Intel Cpu Xeon Bx80635E51660V2 Users Manual Intel® Xeon® Processor E5 1600 V2/E5 2600 V2 Product Families Datasheet Volume One Of Two

2015-02-02

• 1 Overview
  • 1.1 Introduction
    • 1.1.1 Processor Feature Details
    • 1.1.2 Supported Technologies
  • 1.2 Interfaces
    • 1.2.1 System Memory Support
    • 1.2.2 PCI Express*
    • 1.2.3 Direct Media Interface Gen 2 (DMI2)
    • 1.2.4 Intel® QuickPath Interconnect (Intel® QPI)
    • 1.2.5 Platform Environment Control Interface (PECI)
  • 1.3 Power Management Support
    • 1.3.1 Processor Package and Core States
    • 1.3.2 System States Support
    • 1.3.3 Memory Controller
    • 1.3.4 PCI Express*
    • 1.3.5 Intel® QPI
  • 1.4 Thermal Management Support
  • 1.5 Package Summary
  • 1.6 Terminology
  • 1.7 Related Documents
  • 1.8 Statement of Volatility (SOV)
  • 1.9 State of Data
• 2 Interfaces
  • 2.1 System Memory Interface
    • 2.1.1 System Memory Technology Support
    • 2.1.2 System Memory Timing Support
  • 2.2 PCI Express* Interface
    • 2.2.1 PCI Express* Architecture
    • 2.2.2 PCI Express* Configuration Mechanism
  • 2.3 DMI2/PCI Express* Interface
    • 2.3.1 DMI2 Error Flow
    • 2.3.2 Processor/PCH Compatibility Assumptions
    • 2.3.3 DMI2 Link Down
  • 2.4 Intel® QuickPath Interconnect (Intel® QPI)
  • 2.5 Platform Environment Control Interface (PECI)
    • 2.5.1 PECI Client Capabilities
    • 2.5.2 Client Command Suite
    • 2.5.3 Client Management
    • 2.5.4 Multi-Domain Commands
    • 2.5.5 Client Responses
    • 2.5.6 Originator Responses
    • 2.5.7 DTS Temperature Data
• 3 Technologies
  • 3.1 Intel® Virtualization Technology (Intel® VT)
    • 3.1.1 Intel® VT-x Objectives
    • 3.1.2 Intel® VT-x Features
    • 3.1.3 Intel® VT-d Objectives
    • 3.1.4 Intel® Virtualization Technology Processor Extensions
  • 3.2 Security Technologies
    • 3.2.1 Intel® Trusted Execution Technology
    • 3.2.2 Intel® Trusted Execution Technology – Server Extensions
    • 3.2.3 AES Instructions
    • 3.2.4 Execute Disable Bit
  • 3.3 Intel® Secure Key
  • 3.4 Intel® OS Guard
  • 3.5 Intel® Hyper-Threading Technology
  • 3.6 Intel® Turbo Boost Technology
    • 3.6.1 Intel® Turbo Boost Operating Frequency
  • 3.7 Enhanced Intel SpeedStep® Technology
  • 3.8 Intel® Intelligent Power Technology
  • 3.9 Intel® Advanced Vector Extensions (Intel® AVX)
  • 3.10 Intel® Dynamic Power Technology
• 4 Power Management
  • 4.1 ACPI States Supported
    • 4.1.1 System States
    • 4.1.2 Processor Package and Core States
    • 4.1.3 Integrated Memory Controller States
    • 4.1.4 DMI2/PCI Express* Link States
    • 4.1.5 Intel® QuickPath Interconnect States
    • 4.1.6 G, S, and C State Combinations
  • 4.2 Processor Core/Package Power Management
    • 4.2.1 Enhanced Intel SpeedStep® Technology
    • 4.2.2 Low-Power Idle States
    • 4.2.3 Requesting Low-Power Idle States
    • 4.2.4 Core C-states
    • 4.2.5 Package C-States
    • 4.2.6 Package C-State Power Specifications
    • 4.2.7 Processor Package Power Specifications
  • 4.3 System Memory Power Management
    • 4.3.1 CKE Power-Down
    • 4.3.2 Self Refresh
    • 4.3.3 DRAM I/O Power Management
  • 4.4 DMI2/PCI Express* Power Management
• 5 Thermal Management Specifications
  • 5.1 Package Thermal Specifications
    • 5.1.1 Thermal Specifications
    • 5.1.2 TCASE and DTS Based Thermal Specifications
    • 5.1.3 Processor Operational Thermal Specifications
    • 5.1.4 Embedded Server Thermal Profiles
    • 5.1.5 Thermal Metrology
  • 5.2 Processor Core Thermal Features
    • 5.2.1 Processor Temperature
    • 5.2.2 Adaptive Thermal Monitor
    • 5.2.3 On-Demand Mode
    • 5.2.4 PROCHOT_N Signal
    • 5.2.5 THERMTRIP_N Signal
    • 5.2.6 Integrated Memory Controller (IMC) Thermal Features
• 6 Signal Descriptions
  • 6.1 System Memory Interface Signals
  • 6.2 PCI Express* Based Interface Signals
  • 6.3 DMI2/PCI Express* Port 0 Signals
  • 6.4 Intel® QuickPath Interconnect Signals
  • 6.5 PECI Signal
  • 6.6 System Reference Clock Signals
  • 6.7 JTAG and TAP Signals
  • 6.8 Serial VID Interface (SVID) Signals
  • 6.9 Processor Asynchronous Sideband and Miscellaneous Signals
  • 6.10 Processor Power and Ground Supplies
• 7 Electrical Specifications
  • 7.1 Processor Signaling
    • 7.1.1 System Memory Interface Signal Groups
    • 7.1.2 PCI Express Signals
    • 7.1.3 DMI2/PCI Express Signals
    • 7.1.4 Intel® QuickPath Interconnect
    • 7.1.5 Platform Environmental Control Interface (PECI)
    • 7.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)
    • 7.1.7 JTAG and Test Access Port (TAP) Signals
    • 7.1.8 Processor Sideband Signals
    • 7.1.9 Power, Ground and Sense Signals
    • 7.1.10 Reserved or Unused Signals
  • 7.2 Signal Group Summary
  • 7.3 Power-On Configuration (POC) Options
  • 7.4 Fault Resilient Booting (FRB)
  • 7.5 Mixing Processors
  • 7.6 Flexible Motherboard Guidelines (FMB)
  • 7.7 Absolute Maximum and Minimum Ratings
    • 7.7.1 Storage Condition Specifications
  • 7.8 DC Specifications
    • 7.8.1 Voltage and Current Specifications
    • 7.8.2 Die Voltage Validation
    • 7.8.3 Signal DC Specifications
  • 7.9 Signal Quality
    • 7.9.1 DDR3 Signal Quality Specifications
    • 7.9.2 I/O Signal Quality Specifications
    • 7.9.3 Intel® QuickPath Interconnect Signal Quality Specifications
    • 7.9.4 Input Reference Clock Signal Quality Specifications
    • 7.9.5 Overshoot/Undershoot Tolerance
• 8 Processor Land Listing
  • 8.1 Listing by Land Name
  • 8.2 Listing by Land Number
• 9 Package Mechanical Specifications
  • 9.1 Package Size and SKUs
  • 9.2 Package Mechanical Drawing (PMD)
  • 9.3 Processor Component Keep-Out Zones
  • 9.4 Package Loading Specifications
  • 9.5 Package Handling Guidelines
  • 9.6 Package Insertion Specifications
  • 9.7 Processor Mass Specification
  • 9.8 Processor Materials
  • 9.9 Processor Markings
• 10 Boxed Processor Specifications
  • 10.1 Introduction
    • 10.1.1 Available Boxed Thermal Solution Configurations
    • 10.1.2 Intel Thermal Solution STS200C (Passive/Active Combination Heat Sink Solution)
    • 10.1.3 Intel Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall Passive Heat Sink Solutions)
  • 10.2 Mechanical Specifications
    • 10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones
    • 10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS)
  • 10.3 Fan Power Supply [STS200C]
    • 10.3.1 Boxed Processor Cooling Requirements
  • 10.4 Boxed Processor Contents