Intel Extreme Desktop Motherboard Blkdx58So2 Users Manual Intel(R) Board DX58SO2 Series
BLKDX58SO2 to the manual d02f37cf-27ca-4079-9f42-0f5c6db9ece9
2015-02-02
: Intel Intel-Intel-Extreme-Desktop-Motherboard-Blkdx58So2-Users-Manual-432494 intel-intel-extreme-desktop-motherboard-blkdx58so2-users-manual-432494 intel pdf
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ATX Form Factor
Intel® Desktop Board
DX58SO2 Extreme Series
and, with superior graphics exibility,
gamers enjoy a smoother, more realistic
experience. Intel® Extreme Memory Proles
(Intel® XMP) is a performance-packed
expansion of the standard DDR3 memory
specication, enabling a robust and stable
solution for ultra-fast memory.
efcient optimum state. The massive data
throughput and support for the Intel Core i7
processor runs more applications simulta-
neously, with less wait time.
Power for the hottest new games
With incredible support for up to 12 threads
of raw processing power, unprecedented
bandwidth, triple-channel DDR3 memory,
and full support for ATI* CrossFireX*
and NVIDIA* SLI* technologies, the Intel
Desktop Board DX58SO2 goes where no
desktop board has gone before.
The optimized eight-layer stack up provides
awless signal speed and industry-leading
power delivery to critical components to
deliver more advanced performance tuning1
Lock and load!
Introducing the Intel® Desktop Board
DX58SO2, designed to unleash the power
of the new Intel® Core™ i7 processors.
Build upon a winner
With the Intel Desktop Board DX58SO2,
Intel is breaking down barriers when it
comes to the performance and bandwidth
that gamers, digital media creators, and
ultimate multitaskers need most. The
Intel Desktop Board DX58SO2 provides
breakaway performance in production and
editing, as well as digital media rendering
and real-time audio/video preview capabili-
ties. Superior Phase Shedding Technology
keeps the system performing in the most
PRODUCT BRIEF
Intel® Desktop Board DX58SO2
Extreme Series
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Intel® Desktop Board DX58SO2 Extreme Series
The boxed Intel® Desktop Board DX58SO2 solution includes:
• ATX compliant I/O shield
• UV-reactive SATA cables
• Extreme mouse pad
• Bluetooth* / Wi-Fi* module
• Board and back panel I/O layout stickers
• Quick reference guide
• Intel® Express Installer driver and software DVD
• Windows Vista* Premium WHQL certified
• NVIDIA* SLI* bridge connectors
• Post code information card
Software included:
CAPABILITY SOFTWARE INCLUDED:
Utilities • Intel® Core Utilities Bundle2
• Intel® Extreme Tuning Utility3 (XTU) (Internet download)
Antivirus • ESET* Smart Security
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3
9.6” (24.38cm)
11.6” (29.46cm)
7
1
23
4109
5 6
Intel® Desktop Board DX58SO2 Extreme Series
Features and Benets
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12
17
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14
15
18
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1 Support for the Intel® Core™ i7
processor Extreme Edition in the
LGA1366 package: Supports both
four-core and six-core processors. Fea-
tures Intel® Turbo Boost Technology4
and Intel® Hyper-Threading Technology5
for exceptional performance and scal-
ability, and 12 MB shared Intel® Smart
Cache, enabling dynamic and efcient
allocation of cache.
2 Intel® X58 Express Chipset with
ICH10R: Features Intel® QuickPath
Interconnect (Intel® QPI) to the
processor for 25.6 GB/s maximum
peak bandwidth.
3 Six DIMM connectors: Designed to
support overclocked1 DDR3 1600+6 /
1333 / 1066 MHz memory, delivering
up to 48 GB/s7 memory bandwidth.
4 Two SuperSpeed USB 3.0 ports,
two IEEE 1394a ports (one external
port and one port via internal
header), and 12 USB 2.0 ports (six
back ports and six ports via three
internal headers): Provides for the
most exible back panel connectivity
options.
5 Three PCI Express* 2.0 x16
connectors: Improved graphics
bandwidth and support for certied
triple-card ATI* CrossFireX* and
NVIDIA* SLI*.
6 PCI Express and PCI connectors:
Flexibility to support PCI Express and
legacy PCI devices.
7 Two SATA 6.0 Gb/s ports, six SATA
3.0 Gb/s ports, and two eSATA back
ports: Support for up to ten ports with
external SATA capability and the ability
to disable individual ports via the Intel®
Matrix Storage driver stack.
8 Intel® Matrix Storage Technology:
Performance and reliability with
support for RAID 0, 1, 5, and 10, and
new Intel® Rapid Recover Technology.
9 Ten-channel Intel® High Denition
Audio8 (7.1): Enables high-quality
integrated audio that rivals the perfor-
mance of high-end discrete solutions.
10 Dual Intel® Gigabit Ethernet LAN:
Features onboard 10/100/1000 Mb/s
Ethernet LAN connectivity.
11 Consumer infrared receiver and
transmitter: Supports receiving,
learning, and emitting capabilities,
controls up to two additional CE
devices with your PC, and eliminates
the need for a USB CIR dongle.
12 Back-to-BIOS switch: Allows easy
access to the BIOS for easy overclocking1
and recovery.
13 Post code decoder: Allows for display
of post codes for debug along with
the included post code quick reference
card displaying critical areas to help
troubleshoot performance-increase
roadblocks.
14 Exclusive voltage regulator thermal
solutions: Provides reliable and
silent cooling for extreme performance
tuning1.
16
15 Solid-state capacitors and exclusive
Maximum ePower processor voltage
regulation design: Maximizes stability
and power for advanced performance
tuning.
16 Tweaker switches: Speed bump,
power, and reset switches for over-
clocking1 on the go, quick reset, and
power on.
17 ATX Form Factor: ATX board supports
more fully featured tower designs.
18 Lead-free: Meets all worldwide
regulatory requirements for lead-free
manufacturing.
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Storage Temperature
•-20°Cto+70°C
REGULATIONS AND SAFETY STANDARDS
United States and Canada
UL1950,Thirdedition—CAN/CSAC22.2
No.950-95withrecognizedU.S.andCanadian
componentmarks
Europe
NemkocertifiedtoEN60950International
NemkocertifiedtoIEC60950
(CBreportwithCBcertificate)
EMC regulations (tested in representative chassis)
United States
FCCPart15,ClassB
FCCPart15,ClassBopen-chassis(coveroff)testing
Canada
ICES-003,ClassB
Europe
EMCdirective89/336/EEC;EN55022:1998
ClassB;EN55024:1998
Australia/New Zealand
AS/NZS3548,ClassB
Taiwan
CNS13438,ClassBInternational
CISPR22:1997,ClassB
Powerrequirementsvary.ComplieswithUSCRFvia
EN55022+6dbinsystemconfigurationswithan
openchassisandEUDirective89/336/EECanduse
viaEN55022andEN50082-1inarepresentative
chassis.
Lead-Free: Thesymbolisusedtoidentify
electricalandelectronicassembliesandcom-
ponentsinwhichthelead(Pb)concentration
levelinanyoftherawmaterialsandtheendprod-
uctisnotgreaterthan0.1%byweight(1000ppm).
Thissymbolisalsousedtoindicateconformance
tolead-freerequirementsanddefinitionsadopted
undertheEuropeanUnion’sRestrictiononHazardous
Substances(RoHS)directive,2002/95/EC.
PROCESSOR
Processor Support
•Intel®Core™i7processorsintheLGA1366package
•Intel®TurboBoostTechnology4
•Intel®Hyper-ThreadingTechnology5
•IntegratedMemoryControllerwithsupportforup
to48GB7ofsystemmemoryDDR3+16006/
1333/1066MHzSDRAM
•Intel®FastMemoryAccess
•SupportsIntel®64architecture9
CHIPSET
Intel® X58 Express Chipset
•Intel®82X58IOHwithICH10R
•Intel®MatrixStorageManager(RAID0,1,5,10)
•TwoSATA(6.0Gb/s)portsand6SATA(3.0Gb/s)ports
•TwoeSATA(3.0Gb/s)portsonthebackpanel
USB PORTS
Integrated Intel® ICH10R controller
•SixHi-SpeedUSB2.0portsviabackpanel
•SixadditionalHi-SpeedUSB2.0portsviathree
internalheaders
•TwoSuperSpeedUSB3.0portsviaNECcontroller
System BIOS
•32MbFlashEEPROMwithIntel®Platform
InnovationFrameworkforEFIPlugandPlay,IDE
driveauto-configure
•Advancedconfigurationandpowerinterface
V3.0b,DMI2.5
Intel® Rapid BIOS Boot
•Intel®RapidBIOSBoot
•Intel®ExpressBIOSupdatesupport:BIOSupdate
vianewF7functionkey
1 Warning: Altering clock frequency and/or voltage may (i) reduce
system stability and useful life of the system and processor; (ii)
cause the processor and other system components to fail; (iii)
cause reductions in system performance; (iv) cause additional
heat or other damage; and (v) affect system data integrity. Intel
has not tested, and does not warranty, the operation of the
processor beyond its specications.
2
The Intel® Core Utilities Bundle includes Intel® Integrator Assis-
tant, Intel® Integrator Toolkit, Intel® Express Installer, and Intel®
Express BIOS Update.
3
Intel® Extreme Tuning Utility is only compatible with Intel® Desk-
top Boards based on the Intel® X38 Express Chipset and newer.
Auto-tuning capabilities may not be available for all Extreme
Series motherboards.
4
Intel® Turbo Boost Technology requires a PC with a processor with
Intel Turbo Boost Technology capability. Intel Turbo Boost Technol-
ogy performance varies depending on hardware, software, and
overall system conguration. Check with your PC manufacturer on
whether your system delivers Intel Turbo Boost Technology. See
www.intel.com/technology/turboboost for more information.
5
Intel® Hyper-Threading Technology requires a computer system
with a processor supporting HT Technology and an HT Technol-
ogy-enabled chipset, BIOS, and operating system. Performance
will vary depending on the specic hardware and software you
use. For more information including details on which processors
support HT Technology, see www.intel.com/info/hyperthreading.
Intel® Desktop Board DX58SO2 Extreme Series
Technical Specications
Hardware Management Features
•Processorfanspeedcontrol
•Systemchassisfanspeedcontrol
•Voltageandtemperaturesensing
•Fansensorinputsusedtomonitorfanactivity
•PowermanagementsupportforACPI3.0b
Intel® PRO 10/100/1000 Network Connection
•DualLANonthebackpanel
•Newlow-powerdesigncanmeetEnergyStar*5.0
specifications
Expansion Capabilities
•ThreePCIExpress*2.0x16connectors(configured
asx16/x8/x8intriple-graphicsmode)
•TwoPCIExpress2.0x1connectors
•OnePCIconnector
Audio
•10-channelIntel®HighDefinitionAudio8codec
•8-channelviathebackpanel
•2-channelviathefrontpanel
•Backpanelsupportforoutputviaopticalcable
•OneinternalheaderforS/PDIFoutputforHDMI*
support
SYSTEM MEMORY
Memory Capacity
•Six240-pinDIMMconnectorssupportingtriple-
channelmemory.Twodouble-sidedDIMMsper
channel.
•Maximumsystemmemoryupto48GB7using8GB
double-sidedDIMMs
Memory Types
•DDR3+1600/1333/1066SDRAMmemorysupport
•Non-ECCMemory
Memory Modes
•Triple-,dual-,orsingle-channeloperationsupport
Memory Voltage
•1.35Vlowvoltage
•1.5VstandardJEDECvoltage
•SupportforIntel®XMPextendedvoltageprofiles
JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
•Singleconfigurationjumperdesign
•JumperaccessforBIOSmaintenancemode
Front-Panel Connectors
•Reset,HDLED,PowerLEDs,poweron/off
•Threefront-panelHi-SpeedUSB2.0headers
•Front-panelaudioheader
•OneIEEE1394aheader
MECHANICAL
Board Style
•ATX
Board Size
•9.6”x11.6”(24.38cmx29.46cm)
Baseboard Power Requirements
•ATX12V
ENVIRONMENT
Operating Temperature
•0°Cto+55°C
For ordering information, visit www.intel.com
For the most current product information, visit www.intel.com/go/idb
or http://ark.intel.com
For specific CPU compatibility, visit http://processormatch.intel.com
6
Maximum peak memory bandwidth requires three DDR3 modules
to be populated in each of the blue memory slots. DDR3 1600
memory support on this motherboard requires advanced knowl-
edge of BIOS and memory tuning; individual results may vary.
For specic supported memory for this motherboard, please visit
www.intel.com/products/motherboard/ for more details.
7
System resources and hardware (such as PCI and PCI Express*)
require physical memory address locations that can reduce avail-
able addressable system memory. This could result in a reduction
of as much as 1 GB or more of physical addressable memory being
available to the operating system and applications, depending on
the system conguration and operating system.
8
Intel® High Denition Audio requires a system with an appropriate
Intel® chipset and a motherboard with an appropriate codec and
the necessary drivers installed. System sound quality will vary
depending on actual implementation, controller, codec, drivers,
and speakers. For more information about Intel® HD Audio, refer
to www.intel.com/design/chipsets/hdaudio.htm
9
64-bit computing on Intel® architecture requires a computer
system with a processor, chipset, BIOS, operating system, device
drivers, and applications enabled for Intel® 64 architecture.
Processors will not operate (including 32-bit operation) without
an Intel 64 architecture-enabled BIOS. Performance will vary
depending on your hardware and software congurations. See
http://developer.intel.com/technology/intel64/index.htm for
more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-
CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-
ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving,
or life-sustaining applications. Intel may make changes to speci-
cations and product descriptions at any time, without notice.
All products, dates, and gures specied are preliminary based
on current expectations, and are subject to change without
notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, and Intel Core are trademarks of Intel
Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2010 Intel Corporation. All rights reserved.
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