User Manual
With Reg gulatory updates - Safety Pre ecautions 9/19/201 14 - Regula atory Notices 9/21//2014 (eccology) In ntel® 5th Generatio on Core™ ™ Process sor-Based Solutiion Development System ((SDS) USER U R MAN NUAL Mode el: WSBUB-SDS Docume ent Number: H320 072 Revisio on 0.93 • May 201 14 Regulatory Info ormation • Septem mber 2014 DRAFT T - Intel Confid dential N Notice: INFORMATION IN TH HIS DOCUMENT IS PROVIDED IN CONN NECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS S OR IMPLIED, BY E ESTOPPEL OR OTHE ERWISE, TO ANY INTELLECTUAL L PROPERTY RIGHT TS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDE ED IN INTEL’S TERM MS AND CONDITION NS OF SALE FOR SU UCH PRODUCTS, INTEL ASSUMES NO LIABIL LITY WHATSOEVER R, AND INTEL DISCLA AIMS ANY EXPRESS S OR IMPLIED WARR RANTY, RELATING T TO SALE AND/OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIE ES RELATING TO FIT TNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY Y, OR INFRINGEMEN NT OF ANY PATENT, COPYRIGH HT OR OTHER INTEL LLECTUAL PROPER RTY RIGHT. INTEL PR RODUCTS ARE NOT T INTENDED FOR US SE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make chang ges to specifications and a product descriptio ons at any time, witho out notice. All products, dates, an nd figures specified are preliminary based on current expectatio ons, and are subject to o change without notitice. Intel processors, chipsets, and desktop boa ards may contain des sign defects or errors known as errata, which may cause the prooduct to deviate from published specificatio ons. Current ccharacterized errata are a available on reque est. Any code names featu ured are used interna ally within Intel to iden ntify products that are in development and not yet publicly annouunced for release. Cu ustomers, licensees a and other third parties are not authorrized by Intel to use co ode names in advertis sing, promotion or ma arketing of any produc ct or services and anyy such use of Intel's internal code names is at the sole rrisk of the user. Software and workloa ads used in performan nce tests may have be een optimized for perrformance only on Inte el microprocessors. P Performance tests, su uch as SYSmark and MobileMark, are measured using specific computer systtems, components, so oftware, operations and functions. Any cha ange to any of those ffactors may cause the e results to vary. You should consult other information and performance tests to o assist you in fully evaluating your contemplated purchases, inc cluding the performannce of that product wh hen combined with oth her products. For more information go to http://www.intell.com/performance. Intel, Intel Inside, the Intel logo, Intel vPro, Centrino, Centrino In nside, Intel Core, Intel Atom, Pentium, Ultra abook, and RealSensse are trademarks of IIntel Corporation in th he United States and other coun ntries. Ultrabook™ products are offered in multiple models. Some mod dels may not be availa able in your market. Consult your Ultraboook™ manufacturer. Fo or more information an nd details, visit http://www.intel.com/u ultrabook. Material in this docum ment is intended as product positioning and d not approved end us ser messaging. This Ultrabook system m is an engineering sa ample and may not be e sold or leased; it rem mains the property off Intel. This Ultrabook system m is specifically design ned and tested for Microsoft* Windows* 8.1, configured for Con nnected Standby operration. This document contains information on pro oducts in the design phase of developmentt. **Other names and bra ands may be claimed as the property of oth hers. Copyright © 2014 Inte el Corporation th Intel® 5 Generation Core™ Processor-Ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 rrevision history Revision Description Da ate 0.92 Added: Jun ne 20, 2014 Fingerprint sensor infformation 0.91 Updated: Ma ay 13, 2014 uctions for enabling WWAN Wireless WAN: instru 0.9 Updated: Ma ay 7, 2014 Wireless WAN SIM card instructions 0.85 Updated: Ma ay 2, 2014 Introduction Left side features Using the keyboard GA adapter Using the HDMI to VG Using the debug portt Standby and system shut down ons Technical specificatio Configuration and tro oubleshooting 0.8 Update for Beta (DVT T2) factory build with Intel® RealSense 3D D camera. Ap pril 23, 2014 Updated: WWAN and Wi-Fi stattements) Safety precautions (W Active Pen configurattion information Touchscreen configuration information 0.7 Initial release, Beta (D DVT2) factory build. Ap pril 15, 2014 § th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 ccontents introduction safety precautions getting to know the system system features left side view right side view front panel view rear pan nel view using your system getting starte ed system orien ntations laptop mode tablet mode display mode de tent mod using the protective sleeve using the tou uch screen customizing the touch scre een functions uchpad using the tou using the acttive pen customizing the pen behav vior example es of applications supporting an active e pen using the key yboard function key commands other ke eyboard functions using the cameras cing webcam user-fac world fa acing camera (table et mode) th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) 11 11 12 12 13 13 14 15 15 16 17 17 20 21 22 24 25 25 25 26 26 27 using the system m motion sensors using the fingerprintt sensor wireless WAN and S SIM card beta (DVT2) syystems: enabling th he WWAN hardware installing the m micro SIM card using the RJ45 Gb Ethernet LAN jack using the HDMI to V VGA adapter standby and system m shut down waking from staandby charging the batteryy using the debug porrt te echnical specificaations configuration and troubleshooting entering the sys ystem BIOS selecting the syystem boot device system battery disconnect/connecct switch Real Time Clocck (RTC) CMOS reset switch regulatory noticess SAFETY WARNING GS AND CAUTION NS EMC STATEMENT S ECOLOGY STATEM MENTS ADDITIONAL INFO ORMATION for systtems with the Intel® ReaalSense™ 3D Camera F200 DEVICE DESC CRIPTION SAFETY WARN NINGS AND CAUT TIONS ECOLOGY STA ATEMENTS DRAFT – CONFIDENTIAL 28 30 31 31 32 33 34 35 35 35 36 37 38 38 38 38 39 40 40 40 43 43 Error! Bookmark Error! Bookmark Error! Bookmark May 2014 ffigures ffigure 2-1 ffigure 2-2 ffigure 2-3 ffigure 2-4 ffigure 2-5 ffigure 2-6 ffigure 2-7 ffigure 2-8 ffigure 2-9 ffigure 2-10 ffigure 2-11 ffigure 2-12 ffigure 2-13 ffigure 2-14 ffigure 2-15 ffigure 2-16 ffigure 2-17 ffigure 2-18 ffigure 2-19 ffigure 2-20 ffigure 2-21 ffigure 2-22 ffigure 2-23 th getting started la aptop mode ro otating to tablet ta ablet mode display mode te ent mode sleeve alignment for laptop carry mode active pen pocket sleeve alignment for tablet mode system and sleeve in i tablet mode to ouch screen gesturres to ouch settings double-tap and pres ss and hold settings display settings other settings to ouchpad gestures to ouchpad configurattion in nstalling the active pen battery active pen buttons pen p and touch scree en navigational flicks navigational and editing flicks customize flicks Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) 12 13 14 14 15 15 16 16 16 16 17 18 18 19 19 20 20 21 21 22 22 23 23 figure 2--24 figure 2--25 figure 2--26 figure 2--27 figure 2--28 figure 2--29 figure 2--30 figure 2--31 figure 2--32 figure 2--33 figure 2--34 figure 4--1 figure 4--2 keyboard rd layout and functio on keys 2D cameera configuration 3D cameera configuration world faccing camera world faccing camera contro ols world faccing camera locatio on setting uup system login passsword setting uup fingerprint accesss insertingg the micro SIM carrd using thee Ethernet LAN jacck VGA dissplay adapter system bbattery reset RTC CM MOS reset 25 26 26 27 28 28 30 30 32 33 34 38 39 tables table 2-1 table 3-1 DRAFT – CONFIDENTIAL standby and shutdown optiions system ffeatures 35 37 May 2014 1 introduction th This 5 generatio on Intel® Core™ Processor-based Solution Development System (S SDS) is a businesss and consumer focused Ultraboo ok™ 2-in-1 cconvertible device e featuring: 13.3” 3200 x 1800 QHD+ multi-finger touch display 360-degree e hinge fold-over conversion mech hanism Intel® vPro o™ Technology with w discrete TPM 2.0 and pop-out RJ45 Gigab bit Ethernet jack (see using the RJ45 Gb Ethernett LAN jack) 180GB Inte el® Pro 2500 Seriies SSD (M.2 module, SATA interface) Two user-fa acing camera opttions (see using the t cameras): o Full HD H 2D camera o Intel® ® RealSense™ 3D Camera F200 with full HD 2D came era World-facin ng camera; 8 MP with LED flash Intel® Duall Band Wireless-A AC 7265 (“Stone Peak”) 802.11ac 2x2 PCIe Wi-Fi w/BT 4.0 M.2 mo odule Intel® Pro Wireless Display (WiDi) 5.0 with Miracast* support el® XMM7160-bassed LTE WWAN w/ GNSS Inte Des signed for Intel “M Maple Peak” WiGig with optional W WiGig Wire eless Dock (see Error! Reference source not fou und.)1 o Maple Peak moodule not include ed, late availabilityy Nea ar Field Commun ications (NFC) an ntenna Syn naptics* ForcePadd* touchpad with multi-finger gestu ure support (see e using the touchhpad) N-trrig* DuoSense Peen 2* Active Pen (see using the acctive pen) Fing gerprint sensor (ssee Error! Refere ence source nott found.) Full set of sensors inncluding accelero ometer, gyroscope e, compass, bient light, user pproximity, and barrometric pressure amb IO connectors: full siize HDMI out, 2x USB 3.0 ports, S SDXC card read der, micro SIM, 33.5 mm combo au udio jack, RJ45 G Gigabit LAN Microsoft* Windows** 8.1 with InstantG Go* capability (also known Standdby) as Connected This Ultrabook 2-in-1 convertible design represents s many of the cap pabilities of system ms based on the 5th Generation In ntel® Core™ Proccessor. This ssystem is designe ed as a software development plattform to aid in delivery of compelling and differentiaated software and d user experience es for the latest Intel platforrms. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 ssafety precautions WARNING G: READ THESE PRECAUTIONS PRIOR TO USING Y YOUR DEVICE. Use U only the powe er adapter provided with the device e. Other power adapters may oveerheat or damage e the device. The T battery pack is not user-service eable; the battery y[ies] in this devic ce cannot be easilly replaced by users themselves’. Do not n attempt to rem move the battery pack as damage to t the device or ba attery pack may ooccur. Iff the device is dam maged crushed or o severely droppe ed, to ensure safe e and proper opeeration, return it to o Intel for servicin ng. Iff the device is exp posed to excessiv ve temperatures the t battery may fa ail. Do not exposee the device to en nvironments over 100 degrees C. Do D NOT drop the device in water, as a the device is no ot waterproof. Operation and devvice failure may occcur. Caution should be e exercised during g long exposure to o excessive soun nd levels from earrphones and head dphones as this ccan cause hearing loss. This device may contain an Intel® RealSense™ 3D D Camera module e that contains ann integrated laser projector. The ccamera complies with Inte ernational Standard EN/IEC 60825 5-1:2007 edition 2 for a Class 1 lasser product. The camera also com mplies with US U FDA performa ance standards fo or laser products except for deviations pursuant to LLaser notice No. 50, dated June 2 24, 2007." Do not mo odify, attempt to open or service th he camera modulle within this deviice in any way. M Modification or se ervice of the camera module might caus se the emissions to exceed the Class 1 level. Do nnot activate this d device if the came era is damaged in any manner. Use of controls or o adjustments or performance of pprocedures otherr than those specified herein adiation exposure e. may resullt in hazardous ra For additional inform mation including g RF exposure: See REGULATORY NOTICES section. th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 g getting to know the syste em ssystem featu ures 1. User-fac cing webcam and microphones (se ee using the e cameras) The SDS S has two camera/m microphone configu urations: SKU A: standard 11080P full HD webccam SKU B: Intel® ReaalSense™ 3D Cam mera F200 plus 108 80P full HD 2D camera 3. Ambientt light sensor (AL LS) The ALS S allows the system m to change the disp play backlight automatically accordin ng to the ambient ligght. 4. QHD+ (3 3200 x 1800) multii-touch display The high h-definition display panel provides exccellent viewing featu ures for photos, videos, and other m multimedia files. 5. Microso oft* Windows* hom me key Home ke ey for quick navigattion in tablet mode.. 6. User pro oximity sensor The builtt-in proximity sensoor determines when n a user is within ra ange to switch between n wake and standbyy modes. This component is not functiional with Windows s 8.1; intended for ddevelopment with ffuture operating sysstems. 7. Speakerrs Speakerrs are located on booth sides of the sysstem. The integrate ed stereo speakers s provide high perfoormance audio. 8. Synaptic cs* ForcePad* To uchpad Pressure e sensitive touchpaad compliant with M MS precision touchp pad specifica ation. See using thee touchpad for deta ails. 9. Fingerprint sensor (see u using the fingerprintt sensor) Place fin nger on sensor to loog into Windows 8.1. 10. World-fa acing camera and d flash (for tablet m mode) This 8MP P camera has an LLED flash and is loccated on the keyboa ard face for use in ta ablet mode. 11. NFC anttenna location ind dicator Near Fie eld Communicationss antenna for tap/p pay and tap/connecct usage. 2. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 lleft side view 1. Power (DC) input port and power status indicator Insert the bun ndled power adap pter into this port to charge the battery pack and a supply power to the system. See S charging the battery. 2. USB 3.0 portt, compliant with h USB charging spec 1.2 This Universa al Serial Bus 3.0 (USB 3.0) port prrovides a transferr rate of up to 5 Gbit/s and is ba ackward compatib ble to USB 2.0. Also provides pow wer for charging otther devices such h as cell phones while in stand dby state. 3. Main system m battery disconn nect/connect sw witch This switch is s for debug and validation purpose es and should nott be necessary forr normal usage. Insert pin or pape er clip, press to disconnect main system battery. Press again to o reconnect the main system battery. See systtem battery disco onnect/connect switch for dettails. 4. Headphone/microphone com mbo jack port p allows connec ction of the SDS to t amplified The combo port speakers or headphones, or connection to an external micropho one. 5. Real Time Clock (RTC) CMO OS reset switch s for debug and validation purpose es and should nott be This switch is necessary forr normal usage. Insert pin or pape er clip, press to force a system rese et and clear CMO OS settings. The Real Time Clock battery provid des constant pow wer for storing sys stem BIOS setting gs information such as time and date. See Real Time Clock (RTC) CMOS reset sw witch for details. 6. SD DXC (secure digiital extended capacity) memory card slot The e memory card sslot supports SDX XC cards with memory up to 2 TB. 7. Sy ystem power buttton and power indicator light The e system indicatoor LED lights up w when the system is active. The e power button h as three function ns: ase the power button to put Standby modee: Press and relea ess and release a again to the system in sttandby mode. Pre return to active mode. Shut down: Preess and hold the power button for more than 2 seconds but leess than 10 seco onds to activate a slider prompt to shut ddown the system. Forced shut do own: Press and h hold the power bu utton for more than 10 seeconds to force a an immediate sysstem shut down. rright side vie ew th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 8 8. Rotation lock button a modes (laptop p, tablet, display, aand tent.) The rotation lock button secures the SDS display orientation in all 9. Volume up button Press to incre ease system volu ume. 10. Volume dow wn button Press to decrrease system volu ume. 11. USB 3.0 portt This Universa al Serial Bus 3.0 (USB 3.0) port prrovides a transferr rate of up to 5 Gbit/s and is backw ward compatible to USB 2.0. 12. HDMI port e A HDMI version n 1.4a port for pro ojecting audio and d video to externa al sources includiing televisions an nd audio receiverss. Full size Type 13. RJ45 Gb Eth hernet LAN jack Use the LAN port to connect to o a network. See using the RJ45 Gb G Ethernet LAN jack for more infformation. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 10 ffront panel view 14. World-fa acing microphon nes Dual world-facing microph hone, used with world-facing came era. 15. Lid lift area ert fingers and liftt to open system lid. Inse 18. Deb bug port Deb bug port (should nnot be necessaryy for normal syste em use.) See e using the debugg port. rrear panel viiew 16. 17. Air vents Keep the system’s air vents clear of obstruction for optimal performance. Micro SIM M card slot To be use ed for LTE/3G WWAN connectivity y. Micro SIM card d not included with system. Con ntact your cellularr communications carrier for a micro SIM carrd. Insert the end of a paper clip or a ard tray from the slot. small pin into the pin hole to remove the ca See wirelless WAN and SIM card. § th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 11 2 using g your sy ystem getting starte ed WARNING: To av void injury, read im mportant safety in nformation in safety precautions. To start your systtem the first time: ure 2-1 figu gettting started 1. Remove all components frrom the box and packaging s. materials 2. Flip the system to Laptop Mode (see system orientations.) 3. Remove the protective sle eeve. 4. Connect the AC power cord to the AC/DC adapter; connect the cord to t the system and d plug into an outtlet. Leave system connecte ed to power sourc ce for a few hours s (preferably overnightt) to fully charge battery. 5. Press the e power button. 6. Follow on nscreen directions s to configure sys stem. NOTE: This sys stem does not include an operatting system activatio on key. A Micros soft* MSDN* product key is required to activate the operating system m installed on this device. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 12 ssystem orien ntations The system has four different orien ntation modes: la aptop, tablet, display, and tent. The e included protecctive sleeve functiions as a carrying g case for tthe system and as a keyboard cov ver in tablet mode e. llaptop mode Laptop mode is th he standard comp puter usage mode e, with the display screen tilted up p at an angle to thhe keyboard. Thiss mode provides comfortable alignment for gen neral computer functions while worrking at a desk orr with the computer on your lap. ffigure 2-2 th la aptop mode ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 13 ttablet mode This mode offers the ability to use the system as a modern Windows s* 8.1 touchscree en tablet, without using the keyboa ard or touchpad. T The kkeyboard and tou uchpad are disabled in this mode for f proper handlin ng of the system without accidentaal key strikes. You can use the world-facing cam mera (see using th he cameras) in tab blet mode to take e pictures and viddeo. ffigure 2-3 shows how to rotate the e system from laptop to tablet mode. The rotation lo ock switch locatedd on right side of the device locks the display orientation so sys stem movements don’t result in dis splay rotation. See figure 2-7 forr instructions on using the protectiv ve sleeve to cove er the keyboard while in tablet modde. ffigure 2-3 th ro otating to tablet Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) figure 2-4 DRAFT – CONFIDENTIAL tablet mode May 2014 14 d display mode tent mo ode Display mode offe ers a convenient orientation for vie ewing media on your ssystem, or for using the system in touchscreen mod de while placed on o a desk or your lap. You can use the protective sleeve e to cover the kkeyboard surface e while in this mod de (see Tent mode e offers an alternnative orientation to display mode ffor viewing media or using your touch screen. using the protective sleeve for proper sleeve alig gnment.) ffigure 2-5 th display mode ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) figure 2-6 DRAFT – CONFIDENTIAL tent modee May 2014 15 u using the pro otective slee eve The protective sle eeve provided witth your system ca an be used as botth a carrying case e when the systeem is not in use to o help protect aga ainst damage and as a keyboard cover to protect agains st dirt or spills whe en in tablet or dis splay mode. figuree 2-7 and figure 2 2-9 show proper ssleeve alignment. The prrotective sleeve in ncludes a storage e pocket for the active pen. Note: do not push h pen to bottom of o pocket; constan nt pressure on pe en tip may result in i damage or redu duced battery life. ffigure 2-7 sleeve alignment for f laptop carry mode figure 2-8 active penn pocket ffigure 2-9 sleeve alignment for f tablet mode figure 2-10 system annd sleeve in tablett mode th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 16 u using the tou uch screen The system is equipped with a mu ulti-touch HD disp play screen suppo orting the following standard gestuures. ffigure 2-11 to ouch screen gesttures Left edg ge swipe Swipe from the left edge of the screen to t running apps. shuffle the Tap aand hold To m move an app, tap a and hold the app tile and drag it to a new locatio on. To cl ose an app, tap a and hold the top sside of the ruunning app and d drag it down to the bottoom of the screen tto close it. Right edge swipe Swipe from the right edg ge of the screen to t charms bar. launch the Zoom m out Bringg together two fing gers on the displa ay. Top edg ge swipe In the Start screen, swipe from the top edge off the screen to vie ew the All Apps bar. Drag Toucch and drag your ffinger on the disp play to movee an item to a new w location. Zoom m in Spreaad apart two fingers on the displayy. In a running app, swipe from the top edge creen to view its menu. of the sc Scroll a slide a finger in any direction Touch and on the display to scroll th hrough pictures, text, or other content. Rotaate wo fingers and twist your Toucch an item with tw handd to rotate. (Not alll items rotate.) For more details: http://windows.micro osoft.com/en-US/w windows-8/get-starte ed ccustomizing the touch sc creen functio ons Touch screen fun nctions including double-tap, press s and hold, and viisual touch feedb back can be configgured to optimize e your user experrience. th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 17 G Go to Control Pa anel > Hardware and Sound > Pe en and Touch > Touch to configu ure your touch scrreen functions. Choose Double-tap or Pres ss and hold from the Touch tab of the Pen n and Touch pop up window. Click k Settings. Or, configure your Touch Feed dback settings to show (or not ual feedback whe en you touch yourr display. show) visu In th he Double-Tap S ettings or Press a and Hold Settingss dialog box x, choose the settting you want to ccustomize. Selectt OK when finis shed. figure 2-12 figure 2-13 touch settings doubble-tap and presss and hold setting gs You can also customize settings th hrough the Tablet PC Settings me enu (go to Contro ol Panel > Hardw ware and Sound > Tablet PC Setttings.) From this menu you y can configure e pen and touch settings, calibrate the display (not recommended) aand change the ha andedness of the e display. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 18 The Display tab t includes display, orientation, and pen and touch display y configuration options. The “Calibrrate” function is not recomm mended. The Otther tab includes handedness and pen and touch setting configuration. figure 2-14 display settings figure 2-15 other sett ings th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 19 u using the tou uchpad The system is equipped with a pre essure-sensitive Synaptics* ForceP Pad* touchpad. The T ForcePad is a multi-finger, buttton-less touchpa ad with vvariable pressure e detection and a maximized gestu ure area for a fastt and fluid Window ws 8 user experieence. The Synaptics driiver incorporates all sstandard touch ge estures including pinches, swipes, finger scrolling, and ffinger flicks. figurre 2-16 touchpa ad gestures The Synaptics Ge esture Suite offerrs options for multi-ffinger flick gesture es to help navigate, zoom, and manipula ate documents and programs. ffigure 2-17 shows s how to reach the Synaptics Gesturre Suite software tthrough the pointiing device properrties application. ffigure 2-17 to ouchpad configurration For more details: http://www.syna aptics.com/solutio ons/products/force epad th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 20 u using the acttive pen The N-trig* DuoSense Pen 2* activ ve pen included with w this system is s a high accuracy y pressure sensittive pen with butto on, hover, and flicck ccapabilities. The active pen suppo orts the following: Handwriting recognition (H HWR) WR/search) Note taking (including HW ument annotation PDF/docu E-textboo oks and curriculum m annotation Presentation tools ation/white-boarding Collabora Drawing and graphics edia (photo annotation) Digital me Internet in nfrastructure (Fla ash and AIR) Games figure 2-18 installing the aactive pen batteryy The DuoSense Pen 2 acts like a re egular pen, with 256 2 distinct levels of pressure e sensitivity for a natural pen-on-pa aper experience. Touc ch the pen tip to th he display to sele ect onscreen objects or to hand dwrite or markup in an application. ffigure 2-19 active pen buttons Tap or hold button when touching g tip to screen to ‘Right Click’ or foor application spe ecific functions. Press button forr ‘Eraser’ tool or other application specific function. th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 21 ccustomizing the pen beh havior Customize the ac ctive pen behavior to optimize your user experience e. You can custom mize navigationall flicks (up, down, left, and right) o or navigational flicks s and editing flick ks (up, down, left, right, and diagon nals), as shown in n figure 2-20 thro ugh figure 2-23. Note: a right mou use click function can be achieved by touching and holding the pen tip t to the display. This option can b be configured in tthe Microsoft* Window ws* 8.1 Pen Configuration applet. This functionality y is available in th he Windows Deskktop interface, ass well as in Windo ows JJournal*, Microso oft Office*, Sticky Notes*, and the Snipping Tool*. Pen gestures can n be configured in n the Microsoft Windows 8/8.1 pen n configuration ap pplet here: Control Panel > Hardware and Sound > Pen and d Touch > Pen Options. ffigure 2-20 pen p and touch scrreen figgure 2-21 na avigational flicks In the Pen and Touch pop up window, se elect the Flicks ta ab. On the Flic cks tab, select Navigation nal flicks to configure up, down, left, and right flicks. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 22 ffigure 2-22 navigational and editing flicks figurre 2-23 cu ustomize flicks In the Pen and Touch pop up window, se elect the Flicks ta ab. On the Flic cks tab, select Navigation nal flicks and editing flicks to co onfigure up, down, left, right and diagonal flicks. The pen supports s multiple flick ges stures, including the following: Scroll forw ward/backward: flick the pen to the left across the screen to scroll backward or to thee right to scroll fo orward. Drag up/d drag down: flick the pen upward on the screen to drag up, or downw ward to drag downn. Copy: flic ck the pen upward d at a diagonal to o the right corner of the screen to copy. Paste: flic ck the pen downw ward at a diagona al to the right corn ner of the screen to paste. Undo: flic ck the pen downw ward at a diagona al to the left corne er of the screen to o undo. Delete: flick the pen upwa ard at a diagonal to t the left corner of o the screen to delete. th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 23 e examples off applications s supporting an active pen The active pen offfers a broad rang ge of functions an nd users across diffe erent applications s. This chart proviides a ssmall list of applic cations available in the market tha at ssupport an active pen. environ nment Microsoftt Windows Desktop interface NOTE: These applications are not included witth the Solution Development System. app p name app description pen pressure sensitivity ArtRage* 4 Draawing Yes Yes BlueBeam* Revu* PDF F annotation Yes Yes Corel* Paint It I Touch* Draawing Yes Yes Grahl* PDF Annotator* PDF F annotation Yes Yes Microsoft* Ma ath Input Panel 6.2 Penn-to-text for writing matthematical equations Yes No Yes Yes Microsoft* Offfice 2013 Suite For more details: pen button support Microsoft* On neNote* (Office 2013) Notte taking Yes Yes Microsoft* Sn nipping Tool Annnotation Yes Yes odleinator* Xoanan* Doo Creeating doodle anim mations No No MyScript* No otes Mobile* Notte taking Yes Yes Spritehand* Physamajig* Dooodling physics game No No Halfbrick* Fru uit Ninja* Gam me No No Autodesk* Sk ketchbook* Express Draawing Yes Yes http://www.nttrig.com/Content.as spx?Page=TechDu uoSenseActivePen Microsoftt Windows s8 Live Tiles “modern interface”” th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 24 u using the key yboard The system has a full size backlit keyboard. Standard keyboard fun nction commands and shortcuts arre supported. ffunction key commands ffigure 2-24 keyboard layout and a function keys other keyb board functio ons boot up keys: F2 = BIOS setup F7 = boot options Windows sho ortcuts: http://windo ows.microsoft.com m/en-US/window ws7/using-your-ke eyboard th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 25 u using the cameras The system includ des a user-facing g webcam (in two different configurations) and a wo orld-facing camerra for use in table et mode. user-facing webcam The user-facing webcam is located d at the top of the e display screen and a is used for pictures, video andd video conferenccing. The system is ava ailable with two user-facing webcam options: SKU A: figure 2-25 D camera configuuration 2D figure 2-26 3D D camera configuuration standard 1080 0P full HD webca am SKU B: Intel® RealSen nse™ 3D Camera a F200 plus 1080P fu ull HD 2D camera See Recyclable: Do not dispose of o this device in unsorted municip pal waste. Recycle properly to ensure safe an nd proper prote ection of the environment. This device con ntains certain rrecyclable comp ponents. At the end of development use e, return the dev vice to Intel for rrecycling, or recy ycle in a mannerr acceptable to your local authorities. Re efer to local environmental regulations for proper recycling. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 26 Lithium Battery Pack: Except to recycle, do not attempt to remove the battery pack as damage to the de evice or battery y pack may occu ur. The battery[ies] in this device cannot be easily d by users them mselves’. replaced Perchlorrate Material: Lithium (Coin Cell) Battery contains Perchlorate material — special g may apply. See handling www.dts sc.ca.gov/hazardouswaste/perchlorate. This nottice is required by California Code of Regulatiions, Title 22, Division 4.5, Ch hapter 33: Best Management Prac ctices for Perchlorate Materials. This device includes a batttery which s Perchlorate material. contains Power Efficiency (as sh hipped) Default Settings ws 8.1 installed): (Window Balanced Powerr Plan: Put Computer to Sle eep (On Batte ery): 4 minutes s. Put Computer to Sle eep (Plug gged In): 10 miinutes. Hibernate: Critical Battery Action when Critical Battery Level reaches 2%. for important safe ety and regulatorry information. world facing camera (tab blet mode) The world facing camera is located d on the keyboard th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) figu ure 2-27 DRAFT – CONFIDENTIAL woorld facing camerra May 2014 27 p panel face and is used in tablet mo ode. Hold the sys stem up in tablet mode e with the hinges pointing down to ccorrectly orient th he world facing ca amera. ffigure 2-28 world facing came era controls figu ure 2-29 woorld facing camerra location using the sys stem motion sensors Sensors integrate ed into the system m detect orientatio on, movement, an nd ambient light. Accelerom meter and gyrosc cope: detects mo otion and orientation changes, for example to shift tthe on-screen ima age from landsca ape to portrait display as the systtem orientation ch hanges while in ta ablet mode. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 28 Ambient Light Sensor (ALS): detects room m light intensity, fo or example to adjust onscreen dispplay brightness to o improve readab bility in bright ery power in low light room. rooms or to conserve batte Near Field Communication ns (NFC): detectts other NFC enabled devices (suc ch as smartphonees or credit cardss) to initiate data ttransfer operation ns within Windows s or for faster on--line payment tran nsactions at apprropriately enabledd web sites. The e NFC solution is compliant with Micro osoft Windows 8..1 Proximity Serv vice APIs and Inte el® Identity Protec ction Technologyy middleware for ““Tap and Pay” se ervices. Infrared (IR) user proximity: detects heat and/or human pre esence to prompt the system to waake up or to enterr standby mode. The IR sensor is not currently sup pported under Windows 8.1 and is s intended for use e in developing fuuture applications or operating systtems. Barometrric pressure: dete ects changes in air a pressure, such h as with elevation n changes, and ccan be used to faccilitate improved indoor navigation capabilities. The T barometric pressure sensor is currently not sup pported under Winndows 8.1 and is intended for use e in ng future applications or operating systems developin The system also includes a Near Field Communica ation (NFC) solution to detect other NFC enabled d evices. The antenna detects other NFC enabled devices (such as smartph hones or credit ca ards) to initiate da ata transfer opera ations within Microosoft* Windows* or for faster on-lin ne payment ttransactions at ap ppropriately enab bled web sites. The T NFC solution is compliant with h Windows 8.1 Prroximity Service A APIs and Intel® Id dentity Protection Technology middleware e for “Tap and Pa ay” services. th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 29 u using the fingerprint sensor The fingerprint se ensor can be used d in place of typin ng a password to streamline the sy ystem login proceess. Set up a sysstem login passw word prior to ssetting up fingerp print access. If yo ou already have a system login password for the sp pecific user accouunt, skip to setting g up fingerprint access. Fingerprint acces ss can be set up for f each user account on the syste em; multiple finge erprints can be asssociated with eacch user account. First, set up a sy ystem login pass sword for a specific user acc count. Select the e desired accountt at system login, th hen: figure 2-30 setting up sy ystem login passw word 1. Swipe fro om right to display y Charms bar. 2. Select Se ettings. 3. Select Ch hange PC Setting gs. 4. Select Ac ccounts. 5. Select Sig gn in options. 6. Select Ad dd password. Next, set up fing gerprint access: figure 2-31 setting up fin ngerprint access 1. Same path as setting up the system login d, but for Step 6, choose Add unde er password Fingerprint. 2. Log in us sing your system login password. 3. Using firm m pressure, tap/hold your finger (d do not swipe e) to the sensor 8 times. 4. When 8 taps have been successful complete ed, select Finish. 5. Optional, add another fing gerprint (up to 12, from a diffferent finger, diffferent hand, or different user). Sign out, sign bac ck in (choose Fingerprint under Sign in options) to confirm your fingerprrint access. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 30 w wireless WA AN and SIM card A micro SIM card d must be installed d in the system to o use the integratted LTE/3G WWA AN connectivity. M Micro SIM card not included with ssystem. Contact your cellu ular communications carrier for a micro SIM card. beta (DVT2 an nd DVT3) syste ems: enabling the WWAN ha ardware Due to safety and d regulatory certiffication issues, all Beta (DVT2 and d DVT3) systems are shipped withh WWAN hardwarre disabled. Follo ow the steps below if you choo ose to enable the WWAN hardware e. RF ex xposure: This en ngineering sample system contain ns a WWAN wirele ess radio that tra nsmits RF energyy. The transmit anten nna structure mus st be at least 20 cm c from the user or nearby person ns in all usage orrientations of the ssystem. The WW WAN transmit antenna struc cture is located on the top right edge of the LCD dis splay. Note: Steps to enable WWAN hardware: 1. Power system off (see standby and syste em shut down.) LY press F2 to en nter the system 2. Power on, IMMEDIATEL BIOS. 3. Select Intel Advanced. 4. Select PCH-IO Configurration. on. 5. Select USB Configuratio onnector #2 and change from Disa able 6. Select USB Physical Co p to Enabled. USB2 port 7. Select USB Per-Connec ctor Disable at top p of list and change nabled to Disable ed. from En 8. Press F4 F to save setting gs. 9. Press Esc E three times. 10. Select Continue to exit BIOS setup. th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) Steps to check WWAN “Ennabled” status: 1. Power system offf (see standby an nd system shut d down.) Power on, IMME EDIATELY press F2 to enter the syystem 2. BIOS. 3. Select Intel Advaanced. Select PCH-IO C Configuration. 4. Select USB Connfiguration. 5. ble at top of list an nd change Select USB Per--Connector Disab 6. from Disabled too Enabled. Select USB Phys ysical Connector # #2 and change fro om Enabled 7. to Disable USB22 port. 8. Select F4 to savve settings. 9. Press Esc three times. 10. Select Continue to exit BIOS setu up. DRAFT – CONFIDENTIAL May 2014 31 installing the micro SIM card WARNING: WARNING: MAKE SUR RE SYSTEM IS FUL LLY POWERED OFF BEFORE INSER RTING THE SIM C CARD TRAY INSERTING G THE SIM CARD TRAY INCORRECT TLY CAN CAUSE DAMAGE TO THE E SYSTEM. TO INSERT CORRECTLY, MA AKE SURE PIN HO OLE IS LOCATED C CLOSER TO DEBU UG PORT. Procedure for inserting micro SIM card (see figure 2-32): wer the system co ompletely off. 1. Pow 2. Con nvert system to Laptop Mode and close the lid. 3. Turrn system upside down so system label is facing up p. 4. Inse ert the end of a paper clip or a small pin into the pin n hole to remove the card tray from m the slot. 5. Inse ert card as shown n in step 3 of figure 2-32. 6. Inse ert card with pin hole to side of slo ot closer to debug g port. 7. Turrn system on. 8. Use e the Windows ne etwork device setttings application to configure wireless WAN netwo rk connectivity. ffigure 2-32 th in nserting the micro o SIM card Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 32 u using the RJ J45 Gb Etherrnet LAN jac ck The RJ45 connector is s delicate and ma ay not always prrovide a secure network cable con nnection. Handle e the RJ45 connec ctor with care to avoid damage. Different network cables may result in a more secure conn nection. Note: To use the LAN ja ack: 1. Gently pre ess in on the jack to pop it out. 2. Carefully lift up on the top bracket, unfolding g it outward. 3. Plug in your cable. shed, carefully remove cable, fold 4. When finis bracket in,, and press back into system. th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) figure 2-3 33 using the Ethernet LAN jacck DRAFT – CONFIDENTIAL May 2014 33 u using the HD DMI to VGA adapter The HDMI to VGA A adapter is used d to connect the system to a VGA monitor or projec ctor. To activate the display: figure 2-34 VGA dispplay adapter 1. Connect the HDMI end of the adapter to the HDMI port located on o the right side of o the system. 2. Connect the VGA end of the adapter to a VGA display. 3. Press the e Windows key (to o the left of the Alt A key) and the “p” key to o open the display y pop up. 4. Choose a display option: extend, duplicate or second screen on nly. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 34 sstandby and system shut down ttable 2-1 standby and shutd down options options steps using the Windows Charms bar Using the touchscrreen swipe from the e right edge of the display to access tthe Charms bar, tap p ‘Settings’, then tap ‘Power’ and select ‘Sleep’, ‘Shut down’ or ‘Resstart’. using Ctrl + Alt + Delete on the keyboa ard Simultaneously pre ess Ctrl/Alt/Delete keys to bring up thee log-out screen. T Then tap the ‘Powe er’ icon in lower right corner and a select ‘Sleep’, ‘Shut down’, or ‘Reestart’. ffrom the login scree en From the login scre een instead of ente ering a password taap the ‘Power’ icon n in lower right corn ner and select ‘Sleep’, ‘Shu ut down’, or ‘Restarrt’. using Alt + F4 on th he keyboard From the Windows s desktop press Alt+F4 to launch the ‘‘Shut Down Window ws’ menu; then sele ect ‘Sign out’, ‘Sleep’, ‘Shut down’, or ‘Restart’ from the drop-dow wn list. using the system po ower button Press and hold the e system power buttton on the left sidee of the system for m more than 2 seconds but less than 10 seconds to o launch the ‘Shut Down Windows’ meenu; then select ‘Sign out’, ‘Sleep’, ‘Shut down’, or ‘Restart’ from th he drop-down list. fforced shutdown (w when system locks up) Press and hold the e system power buttton for more than 110 seconds to force e an immediate sysstem shut down. Use of this option should be av voided if possible; aany unsaved data w will be lost. waking from standby To wake the syste em from standby mode: from clos sed lid laptop mod de simply open th he system lid from any other open lid orr tablet mode pres ss the system pow wer button ccharging the e battery IIMPORTANT! Us se only the bundle ed power adapterr to charge the ba attery pack and su upply power to thhe system. IInsert the bundled d power adapter into the power po ort to charge the battery pack and supply power to tthe system. The two-color LED prrovides a vvisual indication of o the battery’s ch harge status: Solid Gre een: Solid Ora ange: Blinking Orange: Lights Offf: th The Ultrabook system is plugged in to a power source and a the battery poower is 100%. The Ultrabook system is plugged in to a power source and a the battery poower is between 0 0% and 100%. The Ultrabook system is running on the e battery and the battery power is less than 10%. The Ultrabook system is running on the e battery and the battery power is between 10% an nd 100%. ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 35 u using the debug port This port is for de ebug and validatio on purposes for use u by Intel and should not be necessary for normaal use and software development. Use of the debug port requirres a dedicated de ebug card not inc cluded with the sy ystem. IInsert a small flat screwdriver into the slot on the ba ack of the system m to remove the debug port cover. Insert the debug card into the ope en port. § th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 36 3 technical specifica ations ttable 3-1 system features feature description Form factor and weight 13.3”” 2-in-1 Convertible e, ~3.4 lbs., z = 18.6 6 mm, compliant with w 2014 Intel® Ultrrabook™ Definition n Rev. 1.3 Full-s size backlit keyboa ard, 5 finger multi-to ouch touchpad Processor 5th Gen G Intel® Core™ Processor (Broadwe ell-ULT dual core), 15 W TDP, internaal or PQS sample 2 2.0 GHz or greater base frequ uency (see Dear Cu ustomer Letter inclu uded with system fo or more informationn) Graphics Intel HD Graphics (Gen n5, GT2) OS Micro osoft* Windows 8.1 1* supporting Instan ntGo (Connected Standby) Display 13.3””, 16:9, QHD (3200 0 x 1800), eDP with h PSR, 5+-finger mu ulti-touch with Activve Digitizer Memory 8 GB B LP-DDR3 operatin ng at 1333 MHz (BGA) Storage 180G GB Intel Pro 2500 SSD (“Temple Star””), M.2 (NGFF) mo odule, SATA interfaace Communications Intel® ® Dual Band Wirele ess-AC 7265 (“Ston ne Peak”) 802.11ac c 2x2 PCIe Wi-Fi w w/BT 4.0 M.2 module Designed to support Inttel “Maple Peak” 60 0 GHz 802.11ad WiGig + 2x2 802.11aac WLAN + Bluetoo oth 4.0 M.2 module e, PCIe / USB k module not installled in system interfface) – Maple Peak NXP NPC100 (aka PN5 547) NFC (Near Fie eld Communication n) “Galapagos” moddule with antenna b booster, NCI interfa ace FIH7 7160 4G LTE/3G WWAN w/ GNSS (In ntel XMM 7160 silicon), M.2 module, U USB interface Camera & Mics 2D 1080p user-facing camera (SKU A) or Intel® RealSense 3D+ 2D 1080p useer-facing camera (S SKU B) with LED acctivity indic cator 8 MP P world-facing came era with flash 2x lid d (2d Uf camera) orr 3x lid (SKU B) or and 2x base array digital microphoness IO connectors HDM MI out (1.4b) , 2x US SB 3.0 ports with USB charging spec 1.2 support) SDXC C card reader, micrroSIM, 3.5 mm com mbo audio jack, RJ45 Gigabit LAN Connected standb by with Windows 8.1 Connec cted Standby requirrements Full compliance S0ix-- and Intel® Powerr Optimizer-enabled Sensors ALS,, accelerometer, gy yroscope, compass, NFC (for tap usag ges), IR proximity, bbarometric pressurre Finge erprint sensor GPS S/GNSS (on WWAN N), sensor fusion Battery 50W Whr, Lithium-ion, Sim mplo* 2s2p arrange ement Power adapter Delta a ADP-45BE AA th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) Input : 100~240 V /1.3A , 50~60 Hz Output: 20 V / 2.225 A, 45 W DRAFT – CONFIDENTIAL May 2014 37 4 configur ration an nd troubleshootiing entering the sy ystem BIOS 1. 2. 3. 4. 5. 6. Power sy ystem off (see sta andby and system m shut down.) Power on n, IMMEDIATELY Y press F2 to ente er the system BIO OS. Configure e settings as desiired. Select F4 4 to save settings s. Press Esc until you return to main BIOS me enu. Select Co ontinue to exit BIO OS setup. sselecting the system boot de evice Press F7 during system power on n to select boot device or to boot to the EDK shell. ssystem battery y disconnect/co onnect switch IIf your system sto ops responding or fails to boot, the e system battery reset switch provides the electtrical equivalent of o removing the battery from the sy ystem. figure 4-1 system battery reset To disconnect the e battery from the e system: 1. Insert a pin p or paper clip as a shown in Errorr! Reference sou urce not found. 2. Press in and a release to dis sconnect the batttery. 3. Wait a few w seconds. 4. Repeat Step 2 to reconnect battery. 5. Power sy ystem up as usua al. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 38 R Real Time Clock (RTC) CMO OS reset switch The RTC provides constant powerr for storing custo omized BIOS settings in the ssystem CMOS region. To restore factory default va alues insert pin orr paper clip into hole on side of system, press and release. figure 4-2 RTC CM MOS reset § th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 39 5 REGULA ATORY NOTICES This informatio on should be ke ept with the de evice for future e reference. THIS SYSTEM IS AN N ENGINEERIING DEVELOP PMENT DEVIC CE. NOT OFF ERED FOR SA ALE OR LEAS SE. This device is provided forr test, evaluatio on, and demon nstration purpo oses only as pe ermitted in you ur region. This s device is de esigned to meet or excee ed internation nal Safety, EMC, RF and E Environmenttal standards s. SAFETY WA ARNINGS AN ND CAUTIO ONS 1. Use only y the power ada apter provided with the device e. Other powerr adapters may overheat or da amage the device. 2. The batttery pack is no ot user-servicea able; the batterry[ies] in this device cannot be e easily replace ed by users themse elves’. Do not attempt to remove the battery y pack as dama age to the devicce or battery pack may occur. 3. If the device is damag ged crushed or severely dropped, to ensure safe and properr operation, retturn it to Intel ffor servicin ng. 4. If the device is expose ed to excessive temperatures the battery ma ay fail. Do not e expose the deviice to environ nments over 10 00 degrees C. 5. Do NOT drop the device e in water, as the device is no ot waterproof. Operation and device failure m may occur. 6. Caution n should be exe ercised during lo ong exposure to o excessive sou und levels from m earphones and d headphones a as this can cau use hearing loss s. 7. This de evice may conta ain an Intel® RealSense™ 3D Camera module that containss an integrated d laser projector. The camera a complies with International Standard EN/IE EC 60825-1:200 07 edition 2 forr a Class 1 lase er product. The e camera also complies with US S FDA performance standards for laser products except for d deviations purs suant to Laser n notice No. 007." 50, datted June 24, 20 Do not modify, attempt to open or service the camera module with hin this device iin any way. Mo odification or se ervice of the camera module e might cause the emissions to o exceed the Class 1 level. Do o not activate tthis device if th he camera is da amaged in any manner. Use of o controls or ad djustments or performance off procedures otther than those e specified here ein may result in n hazardous radiation exposure. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 40 E EMC STATE EMENTS Federal Communications Commission Regulatory Statement This equ uipment has been tested and found to comply y with the limitts for a Class B digital device, pursuant to Pa art 15 of the FCC Rules. These liimits are design ned to provide reasonable pro otection againstt harmful interfference in a residential installation. This equipment generates s, uses, and can radiate radio frequency ene ergy and, if not installed and u used in structions, may y cause harmful interference to radio commu unications. How wever, there is n no accordance with the ins ee that interferrence will not oc ccur in a particular installation n. If this equipm ment does caus se harmful interrference guarante to radio or television re eception, which h can be determ mined by turning g the equipmen nt off and on, the user is enco ouraged to try to co orrect the interfference by one or more of the e following measures: • Reorient or relocate the rec ceiving antenna. • Increase the separation bettween the equip pment and rece eiver. • Connect the equipment into o an outlet on a circuit differen nt from that to which the rece eiver is connected. • Consult the dealer or an experienced radio o/TV technician for help. Caution n: To assure continued FCC compliance operation is subje ect to the follow wing two condittions: 1) 1 This device may not cause harmful interference. 2) 2 This device must accept any y interference received, includ ding interferencce that may cau use undesired o operation. Changes or mod difications not expressly appro oved by Intel Corporation coulld void the deve eloper's authorrity to operate the equ uipment. This dev vice complies with the applicab ble FCC rules. FCC ID: RMXWS SBUB-SDS FCC RF Exposure Statement This equ uipment complie es with FCC RF F exposure limitts set forth for an a uncontrolled d environment. This device and its antenna a must not be co o-located or op perating in conjunction with an ny other antenn na or transmitte er. The most th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 41 conserva ative SAR meas sured was 1.49 9W/kg which is below the FCC limit of 1.6W/k kg. Usage of the device should be in accordance with the Us ser Guide and the content of the FCC applica ation. CE Mark This dev vice can be operated in EU without restriction ns indoors. Intel Corporation hereby declare es that this Ultra abook is in complian nce with the es ssential requirem ments and othe er relevant prov visions and Dire ective 1999/5//EC – Radio and Telecom mmunications Te erminal Equipm ment, 2004/108 8/EC – EMC, 20 011/65/EU - Ro oHS, 2012/19/E EU - WEEE, 200 09/125/EU – Ecodesign and 2006//95/EC – Low Voltage. IIndustry Cana ada (IC) Notice This dev vice complies with Industry Ca anada license-exempt RSS sta andard(s). Ope eration is subjec ct to the following two conditions: 1) 1 this device may not cause in nterference, 2) 2 this device must accept any y interference, including interfference that ma ay cause undesired operation of the device. Changes or mod difications not expressly appro oved by Intel Corporation coulld void the deve eloper's authorrity to operate the equ uipment. This equ uipment complie es with Industrry Canada radia ation exposure limits set forth for an uncontrrolled environm ment. The most conservative SAR R measured was s 1.49W/kg. Usage of the de evice should be e in accordance with the User Guide and the content of the IC application. IC:1000V-WSBU UBSDS Français s - Canada Cet C appareil estt conforme avec c le licence-exe empt standard RSS(s) d'Indusstrie Canada. L L’utilisation de c ce dispositif est au utorisée seulement aux deux conditions suiva antes : (1) il ne e doit pas produ uire de brouillage, et (2) l’’utilisateur du dispositif doit être prêt à accepter tout brouilllage radioélecttrique reçu, mê ême si ce brouilllage est susceptible de compromettre le fonctionneme ent du dispositiif. th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 42 Cet C équipementt est conforme Industrie Canada limites d'exposition aux ra ayonnements dé éfinies pour un environnement non contrôlé. Le L SAR la plus conservatrice mesurée était d de 1.49W/kg. L L'utilisation de l''appareil doit êttre en conformité avec le Guid de de l'utilisateur et le conten u de la demand de d'Industrie Canada. Wireless (RF) Interface This developme ent device includ des a wireless (Radio Frequen ncy, RF) transm mitter. Operatio on of the transm mitter may be b restricted or prohibited by regional or natiional regulation ns; a license forr development//experimental u use may be b required. This device may y contain a Wire eless Wide Area a Network (WW WAN) data card . Operation of WWAN requires s the in nstallation of a SIM card (or other network access means) which must be obtained from a licensed netw work service providerr (carrier) for your location. Authorization to o operate a dev velopment device on a live nettwork requires the exp plicit approval of o a network se ervice provider (carrier). Français – Can nada Cet apparreil est conform me avec Industrrie Canada RSS S standard exem mpts de licence e (s). Son utilisation est so oumise à Les deux conditions suivantes: (1) cet appareil ne e peut pas prov voquer d'interfé érences et (2) cet appareil doit accepter Toute interféren nce, y compris les interférencces qui peuventt causer un mau uvais fonctionnementt du dispositif. ECOLOGY STATEMENT TS Recyclab ble: Do not dis spose of this de evice in unsorte ed municipal wa aste. Recycle p properly to ensu ure safe and proper protectio on of the enviro onment. This de evice contains certain recyclab ble componentss. At the end o of developmentt use, return th he device to Inttel for recycling g, or recycle in a manner acce eptable to your local authoritie es. Refer to loc cal environm mental regulations for proper recycling. Lithium Battery Pack: Except to recycle, do not atte empt to remove e the battery pa ack as damage to the device o or battery pack ma ay occur. The battery[ies] in this device cann not be easily replaced by userss themselves’. Perchlorrate Material: Lithium (Coin Cell) Battery con ntains Perchlora ate material — special handlin ng may apply. See www.dts sc.ca.gov/hazardouswaste/perchlorate. This notice is required by Californ ia Code of Regu ulations, Title 2 22, th ased SDS Intel® 5 Generation Core™ Processor-ba USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 43 Division 4.5, Chapter 33: 3 Best Management Practice es for Perchloratte Materials. Th his device inclu udes a battery w which contains s Perchlorate material. Power Efficiency (as sh hipped) Default Settings (Wind dows 8.1 installled): Balanced Powerr Plan: Put Computer to Sle eep (On Battery y): 4 minutes. Put Computer to Sle eep (Plugged In n): 10 minutes. Hibernate: Critical Battery Action when Critic cal Battery Leve el reaches 2%. § th Intel® 5 Generation Core™ Processor-ba ased SDS USER MANUAL (Rev v 0.93) DRAFT – CONFIDENTIAL May 2014 44
Source Exif Data:
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