Intel WSBUB-SDS WSBUB-SDS User Manual

Intel Corporation WSBUB-SDS

User Manual

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With Reg
gulatory updates
- Safety
Pre
ecautions 9/19/201
14
- Regula
atory Notices 9/21//2014 (eccology)
In
ntel® 5th Generatio
on Core™
™ Process
sor-Based
Solutiion Development System ((SDS)
USER
U R MAN
NUAL
Mode
el: WSBUB-SDS
Docume
ent Number: H320
072
Revisio
on 0.93 • May 201
14
Regulatory Info
ormation • Septem
mber 2014
DRAFT
T - Intel Confid
dential
N
Notice:
INFORMATION IN TH
HIS DOCUMENT IS PROVIDED
IN CONN
NECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS
S OR IMPLIED, BY E
ESTOPPEL OR OTHE
ERWISE, TO
ANY INTELLECTUAL
L PROPERTY RIGHT
TS IS GRANTED BY THIS
DOCUMENT. EXCEPT
AS PROVIDE
ED IN INTEL’S TERM
MS AND CONDITION
NS OF SALE FOR SU
UCH
PRODUCTS, INTEL ASSUMES
NO LIABIL
LITY WHATSOEVER
R, AND INTEL DISCLA
AIMS ANY EXPRESS
S OR IMPLIED WARR
RANTY, RELATING T
TO SALE AND/OR USE OF
INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIE
ES RELATING TO FIT
TNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY
Y, OR INFRINGEMEN
NT OF ANY
PATENT, COPYRIGH
HT OR OTHER INTEL
LLECTUAL PROPER
RTY RIGHT. INTEL PR
RODUCTS ARE NOT
T INTENDED FOR US
SE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS.
Intel may make chang
ges to specifications and
a product descriptio
ons at any time, witho
out notice.
All products, dates, an
nd figures specified are preliminary based on current expectatio
ons, and are subject to
o change without notitice.
Intel processors, chipsets, and desktop boa
ards may contain des
sign defects or errors known as errata, which may cause the prooduct to deviate from published specificatio
ons. Current
ccharacterized errata are
a available on reque
est.
Any code names featu
ured are used interna
ally within Intel to iden
ntify products that are in development and not yet publicly annouunced for release. Cu
ustomers, licensees a
and other third
parties are not authorrized by Intel to use co
ode names in advertis
sing, promotion or ma
arketing of any produc
ct or services and anyy such use of Intel's internal code names is at the sole
rrisk of the user.
Software and workloa
ads used in performan
nce tests may have be
een optimized for perrformance only on Inte
el microprocessors. P
Performance tests, su
uch as SYSmark and MobileMark,
are measured using specific
computer systtems, components, so
oftware, operations and functions. Any cha
ange to any of those ffactors may cause the
e results to vary. You should consult
other information and performance tests to
o assist you in fully evaluating your contemplated purchases, inc
cluding the performannce of that product wh
hen combined with oth
her products.
For more information go to http://www.intell.com/performance.
Intel, Intel Inside, the Intel logo, Intel vPro, Centrino, Centrino In
nside, Intel Core, Intel Atom, Pentium, Ultra
abook, and RealSensse are trademarks of IIntel Corporation in th
he United
States and other coun
ntries.
Ultrabook™ products are offered in multiple models. Some mod
dels may not be availa
able in your market. Consult
your Ultraboook™ manufacturer. Fo
or more information an
nd details, visit
http://www.intel.com/u
ultrabook.
Material in this docum
ment is intended as product positioning and
d not approved end us
ser messaging.
This Ultrabook system
m is an engineering sa
ample and may not be
e sold or leased; it rem
mains the property off Intel.
This Ultrabook system
m is specifically design
ned and tested for Microsoft* Windows* 8.1, configured for Con
nnected Standby operration.
This document contains information on pro
oducts in the design phase
of developmentt.
**Other names and bra
ands may be claimed as the property of oth
hers.
Copyright © 2014 Inte
el Corporation
th
Intel® 5 Generation Core™ Processor-Ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
rrevision history
Revision
Description
Da
ate
0.92
Added:
Jun
ne 20, 2014
Fingerprint sensor infformation
0.91
Updated:
Ma
ay 13, 2014
uctions for enabling WWAN
Wireless WAN: instru
0.9
Updated:
Ma
ay 7, 2014
Wireless WAN SIM card
instructions
0.85
Updated:
Ma
ay 2, 2014
Introduction
Left side features
Using the keyboard
GA adapter
Using the HDMI to VG
Using the debug portt
Standby and system shut down
ons
Technical specificatio
Configuration and tro
oubleshooting
0.8
Update for Beta (DVT
T2) factory build with Intel® RealSense 3D
D camera.
Ap
pril 23, 2014
Updated:
WWAN and Wi-Fi stattements)
Safety precautions (W
Active Pen configurattion information
Touchscreen configuration information
0.7
Initial release, Beta (D
DVT2) factory build.
Ap
pril 15, 2014
§
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
ccontents
introduction
safety precautions
getting to know the system
system features
left side view
right side view
front panel view
rear pan
nel view
using your system
getting starte
ed
system orien
ntations
laptop mode
tablet mode
display mode
de
tent mod
using the protective sleeve
using the tou
uch screen
customizing the touch scre
een functions
uchpad
using the tou
using the acttive pen
customizing the pen behav
vior
example
es of applications supporting
an active
e pen
using the key
yboard
function key commands
other ke
eyboard functions
using the cameras
cing webcam
user-fac
world fa
acing camera (table
et mode)
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
11
11
12
12
13
13
14
15
15
16
17
17
20
21
22
24
25
25
25
26
26
27
using the system m
motion sensors
using
the fingerprintt sensor
wireless
WAN and S
SIM card
beta (DVT2) syystems: enabling th
he WWAN hardware
installing the m
micro SIM card
using
the RJ45 Gb Ethernet LAN jack
using
the HDMI to V
VGA adapter
standby
and system
m shut down
waking from staandby
charging
the batteryy
using
the debug porrt
te
echnical specificaations
configuration
and troubleshooting
entering the sys
ystem BIOS
selecting the syystem boot device
system battery disconnect/connecct switch
Real Time Clocck (RTC) CMOS reset switch
regulatory
noticess
SAFETY
WARNING
GS AND CAUTION
NS
EMC
STATEMENT S
ECOLOGY
STATEM
MENTS
ADDITIONAL
INFO
ORMATION for systtems with the
Intel® ReaalSense™ 3D Camera F200
DEVICE DESC
CRIPTION
SAFETY WARN
NINGS AND CAUT
TIONS
ECOLOGY STA
ATEMENTS
DRAFT – CONFIDENTIAL
28
30
31
31
32
33
34
35
35
35
36
37
38
38
38
38
39
40
40
40
43
43
Error! Bookmark
Error! Bookmark
Error! Bookmark
May 2014
ffigures
ffigure 2-1
ffigure 2-2
ffigure 2-3
ffigure 2-4
ffigure 2-5
ffigure 2-6
ffigure 2-7
ffigure 2-8
ffigure 2-9
ffigure 2-10
ffigure 2-11
ffigure 2-12
ffigure 2-13
ffigure 2-14
ffigure 2-15
ffigure 2-16
ffigure 2-17
ffigure 2-18
ffigure 2-19
ffigure 2-20
ffigure 2-21
ffigure 2-22
ffigure 2-23
th
getting
started
la
aptop mode
ro
otating to tablet
ta
ablet mode
display
mode
te
ent mode
sleeve
alignment for laptop carry mode
active
pen pocket
sleeve
alignment for tablet mode
system
and sleeve in
i tablet mode
to
ouch screen gesturres
to
ouch settings
double-tap
and pres
ss and hold settings
display
settings
other
settings
to
ouchpad gestures
to
ouchpad configurattion
in
nstalling the active pen battery
active
pen buttons
pen
p and touch scree
en
navigational
flicks
navigational
and editing flicks
customize
flicks
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
12
13
14
14
15
15
16
16
16
16
17
18
18
19
19
20
20
21
21
22
22
23
23
figure 2--24
figure 2--25
figure 2--26
figure 2--27
figure 2--28
figure 2--29
figure 2--30
figure 2--31
figure 2--32
figure 2--33
figure 2--34
figure 4--1
figure 4--2
keyboard
rd layout and functio
on keys
2D cameera configuration
3D cameera configuration
world faccing camera
world faccing camera contro
ols
world faccing camera locatio
on
setting uup system login passsword
setting uup fingerprint accesss
insertingg the micro SIM carrd
using thee Ethernet LAN jacck
VGA dissplay adapter
system bbattery reset
RTC CM
MOS reset
25
26
26
27
28
28
30
30
32
33
34
38
39
tables
table 2-1
table 3-1
DRAFT – CONFIDENTIAL
standby and shutdown optiions
system ffeatures
35
37
May 2014
1
introduction
th
This 5 generatio
on Intel® Core™ Processor-based
Solution Development System (S
SDS) is a businesss and consumer focused Ultraboo
ok™ 2-in-1
cconvertible device
e featuring:











13.3” 3200 x 1800 QHD+ multi-finger touch display
360-degree
e hinge fold-over conversion mech
hanism
Intel® vPro
o™ Technology with
w discrete TPM 2.0 and pop-out
RJ45 Gigab
bit Ethernet jack (see
using the RJ45
Gb Ethernett LAN jack)
180GB Inte
el® Pro 2500 Seriies SSD (M.2 module, SATA
interface)
Two user-fa
acing camera opttions (see using the
t cameras):
o Full HD
H 2D camera
o Intel®
® RealSense™ 3D Camera F200 with full HD 2D
came
era
World-facin
ng camera; 8 MP with LED flash
Intel® Duall Band Wireless-A
AC 7265 (“Stone Peak”) 802.11ac 2x2
PCIe Wi-Fi w/BT 4.0 M.2 mo
odule
Intel® Pro Wireless
Display (WiDi) 5.0 with Miracast*
support







el® XMM7160-bassed LTE WWAN w/ GNSS
Inte
Des
signed for Intel “M
Maple Peak” WiGig with optional W
WiGig
Wire
eless Dock (see Error! Reference source not fou
und.)1
o Maple Peak moodule not include
ed, late availabilityy
Nea
ar Field Commun ications (NFC) an
ntenna
Syn
naptics* ForcePadd* touchpad with multi-finger gestu
ure support
(see
e using the touchhpad)
N-trrig* DuoSense Peen 2* Active Pen (see using the acctive pen)
Fing
gerprint sensor (ssee Error! Refere
ence source nott found.)
Full set of sensors inncluding accelero
ometer, gyroscope
e, compass,
bient light, user pproximity, and barrometric pressure
amb
IO connectors:
full siize HDMI out, 2x USB 3.0 ports, S
SDXC card
read
der, micro SIM, 33.5 mm combo au
udio jack, RJ45 G
Gigabit LAN
Microsoft* Windows** 8.1 with InstantG
Go* capability (also known
Standdby)
as Connected
This Ultrabook 2-in-1 convertible design
represents
s many of the cap
pabilities of system
ms based on the 5th Generation In
ntel® Core™ Proccessor. This
ssystem is designe
ed as a software development plattform to aid in delivery of compelling and differentiaated software and
d user experience
es for the
latest Intel platforrms.
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
ssafety precautions
WARNING
G: READ THESE PRECAUTIONS PRIOR
TO USING Y
YOUR DEVICE.







Use
U only the powe
er adapter provided with the device
e. Other power adapters
may oveerheat or damage
e the device.
The
T battery pack is not user-service
eable; the battery
y[ies] in this devic
ce cannot be easilly replaced by users themselves’. Do
not
n attempt to rem
move the battery pack
as damage to
t the device or ba
attery pack may ooccur.
Iff the device is dam
maged crushed or
o severely droppe
ed, to ensure safe
e and proper opeeration, return it to
o Intel for servicin
ng.
Iff the device is exp
posed to excessiv
ve temperatures the
t battery may fa
ail. Do not exposee the device to en
nvironments
over
100 degrees C.
Do
D NOT drop the device in water, as
a the device is no
ot waterproof. Operation and devvice failure may occcur.
Caution
should be
e exercised during
g long exposure to
o excessive soun
nd levels from earrphones and head
dphones as this ccan cause
hearing
loss.
This
device may contain
an Intel® RealSense™ 3D
D Camera module
e that contains ann integrated laser projector. The ccamera
complies
with Inte
ernational Standard EN/IEC 60825
5-1:2007 edition 2 for a Class 1 lasser product. The camera also com
mplies with
US
U FDA performa
ance standards fo
or laser products except
for deviations pursuant to LLaser notice No. 50, dated June 2
24, 2007."
Do not mo
odify, attempt to open
or service th
he camera modulle within this deviice in any way. M
Modification or se
ervice of the
camera module
might caus
se the emissions to exceed the Class 1 level. Do nnot activate this d
device if the came
era is
damaged in any manner. Use of controls or
o adjustments or performance of pprocedures otherr than those specified herein
adiation exposure
e.
may resullt in hazardous ra
For additional
inform
mation including
g RF exposure:
See REGULATORY NOTICES section.
th
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
g
getting to know the syste
em
ssystem featu
ures
1.
User-fac
cing webcam and microphones (se
ee
using the
e cameras)
The SDS
S has two camera/m
microphone configu
urations:

SKU A: standard 11080P full HD webccam

SKU B: Intel® ReaalSense™ 3D Cam
mera F200 plus 108
80P full HD
2D camera
3. Ambientt light sensor (AL
LS)
The ALS
S allows the system
m to change the disp
play backlight automatically
accordin
ng to the ambient ligght.
4. QHD+ (3
3200 x 1800) multii-touch display
The high
h-definition display panel provides exccellent viewing featu
ures for
photos, videos,
and other m
multimedia files.
5. Microso
oft* Windows* hom
me key
Home ke
ey for quick navigattion in tablet mode..
6. User pro
oximity sensor
The builtt-in proximity sensoor determines when
n a user is within ra
ange to switch
between
n wake and standbyy modes. This component is not functiional with
Windows
s 8.1; intended for ddevelopment with ffuture operating sysstems.
7. Speakerrs
Speakerrs are located on booth sides of the sysstem. The integrate
ed stereo
speakers
s provide high perfoormance audio.
8. Synaptic
cs* ForcePad* To uchpad
Pressure
e sensitive touchpaad compliant with M
MS precision touchp
pad
specifica
ation. See using thee touchpad for deta
ails.
9. Fingerprint sensor (see u
using the fingerprintt sensor)
Place fin
nger on sensor to loog into Windows 8.1.
10. World-fa
acing camera and
d flash (for tablet m
mode)
This 8MP
P camera has an LLED flash and is loccated on the keyboa
ard face for
use in ta
ablet mode.
11. NFC anttenna location ind
dicator
Near Fie
eld Communicationss antenna for tap/p
pay and tap/connecct usage.
2.
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
lleft side view
1.
Power (DC) input
port and power
status indicator
Insert the bun
ndled power adap
pter into this port to charge the
battery pack and
a supply power to the system. See
S charging the
battery.
2.
USB 3.0 portt, compliant with
h USB charging spec 1.2
This Universa
al Serial Bus 3.0 (USB
3.0) port prrovides a transferr
rate of up to 5 Gbit/s and is ba
ackward compatib
ble to USB 2.0. Also
provides pow
wer for charging otther devices such
h as cell phones
while in stand
dby state.
3.
Main system
m battery disconn
nect/connect sw
witch
This switch is
s for debug and validation purpose
es and should nott be
necessary forr normal usage. Insert pin or pape
er clip, press to
disconnect main
system battery. Press again to
o reconnect the
main system battery. See systtem battery disco
onnect/connect
switch for dettails.
4.
Headphone/microphone com
mbo jack port
p allows connec
ction of the SDS to
t amplified
The combo port
speakers or headphones,
or connection
to an external
micropho
one.
5.
Real Time Clock (RTC) CMO
OS reset switch
s for debug and validation purpose
es and should nott be
This switch is
necessary forr normal usage. Insert pin or pape
er clip, press to force
a system rese
et and clear CMO
OS settings. The Real
Time Clock
battery provid
des constant pow
wer for storing sys
stem BIOS setting
gs
information such as time and date.
See Real Time Clock (RTC)
CMOS reset sw
witch for details.
6.
SD
DXC (secure digiital extended capacity) memory card slot
The
e memory card sslot supports SDX
XC cards with memory up to
2 TB.
7.
Sy
ystem power buttton and power indicator light
The
e system indicatoor LED lights up w
when the system is active.
The
e power button h as three function
ns:

ase the power button to put
Standby modee: Press and relea
ess and release a
again to
the system in sttandby mode. Pre
return to active mode.

Shut down: Preess and hold the power button for more than
2 seconds but leess than 10 seco
onds to activate a slider
prompt to shut ddown the system.

Forced shut do
own: Press and h
hold the power bu
utton for
more than 10 seeconds to force a
an immediate sysstem shut
down.
rright side vie
ew
th
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
8
8.
Rotation lock button
a modes (laptop
p, tablet, display, aand tent.)
The rotation lock button secures the SDS display orientation in all
9.
Volume up button
Press to incre
ease system volu
ume.
10.
Volume dow
wn button
Press to decrrease system volu
ume.
11.
USB 3.0 portt
This Universa
al Serial Bus 3.0 (USB
3.0) port prrovides a transferr rate of up to 5 Gbit/s
and is backw
ward compatible to USB 2.0.
12.
HDMI port
e A HDMI version
n 1.4a port for pro
ojecting audio and
d video to externa
al sources includiing televisions an
nd audio receiverss.
Full size Type
13.
RJ45 Gb Eth
hernet LAN jack
Use the LAN port to connect to
o a network. See using the RJ45 Gb
G Ethernet LAN jack for more infformation.
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
10
ffront panel view
14.
World-fa
acing microphon
nes
Dual world-facing microph
hone, used with world-facing
came
era.
15.
Lid lift area
ert fingers and liftt to open system lid.
Inse
18.
Deb
bug port
Deb
bug port (should nnot be necessaryy for normal syste
em use.)
See
e using the debugg port.
rrear panel viiew
16.
17.
Air vents
Keep the system’s air vents clear of obstruction for optimal
performance.
Micro SIM
M card slot
To be use
ed for LTE/3G WWAN connectivity
y. Micro SIM card
d not
included with system. Con
ntact your cellularr communications
carrier for a micro SIM carrd. Insert the end of a paper clip or a
ard tray from the slot.
small pin into the pin hole to remove the ca
See wirelless WAN and SIM card.
§
th
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
11
2
using
g your sy
ystem
getting starte
ed
WARNING:
To av
void injury, read im
mportant safety in
nformation in
safety precautions.
To start your systtem the first time:
ure 2-1
figu
gettting started
1. Remove all components frrom the box and packaging
s.
materials
2. Flip the system
to Laptop Mode (see system orientations.)
3. Remove the protective sle
eeve.
4. Connect the AC power cord to the AC/DC adapter;
connect
the cord to
t the system and
d plug into an outtlet. Leave system
connecte
ed to power sourc
ce for a few hours
s (preferably
overnightt) to fully charge battery.
5. Press the
e power button.
6. Follow on
nscreen directions
s to configure sys
stem.
NOTE: This sys
stem does not include an operatting system
activatio
on key. A Micros
soft* MSDN* product key is
required to activate the operating
system
m installed on
this device.
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
12
ssystem orien
ntations
The system has four
different orien
ntation modes: la
aptop, tablet, display, and tent. The
e included protecctive sleeve functiions as a carrying
g case for
tthe system and as a keyboard cov
ver in tablet mode
e.
llaptop mode
Laptop mode is th
he standard comp
puter usage mode
e, with the display screen tilted up
p at an angle to thhe keyboard. Thiss mode provides comfortable
alignment for gen
neral computer functions while worrking at a desk orr with the computer on your lap.
ffigure 2-2
th
la
aptop mode
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
13
ttablet mode
This mode offers the ability to use the system as a modern Windows
s* 8.1 touchscree
en tablet, without using the keyboa
ard or touchpad. T
The
kkeyboard and tou
uchpad are disabled in this mode for
f proper handlin
ng of the system without
accidentaal key strikes.
You can use the world-facing
cam
mera (see using th
he cameras) in tab
blet mode to take
e pictures and viddeo.
ffigure 2-3 shows how to rotate the
e system from laptop to tablet mode. The rotation lo
ock switch locatedd on right side of the device locks the display
orientation so sys
stem movements don’t result in dis
splay rotation.
See figure 2-7 forr instructions on using
the protectiv
ve sleeve to cove
er the keyboard while
in tablet modde.
ffigure 2-3
th
ro
otating to tablet
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
figure 2-4
DRAFT – CONFIDENTIAL
tablet mode
May 2014
14
d
display mode
tent mo
ode
Display mode offe
ers a convenient orientation for vie
ewing media on your
ssystem, or for using the system in touchscreen mod
de while placed on
o a
desk or your lap. You can use the protective sleeve
e to cover the
kkeyboard surface
e while in this mod
de (see
Tent mode
e offers an alternnative orientation to display mode ffor viewing
media or using
your touch screen.
using the protective sleeve for proper
sleeve alig
gnment.)
ffigure 2-5
th
display
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figure 2-6
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May 2014
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u
using the pro
otective slee
eve
The protective sle
eeve provided witth your system ca
an be used as botth a carrying case
e when the systeem is not in use to
o help protect aga
ainst
damage and as a keyboard cover to protect agains
st dirt or spills whe
en in tablet or dis
splay mode. figuree 2-7 and figure 2
2-9 show proper ssleeve
alignment. The prrotective sleeve in
ncludes a storage
e pocket for the active
pen.
Note: do not push
h pen to bottom of
o pocket; constan
nt pressure on pe
en tip may result in
i damage or redu
duced battery life.
ffigure 2-7
sleeve
alignment for
f laptop carry mode
figure 2-8
active penn pocket
ffigure 2-9
sleeve
alignment for
f tablet mode
figure 2-10
system annd sleeve in tablett mode
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u
using the tou
uch screen
The system is equipped with a mu
ulti-touch HD disp
play screen suppo
orting the following standard gestuures.
ffigure 2-11
to
ouch screen gesttures
Left edg
ge swipe
Swipe from the left edge of the screen to
t running apps.
shuffle the
Tap aand hold
To m
move an app, tap a
and hold the app tile and
drag it to a new locatio
on.
To cl ose an app, tap a
and hold the top sside of
the ruunning app and d
drag it down to the
bottoom of the screen tto close it.
Right edge
swipe
Swipe from the right edg
ge of the screen to
t charms bar.
launch the
Zoom
m out
Bringg together two fing
gers on the displa
ay.
Top edg
ge swipe
In the Start
screen, swipe from the top
edge off the screen to vie
ew the All Apps
bar.
Drag
Toucch and drag your ffinger on the disp
play to
movee an item to a new
w location.
Zoom
m in
Spreaad apart two fingers on the displayy.
In a running app, swipe from
the top edge
creen to view its menu.
of the sc
Scroll
a slide a finger in any direction
Touch and
on the display
to scroll th
hrough pictures,
text, or other content.
Rotaate
wo fingers and twist your
Toucch an item with tw
handd to rotate. (Not alll items rotate.)
For more details: http://windows.micro
osoft.com/en-US/w
windows-8/get-starte
ed
ccustomizing the touch sc
creen functio
ons
Touch screen fun
nctions including double-tap,
press
s and hold, and viisual touch feedb
back can be configgured to optimize
e your user experrience.
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G
Go to Control Pa
anel > Hardware and Sound > Pe
en and Touch > Touch to configu
ure your touch scrreen functions.
Choose Double-tap
or Pres
ss and hold from the Touch tab
of the Pen
n and Touch pop up window. Click
k Settings. Or,
configure your Touch Feed
dback settings to show (or not
ual feedback whe
en you touch yourr display.
show) visu
In th
he Double-Tap S ettings or Press a
and Hold Settingss dialog
box
x, choose the settting you want to ccustomize. Selectt OK when
finis
shed.
figure 2-12
figure 2-13
touch settings
doubble-tap and presss and hold setting
gs
You can also customize settings th
hrough the Tablet PC Settings me
enu (go to Contro
ol Panel > Hardw
ware and Sound > Tablet PC Setttings.)
From this menu you
y can configure
e pen and touch settings,
calibrate the display (not recommended)
aand change the ha
andedness of the
e display.
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The Display tab
t includes display, orientation, and pen and
touch display
y configuration options. The “Calibrrate” function
is not recomm
mended.
The Otther tab includes handedness and pen and touch
setting configuration.
figure 2-14 display
settings
figure 2-15
other sett ings
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u
using the tou
uchpad
The system is equipped with a pre
essure-sensitive Synaptics*
ForceP
Pad* touchpad. The
T ForcePad is a multi-finger, buttton-less touchpa
ad with
vvariable pressure
e detection and a maximized gestu
ure area for a fastt and fluid Window
ws 8 user experieence.
The Synaptics driiver incorporates all
sstandard touch ge
estures including
pinches, swipes, finger scrolling, and
ffinger flicks.
figurre 2-16
touchpa
ad gestures
The Synaptics Ge
esture Suite offerrs
options for multi-ffinger flick gesture
es to
help navigate, zoom, and manipula
ate
documents and programs.
ffigure 2-17 shows
s how to reach the
Synaptics Gesturre Suite software
tthrough the pointiing device properrties
application.
ffigure 2-17
to
ouchpad configurration
For more details: http://www.syna
aptics.com/solutio
ons/products/force
epad
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u
using the acttive pen
The N-trig* DuoSense Pen 2* activ
ve pen included with
w this system is
s a high accuracy
y pressure sensittive pen with butto
on, hover, and flicck
ccapabilities. The active
pen suppo
orts the following:

Handwriting recognition (H
HWR)

WR/search)
Note taking (including HW

ument annotation
PDF/docu

E-textboo
oks and curriculum
m annotation

Presentation tools

ation/white-boarding
Collabora

Drawing and graphics

edia (photo annotation)
Digital me

Internet in
nfrastructure (Fla
ash and AIR)

Games
figure 2-18
installing the aactive pen batteryy
The DuoSense Pen 2 acts like a re
egular pen, with 256
2 distinct
levels of pressure
e sensitivity for a natural pen-on-pa
aper
experience. Touc
ch the pen tip to th
he display to sele
ect onscreen
objects or to hand
dwrite or markup in an application.
ffigure 2-19
active
pen buttons
Tap or hold button when touching
g tip to screen to ‘Right Click’ or foor application spe
ecific functions.
Press button forr ‘Eraser’ tool or other
application specific
function.
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ccustomizing the pen beh
havior
Customize the ac
ctive pen behavior to optimize your user experience
e. You can custom
mize navigationall flicks (up, down, left, and right) o
or
navigational flicks
s and editing flick
ks (up, down, left, right, and diagon
nals), as shown in
n figure 2-20 thro ugh figure 2-23.
Note: a right mou
use click function can be achieved by touching and holding the pen tip
t to the display. This option can b
be configured in tthe
Microsoft* Window
ws* 8.1 Pen Configuration applet. This functionality
y is available in th
he Windows Deskktop interface, ass well as in Windo
ows
JJournal*, Microso
oft Office*, Sticky Notes*, and the Snipping
Tool*.
Pen gestures can
n be configured in
n the Microsoft Windows 8/8.1 pen
n configuration ap
pplet here:
Control Panel > Hardware and Sound
> Pen and
d Touch > Pen Options.
ffigure 2-20
pen
p and touch scrreen
figgure 2-21

na
avigational flicks
In the Pen and Touch pop up
window, se
elect the Flicks ta
ab.
On the Flic
cks tab, select
Navigation
nal flicks to configure up,
down, left, and right flicks. 
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ffigure 2-22
navigational
and editing
flicks
figurre 2-23
cu
ustomize flicks
 In the Pen and Touch pop up
window, se
elect the Flicks ta
ab.
On the Flic
cks tab, select
Navigation
nal flicks and editing
flicks to co
onfigure up, down, left,
right and diagonal
flicks. 
The pen supports
s multiple flick ges
stures, including the following:

Scroll forw
ward/backward: flick
the pen to the left across the screen
to scroll backward
or to thee right to scroll fo
orward.

Drag up/d
drag down: flick the pen upward on the screen to drag up, or downw
ward to drag downn.

Copy: flic
ck the pen upward
d at a diagonal to
o the right corner of the screen to copy.

Paste: flic
ck the pen downw
ward at a diagona
al to the right corn
ner of the screen to paste.

Undo: flic
ck the pen downw
ward at a diagona
al to the left corne
er of the screen to
o undo.

Delete: flick the pen upwa
ard at a diagonal to
t the left corner of
o the screen to delete.
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e
examples off applications
s supporting
an active pen
The active pen offfers a broad rang
ge of functions an
nd
users across diffe
erent applications
s. This chart proviides a
ssmall list of applic
cations available in the market tha
at
ssupport an active pen.
environ
nment
Microsoftt
Windows
Desktop
interface
NOTE: These applications
are not included witth the
Solution Development System.
app
p name
app description
pen
pressure
sensitivity
ArtRage* 4
Draawing
Yes
Yes
BlueBeam* Revu*
PDF
F annotation
Yes
Yes
Corel* Paint It
I Touch*
Draawing
Yes
Yes
Grahl* PDF Annotator*
PDF
F annotation
Yes
Yes
Microsoft* Ma
ath Input Panel
6.2
Penn-to-text for writing
matthematical equations
Yes
No
Yes
Yes
Microsoft* Offfice 2013 Suite
For more details:
pen button
support
Microsoft* On
neNote* (Office
2013)
Notte taking
Yes
Yes
Microsoft* Sn
nipping Tool
Annnotation
Yes
Yes
odleinator*
Xoanan* Doo
Creeating doodle
anim
mations
No
No
MyScript* No
otes Mobile*
Notte taking
Yes
Yes
Spritehand* Physamajig*
Dooodling physics game
No
No
Halfbrick* Fru
uit Ninja*
Gam
me
No
No
Autodesk* Sk
ketchbook*
Express
Draawing
Yes
Yes
http://www.nttrig.com/Content.as
spx?Page=TechDu
uoSenseActivePen
Microsoftt
Windows
s8
Live Tiles
“modern
interface””
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u
using the key
yboard
The system has a full size backlit keyboard.
Standard keyboard fun
nction commands and shortcuts arre supported.
ffunction key commands
ffigure 2-24
keyboard
layout and
a function keys
other keyb
board functio
ons
boot up keys:
F2 = BIOS setup
F7 = boot options
Windows sho
ortcuts:
http://windo
ows.microsoft.com
m/en-US/window
ws7/using-your-ke
eyboard
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u
using the cameras
The system includ
des a user-facing
g webcam (in two different configurations) and a wo
orld-facing camerra for use in table
et mode.
user-facing webcam
The user-facing webcam
is located
d at the top of the
e display screen and
a is used for pictures, video andd video conferenccing.
The system is ava
ailable with two user-facing
webcam options:
SKU A:
figure 2-25
D camera configuuration
2D
figure 2-26
3D
D camera configuuration
standard 1080
0P full HD webca
am
SKU B: Intel® RealSen
nse™ 3D Camera
a F200
plus 1080P fu
ull HD 2D camera
See Recyclable: Do not dispose of
o this device in
unsorted municip
pal waste. Recycle properly to
ensure safe an
nd proper prote
ection of the
environment. This device con
ntains certain
rrecyclable comp
ponents.
At the end of
development use
e, return the dev
vice to Intel for
rrecycling, or recy
ycle in a mannerr acceptable to
your local authorities.
Re
efer to local
environmental regulations for proper recycling.
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Lithium Battery Pack: Except to recycle, do not
attempt to remove the battery pack as damage
to the de
evice or battery
y pack may occu
ur. The
battery[ies] in this device cannot be easily
d by users them
mselves’.
replaced
Perchlorrate Material: Lithium
(Coin Cell)
Battery contains Perchlorate material — special
g may apply. See
handling
www.dts
sc.ca.gov/hazardouswaste/perchlorate.
This nottice is required by California Code of
Regulatiions, Title 22, Division
4.5, Ch
hapter 33:
Best Management Prac
ctices for Perchlorate
Materials. This device includes a batttery which
s Perchlorate material.
contains
Power Efficiency (as sh
hipped) Default Settings
ws 8.1 installed):
(Window
Balanced
Powerr Plan:


Put Computer
to Sle
eep (On
Batte
ery): 4 minutes
s.
Put Computer
to Sle
eep
(Plug
gged In): 10 miinutes.
Hibernate:
Critical Battery Action when
Critical
Battery Level reaches 2%.
for important safe
ety and regulatorry information.
world facing camera (tab
blet mode)
The world facing camera is located
d on the keyboard
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figu
ure 2-27
DRAFT – CONFIDENTIAL
woorld facing camerra
May 2014
27
p
panel face and is used in tablet mo
ode. Hold the sys
stem
up in tablet mode
e with the hinges pointing
down to
ccorrectly orient th
he world facing ca
amera.
ffigure 2-28
world
facing came
era controls
figu
ure 2-29
woorld facing camerra location
using the sys
stem motion sensors
Sensors integrate
ed into the system
m detect orientatio
on, movement, an
nd ambient light.

Accelerom
meter and gyrosc
cope: detects mo
otion and orientation changes, for example to shift tthe on-screen ima
age from landsca
ape to
portrait display as the systtem orientation ch
hanges while in ta
ablet mode.
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
Ambient Light Sensor (ALS): detects room
m light intensity, fo
or example to adjust onscreen dispplay brightness to
o improve readab
bility in bright
ery power in low light room.
rooms or to conserve batte

Near Field Communication
ns (NFC): detectts other NFC enabled devices (suc
ch as smartphonees or credit cardss) to initiate data ttransfer
operation
ns within Windows
s or for faster on--line payment tran
nsactions at apprropriately enabledd web sites. The
e NFC solution is compliant
with Micro
osoft Windows 8..1 Proximity Serv
vice APIs and Inte
el® Identity Protec
ction Technologyy middleware for ““Tap and Pay” se
ervices.

Infrared (IR)
user proximity: detects heat and/or
human pre
esence to prompt the system to waake up or to enterr standby mode. The IR
sensor is not currently sup
pported under Windows 8.1 and is
s intended for use
e in developing fuuture applications or operating systtems.

Barometrric pressure: dete
ects changes in air
a pressure, such
h as with elevation
n changes, and ccan be used to faccilitate improved indoor
navigation capabilities. The
T barometric pressure sensor is currently not sup
pported under Winndows 8.1 and is intended for use
e in
ng future applications or operating systems
developin
The system also includes a Near Field
Communica
ation (NFC) solution to detect other NFC enabled d evices. The antenna detects other NFC
enabled devices (such
as smartph
hones or credit ca
ards) to initiate da
ata transfer opera
ations within Microosoft* Windows* or for faster on-lin
ne payment
ttransactions at ap
ppropriately enab
bled web sites. The
T NFC solution is compliant with
h Windows 8.1 Prroximity Service A
APIs and Intel® Id
dentity
Protection Technology middleware
e for “Tap and Pa
ay” services.
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u
using the fingerprint sensor
The fingerprint se
ensor can be used
d in place of typin
ng a password to streamline the sy
ystem login proceess. Set up a sysstem login passw
word prior to
ssetting up fingerp
print access. If yo
ou already have a system login password for the sp
pecific user accouunt, skip to setting
g up fingerprint access.
Fingerprint acces
ss can be set up for
f each user account on the syste
em; multiple finge
erprints can be asssociated with eacch user account.
First, set up a sy
ystem login pass
sword for a
specific user acc
count. Select the
e desired accountt
at system login, th
hen:
figure 2-30
setting up sy
ystem login passw
word
1. Swipe fro
om right to display
y Charms bar.
2. Select Se
ettings.
3. Select Ch
hange PC Setting
gs.
4. Select Ac
ccounts.
5. Select Sig
gn in options.
6. Select Ad
dd password.
Next, set up fing
gerprint access:
figure 2-31
setting up fin
ngerprint access
1. Same path as setting up the system login
d, but for Step 6, choose Add unde
er
password
Fingerprint.
2. Log in us
sing your system login password.
3. Using firm
m pressure, tap/hold your finger (d
do
not swipe
e) to the sensor 8 times.
4. When 8 taps
have been successful
complete
ed, select Finish.
5. Optional, add another fing
gerprint (up to 12,
from a diffferent finger, diffferent hand, or
different user).
Sign out, sign bac
ck in (choose Fingerprint under Sign
in options) to confirm your fingerprrint access.
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w
wireless WA
AN and SIM card
A micro SIM card
d must be installed
d in the system to
o use the integratted LTE/3G WWA
AN connectivity. M
Micro SIM card not included with ssystem.
Contact your cellu
ular communications carrier for a micro
SIM card.
beta (DVT2 an
nd DVT3) syste
ems: enabling the WWAN ha
ardware
Due to safety and
d regulatory certiffication issues, all Beta (DVT2 and
d DVT3) systems are shipped withh WWAN hardwarre disabled. Follo
ow the steps
below if you choo
ose to enable the WWAN hardware
e.
RF ex
xposure: This en
ngineering sample system contain
ns a WWAN wirele
ess radio that tra nsmits RF energyy. The transmit
anten
nna structure mus
st be at least 20 cm
c from the user or nearby person
ns in all usage orrientations of the ssystem. The WW
WAN
transmit antenna struc
cture is located on the top right edge of the LCD dis
splay.
Note:
Steps to enable WWAN
hardware:
1.
Power system off (see standby
and syste
em shut down.)
LY press F2 to en
nter the system
2.
Power on, IMMEDIATEL
BIOS.
3.
Select Intel Advanced.
4.
Select PCH-IO Configurration.
on.
5.
Select USB Configuratio
onnector #2 and change
from Disa
able
6.
Select USB Physical Co
p to Enabled.
USB2 port
7.
Select USB Per-Connec
ctor Disable at top
p of list and change
nabled to Disable
ed.
from En
8.
Press F4
F to save setting
gs.
9.
Press Esc
E three times.
10. Select Continue to exit BIOS
setup.
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Steps to check
WWAN “Ennabled” status:
1.
Power system offf (see standby an
nd system shut d
down.)
Power on, IMME
EDIATELY press F2 to enter the syystem
2.
BIOS.
3.
Select Intel Advaanced.
Select PCH-IO C
Configuration.
4.
Select USB Connfiguration.
5.
ble at top of list an
nd change
Select USB Per--Connector Disab
6.
from Disabled too Enabled.
Select USB Phys
ysical Connector #
#2 and change fro
om Enabled
7.
to Disable USB22 port.
8.
Select F4 to savve settings.
9.
Press Esc three times.
10. Select Continue to exit BIOS setu
up.
DRAFT – CONFIDENTIAL
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31
installing the micro
SIM card
WARNING:
WARNING:
MAKE SUR
RE SYSTEM IS FUL
LLY POWERED OFF BEFORE INSER
RTING THE SIM C
CARD TRAY
INSERTING
G THE SIM CARD TRAY
INCORRECT
TLY CAN CAUSE DAMAGE TO THE
E SYSTEM.
TO INSERT CORRECTLY, MA
AKE SURE PIN HO
OLE IS LOCATED C
CLOSER TO DEBU
UG PORT.
Procedure for inserting micro SIM card (see figure 2-32):
wer the system co
ompletely off.
1.
Pow
2.
Con
nvert system to Laptop Mode and close the lid.
3. Turrn system upside down so system label is facing up
p.
4.
Inse
ert the end of a paper clip or a small pin into the pin
n hole to remove the card tray from
m the slot.
5.
Inse
ert card as shown
n in step 3 of figure 2-32.
6.
Inse
ert card with pin hole
to side of slo
ot closer to debug
g port.
7.
Turrn system on.
8.
Use
e the Windows ne
etwork device setttings application to configure wireless WAN netwo rk connectivity.
ffigure 2-32
th
in
nserting the micro
o SIM card
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u
using the RJ
J45 Gb Etherrnet LAN jac
ck
The RJ45
connector is
s delicate and ma
ay not always prrovide a secure network cable con
nnection. Handle
e the RJ45 connec
ctor
with care to avoid damage. Different network cables may
result in a more
secure conn
nection.
Note:
To use the LAN ja
ack:
1. Gently pre
ess in on the jack to pop it out.
2. Carefully lift up on the top bracket,
unfolding
g it
outward.
3. Plug in your cable.
shed, carefully remove cable, fold
4. When finis
bracket in,, and press back into system.
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figure 2-3
33
using the Ethernet LAN jacck
DRAFT – CONFIDENTIAL
May 2014
33
u
using the HD
DMI to VGA adapter
The HDMI to VGA
A adapter is used
d to connect the system
to a VGA monitor or projec
ctor.
To activate the display:
figure 2-34
VGA dispplay adapter
1. Connect the HDMI end of the adapter to the HDMI port
located on
o the right side of
o the system.
2. Connect the VGA end of the adapter to a VGA
display.
3. Press the
e Windows key (to
o the left of the Alt
A key) and the
“p” key to
o open the display
y pop up.
4. Choose a display option: extend,
duplicate or second
screen on
nly.
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sstandby and system shut down
ttable 2-1
standby
and shutd
down options
options
steps
using the Windows Charms bar
Using the touchscrreen swipe from the
e right edge of the display to access tthe Charms bar, tap
p ‘Settings’,
then tap ‘Power’ and select ‘Sleep’, ‘Shut down’ or ‘Resstart’.
using Ctrl + Alt + Delete on the keyboa
ard
Simultaneously pre
ess Ctrl/Alt/Delete keys to bring up thee log-out screen. T
Then tap the ‘Powe
er’ icon in
lower right corner and
a select ‘Sleep’, ‘Shut down’, or ‘Reestart’.
ffrom the login scree
en
From the login scre
een instead of ente
ering a password taap the ‘Power’ icon
n in lower right corn
ner and
select ‘Sleep’, ‘Shu
ut down’, or ‘Restarrt’.
using Alt + F4 on th
he keyboard
From the Windows
s desktop press Alt+F4 to launch the ‘‘Shut Down Window
ws’ menu; then sele
ect ‘Sign
out’, ‘Sleep’, ‘Shut down’, or ‘Restart’ from the drop-dow
wn list.
using the system po
ower button
Press and hold the
e system power buttton on the left sidee of the system for m
more than 2 seconds but less
than 10 seconds to
o launch the ‘Shut Down
Windows’ meenu; then select ‘Sign out’, ‘Sleep’, ‘Shut down’,
or ‘Restart’ from th
he drop-down list.
fforced shutdown (w
when system locks up)
Press and hold the
e system power buttton for more than 110 seconds to force
e an immediate sysstem shut
down. Use of this option
should be av
voided if possible; aany unsaved data w
will be lost.
waking from standby
To wake the syste
em from standby mode:


from clos
sed lid laptop mod
de simply open th
he system lid
from any other open lid orr tablet mode pres
ss the system pow
wer button
ccharging the
e battery
IIMPORTANT! Us
se only the bundle
ed power adapterr to charge the ba
attery pack and su
upply power to thhe system.
IInsert the bundled
d power adapter into the power po
ort to charge the battery
pack and supply power to tthe system. The two-color LED prrovides a
vvisual indication of
o the battery’s ch
harge status:
Solid Gre
een:
Solid Ora
ange:
Blinking Orange:
Lights Offf:
th
The Ultrabook
system is plugged in to a power source and
a the battery poower is 100%.
The Ultrabook
system is plugged in to a power source and
a the battery poower is between 0
0% and 100%.
The Ultrabook
system is running on the
e battery and the battery power is less than 10%.
The Ultrabook
system is running on the
e battery and the battery power is between 10% an
nd 100%.
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
35
u
using the debug port
This port is for de
ebug and validatio
on purposes for use
u by Intel and should not be necessary for normaal use and software development. Use of the
debug port requirres a dedicated de
ebug card not inc
cluded with the sy
ystem.
IInsert a small flat screwdriver into the slot on the ba
ack of the system
m to remove the debug port cover. Insert the debug card into the ope
en port.
§
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
36
3
technical
specifica
ations
ttable 3-1
system
features
feature
description
Form factor and weight


13.3”” 2-in-1 Convertible
e, ~3.4 lbs., z = 18.6
6 mm, compliant with
w 2014 Intel® Ultrrabook™ Definition
n Rev. 1.3
Full-s
size backlit keyboa
ard, 5 finger multi-to
ouch touchpad
Processor

5th Gen
G Intel® Core™ Processor
(Broadwe
ell-ULT dual core), 15 W TDP, internaal or PQS sample 2
2.0 GHz or greater base
frequ
uency (see Dear Cu
ustomer Letter inclu
uded with system fo
or more informationn)
Graphics

Intel HD Graphics (Gen
n5, GT2)
OS

Micro
osoft* Windows 8.1
1* supporting Instan
ntGo (Connected Standby)
Display

13.3””, 16:9, QHD (3200
0 x 1800), eDP with
h PSR, 5+-finger mu
ulti-touch with Activve Digitizer
Memory

8 GB
B LP-DDR3 operatin
ng at 1333 MHz (BGA)
Storage

180G
GB Intel Pro 2500 SSD
(“Temple Star””), M.2 (NGFF) mo
odule, SATA interfaace
Communications


Intel®
® Dual Band Wirele
ess-AC 7265 (“Ston
ne Peak”) 802.11ac
c 2x2 PCIe Wi-Fi w
w/BT 4.0 M.2 module
Designed to support Inttel “Maple Peak” 60
0 GHz 802.11ad WiGig + 2x2 802.11aac WLAN + Bluetoo
oth 4.0 M.2 module
e, PCIe / USB
k module not installled in system
interfface) – Maple Peak
NXP NPC100 (aka PN5
547) NFC (Near Fie
eld Communication
n) “Galapagos” moddule with antenna b
booster, NCI interfa
ace
FIH7
7160 4G LTE/3G WWAN
w/ GNSS (In
ntel XMM 7160 silicon), M.2 module, U
USB interface


Camera & Mics



2D 1080p user-facing camera
(SKU A) or Intel® RealSense 3D+
2D 1080p useer-facing camera (S
SKU B) with LED acctivity
indic
cator
8 MP
P world-facing came
era with flash
2x lid
d (2d Uf camera) orr 3x lid (SKU B) or and 2x base array digital microphoness
IO connectors

HDM
MI out (1.4b) , 2x US
SB 3.0 ports with USB
charging spec 1.2 support) SDXC
C card reader, micrroSIM, 3.5 mm com
mbo audio
jack, RJ45 Gigabit LAN
Connected standb
by


with Windows 8.1 Connec
cted Standby requirrements
Full compliance
S0ix-- and Intel® Powerr Optimizer-enabled
Sensors



ALS,, accelerometer, gy
yroscope, compass, NFC (for tap usag
ges), IR proximity, bbarometric pressurre
Finge
erprint sensor
GPS
S/GNSS (on WWAN
N), sensor fusion
Battery

50W
Whr, Lithium-ion, Sim
mplo* 2s2p arrange
ement
Power adapter

Delta
a ADP-45BE AA
th
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
Input : 100~240 V /1.3A , 50~60 Hz Output: 20 V / 2.225 A, 45 W
DRAFT – CONFIDENTIAL
May 2014
37
4
configur
ration an
nd troubleshootiing
entering the sy
ystem BIOS
1.
2.
3.
4.
5.
6.
Power sy
ystem off (see sta
andby and system
m shut down.)
Power on
n, IMMEDIATELY
Y press F2 to ente
er the system BIO
OS.
Configure
e settings as desiired.
Select F4
4 to save settings
s.
Press Esc until you return to main BIOS me
enu.
Select Co
ontinue to exit BIO
OS setup.
sselecting the system
boot de
evice
Press F7 during system
power on
n to select boot device or to boot to the EDK shell.
ssystem battery
y disconnect/co
onnect switch
IIf your system sto
ops responding or fails to boot, the
e system battery reset
switch
provides the electtrical equivalent of
o removing the battery
from the sy
ystem.
figure 4-1
system battery reset
To disconnect the
e battery from the
e system:
1. Insert a pin
p or paper clip as
a shown in Errorr! Reference sou
urce not
found.
2. Press in and
a release to dis
sconnect the batttery.
3. Wait a few
w seconds.
4. Repeat Step
2 to reconnect battery.
5. Power sy
ystem up as usua
al.
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
38
R
Real Time Clock (RTC) CMO
OS reset switch
The RTC provides constant powerr for storing custo
omized BIOS settings in the
ssystem CMOS region. To restore factory
default va
alues insert pin orr paper clip
into hole on side of system, press and release.
figure 4-2
RTC CM
MOS reset
§
th
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
39
5
REGULA
ATORY NOTICES
This
informatio
on should be ke
ept with the de
evice for future
e reference.
THIS SYSTEM
IS AN
N ENGINEERIING DEVELOP
PMENT DEVIC
CE. NOT OFF ERED FOR SA
ALE OR LEAS
SE.
This device is provided forr test, evaluatio
on, and demon
nstration purpo
oses only as pe
ermitted in you
ur region. This
s device
is de
esigned to meet or excee
ed internation
nal Safety, EMC, RF and E
Environmenttal standards
s.
SAFETY WA
ARNINGS AN
ND CAUTIO
ONS
1. Use only
y the power ada
apter provided with the device
e. Other powerr adapters may overheat or da
amage the device.
2. The batttery pack is no
ot user-servicea
able; the batterry[ies] in this device cannot be
e easily replace
ed by users
themse
elves’. Do not attempt
to remove the battery
y pack as dama
age to the devicce or battery pack may occur.
3. If the device
is damag
ged crushed or severely dropped, to ensure safe
and properr operation, retturn it to Intel ffor
servicin
ng.
4. If the device
is expose
ed to excessive temperatures the battery ma
ay fail. Do not e
expose the deviice to
environ
nments over 10
00 degrees C.
5. Do NOT drop the device
e in water, as the
device is no
ot waterproof. Operation and device failure m
may occur.
6. Caution
n should be exe
ercised during lo
ong exposure to
o excessive sou
und levels from
m earphones and
d headphones a
as this
can cau
use hearing loss
s.
7. This de
evice may conta
ain an Intel® RealSense™
3D Camera module that containss an integrated
d laser projector. The
camera
a complies with International Standard
EN/IE
EC 60825-1:200
07 edition 2 forr a Class 1 lase
er product. The
e camera
also complies with US
S FDA performance standards for laser products except for d
deviations purs
suant to Laser n
notice No.
007."
50, datted June 24, 20
Do not modify,
attempt to open or service the camera module with
hin this device iin any way. Mo
odification or se
ervice of
the camera
module
e might cause the emissions to
o exceed the Class 1 level. Do
o not activate tthis device if th
he camera
is da
amaged in any manner. Use of
o controls or ad
djustments or performance
off procedures otther than those
e specified
here
ein may result in
n hazardous radiation exposure.
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
40
E
EMC STATE
EMENTS
Federal Communications Commission
Regulatory Statement
This equ
uipment has been tested and found
to comply
y with the limitts for a Class B digital device, pursuant to Pa
art 15 of
the FCC Rules. These liimits are design
ned to provide reasonable pro
otection againstt harmful interfference in a residential
installation. This equipment generates
s, uses, and can radiate radio frequency ene
ergy and, if not installed and u
used in
structions, may
y cause harmful interference to radio commu
unications. How
wever, there is n
no
accordance with the ins
ee that interferrence will not oc
ccur in a particular installation
n. If this equipm
ment does caus
se harmful interrference
guarante
to radio or television re
eception, which
h can be determ
mined by turning
g the equipmen
nt off and on, the user is enco
ouraged to
try to co
orrect the interfference by one or more of the
e following measures:
• Reorient or relocate
the rec
ceiving antenna.
• Increase the separation bettween the equip
pment and rece
eiver.
• Connect the equipment into
o an outlet on a circuit differen
nt from that to which the rece
eiver is connected.
• Consult the dealer
or an experienced radio
o/TV technician for help.
Caution
n:
To assure continued FCC compliance operation is subje
ect to the follow
wing two condittions:
1)
1 This device may
not cause harmful
interference.
2)
2 This device must
accept any
y interference received,
includ
ding interferencce that may cau
use undesired o
operation.
Changes
or mod
difications not expressly
appro
oved by Intel Corporation coulld void the deve
eloper's authorrity to
operate
the equ
uipment.
This dev
vice complies with
the applicab
ble FCC rules.
FCC
ID: RMXWS
SBUB-SDS
FCC RF Exposure Statement
This equ
uipment complie
es with FCC RF
F exposure limitts set forth for an
a uncontrolled
d environment. This device and its
antenna
a must not be co
o-located or op
perating in conjunction with an
ny other antenn
na or transmitte
er. The most
th
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
41
conserva
ative SAR meas
sured was 1.49
9W/kg which is below the FCC limit of 1.6W/k
kg. Usage of the device should be in
accordance with the Us
ser Guide and the
content of the
FCC applica
ation.
CE Mark
This dev
vice can be operated in EU without restriction
ns indoors. Intel Corporation hereby declare
es that this Ultra
abook is in
complian
nce with the es
ssential requirem
ments and othe
er relevant prov
visions and Dire
ective 1999/5//EC – Radio and
Telecom
mmunications Te
erminal Equipm
ment, 2004/108
8/EC – EMC, 20
011/65/EU - Ro
oHS, 2012/19/E
EU - WEEE, 200
09/125/EU
– Ecodesign and 2006//95/EC – Low Voltage.
IIndustry Cana
ada (IC) Notice
This dev
vice complies with
Industry Ca
anada license-exempt RSS sta
andard(s). Ope
eration is subjec
ct to the following two
conditions:
1)
1 this device may
not cause in
nterference,
2)
2 this device must
accept any
y interference, including
interfference that ma
ay cause undesired operation of the
device.
Changes
or mod
difications not expressly
appro
oved by Intel Corporation coulld void the deve
eloper's authorrity to
operate
the equ
uipment.
This equ
uipment complie
es with Industrry Canada radia
ation exposure limits set forth for an uncontrrolled environm
ment. The
most conservative SAR
R measured was
s 1.49W/kg. Usage
of the de
evice should be
e in accordance with the User Guide
and the content of the IC application.
IC:1000V-WSBU
UBSDS
Français
s - Canada
Cet
C appareil estt conforme avec
c le licence-exe
empt standard RSS(s) d'Indusstrie Canada. L
L’utilisation de c
ce
dispositif
est au
utorisée seulement aux deux conditions
suiva
antes : (1) il ne
e doit pas produ
uire de brouillage, et (2)
l’’utilisateur du dispositif
doit être prêt à accepter tout brouilllage radioélecttrique reçu, mê
ême si ce brouilllage est
susceptible
de compromettre
le fonctionneme
ent du dispositiif.
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
42
Cet
C équipementt est conforme Industrie Canada limites d'exposition aux ra
ayonnements dé
éfinies pour un
environnement
non contrôlé. Le
L SAR la plus conservatrice
mesurée
était d
de 1.49W/kg. L
L'utilisation de
l''appareil doit êttre en conformité avec le Guid
de de l'utilisateur et le conten u de la demand
de d'Industrie
Canada.
Wireless (RF) Interface
This
developme
ent device includ
des a wireless (Radio Frequen
ncy, RF) transm
mitter. Operatio
on of the transm
mitter may
be
b restricted or prohibited by regional
or natiional regulation
ns; a license forr development//experimental u
use may
be
b required.
This
device may
y contain a Wire
eless Wide Area
a Network (WW
WAN) data card . Operation of WWAN requires
s the
in
nstallation of a SIM card (or other
network access
means) which
must be obtained from a licensed netw
work
service
providerr (carrier) for your
location. Authorization
to
o operate a dev
velopment device on a live nettwork
requires
the exp
plicit approval of
o a network se
ervice provider (carrier).
Français
– Can
nada Cet apparreil est conform
me avec Industrrie Canada RSS
S standard exem
mpts de licence
e (s). Son
utilisation
est so
oumise à Les deux conditions suivantes: (1) cet appareil ne
e peut pas prov
voquer d'interfé
érences et
(2) cet appareil doit accepter Toute
interféren
nce, y compris les interférencces qui peuventt causer un mau
uvais
fonctionnementt du dispositif.
ECOLOGY STATEMENT
TS
Recyclab
ble: Do not dis
spose of this de
evice in unsorte
ed municipal wa
aste. Recycle p
properly to ensu
ure safe and proper
protectio
on of the enviro
onment. This de
evice contains certain
recyclab
ble componentss. At the end o
of developmentt use,
return th
he device to Inttel for recycling
g, or recycle in a manner acce
eptable to your local authoritie
es. Refer to loc
cal
environm
mental regulations for proper recycling.
Lithium Battery Pack: Except to recycle, do not atte
empt to remove
e the battery pa
ack as damage to the device o
or battery
pack ma
ay occur. The battery[ies]
in this
device cann
not be easily replaced by userss themselves’.
Perchlorrate Material: Lithium
(Coin Cell) Battery con
ntains Perchlora
ate material — special handlin
ng may apply. See
www.dts
sc.ca.gov/hazardouswaste/perchlorate. This notice is required by Californ ia Code of Regu
ulations, Title 2
22,
th
ased SDS
Intel® 5 Generation Core™ Processor-ba
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
43
Division 4.5, Chapter 33:
3 Best Management Practice
es for Perchloratte Materials. Th
his device inclu
udes a battery w
which
contains
s Perchlorate material.
Power Efficiency (as sh
hipped) Default Settings (Wind
dows 8.1 installled):
Balanced
Powerr Plan:


Put Computer
to Sle
eep (On Battery
y): 4 minutes.
Put Computer
to Sle
eep (Plugged In
n): 10 minutes.
Hibernate:
Critical Battery Action when Critic
cal Battery Leve
el reaches 2%.
§
th
Intel® 5 Generation Core™ Processor-ba
ased SDS
USER MANUAL (Rev
v 0.93)
DRAFT – CONFIDENTIAL
May 2014
44

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