Johnson Controls MAPWIFI WRZ Radio Module User Manual JCI x

Johnson Controls Inc WRZ Radio Module JCI x

User Manual

TRANSCEIVER MODULE
USER MANUAL
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Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth,
Bluetooth Low Energy (BLE), and ANT
FEATURES
IEEE 802.11b,g,n,d,e,i compliant
Typical WLAN Transmit Power:
o 20.0dBm, 11 Mbps,CCK (b)
o 14.5dBm, 54 Mbps,OFDM (g)
o 12.5dBm, 65 Mbps,OFDM (n)
Typical WLAN Sensitivity:
o -89dBm, 8% PER, 11 Mbps
o -76dBm, 10% PER, 54 Mbps
o -73dBm, 10% PER, 65 Mbps
Bluetooth 2.1+EDR, Power Class 1.5
Full support for BLE 4.0 and ANT
Miniature footprint: 18 mm x 13 mm
Low height profile: 1.9 mm
U.FL connector for external antenna
Terminal for PCB/Chip antenna feeds
Integrated band-pass filter
Compact design based on Texas
Instruments WL1271L
Transceiver
Seamless integration with TI OMAP™
application
processors
SDIO Host data path interfaces
Bluetooth Advanced Audio Interfaces
Low power operation mode
RoHS compliant
DESCRIPTION
The module is a high performance
2.4 GHz IEEE 802.11 b/g/n, Bluetooth
2.1+EDR, and Bluetooth Low Energy (BLE) 4.0
radio in a cost effective, pre-certified footprint.
The module realizes the necessary PHY/MAC
layers to support WLAN applications in
conjunction with a host processor over a SDIO
interface.
The module also provides a Bluetooth platform
through the HCI transport layer. Both WLAN
and Bluetooth share the same antenna port.
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TIWI-BLECA MODULE FOOTPRINT AND PIN DEFINITIONS
To apply the module, it is important to use the module pins in your application as they are designated in
below and in the corresponding pin definition table found on pages 3 and 4. Not all the pins on the
module may be used, as some are reserved for future functionality.
Figure 2 Pinout (Top View)
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PIN DESCRIPTIONS
ModulePin
Name
I/O
Type
Buffer
Type
Logic
Level
Description
1
VBAT
PI
-
-
Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC)
2
BT_FUNC5 DO 4 mA 1.8 VDC HOST_WU (*)
3
WL_UART_DBG DIO 4 mA 1.8 VDC WL_UART_DBG
4
WLAN_IRQ DO 4 mA 1.8 VDC WLAN Interrupt Request
5
BT_EN
DI
-
1.8 VDC Bluetooth Enable
6
FM_EN
DI
-
1.8 VDC NOT SUPPORTED, CONNECT TO GND
7
WL_RS232_RX
DI
-
1.8 VDC WLAN TEST UART RX (*)
8
WL_RS232_TX DO 4 mA 1.8 VDC WLAN TEST UART TX (*)
9
FM_I2S_FSYNC DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
10
WL_EN
DI
-
1.8 VDC WLAN Enable
11
VIO
PI
-
-
POWER SUPPLY FOR 1.8 VDC DIGITAL
DOMAIN
12
GND
GND
-
-
Ground
13
SDIO_D3 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP
14
SDIO_D2 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP
15
SDIO_D1 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP
16
SDIO_D0 DIO 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP
17
SDIO_CMD DIO 8 mA 1.8 VDC HOST PULL UP
18
SDIO_CLK
DI
-
1.8 VDC HOST PULL UP
19
SLOW_CLK
DI
-
1.8 VDC SLEEP CLOCK (32 kHz)
20
FM_IRQ
DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
21
FM_SDA DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
22
FM_SCL
DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
23
FM_I2S_CLK DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
24
FM_I2S_DI
DI
4 mA 1.8 VDC NOT SUPPORTED, CONNECT TO GND
25
FM_I2S_DO DO 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
26
FM_AUD_RIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
27
FM_AUD_LIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
28
FMRFOUT AO
-
-
NOT SUPPORTED, NO CONNECT
29
FMRFIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
30
GND
GND
-
-
Ground
31
FM_AUD_ROUT AO
-
-
NOT SUPPORTED, NO CONNECT
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ModulePin
Name
I/O
Type
Buffer
Type
Logic
Level
Description
32
FM_AUD_LOUT AO
-
-
NOT SUPPORTED, NO CONNECT
33
AUD_FSYNC DIO 4 mA 1.8 VDC PCM I/F
34
HCI_RX
DI
8 mA 1.8 VDC Bluetooth HCI UART RX (*)
35
HCI_RTS DO 4 mA 1.8 VDC Bluetooth HCI UART RTS (*)
36
HCI_TX
DIO 8 mA 1.8 VDC Bluetooth HCI UART TX
37
AUD_CLK DO 4 mA 1.8 VDC PCM I/F (*)
38
AUD_OUT DO 4 mA 1.8 VDC PCM I/F (*)
39
HCI_CTS
DI
4 mA 1.8 VDC Bluetooth HCI UART CTS (*)
40
AUD_IN
DI
4 mA 1.8 VDC PCM I/F (*)
41
BT_FUNC2
DI
4 mA 1.8 VDC Bluetooth Wakeup[DI] / DC2DC mode[DO](*)
42
BT_FUNC4 DO 4 mA 1.8 VDC BT_UARTD (DEBUG) (*)
43
VDD_LDO_CLASS_1P5 NC
-
-
VBAT VOLTAGE PRESENT, NO CONNECT
44
GND
GND
-
-
Ground
45
GND
GND
-
-
Ground
46
GND
GND
-
-
Ground
47
GND
GND
-
-
Ground
48
ANT
RF
-
Antenna terminal for WLAN and Bluetooth (Note
[1])
49
GND
GND
-
-
Ground
50
GND
GND
-
-
Ground
51
GND
GND
-
-
Ground
52
GND
GND
-
-
Ground
PI = Power Input PO = Power Output DI = Digital Input (1.8 VDC Logic Level) DO=Digital Output (1.8 VDC Logic Level)
AI = Analog Input AO = Analog Output AIO = Analog Input/Output RF = RF Port GND = Ground
Note[1]: Antenna terminal presents d.c. short circuit to ground.
(*) indicates that pin is capable of bidirectional operation, but is used as the type shown.
Table 1 Module Pin Descriptions
All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V
logic, then level shifters MUST be used.
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ELECTRICAL SPECIFICATIONS
The majority of these characteristics are based on controlling and conditioning the tests using the
control software application. Other control conditions may require these values to be re- characterized
by the customer.
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Power supply voltage (VBAT)(4)(5)
-0.5
+5.5
V
Digital supply voltage (VIO)
-0.5
2.1
V
Voltage on any GPIO
-0.5
VIO + 0.5
V
Voltage on any Analog Pins(3)
-0.5
2.1
V
RF input power, antenna port
+10
dBm
Operating temperature(6)
-40
+85
ºC
Storage temperature
-55
+125
ºC
1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device and are not
covered by the warranty. These are stress ratings only and functional operation of the device at these or any other
conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
2. All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V,
VDD_LDO_CLASS1P5=3.6V
3. Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM,
FMRFINM, FMAUDLIN, FMAUDRIN, FMAUDLOUT, FMAUDROUT
4. The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is
used).
5. Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative.
6. The device can be reliably operated for 5,000 active-WLAN cumulative hours at TA of 85oC.
Table 2 Absolute Maximum
Ratings
Recommended Operating Conditions
Parameter
Min
Typ
Max
Unit
VBAT
3.0
3.6
4.8
V
VIO
1.62
1.8
1.92
V
VIH 0.65 x VIO
-
VIO
V
VIL
0
-
0.35 x VIO
V
VOH @ 4, 8 mA VIO - 0.45
-
VIO
V
VOL @ 4, 8 mA
0
-
0.45
V
Ambient temperature range
-40
25
85
ºC
Table 3 Recommended Operating Conditions
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General Characteristics
Parameter
Min
Typ
Max
Unit
WLAN RF frequency range
2412
2472
MHz
WLAN RF data rate
1
802.11
b/g/n
rates
supported
65
Mbps
BT RF frequency Range
2402
2480
MHz
Table 4 General
Characteristics
Power Consumption - WLAN
Parameter
Test Conditions Min
Typ
Max
Unit
CCK (802.11b)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=20dBm, 11 Mbps CCK
L=1200 bytes, tdelay (idle)=4 S
-
280
-
mA
OFDM (802.11g)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=14.5 dBm, 54 Mbps OFDM
L=1200 bytes, tdelay (idle)=4S
-
185
-
mA
OFDM (802.11n)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=12.5dBm, 65 Mbps OFDM
L=1200 bytes, tdelay (idle)=4S
-
165
-
mA
CCK (802.11b)
RX Current
-
100
-
mA
OFDM (802.11g)
RX Current
-
100
-
mA
OFDM (802.11n)
RX Current
-
100
-
mA
Dynamic Mode [1]
-
<1.2
-
mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon
reception in Listen Mode.
Table 5 WLAN Power
Consumption
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Power Consumption - Bluetooth
Parameter
Test Conditions Min
Typ
Max
Unit
GFSK TX Current Constant Transmit, DH5, PRBS9
-
45
-
mA
EDR TX Current Constant Transmit, 2DH5,3DH5,
PRBS9
-
43
-
mA
GFSK RX Current Constant Receive, DH1
-
35
-
mA
EDR RX Current Constant Receive, 2DH5, 3DH5
-
41
-
mA
Deep Sleep Current Deep Sleep Mode
-
70
-
µA
Table 6 Bluetooth Power Consumption
DC Characteristics – General Purpose I/O
Pa
r
amete
r
Test Conditions
Min
T
y
p
Max
Unit
VIO Current 
-
16
mA
Logic input low, VIL
0
-
0.35 x VIO
V
Logic input high, VIH 0.65 x VIO
-
VIO
V
Logic output low, VOL
(Full Drive)
Iout = 8 mA
0
-
0.45
V
Iout = 4 mA
0
-
0.45
V
Logic output low, VOL
(Reduced Drive)
Iout = 1 mA
0
-
0.112
V
Iout = 0.09 mA
0
-
0.01
V
Logic output high, VOH
(Full Drive)
Iout = -8 mA VIO - 0.45
-
VIO
V
Iout = -4 mA VIO - 0.45
-
VIO
V
Logic output high, VOH
(Reduced Drive)
Iout = -1 mA VIO - 0.112
-
VIO
V
Iout = -0.3 mA VIO - 0.033
-
VIO
V
Table 7 DC Characteristics General Purpose I/O
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WLAN RF Characteristics
WLAN Transmitter Characteristics
(TA=25°C, VBAT=3.6 V)
Parameter
Test Conditions Min Typ
Max Unit
11 Mbps CCK (802.11b)
TX Output Power
11 Mbps CCK , 802.11(b)
Mask
Compliance, 35%
EVM
RMS power over TX
packet
-
20
-
dBm
9 Mbps OFDM (802.11g)
TX Output Power
9 Mbps OFDM , 802.11(g)
Mask
Compliance, -8 dB
EVM
RMS power over TX
packet
-
19
-
dBm
54 Mbps OFDM (802.11g)
TX Output Power
54 Mbps OFDM, 802.11(g)
Mask
Compliance, -25 dB
EVM
RMS power over TX
packet
-
14.5
-
dBm
6.5 Mbps OFDM (802.11n)
TX Output Power
6.5 Mbps OFDM, 802.11(n)
Mask
Compliance, -5 dB
EVM
RMS power over TX packet
-
19
-
dBm
65 Mbps OFDM (802.11n)
TX Output Power
65 Mbps OFDM, 802.11(n)
Mask
Compliance, -28 dB
EVM
RMS power over TX packet
-
12.5
-
dBm
Table 8 WLAN Transmitter RF Characteristics
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WLAN Receiver Characteristics
(TA=25°C, VBAT=3.6 V) [1]
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps CCK (802.11b)
RX Sensitivity
8% PER
-
-97
-
dBm
11 Mbps CCK (802.11b)
RX Sensitivity
8% PER
-
-89
-
dBm
9 Mbps OFDM (802.11g)
RX Sensitivity
10% PER
-
-90
-
dBm
54 Mbps OFDM (802.11g)
RX Sensitivity
10% PER
-
-76
-
dBm
6.5 Mbps OFDM (802.11n)
RX Sensitivity
10% PER
-
-91
-
dBm
65 Mbps OFDM (802.11n)
RX Sensitivity
10% PER
-
-73
--
dBm
11 Mbps CCK (802.11b)
RX Overload Level
8% PER
-
-
-10
dBm
6 Mbps OFDM (802.11g)
RX Overload Level
10% PER
-
-
-20
dBm
54 Mbps OFDM (802.11g)
RX Overload Level.
10% PER
-
-
-20
dBm
65 Mbps OFDM (802.11n)
RX Overload Level
10% PER
-
-
-20
dBm
[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes.
Table 9 WLAN Receiver RF
Characteristics
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Bluetooth RF Characteristics
Bluetooth Transmitter GFSK Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min Typ Max Bluetooth Spec Unit
GFSK RF Output Power
-
9.5
-
-
dBm
EDR RF Output Power
-
7
-
dBm
Power Control Step Size
2
4
8
2-8
dB
EDR Relative Power
-2
1
-4/+1
dB
Table 10 Bluetooth Transmitter RF Characteristics
Bluetooth Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min Typ Max Bluetooth Spec Unit
GFSK Sensitivity BER=0.1%
-
-92
-
-70
dBm
EDR 2 Mbps Sensitivity BER=0.01%
-
-91
-
-70
dBm
EDR 3 Mbps Sensitivity BER=0.01%
-
-82
-
-70
dBm
GFSK Maximum Input Level BER=0.1%
-
-5
-
-20
dBm
EDR 2 Maximum Input Level BER=0.1%
-
-10
-
-
dBm
EDR 3 Maximum Input Level BER=0.1%
-
-10
-
-
-
Table 11 Bluetooth Receiver RF Characteristics
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Bluetooth Low Energy RF Characteristics
Bluetooth BLE Transmitter GMSK and EDR Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min Typ Max BT Spec Unit
GMSK RF Output Power
-
10
-
-
dBm
Power Control Step Size
2
4
8
2-8
dB
(1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS
command.
Table 12 Bluetooth Low Energy Transmitter RF Characteristics
Bluetooth BLE Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min Typ Max BT Spec Unit
GMSK Sensitivity PER = 30.8%
-
-92
-
-70
dBm
GMSK Maximum Input Level PER = 30.8%
-
-5
-
-20
dBm
Table 13 Bluetooth Low Energy Receiver RF Characteristics
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WLAN POWER-UP SEQUENCE
The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the
Bluetooth and FM cores are disabled.
Figure 3 Power-up Sequence
Requirements
1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'failsafe’.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can
tolerate external voltages with no VDDS and DC2DC".
2. VBAT, VIO, and SLOWCLK must be available before WL_EN.
3. Twakeup = T1 + T2
The duration of T1 is defined as the time from WL_EN=high until Fref is valid for the SoC. T1=~55ms
The duration of T2 depends on:
Operating system
– Host enumeration for the SDIO/WSPI
– PLL configuration
– Firmware download
– Releasing the core from reset
– Firmware initialization
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WLAN POWER-DOWN SEQUENCE
Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 4 Module Power-down Sequence
Requirements
1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working
(e.g
BT) it will stay
high.
2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and
using the FREF (e.g BT) it will stay high.
3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64sec
before it is re-asserted.
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BLUETOOTH POWER-UP SEQUENCE
The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled;
the WLAN core is disabled.
Notes:
1. (A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown
2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only
Figure 5 Bluetooth Power-up Sequence
Power up requirements:
1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can
tolerate external voltages with no VDDS and DC2DC.
2. VDDS and SLOWCLK must be stable before releasing BT_EN.
3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.
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BLUETOOTH POWER-DOWN SEQUENCE
Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 6 Bluetooth Power-down Sequence
The module indicates completion of Bluetooth power up sequence by asserting HCI_RTS
low. This occurs up to 100 ms after BT_EN goes high.
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ENABLE SCHEME
The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2
modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be
grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI
commands.
1. Each core is operated independently by asserting each EN signal to Logic '1'. In this mode it is possible to
control each core asynchronously and independently.
2. Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of
Bluetooth.
IRQ OPERATION
1. The default state of the WLAN_IRQ prior to firmware initialization is 0.
2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes
its state to 1.
3. A WLAN firmware interrupt is handled as follows:
a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the
WLAN_IRQ line (host must be configured as active-low or falling-edge
detect).
b. After the host is available, depending on the interrupt priority and other host tasks, it masks the
firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line).
c. The host reads the internal register status to determine the interrupt sources - the register is
cleared after the read.
d. The host processes in sequence all the interrupts read from this register
e. The host unmasks the firmware interrupts.
4. The host is ready to receive another interrupt from the WLAN device.
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SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS
The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital
signal in the range of VIO only. For slow clock frequency and accuracy refer to Table 14. The external slow clock
must be stable before the system exits from shut down mode.
Parameter [1]
Condition Symbol
Min
Typ
Max Unit
Input slow clock frequency 32768
Hz
Input slow clock accuracy WLAN, BT  +/-250 ppm
Input transition time Tr/Tf – 10% to 90% Tr/Tf 
100
ns
Frequency input duty cycle 
30
50
70
%
Input voltage limits Square wave,
DC coupled
VIH
0.65 x VDDS
VDDS Vpeak
VIL
0
0.35 x VDDS 
Input impedance 
1
 MW
Input capacitance 
5
pF
Rise and fall time 
100
ns
Phase noise 1 kHz  -125 dBc/Hz
[1] Slow clock is a fail safe input
Table 14 Slow Clock Source Requirements
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BLUETOOTH HCI UART
Figure 7 Bluetooth UART Timing
Table 15 Bluetooth UART Timing
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Figure 8 Bluetooth UART Data Frame
Table 16 Bluetooth UART Data Frame
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SDIO INTERFACE TIMING
Table 17 SDIO Interface Read (see Figure
9)
Figure 9 SDIO Single Block
Read
Table 18 SDIO Interface Write (see Figure
10)
Figure 10 SDIO Single Block
Write
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SDIO CLOCK TIMING
Table 19 SDIO Clock Timing
Figure 11 SDIO Clock Timing
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SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
Figure 12 Reflow
Profile
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CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Never attempt a rework on the
module itself, e.g. replacing
individual components. Such actions
will terminate warranty coverage.
HANDLING, AND STORAGE Shipping
Handling
The modules contain a highly sensitive
electronic circuitry. Handling without proper
ESD protection may destroy or damage the
module permanently. ESD protection may
destroy or damage the module permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
Storage
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
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Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
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AGENCY CERTIFICATIONS
FCC ID: OEJ-MAPWIFI, 15.247.
IC: 279A-MAPWIFI, RSS 210
MODEL: 25-2934-4
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
FCC CAUTION: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
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Industry Canada Statements
This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to
the following two conditions: (1) this device may not cause interference, and (2) this device must accept
any interference, including interference that may cause undesired operation of the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for
successful communication.
This device has been designed to operate with the antenna(s) listed below, and having a maximum
gain of 1.3dBi (Johnason Chip). Antennas not included in this list or having a gain greater than 1.3 dBi
are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1)
Johanson 2450AT43B100 chip
antenna.
Cet appareil est conforme aux normes d'Industrie Canada exempts de licence RSS (s).
L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer
d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui
peuvent causer un mauvais fonctionnement de l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre
choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle
permise pour une communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximal de
1.3dBi (Johnason Chip). Antennes pas inclus dans cette liste ou présentant un gain supérieur à 1,3 dBi
sont strictement interdits pour une utilisation avec cet appareil. L'impédance d'antenne requise est de
50 ohms.
Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur
1)
Antenne Johanson puce
2450AT43B100.
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OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA
REGULATIONS
The Module has been certified for integration into products only by OEM integrators under the following
conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required. However,
the OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed (for example, digital device emissions, PC peripheral
requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain
configurations or co-location with another transmitter), then the FCC and Industry
Canada authorizations are no longer considered valid and the FCC ID and IC Certification
Number cannot be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC and Industry Canada authorization.
Le module de a été certifié pour l'intégration dans des produits uniquement par des intégrateurs
OEM dans les conditions suivantes:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité
avec la FCC et de l'Industrie Canada, multi-émetteur procédures produit.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne
seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour
toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les
émissions appareil numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour
certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et
Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC
et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
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OEM LABELING REQUIREMENTS FOR END-PRODUCT
The module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification
numbers are not visible when the module is installed inside another device, as such the end device into
which the module is installed must display a label referring to the enclosed module.
The final end product must be labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: OEJ-MAPWIFI”
“Contains Transmitter Module IC: 279A-MAPWIFI”
or
Contains FCC ID: OEJ-MAPWIFI”
“Contains IC: 279A-MAPWIFI”
The OEM of the Module must only use the approved antenna(s) listed above, which have been certified
with this module.
Le module de est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la
FCC et IC numéros de certification ne sont pas visibles lorsque le module
est installé à l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est
installé doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être
étiqueté dans un endroit visible par le suivant:
“Contient Module émetteur FCC ID: OEJ-MAPWIFI"
“Contient Module émetteur IC: 279A-MAPWIFI"
ou
“Contient FCC ID: OEJ-MAPWIFI"
“Contient IC: 279A-MAPWIFI"
L’OEM du module ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec
ce module.
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OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not provide information to the end user regarding how to install or remove
this RF module or change RF related parameters in the user manual of the end product.
The user manual for the end product must include the following information in a prominent
location:
This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures.
Other user manual statements may apply.
L'intégrateur OEM ne devrait pas fournir des informations à l'utilisateur final en ce qui concerne la façon
d'installer ou de retirer ce module RF ou modifier les paramètres RF connexes dans le manuel
utilisateur du produit final.
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans
unendroit bien en vue:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en
conformité avec FCC et Industrie Canada, multi-émetteur procédures produit.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.

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