LG Electronics USA 9QK-CX8753PB JukeBlox Networked Media Module User Manual
LG Electronics USA JukeBlox Networked Media Module
user manual
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Index ......................................................................................................................................................... 2
Revision History ....................................................................................................................................... 4
.................................................................................................................... 5
1 Introduction ...................................................................................................................................... 5
2 Block Diagram .................................................................................................................................. 5
3 Board Pictures................................................................................................................................... 6
3.1 Top View of CX Module ........................................................................................................ 6
3.2 Bottom View of CX Module .................................................................................................. 6
3.3 Production Module with Top and RF shields in place – Top View ........................................ 7
3.4 Production Module with 64-pin Connector Option – Side View ........................................... 7
3.5 Example Production Module Showing Soldered RF Shield .................................................. 8
3.6 Production Module with Bottom Shield (Part Numbers with a “B” after the configuration
letter) 9
4 Ordering Guide ............................................................................................................................... 10
4.1 Part Number Syntax ............................................................................................................. 10
5 Electrical Specifications ................................................................................................................. 11
5.1 Absolute Maximum Ratings................................................................................................. 12
5.2 Operating Conditions ........................................................................................................... 12
5.3 WiFi Specification (CX875 only) ........................................................................................ 13
6 Regulatory Compliance and Quality .............................................................................................. 14
6.0.1 Antenna Considerations ............................................................................................................. 14
6.0.2 CX Power Settings Used For Modular Approval ...................................................................... 15
6.1 RoHS .................................................................................................................................... 15
6.2 Environmental Test ............................................................................................................... 15
6.3 ESD and Transient Test (Applies to LAN and USB external connections only) ................. 15
6.4 Magnetic Field Test .............................................................................................................. 16
6.5 MTBF ................................................................................................................................... 16
6.6 Mechanical Specifications .................................................................................................... 16
6.7 Module Quality .................................................................................................................... 16
7 Board Dimensions and Weight ....................................................................................................... 17
7.1 Top & Bottom View of CX875 Module without Bottom Shield ......................................... 17
7.1.1 Top & Bottom View of CX Module with Bottom Shield .................................................. 17
7.2 Side View of CX875 module without Bottom Shield .......................................................... 18
7.2.1 Side View of CX Module with Bottom Shield .................................................................. 18
7.3 3D View of CX875 Module without Bottom Shield ............................................................ 19
7.4 Module Weight ..................................................................................................................... 19
8 Connectors and Connections .......................................................................................................... 19
8.1 WLAN UFL Antenna Connector (optional) ......................................................................... 19
8.2 Module Connectors .............................................................................................................. 20
8.2.1 Pin Descriptions ................................................................................................................ 21
8.2.2 Connector PIN Assignments ............................................................................................. 26
8.2.3 GPIO Assignments ............................................................................................................ 28
9 Application Guidelines ................................................................................................................... 28
9.1 Power Supply sequencing and Reset Timing ....................................................................... 28
9.1.1 Power up, Reset and Power Down Timing ....................................................................... 29
9.2 RF Considerations ................................................................................................................ 29
10 Revision Control .......................................................................................................................... 30
........................................................................................................................... 38
................................................................................................................... 50
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...................................................................................................................... 70
To be Discussed .............................................................................................................................. 70
1. FCC ...................................................................................................................................... 70
2. IC .......................................................................................................................................... 70
3. CE ......................................................................................................................................... 70
4. Japan Telecfication ............................................................................................................... 70
.......................................................................................................... 71
................................................................................................................ 77
.................................................................................................................................... 84
........................................................................................................................ 86
1.Label ............................................................................................................................................ 86
1.1 Certificate Label ................................................................................................................ 86
1.2 Carton Label ...................................................................................................................... 87
1.3 MAC ID Label .............................................................................................................................. 88
2. Packing Instruction ..................................................................................................................... 89
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Part1. Module Spec Sheet
Ethernet
Transceiver
256 Mbit
SDRAM
RJ-45
+
Transformer
NAND-Flash
2.4 GHz RF
transceiver
USB
Type-A
UART
GPIO
RF Amp. ANT
switch
PWM DAC
NOR-Flash
Apple Co-
processor
I2C
JTAG
3x6bit RGB
Display
4/8bit MMC
SD-Card
Reset In
Video Out
Audio I/O
A/D, D/A
S/PDIF
CCIR-656
SPI Ctrl.
Host
Controller/
LCD setup
Note:
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3.1 Top View of CX Module
3.2 Bottom View of CX Module
SDRAM
802.11b/g
front-end
Ethernet PHY SMSC processor
External Antenna
Connectors
PCB antenna
PCB antenna
LCD connector
Low density
connector
FLASH
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3.3
Production Module with Top and RF shields in place – Top View
3.4 Production Module with 64-pin Connector Option – Side View
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3.5 Example Production Module Showing Soldered RF
Shield
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3.6
Production Module with Bottom Shield (Part Numbers with a “B”
after the configuration letter)
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Note:
Note:
Status code:
4.1 Part Number Syntax
Part Number Status SMSC ICs
+
CX870-3A
CX870-3B
CX870-3D
CX870-3DS
CX870-3F
CX870-3G
CX870-3H
CX870-3I
CX870-3J
CX870-3K
CX870-3BB
CX870-3HB
CX870-3IB
CX870-3JB
CX870-3KB
CX780-3LB
CX870-3MB
CX875-3PB
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Paramete
r
State Model Voltage Symbol min. typ. max. Units
Note:
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5.1 Absolute Maximum Ratings
Parameter Component Min Max Units
3.3V Supply Voltage
Main
-0.5 4.6 V
1.2V Supply Voltage -0.5 1.8 V
1.9V Supply Voltage -0.5 2.2 V
Logic Input Voltage -0.5 6 V
Logic Output Voltage -0.5 4.6 V
5.2 Operating Conditions
Paramete
r
Min Max Units
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5.3 WiFi Specification (CX875 only)
Feature Description
Note:
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Description Countr
y
Compliance Module Versions Passed
6.0.1 Antenna Considerations
Cfg Code Ant. Type Ant. Gain (dBi) Ant. Model Name
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5P A 2.76
69
394
395
Notes about antenna changes:
6.0.2 CX Power Settings Used For Modular Approval
6.1
RoHS
6.2 Environmental Test
6.3 ESD and Transient Test (Applies to LAN and USB
external connections only)
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6.4 Magnetic Field Test
6.5 MTBF
6.6 Mechanical Specifications
6.7 Module Quality
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7.1 Top & Bottom View of CX875 Module without
Bottom Shield
7.1.1 Top & Bottom View of CX Module with Bottom Shield
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7.2
Side View of CX875 module without Bottom Shield
7.2.1 Side View of CX Module with Bottom Shield
Note:
millimetres
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7.3 3D View of CX875 Module without Bottom Shield
Note:
7.4
Module Weight
Note:
8.1 WLAN UFL Antenna Connector (optional)
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8.2 Module Connectors
Connecto
r
Number
Connector
Purpose
Connecto
r
Type
Number
of Pins
Pin
Configuration
Mating Connector Part Numbers
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8.2.1 Pin Descriptions
Signal(s) Type Description
POWER
SPI
UART
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AUDIO
CONTROL
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ETHERNET
USB
JTAG
SSM
VIDEO
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GPIO (not already
mentioned elsewhere
in this table)
MII
LCD
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Notes:
BridgeCo_JB2x - DeviceControlProtocol_Registers_v_2_1.pdf
DM870A DS rev. 1.3_12-15-11.pdf
DM870A DS rev. 1.3_12-15-11.pdf
CX Module Ethernet (RJ45 + Ext.Magnetics)_V1.2.pdf
CX Module USB_V1.2.pdf
A EVMCE2-4_schematic.pdf
A EVMCE2-4_schematic.pdf
A EVMCE2-4_schematic.pdf
Download
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8.2.2 Connector PIN Assignments
J2 – Media Connector
Function GPIO IC PIN Signal Signal IC PIN GPIO Function
NCS3 GPIO-17 BIST activate
PDOUT0 GPIO-04 Factory reset
VCO0 GPIO-05 IR input
AV3CLK GPIO-12 ETH NRESET
USB
Video Output
Ethernet
USB
Video Output
Ethernet
PIN Number
SPI
Debug UART
JTAG
SPI
Note:
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J1 – LCD Connector
Function GPIO IC PIN Signal Signal IC PIN GPIO Function
12
34
56
78
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
PIN Number
LCD Interface
LCD Interface
LCD Interface
LCD Interface
Note:
J3 – Low Density Connector
Function GPIO IC PIN Signal Signal IC PIN GPIO Function
12
34
56
78
910
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
41 42
43 44
45 46
47 48
49 50
51 52
53 54
55 56
57 58
59 60
61 62
63 64
PIN Number
Debug UART
USB
SPI
Ethernet
EthernetEthernet
Ethernet
Note:
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8.2.3 GPIO Assignments
GPIO Assignments for J3 64-pin Low Density Connector
GPIO PIN Name PIN Numbe
r
Function
Note:
9.1 Power Supply sequencing and Reset Timing
•
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•
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9.1.1 Power up, Reset and Power Down Timing
Time
Voltage
9.2 RF Considerations
SMSCAppNote - CX870_Antenna_Placement_V1_4.pdf
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Revision Date / Author Details of Change Reason for Change
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Revision Date / Author Details of Change Reason for Change
dat_DM870_16_datasheet.pdf
DM870A DS rev. 1.3_12-15-11.pdf
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Revision Date / Author Details of Change Reason for Change
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Revision Date / Author Details of Change Reason for Change
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Part2. Reliability Test
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Part3. WLAN Test Report
NM-104 BB (CX875)
WLAN Test Plan and Report
Department: PD-2/NABU
Prepared by: Frank Gung
Checked by: Ralf Liu
Approved by:
Revised Date: 2012-12-28
Note:
1.This document does leave the possibility of improvement, or change.
2.All right are reserved: No one is permitted to reproduce, duplicate or explain contents of this
document, in any from, the whole or part of this document without Liteon’s permission.
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Revision History
Version No. Revised Date Revised by Description Note
V0.1 2012-12-28 Frank Gung Check CX875-3PB module RF
performance
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Table of Contents
1. WLAN Test ................................................................................................................................. 53
1.1. Purpose ................................................................................................................................ 53
1.2. WLAN Function Performance Test Plan ............................................................................. 53
1.3. WLAN Function Performance Test Result .......................................................................... 54
1.3.1 Transmit power levels ................................................................................................... 54
1.3.2 Transmit Spectrum Mask .............................................................................................. 55
1.3.3 Transmit center frequency tolerance ............................................................................ 58
1.3.4 Chip clock frequency tolerance .................................................................................... 59
1.3.5 Power-on ramp.............................................................................................................. 60
1.3.6 RF carrier suppression .................................................................................................. 61
1.3.7 Transmit modulation accuracy ..................................................................................... 62
1.3.8 Symbol clock frequency tolerance ............................................................................... 63
1.3.9 Transmitter center frequency leakage ........................................................................... 64
1.3.10 Transmitter spectral flatness ......................................................................................... 66
1.3.11 Transmitter constellation error ..................................................................................... 68
1.3.12 Receiver minimum input level sensitivity .................................................................... 69
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1. WLAN Test
1.1. Purpose
This report is made to check the NM-104BB CX875 module RF performance.
In order to avoid the fail test on RF center frequency error and improve the yield rate of CX875
module, we proposed a solution to fine tune the 50MHz crystal of RF IC by changing the load
capacitors.
This solution was already sending to SMSC review and we also show the performance results in this
report.
1.2. WLAN Function Performance Test Plan
Test performed on moduleΚ
ΚΚ
ΚCX875-3PB module
(CX875-3PB* means with capacitors changed for crystal accuracy improvement)
Date of testΚ
ΚΚ
Κ2012-12-27
Test Item
Sub Test ID Description
Transmit Test
1.3.1 Transmit power levels
1.3.2 Transmit spectrum mask
1.3.3 Transmit center frequency tolerance
1.3.4 Chip clock frequency tolerance
1.3.5 Transmit power-on and power-down ramp
1.3.6 RF carrier suppression
1.3.7 Transmit modulation accuracy
1.3.8 Symbol clock frequency tolerance
1.3.9 Transmitter center frequency leakage
1.3.10 Transmitter spectral flatness
1.3.11 Transmitter constellation error
Receiver Test 1.3.12 Receiver minimum input level sensitivity
Duration of Test
1 day
Test Conditions
Item Description
System Sample Quantity CX875-3PB
Temperature At room temperature
F/W Version Latest CX875 Factory Default code
Test pad Measurements are taken at the discrete component pins
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Test Equipment & Procedure
Item Description
PC DELL M4500 Notebook
One-box WLAN tester Litepoint IQview
Transmit & Receive Test
1.3. WLAN Function Performance Test Result
1.3.1 Transmit power levels
Verify the transmitter output power of the Device Under Test (DUT) is below conformance limit. DUT
generates continuous frames to power meter with Test software utility and measure the output power.
1.3.1.1 Criteria
Refer to the Below Table.
1.3.1.2 Test Report
802.11b Transmit Power Test
Data Rate Output Power ( AVG) dBm Remark
Ch1 (2.412GHz) CH11 (2.462GHz)
CX875-3PB 11 Mbps 15.88 15.42 Power setting:9
CX875-3PB
*11 Mbps 15.74 15.30 With Cap changed
802.11g Transmit Power Test
Data Rate Output Power ( AVG) dBm Remark
Ch1 (2.412GHz) CH11 (2.462GHz)
CX875-3PB 54 Mbps 15.27 14.63 Power setting:1
CX875-3PB
*54 Mbps 15.44 14.56 With Cap changed
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1.3.2 Transmit Spectrum Mask
To verify the transmitter spectrum of the Device Under Test (DUT) is below conformance limit. DUT
generates continuous frames to spectrum analyzer with test software utility and check if the spectrum
mask conforms to the IEEE 802.11 Standard.
1.3.2.1 Criteria
802.11b
The transmitted spectral products shall be less than -30dBr for fc-22MHz < f < fc-11MHz;and
fc+11MHz<f<fc+22MHz;and shall be less than -50dBr for f<fc-22MHz;and f>fc+22MHz
fc : channel center frequency.
802.11g
The transmitted spectrum shall have a 0 dBr (dB relative to the maximum spectral density of the
signal)
bandwidth not exceeding 18 MHz, –20 dBr at 11 MHz frequency offset, –28 dBr at 20 MHz frequency
offset
and –40 dBr at 30 MHz frequency offset and above.
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1.3.2.2 Test Report
(Original CX875-3PB)
Standard Frequency Data Rate Pass/Fail Note
2412 MHz 802.11 b 11Mbps Pass
802.11 g 54Mbps Pass
2462 MHz 802.11 b 11Mbps Pass
802.11 g 54Mbps Pass
Frequency 2412MH
z
Data
Rate 11Mbps Frequency 2462MH
z
Data
Rate 11Mbps
Mode 802.11 b Pass/Fail Pass Mode 802.11 b Pass/Fail Pass
Frequency 2412MH
z
Data
Rate 54Mbps Frequency 2462MH
z
Data
Rate 54Mbps
Mode 802.11 g Pass/Fail Pass Mode 802.11 g Pass/Fail Pass
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(CX875-3PB with Cap Changed)
Standard Frequency Data Rate Pass/Fail Note
2412 MHz 802.11 b 11Mbps Pass
802.11 g 54Mbps Pass
2462 MHz 802.11 b 11Mbps Pass
802.11 g 54Mbps Pass
Frequency 2412MH
z
Data
Rate 11Mbps Frequency 2462MH
z
Data
Rate 11Mbps
Mode 802.11 b Pass/Fail Pass Mode 802.11 b Pass/Fail Pass
Frequency 2412MH
z
Data
Rate 54Mbps Frequency 2462MH
z
Data
Rate 54Mbps
Mode 802.11 g Pass/Fail Pass Mode 802.11 g Pass/Fail Pass
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1.3.3 Transmit center frequency tolerance
To verify that the frequency offset is within the limits. DUT generates continuous frames to spectrum
analyzer with SMSC transmit test commands.
1.3.3.1 Criteria
The max allowed frequency offset is less than 25ppm
1.3.3.2 Test Report
(Original CX875-3PB)
Frequency offset (ppm) @11b Design Spec.
(ppm) Pass/Fail
CX875-3PB 11 Mbps CH1 CH11 І25ppm Pass
-14.28 -14.26
Frequency offset (ppm) @11g Design Spec.
(ppm) Pass/Fail
CX875-3PB 54 Mbps CH1 CH11 І25ppm Pass
-14.13 -14.22
(CX875-3PB with Cap Changed)
Frequency offset (ppm) @11b Design Spec.
(ppm) Pass/Fail
CX875-3PB* 11 Mbps CH1 CH11 І25ppm Pass
-7.68 -7.63
Frequency offset (ppm) @11g Design Spec.
(ppm) Pass/Fail
CX875-3PB* 54 Mbps CH1 CH11 І25ppm Pass
-7.53 -7.47
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1.3.4 Chip clock frequency tolerance
To verify that the frequency offset is within the limits. DUT generates continuous frames to spectrum
analyzer with SMSC transmit test commands.
1.3.4.1 Criteria
The max allowed frequency offset is less than 25ppm
1.3.4.2 Test Report
(Original CX875-3PB)
Frequency offset (ppm) @11b Design Spec.
(ppm) Pass/Fail
CX875-3PB 11 Mbps CH1 CH11 І25ppm Pass
-13.37 -13.03
(CX875-3PB with Cap Changed)
Frequency offset (ppm) @11b Design Spec.
(ppm) Pass/Fail
CX875-3PB* 11 Mbps CH1 CH11 І25ppm Pass
-7.27 -7.16
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1.3.5 Power-on ramp
To verify that the Power-on ramp time is within the limits. DUT generates continuous frames to
spectrum analyzer with SMSC transmit test commands.
1.3.5.1 Criteria
The transmit power-on ramp for 10% to 90% of maximum power shall be no greater than 2us.
1.3.5.2 Test Report
(Original CX875-3PB)
Power-on ramp time (us) @11b 11Mbps Design Spec.
(us) Pass/Fail
CX875-3PB 11 Mbps CH1 CH11 І2Pass
0.6 0.3
(CX875-3PB with Cap Changed)
Power-on ramp time (us) @11b 11Mbps Design Spec.
(us) Pass/Fail
CX875-3PB* 11 Mbps CH1 CH11 І2Pass
0.3 0.3
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1.3.6 RF carrier suppression
Testing of the RF carrier suppression for 802.11b according to the IEEE specification requires a
special test signal to be provided by the DUT. DUT generates continuous frames to spectrum analyzer
with SMSC transmit test commands.
1.3.6.1 Criteria
The RF carrier suppression, measured at the channel center frequency, shall be at least 15 dB below
the peak SIN(x)/x power spectrum.
1.3.6.2 Test Report
(Original CX875-3PB)
LO Leakage (dBc) @11b 1Mbps Design Spec.
(dBc) Pass/Fail
CX875-3PB 11 Mbps CH1 CH11 <-15 Pass
-31.84 -34.61
(CX875-3PB with Cap Changed)
LO Leakage (dBc) @11b 1Mbps Design Spec.
(dBc) Pass/Fail
CX875-3PB* 11 Mbps CH1 CH11 <-15 Pass
-30.94 -34.48
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1.3.7 Transmit modulation accuracy
The transmit modulation accuracy is measured using error vector magnitude (EVM). EVM is the
magnitude of the phase difference as a function of time between an ideal reference signal and the
measured transmitted signal. DUT generate frame with with SMSC transmit test commands and send
the RF signal to vector signal analyzer. Measure the EVM from vector signal analyzer.
1.3.7.1 Criteria
The EVM specification is 35% peak for 1000 symbols.
1.3.7.2 Test Report
(Original CX875-3PB)
EVM (%) @11b 1Mbps Design Spec.
(%) Pass/Fail
CX875-3PB 11 Mbps CH1 CH11 І35% Pass
6.54 6.38
EVM (%) @11g 54Mbps Pass/Fail
CX875-3PB 54 Mbps CH1 CH11 І5.62% Pass
3.41 4.25
(CX875-3PB with Cap Changed)
EVM (%) @11b 1Mbps Design Spec.
(%) Pass/Fail
CX875-3PB* 11 Mbps CH1 CH11 І35% Pass
6.60 6.45
EVM (%) @11g 54Mbps Pass/Fail
CX875-3PB* 54 Mbps CH1 CH11 І5.62% Pass
3.47 4.09
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1.3.8 Symbol clock frequency tolerance
To verify that the frequency offset is within the limits. DUT generates continuous frames to spectrum
analyzer with SMSC transmit test commands.
1.3.8.1 Criteria
The max allowed frequency offset is less than 25ppm
1.3.8.2 Test Report
(Original CX875-3PB)
Frequency offset (ppm) @11g Design Spec.
(ppm) Pass/Fail
CX875-3PB 54
Mbps
CH1 CH11 І25ppm Pass
-13.71 -12.88
(CX875-3PB with Cap Changed)
Frequency offset (ppm) @11g Design Spec.
(ppm) Pass/Fail
CX875-3PB* 54
Mbps
CH1 CH11 І25ppm Pass
-7.07 -7.40
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1.3.9 Transmitter center frequency leakage
Testing of the Transmitter center frequency leakage for 802.11g according to the IEEE specification
requires a special test signal to be provided by the DUT. DUT generates continuous frames to
spectrum analyzer with SMSC transmit test commands.
1.3.9.1 Criteria
Certain transmitter implementations may cause leakage of the center frequency component. Such
leakage (which manifests itself in a receiver as energy in the center frequency component) shall not
exceed -15 dB relative to overall transmitted power or, equivalently, +2 dB relative to the average
energy of the rest of the subcarriers. The data for this test shall be derived from the channel estimation
phase.
1.3.9.2 Test Report
(Original CX875-3PB)
LO Leakage Design Spec
(dB) Note
CX875-3PB 54 Mbps CH1 CH11 2
Pass Pass
Frequency 2412MH
z
Data
Rate 54Mbps Frequency 2462MH
z
Data
Rate 54Mbps
Mode 802.11 g Pass/Fail Pass Mode 802.11 g Pass/Fail Pass
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(CX875-3PB with Cap Changed)
LO Leakage Design Spec
(dB) Note
CX875-3PB* 54 Mbps CH1 CH11 2
Pass Pass
Frequency 2412MH
z
Data
Rate 54Mbps Frequency 2462MH
z
Data
Rate 54Mbps
Mode 802.11 g Pass/Fail Pass Mode 802.11 g Pass/Fail Pass
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1.3.10 Transmitter spectral flatness
To verify if the Transmit Spectrum Flatness can conforms to the IEEE 802.11g Standard. DUT
generates continuous frames to spectrum analyzer with SMSC transmit test commands.
1.3.10.1 Criteria
The average energy of the constellations in each of the spectral lines –16~ –1 and +1~+16 will deviate
no more than ± 2 dB from their average energy. The average energy of the constellations in each of the
spectral lines –26~–17 and +17~ +26 will deviate no more than +2/–4 dB from the average energy of
spectral lines –16~–1 and +1~ +16. The data for this test shall be derived from the channel estimation
step.
1.3.10.2 Test Report
(Original CX875-3PB)
Transmit Spectrum Flatness Design Spec (dB) Note
CX875-3PB 54 Mbps
CH1 CH11
–16~ –1 and +1~+16 < ± 2
dBΙ –26~–17 and +17~ +26
<+2/–4 dB
Pass Pass
Frequency 2412MH
z
Data
Rate 54Mbps Frequency 2462MH
z
Data
Rate 54Mbps
Mode 802.11 g Pass/Fail Pass Mode 802.11 g Pass/Fail Pass
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(CX875-3PB with Cap Changed)
Transmit Spectrum Flatness Design Spec (dB) Note
CX875-3PB* 54 Mbps
CH1 CH11
–16~ –1 and +1~+16 < ± 2
dBΙ –26~–17 and +17~ +26
<+2/–4 dB
Pass Pass
Frequency 2412MH
z
Data
Rate 54Mbps Frequency 2462MH
z
Data
Rate 54Mbps
Mode 802.11 g Pass/Fail Pass Mode 802.11 g Pass/Fail Pass
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1.3.11 Transmitter constellation error
The transmit constellation error is measured using error vector magnitude (EVM). EVM is the
magnitude of the phase difference as a function of time between an ideal reference signal and the
measured transmitted signal. DUT generate frame with SMSC transmit test commands and send the
RF signal to vector signal analyzer. Measure the EVM from vector signal analyzer.
1.3.11.1 Criteria
The relative constellation RMS error, averaged over subcarriers, OFDM frames, and packets, shall not
exceed a data-rate dependent value according to Table.
1.3.11.2 Test Report
(Original CX875-3PB)
EVM (dB) @11g 54Mbps Design Spec. Pass/Fail
CX875-3PB 54 Mbps CH1 CH11 І-25dB Pass
-29.35 -27.42
(CX875-3PB with Cap Changed)
EVM (dB) @11g 54Mbps Design Spec. Pass/Fail
CX875-3PB* 54 Mbps CH1 CH11 І-25dB Pass
-29.20 -27.76
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1.3.12 Receiver minimum input level sensitivity
To verify if the receiver minimum input level sensitivity conforms to the IEEE 802.11 Standard.
1.3.12.1 Criteria
Refer to the Below Table.
1.3.12.2 Test report
Test Condition:
Using IQnxn send 10000 packets and measure the minimal power level that keeps packet loss under
10%.
The power value does not include the cable loss about 1dB
Test Result
802.11b Sensitivity Test
Test
Module Data Rate
dBm (measured) Design
Spec.
dBm
Pass/Fail Remark
Ch1
(2.412GHz)
CH11
(2.462GHz)
CX875-3PB 11 Mbps -78 -78.5 <=-78 Pass
CX875-3PB
*11 Mbps -78 -78.5 <=-78 Pass
With Cap changed
802.11g Sensitivity Test
Test
Module Data Rate
dBm (measured) Design
Spec.
dBm
Pass/Fail Remark
Ch1
(2.412GHz)
CH11
(2.462GHz)
CX875-3PB 54 Mbps -70 -70 <=-70 Pass
CX875-3PB
*54 Mbps -70 -70 <=-70 Pass With Cap changed
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Part4. WiFi Certification
To be Discussed
1. FCC
2. IC
3. CE
4. Japan Telecfication
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Part5. Manufacturing Test Plan
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Part6. PCB Circuit Drawing
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Part7. BOM List
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Part8. Packing Method
1.Label
1.1 Certificate Label
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1.2 Carton Label
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1.3 MAC ID Label
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2. Packing Instruction