LG Innotek BK1100 Telematics Modem User Manual 1

LG Innotek Co., Ltd. Telematics Modem 1

User Manual

Copyright ⓒ. 2017. All Rights Reserved. User Guide for the LTD-BK1100 1. Overview 2. Major features 3. Interface 4. Electrical specifications 5. RF specifications 6. Mechanical specifications 7. General specifications 8. Connectors 9. RFx information 10. Approbation FCC Table of Contents Product: LTE_WCDMA Wireless Modem Model name: LTD-BK1100
Copyright ⓒ. 2017. All Rights Reserved. The LTD-BK1100 is a personal mobile communication device that incorporates the latest compact radio technology, including smaller and lighter components and support for WCDMA(850/1900MHz) bands and LTE(700/850/1700/1900/2700 MHz). This device acts as the vehicle’s telematics system and connects to WCDMA (HSPA+) and LTE wireless networks and wireless modules to allow voice and data communication. Furthermore, this device can operate on land and water as well as other similar areas. In LTE mode, the device provides uplink speeds of up to 50 Mbps and downlink speeds of up to 150 Mbps for seamless transfer of data such as movies and video calls. The device also supports the transfer of large amounts of data. The device communicates with the host system via a standard RS-232 or USB port, and AT commands and control commands can be used to send data. Voice calls are also possible. 1. Overview
Copyright ⓒ. 2017. All Rights Reserved. Mechanical Dimensions 34 x 40 x 3.5 mm (L x W x T) (Tolerance – width, length : TBD) Weight TBD g (max) Interface USB, general purpose I/O pins Temperature* Operation: -20 ℃ - +70 ℃ Storage: -40 ℃ - +85 ℃ Technology Main chipset MDM9628 Memory 4Gb(NAND) / 1Gb(SDRAM) Standard WCDMA (HSPA+) - DL Speed : 14.4 Mbps - UL Speed : 5.76 Mbps LTE - DL Speed : 150 Mbps - UL Speed : 50 Mbps Band WCDMA B2, B5 LTE B2, B4, B5, B12(17), B7 Power WCDMA : Typ. 24dBm (Power Class 3) LTE : Typ. 23dBm (Power Class 3) ETC DC power 4 V Functions Voice, data, SMS 2. Major features
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface 3.1 LGA Pad Layout (Top View) Figure 1. LGA Pin map
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface 3.2 Pin description Table 1. Pin descriptions PAD. NAME DIRECTION DESCRIPTION Antenna Interface Pads C21 MAIN_ANT Input/Output RF Main Antenna AC21 DIV_ANT Input/Output RF Diversity Antenna User Interface Pads H6 ACC_PWR_ON Input ACC_PWR_ON I5 BOOT_OK Output BOOT_OK H4 MSG Output MSG G3 96H_END Output 96H_END F20 MAIN_ANT_DTC_EN Output Main ANT Detect Enable Z20 DIV_ANT_DTC_EN Output Diversity ANT Detect Enable I7 SPI_LEVEL_SHIFT_EN Output SPI LEVEL SHIFT Enable AD4 ETHERNET_DCDC_ENABLE Output Ethernet power enable F6 GPIO1 Input/Output (Do not use with External PU) General purpose I/O E5 GPIO2 General purpose I/O L6 GPIO3 Input/Output (Not support INTERRUPT) General purpose I/O N6 GPIO4 General purpose I/O ADC Interface Pads E19 ADC1 Input ADC Convertor input for main antenna detect AA19 ADC2 Input ADC Convertor input for diversity antenna detect PCM Interface Pads W3 PCM_EN Output PCM 3.3 Level Shifter Enable X2 PCM_CLK Input PCM Clock W1 PCM_SYNC Input PCM Frame Sync Y3 PCM_DIN Input PCM Data In Y1 PCM_DOUT Output PCM Data Out JTAG Pin Description AC7 MDM_JTAG_TMS Input/Output JTAG mode select input AD8 MDM_JTAG_PS_HOLD input JTAG PS HOLD detect AD6 MDM_JTAG_TDI Input JTAG data input AE7 MDM_JTAG_TRST_N Input JTAG reset for debug AB6 MDM_JTAG_TDO Output JTAG debugging AB8 MDM_JTAG_TCK Input JTAG clock input AE9 MDM_JTAG_SRST_N Input JTAG reset USB Interface Pads N2 USB_HS_DM Input/Output USB high speed data (minus) M1 USB_HS_DP Input/Output USB high speed data (plus) K1 USB_VBUS Input USB power L2 USB_ID Input USB ID SDIO Interface Pads S1 SDC_CLK Output Secure digital controller clock Q1 SDC_CMD Output Secure digital controller command T2 SDC_DATA0 Input/Output Secure digital controller data bit 0 R2 SDC_DATA1 Input/Output Secure digital controller data bit 1 S3 SDC_DATA2 Input/Output Secure digital controller data bit 2
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface Table 1. Pin descriptions Q3 SDC_DATA3 Input/Output Secure digital controller data bit 3 SGMMI Interface Pads AA11 EPHY_RST_N or UIM2_RESET Output Ethernet PHY reset AE11 EPHY_INT_N or UIM2_DETECT Input Ethernet PHY interrupt AB10 SGMII_DATA or UIM2_CLK Input/Output SGMII input Output data AD10 GND Ground X10 SGMII_RX_P Input SGMII receive - plus W11 SGMII_RX_M Input SGMII receive -minus Z10 SGMII_TX_M Output SGMII transmit - plus Y11 SGMII_TX_P Output SGMII transmit -minus AC11 SGMII_CLK or UIM2_DATA Output SGMII clock SPI Interface Pads S5 SPI_MOSI Output SPI Serial Output T6 SPI_CLK Output SPI Serial Clock R6 SPI_CS_N Output SPI Chip Select U5 SPI_MISO Input SPI Serial input Q5 SPI_INTERRUPT Input MICOM → LGA SPI interrupt UART Interface Pads M5 UART2_TX Output UART2 Transmit data N4 UART2_RX Input UART2 Receive data K5 UART1_TX Output Debug UART5 Transmit Data L4 UART1_RX Input Debug UART5 Receive Data O5 UART3_TX Output UART6 Transmit data P4 UART3_RX Input UART6 Receive data USIM Interface Pads I3 UIM1_PRESENT Input Detection of an external UIM card H2 UIM1_CLK Output Clock Output to an external UIM card E1 UIM1_RESET Output Reset Output to an external UIM card G1 UIM1_DATA Input/Output Data connection with an external UIM card F2 VREG_L6_UIM1 Output Supply Output for an external UIM card E3 GND Ground D2 GND Ground A1 GND Ground C1 GND Ground B2 GND Ground HSIC Pin Description AB2 HSIC_DATA Input/Output HSIC data AC1 HSIC_STB Input/Output HSIC Strobe signal AD2 NC No Connect AE1 NC No Connect DSRC Pin Description Y7 COEX_UART_RX Input LTE receiver sync for coexistence with UART Z6 COEX_UART_TX Output LTE transmitter sync for coexistence with UART X4 RFCLK2_QCA Output Low noise RF clock Output AA3 WLAN_EN_DSRC Output WLAN Enable
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface Table 1. Pin descriptions X6 DSRC_SLP_CLK Output DSRC sleep clock Y5 WLAN_3V_EN_DSRC Output Used for WLAN enable Z4 DSRC_PPS Input/Output Pulse Per Second X8 MDM2AP_INT_N Output MDM to AP interrupt, PCM_LDO_EN Z8 AP2MDM_INT_N Input AP to MDM interrupt Control Pads A3 LGA_PHONE_ON Input ON/OFF Control B4 MDM_RESOUT_N Output Reset Output C3 LGA_RESIN_N Input External Reset Input Power Supply Pads A17 VPH_PWR for PAM Input power supply (4.0V) B16 VPH_PWR for PAM Input power supply (4.0V) A15 VPH_PWR for PAM Input power supply (4.0V) B14 VPH_PWR for PAM Input power supply (4.0V) A9 VPH_PWR for PMIC Input power supply (4.0V) B8 VPH_PWR for PMIC Input power supply (4.0V) A7 VPH_PWR for PMIC Input power supply (4.0V) C7 VPH_PWR for PMIC Input power supply (4.0V) Voltage Reference Pad C9 VREG_L11_1P8 Output LDO out for 1.8V pull up D8 VREG_L11_1P8 Output LDO out for 1.8V pull up AE3 Voltage Reference for SGMII (VREG_L5_UIM2) – Ethernet IO전압 level Output Ethernet I/O voltage NC Pads G9 NC No Connect B12 NC No Connect I9 NC No Connect G7 NC No Connect C5 NC No Connect D4 NC No Connect A21 GND Ground E21 GND Ground G21 GND Ground I21 GND Ground K21 GND Ground M21 GND Ground O21 GND Ground Q21 GND Ground S21 GND Ground U21 GND Ground W21 GND Ground Y21 GND Ground AA21 GND Ground AE21 GND Ground B20 GND Ground D20 GND Ground H20 GND Ground J20 GND Ground
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface Table 1. Pin descriptions L20 GND Ground N20 GND Ground P20 GND Ground R20 GND Ground T20 GND Ground V20 GND Ground X20 GND Ground AB20 GND Ground AD20 GND Ground A19 GND Ground C19 GND Ground G19 GND Ground I19 GND Ground K19 GND Ground M19 GND Ground O19 GND Ground Q19 GND Ground S19 GND Ground U19 GND Ground W19 GND Ground Y19 GND Ground AC19 GND Ground AE19 GND Ground B18 GND Ground D18 GND Ground F18 GND Ground H18 GND Ground J18 GND Ground L18 GND Ground N18 GND Ground P18 GND Ground R18 GND Ground T18 GND Ground V18 GND Ground X18 GND Ground Z18 GND Ground AB18 GND Ground AD18 GND Ground C17 GND Ground E17 GND Ground G17 GND Ground I17 GND Ground K17 GND Ground M17 GND Ground O17 GND Ground Q17 GND Ground S17 GND Ground U17 GND Ground W17 GND Ground Y17 GND Ground
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface Table 1. Pin descriptions AA17 GND Ground AC17 GND Ground AE17 GND Ground D16 GND Ground F16 GND Ground H16 GND Ground J16 GND Ground L16 GND Ground N16 GND Ground P16 GND Ground R16 GND Ground T16 GND Ground V16 GND Ground X16 GND Ground Z16 GND Ground AB16 GND Ground AD16 GND Ground C15 GND Ground E15 GND Ground G15 GND Ground I15 GND Ground W15 GND Ground Y15 GND Ground AA15 GND Ground AC15 GND Ground AE15 GND Ground D14 GND Ground F14 GND Ground H14 GND Ground X14 GND Ground Z14 GND Ground AB14 GND Ground AD14 GND Ground A13 GND Ground C13 GND Ground E13 GND Ground G13 GND Ground I13 GND Ground W13 GND Ground Y13 GND Ground AA13 GND Ground AC13 GND Ground AE13 GND Ground D12 GND Ground F12 GND Ground H12 GND Ground X12 GND Ground Z12 GND Ground AB12 GND Ground AD12 GND Ground
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface Table 1. Pin descriptions A11 GND Ground C11 GND Ground E11 GND Ground G11 GND Ground I11 GND Ground B10 GND Ground D10 GND Ground F10 GND Ground H10 GND Ground E9 GND Ground W9 GND Ground Y9 GND Ground AA9 GND Ground AC9 GND Ground F8 GND Ground H8 GND Ground E7 GND Ground W7 GND Ground AA7 GND Ground B6 GND Ground D6 GND Ground J6 GND Ground P6 GND Ground V6 GND Ground A5 GND Ground W5 GND Ground AA5 GND Ground AC5 GND Ground AE5 GND Ground F4 GND Ground J4 GND Ground R4 GND Ground T4 GND Ground V4 GND Ground AB4 GND Ground K3 GND Ground M3 GND Ground O3 GND Ground U3 GND Ground AC3 GND Ground J2 GND Ground P2 GND Ground V2 GND Ground Z2 GND Ground I1 GND Ground O1 GND Ground U1 GND Ground AA1 GND Ground GND1 GND Ground GND2 GND Ground
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface Table 1. Pin descriptions GND3 GND Ground GND4 GND Ground GND5 GND Ground GND6 GND Ground GND7 GND Ground GND8 GND Ground GND9 GND Ground GND10 GND Ground GND11 GND Ground GND12 GND Ground N14 GND Ground P14 GND Ground R14 GND Ground M13 GND Ground O13 GND Ground Q13 GND Ground S13 GND Ground N12 GND Ground P12 GND Ground R12 GND Ground M11 GND Ground O11 GND Ground Q11 GND Ground S11 GND Ground N10 GND Ground P10 GND Ground R10 GND Ground M9 GND Ground O9 GND Ground Q9 GND Ground S9 GND Ground N8 GND Ground P8 GND Ground R8 GND Ground G5 GND Ground
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface 3.3 USB This device supports universal serial bus (USB) connections for high-speed data communication. The relevant hardware satisfies the USB 2.0 specifications and supports maximum communications speeds of 480 Mbps Table 2. USB Pin descriptions Pin NO. Signal Name Pin I/O (Modem host) Function Description M1 USB_D+ IO USB Differential data line (+) N2 USB_D- IO USB Differential data line (-) K1 USB_VBUS I USB Power Supply
Copyright ⓒ. 2017. All Rights Reserved. 3. Interface 3.4 Audio This module includes a PCM interface. The pull-up and pull-down resistors attached to these pin must provide more than 50 Kohm of resistance. Table 3. PCM Pin descriptions 3.5 User interface Pin No. Signal Name Direction Function I5 BOOT_OK O Indicates that the Modem boot is complete. C3 RESET_IN I Control line to unconditionally restart the module. H4 MSG O Indicates that the Modem receive Urgent message. G3 96H_END O Indicates that the 96hr sleep mode is end. H6 ACC_ON_SLEEP I Control line to power on or 96hr sleep mode. A3 Phone_ON I Control line to power on / off Table 4. User interface Pin descriptions Pin NO. Signal Name Pin I/O (Modem host) Function Description W1 PCM_SYNC I PCM Interface sync X2 PCM_CLK I PCM Interface clock Y1 PCM_TXD O PCM Interface digital audio data out Y3 PCM_RXD I PCM Interface digital audio data in
Copyright ⓒ. 2017. All Rights Reserved. 4. Electrical specifications 4.1 Power supply specifications The host system provides the power supply (V_BATT)DC 4 V, 2.5 A to the device. The internal power supply module manages the power supplied to the integral circuits and maintains constant voltages. This module also controls each power block to minimize power consumption. In particular, the PAM (power amplifier module) consumes a lot of power, so it receives a direct power supply of 4 V from the V_BATT. Therefore the V_BATT signal inputs only the supply power of the PAM, even when the absolute rating is higher. In addition, the entire power input module blocks and protects against high surges and ESD in the NAD module. Pin No. Signal Name Direction MIN TYP MAX A7,C7,B8,A9, B14,A15,B16, A17 V_BATT I 3.9 V 4 V 4.1 V Table 5. Power supply specifications
Copyright ⓒ. 2017. All Rights Reserved. 4. Electrical specifications 4.2 Logic level specifications 4.2.1 Digital logic level specifications Table 6. Digital logic level specifications Signal Name Type Low High Unit Min Max Min Max BOOT_OK O 0 0.45 1.35 1.8 V RESET_IN I -0.3 0.63 1.17 1.8 MSG O 0 0.45 1.35 1.8 96H_END O 0 0.45 1.35 1.8 ACC_ON_SLEEP I 0 0.63 1.17 1.8
Copyright ⓒ. 2017. All Rights Reserved. 5. RF specifications 5.1 WCDMA 5.1.1 Receiver .- Bandwidth : 5MHz .- Frequency : 869MHz – 894MHz (B5), 1930MHz – 1990MHz (B2) .- RF to Baseband Direct conversion (Zero IF) .- Modulation method : QPSK, 16QAM .- Sensitivity : ≤-104dBm (BER = Under 0.1%) 5.1.2 Transmitter .- Frequency: 824MHz – 849MHz (B5), 1850MHz – 1910MHz (B2) .- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm .- Modulation method : QPSK .- Baseband to RF Direct conversion (Zero IF) 5.2 LTE 5.2.1 Receiver .- Bandwidth : B2/B4/B7 (5 MHz, 10 MHz, 15 MHz, 20 MHz), B5/B12 (5 MHz, 10 MHz). - Frequency : B2 (1930 MHz – 1990 MHz), B4 (2110 MHz – 2155 MHz), B5 (869 MHz – 894 MHz), B7(2620 MHz – 2690 MHz) B12 (729 MHz – 746 MHz) .- RF to Baseband Direct conversion (Zero IF) .- Modulation method : QPSK, 16QAM and 64QAM .- Sensitivity : B2 (≤-94.3dBm @QPSK, BW:10 MHz), B4 (≤-96.3dBm @QPSK, BW:10 MHz), B5 (≤-94.3dBm @QPSK, BW:10 MHz), B7 (≤-94.3dBm @QPSK, BW:10 MHz), B12 (≤-93.3dBm @QPSK, BW:10 MHz)
Copyright ⓒ. 2017. All Rights Reserved. 5. RF specifications 5.2.2 Transmitter .- Frequency: B2 (1850 MHz – 1910 MHz), B4 (1710 MHz – 1755 MHz), B5 (824 MHz – 849 MHz), B7 (2500 MHz – 2570 MHz), B12(699 MHz – 716 MHz) .- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm .- Modulation method : QPSK and 16QAM .- Baseband to RF Direct conversion (Zero IF)
Copyright ⓒ. 2017. All Rights Reserved. 6. Mechanical specifications 6.1 Environment specifications .- Storage temp.: -40 ℃ - +85 ℃ .- Operating temp.: -20 ℃ - +70 ℃ (-20 ℃ - +70 ℃ : 3GPP specifications are satisfied -30 ℃ - -20 ℃, +70 ℃ - +80 ℃ : May cause performance degradation) .- Operating humidity: 80% (60℃) relative humidity
Copyright ⓒ. 2017. All Rights Reserved. 6. Mechanical specifications 6.1 Mechanical dimensions Dimensions 34 x 40.0 x 3.5 mm (L x W x T) (Tolerance – width, length : TBD) Weight TBD grams(max.) Modem interface connector 12709HS-H40 (Manufacture vendor : YUNHO) Modem antenna Connector (Plug) KR15005-DD , KR15005-DG (Manufacture vendor : KET) Table 7. Mechanical specification Figure 2. Mechanical dimension
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.1 WCDMA B5 electrical specifications Table 8. WCDMA B5 RF specification TEST ITEM Spec. Test Temperature Test Frequency CHANNEL 4357 4400 4458 1 Maximum Output Power 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Frequency Error -195 ~ +195Hz Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Inner Loop Power Control in the Uplink PASS Normal Mid - PASS - 4 Minimum Output Power -49dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 5 Occupied Bandwidth (OBW) 5MHz ↓ Normal Low, Mid, High PASS PASS PASS 6 Spectrum emission mask SEM Band1 Offset2.5-3.5MHz (at Freq+3.5MHz) -48.5dBc ↓ Normal Low, Mid, High PASS PASS PASS SEM Band1 Offset3.5-7.5MHz (at Freq+7.5MHz) -37.5dBc ↓ PASS PASS PASS SEM Band1 Offset7.5-8.5MHz (at Freq+8.5MHz) -47.5dBc ↓ PASS PASS PASS SEM Band1 Offset8.5-12.5MHz -47.5dBc ↓ PASS PASS PASS 7 Adjacent Channel Leakage Power Ratio (ACLR) ACLR Offset +5/-5MHz Rel -32.2dBc ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR Offset +10/-10MHz Rel -42.2dBc ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Error Vector Magnitude(EVM) EVM at Tx output power 24dBm /-18dBm 17.5% ↓ Normal Low, Mid, High PASS PASS PASS 9 Peak code domain error PCDE at Tx output power 24dBm/-18dBm -14dB ↓ Normal Low, Mid, High PASS PASS PASS 10 Phase Discontinuity Phase Discontinuity max EVM 17.5% ↓ Normal Mid - PASS - Phase Discontinuity max Frequency Error -195~195Hz - PASS - Phase Discontinuity max 1500Hz 36 degrees ↓ - PASS - 11 Reference Sensitivity Level Ref Sense Go/No Go I^or=-104dBm/3.84MHz BER 0.1% ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 12 Maximum Input Level Max Input Go/No Go I^or=-25.7dBm/3.84MHz BER 0.1% ↓ Normal Mid - PASS -
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.2 WCDMA B2 electrical specifications Table 9. WCDMA B2 RF specification TEST ITEM Spec. Test Temperature Test Frequency CHANNEL 9662 9800 9938 1 Maximum Output Power 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Frequency Error -195 ~ +195Hz Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Inner Loop Power Control in the Uplink PASS Normal Mid - PASS - 4 Minimum Output Power -49dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 5 Occupied Bandwidth (OBW) 5MHz ↓ Normal Low, Mid, High PASS PASS PASS 6 Spectrum emission mask SEM Band1 Offset2.5-3.5MHz (at Freq+3.5MHz) -48.5dBc ↓ Normal Low, Mid, High PASS PASS PASS SEM Band1 Offset3.5-7.5MHz (at Freq+7.5MHz) -37.5dBc ↓ PASS PASS PASS SEM Band1 Offset7.5-8.5MHz (at Freq+8.5MHz) -47.5dBc ↓ PASS PASS PASS SEM Band1 Offset8.5-12.5MHz -47.5dBc ↓ PASS PASS PASS 7 Adjacent Channel Leakage Power Ratio (ACLR) ACLR Offset +5/-5MHz Rel -32.2dBc ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR Offset +10/-10MHz Rel -42.2dBc ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Error Vector Magnitude(EVM) EVM at Tx output power 24dBm /-18dBm 17.5% ↓ Normal Low, Mid, High PASS PASS PASS 9 Peak code domain error PCDE at Tx output power 24dBm/-18dBm -14dB ↓ Normal Low, Mid, High PASS PASS PASS 10 Phase Discontinuity Phase Discontinuity max EVM 17.5% ↓ Normal Mid - PASS - Phase Discontinuity max Frequency Error -195~195Hz - PASS - Phase Discontinuity max 1500Hz 36 degrees ↓ - PASS - 11 Reference Sensitivity Level Ref Sense Go/No Go I^or=-104dBm/3.84MHz BER 0.1% ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 12 Maximum Input Level Max Input Go/No Go I^or=-25.7dBm/3.84MHz BER 0.1% ↓ Normal Mid - PASS -
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.3 LTE B2 electrical specifications 시험 항목 Spec. Test Temperature Frequency TX Channel 18650 18900 19150 1 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz Ref Sense throughput shall be ≥ 95% -94.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 10. LTE B2 RF specification
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.4 LTE B4 electrical specifications 시험 항목 Spec. Test Temperature Frequency TX Channel 20000 20175 20350 1 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz Ref Sense throughput shall be ≥ 95% -96.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 11. LTE B4 RF specification
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.5 LTE B5 electrical specifications 시험 항목 Spec. Test Temperature Frequency TX Channel 20450 20525 20600 1 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz Ref Sense throughput shall be ≥ 95% -94.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 12. LTE B5 RF specification
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.6 LTE B7 electrical specifications Table 13. LTE B17 RF specification 시험 항목 Spec. Test Temperature Frequency TX Channel 23780 23790 23800 1 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz Ref Sense throughput shall be ≥ 95% -93.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.7 LTE B12/17 electrical specifications Table 13. LTE B17 RF specification 시험 항목 Spec. Test Temperature Frequency TX Channel 23780 23790 23800 1 Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz Ref Sense throughput shall be ≥ 95% -93.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
Copyright ⓒ. 2017. All Rights Reserved. 8.RFx information The strength of the RF field produced by the wireless module or modules embedded in the TCU is well within all international RF exposure limits known at this time. Because the wireless modules embedded in the TCU emit less than the maximum amount of energy permitted in radio frequency safety standards and recommendations, the manufacturer believes these modules are safe for use. Regardless of the power levels, care should be taken to minimize human contact during normal operation. This module should be remain more than 20 cm (8 inches) from the body when wireless devices are on and transmitting. This transmitter must not be collocated or operated in conjunction with any other antenna or transmitter. Operation is subject to the following two conditions: (1) this module does not cause interference , (2) this module accepts any interference that may cause undesired operation. 8.1 Information for the integrator The integrator must not provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual that is provided by the integrator for end users must include the following information in a prominent location. To comply with FCC RF exposure requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operated in conjunction with any other antenna or transmitter. The label for the end product must include FCC ID: YZP-BK1100 or A RF transmitter inside, IC ID: 7414C-BK1100
Copyright ⓒ. 2017. All Rights Reserved. 9. Approbation FCCThis module complies with FCC/IC rules. FCC : Part 22, Part 24, Part 27 ISED : RSS-130, RSS-132, RSS-133, RSS-139, RSS-199Furthermore, this device complies with FCC/IC radiation exposure limits set forth for uncontrolled environments. This module must be installed and operated with minimum distance of 20 cm between the radiating element and the user. This module must not be co-located with any other transmitters or antennas. Cet module est conforme à l'exposition de FCC et IC rayonnements limites é-tablies pour un environnement non contrôlé. Cet module doit être installé et utilisé avec une distance minimale de 20 cm entre le radiateur et votre corps. Ce module ne doit pas être même endroit avec d'autres émetteur ou antennes.To comply with FCC/IC regulations limiting both the maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the values listed in the following table. To satisfy the FCC’s exterior labeling requirements, the following text must appear on the exterior of the end product. Contains transmitter module FCC ID: YZP-BK1100 Contains transmitter module IC ID: 7414C-BK1100 Changes or modifications to this equipment may cause harmful interference unless the modifications are expressly approved in the instruction manual. Users may lose the authority to operate this equipment if an unauthorized change or codification is made. Note: If this module is intended for use in a portable device, additional testing will be required to satisfy the RF exposure and SAR requirements of FCC Part 2.1093 and RSS-102. Band Frequency Range [MHz] Maximum Antenna Gain[dBi] WCDMA(B5) 826.40~846.6 4.5 WCDMA(B2) 1852.4~1907.6 2.0 LTE(B2) 1850~1910 2.0 LTE(B4) 1710~1755 2.0 LTE(B5) 824~849 4.5 LTE(B7) 2500~2690 2.0 LTE(B12/17) 704~716 4.5

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