LITE ON TECHNOLOGY WB117C BT V4.0 LE Dual Mode Bluetooth Stereo Audio Module User Manual LiteOn Technology Corp

LITE-ON Technology Corp. BT V4.0 LE Dual Mode Bluetooth Stereo Audio Module LiteOn Technology Corp

User Manual

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Document ID2276311
Application IDIxiVK7dENjDr+KztPd0DcA==
Document DescriptionUser Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize134.66kB (1683270 bits)
Date Submitted2014-05-23 00:00:00
Date Available2014-05-23 00:00:00
Creation Date2014-05-05 19:25:56
Producing SoftwareMicrosoft® Word 2013
Document Lastmod2014-05-16 15:35:33
Document TitleLiteOn Technology Corp.
Document CreatorMicrosoft® Word 2013
Document Author: Tracy Chang

PRODUCT SPECIFICATION
BT V4.0 LE Dual Mode Bluetooth Stereo Audio Module
WB117C
CSR 8645
Version 1.7
User Manual
* This document contains confidential proprietary information and is property of LTC. The contents of
this document should not be disclosed to unauthorized persons without the written consent of LTC.
Page 1/15
PRODUCT SPECIFICATION
BT V4.0 LE Dual Mode Bluetooth Stereo Audio Module
WB117C
CSR 8645
Version 1.7
Networking B.U.
Lite-on Technology Corporation
4F, No. 90, Chien I Rd.,
Chung Ho, New Taipei City 235, Taiwan, R.O.C.
Customer Approval:
(Signature)
(Title)
(Company)
(Date)
(Please Sign Back by FAX.
For Confirming the Spec Only, not an Official Agreement for OEM/ODM Business)
Page 2/15
CONTENT
FCC WARING STATEMENT .......................................................................................................... 4
IC WARING STATEMENT .............................................................................................................. 4
CAN ICES-3 (B)/NMB-3(B) ............................................................................................................... 6
低功率電波輻射性電機管理辦法 ....................................................................................................... 6
PRODUCT FEATURES .................................................................................................................... 7
PRODUCT SPECIFICATIONS ........................................................................................................ 8
MAIN CHIPSET ....................................................................................................................................... 8
FUNCTIONAL SPECIFICATIONS ............................................................................................................... 8
PIN ASSIGNMENT ............................................................................................................................ 9
CONNECTOR SPEC ....................................................................................................................... 10
MECHANICAL ................................................................................................................................ 11
BLOCK DIAGRAM ......................................................................................................................... 11
ANTENNA SPEC ............................................................................................................................. 12
LABEL DRAWING .......................................................................................................................... 13
MODULE PHOTO ........................................................................................................................... 14
BT BEHAVIOR ................................................................................................................................ 15
LED BEHAVIOR ............................................................................................................................. 15
EEPROM INFORMATION ............................................................................................................ 15
ENVIRONMENTAL ........................................................................................................................ 15
OPERATING .......................................................................................................................................... 15
STORAGE.............................................................................................................................................. 15
Page 3/15
PRODUCT FEATURES

Bluetooth V4.0 specification compliant Backwards compatible with BT version
of 1.1, 1.2, 2.0, 2.1+EDR




Dual-mode Bluetooth low energy radio
80MHz RISC MCU and 80MIPS Kalimba DSP
BT using SPI interface
Bluetooth Profiles:
- HFP v1.6
- HSP v1.2
- A2DP v1.2
- AVRCP v1.4

Stereo codec with 2 microphone inputs


Multipoint HFP connection to 2 phones for voice
Multipoint A2DP connection enables a headset(A2DP) connection to 2 A2DP
source devices for music playback


Secure simple paring, CSR’s proximity pairing and CSR’s proximity connection





Reconnect on Power-on
aptX, SBC, MP3 and AAC decoder support
Fast AGC for enhanced dynamic range
Memorize up to 8 paired devices
RoHS compliance
Low Halogen compliance
Page 7/15
PRODUCT SPECIFICATIONS
MAIN CHIPSET
CSR 8645
FUNCTIONAL SPECIFICATIONS
BT Function
Standard
Bluetooth V4.0 LE
Bus Interface
SPI
Data Rate
1 Mbps, 2Mbps and Up to 3Mbps
Modulation Scheme
GFSK, π/4-DQPSK and 8-DPSK
Frequency Range
2.402~2.480 GHz
Transmit Output Power -3 ≤ Output Power ≤ +3 ; Class 2 Device
Receiver Sensitivity
< 0.1% BER at -80 dBm
Operating Voltage
3.3 V ±9% I/O supply voltage
Power Consumption
Paring Mode:
10 mA
Stereo high quality SBC:
65 mA
Associated Idle Mode:
14 mA
Antenna Type
Metal Antenna
Page 8/15
PIN ASSIGNMENT
Pin.
Pin Name
Type
Description
VBUS
3.3V Power supply
GND
Ground
SPKL_P
Speaker differential output positive, left
SPKL_N
Speaker differential output negative, left
SPKR_P
Speaker differential output positive, right
SPKR_N
Speaker differential output negative, right
GND
Ground
Paring
Active High(1.8V) to enter paring mode
LED
LED driver, Open-Drain
10
VREGENABLE
Active High(3.3V) to enable BT or disable BT
11
MIC1_B
Connect to Ground(Black cable)
12
MIC1_R
Microphone input(Red cable)
13
MIC1_B
Connect to Ground(Black cable)
14
MIC2_R
Microphone input(Red cable)
Page 9/15
CONNECTOR SPEC
Page 10/15
MECHANICAL
BLOCK DIAGRAM
Page 11/15
ANTENNA SPEC
Page 12/15
LABEL DRAWING
Page 13/15
MODULE PHOTO
Top Side
Bottom Side
Page 14/15
BT BEHAVIOR
Item
BT Status
Press Button Timing/Description
Power On
500ms~1s
Enter Paring Mode
Reconnection
Power Off
1s~2s. Keep paring status up to 120s
BT will reconnect with paired device after
Power On.TV FW will turn off BT within
120s if no paired device nearby.
500ms~1s
LED BEHAVIOR
Item
BT Status
LED Behavior
Enable
Steady Off
Paring Mode
Steady Off
A2DP Streaming
Steady On
Associated Idle
Steady On
Disable
Steady Off
Noted: TV FW will turn off BT while LED is no emitting
EEPROM INFORMATION
Vendor ID
0x0A12
Product ID
0x0001
ENVIRONMENTAL
OPERATING
Operating Temperature: 0 to 60 C (32 to 140F)
Relative Humidity: 5-90% (non-condensing)
STORAGE
Temperature: -20 to 70 C (-4 to 158 F)
Relative Humidity: 5-95% (non-condensing
Page 15/15

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About                           : uuid:ed165b62-a40e-4a32-afde-7cd721932437
Producer                        : Microsoft® Word 2013
Modify Date                     : 2014:05:16 15:35:33+08:00
Create Date                     : 2014:05:05 19:25:56+08:00
Creator Tool                    : Microsoft® Word 2013
Metadata Date                   : 2014:05:16 15:35:33+08:00
Document ID                     : uuid:c2390d7c-5566-4b6c-be58-c0aa373d3f05
Format                          : application/pdf
Title                           : LiteOn Technology Corp.
Creator                         : Tracy Chang
Tagged PDF                      : No
Author                          : Tracy Chang
EXIF Metadata provided by EXIF.tools
FCC ID Filing: PPQ-WB117C

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