LITE ON TECHNOLOGY WCBN4516R 802.11a/b/g/n 2Tx2R + BT V4.1LE USB Combo Module User Manual

LITE-ON Technology Corp. 802.11a/b/g/n 2Tx2R + BT V4.1LE USB Combo Module

User Manual

Download: LITE ON TECHNOLOGY WCBN4516R 802.11a/b/g/n 2Tx2R + BT V4.1LE USB Combo Module User Manual
Mirror Download [FCC.gov]LITE ON TECHNOLOGY WCBN4516R 802.11a/b/g/n 2Tx2R + BT V4.1LE USB Combo Module User Manual
Document ID3171511
Application IDnIFnHHDk1BOLlCkG/S2uiw==
Document DescriptionUser Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize340.84kB (4260484 bits)
Date Submitted2016-10-23 00:00:00
Date Available2016-10-23 00:00:00
Creation Date2016-10-07 20:13:19
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Document Lastmod2016-10-10 23:59:21
Document TitleMicrosoft Word - 05.User manual(Revise未完成)
Document CreatorPScript5.dll Version 5.2.2
Document Author: User

PROD
DUCT SPECIIFICA
ATION
802.11a/b/g/n 2Tx2R
+ BT V4.1L
LE USB Combo
Module
WC
CBN4516R
MediaT
Tek MT
T7632TU
Version 1.0
Chaange Historry
Reviision
Verssion 1.0
Date
2016/08/03
Authorr
Ben J C
Chen
Change Liist
Preliminary
* Thhis document contains conffidential proprrietary inform
mation and is property
of LTTC. The conten
nts of
thhis document should
not be disclosed to uunauthorized persons
without the written consent of LT
TC.
Page 1/35
PROD
DUCT SPECIIFICA
ATION
802.111a/b/g/n 2Tx2R
+ BT V4.1L
LE USB Combo
Module
WC
CBN4516R
MediaT
Tek MT
T7632TU
Version 1.0
Nettworking B.U.
Lite-on
Tecchnology Corporation
4F, Noo. 90, Chien
n 1 Rd.,
Chung Ho,
H New Taaipei City 235,
2 Taiwan
n, R.O.C.
(Signature)
Cusstomer Appro
oval:
(Title)
(Company)
(Date)
ign Back by FAX.
For Co
onfirming the S
Spec Only, no
ot an Official Agreement
forr OEM/ODM Business)
Page 2/40
CONTEN
NT
RODUCT FE
EATURES ........................................................................................................................ 4
T FEATURE .............................................................................................................................................. 4
I-FI FEATURE .......................................................................................................................................... 4
OMMON FEATU
URE .................................................................................................................................... 4
RODUCT SP
PECIFICATIONS ........................................................................................................... 5
AIN CHIPSET ........................................................................................................................................... 5
UNCTIONAL SPECIFICATIONS
S................................................................................................................... 5
IN ASSIGME
ENT................................................................................................................................... 8
SB CONNEC
CTOR SPEC......................
.............................................................................................. 8
MECHANICA
AL ...................................................................................................................................... 9
HIELDING CASE
SPEC ......................
............................................................................................ 14
ATERIAL CERT
TIFICATION ...................................................................................................................... 15
CB UL CERT
TIFICATE ..................................................................................................................... 16
.FL CONNEC
CTOR SPEC
C ................................................................................................................ 22
EPROM INF
FORMATION
N ............................................................................................................... 23
T............................................................................................................................................................ 23
I-FI ....................................................................................................................................................... 23
NVIRONME
ENTAL ............................................................................................................................ 23
PERATING .............................................................................................................................................. 23
TORAGE.................................................................................................................................................. 23
ART LIST ........................................................................................................................................... 24
ELIABILITY
Y TEST ITEM
M .............................................................................................................. 29
ACKING DR
RAWING ........................................................................................................................ 31
PPENDIX A: SHIELDING CASE SGS
S REPORT........................................................................ 32
PPENDIX B:: RELIABILIITY TEST R
REPORT ............................................................................. 35
Page 3/35
PRO
ODUCT FEATURES
BT FEATU
URE:
z Bluuetooth V4.1 LE system
Bacckwards com
mpatible withh BT version of 1.1, 1.2, 2.0,
2 2.1, 3.0++HS and 4.0
Bluuetooth Classs 1 transmisssion power
Besst-in-class BT
T/Wi-Fi coexxistence perfformance
Suppport for Sim
mple Pairing ((SP) and Enh
hanced Inquiiry Responsee (EIR) functtion
Suppport for SCA
ATTERNET and up to piiconets simulltaneously w
with backgrou
und
inqquiry/page scan
z Suppport wide-band speech aand hardwaree acceleratedd SBC codec for A2DP
streeaming
z Suppport Wake On
O Bluetoothh
WI-FI FEA
ATURE:
z Opeerate at ISM frequency B
Band (2.4/5G
GHz)
z IEE
EE Standards Support, 8022.11a ,802.11b, 802.11g,, 802.11n
z Suppport for bothh 20 MHz/355 MHz channnel width in 2.4GHz andd 20 MHz/35
MH
Hz channel width
in 5GH
Hz
z Entterprise levell security suppporting: WP
PS2.0,WAPI,, WPA, WPA
A2
z Duaal-stream IEE
EE 802.11n support for 40MHz
chan
nnels providees PHY layerr
ratees up to 300M
Mbps
z QoS
S support of WFA WMM
M, WMMPS
z Suppport for WI--Fi Direct
z Suppport Wake On
O WLAN
COMMON FEATURE:
z MT
T7632TU is a single chip integrated IE
EEE 802.11 a/b/g/n and B
Bluetooth 4.1LE
witth a single USB interfacee
PA,, LNA, and T/R
T switch inntegration for Wi-Fi and Bluetooth
Besst-in-class acctive and idlee power conssumption performance
Fully compliancce with USB
B v2.0 specifiication
Suppport OS: Lin
nux based
RoH
HS complian
nce
Low
w Halogen co
ompliance
Page 4/35
PRO
ODUCT SPECIFICAT
TIONS
MAIN CHIP
PSET
MediaTeek MT7632T
TU
FUNCTIONA
AL SPECIFIC
CATIONS
BT Fu
unction
Standard
Bluuetooth V4.1LE
Bus Interrface
US
SB2.0
Data Ratte
1M
Mbps, 2Mbpss and Up to 3Mbps
Modulatiion Scheme
GF
FSK, /4-DQ
QPSK and 8-D
DPSK
Frequenccy Range
2.4402~2.480 GH
Hz
Transmitt Output Po
ower
+4  Output Po
ower  +10dB
Bm; Class 1 D
Device
Receiver Sensitivity
< 00.1% BER att -80dBm
Wi-Fii Function
Standard
IEE
EE802.11a; IEEE802.11b
b; IEEE 802..11g; IEEE
8022.11n
Bus Interrface
US
SB2.0
Data Ratte
8022.11a:
6, 24, 18, 12, 9, 6 Mbps
54, 48, 36
8022.11b:
11, 5.5, 2,, 1 Mbps
8022.11g:
6, 24, 18, 12, 9, 6 Mbps
54, 48, 36
8022.11n:
MCS 0 to 15 for HT20
0MHz
MCS 0 to 15 for HT40
0MHz
Media Acccess Control
CS
SMA/CA with
h ACK
Modulatiion Techniq
que
Network Architecturre
Operatioon Channel
8022.11a:
PSK, BPSK
64QAM, 16QAM, QP
8022.11b:
CCK, DQ
QPSK, DBPSK
8022.11g:
64QAM, 16QAM, QP
PSK, BPSK
8022.11n:
PSK, BPSK
64QAM, 16QAM, QP
Add-hoc mode (Peer-to-Peerr)
Infr
frastructure mode
2.44GHz
– Uniteed States
11: (Ch. 1-11)
13: (Ch. 1-13)
– Europ
pe
14: (Ch. 1-14)
– Japan
5G
GHz
Page 5/35
21: USA
19: EU
8: Japan
8022.11bg
2.400 ~ 2.4835 GHz
8022.11a
5.15 ~ 5.85 GHz
8022.11a:
-86 dBm@
@6Mbps
-70 dBm@
@54Mbps
8022.11b:
-88 dBm@
@1Mbps
-82 dBm@
@11Mbps
8022.11g:
-86 dBm@
@6Mbps
-71 dBm@
@54Mbps
8022.11n:
22.4G/5G
20MHz
-86 dBm@
@MCS0
-70 dBm@
@MCS7
-68 dBm@
@MCS15
40MHz
-83 dBm@
@MCS0
-67 dBm@
@MCS7
-65 dBm@
@MCS15
WP
PS, WPA, WPA2,
WEP 64bit & 128bbit, IEEE 802.1X,
IEE
EE 802.11i
Frequenccy Range
Receiver Sensitivity
Security
Common
n Function
Operatin
ng Voltage
5 V ±5% I/O su
upply voltage
OS Supp
ported
Linnux Based
Mode
Power Coonsumption
TX
RX
Iddle
WiFi+BT
@wake
upp mode
Antenna Type
Avverage
2.4G
5G
56
60mA
690
0mA
29
90mA
325
5mA
30mA
4.5mA
Peakk
2.4G
850m
mA
5G
920m
mA
Triiple U.FL con
nnectors for plugging Wi
WiFi&BT exteernal
anttenna
Page 6/35
PIN
N ASSIGME
ENT
Pin.
11
Pin Define
GND
DD+
GND
WOB
GND
Pin.
10
12
Pin Deffine
GND
WOW
RESET
T#
VCC
VCC
GND
Top View
USB CONNE
ECTOR SPE
EC
Page 7/35
MECHANICA
AL
Page 8/35
SHIIELDING CASE SPE
EC
Manufacturre: Hun Paii(⬷㷫)
Approval Sh
heet: see Ap
ppendix A(ppage32~pag
ge39)
Page 9/35
Materiaal Certifica
ation
Page 10/35
PC
CB UL CERTIFICAT
TE
Manufacturrer: APCB
Page 11/35
Page 12/35
Man
nufacturer:: BROAD
Page 13/35
Man
nufacturer:: Tripod
Page 14/35
Page 15/35
Page 16/35
U.F
FL CONNE
ECTOR SP
PEC
Page 17/35
EE
EPROM INFORMAT
TION
BT
Vendoor ID
0x0E88D
Produ
uct ID
0x76A
A1
WI-FI
Reg Domain
Worldd Wide
2.44G/5G
Reead from regiistry; Control by driver
Offseet 0x38 for 5G
G: 0xFF
Offseet 0x39 for 2..4G: 0xFF
Vendoor ID
0x0E88D
Devicee ID
0x76A
A1
ENV
VIRONME
ENTAL
OPERATIN
NG
Operaating Temperature: 0 to 770 qC (32 to 158 qF)
Relative Humidity
y: 5-90% (nnon-condensiing)
STORAGE
Tempperature: -40 to 80 qC (-440 to 176 qF)
Relative Humidity
y: 5-95% (nnon-condensiing)
Page 18/35
PAR
RT LIST
Item
m Component_Description
n
O02012.7pF//50V+0.25pFFNPOGRM03
335C1H2R7CA
A01D
CHIPMONO
1
SMD(MURA
ATA)
O02011.5pF//50V+0.25pFFNPOGRM03
335C1H1R5CA
A01D
CHIPMONO
2
SMD(MURA
ATA)
CHIPMONO
O02010.5pF50V+0.25pFNPOGRM03
335C1HR50CA
A01D
3
SMD(MURA
ATA)
CHIPMONO
O02012.7pF//50V+0.25pFFNPOGRM03
335C1H2R7CA
A01D
4
SMD(MURA
ATA)
5CHIPMONO
O020110pF/5
50V+5%NPO
OGRM0335C
C1H100JA01DSMD(MURATTA)
Locatio
on
C1
C10
C11
C13
C14
6CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C15
7CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C15
8CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
CHIPMONO
O02011.5pF//50V+0.25pFFNPOGRM03
335C1H1R5CA
A01D
9
SMD(MURA
ATA)
CHIPMONO
O02012.7pF//50V+0.25pFFNPOGRM03
335C1H2R7CA
A01D
110
SMD(MURA
ATA)
CHIPMONO
O02011.5pF//50V+0.25pFFNPOGRM03
335C1H1R5CA
A01D
111
SMD(MURA
ATA)
112CHIPRES1//20W+5%0o
ohm0201RM
M02JTN0SMD
D(TAI)
C15
C17
C18
C2
C21
113CHIPRES1//20W+5%0o
ohm0201WR
R02X000PALSMD(WALSIN)
C21
114CHIPRES1//20W+5%0o
ohm0201RR00306S000XN
NHSMD(CYNT
TEC)
C21
115CHIPRES1//20W+5%0o
ohm0201RM
M02JTN0SMD
D(TAI)
C23
116CHIPRES1//20W+5%0o
ohm0201WR
R02X000PALSMD(WALSIN)
C23
117CHIPRES1//20W+5%0o
ohm0201RR00306S000XN
NHSMD(CYNT
TEC)
C23
118CHIPRES1//20W+5%0o
ohm0201RM
M02JTN0SMD
D(TAI)
C25
119CHIPRES1//20W+5%0o
ohm0201WR
R02X000PALSMD(WALSIN)
C25
220CHIPRES1//20W+5%0o
ohm0201RR00306S000XN
NHSMD(CYNT
TEC)
C25
221CHIPMONO
O020110pF/5
50V+5%NPO
OGRM0335C
C1H100JA01DSMD(MURATTA)
C3
222CHIPMONO
O02010.6pF//50V+0.1pFN
NPOGRM033
35C1HR60BA0
01DSMD(MU RATA)C32
CHIPMONO
O02014.7pF//50V+0.25pFFNPOGRM03
335C1H4R7CA
A01D
223
C33
SMD(MURA
ATA)
224CHIPMONO
O020110pF/5
50V+5%NPO
OGRM0335C
C1H100JA01DSMD(MURATTA)
C35
225CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C36
226CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C36
227CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
C36
228CHIPMONO
O06034.7uF10V+10%X55R0603X475K100CTSMD(WALSIN)
C37
229CHIPMONO
O06034.7uF//10V+10%X55RLMK107BJJ475KATSMD
D(TAIYOYUDEEN)
C37
330CHIPMONO
O06034.7uF10V+10%X55RC1608X5R475KDTSSMD
D(DARFON)
C37
331CHIPMONO
O0201100pF/25V+5%NPPOCC0201JRNPO8BN101S
SMD(YAGEO)
C38
332CHIPMONO
O0201100pF25V+5%NPPOC0603NP0
0101JFTSSMD
D(DARFON)
C38
333CHIPMONO
O0201100pF25V+5%NPPOGRM0335C
C1E101JA01D
DSMD(MURATTA)
C38
334CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C39
335CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C39
Page 19/35
36CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
O02012.7pF//50V+0.25pFFNPOGRM03
335C1H2R7CA
A01D
CHIPMONO
SMD(MURA
ATA)
38CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
37
C39
C4
C40
39CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C40
40CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
C40
41CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
C41
42CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C41
43CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
C41
44CHIPMONO
O020122pF/2
25V+5%NPO
O0201N220J250CTSMD(W
WALSIN)
C42
45CHIPMONO
O020122pF/2
25V+5%NPO
OC0603NP02
220JFTSSMD(DARFON)
C42
46CHIPMONO
O020122pF/2
25V+5%NPO
OGRM0335C
C1E220JA01DSMD(MURATA
A)
C42
47CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
C44
48CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C44
49CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
C44
50CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
C45
51CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C45
52CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
C45
53CHIPMONO
O060310uF/10V+20%X55RLMK107BJ106MALTDSM
MD(TAIYOYUD
DEN) C47
54CHIPMONO
O060310uF/10V+20%X55RGRM188R6
61A106ME69DSMD(MURA
ATA) C47
55CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
C48
56CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C48
57CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
C48
58CHIPMONO
O04024700p
pF/50V+10% X7R0402B47
72K500CTSMD(WALSIN)
C55
59CHIPMONO
O04024700p
pF/50V+10% X7RGRM155
5R71H472KA0
01DSMD(MU RATA) C55
60CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C57
61CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C57
62CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
C57
63CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
C58
64CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C58
65CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
CHIPMONO
O02010.5pF50V+0.25pFNPOGRM03
335C1HR50CA
A01D
66
SMD(MURA
ATA)
67CHIPMONO
O06032.2uF//10V+10%X55R0603X225
5K100CTSMD((WALSIN)
C58
C6
68CHIPMONO
O06032.2uF//10V+10%X55RCC0603KR
RX5R6BB225S
SMD(YAGEO)
C60
69CHIPMONO
O06032.2uF//10V+10%X55RGRM188R
R61A225KE34D
DSMD(MURA
ATA)
C60
70CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
C61
71CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C61
72CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
C61
73CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C62
74CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C62
75CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
C62
76CHIPMONO
O06032.2uF//10V+10%X55R0603X225
5K100CTSMD((WALSIN)
C68
77CHIPMONO
O06032.2uF//10V+10%X55RCC0603KR
RX5R6BB225S
SMD(YAGEO)
C68
Page 20/35
C60
78CHIPMONO
O06032.2uF//10V+10%X55RGRM188R
R61A225KE34D
DSMD(MURA
ATA)
C68
79CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C69
80CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C69
81CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
C69
82CHIPMONO
O020110pF/5
50V+5%NPO
OGRM0335C
C1H100JA01DSMD(MURATTA)
C7
83CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C70
84CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C70
85CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
C70
86CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
C71
87CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C71
88CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
C71
89CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C72
90CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C72
91CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
C72
92CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C73
93CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C73
94CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
C73
95CHIPMONO
O02010.1uF10V+10%X55RCC0201KRX5R6BB104SMD(YAGEO)
C74
96CHIPMONO
O02010.1uF10V+10%X55RC0603X5R104KDTSSMD
D(DARFON)
C74
97CHIPMONO
O02010.1uF//10V+10%X55RGRM033R
R61A104KE15D
DSMD(MURA
ATA)
C74
98CHIPMONO
O04021uF/10
0V+10%X5R
R0402X105K1
100CTSMD(W
WALSIN)
C75
99CHIPMONO
O04021uF/10
0V+10%X5R
RC1005X5R10
05KDTSSMD(DARFON)
C75
00CHIPMONO
O04021uF/10
0V+10%X5R
RGRM155R61
1A105KE15DS
SMD(MURATA
A)
O02011.5pF//50V+0.25pFFNPOGRM03
335C1H1R5CA
A01D
CHIPMONO
01
SMD(MURA
ATA)
02CHIPMONO
O0201100pF/25V+5%NPPOCC0201JRNPO8BN101S
SMD(YAGEO)
C75
C8
03CHIPMONO
O0201100pF25V+5%NPPOC0603NP0
0101JFTSSMD
D(DARFON)
C80
04CHIPMONO
O0201100pF25V+5%NPPOGRM0335C
C1E101JA01D
DSMD(MURATTA)
C80
05CHIPMONO
O0201100pF/25V+5%NPPOCC0201JRNPO8BN101S
SMD(YAGEO)
C81
06CHIPMONO
O0201100pF25V+5%NPPOC0603NP0
0101JFTSSMD
D(DARFON)
C81
07CHIPMONO
O0201100pF25V+5%NPPOGRM0335C
C1E101JA01D
DSMD(MURATTA)
C81
C80
08CHIPMONO
O060310uF/10V+20%X55RLMK107BJ106MALTDSM
MD(TAIYOYUD
DEN) C85
09CHIPMONO
O060310uF/10V+20%X55RGRM188R6
61A106ME69DSMD(MURA
ATA) C85
10CHIPMONO
O020122pF/2
25V+5%NPO
O0201N220J250CTSMD(W
WALSIN)
C86
11CHIPMONO
O020122pF/2
25V+5%NPO
OC0603NP02
220JFTSSMD(DARFON)
C86
12CHIPMONO
O020122pF/2
25V+5%NPO
OGRM0335C
C1E220JA01DSMD(MURATA
A)
C86
13CHIPMONO
O060310uF/10V+20%X55RLMK107BJ106MALTDSM
MD(TAIYOYUD
DEN) C87
14CHIPMONO
O060310uF/10V+20%X55RGRM188R6
61A106ME69DSMD(MURA
ATA) C87
15CHIPMONO
O020122pF/2
25V+5%NPO
O0201N220J250CTSMD(W
WALSIN)
C88
16CHIPMONO
O020122pF/2
25V+5%NPO
OC0603NP02
220JFTSSMD(DARFON)
C88
17CHIPMONO
O020122pF/2
25V+5%NPO
OGRM0335C
C1E220JA01DSMD(MURATA
A)
C88
18CHIPMONO
O020122pF/2
25V+5%NPO
O0201N220J250CTSMD(W
WALSIN)
C89
19CHIPMONO
O020122pF/2
25V+5%NPO
OC0603NP02
220JFTSSMD(DARFON)
C89
Page 21/35
20CHIPMONO
O020122pF/2
25V+5%NPO
OGRM0335C
C1E220JA01DSMD(MURATA
A)
C89
21CHIPMONO
O020110pF/5
50V+5%NPO
OGRM0335C
C1H100JA01DSMD(MURATTA)
C9
22CHIPMONO
O020122pF/2
25V+5%NPO
O0201N220J250CTSMD(W
WALSIN)
C90
23CHIPMONO
O020122pF/2
25V+5%NPO
OC0603NP02
220JFTSSMD(DARFON)
C90
24CHIPMONO
O020122pF/2
25V+5%NPO
OGRM0335C
C1E220JA01DSMD(MURATA
A)
C90
25CHIPMONO
O020122pF/2
25V+5%NPO
O0201N220J250CTSMD(W
WALSIN)
C91
26CHIPMONO
O020122pF/2
25V+5%NPO
OC0603NP02
220JFTSSMD(DARFON)
C91
27CHIPMONO
O020122pF/2
25V+5%NPO
OGRM0335C
C1E220JA01DSMD(MURATA
A)
C91
28CHIPMONO
O020122pF/2
25V+5%NPO
O0201N220J250CTSMD(W
WALSIN)
C92
29CHIPMONO
O020122pF/2
25V+5%NPO
OC0603NP02
220JFTSSMD(DARFON)
C92
30CHIPMONO
O020122pF/2
25V+5%NPO
OGRM0335C
C1E220JA01DSMD(MURATA
A)
C92
31CHIPMONO
O020122pF/2
25V+5%NPO
O0201N220J250CTSMD(W
WALSIN)
C93
32CHIPMONO
O020122pF/2
25V+5%NPO
OC0603NP02
220JFTSSMD(DARFON)
C93
33CHIPMONO
O020122pF/2
25V+5%NPO
OGRM0335C
C1E220JA01DSMD(MURATA
A)
C93
ULTRAMINICO
OAXRECEPTACCLE3P20279
9001E03SMD
D(㖍⓮ッỗġIIPEX) CON1
34ANTCONU
MINICOAX RECEPTACLES
MD3P AM410000003(枮忋)
35ANTCONM
CON1
ULTRAMINICO
OAXRECEPTACCLE3P20279
9001E03SMD
D(㖍⓮ッỗġIIPEX) CON2
36ANTCONU
MINICOAX RECEPTACLES
MD3P AM410000003(枮忋)
37ANTCONM
CON2
ULTRAMINICO
OAXRECEPTACCLE3P20279
9001E03SMD
D(㖍⓮ッỗġIIPEX) CON3
38 ANTCONU
MINICOAX RECEPTACLES
MD3P AM410000003(枮忋)
39 ANTCONM
CON3
40PinHeaderMale2*612P
PINSMD+R2m
mm SMDCH
H79122M10P CVILUX
J1
41Inductors2
2.7nH@600MH
Hz0.5A+0.1nnH0201 SM
MDLQP03TN2N7B02DMURRATA L1
42Inductors1
1.0nH@500MH
Hz0.75A+0.11nH 0201SM
MDLQP03TN1N0B02DMU
URATA L14
43INDUCTOR5.1nH+3%3
350mA0201LLQP03TN5N1H
H02DSMD(MURATA)
L15
44Inductors2
2.2uH@100KH
Hz1.5A+20%
2.5*2.0*1.0
0SMD
L16
45Inductors2
2.2uH@100KH
Hz1.5A+20%
2.5*2.0*1.0
0SMD
L17
46Inductors2
2.7nH@600MH
Hz0.5A+0.1nnH0201 SM
MDLQP03TN2N7B02DMURRATA L2
47INDUCTOR1.8nH+0.1nH600mA02001LQP03TN1N8B02DSMD(MURATA)
L3
48INDUCTOR1.8nH+0.1nH600mA02001LQP03TN1N8B02DSMD(MURATA)
L4
49INDUCTOR1.8nH+0.1nH600mA02001LQP03TN1N8B02DSMD(MURATA)
L6
50Inductors2
2.7nH@600MH
Hz0.5A+0.1nnH0201 SM
MDLQP03TN2N7B02DMURRATA L7
51Inductors2
2.7nH@600MH
Hz0.5A+0.1nnH0201 SM
MDLQP03TN2N7B02DMURRATA L8
52INDUCTOR1.8nH+0.1nH600mA02001LQP03TN1N8B02DSMD(MURATA)
L9
53CHIPRES1//20W+5%0o
ohm0201RM
M02JTN0SMD
D(TAI)
R100
54CHIPRES1//20W+5%0o
ohm0201WR
R02X000PALSMD(WALSIN)
R100
55CHIPRES1//20W+5%0o
ohm0201RR00306S000XN
NHSMD(CYNT
TEC)
R100
56CHIPRES1//20W+5%0o
ohm0201RM
M02JTN0SMD
D(TAI)
R104
57CHIPRES1//20W+5%0o
ohm0201WR
R02X000PALSMD(WALSIN)
R104
58CHIPRES1//20W+5%0o
ohm0201RR00306S000XN
NHSMD(CYNT
TEC)
R104
59CHIPRES1//20W+1%5.1K0201RC02201FR075K1LSMD(YAGEO
O)
R15
60CHIPRES1//20W+1%5.1K0201RM002FTN5101SM
MD(TAI)
R15
61CHIPRES1//20W+1%5.1K0201WR002X5101FALSSMD(WALSIN)
R15
62CHIPRES1//16W+1%20
0ohm0402RCC0402FR0720RLSMD(YAG
GEO)
R20
Page 22/35
63CHIPRES1//16W+1%20
0ohm0402W
WR04X20R0FTTLSMD(WALSIIN)
R20
64CHIPRES1//20W+5%1K
K0201RM02JJTN102SMD(TAI)
R7
65CHIPRES1//20W+5%1K
K0201WR02XX102JALSMD
D(WALSIN)
R7
66CHIPRES1//20W+5%1K
K0201RR03066S102JNHSSMD(CYNTEC)
R7
67CHIPRES1//20W+5%0o
ohm0201RM
M02JTN0SMD
D(TAI)
R91
68CHIPRES1//20W+5%0o
ohm0201WR
R02X000PALSMD(WALSIN)
R91
69CHIPRES1//20W+5%0o
ohm0201RR00306S000XN
NHSMD(CYNT
TEC)
R91
70CHIPRES1//20W+5%0o
ohm0201RM
M02JTN0SMD
D(TAI)
R92
71CHIPRES1//20W+5%0o
ohm0201WR
R02X000PALSMD(WALSIN)
R92
72CHIPRES1//20W+5%0o
ohm0201RR00306S000XN
NHSMD(CYNT
TEC)
R92
73CHIPRES1//20W+5%10
00K0201RC02201JR07100
0KLSMD(YAGE
EO)
R95
74CHIPRES1//20W+5%10
00K0201RM002JTN104 SM
MD(TAI)
R95
75CHIPRES1//20W+5%10
00K0201WR002X104JALSMD(WALSIN)
R95
76CHIPRES1//20W+5%10
00K0201RC02201JR07100
0KLSMD(YAGE
EO)
R96
77CHIPRES1//20W+5%10
00K0201RM002JTN104 SM
MD(TAI)
R96
78CHIPRES1//20W+5%10
00K0201WR002X104JALSMD(WALSIN)
R96
79CHIPRES1//20W+1%22
2.1K0201RC00201FR0722K1LSMD(YAG
GEO)
R97
80CHIPRES1//20W+1%22
2.1K0201RM 02FTN2212SSMD(TAI)
R97
81CHIPRES1//20W+1%22
2.1K0201WR
R02X2212FALSMD(WALSIN
N)
R97
82BandPassFFilter5.0GHz1
1.6*0.8mmSM
MD DP1608
8A2455DGT/LLFACXC
U1
83BandPassFFilter5.0GHz1
1.6*0.8mmSM
MD DP1608
8A2455DGT/LLFACXC
U2
84(Amtran)W
WLAN+Bluetoo
othQFN76PIN
NSMD MT7632TUNMEDIATEK
U4
85Crystals_SM
MD40MHz10.0ppm11.5pFF 3.2*2.5*0..7SMDTZ274
46ATAISAW
U5
86LowPassFilter2.4GHz DEA162500LTT5033A2TDK
K
U7
87RegulatorIC
C2.55.5V1A 0.WDFN 6 .0PINSMD(A
ADJACENT
U8
88RigidPCBW
WCBN4507RW
WLANFR4OSPP1oz4 49*1
18*11TRIPOD
D
89RigidPCBW
WCBN4507RW
WLANFR4OSPP1oz4 49*1
18*11BROAD
DTECH
90RigidPCBW
WCBN4507RW
WLANFR4OSPP1oz4 49*1
18*11APCB
AlloyWCBN45
503RB:shieldiing 㲳䘥戭 ġFORWCBN45
503RAND
91Stamping_A
Page 23/35
RELIABILITY
Y TEST ITE
EM
Test Report:: see Appen
ndix C(pagee45~page78
8)
Test Item
Test
Time
Test Condition
Test Estim
mated Date
Q'ty of Completion
1. E
Environmenttal Test
1.1 T
Thermal meassurement test
1.2 H
High Temperaature Test
(Opeerating)
1.3 L
Low Temperaature Test
(Opeerating)
1.4 T
Temp. and Huumidity Cyclicc
Test (Operational))
1.5 H
High Temperaature Test
(Storrage)
1.6 L
Low Temperaature Test
(Storrage)
1.7 H
High Temperaature & High
Hum
midity (Storagee)
21hrs
Teemperature 25
5°C&40°C&60°C,
6hhrs/Temp
96hrs Teemperature 60
0°C
96hrs Teemperature 0°°C
Completed
Completed
10
Completed
96hrs Teemperature 60
0°C, Humidity
y 90%RH.
Completed
96hrs Teemperature 80
0°C
Completed
96hrs Teemperature -2
25°C
Completed
96hrs Teemperature 60
0°C, Humidity
y 90%RH
10
Completed
1.8 T
Thermal Shocck Test
(Storrage)
Loow temperaturre: -40°C 30m
min
ure: 100°C 30m
min
24hrs Hiigh temperatu
Teest cycles: 20ccycles
Completed
1.9 C
Cold Start Tessting
6hrs
Completed
Teemperature 0°°C
1.10 Longtime Coonnection Testt
(Opeerating)
168hrs Teemperature 60
0°C
10
Completed
1.11 MTBF Demoonstration
1. Temperature Condition: 40
0°C.
2. To check DU
UTs’ function everyday
76days
3. Change ART
T mode and au
uto radiate
duuring the test event
25
Completed
Completed
Completed
10
Completed
101.12 Open Shorrt Test
1.13 Electrostatic
Disccharge(ESD) Test
3hrs
3hrs
3.33V
Aiir +/- 8KV
Coontact +/- 4KV
2. M
Mechanical Test
2.1 D
Drop Test (Unnit and
Packkage)
Unnit
1. Drop height: 78cm
2. Drop Plane: steel
plate
3. Sample: 10PC
CS
4. Drop Sequen
nces: 6 sides, 4 edges
24hrs Paackage
1. Drop height: 91cm
2. Drop Plane: steel
plate
3. Sample: 1 Caarton
4. Drop Sequen
nces: 1 corner,, 3 edge
annd 6 face
Page 24/35
Vibration Testt (Unit and
kage)
Unnit and Package (Random)
1. Frequency: 5 ~ 250Hz
2. Acceleration = 1.0Grms
3. Each of X, Y,
Y Z axis/ 60 min
4. Sample: 10U
Units and 1 Carrton
Unnit and Package (Sine)
1. Frequency: 5 ~ 250Hz
5.5hrs 2. Acceleration = 1.0Grms
3. Each of X, Y,
Y Z axis/ 30 min
4. Sample: Unitts and 1 Carton
Unnit (Random)
1. Frequency: 10 ~ 1000Hz
2. Acceleration = 6~8Grms
3. Each of X, Y,
Y Z axis/ 20 min
4. Sample: Unitts
1. System ON Time:
Power on
o Time 5
seec + Op 5 sec System
Power ON/OF
FF Cycling Teest 50hrs 2. OFF Time: 10 seconds
3. ON/OFF Cyccle Time: 15 seconds
4. Test Cycle: 12000
Cycles
Salt Mist Test
Saalt Solution: 5 wt.% NaCl solution
PH
H of solution: 6.5~7.2
Teemperature: 35±2°C
48hrs
Quuantity of fog
g: 1.0~2.0 ml/ 80 cm2/
hoour
Exxposing duratiion: 48 hours
Page 25/35
10
Completed
10
Completed
Completed
PAC
CKING DRAWING
Page 26/35
APPPENDIX A: SHIELDIING CASE SGS REPPORT
Page 27/35
Page 28/35
Page 29/35
Page 30/35
Page 31/35
Page 32/35
Page 33/35
Page 34/35
APPPENDIX B: RELIABIILITY TESST REPORT
Page 35/35
FCC Statement:
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one of the following measures:
● Reorient or relocate the receiving antenna.
● Increase the separation between the equipment and receiver.
● Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
● Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible
for compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
For product available in the USA/Canada market, only channel 1~11 can be operated.
Selection of other channels is not possible.
This device and its antenna(s) must not be co‐located with any other transmitters except in
accordance with FCC multi‐transmitter product procedures.
IMPORTANT NOTE:
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20
cm between the radiator & your body.
IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is responsible for the
compliance to all the rules that apply to the product into which this certified RF module is
integrated.
Additional testing and certification may be necessary when multiple modules are used.
20 cm minimum distance has to be able to be maintained between the antenna and the
users for the host this module is integrated into. Under such configuration, the FCC radiation
exposure limits set forth for an population/uncontrolled environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the
user's authority to operate this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20
cm separation with the antenna while this end product is installed and operated. The end
user has to be informed that the FCC radio‐frequency exposure guidelines for an
uncontrolled environment can be satisfied. The end user has to also be informed that any
changes or modifications not expressly approved by the manufacturer could void the user's
authority to operate this equipment. If the size of the end product is smaller than 8x10cm,
then additional FCC part 15.19 statement is required to be available in the users manual:
This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC
ID: PPQ‐WCBN4516R ". If the size of the end product is larger than 8x10cm, then the
following FCC part 15.19 statement has to also be available on the label: This device
complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1)
this device may not cause harmful interference and (2) this device must accept any
interference received, including interference that may cause undesired operation.
OEM Integrator Checklist
The party below will implement the LITE‐ON Module in host systems in accordance with the
instructions specified in this document and the documents referenced herein.
1. The OEM integrator will ensure the Module is integrated in a host systems using only the
approved antenna model(s) described in this document.
BT:Walsin / RFPCA291503IMAB301 / PCB Antenna / Gain: 4.85 dBi
WiFi_1:Walsin / RFPCA251523IMLB301 / PCB Antenna / 2.4G Gain: 3.94 dBi, 5G Gain: 5.52
dBi
WiFi_2:Walsin / RFPCA361507IMLB301 / PCB Antenna / 2.4G Gain: 4.4 dBi, 5G Gain: 5.67
dBi
2. The OEM integrator will ensure the antenna placement inside the host system will
maintain the required spacing to end user for RF Exposure compliance, as specified in this
document.
3. If other radios are integrated inside the host with the LITE‐ON Module, the OEM
integrator will contact its test lab, TCB or LITE‐ON to determine if additional FCC compliance
evaluation is required to meet FCC collocation rules.
4. The OEM integrator will ensure end user documentation will contain the specified
regulatory wording and ensure the host system and the Module itself are labeled as
specified in this document.
5. The OEM integrator will ensure the Module is programmed in the factory with compliant
transmit power not exceeding the levels specified in this document.
LITE‐ON requests that the OEM integrator acknowledge its receipt of this document and the
above instructions. You may contact LITE‐ON with any questions concerning this document
or the responsibilities of the OEM integrator.
IC Statement:
This device complies with Industry Canada license‐exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil
ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
For product available in the USA/Canada market, only channel 1~11 can be operated.
Selection of other channels is not possible.
Pour les produits disponibles aux États‐Unis / Canada du marché, seul le canal 1 à 11
peuvent être exploités. Sélection d'autres canaux n'est pas possible.
This device and its antenna(s) must not be co‐located with any other transmitters except in
accordance with IC multi‐transmitter product procedures.
Refering to the multi‐transmitter policy, multiple‐transmitter(s) and module(s) can be
operated simultaneously without reassessment permissive change.
Cet appareil et son antenne (s) ne doit pas être co‐localisés ou fonctionnement en
association avec une autre antenne ou transmetteur.
The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the
potential for harmful interference to co‐channel mobile satellite systems.
les dispositifs fonctionnant dans la bande 5150‐5250 MHz sont réservés uniquement pour
une utilisation à l’intérieur afin de réduire les risques de brouillage préjudiciable aux
systèmes de satellites mobiles utilisant les mêmes canaux.
The maximum antenna gain permitted for devices in the band 5725‐5850 MHz shall be such
that the equipment still complies with the e.i.r.p. limits specified for point‐to‐point and
non‐point‐to‐point operation as appropriate.
le gain maximal d’antenne permis (pour les dispositifs utilisant la bande 5725‐5850 MHz)
doit se conformer à la limite de p.i.r.e. spécifiée pour l’exploitation point à point et non
point à point, selon le cas.
Dynamic Frequency Selection (DFS) for devices operating in the bands 5250‐ 5350 MHz,
5470‐5600 MHz and 5650‐5725 MHz.
Sélection dynamique de fréquences (DFS) pour les dispositifs fonctionnant dans les bandes
5250‐5350 MHz, 5470‐5600 MHz et 5650‐5725 MHz.
The maximum antenna gain permitted for devices in the bands 5250‐5350 MHz and
5470‐5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit.
le gain maximal d’antenne permis pour les dispositifs utilisant les bandes 5250‐5350 MHz et
5470‐5725 MHz doit se conformer à la limite de p.i.r.e.
Users should also be advised that high‐power radars are allocated as primary users (i.e.
priority users) of the bands 5250‐5350 MHz and 5650‐5850 MHz and that these radars could
cause interference and/or damage to LE‐LAN devices.
De plus, les utilisateurs devraient aussi être avisés que les utilisateurs de radars de haute
puissance sont désignés utilisateurs principaux (c.‐à‐d., qu’ils ont la priorité) pour les bandes
5250‐5350 MHz et 5650‐5850 MHz et que ces radars pourraient causer du brouillage et/ou
des dommages aux dispositifs LAN‐EL.
Pour une utilisation en intérieur uniquement.
IMPORTANT NOTE:
IC Radiation Exposure Statement:
This equipment complies with IC RSS‐102 radiation exposure limits set forth for an
uncontrolled
environment. This equipment should be installed and operated with minimum distance 20
cm
between the radiator & your body.
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum
de 20 cm de distance entre la source de rayonnement et votre corps.
This module is intended for OEM integrator. The OEM integrator is still responsible for the IC
compliance requirement of the end product, which integrates this module.
Any changes or modifications not expressly approved by the manufacturer could void the
user's authority to operate this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20
cm separation with the antenna while this end product is installed and operated. The end
user has to be informed that the IC radio‐frequency exposure guidelines for an uncontrolled
environment can be satisfied. The end user has to also be informed that any changes or
modifications not expressly approved by the manufacturer could void the user's authority to
operate this equipment. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference and (2) this device must accept any interference
received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX IC:
4491A‐WCBN4516R ".

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