Laird Connectivity BL652 Bluetooth 4.2 module (BLE only) User Manual

Laird Technologies Bluetooth 4.2 module (BLE only) Users Manual

Users Manual

Datasheet

BL652-SA and BL652-SC

Version 1.1

BL652

Datasheet

Embedded Wireless Solutions Support Center:

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REVISION HISTORY

Version

Date

Notes

Approver

1.0

20 July 2016

Initial Release

Jonathan Kaye

1.1

30 Aug 2016

Corrected Operating Temperature voltage to read

VCC 1.8 V-3.6 V rather than 1.7 V-3.6V

Corrected minor formatting issues and typo

Changed the SIO_02 pin # (OTA mode table) to 23 vs. 21

Raj Khatri

BL652 
Datasheet 
Embedded Wireless Solutions Support Center: 
http://ews-support.lairdtech.com 
www.lairdtech.com/bluetooth 
3 
© Copyright 2016 Laird. All Rights Reserved 
Americas: +1-800-492-2320 
Europe: +44-1628-858-940 
Hong Kong: +852 2923 0610 
 
   
CONTENTS 
1  Overview and Key Features ................................................................................................................................. 4 
2  Specification ......................................................................................................................................................... 5 
3  Hardware Specifications ...................................................................................................................................... 9 
4  Power Consumption .......................................................................................................................................... 19 
5  Functional Description ....................................................................................................................................... 34 
  Power Management (includes Brown-out and Power on Reset) ......................................................... 34 
  Clocks and Timers ................................................................................................................................. 35 
  Memory for smartBASIC Application Code .......................................................................................... 35 
  Radio Frequency (RF) ............................................................................................................................ 35 
  NFC ........................................................................................................................................................ 35 
  UART Interface ...................................................................................................................................... 36 
  SPI Bus ................................................................................................................................................... 37 
  I2C Interface.......................................................................................................................................... 37 
  General Purpose I/O, ADC, PWM and FREQ ......................................................................................... 38 
  nRESET pin ............................................................................................................................................ 39 
  nAutoRUN pin ....................................................................................................................................... 39 
  vSP Command Mode ............................................................................................................................ 39 
 Two-wire Interface JTAG ...................................................................................................................... 40 
  BL652 Wakeup ...................................................................................................................................... 42 
  Low Power Modes ................................................................................................................................ 42 
  Temperature Sensor ............................................................................................................................. 42 
  Random Number Generator ................................................................................................................. 42 
  AES Encryption/Decryption .................................................................................................................. 42 
  Optional External Serial (SPI) Flash ....................................................................................................... 43 
  Optional External 32.768 kHz crystal.................................................................................................... 43 
  BL652-SA On-board Chip Antenna Characteristics ............................................................................... 45 
6  Hardware Integration Suggestions .................................................................................................................... 46 
  Circuit .................................................................................................................................................... 46 
  PCB Layout on Host PCB - General ....................................................................................................... 48 
  PCB Layout on Host PCB for BL652-SA ................................................................................................. 48 
  External Antenna Integration with BL652-SC ....................................................................................... 50 
7  Mechanical Details ............................................................................................................................................. 51 
8  Application Note for Surface Mount Modules .................................................................................................. 53 
  Introduction .......................................................................................................................................... 53 
  Shipping ................................................................................................................................................ 53 
  Reflow Parameters ............................................................................................................................... 55 
9  FCC and IC Regulatory Statements .................................................................................................................... 58 
10  Japan (MIC) Regulatory ...................................................................................................................................... 62 
11  CE Regulatory ..................................................................................................................................................... 63 
12  EU Declarations of Conformity .......................................................................................................................... 64 
13  Ordering Information ......................................................................................................................................... 65 
14  Bluetooth SIG Qualification ............................................................................................................................... 65 
 

BL652

Datasheet

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1 OVERVIEW AND KEY FEATURES

Every BL652 Series module is designed to enable OEMs to add single-mode Bluetooth Low Energy (BLE) v4.2 to

small, portable, power-conscious devices. The BL652 modules are supported with Laird’s smartBASIC, an event-

driven programming language that enables OEMs to make their BLE product development quicker and simpler,

significantly reducing time to market. smartBASIC enables customers to develop a complete embedded application

inside the compact BL652 hardware, connecting to a wide array of external sensors via its I2C, SPI, UART, ADC or

GPIO interfaces. The BL652 also provides flexibility in the OEM’s application development choice with full support

for using Nordic’s SDK and firmware tools.

Based on the world-leading Nordic Semiconductor nRF52832 chipset, the BL652 modules provide ultra-low power

consumption with outstanding wireless range via 4 dBm of transmit power. A broad range of BLE profiles including

Temperature and Heart Rate are available, and smartBASIC provides the ideal mechanism to support any BLE

profile development of your choice. This document should be read in conjunction with the smartBASIC user

manual.

Note: BL652 hardware is functionally capable as the nRF52832 chipset used in the module design.

Not all features are currently exposed within Laird’s smartBASIC firmware implementation.

Features and Benefits

 Bluetooth v4.2 - Single mode

 NFC-A Listen mode compliant

 External or internal antennas

 smartBASIC programming language or Nordic SDK

 Compact footprint

 Programmable Tx power +4 dBm to -20 dBm

 Tx whisper mode (-40 dBm)

 Rx sensitivity: -96 dBm

 Ultra-low power consumption

 Tx: 5.3 mA peak (at 0 dBm, DCDC on) – See Power

Consumption section Note 1

 Rx: 5.4 mA peak (DCDC on) – See Power

Consumption section Note 1

 Standby Doze: 1.2 uA typical

 Deep Sleep: 0.4 uA – See Power Consumption

section Note 4

 UART, GPIO, ADC, PWM, FREQ output, timers,

I2C, and SPI interfaces

 Fast time-to-market

 FCC, CE, IC, and Japan certified; Full Bluetooth

Declaration ID

 Other regulatory certifications on request (all

certifications are in process)

 No external components required

 Industrial temperature range (-40 to + 85)

Application Areas

 Medical devices

 Wellness devices

 iOS “appcessories”

 Fitness sensors

 Location awareness

 Home automation

Note: Figures on this page are gathered from the nRF52 datasheet provided by Nordic.

BL652

Datasheet

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2 SPECIFICATION

Specification Summary

Table 1: BL652 Specifications

Categories

Feature

Implementation

Operating Modes

Self-contained Run mode

Selected by nAutoRun pin status: LOW (0V).

Then runs $autorun$ (smartBASIC application

script) if it exists.

Interactive/Development mode

HIGH (VCC).

Then runs via at+run (and file name of smartBASIC

application script).

Supply Voltage

Supply (VCC)

1.8- 3.6 V – Internal DCDC converter or LDO

(See Note 5)

Power

Consumption

(See Note 5)

Active Modes Peak Current (for

maximum Tx power +4 dBm)

– Radio only

Advertising mode

7.5 mA peak Tx (with DCDC)

Connecting mode

5.4 mA peak Tx (with DCDC)

Active Modes Peak Current (for

Tx Whisper mode2 power -40

dBm) – Radio only

Advertising mode

2.7 mA peak Tx (with DCDC)

Connecting mode

5.4 mA peak Tx (with DCDC)

Active Modes Average Current

Depends on many factors, see Power Consumption.

Ultra Low Power Modes

Standby Doze

Deep Sleep

1.2 uA typical (Note 6)

400 nA (Note 6)

Antenna Options

Internal

Ceramic chip monopole antenna – on-board

BL652-SA variant

External

Dipole antenna (with IPEX connector)

Dipole PCB antenna (with IPEX connector)

Connection via IPEX MH4 – BL652-SC variant

See the Antenna Information sections for FCC and

IC, MIC, and CE.

Physical

Dimensions

14 mm x 10 mm x 2.1 (TBC) mm

Pad Pitch: 0.75 mm

Pad Type: Plated half-moon edge pads (easy to

hand solder)

Weight

<1 gram

Environmental

Operating

-40 ˚C to +85 ˚C (VCC 1.8V-3.6V)

Storage

-40 ˚C to +85 ˚C

Miscellaneous

Lead Free

Lead-free and RoHS compliant

Warranty

Five-year Limited Lifetime

Development

Tools

Development Kit

Development kit (DVK-BL652-xx) and free software

tools

Approvals

Bluetooth®

Full Bluetooth SIG Declaration ID

FCC / IC / CE / MIC

All BL652 Series

Module Specification Notes:

Note 1

DSR, DTR, RI, and DCD can be implemented in the smartBASIC application.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Module Specification Notes:

Note 2

With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL must be connected externally as

per I2C standard.

Note 3

SPI interface (master) consists of SPI MOSI, SPI MISO, and SPI CLK. SPI CS is created by using any

spare SIO pin within the smartBASIC application script allowing multi-dropping.

Note 4

The BL652 module comes loaded with smartBASIC runtime engine firmware but does not come

loaded with any smartBASIC application script (as that is dependent on customer-end application or

use). Laird provides many sample smartBASIC application scripts covering the services listed.

Additional BLE services are being added every quarter.

Note 5

Use of the internal DCDC convertor or LDO is decided by the underlying BLE stack.

Note 6

These figures are measured on the BL652-Sx-xx.

 Deep Sleep current for BL652-Sx-xx ~400nA (typical)

 Standby Doze current for BL652-xx-A1 1.2uA (typical)

Note 7

PWM output signal has a frequency and duty cycle property. PWM output is generated using

dedicated hardware in the chipset. There is a trade-off between PWM output frequency and

resolution.

For example:

 PWM output frequency of 500 kHz (2 uS) results in resolution of 1:2.

 PWM output frequency of 100 kHz (10 uS) results in resolution of 1:10.

 PWM output frequency of 10 kHz (100 uS) results in resolution of 1:100.

 PWM output frequency of 1 kHz (1000 uS) results in resolution of 1:1000.

Refer to the smartBASIC user guide for details. It’s available from the Laird BL652 product page.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

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3 HARDWARE SPECIFICATIONS

Block Diagram and Pin-out

Figure 1: BL652 Block diagram

Figure 2: Functional HW and SW block diagram for BL652 series BLE smartBASIC module

BL652

Datasheet

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Figure 3: BL652-Sx module pin-out (top view)

Pin Definitions

Table 2: Pin definitions

Pin Name

Default

Function

Alternate

Function

In/

Out

Pull

Up/

Down

nRF52832

QFN Pin

nRF52832

QFN Name

Comment

GND

SIO_24/

SPI_MISO

SIO_24

SPI_MISO

PULL-

PO.24

Laird Devkit: SPI EEPROM.

SPI_Eeprom_MISO, Input.

SPIOPEN() in smartBASIC selects

SPI function; MOSI and CLK are

outputs when in SPI master mode.

SIO_23/

SPI_MOSI

SIO_23

SPI_MOSI

PULL-

PO.23

Laird Devkit: SPI EEPROM.

SPI_Eeprom_MOSI, Output

SPIOPEN() in smartBASIC selects

SPI function, MOSI and CLK are

outputs in SPI master.

SIO_22

PULL-

PO.22

Laird Devkit: SPI EEPROM.

SPI_Eeprom_CS, Input

SWDIO

PULL-

SWDIO

BL652

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Pin Name

Default

Function

Alternate

Function

In/

Out

Pull

Up/

Down

nRF52832

QFN Pin

nRF52832

QFN Name

Comment

SWDCLK

PULL-

DOWN

SWDCLK

nRESET

PULL-

PO.21/

nRESET

System Reset (Active Low)

SIO_20/

SFLASH_MOSI

SIO_20

SFLASH_MOSI

PULL-

PO.20

Laird Devkit: Optional External

serial SPI flash for data logging

purpose.

High level API in smartBASIC can

be used for fast access using

open/close/read/write API

functions.

SIO_18

PULL-

PO.18

SIO_16/

SFLASH_CLK

SIO_16

SFLASH_CLK

PULL-

PO.16

Laird Devkit: Optional External

serial SPI flash for data logging

purpose.

High level API in smartBASIC can

be used for fast access using

open/close/read/write API

functions.

SIO_14/

SFLASH_MISO

SIO_14

SFLASH_MISO

PULL-

PO.14

SIO_12/

SFLASH_CS

SIO_12

SFLASH_CS

PULL-

PO.12

SIO_11

PULL-

PO.11

Laird Devkit: BUTTON1

NFC2/

SIO_10

NFC2

SIO_10

PO.10/NFC2

NFC1/

SIO_09

NFC1

SIO_09

PO.09/NFC1

GND

SIO_08/

UART_RX

SIO_08

UART_RX

PULL-

PO.08

UARTCLOSE() selects DIO

functionality

UARTOPEN() selects UART

COMMS behaviour

SIO_07/

UART_CTS

SIO_07

UART_CTS

PULL-

DOWN

PO.07

SIO_06/

UART_TX

SIO_06

UART_TX

OUT

Set

High in

PO.06

SIO_05/

UART_RTS/

AIN3

SIO_05

UART_RTS/

AIN3

OUT

Set Low

in FW

PO.05/AIN3

SIO_04/

AIN2

SIO_04

AIN2

PULL-

PO.04/AIN2

Internal pull-down

SIO_03/

AIN1

SIO_03

AIN1

PULL-

PO.03/AIN1

Laird Devkit: Temp Sens Analog

or Arduino Analog

BL652

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Pin Name

Default

Function

Alternate

Function

In/

Out

Pull

Up/

Down

nRF52832

QFN Pin

nRF52832

QFN Name

Comment

SIO_02/

AIN0

SIO_02

AIN0

PULL-

DOWN

PO.02/AIN0

Internal pull-down

SIO_01/

XL2

SIO_01

XL2

PULL-

PO.01/XL2

Laird Devkit: Optional 32.768kHz

crystal pad XL2

SIO_00/

XL1

SIO_00

XL1

PULL-

PO.00/XL1

Laird Devkit: Optional 32.768kHz

crystal pad XL1

VDD_nRF

1.7V to 3.6V

GND

SIO_13/

nAutoRUN

SIO_13

PULL-

DOWN

PO.13

Laird Devkit: FTDI USB_DTR via

jumper on J12pin1-2.

SIO_15

PULL-

PO.15

Laird Devkit: BUTTON2

SIO_17

PULL-

PO.17

Laird Devkit: LED1

SIO_19

PULL-

PO.19

Laird Devkit: LED2

SIO_31/

AIN7

SIO_31

AIN7

PULL-

PO.31/AIN7

SIO_30/

AIN6

SIO_30

AIN6

PULL-

PO.30/AIN6

SIO_29/

AIN5

SIO_29

AIN5

PULL-

PO.29/AIN5

SIO_28/

AIN4

SIO_28

AIN4

PULL-

PO.28/AIN4

SIO_27/

I2C_SCL

SIO_27

I2C_SCL

PULL-

PO.27

Laird Devkit: I2C RTC chip. I2C

clock line.

SIO_26/

I2C_SDA

SIO_26

I2C_SDA

PULL-

PO.26

Laird Devkit: I2C RTC chip. I2C

data line.

SIO_25/

SPI_CLK

SIO_25

SPI_CLK

PULL-

PO.25

Laird Devkit: SPI EEPROM.

SPI_Eeprom_CLK, Output

SPIOPEN() in smartBASIC selects

SPI function, MOSI and CLK are

outputs when in SPI master mode.

GND

Pin Definition Notes:

Note 1

Secondary function is selectable in smartBASIC application.

BL652

Datasheet

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www.lairdtech.com/bluetooth

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Hong Kong: +852 2923 0610

Pin Definition Notes:

Note 2

DIO = Digital Input or Output.

I/O voltage level tracks VCC.

Note 3

AIN = Analog Input

Note 4

DIO or AIN functionality is selected using the GpioSetFunc() function in smartBASIC.

Note 5

AIN configuration selected using GpioSetFunc() function.

Note 6

I2C, UART, SPI controlled by xxxOPEN() functions in smartBASIC.

Note 7

SIO_5 to SIO_8 are DIO by default when $autorun$ app runs on power-up.

Note 8

JTAG (two-wire SWD interface), pin 5 (SWDIO) and pin 6 (SWDCLK).

JTAG is NOT required for customer use. Upgrading smartBASIC runtime engine firmware or loading

the smartBASIC applications is done using the UART interface.

Note 9

Pull the nRESET pin (pin 7) low for minimum 100 milliseconds to reset the BL652.

Note 10

SPI CS is created by using any spare SIO pin within their smartBASIC application script allowing multi-

dropping.

Note 11

The SIO_02 pin must be pulled high externally to enable an OTA (over-the-air) smartBASIC

application download. Refer to the latest firmware release documentation for details.

Note 12

Ensure that SIO_02 (pin 23) and AutoRUN (pin 28) are not both high (externally), in that state, the

UART is bridged to Virtual Serial Port service; the BL652 module does not respond to AT commands

and cannot load smartBASIC application scripts.

Note 13

The smartBASIC runtime engine has DIO (Default Function) INPUT pins, which are set PULL-UP by

default. This avoids floating inputs (which can cause current consumption to drive with time in low

power modes (such as StandbyDoze). You can disable the PULL-UP through your smartBASIC

application.

All of the SIO pins (with a default function of DIO) are inputs (apart from SIO_05 and SIO_08, which

are outputs):

 SIO_06 (alternative function UART_TX) is an output, set High (in the firmware).

 SIO_05 (alternative function UART_RTS) is an output, set Low (in the firmware).

 SIO_08 (alternative function UART_RX) is an input, set with internal pull-up (in the firmware).

 SIO_07 (alternative function UART_CTS) is an input, set with internal pull-down (in the

firmware).

BL652

Datasheet

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www.lairdtech.com/bluetooth

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Pin Definition Notes:

 SIO_02 is an input set with internal pull-down (in the firmware). It is used for OTA downloading

of smartBASIC applications. Refer to the latest firmware release documentation for details.

Note 14

Not required for BL652 module normal operation. If you fit an external serial (SPI) flash for data

logging purposes, then that external serial (SPI) flash must connect to BL652 module pins SIO_12

(SFLASH_CS), SIO_14 (SFLASH_MISO), SIO_16 (SFLASH_CLK), and SIO_20 (SFLASH_MOSI); in that

case, a high level API in smartBASIC can be used for fast access using open/close/read/write API

functions.

By default, these are GPIO pins. Only when in their FlashOpen() smartBASIC app are these lines

dedicated to SPI and for talking to the off-board flash.

If you decide to use an external serial (SPI) flash with BL652-SX-xx, then ONLY the manufacturer part

numbers below MUST be used:

 4 Mbit Macronix MX25R4035F

http://www.macronix.com/Lists/DataSheet/Attachments/3288/MX25R4035F,%20Wide%20Ran

ge,%204Mb,%20v1.2.pdf

 8 Mbit Macronix MX25R8035F

http://www.macronix.com/Lists/DataSheet/Attachments/3532/MX25R8035F,%20Wide%20Ran

ge,%208Mb,%20v1.2.pdf

smartBASIC does not provide access to any external serial (SPI) flash other than these part numbers.

Note 15

Not required for BL652 module normal operation. The on-chip 32.768kHz RC oscillator provides the

standard accuracy of ±250 ppm, with calibration required every 8seconds (default) to stay within

±250 ppm.

BL652 also allows as an option to connect an external higher accuracy (±20 ppm) 32.768 kHz crystal

to the BL652-SX-xx pins SIO_01/XL2 (pin 24) and SIO_00/XL1 (pin 25). This provides higher accuracy

protocol timing and helps with radio power consumption in the system standby doze/deep sleep

modes by reducing the time that the Rx window must be open.

The BL652 module is delivered with the integrated smartBASIC runtime engine firmware loaded (but no onboard

smartBASIC application script). Therefore it boots into AT command mode by default.

At reset, all SIO lines are configured as the defaults shown above.

SIO lines can be configured through the smartBASIC application script to be either inputs or outputs with pull-ups

or pull-downs. When an alternative SIO function is selected (such as I2C or SPI), the firmware does not allow the

setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up resistors on I2C SDA and

I2C SCL must be connected externally as per I2C standard.

UART_RX, UART_TX, and UART_CTS are 3.3 V level logic (if VCC is 3.3 V; such as SIO pin I/O levels track VCC). For

example, when Rx and Tx are idle, they sit at 3.3 V (if VCC is 3.3 V). Conversely, handshaking pins CTS and RTS at

0V are treated as assertions.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

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Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Pin 28 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BL652-xx) it is connected so

that the state is driven by the host’s DTR output line. The nAutoRUN pin must be externally held high or low to

select between the following two BL652 operating modes:

 Self-contained Run mode (nAutoRUN pin held at 0V –this is the default (internal pull-down enabled))

 Interactive/Development mode (nAutoRUN pin held at VCC)

The smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low

and if there is a smartBASIC application script named $autorun$, then the smartBASIC runtime engine firmware

executes the application script automatically; hence the name Self-contained Run Mode.

Electrical Specifications

3.3.1 Absolute Maximum Ratings

Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed

below; exceeding these values causes permanent damage.

Table 3: Maximum current ratings

Parameter

Min

Max

Unit

Voltage at VDD_nRF pin

-0.3

+3.9 (Note 1)

Voltage at GND pin

Voltage at SIO pin (at VDD_nRF≤3.6V)

-0.3

VDD_nRF +0.3

Voltage at SIO pin (at VDD_nRF≥3.6V)

-0.3

3.9

NFC antenna pin current (NFC1/2)

Radio RF input level

dBm

Environmental

Storage temperature

-40

+85

ºC

MSL (Moisture Sensitivity Level)

ESD (as per EN301-489)

Conductive

Air Coupling

Flash Memory (Endurance) (Note 2)

10000

Write/erase cycles

Flash Memory (Retention)

10 years at 40°C

Maximum Ratings Notes:

Note 1

The absolute maximum rating for VCC pin (max) is 3.9V for the BL652-Sx-xx.

Note 2

Wear levelling is used in file system.

3.3.2 Recommended Operating Parameters

Table 4: Power supply operating parameters

Parameter

Min

Typ

Max

Unit

VDD_nRF (independent of DCDC)1

1.8

3.3

3.6

BL652

Datasheet

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Parameter

Min

Typ

Max

Unit

VCC Maximum ripple or noise2

VCC rise time (0 to 1.7V)3

Operating Temperature Range

-40

+85

ºC

Recommended Operating Parameters Notes:

Note 1

4.7 uF internal to module on VCC. In smartBASIC runtime engine firmware, use of the internal DCDC

convertor or LDO is decided by the underlying BLE stack.

Note 2

This is the maximum VCC ripple or noise (at any frequency) that does not disturb the radio.

Note 3

The on-board power-on reset circuitry may not function properly for rise times outside the noted

interval.

Table 5: Signal levels for interface, SIO

Parameter

Min

Typ

Max

Unit

VIH Input high voltage

0.7 VDD_nRF

VDD_nRF

VIL Input low voltage

VSS

0.3 x VDD_nRF

VOH Output high voltage

(std. drive, 0.5mA) (Note 1)

(high-drive, 3mA) (Note 1)

(high-drive, 5mA) (Note 2)

VDD_nRF -0.4

VDD_nRF

VOL Output low voltage

(std. drive, 0.5mA) (Note 1)

(high-drive, 3mA) (Note 1)

(high-drive, 5mA) (Note 2)

VSS

VSS+0.4

VOL Current at VSS+0.4V,Output set low

(std. drive, 0.5mA) (Note 1)

(high-drive, 3mA) (Note 1)

(high-drive, 5mA) (Note 2)

VOL Current at VDD_nRF -0.4, Output set low

(std. drive, 0.5mA) (Note 1)

(high-drive, 3mA) (Note 1)

(high-drive, 5mA) (Note 2)

Pull up resistance

kΩ

Pull down resistance

kΩ

Pad capacitance

Pad capacitance at NFC pads

BL652

Datasheet

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http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

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Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Signal Levels Notes:

Note 1

For VDD_nRF≥1.7V. The smartBASIC firmware supports high drive (3 mA, as well as standard drive).

Note 2

For VDD_nRF≥2.7V. The smartBASIC firmware supports high drive (5 mA (since VDD_nRF≥2.7V), as

well as standard drive).

Table 6: SIO pin alternative function AIN (ADC) specification

Parameter

Min

Typ

Max

Unit

ADC Internal reference voltage

-1.5%

0.6 V

+1.5%

ADC pin input

internal selectable scaling

4, 2, 1, 1/2,

1/3, 1/4, 1/5

1/6

scaling

ADC input pin (AIN) voltage maximum without

damaging ADC w.r.t1

VCC Prescaling

0V-VDD_nRF 4, 2, 1, ½, 1/3, ¼, 1/5, 1/6

VDD+0.3

Configurable via smartBASIC

Resolution

8bit

mode

10bit mode

12bit mode

bits

Configurable via smartBASIC2

Acquisition Time, source resistance ≤10kΩ

Acquisition Time, source resistance ≤40kΩ

Acquisition Time, source resistance ≤100kΩ

Acquisition Time, source resistance ≤200kΩ

Acquisition Time, source resistance ≤400kΩ

Acquisition Time, source resistance ≤800kΩ

Conversion Time3

ADC input impedance (during operation)3

Input Resistance

Sample and hold capacitance at maximum gain

2.5

MOhm

Recommended Operating Parameters Notes:

Note 1

Stay within internal 0.6 V reference voltage with given pre-scaling on AIN pin and do not violate ADC

maximum input voltage (for damage) for a given VCC, e.g. If VCC is 3.6V, you can only expose AIN pin

to VDD+0.3 V. Default pre-scaling is 1/6 which configurable via smartBASIC.

Note 2

smartBASIC runtime engine firmware allows configurable resolution (8-bit, 10-bit or 12-bit mode)

and acquisition time. The sampling frequency is limited by the sum of sampling time and acquisition

time. The maximum sampling time is 2us. For acquisition time of 3us the total conversion time is

therefore 5us, which makes maximum sampling frequency of 1/5us = 200kHz. Similarly, if acquisition

time of 40us chosen, then the conversion time is 42us and the maximum sampling frequency is

1/42us = 23.8kHz

Note 3

ADC input impedance is estimated mean impedance of the ADC (AIN) pins.

BL652

Datasheet

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http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

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Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

3.3.3 nAutoRUN Pin and Operating Modes

Operating modes (refer to the smartBASIC guide for details):

 Self-contained mode

 Interactive/Development mode

Table 7: nAutoRUN pin

Signal Name

Pin #

I/O

Comments

nAutoRUN /(SIO_13)

Input with active low logic. Internal pull down (default).

Operating mode selected by nAutoRun pin status:

 If Low (0V), runs $autorun$ if it exists

 If High (VCC), runs via at+run (and file name of application)

Pin 28 (nAutoRUN) is an input, with active low logic. In the development board (DVK-BL652-xx) it is connected so

that the state is driven by the host’s DTR output line. nAutoRUN pin needs to be externally held high or low to

select between the two BL652 operating modes:

 Self-contained Run mode (nAutoRUN pin held at 0V).

 Interactive/Development mode (nAutoRUN pin held at VCC).

smartBASIC runtime engine firmware checks for the status of nAutoRUN during power-up or reset. If it is low

AND if there is a smartBASIC application named $autorun$, the smartBASIC runtime engine executes the

application automatically; hence the name self-contained run mode.

3.3.4 OTA (Over-the-Air) smartBASIC Application Download

Refer to latest firmware release documentation (firmware release notes and smartBASIC user guide) for details.

Table 8: OTA mode

Signal Name

Pin #

I/O

Comments

SIO_02

Internal pull down (default).

OTA mode selected by externally pulling-up SIO_02 pin:

High (VCC), then OTA smart BASIC application download is possible.

The OTA smartBASIC application download feature can be useful for production because it allows the module to

be soldered into an end product without pre-configuration; the application can then be downloaded over-the-air

once the product has been pre-tested.

Note: It is the smartBASIC application that is downloaded over-the-air and NOT the firmware. Since this is

principally designed for use in production with multiple programming stations in a locality, the

transmit power is limited (to lower Tx power). See the smartBASIC user guide for more details.

BL652

Datasheet

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http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

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Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

4 POWER CONSUMPTION

Data taken at VCC_nRF of 3.0 V with internal (to chipset) LDO ON or with internal (to chipset) DCDC ON

(see Note 1) and 25ºC.

Power Consumption

Table 9: Power consumption

Parameter

Min

Typ

Max

Unit

Active mode ‘peak’ current (Note 1)

(Advertising or Connection)

Tx only run peak current @ Txpwr = +4 dBm

Tx only run peak current @ Txpwr = 0 dBm

Tx only run peak current @ Txpwr = -4 dBm

Tx only run peak current @ Txpwr = -8 dBm

Tx only run peak current @ Txpwr = -12 dBm

Tx only run peak current @ Txpwr = -16 dBm

Tx only run peak current @ Txpwr = -20 dBm

With DCDC [with LDO]

7.5 [16.6]

5.3 [11.6]

4.2 [9.3]

3.8 [8.4]

3.5 [7.7]

3.3 [7.3]

3.2 [7.0]

Tx Whisper mode 1 (Note 2)

Tx only run peak current @ Txpwr = -40 dBm

2.7 [5.9]

Active Mode

Rx only ‘peak’ current (Note 2)

5.4 [11.7]

Ultra Low Power Mode 1 (Note 2)

Standby Doze, no RAM retention

1.2

Ultra Low Power Mode 2 (Note 3)

Deep Sleep (no RAM retention)

400

Active Mode Average current (Note 4)

Advertising Average Current draw

Max, with advertising interval (min) 20 mS

Min, with advertising interval (max) 10240 mS

Connection Average Current draw

Max, with connection interval (min) 7.5 mS

Min, with connection interval (max) 4000 mS

~511

~3.2

~513

~2.9

Power Consumption Notes:

Note 1

This is for Peak Radio Current only, but there is additional current due to the MCU, refer to Table 12

and Table 15 for the peak and "Average Advert/connection (burst) current" consumption profile

(with DCDC on) during advertising and connection versus TX power. In smartBASIC runtime engine

firmware, use of the internal DCDC convertor or LDO is decided by the underlying BLE stack.

Note 2

BL652-Sx-xx: Standby Doze is 1.2uA typical. Standby Doze is entered automatically (when a waitevent

statement is encountered within a smartBASIC application script). In Standby Doze, all peripherals

BL652

Datasheet

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that are enabled stay on and may re-awaken the chip. Depending on active peripherals, current

consumption ranges from ~1.2 µA to 270 uA (when UART is ON). See individual peripherals current

consumption data in the Peripheral Block Current Consumption section. smartBASIC runtime engine

firmware has added new functionality to detect GPIO change with no current consumption cost, it is

possible to close the UART and get to the 1.2uA current consumption regime and still be able to

detect for incoming data and be woken up so that the UART can be re-opened at expense of losing

that first character.

Note 3

In Deep Sleep, everything is disabled and the only wake-up sources (including NFC to wakeup) are

reset and changes on SIO or NFC pins on which sense is enabled. The current consumption seen is

~400 nA typical in BL652-Sx-xx.

 smartBASIC runtime engine firmware requires a hardware reset to come out of deep sleep.

 smartBASIC runtime engine firmware also allows coming out from Deep Sleep to Standby Doze

through GPIO signal through the reset vector. Deep Sleep mode is entered with a command in

smartBASIC application script.

Note 4

Data taken with a transmit power of 4 dBm and all peripherals off (UART OFF after radio event), slave

latency of 0 (in a connection). Average current consumption depends on a number of factors

(including Tx power, VCC, accuracy of 32MHz and 32.768 kHz). With these factors fixed, the largest

variable is the advertising or connection interval set.

Advertising Interval range:

 20 milliseconds to 10240 milliseconds in multiples of 0.625 milliseconds for the following Advert

type: ADV_IND and ADV_DIRECT_IND

 100 milliseconds to 10240 milliseconds in multiples of 0.625 milliseconds for the following

Advert types: ADV_SCAN_IND and ADV_NONCONN_IND

For advertising timeout, if the advert type is ADV_DIRECT_IND, then the timeout is limited to

1.28 seconds (1280 milliseconds).

For an advertising event:

 The minimum average current consumption is when the advertising interval is large 10240 mS

(although this may cause long discover times (for the advertising event) by scanners

 The maximum average current consumption is when the advertising interval is small 20 mS

Other factors that are also related to average current consumption include the advertising

payload bytes in each advertising packet and whether it’s continuously advertising or

periodically advertising.

Connection Interval range:

 7.5 milliseconds to 4000 milliseconds in multiples of 1.25 milliseconds.

For a connection event:

 The minimum average current consumption is when the connection interval is large 4000

milliseconds

 The maximum average current consumption is with the shortest connection interval of 7.5 ms;

no slave latency.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Other factors that are also related to average current consumption include:

 Whether transmitting six packets per connection interval with each packet containing 20 bytes

(which is the maximum for each packet)

 An inaccurate 32.768 kHz master clock accuracy would increase the average current

consumption.

Measured Current Waveforms during Advertising and Connection

The following figures illustrate current waveforms observed as the BL652 module performs advertising and

connection functionality.

TX power – 4 dBm

Advert duration ~4.377 ms

29 byte payload

Advertising interval – 20 ms

Figure 4: Typical peak current consumption profile (with DCDC ON) during advertising in slave mode @ TX PWR +4 dBm. UART is OFF

TX: <8.8 mA

TX: 8.8 mA

RX: 6 mA

Average current for BLE Advert

RX: 6 mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power – 4 dBm

Interval – 7.5 ms

29 byte payload

Advertising interval – 20 ms

Figure 5: Typical peak current consumption profile (with DCDC ON) during data connection event in slave mode @ TX PWR +4dBm

UART is OFF

Note: In the above pictures, UART is OFF. Y-axis current (1.3 mA per square).

To make things easier the average current during the whole BLE event is shown in the plot above, and then the

BLE event total charge consumption is found by multiplying the average current over the BLE event with the

length of the event. This charge can then be used to extrapolate the average current for different advertising

intervals, by dividing by the interval. Then the StandbyDoze (IDLE) current must be added to give the total

average current. In this example we can calculate the average current to be:

The total charge of the BLE event:

BLE_charge = BLE_avg * BLE_length

The average current consumed by the BLE event for a specific interval:

BLE_avg = BLE_charge / (BLE_interval + perturbation)

The perturbation is given as a random number between 0 and 10 milliseconds added to the interval to prevent

advertisers to periodically transmit at the exact same time. This averages to 5 milliseconds.

TX: 8.55 mA

RX: 6 mA

Average current for BLE connection

BL652

Datasheet

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http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

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Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Adding the IDLE current (StandbyDoze mode) to the inactive part of the interval:

TOT_avg = BLE_avg + IDLE * (BLE_interval - BLE_length) / BLE_interval

Performing the calculation with the numbers 25mS advertising internal and TX power for 4dBm for example:

BLE_charge = 4.377 ms * 2.91 mA = 12.74 uC

BLE_avg = 12.74 uC / 25 ms + 5 ms) = 509.78 uA

TOT_avg = 509.78 uA + 2 uA * (25 ms - 4.377 ms)/25 ms = 511.43 uA

Table 10 and Table 11 display the measured "Average Advert (Burst) current" (for a given TX power) which can be

used to calculate the Total average current for any advertising interval.

Table 12 and Table 13 display the measured "Average Connection (Burst) current" (for a given TX power) which

can be used to calculate the Total average current for any connection interval.

The following table (Table 10) shows the measured total average current consumption profile (with DCDC on)

during advertising in slave mode versus TX power for a minimum advertising interval of 25 milliseconds. Note

that UART is off.

Table 10: Measured total average current consumption profile – for a minimum advertising interval of 25 ms

Power

(dBm)

Average

Advert

(Burst)

Current

(uA)

Average

Advert

(Burst)

Duration

(mS)

BLE

Advert

Charge

(uC)

BLE Advert

Interval

20 mS plus

5 mS

Perturbation

BLE

Advert

Average

(uA)

Max

Standby

Doze

Current

(uA)

BLE Advert

Interval

20 mS plus

5 mS

Pertubation

Total

Average

Current

(uA)

2911.726

4.377

12744.625

509.785

511.435

2431.095

4.377

10640.903

425.636

427.286

-4

2163.884

4.377

9471.320

378.853

380.503

-8

2151.602

4.377

9417.562

376.702

378.352

-12

2086.596

4.377

9133.031

365.321

366.971

-16

2052.041

4.377

8981.783

359.271

360.921

-20

2029.615

4.377

8883.625

355.345

356.995

-40

1960.112

4.377

8579.410

343.177

344.826

The following table (Table 11) shows the measured total average current consumption profile (with DCDC on)

during advertising in slave mode versus TX power for a maximum advertising interval of 10240 milliseconds. Note

that UART is off.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Table 11: Measured total average current consumption profile – for a minimum advertising interval of 10240 ms

Power

(dBm)

Average

Advert

(Burst)

Current

(uA)

Average

Advert

(Burst)

Duration

(mS)

BLE

Advert

Charge

(uC)

BLE Advert

Interval

10240 mS

plus 5 mS

Perturbation

BLE

Advert

Average

(uA)

Max

Standby

Doze

Current

(uA)

BLE Advert

Interval

10240 mS

plus 5 mS

Perturbation

Total

Average

Current

(uA)

2911.726

4.377

12744.625

10245

1.244

10245

3.243

2431.095

4.377

10640.903

10245

1.039

10245

3.038

-4

2163.884

4.377

9471.320

10245

0.924

10245

2.924

-8

2151.602

4.377

9417.562

10245

0.919

10245

2.918

-12

2086.596

4.377

9133.031

10245

0.891

10245

2.891

-16

2052.041

4.377

8981.783

10245

0.877

10245

2.876

-20

2029.615

4.377

8883.625

10245

0.867

10245

2.866

-40

1960.112

4.377

8579.410

10245

0.837

10245

2.837

Table 12 displays measured peak and "Average Advert (burst) current" consumption profile (with DCDC on)

during advertising in slave mode versus TX power. Between Marker 1 and 2 is the average BLE advert current.

Table 12: Measured average advert (burst) current consumption profiles (with DCDC on) during advertising in slave mode vs TX power

TX power: 4 dBm

Advert

29 byte payload

20 ms interval

Average BLE advert current burst

(excluding advertising interval): 2.911 mA

Aside:

Peak TX current: 8.8 mA

Peak RX current: 6 mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power: 0 dBm

Advert

29 byte payload

20 ms interval

Average BLE advert current burst

(excluding advertising interval): 2.431 mA

Aside:

Peak TX current: 6 mA

Peak RX current: 6 mA

TX power: -4 dBm

Advert

29 byte payload

20 ms interval

Average BLE advert current burst

(excluding advertising Interval): 2.163 mA

Aside:

Peak TX current: 4.98 mA

Peak RX current: 5.99 mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power: -8 dBm

Advert

29 byte payload

20 ms interval

Average BLE advert current burst

(excluding advertising Interval): 2.151 mA

Aside:

Peak TX current: 4.59 mA

Peak RX current: 5.98 mA

TX power: -12 dBm

Advert

29 byte payload

20 ms interval

Average BLE advert current burst

(excluding advertising Interval): 2.086 mA

Aside:

Peak TX current: 4.34 mA

Peak RX current: 5.99 mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power: -16 dBm

Advert

29 byte payload

20 ms interval

Average BLE advert current burst

(excluding advertising Interval): 2.052 mA

Aside:

Peak TX current: 4.16 mA

Peak RX current: 5.99 mA

TX power: -20 dBm

Advert

29 byte payload

20 ms interval

Average BLE advert current burst

(excluding advertising Interval): 2.029 mA

Aside:

Peak TX current: 4.03 mA

Peak RX current: 5.99 mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power: -40 dBm

Advert

29 byte payload

20 ms interval

Average BLE advert current burst

(excluding advertising Interval): 1.960 mA

Refer to table for worked out total BLE

advert average current for given

advertising interval.

Aside:

Peak TX current: 3.6 mA

Peak RX current: 6.01 mA

Table 13 and Table 14 has the measured "Average Connection (Burst) current" (for a given TX power) which can

be used to calculate the Total average current for any connection interval.

Table 13: Measured Total average current consumption profile (with DCDC ON) during connection in slave mode versus TX POWER for

minimum Connection interval of 7.5 mS. UART is OFF

power

(dBm)

Average

Connection

(Burst)

Current (uA)

Average

Connection

(Burst)

Duration

(mS)

BLE

Connection

Charge

(uC)

BLE

Connection

Interval

(mS)

BLE

Connection

Average

(uA)

Max

Standby

Doze

Current

(uA)

BLE

Connection

Interval

7.5 ms

Total

Average

Current

(uA)

1670.956

2.3

3843.199

7.5

512.427

7.5

513.813

1560.069

2.3

3588.159

7.5

478.421

7.5

479.808

-4

1513.156

2.3

3480.259

7.5

464.035

7.5

465.421

-8

1492.133

2.3

3431.906

7.5

457.587

7.5

458.974

-12

1488.407

2.3

3423.336

7.5

456.445

7.5

457.831

-16

1469.042

2.3

3378.797

7.5

450.506

7.5

451.893

-20

1454.618

2.3

3345.621

7.5

446.083

7.5

447.470

-40

1428.215

2.3

3284.895

7.5

437.986

7.5

439.373

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Table 14: Measured Total average current consumption profile (with DCDC ON) during connection in slave mode versus TX POWER for

minimum Connection interval of 4000mS. UART is OFF

power

(dBm)

Average

Connection

(Burst)

Current (uA)

Average

Connection

(Burst)

Duration

(mS)

BLE

Connection

Charge

(uC)

BLE

Connection

Interval

(mS)

BLE

Connection

Average

(uA)

Max

Standby

Doze

Current

(uA)

BLE

Connection

Interval

7.5 ms

Total

Average

Current

(uA)

1670.956

2.3

3843.199

4000

0.961

4000

2.960

1560.069

2.3

3588.159

4000

0.897

4000

2.896

-4

1513.156

2.3

3480.259

4000

0.870

4000

2.869

-8

1492.133

2.3

3431.906

4000

0.858

4000

2.857

-12

1488.407

2.3

3423.336

4000

0.856

4000

2.855

-16

1469.042

2.3

3378.797

4000

0.845

4000

2.844

-20

1454.618

2.3

3345.621

4000

0.836

4000

2.835

-40

1428.215

2.3

3284.895

4000

0.821

4000

2.820

Table 15 displays the typical peak and "Average Connection (Burst) current" consumption profile (with DCDC on)

during a connection event in slave mode versus TX power. Between Marker 1 and 2 is the average BLE

connection current.

Table 15: Average connection current consumption profiles during a connection event in slave mode

TX power: 4 dBm

Connection

29 byte payload

7.5 ms interval

Average BLE connection burst current

(excluding connection Interval): 1.67 mA

Aside:

Peak RX current: 5.95mA

Peak TX current: 8.55mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power: 0 dBm

Connection

29 byte payload (2.3 ms)

7.5 ms interval

Average BLE connection burst current

(excluding connection Interval): 1.56 mA

Aside:

Peak RX current: 5.92 mA

Peak TX current: 5.96 mA

TX power: -4 dBm

Connection

29 byte payload (2.3 ms)

7.5 ms interval

Average BLE connection burst current

(excluding connection Interval): 1.513

Aside:

Peak RX current: 5.94 mA

Peak TX current: 4.95 mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power: -8 dBm

Connection

29 byte payload (2.3 ms)

7.5 ms interval

Average BLE connection burst current

(excluding connection Interval): 1.492

Aside:

Peak RX current: 5.92 mA

Peak TX current: 4.58 mA

TX power: -12 dBm

Connection

29 byte payload (2.3 ms)

7.5 ms interval

Average BLE connection burst current

(excluding connection Interval):

1.488 mA

Aside:

Peak RX current: 5.93 mA

Peak TX current: 4.30 mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power: -16 dBm

Connection

29 byte payload (2.3 ms)

7.5 ms interval

Average BLE connection burst current

(excluding connection Interval):

1.469 mA

Aside:

Peak RX current: 5.94 mA

Peak TX current: 4.17 mA

TX power: -20 dBm

Connection

29 byte payload (2.3 ms)

7.5 ms interval

Average BLE connection burst current

(excluding connection Interval):

1.454 mA

Aside:

Peak RX current: 5.95 mA

Peak TX current: 4.03 mA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

TX power: -40 dBm

Connection

29 byte payload (2.3 ms)

7.5 ms interval

Average BLE connection burst current

(excluding connection Interval):

1.428 mA

Aside:

Peak RX current: 5.94 mA

Peak TX current: 3.62 mA

Peripheral Block Current Consumption

The values below are calculated for a typical operating voltage of 3V.

Table 16: UART power consumption

Parameter

Min

Typ

Max

Unit

UART Run current @ 115200 bps

UART Run current @ 1200 bps

Idle current for UART (no activity)

UART Baud rate

1.2

1000

kbps

Table 17: power consumption

Parameter

Min

Typ

Max

Unit

SPI Master Run current @ 2 Mbps

SPI Master Run current @ 8 Mbps

SPI bit rate

0.125

Mbps

Table 18: I2C power consumption

Parameter

Min

Typ

Max

Unit

I2C Run current @ 100 kbps

I2C Run current @ 400 kbps

I2C Bit rate

100

400

kbps

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Table 19: ADC power consumption

Parameter

Min

Typ

Max

Unit

ADC current during conversion

700

The above current consumption is for the given peripheral only and to operate that peripheral requires some

other internal blocks which consume base current. This base current is consumed when the UART, SPI, I2C, or

ADC is opened (operated).

For asynchronous interface like the UART (asynchronous as the other end can communicate at any time), the

UART on the BL652 must be kept open (by a command in smartBASIC application script), resulting in the base

current consumption penalty.

For a synchronous interface like the I2C or SPI (since BL652 side is the master), the interface can be closed and

opened (by a command in smartBASIC application script) only when needed, resulting in current saving (no base

current consumption penalty). There’s a similar argument for ADC (open ADC when needed).

5 FUNCTIONAL DESCRIPTION

The BL652 BLE (Bluetooth Low Energy) module is a self-contained product and requires only power and a user’s

smartBASIC application to implement full BLE functionality. The integrated, high performance antenna combined

with the RF and base-band circuitry provides the BLE wireless link, and any of the SIO lines provide the OEM’s

chosen interface connection to the sensors. The user’s smartBASIC application binds the sensors to the BLE

wireless functionality.

The variety of hardware interfaces and the smartBASIC programming language allow the BL652 module to serve

a wide range of wireless applications while reducing overall time to market and the learning curve for developing

BLE products.

To provide the widest scope for integration, a variety of physical host interfaces/sensors are provided. The major

BL652 series module functional blocks described below.

Power Management (includes Brown-out and Power on Reset)

Power management features:

 System Standby Doze and Deep Sleep modes

 Open/Close Peripherals (UART, SPI, I2C, SIO’s, ADC, NFC). Peripherals consume current when open; each

peripheral can be individually closed to save power consumption (with a command in a smartBASIC

application script)

 Use of the internal DCDC convertor or LDO is decided by the underlying BLE stack

 smartBASIC command allows the VCC voltage to be read (through the internal ADC)

 Pin wake-up system from deep sleep (including from NFC pins)

Power supply features:

 Supervisor hardware to manage power during reset, brownout, or power fail.

 1.8V to 3.6V supply range using internal DCDC convertor or LDO decided by the underlying BLE stack.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Clocks and Timers

5.2.1 Clocks

The integrated high accuracy 32 MHz (±10 ppm) crystal oscillator helps with radio operation and reducing power

consumption in the active modes.

The integrated on-chip 32.768 kHz RC oscillator (±250 ppm) provides protocol timing and helps with radio power

consumption in the system StandByDoze and Deep Sleep modes by reducing the time that the RX window needs

to be open.

To keep the on-chip 32.768 kHz RC oscillator within ±250 ppm (which is needed to run the BLE stack) accuracy,

RC oscillator needs to be calibrated (which takes 16-17 mS) regularly. The default calibration interval is eight

seconds which is enough to keep within ±250 ppm. The calibration interval ranges from 0.25 seconds to 31.75

seconds (in multiples of 0.25 seconds) and configurable via smartBASIC command at+cfg210.

5.2.2 Timers

In keeping with the event driven paradigm of smartBASIC, the timer subsystem enables smartBASIC applications

to be written which allow future events to be generated based on timeouts.

 Regular Timer – There are eight built-in timers (regular timers) derived from a single RTC clock which are

controlled solely by smart BASIC functions. The resolution of the regular timer is 976 microseconds.

 Tick Timer – A 31-bit free running counter that increments every (1) millisecond. The resolution of this

counter is 488 microseconds. Use the functions GetTickCount() and GetTickSince() to access this counter.

Refer to the smart BASIC User Guide available from the Laird BL652 product page.

Memory for smartBASIC Application Code

You have up to 32 kbytes of data memory available for smart BASIC application script.

Radio Frequency (RF)

 2402–2480 MHz Bluetooth Low Energy radio (one Mbps over the air data rate).

 Tx output power of +4 dBm programmable (via smartBASIC command) to -20 dBm in steps of 4 dB.

 Tx Whisper mode1 -40 dBm (via smartBASIC command).

 Receiver (with integrated channel filters) to achieve maximum sensitivity -96 dBm @ 1 Mbps BLE.

 RF conducted interface available in the following two ways:

– BL652-SA: RF connected to on-board antenna on BL652-SA

– BL652-SC: RF connected to on-board IPEX MH4 RF connector on BL652-SC

 Antenna options:

– Integrated monopole chip antenna on BL652-SA

– External dipole antenna connected with to IPEX MH4 RF connector on BL652-SC

NFC

NFC-A Listen mode compliant:

 Based on NFC forum specification

– 13.56 MHz

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

– Date rate 106 kbps

– NFC-A tag (can only be a target/tag; cannot be an initiator)

 Modes of Operation:

– Disable

– Sense

– Activated

5.5.1 Use Cases

 Touch-to Pair with NFC

 Launch a smartphone app (on Android)

 NFC enabled Out-of-Band Pairing

 System Wake-On-Field function

– Proximity Detection

UART Interface

The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial communication

with built-in flow control support (UART_CTS, UART_RTS) in HW up to one Mbps baud. Parity checking and

generation for the ninth data bit are supported.

UART_TX, UART_RX, UART_RTS, and UART_CTS form a conventional asynchronous serial data port with

handshaking. The interface is designed to operate correctly when connected to other UART devices such as the

16550A. The signaling levels are nominal 0 V and 3.3 V (tracks VCC) and are inverted with respect to the signaling

on an RS232 cable.

Two-way hardware flow control is implemented by UART_RTS and UART_CTS. UART_RTS is an output and

UART_CTS is an input. Both are active low.

These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS, UART_RTS are

all 3.3 V level logic (tracks VCC). For example, when RX and TX are idle they sit at 3.3 V. Conversely for

handshaking pins CTS, RTS at 0 V is treated as an assertion.

The module communicates with the customer application using the following signals:

 Port/TxD of the application sends data to the module’s UART_RX signal line

 Port/RxD of the application receives data from the module’s UART_TX signal line

Figure 6: UART signals

Note: The BL652 serial module output is at 3.3V CMOS logic levels (tracks VCC). Level conversion must be

added to interface with an RS-232 level compliant interface.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Some serial implementations link CTS and RTS to remove the need for handshaking. We do not recommend

linking CTS and RTS other than for testing and prototyping. If these pins are linked and the host sends data at the

point that the BL652 deasserts its RTS signal, then there is significant risk that internal receive buffers will

overflow, which could lead to an internal processor crash. This will drop the connection and may require a power

cycle to reset the module. We recommend that the correct CTS/RTS handshaking protocol be adhered to for

proper operation.

Table 20: UART interface

Signal Name

Pin No

I/O

Comments

SIO_06 / UART_Tx

SIO_06 (alternative function UART_Tx) is an output, set high

(in firmware).

SIO_08 / UART_Rx

SIO_08 (alternative function UART_Rx) is an input, set with internal

pull-up (in firmware).

SIO_05 / UART_RTS

SIO_05 (alternative function UART_RTS) is an output, set low

(in firmware).

SIO_07 / UART_CTS

SIO_07 (alternative function UART_CTS) is an input, set with internal

pull-down (in firmware).

The UART interface is also used to load customer developed smartBASIC application script.

SPI Bus

The SPI interface is an alternate function on SIO pins, configurable by smartBASIC.

The module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CS is implemented using

any spare SIO digital output pins to allow for multi-dropping.

The SPI interface enables full duplex synchronous communication between devices. It supports a 3-wire (SPI_MOSI,

SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from multiple slaves. Individual chip select

signals are necessary for each of the slave devices attached to a bus, but control of these is left to the application

through use of SIO signals. I/O data is double-buffered.

The SPI peripheral supports SPI mode 0, 1, 2, and 3.

Table 21: SPI interfaces

Signal Name

Pin No

I/O

Comments

SPI_MOSI

This interface is an alternate function configurable by

smartBASIC. Default in the FW pin 3 and 38 are SIO inputs. SPIOPEN() in

smartBASIC selects SPI function and changes pin 3 and 38 to outputs (when in SPI

master mode).

SPI_MISO

SPI_CLK

SPI_CS

SPI_CS is implemented using any spare SIO digital output pins to allow for

multi-dropping. On Laird devboard SIO_22 (pin4) used as SPI_CS.

I2C Interface

The I2C interface is an alternate function on SIO pins, configurable by smartBASIC command.

The two-wire interface can interface a bi-directional wired-OR bus with two lines (SCL, SDA) and has master

/slave topology. The interface is capable of clock stretching. Data rates of 100 kbps and 400 kbps are supported.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR type bus consisting

of two lines which normally sit at VCC. The BL652 module can only be configured as an I2C master with additional

constraint that it be the only master on the bus. The SCL is the clock line which is always sourced by the master

and SDA is a bi-directional data line which can be driven by any device on the bus.

IMPORTANT: It is essential to remember that pull-up resistors on both SCL and SDA lines are not provided in

the module and MUST be provided external to the module.

Table 22: I2C interface

Signal Name

Pin No

I/O

Comments

I2C_SDA

I/O

This interface is an alternate function on each pin, configurable by

smartBASIC. I2COPEN() in smartBASIC selects I2C function.

I2C_SCL

I/O

General Purpose I/O, ADC, PWM and FREQ

5.9.1 GPIO

The 19 SIO pins are configurable by smartBASIC. They can be accessed individually. Each has the following user

configured features:

 Input/output direction

 Output drive strength (standard drive 0.5 mA or high drive 5mA)

 Internal pull-up and pull-down resistors (13 K typical) or no pull-up/down

 Wake-up from high or low level triggers on all pins including NFC pins

5.9.2 ADC

The ADC is an alternate function on SIO pins, configurable by smart BASIC.

The BL652 provides access to 8-channel 8/10/12-bit successive approximation ADC in one-shot mode. This

enables sampling up to 8 external signals through a front-end MUX. The ADC has configurable input and

reference pre-scaling and sample resolution (8, 10, and 12 bit).

5.9.2.1 Analog Interface (ADC)

Table 23: Analog interface

Signal Name

Pin No

I/O

Comments

AIN – Analog Input

This interface is an alternate function on each pin, configurable by

smartBASIC. AIN configuration selected using GpioSetFunc()

function.

Configurable 8, 10, 12 bit resolution.

Configurable voltage scaling 4, 2, 1/1, 1/3, 1/3, 1/4, 1/5,

1/6(default).

Configurable acquisition time 3uS, 5uS, 10uS(default), 15uS, 20uS,

40uS.

Full scale input range (VCC)

AIN – Analog Input

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

5.9.3 PWM Signal Output on up to 12 SIO Pins

The PWM output is an alternate function on SIO pins, configurable by smartBASIC.

The ability to output a PWM (Pulse Width Modulated) signal on ALL GPIO (SIO) output pins can be selected using

GpioSetFunc() function.

The PWM output signal has a frequency and duty cycle property. Frequency is adjustable (up to 1MHz ) and the

duty cycle can be set over a range from 0% to 100% (both configurable by smart BASIC command).

5.9.4 FREQ Signal Output on up to 2 SIO Pins

The FREQ output is an alternate function on SIO pins, configurable by smartBASIC.

The ability to output a FREQ output signal on 2 GPIO (SIO) output pins can be selected using GpioSetFunc()

function.

Note: The frequency driving each of the two SIO pins is the same but the duty cycle can be independently

set for each pin.

FREQ output signal frequency can be set over a range of 0Hz to 4 MHz (with 50% mark-space ratio).

nRESET pin

Table 24: nRESET pin

Signal Name

Pin No

I/O

Comments

nRESET

BL652 HW reset (active low). Pull the nRESET pin low for minimum

100mS in order for the BL652 to reset.

nAutoRUN pin

Refer to nAutoRUN pin and Operating Modes regarding operating modes and the nAutoRUN pin.

 Self-contained Run mode

 Interactive/Development mode

vSP Command Mode

This section discusses VSP Command mode through pulling SIO_2 high and nAutoRUN low. Read this section in

conjunction with the VSP Configuration chapter of the BL652 smartBASIC Extensions Guide, found in the

documentation tab of the BL652 product page.

Figure 7 shows the difference between VSP Bridge to UART mode and VSP Command mode and how SIO_02 and

nAutoRUN must be configured to select between these two modes.

 VSP Bridge to UART mode takes data sent from phone or tablet (over BLE) and sends to BL652 to be sent

out of the BL652 UART (therefore data not stored on BL652).

 VSP Command mode takes data sent from phone or tablet and sends to BL652 which will interpret as an AT

command and response will be sent back. The OTA Android or iOS application can be used to download any

smartBASIC application script over the air to the BL652 because a smartBASIC application is downloaded

using AT commands.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Figure 7: Differences between VSP bridge to UART mode and VSP Command mode

Table 25: vSP modes

Mode

SIO_02

nAutoRUN

VSP Bridge to UART Mode

High

VSP Command Mode

High

Low

SIO_02 High (externally) selects the VSP service. When SIO_02 is High and nAutoRUN is Low (externally), this

selects VSP Command mode. When SIO_12 is High and nAutoRUN is High (externally), this selects VSP Bridge to

UART mode.

When SIO_02 on module is set HIGH (externally), VSP is enabled and auto-bridged to UART when connected.

However, for VSP Command mode, auto-bridge to UART is not required. With SIO_02 set to High and nAutoRUN

set to Low, the device enters VSP Command mode and you can then download the smartBASIC application onto

the module over the air from the phone (or tablet).

Two-wire Interface JTAG

The BL652 Firmware hex file consists of four elements:

 smartBASIC runtime engine

 Softdevice

 Master Bootloader

Laird BL652 smartBASIC firmware (FW) image part numbers are referenced as w.x.y.z (ex. v28.x.y.z). The

BL652smartBASIC runtime engine and Softdevice combined image can be upgraded by the customer over the

UART interface.

You also have the option to use the two-wire (JTAG) interface, during production, to clone the file system of a

Golden preconfigured BL652 to others using the Flash Cloning process. This is described in the app note Flash

Cloning for the BL652. In this case the file system is also part of the .hex file.

Signal Name

Pin No

I/O

Comments

SWDIO

I/O

Internal pull-up resistor

SWDCLK

Internal pull-down resistor

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

The Laird DVK-BL652 development board incorporates an on-board JTAG J-link programmer for this purpose.

There is also the following JTAG connector which allows on-board JTAG J-link programmer signals to be routed

off the development board. The only requirement is that you should use the following JTAG connector on the

host PCB.

The JTAG connector MPN is as follows:

Reference

Part

Description and MPN (Manufacturers Part Number)

JP1

FTSH-105

Header, 1.27mm, SMD, 10-way, FTSH-105-01-L-DV Samtech

Note: Reference on the BL652 development board schematic (Figure 8) shows the DVK-BL652-xx

development schematic wiring only for the JTAG connector and the BL652 module JTAG pins.

Figure 8: BL652 development board schematic

SIO_18

CON_SM_39

GND

SIO_23/SPI_MOSI

SIO_17 30

SIO_15 29

SIO_13/nAutoRUN 28

SIO_22

GND

NFC2/SIO_10

14 NFC1/SIO_09

SIO_25/SPI_CLK 38

nRESET

VDD_nRF

SIO_16/SFLASH_CLK

SIO_24/SPI_MISO

GND

SWDIO

5SWDCLK

SIO_20/SFLASH_MOSI

8SIO_18

SIO_14/SFLASH_MISO

11 SIO_12/SFLASH_CS

12 SIO_11

SIO_08/UART_RX

17 SIO_07/UART_CTS

18 SIO_06/UART_TX

19 SIO_05/UART_RTS/AIN3

20 SIO_04/AIN2

21 SIO_03/AIN1

22 SIO_02/AIN0

23 SIO_01/XL2

24 SIO_00/XL1

SIO_19 31

SIO_31/AIN7 32

SIO_30/AIN6 33

SIO_29/AIN5 34

SIO_28/AIN4 35

SIO_27/I2C_SCL 36

SIO_26/I2C_SDA 37

GND 39

GND

SWDIO_BLE

VCC_BLE

SIO_18

SWDCLK_BLE

VCC_BLE

nRESET_BLE

0.1uF,16V

GND

SWDIO

VCC_IO

SWDCLK

JP1

NOPOP (PIN HEADER,1.27mm 2X5P)

1 2

3 4

5 6

7 8

910

PIN HEADER,2.54mm 1X3P

SWDCLK_BLE

nRESET_BLE

SIO_18

SWDIO_BLE

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Note: J3 and J4 (on the DVK-BL652-xx development board allows Laird on-board JTAG J-link programmer

signals to be routed off the development board by fitting jumpers in the J3 pins (2-3) and J4 pins (2-3).

BL652 Wakeup

5.14.1 Waking Up BL652 from Host

Wake the BL652 from the host using wake-up pins (any SIO pin). Refer to the smartBASIC user guide for details.

You may configure the BL652’s wakeup pins via smartBASIC to do any of the following:

 Wake up when signal is low

 Wake up when signal is high

 Wake up when signal changes

Refer to the smartBASIC user guide for details. You can access this guide from the Laird BL652 product page.

Low Power Modes

The BL652 has three power modes: Run, Standby Doze, and Deep Sleep.

The module is placed automatically in Standby Doze if there are no pending events (when WAITEVENT statement

is encountered within a customer’s smartBASIC script). The module wakes from Standby Doze via any interrupt

(such as a received character on the UART Rx line). If the module receives a UART character from either the

external UART or the radio, it wakes up.

Deep sleep is the lowest power mode. Once awakened, the system goes through a system reset.

Temperature Sensor

The on-silicon temperature sensor has a temperature range greater than or equal to the operating temperature

of the device. Resolution is 0.25 degrees.

To read temperature from on-silicon temperature sensor (in tenth of centigrade, so 23.4°C is output as 234):

 In command mode, use ATI2024

 From running from a running smartBASIC application script, use SYSINFO(2024)

Random Number Generator

Exposed via an API in smartBASIC (see smartBASIC documentation available from the BL652 product page).

The rand() function from a running smartBASIC application returns a value.

AES Encryption/Decryption

Exposed via an API in smartBASIC (see smartBASIC documentation available from the BL652 product page).

Function called aesencrypt and aesdecrypt.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Optional External Serial (SPI) Flash

This is not required for normal BL652 module opertion.

If you fit an optional external serial (SPI) flash (such as for data logging purpose) then that external serial (SPI)

flash must connect to BL652 module pins SIO_12 (SFLASH_CS), SIO_14 (SFLASH_MISO), SIO_16 (SFLASH_CLK),

and SIO_20 (SFLASH_MOSI); in that case a high level API in smartBASIC can be used for fast access using

open/close /read/write API functions.

Note: By default, these are GPIO pins. Only when in their FlashOpen()smartBASIC app are these lines

dedicated to SPI and for talking to the off-module board SPI flash.

If you decide to use external serial (SPI) flash with the BL652-SX-xx, then ONLY the manufacturer part numbers

below MUST be used:

 4-Mbit Macronix MX25R4035F

http://www.macronix.com/Lists/DataSheet/Attachments/3288/MX25R4035F,%20Wide%20Range,%204Mb,

%20v1.2.pdf

 8-Mbit Macronix MX25R8035F

http://www.macronix.com/Lists/DataSheet/Attachments/3532/MX25R8035F,%20Wide%20Range,%208Mb,

%20v1.2.pdf

For any external serial (SPI) flash other than these part numbers, smartBASIC does not provide access.

Optional External 32.768 kHz crystal

This is not required for normal BL652 module operation.

The BL652 uses the on-chip 32.76 kHz RC oscillator (LFCLK) by default (which has an accuracy of ±250 ppm) which

requires regulator calibration (every eight seconds) to within ±250 ppm.

You can connect an optional external high accuracy (±20 ppm) 32.768 kHz crystal to the BL652-SX-xx pins,

SIO_01/XL2 (pin 24) and SIO_00/XL1 (pin 25) to provide improved protocol timing and to help with radio power

consumption in the system standby doze/deep sleep modes by reducing the time that the RX window needs to

be open. Table 26 compares the current consumption difference between RC and crystal oscillator.

Table 26: Comparing current consumption difference between BL652 on-chip RC 32.76 kHz oscillator and optional external crystal

(32.768kHz) based oscillator

BL652 On-chip 32.768 kHz RC Oscillator

(±250 ppm) LFRC

Optional External Higher Accuracy (±20 ppm)

32.768 kHz Crystal-based Oscillator XO

Current

Consumption

of 32.768 kHz

Block

0.6 uA

0.25 uA

Standby Doze

Current

1.2 uA

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

BL652 On-chip 32.768 kHz RC Oscillator

(±250 ppm) LFRC

Optional External Higher Accuracy (±20 ppm)

32.768 kHz Crystal-based Oscillator XO

Calibration

Calibration required regularly (default eight

seconds interval)

Calibration takes 16-17 ms; with DCDC used,

the total charge of a calibration event is 7.4 uC.

The average current consumed by the

calibration depends on the calibration interval

and can be calculated using the following

formula:

CAL_charge/CAL_interval

The lowest calibration interval (0.25 seconds)

provides an average current of (DCDC

enabled):

7.4uC / 0.25s = 29.6uA

To get the 250 ppm accuracy, the BLE stack

specification states that a calibration interval

of eight seconds is enough. This gives an

average current of:

7.4uC / 8s = 0.93 uA

Added to the LFRC run current and Standby

Doze (IDLE) base current shown above results

in a total average current of:

LFRC + CAL = 1.8 + 0.93 = 2.7uA

Not applicable

Total

2.7 uA

1.45 uA

Summary

 Low current consumption

 Accuracy 250 ppm

 Lowest current consumption

 Needs external crystal

 High accuracy (depends on the crystal, usually

20 ppm)

Table 27: Optional external 32.768 kHz crystal specification

Optional external 32.768kHz crystal

Min

Typ

Max

Crystal Frequency

32.768 kHz

Frequency tolerance requirement of BLE stack

±250 ppm

Load Capacitance

12.5 pF

Shunt Capacitance

2 pF

Equivalent series resistance

100 kOhm

BL652

Datasheet

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Optional external 32.768kHz crystal

Min

Typ

Max

Drive level

1 uW

Input capacitance on XL1 and XL2 pads

4 pF

Run current for 32.768 kHz crystal based oscillator

0.25 uA

Startup time for 32.768 kHz crystal based oscillator

0.25 seconds

Peak to peak amplitude for external low swing clock input

signal must not be outside supply rails

200 mV

1000 mV

Be sure to tune the load capacitors on the board design to optimize frequency accuracy (at room temperature) so

it matches that of the same crystal standalone, Drive Level (so crystal operated within safe limits) oscillation

margin (Rneg is at least 3 to 5 times ESR) over the operating temperature range.

BL652-SA On-board Chip Antenna Characteristics

The BL652-SA on-board chip monopole antenna radiated performance depends on the host PCB layout.

The BL652 development board was used for BL652 development and antenna performance evaluation. To obtain

similar performance, follow guidelines in section PCB Layout on Host PCB for BL652-SA to allow the on-board

antenna to radiate and reduce proximity effects due to nearby host PCB GND copper or metal covers.

BL652-SA on-board chip antenna datasheet: http://www.acxc.com.tw/product/at/at3216/AT3216-B2R7HAA_S-

R00-N198_2.pdf

Unit in dBi @2.44GHz

XY-plane

XZ-plane

YZ-plane

Efficiency

Peak

Avg

Peak

Avg

Peak

Avg

AT3216-B2R7HAA

-5.1

-8.7

-1.3

-7.4

-5.1

-8.7

25.0%

◆XY-plane ◆XZ-plane ◆YZ-plane

BL652

Datasheet

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6 HARDWARE INTEGRATION SUGGESTIONS

Circuit

The BL652 is easy to integrate, requiring no external components on your board apart from those which you

require for development and in your end application.

The following are suggestions for your design for the best performance and functionality.

Checklist (for Schematic):

 VCC pins

External power source should be within the operating range, rise time and noise/ripple specification of the

BL652. Add decoupling capacitors for filtering the external source. Power-on reset circuitry within BL652

series module incorporates brown-out detector, thus simplifying your power supply design. Upon

application of power, the internal power-on reset ensures that the module starts correctly.

 VCC and coin-cell operation

With built-in DCDC (operating range 1.7V to 3.6V), reduces the peak current required from a coin-cell

(CR2032), making it easier to use with coin-cell.

 AIN (ADC) and SIO pin IO voltage levels

BL652 SIO voltage levels are at VCC. Ensure input voltage levels into SIO pins are at VCC also (if VCC source is

a battery whose voltage will drop). Ensure ADC pin maximum input voltage for damage is not violated.

 AIN (ADC) impedance and external voltage divider setup

If you need to measure with ADC a voltage higher than 3.6V, you can connect a high impedance voltage

divider to lower the voltage to the ADC input pin.

 JTAG

This is not required as smartBASIC runtime engine firmware can be loaded using the UART. JTAG may be

used if you intend to use Flash Cloning during production to load smartBASIC scripts.

Table 28: BL652-SA on-board chip antenna performance (Antenna Gain, efficiency and S11 (whilst BL652-SA-xx module on DVK-

BL652-xx development board)

BL652

Datasheet

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 UART

Required for loading your smartBASIC application script during development (or for subsequent firmware

upgrades (except JTAG for FW upgrades and/or Flash Cloning of the smartBASIC application script). Add

connector to allow interfacing with UART via PC (UART–RS232 or UART-USB).

 UART_RX and UART_CTS

SIO_8 (alternative function UART_RX) is an input, set with internal weak pull-up (in firmware). The pull-up

prevents the module from going into deep sleep when UART_RX line is idling.

SIO_7 (alternative function UART_CTS) is an input, set with internal weak pull-down (in firmware). This pull-

down ensures the default state of the UART_CTS will be asserted which means can send data out of the

UART_TX line. Laird recommends that UART_CTS be connected.

 nAutoRUN pin and operating mode selection

nAutoRUN pin needs to be externally held high or low to select between the two BL652 operating modes at

power-up:

– Self-contained Run mode (nAutoRUN pin held at 0V).

– Interactive / development mode (nAutoRUN pin held at VCC).

Make provision to allow operation in the required mode. Add jumper to allow nAutoRUN pin to be

held high or low (BL652 has internal 13K pull-down by default) OR driven by host GPIO.

 I2C

It is essential to remember that pull-up resistors on both I2C_SCL and I2C_SDA lines are not provided in the

BL652 module and MUST be provided external to the module as per I2C standard.

 SPI

Implement SPI chip select using any unused SIO pin within your smartBASIC application script then SPI_CS is

controlled from smartBASIC application allowing multi-dropping.

 SIO pin direction

BL652 modules shipped from production with smart BASIC runtime engine FW, all SIO pins (with default

function of DIO) are mostly digital inputs (see Pin Definitions Table2). Remember to change the direction SIO

pin (in your smart BASIC application script) if that particular pin is wired to a device that expects to be driven

by the BL652 SIO pin configured as an output. Also, these SIO pins have the internal pull-up or pull-down

resistor-enabled by default in firmware (see Pin Definitions Table 2). This was done to avoid floating inputs,

which can cause current consumption in low power modes (e.g. StandbyDoze) to drift with time. You can

disable the PULL-UP or Pull-down through their smartBASIC application.

Note: Internal pull-up, pull down will take current from VCC.

 SIO_02 pin and OTA smartBASIC application download feature

SIO_02 is an input, set with internal pull-down (in FW). Refer to latest firmware release documentation on

how SIO_02 is used for Over the Air smartBASIC application download feature. SIO_02 pin has to be pulled

high externally to enable the feature. Decide if this feature is required in production. When SIO_02 is high,

ensure nAutoRun is NOT high at same time; otherwise you cannot load the smartBASIC application script.

 NFC antenna connector

To make use of the Laird flexi-PCB NFC antenna, fit connector:

Description: FFC/FPC Connector, Right Angle, SMD/90d,Dual Contact,1.2mm Mated Height

Manufacturer: Molex

Manufacturers Part number: 512810594

BL652

Datasheet

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Add tuning capacitors of 300 pF on NGC1 pin to GND and 300 pF on NFC2 pins to GND if the PCB track length

is similar as DVK-BL652 devboard.

 nRESET pin (active low)

Hardware reset. Wire out to push button or drive by host.

By default module is out of reset when power applied to VCC pins.

 Optional External 32.768kHz crystal

If the optional external 32.768kHz crystal is needed then use a crystal that meets specification.

 Optional External serial SPI flash IC

If the optional external serial (SPI) flash is required, ensure that manufacturer part number tested by Laird

are used.

PCB Layout on Host PCB - General

Checklist (for PCB):

 MUST locate BL652-Sx module close to the edge of PCB (mandatory for BL652-SA for on-board chip antenna

to radiate properly).

 Use solid GND plane on inner layer (for best EMC and RF performance).

 All module GND pins MUST be connected to host PCB GND.

 Place GND vias close to module GND pads as possible.

 Unused PCB area on surface layer can flooded with copper but place GND vias regularly to connect copper

flood to inner GND plane. If GND flood copper underside the module then connect with GND vias to inner

GND plane.

 Route traces to avoid noise being picked up on VCC supply and AIN (analogue) and SIO (digital) traces.

 Ensure no exposed copper is on the underside of the module (refer to land pattern of BL652 development

board).

PCB Layout on Host PCB for BL652-SA

6.3.1 Antenna Keep-out on Host PCB

The BL652-SA has an integrated chip antenna and its performance is sensitive to host PCB. It is critical to locate

the BL652-SA on the edge of the host PCB (or corner) to allow the antenna to radiate properly. Refer to

guidelines in section PCB land pattern and antenna keep-out area for BL652-SA. Some of those guidelines

repeated below.

 Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep all mounting

hardware and metal clear of the area to allow proper antenna radiation.

 For best antenna performance, place the BL652-SA module on the edge of the host PCB, preferably in the

corner with the antenna facing the corner.

 The BL652 development board has the BL652-SA module on the edge of the board (not in the corner). The

antenna keep-out area is defined by the BL652 development board which was used for module

development and antenna performance evaluation is shown in Figure 9, where the antenna keep-out area is

~4.95mm wide, 25.65 mm long; with PCB dielectric (no copper) height 0.85 mm sitting under the BL652-SA

antenna.

BL652

Datasheet

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 The BL652-SA antenna is tuned when BL652-SA is sitting on development board (host PCB) with size of 120

mm x 93 mm.

 A different host PCB thickness dielectric will have small effect on antenna.

 The antenna-keep-out defined in the Host PCB Land Pattern and Antenna Keep-out for BL652-SA section.

 Host PCB land pattern and antenna keep-out for the BL652 applies when the BL652-SA is placed in the

corner of the host PCB. When BL652-SA cannot be placed as such, it must be placed on the edge of the host

PCB and the antenna keep out must be observed. Figure 9 shows an example.

Figure 9: Antenna keep-out area (shown in red), corner of the BL652 development board for BL652-SA module.

Antenna Keep-out Notes:

Note 1

The BL652 module is placed on the edge of the host PCB.

Note 2

Copper cut-away on all layers in the Antenna Keep-out area under BL652 on host PCB.

6.3.2 Antenna Keep-out and Proximity to Metal or Plastic

Checklist (for metal /plastic enclosure):

 Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40 mm

top/bottom and 30 mm left or right.

 Metal close to the BL652-SA chip monopole antenna (bottom, top, left, right, any direction) will have

degradation on the antenna performance. The amount of that degradation is entirely system dependent,

meaning you will need to perform some testing with your host application.

BL652-SA module

Antenna Keep-out

BL652

Datasheet

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 Any metal closer than 20 mm will begin to significantly degrade performance (S11, gain, radiation

efficiency).

 It is best that you test the range with a mock-up (or actual prototype) of the product to assess effects of

enclosure height (and materials, whether metal or plastic).

External Antenna Integration with BL652-SC

Please refer to the regulatory sections for FCC, IC, CE, and Japan for details of use of BL652-Sx with external

antennas in each regulatory region.

The BL652 family has been designed to operate with the below external antennas (with a maximum gain of

2.0 dBi). The required antenna impedance is 50 ohms. See Table 29. External antennas improve radiation

efficiency.

Table 29: External antennas for the BL652

External Antenna

Part Number

Laird Part

Number

Mfg.

Type

Gain

(dBi)

Connector Type

BL652 Part

Number

FlexPIFA (001-0022)

LSR

PCB

Dipole

2.0

IPEX-4

(See Note 1)

BL652-SC

FlexNotch (001-0023)

LSR

PCB

Dipole

2.0

IPEX-4

(See Note 1)

BL652-SC

EDA-8709-2G4C1-B27-CY

Mag.Layers

Dipole

2.0

IPEX-4

(See Note 1)

BL652-SC

RFDPA870910EMAB302

0600-00057

Walsin

Dipole

2.0

IPEX-4

(See Note 1)

BL652-SC

Note 1: Integral RF co-axial cable (1.13 mm OD) with length 100±5 mm and IPEX-4 compatible connector.

These antennas are available through Laird – please contact Sales for information.

BL652

Datasheet

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7 MECHANICAL DETAILS

BL652 Mechanical Details

Figure 10: BL652 mechanical drawings

Development Kit Schematics can be found in the software downloads tab of the BL652 product page:

http://www.lairdtech.com/Products/BL652-Series

BL652

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Host PCB Land Pattern and Antenna Keep-out for BL652-SA

Figure 11: Land pattern and Keep-out for BL652-SA

All dimensions are in mm.

Host PCB Land Pattern and Antenna Keep-out for BL652-SANotes:

Note 1

Ensure there is no copper in the antenna ‘keep out area’ on any layers of the host PCB. Also keep all

mounting hardware or any metal clear of the area (Refer to 6.3.2) to reduce effects of proximity

detuning the antenna and to help antenna radiate properly.

Note 2

For the best on-board antenna performance, the module BL652-SA MUST be placed on the edge of

the host PCB and preferably in the corner with the antenna facing the corner. Above “Keep Out

Area” is the module placed in corner of PCB. If BL652-SA is not placed in corner but on edge of host

PCB, the antenna “Keep Out Area” is extended (see Note 4).

Note 3

BL652 development board has BL652-SA placed on the edge of the PCB board (and not in corner) for

that the Antenna keep out area is extended down to the corner of the development board, see

section PCB Layout on Host PCB for BL652-SA, Figure 11. This was used for module development and

antenna performance evaluation.

BL652

Datasheet

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Note 4

Ensure that there is no exposed copper under the module on the host PCB.

Note 5

You may modify the PCB land pattern dimensions based on their experience and/or process

capability.

8 APPLICATION NOTE FOR SURFACE MOUNT MODULES

Introduction

Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This

application note is intended to provide additional guidance beyond the information that is presented in the User

Manual. This Application Note is considered a living document and will be updated as new information is

presented.

The modules are designed to meet the needs of a number of commercial and industrial applications. They are

easy to manufacture and conform to current automated manufacturing processes.

Shipping

8.2.1 Tape and Reel Package Information

Note: Ordering information for tape and reel packaging involves the addition of T/R to the end of the full

module part number. For example, BL652-SA-0x becomes BL652-SA-0x-T/R.

Figure 12: Reel specifications

BL652

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Figure 13: Tape specifications

There are 1000 BL652 modules taped in a reel (and packaged in a pizza box) and five boxes per carton (5000

modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See Carton Contents for

more information.

8.2.2 Carton Contents

The following are the contents of the carton shipped for the BL652 modules.

BL652

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8.2.3 Packaging Process

Figure 15: BL652 packaging process

8.2.4 Labeling

The following labels are located on the antistatic bag:

Figure 16: Antistatic bag labels

Figure 14: Carton contents for the BL652

BL652

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The following package label is located on both sides of the master carton:

Figure 17: Master carton package label

The following is the packing slip label:

Figure 18: Packing slip label

Reflow Parameters

Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New

packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained

during storage and shipment. If directed to bake units on the card, see Table 30 and follow instructions specified

by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website:

http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf

Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures

displayed in in Table 30, the modules must be removed from the shipping tray.

Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and

a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient

environment 30°C/60%RH.

BL652

Datasheet

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Table 30: Recommended baking times and temperatures

MSL

125°C

Baking Temp.

90°C/≤ 5%RH

Baking Temp.

40°C/ ≤ 5%RH

Baking Temp.

Saturated

30°C/85%

Floor Life Limit

+ 72 hours

@ 30°C/60%

Saturated

30°C/85%

Floor Life Limit

+ 72 hours

@ 30°C/60%

Saturated

30°C/85%

Floor Life Limit

+ 72 hours @

30°C/60%

9 hours

7 hours

33 hours

23 hours

13 days

9 days

Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.

Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven

temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to

J-STD-020D1 standards for reflow temperatures.

Important: During reflow, modules should not be above 260° and not for more than 30 seconds.

Figure 19: Recommended reflow temperature

Temperatures should not exceed the minimums or maximums presented in Table 31.

Table 31: Recommended maximum and minimum temperatures

Specification

Value

Unit

Temperature Inc./Dec. Rate (max)

1~3

°C / Sec

Temperature Decrease rate (goal)

2-4

°C / Sec

Soak Temp Increase rate (goal)

.5 - 1

°C / Sec

Flux Soak Period (Min)

Sec

Flux Soak Period (Max)

120

Sec

Flux Soak Temp (Min)

150

°C

Flux Soak Temp (max)

190

°C

Time Above Liquidous (max)

Sec

BL652

Datasheet

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Specification

Value

Unit

Time Above Liquidous (min)

Sec

Time In Target Reflow Range (goal)

Sec

Time At Absolute Peak (max)

Sec

Liquidous Temperature (SAC305)

218

°C

Lower Target Reflow Temperature

240

°C

Upper Target Reflow Temperature

250

°C

Absolute Peak Temperature

260

°C

9 FCC AND IC REGULATORY STATEMENTS

Model

US/FCC

Canada/IC

BL652-SA

SQGBL652

3147A-BL652

BL652-SC

SQGBL652

3147A-BL652

The BL652SA and BL652-SC hold full modular approvals. The OEM must follow the regulatory guidelines and

warnings listed below to inherit the modular approval.

Part #

Form Factor

Tx Outputs

Antenna

BL652-SA-SA

Surface Mount

4 dBm

Ceramic

BL652-SC-SC

Surface Mount

4 dBm

IPEX MHF4

*Last two slots "XX" in Part # are used for production firmware release changes. Can be values 01-99, aa-zz

Antenna Information

The BL652 family has been designed to operate with the antennas listed below with a maximum gain of 2.21 dBi.

The required antenna impedance is 50 ohms.

External Antenna Part Number

Laird Part

Number

Mfg.

Type

Gain

(dBi)

Connector

Type

BL652 Part

number

FlexPIFA

001-0022

LSR

PCB Dipole

2.0

IPEX-4

BL652-SC

FlexNotch

001-0023

LSR

PCB Dipole

2.0

IPEX-4

BL652-SC

EDA-8709-2G4C1-B27-CY

Mag.Layers

Dipole

2.0

IPEX-4

BL652-SC

RFDPA870910EMAB302

0600-00057

Walsin

Dipole

2.0

IPEX-4

BL652-SC

Note: The OEM is free to choose another vendor’s antenna of like type and equal or lesser gain as an

antenna appearing in the table and still maintain compliance. Reference FCC Part 15.204(c)(4) for

further information on this topic.

To reduce potential radio interference to other users, the antenna type and gain should be chosen so

that the equivalent isotropic radiated power (EIRP) is not more than that permitted for successful

communication.

BL652

Datasheet

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Power Exposure Information

Federal Communication Commission (FCC) Radiation Exposure Statement:

This EUT is in compliance with SAR for general population/uncontrolled exposure limits in ANSI/IEEE C95.1-1999

and had been tested in accordance with the measurement methods and procedures specified in OET Bulletin 65

Supplement C.

This transceiver must not be co-located or operating in conjunction with any other antenna, transmitter, or

external amplifiers. Further testing / evaluation of the end product will be required if the OEM’s device violates

any of these requirements.

The BL652 is fully approved for mobile and portable applications.

OEM Responsibilities

WARNING: The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label

on the outside of the OEM enclosure specifying the appropriate Laird Technology FCC identifier

for this product.

Contains FCC ID: SQGBL652 IC: 3147A-BL652

If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement

has to also be available on visible on outside of device:

The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions: (1) This device may not cause harmful interference, and (2) This device must

accept any interference received, including interference that may cause undesired operation

Label and text information should be in a size of type large enough to be readily legible, consistent with the

dimensions of the equipment and the label. However, the type size for the text is not required to be larger than

eight point.

CAUTION: The OEM should have their device which incorporates the BL652 tested by a qualified test house to

verify compliance with FCC Part 15 Subpart B limits for unintentional radiators.

CAUTION: Any changes or modifications not expressly approved by Laird Technology could void the user’s

authority to operate the equipment.

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in a particular installation. If this equipment does

cause harmful interference to radio or television reception, which can be determined by turning the equipment

off and on, the user is encouraged to try to correct the interference by one of the following measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

BL652

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 Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including

interference that may cause undesired operation.

IMPORTANT NOTE:

FCC Radiation Exposure Statement:

The product comply with the US portable RF exposure limit set forth for an uncontrolled environment and are

safe for intended operation as described in this manual. The further RF exposure reduction can be achieved if

the product can be kept as far as possible from the user body or set the device to lower output power if such

function is available.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

This device is intended only for OEM integrators under the following conditions:

(1) The transmitter module may not be co-located with any other transmitter or antenna,

As long as the condition above is met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed

IMPORTANT NOTE

In the event that these conditions can not be met (for example certain laptop configurations or co-location with

another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on

the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end

product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

The final end product must be labeled in a visible area with the following: “Contains FCC ID: SQGBL652”.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Industry Canada Statement

This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two

conditions:

(1) This device may not cause interference; and

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

(2) This device must accept any interference, including interference that may cause undesired operation of the

device.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de

licence. L’exploitation est autorisée aux deux conditions suivantes:

(1) l’appareil ne doit pas produire de brouillage;

(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d’en compromettre le fonctionnement.

Radiation Exposure Statement

The product comply with the Canada portable RF exposure limit set forth for an uncontrolled environment and

are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved

if the product can be kept as far as possible from the user body or set the device to lower output power if such

function is available.

Déclaration d'exposition aux radiations:

Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada

établies pour un environnement non contrôlé. Le produit est sûr pour un fonctionnement tel que décrit dans ce

manuel. La réduction aux expositions RF peut être augmentée si l'appareil peut être conservé aussi loin que

possible du corps de l'utilisateur ou que le dispositif est réglé sur la puissance de sortie la plus faible si une telle

fonction est disponible.

This device is intended only for OEM integrators under the following conditions:

(1) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 1 condition above are met, further transmitter test will not be required. However, the OEM integrator

is still responsible for testing their end-product for any additional compliance requirements required with this

module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:

(1) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas

nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes

exigences de conformité supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop configurations or co-location with

another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used

on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end

product (including the transmitter) and obtaining a separate Canada authorization.

NOTE IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations

d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est

plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une

autorisation distincte au Canada.

End Product Labeling

The final end product must be labeled in a visible area with the following: “Contains IC: 3147A-BL652”.

Plaque signalétique du produit final

Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 3147A-

BL652".

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon

d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.

Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements

comme indiqué dans ce manuel.

10 JAPAN (MIC) REGULATORY

The BL652 is approved for use in the Japanese market. The part numbers listed below hold WW type

certification. Refer to ARIB-STD-T66 for further guidance on OEM’s responsibilities.

Model

Certificate Number

Antenna

BL652-SA

201-160415

Ceramic

BL652-SC

201-160416

IPEX MHF4

Antenna Information

The BL652 was tested with antennas listed below. The OEM can choose a different manufacturers antenna but

must make sure it is of same type and that the gain is lesser than or equal to the antenna that is approved for

use.

External Antenna Part Number

Laird Part

Number

Mfg.

Type

Gain

(dBi)

Connector

Type

BL652 Part

Number

FlexPIFA

001-0022

LSR

PCB

Dipole

2.0

IPEX-4

BL652-SC

FlexNotch

001-0023

LSR

PCB

Dipole

2.0

IPEX-4

BL652-SC

EDA-8709-2G4C1-B27-CY

Mag.Layers

Dipole

2.0

IPEX-4

BL652-SC

RFDPA870910EMAB302

0600-00057

Walsin

Dipole

2.0

IPEX-4

BL652-SC

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

11 CE REGULATORY

The BL652-SA/BL652-SC have been tested for compliance with relevant standards for the EU market. The BL652-

SC module was tested with a 2.21 dBi antenna. The OEM can operate the BL652-SC module with any other type

of antenna but must ensure that the gain does not exceed 2.21 dBi to maintain the Laird approval.

The OEM should consult with a qualified test house before entering their device into an EU member country to

make sure all regulatory requirements have been met for their complete device.

Reference the Declaration of Conformities listed below for a full list of the standards that the modules were

tested to. Test reports are available upon request.

Antenna Information

The antennas listed below were tested for use with the BL652. For CE mark countries, the OEM is free to use any

manufacturer’s antenna and type of antenna as long as the gain is less than or equal to the highest gain approved

for use (2.21dBi) Contact a Laird representative for more information regarding adding antennas.

External Antenna Part Number

Laird Part

Number

Mfg.

Type

Gain

(dBi)

Connector

Type

BL652 Part

number

FlexPIFA

001-0022

LSR

PCB

Dipole

2.0

IPEX-4

BL652-SC

FlexNotch

001-0023

LSR

PCB

Dipole

2.0

IPEX-4

BL652-SC

EDA-8709-2G4C1-B27-CY

Mag.Layers

Dipole

2.0

IPEX-4

BL652-SC

RFDPA870910EMAB302

0600-00057

Walsin

Dipole

2.0

IPEX-4

BL652-SC

Note: The BL652 module internal BLE chipset IC pins are rated 4 kV (ESD HBM). ESD can find its way through

the external JTAG connector (if used on the customers design), if discharge is applied directly.

Customer should ensure adequate protection against ESD on their end product design (using the

BL652 module) to meet relevant ESD standard (for CE, this is EN301-489).

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

12 EU DECLARATIONS OF CONFORMITY

BL652-SA/BL652-SC

Manufacturer:

Laird

Product:

BL652-SA, BL652-SC

EU Directive:

RTTE 1995/5/EC

Conformity Assessment:

Annex IV

Reference standards used for presumption of conformity:

Article Number

Requirement

Reference standard(s)

3.1a

Health and Safety

EN60950-1:2006+A11:2009+A1:2010+A12:2011

3.1b

Protection requirements with

respect to electromagnetic

compatibility

EN 301 489-1 V1.9.2 (2011-09)

EN 301 489-17 V2.2.1 (2012-09)

Emissions:

EN55022:2006/A1:2007 (Class B)

Immunity:

EN61000-4-2:2009

EN61000-4-3:2006/A1:2008/A2:2010

3.2

Means of the efficient use of

the radio frequency spectrum

EN 300 328 V1.8.1 (2012-06)

Declaration:

We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that

the above product to which this declaration relates is in conformity with all the applicable essential requirements

of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose.

Place of Issue:

Laird

Saturn House, Mercury Park

Wooburn Green

HP100HH, United Kingdom

tel: +44 (0)1628 858 940

fax: +44 (0)1628 528 382

Date of Issue:

Name of Authorized Person:

Signature:

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

13 ORDERING INFORMATION

BL652-SA-0x

Intelligent BTv4.2 Module featuring smartBASIC (internal antenna)

BL652-SC-0x

Intelligent BTv4.2 Module featuring smartBASIC (IPEX MHF4 connector)

DVK-BL652-SA / SC-0x

Development Kit for each BL652 series module above

General Comments

This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If

in doubt, ask.

14 BLUETOOTH SIG QUALIFICATION

Overview

The BL652 module is listed on the Bluetooth SIG website as a qualified End Product.

Design

Name

Owner

Declaration ID

QD ID

Link to listing on the SIG website

BL652

Laird

D031950

87158

TBD

It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing

Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification

process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification

Process requires each company to register as a member of the Bluetooth SIG – www.bluetooth.org

The following is a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/

For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new

qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your

membership status, please refer to the following webpage:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees

For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG

document:

https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486

Qualification Steps When Referencing a Laird End Product Design

To qualify your product when referencing a Laird end-product design, follow these steps:

1. To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm

Note: A user name and password are required to access this site.

2. In step 1, select the option, New Listing and Reference a Qualified Design.

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

3. Enter TBD or TBD in the End Product table entry.

4. Select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page.

Note: Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG

invoice is paid.

5. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help

document accessible from the site.

Your new design will be listed on the SIG website and you can print your Certificate and DoC.

For further information please refer to the following training material:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates

Note: If using the BL652 with Laird Firmware and smartBASIC script, you can skip Controller Subsystem, Host

Subsystem, and Profile Subsystem.

Qualification Steps When Deviating from a Laird End Product Design

If you wish to deviate from the standard End Product designs listed under TBD or TBD, the qualification process

follows the New Listing route (without referencing a Qualified Design). When creating a new design it is

necessary to complete the full qualification listing process and also maintain a compliance folder for the design.

If your design is based on un-modified BL652 hardware, follow these steps:

1. Reference the existing RF-PHY test report from the BL600 listing.

Note: This report is available from Laird: ews-support@lairdtech.com

2. Combine the relevant Nordic Link Layer (LL).

3. Combine in a Host Component (covering L2CAP, GAP, ATT, GATT, SM).

4. Test any standard SIG profiles that are supported in the design, (customs

profiles are exempt).

The first step is to generate a project on the TPG (Test Plan Generator) system, select

‘Traditional Project’. This determines which test cases apply to demonstrate

compliance with the Bluetooth Test Specifications, from the TPG you generate a Test

Declaration, (Excel format). If you are combining pre-tested and qualified

components in your design, and they are within their 3 year listing period, you are

not required to re-test those layers covered by those components.

Figure 20: Scope of the qualification for an End Product Design.

End

Product

Laird RF-PHY

Nordic LL

Host

Layers

Profiles

BL652

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/bluetooth

Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Examples of LL components that can be combined into a new design are:

Listing reference

Design Name

Core Spec Version

TBD

S130_nRF51xxx link layer

4.2

*Note: Please check with Laird/Nordic for applicable LL components.

Examples of Host Stack components that can be integrated into the new design are;

Listing reference

Design Name

Core Spec Version

TBD

S130_nRF51xxx host layer

4.2

*Note: You may choose any Host Stack and optional profiles in you design.

If the design incorporates any standard SIG LE profiles (such as Heart Rate Profile, refer to section, External to the

Core - Current and Qualifiable GATT-based Profile and Service Test Requirements), it is necessary to test these

profiles using PTS or other tools where permitted; the results are added to the compliance folder.

You are required to upload your test declaration and test reports (where applicable) and complete the final

listing steps on the SIG website. Remember to purchase your Declaration ID before you start the qualification

process; you cannot complete the listing without it.

To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm. In step 1, select the option, New Listing,

(without referencing a Qualified Design).

Additional Assistance

Please contact your local sales representative or our support team for further assistance:

Laird Technologies Connectivity Products Business Unit

Support Centre: http://ews-support.lairdtech.com

Email: wireless.support@lairdtech.com

Phone: Americas: +1-800-492-2320

Europe: +44-1628-858-940

Hong Kong: +852 2923 0610

Web: http://www.lairdtech.com/bluetooth

specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since

Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or

sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be

liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time

to time, a copy of which will be furnished upon request. When used as a tradename herein, Laird means Laird PLC or one or more subsidiaries of Laird PLC.

Laird™, Laird Technologies™, corresponding logos, and other marks are trademarks or registered trademarks of Laird. Other marks may be the property of

third parties. Nothing herein provides a license under any Laird or any third party intellectual property right.

Laird Connectivity BL652 Bluetooth 4.2 module (BLE only) User Manual

Laird Technologies Bluetooth 4.2 module (BLE only) Users Manual

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