Laird Connectivity MSD50NBT 802.11abgn Molex 60-pin board-to-board module w/SDIO interface User Manual

Laird Technologies 802.11abgn Molex 60-pin board-to-board module w/SDIO interface Users Manual

Users Manual

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User Guide
MSD50NBT
Version 1.0
MSD50NBT
Hardware Integration Guide
REVISION HISTORY
Version
1.0
Date
22 Feb 2016
Notes
Initial Release
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
Approver
Andrew Chen
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
CONTENTS
Scope ..........................................................................................................................................................................4
MSD50NBT Features Summary ..................................................................................................................................4
Specifications ..............................................................................................................................................................5
WLAN Functional Description.................................................................................................................................. 11
Overview.............................................................................................................................................................. 11
Bluetooth Functional Description............................................................................................................................ 13
Electrical Characteristics.......................................................................................................................................... 14
Bluetooth Radio Characteristics .............................................................................................................................. 19
SDIO Timing Requirements...................................................................................................................................... 21
Pin Definitions ......................................................................................................................................................... 22
MSD40NBT, MSD45N, and MSD50NBT Pin Comparison Table ........................................................................... 24
Mechanical Specifications ....................................................................................................................................... 27
Mounting ................................................................................................................................................................. 27
Reference Schematic of MSD50NBT ....................................................................................................................... 28
RF Layout Design Guidelines/Precautions ............................................................................................................... 28
Regulatory ............................................................................................................................................................... 29
Certified Antennas ............................................................................................................................................... 29
FCC and Industry Canada Regulatory ...................................................................................................................... 29
FCC ....................................................................................................................................................................... 30
Industry Canada................................................................................................................................................... 31
European Union Regulatory .................................................................................................................................... 34
EU Declarations of Conformity ................................................................................................................................ 34
Ordering Information .............................................................................................................................................. 35
General Comments .............................................................................................................................................. 35
Labeling Requirements .................................................................................................................................... 36
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
Scope
This document describes key hardware aspects of the Laird MSD50NBT
module. This document is intended to assist device manufacturers and
related parties with the integration of this radio into their host devices. Data
in this document is drawn from a number of sources and includes
information found in the Qualcomm Atheros (QCA) QCA6004 and Cambridge
Silicon Radio Ltd. (CSR) CSR8811 A08 data sheet issued in July 2011, along
with other documents provided from QCA and CSR.
This Laird 50-series module is currently in development stage and this
document is preliminary. The information in this document is subject to
change. Please contact Laird to obtain the most recent version of this
document.
MSD50NBT FEATURES SUMMARY
The Laird MSD50NBT device features are described in Table 1.
Table 1: MSD50NBT features
Feature
Radio Front End
Description
Integrates the complete transmit/receive RF paths including baluns, coexistence band pass
filter, diplexer, switches, power amplifier, low noise amplifier, and reference crystal
oscillator.
Enhanced important use cases including:
Enhanced
WLAN/BT
Coexistence
Algorithms





PCM/I2S digital audio interface
BT stereo audio (A2DP)
BT data transfer profiles (such as OPP and FTP)
BT2.1+EDR
BT-LE
Flexible radio architecture ensures simple customization for future use cases.
Uses power-saving techniques including:
Power
Management



Gating clocks to idle or inactive blocks
Fast start and settling circuits to reduce Tx power
Active duty cycles
CPU frequency scaling

RF system tested and calibrated in production.
Pre-Calibration
Internal Sleep
Integrated on-chip low power sleep clock to regulate internal timing.
Clock
Multiple Interface  SDIO 2.0 (50 MHz, 4-bit and 1-bit)
Support
 HS-UART for Bluetooth HCI (compatible with any upper layer Bluetooth stack)

Advanced 802.11n 

Reference
Frequency




Half Guard Interval and Frame Aggregation for high throughput
Space Time Block Coding (STBC) Rx for improved downlink robustness over range
Low Density Parity Check (LDPC) for improved uplink and downlink robustness over range
Incorporates a 26 MHz reference frequency source in package
Sleep regulated and gated to enable the internal crystal to be powered down when the device
is in sleep mode
BT shares the clock from the Wi-Fi chip.
Wi-Fi cannot be turned off or in reset statue when running BT.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
Feature
Advanced WLAN
Host Offloading
(WLAN)
Advanced
Bluetooth
Description
Includes the following advanced WLAN features:
 IEEE 802.11e QoS, Wi-Fi Alliance
 Self-managed power state handling
WMM Power Save, and 802.11n
 Self-contained beacon processing
power saving compliance
 Shared authentication
 AES, AES-CCMP, TKIP engines for
 Ad-hoc power save
faster data encryption
 Multiple PMK ID support
 Cisco CCXv4 ASD, WPS support
 Simulated UAPSD
 Standard WEP/WPA/WPA2 for
 T-Spec support
personal and enterprise
 Production flow diagnostics
environments support
 3-wire scheme for Wi-Fi and BT
 WWR, 802.11d, 802.11h support
coexistence.
 Wi-Fi Direct (Peer-to-Peer)
 RTT for indoor positioning
 Statistics and events for
monitoring
Integrates extensive hardware signal processing and an embedded on-chip CPU to offload
complete 11n MAC/BB/PHY processing to minimize host processor loading and support
application specific customization.






High-speed UART port (up to 4 Mbps)
HFP v1.6 wide-band speech supported on-chip
On-chip encoding of SBC and aptX® codecs for A2DP music streaming
PCM/I2S digital audio interface
Support for IEEE 802.11 coexistence
The flexible RAM/ROM based architecture enables custom or future profiles to be easily added.
SPECIFICATIONS
Table 2: Specifications
Feature
Description
Physical Interface
60-pin board to board connector (Molex 54722-0607)
Wi-Fi Interface
Bluetooth Interface
1-bit or 4-bit Secure Digital I/O
Main Chip
Input Voltage Requirements
I/O Signalling Voltage
Host Controller Interface (HCI) using High Speed UART
Wi-Fi: Qualcomm Atheros QCA6004.
BT: Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08
3.3 VDC (3.20V min to 3.46V max)
3.3 VDC ± 5% or 1.8 VDC ± 5%
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
Feature
Average Current
Consumption, VDDIO = 3.3
volts
(At maximum transmit power
setting)
Note: Standby refers to the
radio operating in PM1 power
saving mode.
Note: MIMO measurements
are generally higher than
Single Stream.
Description
Single Stream
802.11a (with BT in standby)
@ 18 dBm 6 Mbps
Transmit: 600 mA
Receive: 120 mA
Standby: TBD mA
802.11b (with BT in standby)
@ 18 dBm 1 Mbps
Transmit: 460 mA
Receive: 120 mA
Standby: TBD mA
802.11g (with BT in standby)
@ 18 dBm 6 Mbps
Transmit: 450 mA
Receive: 250 mA
Standby: 130 mA
802.11n (2.4 GHz) (with BT in standby)
@ 14 dBm MCS7
Transmit: 340 mA
Receive: 120mA
Standby: TBD mA
802.11n (5 GHz) (with BT in standby)
@ 14 dBm MCS7
Transmit: 490 mA
Receive: 120 mA
Standby: TBD mA
Bluetooth (with Wi-Fi in standby)
Transmit: 85 mA
Receive: 70 mA
Standby: TBD mA
MIMO
802.11a (with BT in standby)
@ 18 dBm 6 Mbps
Transmit: 900 mA
Receive: 140 mA
Standby: TBD mA
802.11b (with BT in standby)
@ 18 dBm 1 Mbps
Transmit: 680 mA
Receive: 140 mA
Standby: TBD mA
802.11g (with BT in standby)
@ 18 dBm 6 Mbps
Transmit: 710 mA
Receive: 140 mA
Standby: TBD mA
802.11n (2.4 GHz) (with BT in
standby) @ 14 dBm MCS7
Transmit: 460 mA
Receive: 140 mA
Standby: TBD mA
802.11n (5 GHz) (with BT in
standby)
@ 14 dBm MCS7
Transmit: 720 mA
Receive: 140 mA
Standby: TBD mA
Bluetooth (with Wi-Fi in standby)
Transmit: TBD mA
Receive: TBD mA
Standby: TBD mA
Operating Temperature
Operating Humidity
Storage Temperature
Storage Humidity
Maximum Electrostatic
Discharge
-30° to 85°C (-22° to 185°F)
10 to 90% (non-condensing)
-40° to 85°C (-40° to 185°F)
Size
32 mm (length) x 22 mm (width) x 4.7 mm (thickness)
Weight
Mounting
TBD
Please see the mounting and handling guide.
Wi-Fi Media
Bluetooth Media
Wi-Fi Media Access Protocol
10 to 90% (non-condensing)
Conductive 4KV; Air coupled 8KV EN61000-4-2
Direct Sequence-Spread Spectrum (DSSS)
Complementary Code Keying (CCK)
Orthogonal Frequency Divisional Multiplexing (OFDM)
Frequency Hopping Spread Spectrum (FHSS)
Carrier sense multiple access with collision avoidance (CSMA/CA)
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
Feature
Network Architecture Types
Wi-Fi Standards
Description
Infrastructure and ad-hoc
Bluetooth Standards
Bluetooth version 2.1 with Enhanced Data Rate
Bluetooth 4.0 (Bluetooth Low Energy or BLE)
Wi-Fi Data Rates Supported
11a (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b (DSSS, CCK) 1, 2, 5.5, 11 Mbps
802.11g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n (OFDM, MCS 0-15)
Full Guard Interval: 6.5,13.0, 19.5, 26.0,39.0,52.0,58.5,65.0,
13.0,26.0,39.0, 52.0, 78.0,104.0,117.0 Mbps
Short Guard Interval: 1.2,14.4,21.7,29.9,43.3,57.8,65.0,72.2,
14.4,28.9,43.3,57.8, 86.7,115.6,130.0,144.4 Mbps
Modulation
BPSK @ 1, 6,9, 6.5, 7.2,13 and 14.4 Mbps
QPSK @ 2, 12, 18, 13, 14.4,19.5, 21.7, 26, 28.9, 39,43.3 Mbps
CCK @ 5.5 and 11 Mbps
16-QAM @ 24, 36,26, 29.9,39,43.3,52,57.8,78,86.7 Mbps
64-QAM @ 48,54,52, 57.8, 58.5, 65,72.2,104.0,115.6,117.0,130.0,144.4
Mbps
802.11n Spatial Streams
2 (2x2 MIMO)
1, 2, 3 Mbps
Bluetooth Data Rates
Supported
Bluetooth Modulation
Regulatory Domain Support
2.4 GHz Frequency Bands
2.4 GHz Operating Channels
(Wi-Fi)
IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n, 802.11r
GFSK@ 1 Mbps
Pi/4-DQPSK@ 2 Mbps
8-DPSK@ 3 Mbps
FCC (Americas, Parts of Asia, and Middle East)
ETSI (Europe, Middle East, Africa, and Parts of Asia)
IC (Industry Canada )
MIC (Japan) (formerly TELEC) – Option
KC (Korea) (formerly KCC) – Option
ETSI: 2.4 GHz to 2.483 GHz
FCC: 2.4 GHz to 2.473 GHz
MIC: 2.4 GHz to 2.495 GHz
KC: 2.4 GHz to 2.483 GHz
ETSI: 13 (3 non-overlapping)
FCC: 11 (3 non-overlapping)
MIC: 14 (4 non-overlapping)
KC: 13 (3 non-overlapping)
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
Feature
5 GHz Frequency Bands
Description
ETSI
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch
100/104/108/112/116/120/124/128/132/136/140/144)
FCC
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch
100/104/108/112/116/120/124/128/132/136/140/144)
5.725 GHz to 5.825 GHz(Ch 149/153/157/161/165)
MIC (Japan)
5.15 GHz to 5.35 GHz
(Ch 36/40/44/48/52/56/60/64)
KC
5.15 GHz to 5.35 GHz
(Ch 36/40/44/48/52/56/60/64)
5.725 GHz to 5.825 GHz (Ch 149/153/157/161/165)
5 GHz Operating Channels
(Wi-Fi)
ETSI: 19 non-overlapping
FCC: 25 non-overlapping
MIC: (Japan): 8 non-overlapping
KC: 12 non-overlapping
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
Feature
Transmit Power
Note: Transmit power on each
channels varies according to
individual country regulations.
All values for lowest data rate
is nominal, +/-2 dBm.
Others are +/-2.5dBm.
Note:
HT40 – 40 Mhz-wide channels
HT20 – 20 MHz-wide channels
Typical Receiver Sensitivity
Note: All values nominal, +/-3
dBm.
Operating Systems Supported
Description
802.11a
6 Mbps
17 dBm
54 Mbps
14 dBm
802.11b
1 Mbps
17 dBm
11 Mbps
17 dBm
802.11g
6 Mbps
17 dBm
54 Mbps
14 dBm
802.11n (2.4 GHz)
6.5 Mbps (MCS0)
17 dBm
65 Mbps (MCS7)
13 dBm
802.11n (5 GHz)
6.5 Mbps (MCS0;HT20)
17 dBm
65 Mbps (MCS7;HT20)
13 dBm
(MCS0;HT40)
14 dBm
(MCS7; HT40)
11 dBm
Bluetooth
1 Mbps
6 dBm
2 Mbps
6 dBm
3 Mbps
3 dBm
802.11a:
6 Mbps
-92 dBm
54 Mbps
-74 dBm (PER <= 10%)
802.11b:
1 Mbps
-94 dBm
11 Mbps
-87 dBm (PER <= 10%)
802.11g:
6 Mbps
-91 dBm
54 Mbps
-74 dBm (PER <= 10%)
802.11n (2.4 GHz)
MCS0 Mbps
-91 dBm
MCS7 Mbps
-71 dBm
802.11n (5 GHz)
MCS0 Mbps
-92 dBm
MCS7 Mbps
-71 dBm
Bluetooth:
1 Mbps
-83 dBm
(1DH1)
3 Mbps
-75 dBm
(3DH5)
BLE
-86 dBm
Windows Mobile 5.0, 6.0, 6.1, 6.5
Windows Embedded Compact (CE) 5.0, 6.0, 7.0, 2013
Windows 7, 8, 8.1
Linux 2.6.x, 3.x.x, 4.0.x kernel
Android 4.1.2 (Jellybean) and forward
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
Feature
Security
Compliance
Certifications
Warranty
Description
Standards
Wireless Equivalent Privacy (WEP)
Wi-Fi Protected Access (WPA)
IEEE 802.11i (WPA2)
Encryption
Wireless Equivalent Privacy (WEP, RC4 Algorithm)
Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)
Advanced Encryption Standard (AES, Rijndael Algorithm)
Encryption Key Provisioning
Static (40-bit and 128-bit lengths)
Pre-Shared (PSK)
Dynamic
802.1X Extensible Authentication Protocol Types
EAP-FAST
PEAP-MSCHAPv2
EAP-TLS
PEAP-TLS
LEAP
EAP-TTLS
PEAP-GTC
ETSI Regulatory Domain
EN 300 328 (Wi-Fi®)
EN 300 328 v1.8.1 (BT 2.1)
EN 301 489-1
EN 301 489-17
EN 301 892
EN 60950-1
EU 2002/95/EC (RoHS)
FCC Regulatory Domain
FCC 15.247 DTS – 802.11b/g (Wi-Fi) – 2.4 GHz
FCC 15.407 UNII – 802.11a (Wi-Fi) – 5 GHz
FCC 15.247 DSS – BT 2.1
Industry Canada
RSS-247 – 802.11a/b/g/n (Wi-Fi) – 2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz
RSS-247 – BT 2.1
Wi-Fi Alliance
802.11a, 802.11b, 802.11g , 802.11n
WPA Enterprise
WPA2 Enterprise
Cisco Compatible Extensions (Version 4)
Bluetooth SIG Qualification
Five Year Limited Lifetime
All specifications are subject to change without notice
Embedded Wireless Solutions Support Center:
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www.lairdtech.com/wireless
10
© Copyright 2015 Laird. All Rights Reserved
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Europe: +44-1628-858-940
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MSD50NBT
Hardware Integration Guide
WLAN FUNCTIONAL DESCRIPTION
Overview
The MSD50NBT WLAN block is based on the Qualcomm-Atheros AR6004 802.11a/b/g/n chipset. It is optimized
for low power embedded applications and is configured to operate in dual-band, two-stream (2x2 MIMO) mode.
Its functionality includes:



Improved throughput on the link due to frame aggregation, RIFS (reduced inter-frame spacing), and half
guard intervals.
Support for STBC (space time block codes) and LDPC (Low Density Parity Check) codes.
Improved 11n performance due to features such as 11n frame aggregation (A-MPDU and A-MSDU) and
low-overhead host-assisted buffering (RX A-MSDU and RX A-MPDU). These techniques can improve
performance and efficiency of applications involving large bulk data transfers such as file transfers or highresolution video streaming.
Other functionality includes the following:
Feature
Reset Control
Description
CHIP_PWD_L and BT_RST_L pins must be asserted low to reset Wi-Fi and Bluetooth. After
these signals are de-asserted, the radio waits for host communication. Until then, all
modules except the host interface are held in reset.
Once the host has initiated communication, the radio turns on its crystal and then the PLL.
After all clocks are stable and running, the block resets are automatically de-asserted.
Note: Because BT chip derives clock from WLAN, the Bluetooth function should be
powered down/reset whenever WLAN is reset.
The MSD50NBT has an RTC block which controls the clocks and power going to other
internal modules. Its inputs consist of sleep requests from these modules and its outputs
consists of clock enable and power signals which are used to gate the clocks going to these
modules. The RTC block also manages resets going to other modules with the device. The
MSD50NBT’s lo ki g is g ouped i to t o t pes: high-speed and low-speed.
High Speed Clocking
System Clocking
(RTC Block)
The reference 26 MHz clock source inside the MSD50NBT drives the PLL and RF synthesizer
of Wi-Fi and Bluetooth. To minimize power consumption, the reference clock source is
powered off in SLEEP, HOST_OFF, and OFF states.
Low Speed Clocking
The MSD50NBT has an 32.768 KHz oscillator that provide slow clock for BT to get deep
sleep mode.
Interface Clock
The host interface clock represents another clock domain for the MSD50NBT. This clock comes from
the SDIO and is independent from the other internal clocks. It drives the host interface logic as well
as certain registers which can be accessed by the host in HOST_OFF and SLEEP states.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
11
© Copyright 2015 Laird. All Rights Reserved
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MSD50NBT
Hardware Integration Guide
Feature
Description
The MSD50NBT Wireless MAC consists of five major blocks:
 Host interface unit (HIU) for bridging to the AHB for bulk data accesses and APB for
register accesses
MAC/BB/RF Block  Ten queue control units (QCU) for transferring TX data
 Ten DCF control units (DCU) for managing channel access
 Protocol control unit (PCU) for interfacing to baseband
DMA receive unit (DRU) for transferring RX data
Baseband Block
The MSD50NBT baseband module (BB) is the physical layer controller for the 802.11b/g/n
air interface. It is responsible for modulating data packets in the transmit direction and
detecting and demodulating data packets in the receive direction. It has a direct control
interface to the radio to enable hardware to adjust analog gains and modes dynamically.
Clock Sharing
Clock sharing is implemented on the MSD50NBT. The Bluetooth chip (CSR8811) receives a
reference clock from Wi-Fi chip (QCA6004). When Wi-Fi is in power off/reset state, no
26MHz reference clock is available; therefore, bluetooth is also off.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
12
© Copyright 2015 Laird. All Rights Reserved
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Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
BLUETOOTH FUNCTIONAL DESCRIPTION
The MSD50NBT Bluetooth (BT) block is based on CSR8811A08 and described in the table below:
Table 3: Bluetooth functions
Feature
HCI-UART Interface
PCM or I2S Interface
CPU and Memory
Build-in Standard
WLAN Coexistence
Reference Clock
BT Low Energy
Reset
Description
The UART Interface is a standard high-speed UART interface. It operates up to 4 Mbps,
supporting Bluetooth HCI UART interface.
 Continuous PCM encoded audio data transmission and reception over Bluetooth.
 Processor overhead reduction through hardware support for continual
transmission and reception of PCM data.
 A bidirectional digital audio interface that routes directly into the baseband layer
of the firmware. It does not pass through the HCI protocol layer.
 Hardware on CSR8811 for sending data to and from a SCO connection.
 Up to three SCO connections on the PCM interface at any one time.
 PCM interface master, generating PCM_SYNC and PCM_CLK.
 PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.
 Various clock formats including:
 *Long Frame Sync
 *Short Frame Sync
 GCI timing environments
 13-bit or 16-bit linear, 8- it μ-law or A-law companded sample formats.
 Receives and transmits on any selection of three of the first four slots following
PCM_SYNC.
 The PCM configuration options are enabled by setting SKEY_PCM_CONFIG32.
The CSR8811 uses a 16-bit RISC MCU for low power consumption and efficient use of
memory. The MCU, interrupt controller, and event timer run the Bluetooth software
stack and control the Bluetooth radio and host interfaces.
56 KB of on-chip RAM is provided to support the RISC MCU and is shared between the
ring buffers used to hold voice/data for each active connection and the generalpurpose memory required by the Bluetooth stack.
5 Mb of Internal ROM memory is available on the CSR8811. This memory is provided
for system firmware, storing CSR8811 settings and program code.
The MSD50NBT supports internally the standard WLAN coexistence interface through
the WLAN_ACTIVE, BT_PRIORITY, and BT_ACTIVE pins.
The BT block is configured for 26 MHz reference clock frequency. The clock source is
provided to BT internally from the WLAN block on demand from BT_CLK_REQ.
Note: The WLAN block must be initialized prior before BT clock sharing is enabled.
The MSD50NBT supports Low Energy specification which allows for connection to
devices with single mode LE function (such as a watch, sensor, and HID). The
implementation is optimized for coexistence with WLAN.
The pin BT_RST_L resets and powers down the BT block.
Holding the BT_RST_L pin at GND turns off the entire BT block; all state information is
lost. To ensure a full reset, the reset signal should be asserted for a period greater than
5 ms.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
13
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
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MSD50NBT
Hardware Integration Guide
Feature
Radio
BT_WAKEUP_HOST
VDDIO
Description
The BT radio shares the single antenna port with the WLAN through an internal 3-way
RF switch. The MSD50NBT implements WLAN/BT coexistence internally.
VDDIO is to set the I/O voltage internally with either 1.8 V or 3.3 V to ensure same
voltage level for the internal Wi-Fi and BT coexistence signal. Refer to the reference
design specifications for details.
Pin-12 on MSD50NBT is reserved for BT to wake host from deep sleep mode. Current
s/w may not support it. Contact Laird for more information.
Pin-21 on MSD50NBT is WLAN Host IO (SDIO) power supply input. Can be either 1.8V
or 3.3V.
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Table 4 summarizes the absolute maximum ratings and Table 5 lists the recommended operating conditions for
the MSD50NBT. Absolute maximum ratings are those values beyond which damage to the device can occur.
Functional operation under these conditions, or at any other condition beyond those indicated in the
operational sections of this document, is not recommended.
Note: Maximum rating for signals follows the supply domain of the signals.
Table 4: Absolute Maximum Ratings
Symbol (Domain)
VDDIO
VCC3_3
Storage
ANT1; ANT2
ESD
Parameter
WLAN host SDIO interface and BT I/O supply
External 3.3V power supply
Storage Temperature
Maximum RF input (reference to 50-Ω input)
Electrostatic discharge tolerance
Max Rating
-0.3 to 4.0
-0.3 to 3.6
-40 to +85
+10
2000
Unit
°C
dBm
Recommended Operating Conditions
Table 5: Recommended Operating Conditions
Symbol (Domain)
VDDIO
VCC3_3
T-ambient
Parameter
WLAN host interface and BT I/O
supply
External 3.3V power supply
Ambient temperature
Min
Typ
Max
Unit
1.71/3.2
1.8/3.3
1.89/3.46
3.2
-30
3.30
25
3.46
85
°C
DC Electrical Characteristics
Table 6 and Table 7 list the general DC electrical characteristics over recommended operating conditions (unless
otherwise specified).
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MSD50NBT
Hardware Integration Guide
Table 6: General DC Electrical Characteristics (For 3.3V I/O Operation)
Symbol
Parameter
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
Without Pullup or Pulldown
Input
Leakage
With Pull-up
Current
IIL
Conditions
High Level Output Voltage
VOL
Low Level Output Voltage
Typ
Max
0.7 x VDD
With Pulldown
VOH
Min
Unit
0.3 x VDD
0V < VIN < VDD
0V < VOUT< VDD
-3
nA
0 V < VIN < VDD
0V < VOUT < VDD
16
48
µA
0V < VIN < VDD
0V < VOUT < VDD
-14
-47
µA
0.1 x VDD
0.1 x VDD
IOH = -4mA
IOH = -12mA
IOH = 4mA
IOH = 12mA
0.9 x VDD
0.9 x VDD
Table 7: General DC Electrical Characteristics (For 1.8V I/O Operation)
Symbol
VIH
VIL
IIL
Parameter
High Level Input Voltage
Low Level Input Voltage
Input
Without Pull-up
or Pull-down
Leakage
Current
With Pull-up
With Pull-down
VOH
VOL
High Level Output Voltage
Low Level Output Voltage
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Conditions
Min
0.7 x VDD
Typ
Max
0.3 x VDD
-3
Unit
nA
3.5
13
µA
-6.2
-23
µA
0V < VIN < VDD
0V < VOUT < VDD
0V < VIN < VDD
0V < VOUT < VDD
0V < VIN < VDD
0V < VOUT < VDD
IOH = -4mA
0.9 x VDD
IOH = -12mA
0.9 x VDD
IOH = 4mA
0.1 x VDD
IOH = 12mA
0.1 x VDD
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MSD50NBT
Hardware Integration Guide
Figure 1: Power On/Off Timing
Figure 2: Power On/Off Timing
Table 8: Timing Diagram Definitions
Timing
Tb
Tc
Td
Tf
Tg
Description
Time between VDD33 (3.3V )supplies valid, to WiFi reset (pin48;CHIP_PWD_L ) negation.
Note: have suitable 10K ohm Pull-up on pin-48, already. No extra
pull-up resistor is required.
Time between VDD33 (3.3V) supplies valid and
BT_RST_L (pin-32) negation
Time between WiFi reset (pin-48;CHIP_PWD_L ) negation and
VDD33 (3.3V) invalid, or time between BT_RST_L (pin-32) negation
and VDD33(3.3V) invalid.
Time of WiFi reset (pin-48; CHIP_PWD_L ) assertion during reset or
power down period. 3.3V should keep ON.
Time of BT_RST_L (pin-32) assertion during reset or power down
period. 3.3V should keep ON.
Min
Unit
µsec
msec
µsec
µsec
We suggest that Tb and Tf timing is greater than 5µsec but no longer than 100 msec.
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MSD50NBT
Hardware Integration Guide
WLAN Radio Receiver Characteristics
Table 9 and Table 10 summarize the WLAN MSD50NBT receiver characteristics.
Table 9: WLAN Receiver Characteristics for 2.4 GHz Signal Chain Operation
Symbol
Frx
Parameter
Receive input frequency range
Srf
Sensitivity
CCK, 1 Mbps
-94
CCK, 11 Mbps
OFDM, 6 Mbps
-87
-91
Min
2.412
See Note3
OFDM, 54 Mbps
HT20, MCS0
Radj
Conditions
HT20, MCS7
Adjacent channel rejection
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
Typ
Max
2.484
Unit
GHz
dBm
-74
-91
-71
32
16
31
14
See Note4
dB
Performance data are measured under signal chain operation.
Performance data are measured under signal chain operation.
Table 10: WLAN Receiver Characteristics for 5 GHz Dual Chain Operation
Symbol
Frx
Srf
Parameter
Receive input frequency
range
Sensitivity
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
Radj
Conditions
Min
5.15
Typ
Unit
GHz
-92
-74
See Note5
-92
-71
HT40, MCS0
HT40, MCS7
-86
-66
Adjacent channel rejection
OFDM, 6 Mbps
22
OFDM, 54 Mbps
HT20, MCS0
Max
5.825
See Note6
HT20, MCS7
20
dBm
dB
19
Performance data are measured under signal chain operation.
Performance data are measured under signal chain operation.
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MSD50NBT
Hardware Integration Guide
WLAN Transmitter Characteristics
Table 11: WLAN Transmitter Characteristics for 2.4 GHz Per Chain Operation
Symbol
Ftx
Parameter
Transmit output frequency range
Conditions
Pout
Output power
11b mask compliant
11g mask compliant
11g EVM compliant
11n HT20 mask compliant
11n HT20 EVM compliant
11n HT20 EVM compliant
See Note7
1Mbps
6Mbps
54Mbps
MCS0
MCS7
MCS15
ATx
Freq.
2412MHz
2442MHz
2472MHz
Transmit power accuracy at 17 dBm
Min
2.412
Typ
Max
2.484
17
17
14
17
13
13
dBm
+ 2.0
dB
1 Mbps
54 Mbps
HT20 MCS7
1 Mbps
54 Mbps
18dBm
15dBm
14dBm
18dBm
15dBm
Typical Current
Consumption Single
Chain (mA)8
420
350
340
420
350
HT20 MCS7
1 Mbps
14dBm
18dBm
340
420
420
560
54 Mbps
HT20 MCS7
15dBm
14dBm
350
340
450
420
Output Power Per
Chain (dBm)
Mode/Rate (Mbps)
Unit
GHz
Max. Current
Consumption Single
Chain (mA)8
560
450
420
560
450
Table 12: WLAN Transmitter Characteristics for 5 GHz Per Chain Operation
Symbol
Ftx
Pout
Parameter
Transmit output frequency range
Output power
Conditions
Typ
6Mbps
54Mbps
17
14
11n HT20 mask compliant
11n HT20 EVM compliant
MCS0
MCS7
17
13
11n HT20 EVM compliant
11n HT40 mask compliant
MCS15
MCS0
13
14
11n HT40 EVM compliant
11n HT40 EVM compliant
Transmit power accuracy at 17dBm
MCS7
MCS15
11
11
+ 2.0
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Max
5.925
Unit
GHz
See Note3
11a mask compliant
11a EVM compliant
ATx
Min
5.15
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MSD50NBT
Hardware Integration Guide
Freq.
5180MHz
5500MHz
5825MHz
15dBm
14dBm
Typical Current
Consumption Single
Chain (mA)8
490
450
Max. Current
Consumption Single
Chain (mA)8
590
560
HT40 MCS7
54 Mbps
12dBm
15dBm
470
490
540
590
HT20 MCS7
HT40 MCS7
14dBm
12dBm
450
470
560
540
54 Mbps
HT20 MCS7
15dBm
14dBm
490
450
590
560
HT40 MCS7
12dBm
470
540
Mode/Rate
[Mbps]
Output Power Per
Chain [dBm]
54 Mbps
HT20 MCS7
Performance data are measured under single chain operation.
Note:
Final TX power values on each channels are limited by the regulatory certification test limit.
Note: 2.4GHz does not support HT40 operation, only 5GHz support HT40 operation.
BLUETOOTH RADIO CHARACTERISTICS
Table 13 through Table 14 describe the basic rate transmitter performance, enhanced data transmitter
performance, basic rate receiver performance, enhanced rate receiver performance, and current consumption
conditions at 25°C.
Table 13: Basic Rate Transmitter Performance Temperature at 25°C (3.3V)
Test Parameter
Maximum RF Output Power
Frequency Range
20 dB Bandwidth
Adjacent Channel TX Power F = F0 +
2 MHz
Adjacent Channel TX Power F = F0
+3 MHz
Δf1avg Maximum Modulation
Min
2.4
—
Typ
—
925
Max
—
2.4835
—
BT Spec.
–6 to +10
2.4 ≤ f ≤ 2.4835
≤ 1000
Unit
dBm
GHz
KHz
—
–36
—
≤ –20
dBm
—
–42
—
≤ –40
dBm
140
165
175
140 < Δf1avg < 175
KHz
Δf2max Minimum Modulation
Δf2avg/Δf1avg
Initial Carrier Frequency
Drift Rate
Drift (DH1 packet)
Drift (DH5 packet)
—
—
—
—
—
—
135
0.9
—
—
—
—
—
—
≥ 115
≥ 0.80
≤±75
≤ 20
≤25
≤ 40
KHz
—
KHz
KHz/50 µs
KHz
KHz
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MSD50NBT
Hardware Integration Guide
Table 14: Enhanced Data Rate Transmitter Performance 25°C (3.3V)
Test Parameter
Relative Transmit Power
Min
–1
Typ
Max
BT Spec.
–4 to +1
Unit
dBm
≤ ±10
KHz
≤ ±75
KHz
≤ ±75
KHz
Max Carrier Frequency
Stability |wo|
π/4 DQPSK
8 DPSK
—
—
—
—
Max Carrier Frequency
Stability |wi|
π/4 DQPSK
—
—
8 DPSK
—
—
Max Carrier Frequency
Stability |w0+wi|
π/4 DQPSK
—
—
8 DPSK
—
1.5
—
π/4 DQPSK
—
—
≤ 20
8 DPSK
—
—
≤13
π/4 DQPSK
—
16
—
≤ 35
8 DPSK
—
15
—
≤ 25
π/4 DQPSK
—
12
—
≤ 30
8 DPSK
—
12
—
≤ 20
—
—
—
—
99
–60
–28
–32
—
—
—
—
≥ 99
< –40
≤ –20
≤ –26
dBm
dBm
dB
RMS DEVM
Peak DEVM
99% DEVM
EDR Differential Phase Encoding
F≥ ± 3MHz
Adjacent Channel Power
F = ± 2MHz
F = ±1MHz
Table 15: Basic Rate Receiver Performance at 3.3V
Test Parameter
Min
Typ
Max
BT Spec.
Unit
Sensitivity
BER ≤ 0.1%
—
–84
-78
≤ –70
dBm
Maximum Input
BER ≤ 0.1%
–20
-10
—
≥ –20
dBm
Co-Channel
—
—
11
11
Adjacent Channel
(± 1 MHz)
Second Adjacent
Channel (± 2 MHz)
—
-4/-2
dB
—
-35/-28
–30
–30
dB
Third Adjacent
Channel (± 3 MHz)
—
-42
–40
–40
dB
–39
-30
≥ –39
dBm
Carrier-to-Interferer Ratio
(C/I)
Maximum Level of Intermodulation Interferers
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MSD50NBT
Hardware Integration Guide
Table 16: Enhanced Data Rate Receiver Performance 3.3V
Test Parameter
Min
Typ
Max
Bluetooth
Specification
Unit
Sensitivity (BER ≤0.01%)
8 DPSK
—
–76
-71
≤ –70
dBm
Maximum Input (BER
≤0.1%)
π/4 DQPSK
8 DPSK
–20
–20
—
—
—
—
≥ –20
≥ –20
dBm
dBm
Co-Channel C/I (BER
≤0.1%)
π/4 DQPSK
8 DPSK
—
—
10
18
13
20
≤ ±13
≤ ±20
dB
dB
Adjacent Channel C/I
(BER≤ 0.1%)
π/4 DQPSK
8 DPSK
—
—
-9/-6
-3/0
≤0
≤5
dB
dB
Second Adjacent Channel
C/I (BER ≤ 0.1%)
π/4 DQPSK
8 DPSK
π/4 DQPSK
8 DPSK
—
—
—
—
-42/-28
-28/-22
-45
-39
–30
–25
–40
–33
≤ –30
≤ –25
≤ –40
≤ –33
dB
dB
dB
dB
Third Adjacent Channel C/I
(BER ≤ 0.1%)
SDIO TIMING REQUIREMENTS
The following figure (Figure 3) and table display SDIO default mode timing.
Figure 3: SDIO Default Mode Timing
Note: Timing is based on CL ≤ 40 pF load on CMD and Data.
Table 17: SDIO Timing Requirements
Symbol
fPP
Parameter
Frequency – Data Transfer mode
Min.
Typ.
Max.
50
Unit
MHz
tWL
tWH
Clock low time
Clock high time
ns
ns
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MSD50NBT
Hardware Integration Guide
Symbol
tTLH
tTHL
Parameter
Clock rise time
Clock low time
Min.
Inputs: CMD, DAT (referenced to CLK)
Input setup time
tISU
tIH
Input hold time
Outputs: CMD, DAT (referenced to CLK)
tODLY
Output delay time – Data Transfer mode
Typ.
Max.
10
10
Unit
ns
ns
ns
ns
14
ns
PIN DEFINITIONS
Pin #
Name
Type
GND
BT_UART_TXD
No Connect
No Connect
BT_UART_RTS_N
Voltage
Reference
VDD_IO
VDD_IO
BT_UART_RXD
No Connect
Wake On Wireless
VDD_IO
VDD_IO
10
No Connect
BT_PCM_OUT
VDD_IO
11
BT_UART_CTS_N
VDD_IO
"Clear-to-send signal for the Bluetooth
UART interface, active low”
N/C
12
BT_WAKEUP_HOST
VDD_IO
When BT wakes up from its deep sleep
state, it sends an H pulse signal out to
Host. Normally, it is Low state.
Note: The current software does not
support it.
N/C
13
VCC3_3
3.3V
14
15
No Connect
No Connect
3.3V Power Supply for the Module. (3.2V
Min; 3.46V Max)
No Connect
No Connect
16
17
No Connect
No Connect
No Connect
No Connect
N/C
N/C
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Description
Ground
Bluetooth UART Serial output
No Connect
No Connect
"Request-to-send signal for the
Bluetooth UART interface, active low"
Bluetooth UART Serial input
No Connect
Reserved as Wake-ON-Wireless
(WOW) LAN, WLAN output signal to
wake up host, active Low and need
external 10K pull up.
Note: The current software does not
support it.
No Connect
BT PCM synchronous data output
22
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If Not
Used
GND
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
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MSD50NBT
Hardware Integration Guide
Pin #
Name
Type
18
19
No Connect
No Connect
Voltage
Reference
20
21
BT_PCM_SYNC
VDD_IO
I/O
VDD_IO
BT PCM Synchronous data
Bus and IO voltage level configuration.
Either 3.3V or 1.8V
N/C
1.8V
or
3.3V
22
23
BT_PCM_IN
No Connect
VDD_IO
BT PCM synchronous data input
No Connect
N/C
N/C
24
25
BT_PCM_CLK
No Connect
I/O
VDD_IO
BT PCM clock
No Connect
N/C
N/C
26
27
No Connect
SDIO_DATA_2
I/O
VDD_IO
N/C
N/C
28
29
No Connect
VCC3_3
30
31
32
GND
GND
BT_RST_L
VDD_IO
33
34
35
36
37
38
39
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
SDIO Data 2 – Internal pull-up. No
external pull-up required
No Connect
3.3V Power Supply for the Module. (3.2V
Min; 3.46V Max)
Ground
Ground
BT chip power-down control. Driving this
pin active low powers down or resets the
BT signal. Has internal weak pull-up.
Should be active low for at least 5ms to
reset the BT.
Note:10K ohm internal pull-up.
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
40
41
42
43
44
45
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
N/C
N/C
N/C
N/C
N/C
N/C
46
47
No Connect
No Connect
No Connect
No Connect
N/C
N/C
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If Not
Used
N/C
N/C
Description
No Connect
No Connect
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N/C
3.3V
GND
GND
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
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MSD50NBT
Hardware Integration Guide
Pin #
Name
Type
48
CHIP_PWD_L
Voltage
Reference
VDD_IO
49
50
51
52
53
54
55
56
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
SDIO_CMD
SDIO_CLK
I/O
VDD_IO
VDD_IO
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
SDIO Command – Internal pull-up.
SDIO Clock (25MHz max)
N/C
N/C
N/C
N/C
N/C
N/C
N/C
57
SDIO_DATA_0
I/O
VDD_IO
N/C
58
SDIO_DATA_3
I/O
VDD_IO
59
SDIO_DATA_1
I/O
VDD_IO
60
GND
SDIO Data 0 – Internal pull-up. No
external pull-up required
SDIO Data 3 – Internal pull-up. No
external pull-up required
SDIO Data 1 – Internal pull-up. No
external pull-up required
Ground
Description
"WLAN Power Down (0=power down, 1=
WLAN awake)
Note:10K ohm internal pull-up.
If Not
Used
N/C
N/C
N/C
N/C
GND
MSD40NBT, MSD45N, and MSD50NBT Pin Comparison Table
Pin Name – MSD40NBT
Pin Name – MSD45N
Pin Name – MSD50NBT
GND
BT_UART_TXD
BT_PRIORITY
BT_GPIO_6
GND
No Connect
BT_PRIORITY
No Connect
GND
BT_UART_TXD
No Connect
No Connect
BT_UART_RTS_N
BT_UART_RXD
No Connect
No Connect
BT_UART_RTS_N
BT_UART_RXD
BT_HOST_WAKE_B
RSVD
No Connect
No Connect
No Connect
Wake On Wireless
10
RSVD
BT_PCM_OUT
No Connect
No Connect
No Connect
BT_PCM_OUT
11
12
BT_UART_CTS_N
BT_WAKE_B
No Connect
No Connect
BT_UART_CTS_N
BT_WAKEUP_HOST
13
14
15
VCC3_3
No Connect
No Connect
VCC3_3
No Connect
No Connect
VCC3_3
No Connect
No Connect
Pin #
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MSD50NBT
Hardware Integration Guide
Pin Name – MSD40NBT
Pin Name – MSD45N
Pin Name – MSD50NBT
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
No Connect
No Connect
No Connect
No Connect
BT_PCM_SYNC
No Connect
BT_PCM_IN
No Connect
BT_PCM_CLK
No Connect
SYS_RST_L
SDIO_DATA_2
RSVD
VCC3_3
GND
GND
BT_RST_L
No Connect
No Connect
No Connect
RSVD
No Connect
No Connect
No Connect
No Connect
No Connect
RSVD
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
VDD_IO
No Connect
No Connect
No Connect
No Connect
No Connect
SDIO_D2
WL_ACTIVE
VCC3_3
GND
GND
No Connect
No Connect
No Connect
No Connect
BT_ACTIVE
No Connect
No Connect
No Connect
No Connect
No Connect
WL_LED_ACT/ANTE
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
BT_PCM_SYNC
VDD_IO
BT_PCM_IN
No Connect
BT_PCM_CLK
No Connect
No Connect
SDIO_DATA_2
RSVD
VCC3_3
GND
GND
BT_RST_L
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
45
46
47
48
No Connect
No Connect
No Connect
CHIP_PWD_L
No Connect
No Connect
No Connect
CHIP_PWD_L
No Connect
No Connect
No Connect
CHIP_PWD_L
49
50
51
No Connect
RSVD
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
No Connect
Pin #
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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MSD50NBT
Hardware Integration Guide
Pin #
52
53
54
55
56
57
58
59
60
Pin Name – MSD40NBT
Pin Name – MSD45N
Pin Name – MSD50NBT
RSVD
RSVD
RSVD
SDIO_CMD
SDIO_CLK
SDIO_DATA_0
SDIO_DATA_3
SDIO_DATA_1
GND
No Connect
No Connect
No Connect
SDIO_CMD
SDIO_CLK
SDIO_D0
SDIO_D3
SDIO_D1
GND
No Connect
No Connect
No Connect
SDIO_CMD
SDIO_CLK
SDIO_DATA_0
SDIO_DATA_3
SDIO_DATA_1
GND
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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MSD50NBT
Hardware Integration Guide
MECHANICAL SPECIFICATIONS
Module dimensions of MSD50NBT are 16x16x2.5mm. Detail drawings are shown in Figure 4.
SiP 15x15
Figure 4: Module dimension of SSD50NBT
Note:
The Wi-Fi MAC address is located on the product label. The BT MAC address is always be numerically
subsequent to the Wi-Fi MAC address. Therefore, the BT MAC address is Wi-Fi MAC address plus one.
MOUNTING
The MSD50NBT connects to the host via a 60-pin connector. In addition, there are three mounting holes used to
secure the device to the host using 2 mm mounting screws.
Laird recommends a 1.5 mm metal spacer (bushing) with a conductive mounting screw to connect the exposed
ground pads of the radio circuit board to the host ground plane. A 1.5 mm conductive metal spacer with a
maximum OD of 4 mm maximizes grounding of the radio and helps to reduce emissions from the radio circuit
board. The spacer may also prevent the MSD board from slanting and breaking the connection to the host
device when the board is attached to the host.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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MSD50NBT
Hardware Integration Guide
Figure 7: Mounting information for MSD50NBT
REFERENCE SCHEMATIC OF MSD50NBT
RF LAYOUT DESIGN GUIDELINES/PRECAUTIONS
The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your
device.






Do not run antenna cables directly above or directly below the radio.
Do not place any parts or run any high speed digital lines below the radio.
If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices
as far apart from each other as possible. Also, make sure there are at least 25dB isolation between
Bluetooth antenna and Wi-Fi antenna.
Laird recommends the use of a double shielded cable for the connection between the radio and the
antenna elements.
Be sure to put the capacitor on the power pin as close as possible to reduce the radiation issue.
Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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MSD50NBT
Hardware Integration Guide




In order to get maximum throughput when operate at MIMO 2x2, two antennas with at least 25dB isolation
is recommended.
To avoid negatively impacting TX power and receiver sensitivity, do no cover the antennas with metallic
objects or components.
Opening/handing/removing must be done on an anti-ESD treated workbench.
All workers must also have undergone anti-ESD treatment.
The devices should be mounted within one year of the date of delivery.
REGULATORY
Certified Antennas
Model
2400~2483.5MHz
5150~5250MHz 5250~5350MHz
5470~5725MHz 5725~5850MHz
2.1 dBi (2.4-2.5 GHz), 2.4 dBi (4.9 GHz)
2.6 dBi (5.25 GHz), 3.4 dBi (5.875 GHz)
Type
Connector
Laird MAF94051
Dipole
RP-SMA
Laird/NanoBlade-IP04
PCB
Dipole
IPEX MHF
2 dBi (2.4-2.5 GHz),
3.9 dBi (5.15-5.35 GHz), 4 dBi (5.6 GHz)
Laird/MAF95310 Mini Nano Blade
Flex
PCB
Dipole
IPEX MHF
2.79 dBi (2.4 GHz), 3.38 dBi (5 GHz)
Laird/NanoBlue-IP04
PCB
Dipole
IPEX MHF
2 dBi (2.4 GHz only)
IPEX MHF
2.5 dBi (2.390-2.490 GHz),
3.5 dBi (4.900-5.100, 5.150-5.350,
5.70-5.900 GHz)
Isolated
Magnetic
Dipole
Ethertronics/WLAN_1000146
FCC AND INDUSTRY CANADA REGULATORY
Model
MSD50NBT
US/FCC
SQG-MSD50NBT
CANADA/IC
3147A-MSD50NBT
The MSD50NBT has been designed to pass certification with the antenna listed below. The required antenna
impedance is 50 ohms.
Peak gain ( dBi )
Model
Type
Connector
Laird
MAF94051
Dipole
RP-SMA
Laird
NanoBlade-IP04
PCB Dipole
IPEX MHF
2 dBi
Laird
MAF95310 Mini
NanoBlade Flex
PCB Dipole
IPEX MHF
2.79 dBi
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
2400~2483.5 5150~5250
MHz
MHz
2.1 dBi
2.4 dBi
5250~5350 5470~5725 5725~5850
MHz
MHz
MHz
2.6 dBi
3.4 dBi
3.9 dBi
29
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4 dBi
3.38 dBi
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MSD50NBT
Hardware Integration Guide
Peak gain ( dBi )
Model
Type
Connector
Laird
NanoBlue-IP04
PCB Dipole
IPEX MHF
2dBi
Ethertronics
WLAN_1000146
Isolated
Magnetic
Dipole
IPEX MHF
2.5dBi
3.5 dBi
2400~2483.5 5150~5250
MHz
MHz
5250~5350 5470~5725 5725~5850
MHz
MHz
MHz
FCC
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one of the
following measures:




Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
Important Note:
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator and your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Country Code selection feature to be disabled for products marketed to the US/Canada.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20 cm is maintained between the antenna and users, and
The transmitter module may not be co-located with any other transmitter or antenna,
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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MSD50NBT
Hardware Integration Guide
For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by
supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to
Regulatory Domain change.
As long as the three conditions above are met, further transmitter testing will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.
Important Note:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with
another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on
the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm
may be maintained between the antenna and users. The final end product must be labeled in a visible area with
the following: Contains FCC ID: SQG-MSD50NBT.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
e o e this RF odule i the use ’s a ual of the e d p odu t hi h i teg ates this odule.
The end user manual shall include all required regulatory information/warning as show in this manual.
Industry Canada
Industry Canada Statement
This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two
conditions:


This device may not cause interference; and
This device must accept any interference, including interference that may cause undesired operation of
the device.
Le p se t appa eil est o fo e au CNR d’I dust ie Ca ada appli a les au appa eils adio e e pts de
li e e. L’e ploitatio est auto is e au deux conditions suivantes:


l’appa eil e doit pas p odui e de ouillage;
l’utilisateu de l’appa eil doit a epte tout ouillage adio le t i ue su i,
sus epti le d’e o p o ett e le fo tio e e t.
e si le
ouillage est
This radio transmitter (IC: 3147A-MSD50NBT) has been approved by Industry Canada to operate with the
antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list,
having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this
device.
Le présent émetteur radio (IC: 3147A-MSD50NBT) a été approuvé par Industrie Canada pour fonctionner avec
les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus
Embedded Wireless Solutions Support Center:
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MSD50NBT
Hardware Integration Guide
dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour
l'exploitation de l'émetteur.
Antenna Information
Peak gain ( dBi )
Model
Type
Connector
Laird
MAF94051
Dipole
RP-SMA
Laird
NanoBlade-IP04
PCB Dipole
IPEX MHF
2 dBi
Laird
MAF95310 Mini
NanoBlade Flex
PCB Dipole
IPEX MHF
2.79 dBi
3.38 dBi
Laird
NanoBlue-IP04
PCB Dipole
IPEX MHF
2dBi
Ethertronics
WLAN_1000146
Isolated
Magnetic
Dipole
IPEX MHF
2.5dBi
3.5 dBi
2400~2483.5 5150~5250
MHz
MHz
2.1 dBi
2.4 dBi
5250~5350 5470~5725 5725~5850
MHz
MHz
MHz
2.6 dBi
3.4 dBi
3.9 dBi
4 dBi
Caution:
(i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for
harmful interference to co-channel mobile satellite systems;
(ii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 52505350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the EIRP limit;
(iii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 57255850 MHz shall be such that the equipment still complies with the EIRP limits specified for point-to-point and
non-point-to-point operation as appropriate; and
Operations in the 5.25-5.35GHz band are restricted to indoor usage only.
Avertissement:
(i) les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation
à l'intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les
mêmes canaux;
(ii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis pour les dispositifs
utilisant les bandes de 5250 à 5350MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e;
(iii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les dispositifs
utilisant la bande de 5725 à 5850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation
point à point et l'exploitation non point à point, selon le cas;
Les opérations dans la bande de 5.25-5.35GHz sont limités à un usage intérieur seulement.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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MSD50NBT
Hardware Integration Guide
Radiation Exposure Statement
This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Déclaration d'exposition aux radiations
Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé.
Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps.
This device is intended only for OEM integrators under the following condition:

The transmitter module may not be co-located with any other transmitter or antenna.
As long as the condition above is met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:

Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes
exigences de conformité supplémentaires requis pour ce module installé.
Important Note:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with
another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used
on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate Canada authorization.
Note Importante:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est
plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,
l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une
autorisation distincte au Canada.
End Product Labeling
The final end product must be labeled in a visible area with the following: Contains IC: 3147A-MSD50NBT.
Plaque signalétique du produit final
Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: Contient des IC: 3147AMSD50NBT.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
e o e this RF odule i the use ’s a ual of the e d p odu t hi h i teg ates this odule.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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MSD50NBT
Hardware Integration Guide
The end user manual shall include all required regulatory information/warning as show in this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon
d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements
comme indiqué dans ce manuel.
EUROPEAN UNION REGULATORY
The MSD50NBT has been tested for compliance with relevant standards for the EU market. MSD50NBT module
was tested with antennas listed below.
Model
2400~2483.5MHz
5150~5250MHz 5250~5350MHz
5470~5725MHz 5725~5850MHz
2.1 dBi (2.4-2.5 GHz), 2.4 dBi (4.9 GHz)
2.6 dBi (5.25 GHz), 3.4 dBi (5.875 GHz)
Type
Connector
Laird MAF94051
Dipole
RP-SMA
Laird/NanoBlade-IP04
PCB
Dipole
IPEX MHF
2 dBi (2.4-2.5 GHz),
3.9 dBi (5.15-5.35 GHz), 4 dBi (5.6 GHz)
Laird/MAF95310 Mini Nano Blade
Flex
PCB
Dipole
IPEX MHF
2.79 dBi (2.4 GHz), 3.38 dBi (5 GHz)
Laird/NanoBlue-IP04
PCB
Dipole
IPEX MHF
2 dBi (2.4 GHz only)
Isolated
Magnetic
Dipole
IPEX MHF
2.5 dBi (2.390-2.490 GHz),
3.5 dBi (4.900-5.100, 5.150-5.350,
5.70-5.900 GHz)
Ethertronics/WLAN_1000146
The OEM should consult with a qualified test house before entering their device into an EU member country to
make sure all regulatory requirements have been met for their complete device.
Reference the Declaration of Conformities listed below for a full list of the standards that the modules were
tested to. Test reports are available upon request.
EU DECLARATIONS OF CONFORMITY
MSD50NBT
Manufacturer:
Product:
EU Directive:
Conformity Assessment:
Laird
MSD50NBT
RTTE 1995/5/EC
Annex IV
Reference standards used for presumption of conformity:
Article No.
3.1a
Requirement
Health and Safety
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
Reference standard(s)
EN60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013
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MSD50NBT
Hardware Integration Guide
Article No.
Requirement
3.1b
Protection requirements with
respect to electromagnetic
compatibility
3.2
Means of the efficient use of
the radio frequency spectrum
Reference standard(s)
EN 301 489-1 V1.9.2 (2011-09)
EN 301 489-17 V2.2.1 (2012-09)
Emissions:
EN55022:2010/AC:2011 (Class B)
Immunity:
EN61000-4-2:2009
EN61000-4-3:2006/A1:2008/A2:2010
EN 300 328 V1.8.1 (2012-06)
EN 301 893 v1.8.1
ORDERING INFORMATION
Part Number
MSD50NBT
Description
2X2 802.11 a/b/g/n with BT4.0 dual mode module.
General Comments
This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If
in doubt, ask.
Česky
[Czech]
[Jméno výrobce] tímtoΝprohlašuje,ΝžeΝtentoΝ[typ zařízení] jeΝveΝshoděΝseΝzákladnímiΝpožadavkyΝ
aΝdalšímiΝpříslušnýmiΝustanovenímiΝsměrniceΝ1999/5/ES.
Dansk
[Danish]
Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets
typebetegnelse] overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.
Deutsch
[German]
Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in Übereinstimmung
mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der
Richtlinie 1999/5/EG befindet.
Eesti
[Estonian]
Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp = type of
equipment] vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele
teistele asjakohastele sätetele.
English
Hereby, [name of manufacturer], declares that this [type of equipment] is in compliance with
the essential requirements and other relevant provisions of Directive 1999/5/EC.
Español
[Spanish]
Por medio de la presente [nombre del fabricante] declara que el [clase de equipo] cumple con
los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva
1999/5/CE.
Ε ην ή
[Greek]
Μ ΝΣΗΝΝΠΑΡΟΤ΢Α [name of manufacturer] ΗΛΩΝ ΙΝΟΣΙ [type of equipment]
΢ΤΜΜΟΡΦΩΝ ΣΑΙΝΠΡΟ΢ΝΣΙ΢ΝΟΤ΢ΙΩ Ι΢ΝΑΠΑΙΣΗ΢ Ι΢ΝΚΑΙΝΣΙ΢ΝΛΟΙΠ ΢Ν΢Χ ΣΙΚ ΢Ν
ΙΑΣΑΞ Ι΢ΝΣΗ΢ΝΟ ΗΓΙΑ΢Ν1999/5/ Κ.
Français
[French]
Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est conforme aux
exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE.
Italiano
[Italian]
Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai
requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.
Latviski
[Latvian]
Aršo[name of manufacturer /izgatavotājanosaukums] deklarē,Νka[type of equipment / iekārtas
tips]atbilstDirektīvasΝ1999/5/EKΝbūtiskajāmprasībāmΝun citiemarΝtoΝsaistītajiemnoteikumiem.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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MSD50NBT
Hardware Integration Guide
Lietuvių
[Lithuanian]
Nederlands
[Dutch]
ŠiuoΝ[manufacturer name] deklaruoja,ΝkadΝšisΝ[equipment type] atitinka esminius reikalavimus
ir kitas 1999/5/EB Direktyvos nuostatas.
Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming
is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG.
Malti
[Maltese]
Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma malħtiġijietΝessenzjaliΝuΝmaΝprovvedimentiΝoħrajnΝrelevantiΝliΝhemmΝfid-Dirrettiva 1999/5/EC.
Magyar
[Hungarian]
Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus]megfelel a vonatkozó alapvetõ
követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.
Polski
[Polish]
Niniejszym [nazwa producenta] oświadcza,ΝżeΝ[nazwa wyrobu] jest zgodny z zasadniczymi
wymogamiΝorazΝpozostałymiΝstosownymiΝpostanowieniamiΝDyrektywyΝ1999/5/EC.
Português
[Portuguese]
[Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos
essenciais e outras disposições da Directiva 1999/5/CE.
Slovensko
[Slovenian]
[Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in ostalimi
relevantnimiΝdoločiliΝdirektiveΝ1999/5/ES.
Slovensky
[Slovak]
[Menovýrobcu]týmtovyhlasuje,Νže[typzariadenia]spĺňazákladnépožiadavkyΝaΝ
všetkypríslušnéustanoveniaSmerniceΝ1999/5/ES.
Suomi
[Finnish]
[Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen tyyppimerkintä]
tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin
muiden ehtojen mukainen.
Svenska
[Swedish]
Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de väsentliga
egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG.
Labeling Requirements
The final end product must be labeled in a visible area with the following notice:
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
36
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
MSD50NBT
Hardware Integration Guide
© Copyright 2015 Laird. All Rights Reserved. Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are
subject to change without notice. Responsibility for the use and application of Laird materials or products rests with the end user since Laird and its agents
cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird
materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall not be liable for incidental or
consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms and Conditions of Sale in effect from time to time, a copy of
which will be furnished upon request. When used as a tradename herein, Laird ea s Lai d PLC o o e o o e su sidia ies of Lai d PLC. Lai d™, Lai d
Te h ologies™, o espo di g logos, a d othe a ks a e t ade a ks o egiste ed t ade a ks of Lai d. Othe a ks a e the property of third parties.
Nothing herein provides a license under any Laird or any third party intellectual property right.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
37
© Copyright 2015 Laird. All Rights Reserved
Americas: +1-800-492-2320
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610

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