Laird Connectivity PROFLEX1SOC ProFLEX01-SOC User Manual manual
LS Research, LLC ProFLEX01-SOC manual
manual
ProFLEX01-SOC TRANSCEIVER MODULE
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Integrated Transceiver Modules for ZigBee / 802.15.4 (2.4 GHz)
Development Kit Available
FEATURES
• 100mW output power
• Long range: 4000 feet
• Miniature footprint: 0.9” x 1.63”
• Integrated PCB F antenna or u.fl connector
for external antenna
• Worldwide acceptance: FCC, IC and ETSI
• Integrated 8051 microcontroller with 256k
FLASH and 8k RAM
• 4MBit Serial FLASH
• Supports ZigBee, 802.15.4 MAC, RF4CE,
SimpliciTI, and custom
• LSR serial protocol based on 802.15.4 MAC
• Low power operation
• RoHS compliant
• Streamlined development with LSR design
services.
• License options available to purchase
design or integrate design.
APPLICATIONS
• Security
• Lighting Control
• HVAC Control
• Sensor Networks
• Medical
• Smart Energy
DESCRIPTION
The ProFLEX01-SOC module is a high
performance 2.4 GHz IEEE 802.15.4 System-
On-Chip (CC2530)
radio/microcontroller and
power amplifier (CC2591) in
a cost effective, pre-certified
footprint.
The module comes preloaded with the TI MAC-
Stack that can be used with the LSR host serial
protocol.
Full debug and programming capabilities are
included to develop custom applications. Easily
load the TI ZigBee stack, 802.15.4 MAC,
RF4CE, or SimplicitTI onto the module and
create your own network.
Need to get to market quickly? Not an expert in
802.15.4 or ZigBee? Need a custom antenna?
Would you like to own the design? Would you
like a custom design? Not quite sure what you
need? Do you need help with your host board?
LS Research Design Services will be happy to
develop custom hardware or software, integrate
the design, or license the design so you can
manufacture yourself. Contact us at
sales@lsr.com or call us at 262-375-4400.
ORDERING INFORMATION
Order Number
Description
450-0035
ProFLEX01-SOC Module with PCB F antenna
450-0044
ProFLEX01-SOC Module with u.fl connector for external antenna
450-0051
ProFLEX01-SOC Development Kit
Table 1 Orderable ProFLEX01-SOC Model Numbers
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MODULE ACCESSORIES
Order Number
Description
001-0001 2.4 GHz Dipole Antenna with Reverse
Polarity SMA Connector
080-0001 u.fl to Reverse Polarity SMA Bulkhead
Cable 105mm
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BLOCK DIAGRAM
CC2530 SOC
8051 Microcontroller
And
Radio
CC2591
(PA/LNA) Antenna
Serial I/O
Analog
GPIO
PGM/DBG TMR/PWM
Serial FLASH
(4MBit)
Figure 1 ProFLEX01-SOC Module Block Diagram – High-Level
DEVELOPMENT KIT
The ProFLEX01-SOC Development Kit can be
used out of the box to evaluate RF range
performance with the simple press of a button.
Users interested in further investigating the
performance and capabilities of the
ProFLEX01-SOC Module can use the
ModFLEX Test Tool. This PC-based software
can demonstrate just how easy it is to send &
receive data, collect performance data, change
channels, power levels, or addresses using the
LSR Serial Host Protocol with another
microcontroller.
More advanced users can use the development
board to create and debug their own software
for the ProFLEX01-SOC module using the
802.15.4 MAC, ZigBee stack, RF4CE stack, or
SimpliciTI stack from TI.
Part Number
Description
450-0051
ProFLEX01-SOC
Development Kit
Figure 2 ProFLEX01-SOC Development Board
Kit Contents
• ModFLEX Development Board with
ProFLEX01-SOC Series Transceiver
Module with F antenna (x2)
• USB Cable (x2)
• AA Batteries (x4)
• Software & Technical Information CD
• Quick Start Guide
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TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 1
MODULE ACCESSORIES ................................................................................................... 2
BLOCK DIAGRAM ............................................................................................................... 3
DEVELOPMENT KIT............................................................................................................ 3
Kit Contents ................................................................................................................................................. 3
MODULE PINOUT AND PIN DESCRIPTIONS .................................................................... 6
MODULE OVERVIEW ........................................................................................................ 10
SOC Microcontroller ................................................................................................................................. 10
SOC Radio.................................................................................................................................................. 10
PA/LNA ....................................................................................................................................................... 12
Antenna Options ....................................................................................................................................... 12
Serial FLASH Memory ............................................................................................................................... 13
MODES OF OPERATION .................................................................................................. 14
Host Microcontroller ................................................................................................................................. 14
Software Stacks ........................................................................................................................................ 15
DEVELOPMENT TOOLS ................................................................................................... 17
TI CC-DEBUGGER ..................................................................................................................................... 17
IAR Embedded Workbench for 8051 ....................................................................................................... 17
ELECTRICAL SPECIFICATIONS ...................................................................................... 18
Absolute Maximum Ratings ..................................................................................................................... 18
Recommended Operating Conditions .................................................................................................... 18
General Characteristics ............................................................................................................................ 19
RF Characteristics .................................................................................................................................... 20
SOLDERING RECOMMENDATIONS ................................................................................ 23
Recommended Reflow Profile for Lead Free Solder ............................................................................. 23
CLEANING ......................................................................................................................... 24
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OPTICAL INSPECTION ..................................................................................................... 24
REWORK ........................................................................................................................... 24
SHIPPING, HANDLING, AND STORAGE ......................................................................... 24
Shipping ..................................................................................................................................................... 24
Handling ..................................................................................................................................................... 24
Moisture Sensitivity Level (MSL) ............................................................................................................. 24
Storage ....................................................................................................................................................... 24
Repeating Reflow Soldering .................................................................................................................... 24
AGENCY STATEMENTS ................................................................................................... 25
MECHANICAL DATA......................................................................................................... 30
PCB Footprint ............................................................................................................................................ 30
General Module Dimensions .................................................................................................................... 31
COMPATIBILITY ................................................................................................................ 32
MODULE REVISION HISTORY ......................................................................................... 33
Rev A .......................................................................................................................................................... 33
CONTACTING LS RESEARCH ......................................................................................... 34
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MODULE PINOUT AND PIN DESCRIPTIONS
MCU#
GND 1
Texas Instruments
CC2530
69 GND MCU#
- GND 2 68 GND -
- GND 3 67 GND -
- NC 4 66 NC -
- NC 5 65 NC -
- NC 6 64 NC -
- NC 7 63 NC -
- NC 8 62 NC -
- NC 9 61 P0.3 16
35 Debug Data 10 60 P0.2 17
34 Debug Clock 11 59 P0.5 14
- NC 12 58 P0.4 37
- NC 13 57 NC -
20 nRESET 14 56 NC -
- NC 15 55 NC -
- NC 16 54 NC -
- NC 17 53 NC -
- NC 18 52 NC -
- NC 19 51 NC -
19 P0.0 20 50 NC -
- NC 21 49 NC -
12 P0.7 22 48 NC -
- NC 23 47 NC -
- NC 24 46 NC -
- NC 25 45 NC -
- VCC - 3V3DC 26 44 GND -
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
P2.0
P1.0
P1.2
NC
P0.7
NC
NC
NC
P1.6/UART TX
P1.7/UART RX
NC
NC
NC
NC
NC
NC
NC
MCU#
36 11 8 - 12 - - - 38 37 - - - - - - - MCU#
Figure 3 Module Pinout
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Module
Pin
Name
MCU
Pin
Type Description
1
GND
N/A
GND
Ground
2
GND
N/A
GND
Ground
3
GND
N/A
GND
Ground
4
NC
N/A
NC
No Connect
5
NC
N/A
NC
No Connect
6
NC
N/A
NC
No Connect
7
NC
N/A
NC
No Connect
8
NC
N/A
NC
No Connect
9
NC
N/A
NC
No Connect
10
Debug Data
35
I/O
Debug Data signal for programming/debugging.
11
Debug Clock
34
Input
Debug Clock signal for programming/debugging.
12
NC
N/A
NC
No Connect
13
NC
N/A
NC
No Connect
14
nRESET
20
Input
RESET
15
NC
N/A
NC
No Connect
16
NC
N/A
NC
No Connect
17
NC
N/A
NC
No Connect
18
NC
N/A
NC
No Connect
19
NC
N/A
NC
No Connect
20 P0.0 19 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
21
NC
N/A
NC
No Connect
22 P0.7 12 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
23
NC
N/A
NC
No Connect
24
NC
N/A
NC
No Connect
25
NC
N/A
NC
No Connect
26
VCC - 3V3DC
VCC
VCC
Supply Voltage
27 P2.0 36 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
28 P1.0 11 I/O General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
29 P1.2 8 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
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Module
Pin
Name
MCU
Pin
Type Description
30 P0.6 13 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
31 P0.7 12 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
32
NC
N/A
NC
No Connect
33
NC
N/A
NC
No Connect
34
NC
N/A
NC
No Connect
35 P1.6/UART TX 38 I/O General-purpose digital I/O
UART transmit data output.
For peripheral functionality see CC2530 User’s Guide.
36 P1.7/UART RX 37 I/O
General-purpose digital I/O
UART receive data input.
For peripheral functionality see CC2530 User’s Guide.
37
NC
N/A
NC
No Connect
38
NC
N/A
NC
No Connect
39
NC
N/A
NC
No Connect
40
NC
N/A
NC
No Connect
41
NC
N/A
NC
No Connect
42
NC
N/A
NC
No Connect
43
NC
N/A
NC
No Connect
44
GND
N/A
GND
Ground
45
NC
N/A
NC
No Connect
46
NC
N/A
NC
No Connect
47
NC
N/A
NC
No Connect
48
NC
N/A
NC
No Connect
49
NC
N/A
NC
No Connect
50
NC
N/A
NC
No Connect
51
NC
N/A
NC
No Connect
52
NC
N/A
NC
No Connect
53
NC
N/A
NC
No Connect
54
NC
N/A
NC
No Connect
55
NC
N/A
NC
No Connect
56
NC
N/A
NC
No Connect
57
NC
N/A
NC
No Connect
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Module
Pin
Name
MCU
Pin
Type Description
58 P0.4 37 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
59 P0.5 14 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
60 P0.2 17 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
61 P0.3 16 I/O
General-purpose digital I/O or analog input.
For peripheral functionality see CC2530 User’s Guide.
62
NC
N/A
NC
No Connect
63
NC
N/A
NC
No Connect
64
NC
N/A
NC
No Connect
65
NC
N/A
NC
No Connect
66
NC
N/A
NC
No Connect
67
GND
N/A
GND
Ground
68
GND
N/A
GND
Ground
69
GND
N/A
GND
Ground
Table 2 ProFLEX01-SOC Module Pin Descriptions
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MODULE OVERVIEW
Figure 4 below shows the internal interconnects of the ICs on the ProFLEX01-SOC module. Consult
the respective IC datasheets for details, or contact LSR sales to purchase the ProFLEX01-SOC module
schematics as part of LSR’s ModFLEX™ design program. For a high-level block diagram of the
ProFLEX01-SOC module, see Figure 1.
Texas Instruments
CC2530 SOC
(Radio and Microcontroller)
Texas Instruments
CC2591
(PA / LNA)
Macronix
MX25V4005CZ
(Serial FLASH)
SO
SI
SCK
/CS
P0.6
P0.1
P1.5
P1.4
PA_EN
EN
P1.1
P1.3
HGM
Vcc
RF_N
RF_P
RF_N
RF_P
9
7
26
25
13
18
5
6
2
5
6
1
5
6
2
4
7
Figure 4 ProFLEX01-SOC Module Block Diagram – Internal Interconnects
SOC Microcontroller
The 8051 CPU core used in the CC2530 SOC is a single-cycle 8051-compatible core. It has three
different memory access buses (SFR, DATA and CODE/XDATA) with single-cycle access to SFR,
DATA, and the main SRAM. It also includes a debug interface and an 18-input extended interrupt unit.
The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of
which is associated with one of four interrupt priorities. Any interrupt service request is serviced also
when the device is in idle mode by going back to active mode. Some interrupts can also wake up the
device from sleep mode (power modes 1–3). Figure 5 shows a block diagram of the CC2530.
SOC Radio
The CC2530 device family provides an IEEE 802.15.4-compliant radio transceiver for the 2.4 GHz
unlicensed ISM band. The RF core controls the analog radio modules. The radio provides extensive
hardware support for frame handling, data buffering, burst transmissions, clear channel assessment,
link quality indication and frame timing information. In addition, it provides an interface between the
MCU and the radio which makes it possible to issue commands, read status, and automate and
sequence radio events. The radio also includes a packet-filtering and address-recognition module.
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Figure 5 CC2530 SOC Block Diagram
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PA/LNA
The CC2591 is a cost-effective and high performance RF Front End for low-power and low-voltage 2.4
GHz wireless applications. It is a range extender for all existing and future 2.4 GHz low-power RF
transceivers, transmitters and System-on-Chip products from Texas Instruments. It increases the link
budget by providing a power amplifier for increased output power, and a LNA with low noise figure for
improved receiver sensitivity. It provides a small size, high output power RF design with its 4x4-mm
QFN-16 package. It contains PA, LNA, switches, RF-matching, and balun for simple design of high
performance wireless applications. Figure 6 shows a block diagram of the CC2591.
Figure 6 CC2591 Block Diagram
Antenna Options
The ProFLEX01-SOC module includes an integrated PCB F-antenna. An optional configuration with a
u.fl connector is also available. The module regulatory certification has been completed with the
following antennas:
• PCB trace antenna
• LS Research 001-0001 2.4 GHz Dipole Antenna with Reverse Polarity SMA Connector and LS
Research 080-0001 u.fl to Reverse Polarity SMA Bulkhead Cable (105mm in length)
An adequate ground plane is necessary to provide good efficiency. The ground plane of the host board
on which the module is mounted increases the effective antenna ground plane size and improves the
antenna performance.
The environment the module is placed in will dictate the range performance. The non-ideal
characteristics of the environment will result in the transmitted signal being reflected, diffracted, and
scattered. All of these factors randomly combine to create extremely complex scenarios that will affect
the link range in various ways.
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It is also best to keep some clearance between the antenna and nearby objects. This includes how the
module is mounted in the product enclosure. Unless the items on the following list of recommendations
are met, the radiation pattern can be heavily distorted.
Whichever antennas are used, it is best to keep a few things in mind when determining their location.
• Never place ground plane or copper trace routing underneath the antenna.
• LSR recommends keeping metal objects as far away from the antenna as possible. At a very minimum
keep the antennas at least 16mm from any metallic objects, components, or wiring. The farther the
antenna is placed from these interferers, the less the radiation pattern and gain will be perturbed
• Do not embed the antenna in a metallic or metalized plastic enclosure.
• Try to keep any plastic enclosure greater than 1 cm from the antenna in any orientation.
Serial FLASH Memory
The ProFLEX01-SOC module includes a 4MBit (256k Byte) serial FLASH memory chip. The primary
intention of the serial FLASH is to support applications that require Over-The-Air (OTA) firmware
downloading. For these applications the new firmware image can get sent to the module and stored in
the serial FLASH. Once the complete firmware image is in the serial FLASH and has been verified as
good, a bootloader can be invoked to copy the new firmware image from the serial FLASH into the
CC2530 FLASH memory. In addition the serial FLASH could be used for data storage depending on
the application requirements.
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MODES OF OPERATION
• With a host microcontroller
• With the TI 802.15.4 MAC, ZigBee stack, RF4CE stack, and SimpliciTI
Host Microcontroller
ProFLEX Module on
Evaluation Board
UART
PC
LSR Test Tool
Software
ProFLEX Module on
Your Board
Your Microcontroller
(Host) of Choice UART
-OR-
Figure 7 Host Microcontroller Modes of Operation
Out of the box the ProFLEX01-SOC module contains an 802.15.4 based application that uses a host
serial processor. This allows features of the module to be explored with the LSR PC based test tool, or
controlled with a host microcontroller. The advantage of this method is ease of use; all major features
of using the radio are simplified into a simple serial message, taking the burden of becoming a radio
expert off the developer.
Use the Communications Log in the ModFLEX™ Test Tool software and serial host protocol
documents to see the messages in action. It will help you become familiar with the serial commands
and how to implement them on your own microcontroller.
Figure 8 ModFLEX™ Test Tool Communications Log
Some examples of serial commands that can be used with the ProFLEX01-SOC Module:
• Set/Query RF channel
• Set/Query RF power
• Set/Query device address
• Transmit RF data or notification RF data received
• Go to Sleep
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Software Stacks
There are four software stacks provided by TI to streamline development:
MAC (802.15.4)
Z-Stack (ZigBee)
Overall Complexity and Development Effort
RF4CE
SimpliciTI
Figure 9 ProFLEX01-SOC Compatible Stacks
TI MAC (802.15.4)
• Use for applications requiring point-to-point or star network topology.
• Advantages: Quick learning curve, minimize software development, easy to deploy in the field
• Disadvantages: No mesh networking
802.15.4 MAC
(To Tx/Rx RF data)
Application Software
(to control switches,
LED’s, serial ports,
etc)
Software
Interface
Figure 10 ProFLEX01-SOC with 802.15.4 MAC
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SimpliciTI
• Used for simple and small RF networks.
• Advantages: Easy to use and supports range extenders and access points.
• Disadvantages: Intended for small networks with low RF data bandwidth.
SimpliciTI Stack
(To Tx/Rx RF data)
Application Software
(to control switches,
LED’s, serial ports,
etc)
Software
Interface
Figure 11 ProFLEX01-SOC with SimpliciTI
RF4CE
• Use when designing a RF4CE compatible remote control.
• Advantages: Compatibility with RF4CE capable consumer electronic devices.
RF4CE Stack
(To Tx/Rx RF data)
Application Software
(to control buttons,
LED’s, etc)
Software
Interface
Figure 12 ProFLEX01-SOC with RF4CE
TI Z-Stack (ZigBee)
• Use when mesh networking is required.
• Advantages: Covers a large area with a ZigBee network.
• Disadvantages: Large learning curve, more software development, and complexity
Application Software
(to control switches,
LED’s, serial ports,
etc)
Software
Interface Z-Stack (ZigBee)
(To Tx/Rx RF data)
Figure 13 ProFLEX01-SOC with TI Z-Stack (ZigBee)
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DEVELOPMENT TOOLS
TI CC-DEBUGGER
Custom firmware development can be done on the ProFLEX01-SOC module using development tools
available thought TI. Shown in Figure 14 is a USB CC-DEBUGGER, which can be used both for
debugging or programming. It plugs directly into the ProFLEX01-SOC Development Board (see Figure
2), and can easily be adapted to other hardware. See the Texas Instruments website for more
information.
Figure 14 CC-DEBUGGER
IAR Embedded Workbench for 8051
Also required is Embedded Workbench for 8051 from IAR Systems. IAR Embedded Workbench for
8051 is an Integrated Development Environment (IDE) for building and debugging embedded
applications. Visit the IAR Systems website for additional information.
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ELECTRICAL SPECIFICATIONS
The majority of these characteristics are based on the use of the TI 802.15.4 MAC loaded with the
generic application firmware written by LSR. Custom firmware may require these values to be re-
characterized by the customer.
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Power supply voltage (VCC)
-0.2
+3.6
V
Voltage on any GPIO
-0.2
VCC + 0.2
V
RF input power, antenna port
+10
dBm
RF input power, transmit port
+8
dBm
Operating temperature
-40
+85
ºC
Storage temperature
-40
+105
ºC
Table 3 Absolute Maximum Ratings1
Recommended Operating Conditions
Parameter
Min
Typ
Max
Unit
Power supply voltage (VCC)
2.4
3.3
3.5
Vdc
Input frequency
2405
2480
MHz
Ambient temperature range
-40
25
85
ºC
Table 4 Recommended Operating Conditions
Module will NOT transmit, if VCC > 3.55V.
1 Under no circumstances should exceeding the ratings specified in the Absolute Maximum Ratings section be
allowed. Stressing the module beyond these limits may result permanent damage to the module that is not
covered by the warranty.
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General Characteristics
Parameter
Min
Typ
Max
Unit
RF frequency range
2405
2480
MHz
RF data rate
250
kbps
Host data rate
1.2
19.2
921.6
kbps
Flash memory
256
kBytes
RAM
8
kBytes
Table 5 General Characteristics
Power Consumption
Parameter
Test Conditions
Min
Typ
Max
Unit
Transmit mode
2440 MHz, 3.3V, +25°C,
+20 dBm output, 50 Ω
130 160 195 mA
Receive mode
2440 MHz, 3.3V, +25°C,
-50 dBm input
29 32 35 mA
Sleep mode
3
8
uA
Table 6 Power Consumption
DC Characteristics – General Purpose I/O
Parameter
Test Conditions
Min
Typ
Max
Unit
Logic input low
VCC = 3.0V, +25°C
.5
V
Logic input high
VCC = 3.0V, +25°C
2.5
V
I/O-pin pullup and pulldown
resistors
VCC = 3.0V, +25°C 20 kΩ
Logic output low
(P1.0)
V
CC
= 3.0V, +25°C,
IOUT = 20mA
.5 V
Logic output low
(ALL I/O except P1.0)
VCC = 3.0V, +25°C,
IOUT = 4mA
.5 V
Logic output high
(P1.0)
V
CC
= 3.0V, +25°C,
IOUT = -20mA
2.4 V
Logic output high
(ALL I/O except P1.0)
V
CC
= 3.0V, +25°C,
IOUT = -4mA
2.4 V
Table 7 DC Characteristics General Purpose I/O
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RF Characteristics
Nominal Transmitter Characteristics
(TA = 25°C, VCC = 3.3V, fC = 2440 MHz, 50Ω)
Parameter
Test Conditions
Min
Typ
Max
Unit
Minimum output power Min 802.15.4
MAC API Setting 7 9 11 dBm
Maximum output power Max 802.15.4
MAC API Setting 18 20 22 dBm
Programmable output power range
9.5
20
dBm
Transmit current – min output Min 802.15.4
MAC API Setting 75 78 85 mA
Transmit current – max output Max 802.15.4
MAC API Setting 130 160 195 mA
Error vector magnitude
12
35
%
Table 8 Nominal Transmitter RF Characteristics
Minimum Transmitter Characteristics
(TA = +85°C, VCC = 2.4V, fC = 2440 MHz, 50Ω)
Parameter
Test Conditions
Min
Typ
Max
Unit
Minimum output power Min 802.15.4
MAC API Setting 2 4 6 dBm
Maximum output power Max 802.15.4
MAC API Setting 16 17 19 dBm
Programmable output power range
4
17
dBm
Transmit current – min output Min 802.15.4
MAC API Setting 70 73 76 mA
Transmit current – max output Max 802.15.4
MAC API Setting 120 129 145 mA
Table 9 Minimum Transmitter RF Characteristics
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Maximum Transmitter Characteristics
(TA = -40°C, VCC = 3.6V, fC = 2440 MHz, 50Ω)
Parameter
Test Conditions
Min
Typ
Max
Unit
Minimum output power Min 802.15.4
MAC API Setting 13 14 15 dBm
Maximum output power Max 802.15.4
MAC API Setting 21 23 24 dBm
Programmable output power range
14
23
dBm
Transmit current – min output Min 802.15.4
MAC API Setting 80 87 95 mA
Transmit current – max output Max 802.15.4
MAC API Setting 219 276 355 mA
Table 10 Maximum Transmitter RF Characteristics
RF Power Settings
(TA = 25°C, VCC = 3.3V, fC = 2440 MHz, 50Ω)
LSR Host RF Power
Value
Radio TXPOWER
Register Value
RF Output Power
Typical Current
Consumption
0-10
0x65
8.8 dBm
77mA
11
0x75
10.4 dBm
81mA
12, 13
0x85
11.8 dBm
86mA
14
0x95
13.0 dBm
90mA
15, 16
0xA5
14.9 dBm
101mA
17
0xB5
16.5 dBm
112mA
18
0xD5
18.6 dBm
133mA
19
0xF5
21.1 dBm
179mA
Table 11 RF Power Settings with LSR Host Software
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Receiver Characteristics
(TA = 25°C, VCC = 3.3V, fC = 2440 MHz)
Parameter
Test Conditions
Min
Typ
Max
Unit
Receiver sensitivity
(1% PER)
HGM -92 -97 -99 dBm
Saturation (maximum input
level) (1% PER)
HGM -13 dBm
Interference rejection
Desired
signal at
-82 dBm,
802.15.4
interferer
±5 MHz
47
dB
±10 MHz
54
dB
±20 MHz 57 dB
Table 12 Receiver RF Characteristics
For additional details regarding the electrical specifications, see the CC2530 and CC2591 datasheets
on the TI website.
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SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
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CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
• Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
• Ultrasonic cleaning could damage the
module permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
• Proper alignment and centering of the
module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring
pads, or vias.
REWORK
The ProFLEX01-SOC module can be
unsoldered from the host board. Use of a hot
air rework tool and hot plate for pre-heating
from underneath is recommended. Avoid
overheating.
Never attempt a rework on the
module itself, e.g. replacing
individual components. Such actions
will terminate warranty coverage.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the ProFLEX01-SOC modules
are delivered in trays of 25.
Handling
The ProFLEX01-SOC modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may destroy or damage
the module permanently. ESD protection may
destroy or damage the module permanently.
Moisture Sensitivity Level (MSL)
MSL 4, per J-STD-020
Devices not stored in a sealed bag with
desiccant pack should be baked.
After opening devices that will be subjected to
reflow must be mounted within 72 hours of
factory conditions (<30°C and 60% RH) or
stored at <10% RH.
Bake devices for 8 hours at 125°C.
Storage
Storage/shelf life in sealed bags is 12 months at
<40°C and <90% relative humidity.
Repeating Reflow Soldering
Only a single reflow soldering
process is encouraged for host
boards.
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AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
FCC CAUTION: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
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Industry Canada Statements
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired operation of
the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for
successful communication.
This device has been designed to operate with the antennas listed below, and having a maximum gain
of 2.0 dB. Antennas not included in this list or having a gain greater than 2.0 dB are strictly prohibited
for use with this device. The required antenna impedance is 50 ohms.
LS Research 001-0001 2.4 GHz Dipole Antenna with Reverse Polarity SMA Connector and LS
Research 080-0001 u.fl to Reverse Polarity SMA Bulkhead Cable (105mm in length)
In addition to the antennas listed above, the ProFLEX01-SOC module has also been certified with an
integrated PCB F-antenna.
Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer
d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui
peuvent causer un mauvais fonctionnement du dispositif.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doivent être
choisies de façon que la puissance isotrope rayonnée équivalente (e.i.r.p) ne dépasse pas celle admise
pour une communication réussie.
Cet appareil a été conçu pour fonctionner avec les antennes énumérées ci-dessous, et ayant un gain
maximum de 2,0 dB. Antennes pas inclus dans cette liste ou ayant un gain supérieur à 2,0 dB sont
strictement interdites pour une utilisation avec cet appareil. L'impédance d'antenne requise est de 50
ohms.
LS Research 001-0001 2.4 GHz Antenne dipôle avec inversion de polarité Connecteur
SMA et LS Research 080-0001 U.FL àinversion de polarité SMA traversée de câble (105 mm de
longueur)
En plus des antennes énumérées ci-dessus, le module ProFLEX01-SOC a également été certifié par
un PCB integer F-antenne.
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OEM Responsibilities to comply with FCC and Industry Canada Regulations
The ProFLEX01-SOC Module has been certified for integration into products only by OEM integrators
under the following conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required. However,
the OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed (for example, digital device emissions, PC peripheral
requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain
configurations or co-location with another transmitter), then the FCC and Industry
Canada authorizations are no longer considered valid and the FCC ID and IC Certification
Number cannot be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC and Industry Canada authorization.
Le module ProFLEX01-SOC a été certifiée pour l'intégration dans les produits que par les intégrateurs
OEM dans les conditions suivantes:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en
conformité avec FCC et Industrie Canada, multi-émetteur procédures produit.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne
seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour
toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les
émissions appareil numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour
certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et
Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC
et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
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End Product Labelling
The ProFLEX01-SOC Module is labeled with its own FCC ID and IC Certification Number. If the FCC
ID and IC Certification Number are not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the
enclosed module. In that case, the final end product must be labeled in a visible area with the
following:
“Contains Transmitter Module FCC ID: TFB-PROFLEX1SOC”
“Contains Transmitter Module IC: 5969A-PROFLEX1SOC”
or
“Contains FCC ID: TFB-PROFLEX1SOC”
“Contains IC: 5969A-PROFLEX1SOC”
The OEM of the ProFLEX01-SOC Module must only use the approved antenna(s) listed above, which
have been certified with this module.
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module or change RF related parameters in the user manual of the end product.
The user manual for the end product must include the following information in a prominent
location:
This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person
and not be co-located with any other transmitters except in accordance with FCC and Industry
Canada multi-transmitter product procedures.
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Le ProFLEX01-SOC Module est étiqueté avec sa propre ID de la FCC et IC numéro de certification. Si
l'ID de la FCC et IC numéro de certification ne sont pas visibles lorsque le module est installé à
l'intérieur d'un autre appareil, puis l'extérieur de l'appareil dans lequel le module est installé doit
également afficher une étiquette mentionnant le module ci-joint. Dans ce cas, le produit final doivent
être étiquetés dans un endroit visible de ce qui suit:
Module émetteur Contient FCC ID: TFB-PROFLEX1SOC
Module émetteur Contient IC: 5969A-PROFLEX1SOC
ou
Contient FCC ID: TFB-PROFLEX1SOC
Contient IC: 5969A-PROFLEX1SOC
Le constructeur d'équipements de l'ProFLEX01-SOC module ne doit utiliser l'antenne approuvée (s) ci-
dessus, qui ont été certifiés avec ce module.
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la
façon d'installer ou de supprimer ce module RF ou RF changer les paramètres liés au mode d'emploi
du produit final.
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans un
endroit bien en vue:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles
seule dans laquelle les antennes utilisées pour cet émetteur doit être installé
pour fournir une distance de séparation d'au moins 20cm de toute personne et
ne pas être co-localisés avec les autres émetteurs, sauf en conformité avec FCC
et Industrie Canada, multi-émetteur procedures produit.
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MECHANICAL DATA
PCB Footprint
Figure 15 PCB footprint
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General Module Dimensions
Figure 16 Basic dimensions
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COMPATIBILITY
To maintain compatibility with other ModFLEX™ family transceiver modules it is important to use the
module pins in your application as they are designated in Figure 17. Since the available GPIO and
peripherals vary per micro, not all pins may be populated.
All attempts are made to lay out modules starting with the lowest number in the peripheral (ADC,
TMR/PWM, GPIO) series. For example if there are only two ADC’s available they will be brought out to
ADC1 and ADC2 (module pins 20 and 21).
GND 1
ModFLEX™
Generic Module Footprint
69 GND
GND 2 68 GND
GND 3 67 GND
NC 4 66 NC
NC 5 65 NC
NC 6 64 NC
NC 7 63 NC
NC 8 62 NC
JTAG - TMS 9 61 SPI - MOSI
JTAG - TDI 10 60 SPI - MISO
JTAG - TCK 11 59 SPI - SCK
JTAG - TDO 12 58 SPI - SS
JTAG/PDI/JRST 13 57 IIC - SDA
nReset 14 56 IIC - SCL
Analog REF 15 55 GPIO 16
Analog REF 16 54 GPIO 15
CMP+ 17 53 GPIO 14
CMP- 18 52 GPIO 13
CMPOUT 19 51 GPIO 12
ADC1 20 50 GPIO 11
ADC2 21 49 GPIO 10
ADC3 22 48 GPIO 9
ADC4 23 47 GPIO 8
ADC5 24 46 GPIO 7
ADC6 25 45 GPIO 6
VCC - 3V3DC 26 44 GND
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
TMR/PWM 1
TMR/PWM 2
TMR/PWM 3
TMR/PWM 4
TMR/PWM 5
TMR/PWM 6
TMR/PWM 7
TMR/PWM 8
UART - TX
UART - RX
UART - CTS
UART - RTS
GPIO 1
GPIO 2
GPIO 3
GPIO 4
GPIO 5
Figure 17 ModFLEX™ Generic Module Footprint
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MODULE REVISION HISTORY
Rev A
• Initial production release.
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CONTACTING LS RESEARCH
Headquarters LS Research, LLC
W66 N220 Commerce Court
Cedarburg, WI 53012-2636
USA
Tel: 1(262) 375-4400
Fax: 1(262) 375-4248
Website www.lsr.com
Technical Support forum.lsr.com
Sales Contact sales@lsr.com
The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”)
products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by
this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND
CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND
DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY
DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING,
WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF
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respect to the accuracy or completeness of the contents of this document and reserves the right to make changes
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for use as components in applications intended to support or sustain life.