Laird Connectivity TIWI501 TiWi5 Transceiver Module User Manual

LS Research, LLC TiWi5 Transceiver Module

Contents

User Manual

TiWi5 TRANSCEIVER MODULE
DATASHEET
The information in this document is subject to change without notice.
330-0042-R1.1 Copyright © 2011-2012 LS Research, LLC Page 1 of 42
Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth,
Bluetooth Low Energy (BLE), and ANT
FEATURES
IEEE 802.11 a,b,g,n,d,e,I compliant
Typical WLAN Transmit Power:
o 18.3 dBm, 11 Mbps, CCK (b)
o 14.4 dBm, 54 Mbps, OFDM (g)
o 12.5 dBm, 65 Mbps, OFDM (n)
Typical WLAN Sensitivity:
o -88 dBm, 8% PER,11 Mbps
o -74 dBm, 10% PER, 54 Mbps
o -72 dBm, 10% PER, 65 Mbps
Bluetooth 2.1+EDR, Power Class 1.5
Full support for BLE 4.0 and ANT
Miniature footprint: 18 mm x 13 mm
Low height profile: 1.9 mm
Terminal for PCB/Chip antenna feeds
Worldwide acceptance: FCC (USA), IC
(Canada), and CE (Europe)
Modular certification allows reuse of LSR
FCC ID and ETSI certification without
repeating the expensive testing on your end
product
Compact design based on Texas
Instruments WL1273L Transceiver
Seamless integration with TI OMAP™
application processors
SDIO Host data path interfaces
Bluetooth Advanced Audio Interfaces
Low power operation modes
RoHS compliant
Streamlined development with LSR Design
Services
APPLICATIONS
Security
HVAC Control, Smart Energy
Sensor Networks
Medical
DESCRIPTION
The TiWi5 module is a high performance 2.4
/5.5 GHz IEEE 802.11 a/b/g/n, Bluetooth
2.1+EDR, and Bluetooth Low Energy (BLE) 4.0
radio in a cost effective, pre-certified footprint.
The module realizes the necessary PHY/MAC
layers to support WLAN applications in
conjunction with a host processor over a SDIO
interface.
The module also provides a Bluetooth platform
through the UART or btSPI HCI transport layer.
Both WLAN and Bluetooth share the same
antenna port.
TiWi5 is pin for pin compatible with the TiWi-R2
and TiWi-BLE modules. TiWi5 does not include
the on module U.FL connector.
Need to get to market quickly? Not an expert in
802.11 or Bluetooth? Need a custom antenna?
Would you like to own the design? Would you
like a custom design? Not quite sure what you
need? Do you need help with your host board?
LS Research Design Services will be happy to
develop custom hardware or software, integrate
the design, or license the design so you can
manufacture yourself. Contact us at
sales@lsr.com or call us at 262-375-4400.
TiWi5 TRANSCEIVER MODULE
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ORDERING INFORMATION
Order Number
Description
450-0053
TiWi5 Module (Tray, SPQ = 100)
450-0053R
TiWi5 Module (Tape and Reel, SPQ = 1000)
Table 1 Orderable TiWi5 Part Numbers
MODULE ACCESSORIES
Order Number
Description
001-0009
2.4/5.5 GHz Dual-Band Dipole Antenna
with Reverse Polarity SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead
Cable 105mm
Table 2 Module Accessories
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BLOCK DIAGRAM
Figure 1 TiWi5 Module Block Diagram – Top-Level
TiWi5 TRANSCEIVER MODULE
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TABLE OF CONTENTS
FEATURES .......................................................................................................................... 1
APPLICATIONS ................................................................................................................... 1
DESCRIPTION ..................................................................................................................... 1
ORDERING INFORMATION ................................................................................................ 2
MODULE ACCESSORIES ................................................................................................... 2
BLOCK DIAGRAM ............................................................................................................... 3
PIN DESCRIPTIONS ............................................................................................................ 7
INI FILE RADIO PARAMETERS .......................................................................................... 9
ELECTRICAL SPECIFICATIONS ...................................................................................... 10
Absolute Maximum Ratings ..................................................................................................................... 10
Recommended Operating Conditions .................................................................................................... 10
General Characteristics ............................................................................................................................ 11
WLAN RF Characteristics......................................................................................................................... 14
Bluetooth RF Characteristics .................................................................................................................. 16
Bluetooth Low Energy RF Characteristics ............................................................................................. 17
WLAN POWER-UP SEQUENCE ....................................................................................... 18
WLAN POWER-DOWN SEQUENCE ................................................................................. 19
BLUETOOTH POWER-UP SEQUENCE............................................................................ 20
BLUETOOTH POWER-DOWN SEQUENCE ..................................................................... 21
ENABLE SCHEME ............................................................................................................ 22
IRQ OPERATION ............................................................................................................... 22
SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS ..................................................... 23
BLUETOOTH HCI UART ................................................................................................... 24
SDIO INTERFACE TIMING ................................................................................................ 26
SDIO CLOCK TIMING........................................................................................................ 27
SOLDERING RECOMMENDATIONS ................................................................................ 28
TiWi5 TRANSCEIVER MODULE
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Recommended Reflow Profile for Lead Free Solder ............................................................................. 28
CLEANING ......................................................................................................................... 29
OPTICAL INSPECTION ..................................................................................................... 29
REWORK ........................................................................................................................... 29
SHIPPING, HANDLING, AND STORAGE ......................................................................... 29
Shipping ..................................................................................................................................................... 29
Handling ..................................................................................................................................................... 29
Moisture Sensitivity Level (MSL) ............................................................................................................. 29
Storage ....................................................................................................................................................... 29
Repeating Reflow Soldering .................................................................................................................... 30
AGENCY CERTIFICATIONS ............................................................................................. 31
AGENCY STATEMENTS ................................................................................................... 31
Federal Communication Commission Interference Statement ............................................................ 31
Industry Canada Statements.................................................................................................................... 32
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA
REGULATIONS ....................................................................................................... 33
OEM LABELING REQUIREMENTS FOR END-PRODUCT .............................................. 34
OEM END PRODUCT USER MANUAL STATEMENTS.................................................... 35
EUROPE ............................................................................................................................ 36
CE Notice ................................................................................................................................................... 36
Declaration of Conformity (DOC) ............................................................................................................ 36
MECHANICAL DATA......................................................................................................... 37
PCB FOOTPRINT .............................................................................................................. 38
TAPE AND REEL SPECIFICATION .................................................................................. 39
DEVICE MARKINGS .......................................................................................................... 40
Rev 1 Devices ............................................................................................................................................ 40
Rev 2 Devices ............................................................................................................................................ 40
Rev 3 Devices ............................................................................................................................................ 41
CONTACTING LS RESEARCH ......................................................................................... 42
TiWi5 TRANSCEIVER MODULE
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TIWI5 MODULE FOOTPRINT AND PIN DEFINITIONS
To apply the TiWi5 module, it is important to use the module pins in your application as they are
designated in below and in the corresponding pin definition table found on pages 7 and 8. Not all the
pins on the TiWi5 module may be used, as some are reserved for future functionality.
Figure 2 TiWi5 Pinout (Top View)
TiWi5 TRANSCEIVER MODULE
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PIN DESCRIPTIONS
Module
Pin
Name
I/O
Type
Buffer
Type
Logic
Level
Description
1
VBAT
PI
-
-
Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC)
2
BT_FUNC5
DO
4 mA
1.8 VDC
HOST_WU (*)
3
WL_UART_DBG
DIO
4 mA
1.8 VDC
WL_UART_DBG
4
WLAN_IRQ
DO
4 mA
1.8 VDC
WLAN Interrupt Request
5
BT_EN
DI
-
1.8 VDC
Bluetooth Enable
6
FM_EN
DI
-
1.8 VDC
NOT SUPPORTED, CONNECT TO GND
7
WL_RS232_RX
DI
-
1.8 VDC
WLAN TEST UART RX (*)
8
WL_RS232_TX
DO
4 mA
1.8 VDC
WLAN TEST UART TX (*)
9
FM_I2S_FSYNC
DO
4 mA
1.8 VDC
NOT SUPPORTED, NO CONNECT
10
WL_EN
DI
-
1.8 VDC
WLAN Enable
11
VIO
PI
-
-
POWER SUPPLY FOR 1.8 VDC DIGITAL DOMAIN
12
GND
GND
-
-
Ground
13
SDIO_D3
DIO
8 mA
1.8 VDC
SDIO INTERFACE, HOST PULL UP
14
SDIO_D2
DIO
8 mA
1.8 VDC
SDIO INTERFACE, HOST PULL UP
15
SDIO_D1
DIO
8 mA
1.8 VDC
SDIO INTERFACE, HOST PULL UP
16
SDIO_D0
DIO
8 mA
1.8 VDC
SDIO INTERFACE, HOST PULL UP
17
SDIO_CMD
DIO
8 mA
1.8 VDC
HOST PULL UP
18
SDIO_CLK
DI
-
1.8 VDC
HOST PULL UP
19
SLOW_CLK
DI
-
1.8 VDC
SLEEP CLOCK (32 kHz)
20
FM_IRQ
DO
4 mA
1.8 VDC
NOT SUPPORTED, NO CONNECT
21
FM_SDA
DO
4 mA
1.8 VDC
NOT SUPPORTED, NO CONNECT
22
FM_SCL
DO
4 mA
1.8 VDC
NOT SUPPORTED, NO CONNECT
23
FM_I2S_CLK
DO
4 mA
1.8 VDC
NOT SUPPORTED, NO CONNECT
24
FM_I2S_DI
DI
4 mA
1.8 VDC
NOT SUPPORTED, CONNECT TO GND
25
FM_I2S_DO
DO
4 mA
1.8 VDC
NOT SUPPORTED, NO CONNECT
26
FM_AUD_RIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
27
FM_AUD_LIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
28
FMRFOUT
AO
-
-
NOT SUPPORTED, NO CONNECT
29
FMRFIN
AI
-
-
NOT SUPPORTED, CONNECT TO GND
30
GND
GND
-
-
Ground
31
FM_AUD_ROUT
AO
-
-
NOT SUPPORTED, NO CONNECT
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Module
Pin
Name
I/O
Type
Buffer
Type
Logic
Level
Description
32
FM_AUD_LOUT
AO
-
-
NOT SUPPORTED, NO CONNECT
33
AUD_FSYNC
DIO
4 mA
1.8 VDC
PCM I/F
34
HCI_RX
DI
8 mA
1.8 VDC
Bluetooth HCI UART RX (*)
35
HCI_RTS
DO
4 mA
1.8 VDC
Bluetooth HCI UART RTS (*)
36
HCI_TX
DIO
8 mA
1.8 VDC
Bluetooth HCI UART TX
37
AUD_CLK
DO
4 mA
1.8 VDC
PCM I/F (*)
38
AUD_OUT
DO
4 mA
1.8 VDC
PCM I/F (*)
39
HCI_CTS
DI
4 mA
1.8 VDC
Bluetooth HCI UART CTS (*)
40
AUD_IN
DI
4 mA
1.8 VDC
PCM I/F (*)
41
BT_FUNC2
DI
4 mA
1.8 VDC
Bluetooth Wakeup / DC2DC mode (*)
42
BT_FUNC4
DO
4 mA
1.8 VDC
BT_UARTD (DEBUG) (*)
43
VDD_LDO_CLASS_1P5
NC
-
-
VBAT VOLTAGE PRESENT, NO CONNECT
44
GND
GND
-
-
Ground
45
GND
GND
-
-
Ground
46
GND
GND
-
-
Ground
47
GND
GND
-
-
Ground
48
ANT
RF
-
Antenna terminal for WLAN and Bluetooth (note [1])
49
GND
GND
-
-
Ground
50
GND
GND
-
-
Ground
51
GND
GND
-
-
Ground
52
GND
GND
-
-
Ground
PI = Power Input
PO = Power Output
DI = Digital Input (1.8 VDC Logic Level)
DO = Digital Output (1.8 VDC Logic Level)
AI = Analog Input
AO = Analog Output
AIO = Analog Input/Output
RF = RF Port
GND = Ground
Note[1]: Antenna terminal presents DC short circuit to ground.
(*) indicates that pin is capable of bidirectional operation, but is used as the type shown.
Table 3 TiWi5 Module Pin Descriptions
All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V
logic, then level shifters MUST be used.
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INI FILE RADIO PARAMETERS
There is an ini file that contains WLAN radio parameters which are critical to both the RF performance
and EMC compliance of the module.
The ini file available on the LSR wiki is only intended to be used with the LSR WLAN Eval Tool. Note
that this ini file will not work when using the TiWi5 module in normal operation which typically involves
an operating system. To use the TiWi5 module in normal operation, refer to specifics contained in the
TiWi Family INI File Radio Parameter User Guide which is also available for download on the LSR
website.
The settings specified in the appropriate ini file must be used to operate the module in compliance with
the modular certification for FCC or ETSI. There is a unique ini file for operating the module in
compliance with FCC regulations, and a different ini file for operating the module in compliance with the
ETSI regulations.
TiWi5 TRANSCEIVER MODULE
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ELECTRICAL SPECIFICATIONS
The majority of these characteristics are based on controlling and conditioning the tests using the TiWi5
control software application. Other control conditions may require these values to be re-characterized
by the customer.
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Power supply voltage (VBAT)(4)(5)
-0.5
+5.5
V
Digital supply voltage (VIO)
-0.5
2.1
V
Voltage on any GPIO
-0.5
VIO + 0.5
V
Voltage on any Analog Pins(3)
-0.5
2.1
V
RF input power, antenna port
+10
dBm
Operating temperature(6)
-40
+85
ºC
Storage temperature
-55
+125
ºC
1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device and are not
covered by the warranty. These are stress ratings only and functional operation of the device at these or any other
conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
2. All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V,
VDD_LDO_CLASS1P5=3.6V
3. Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM,
FMRFINM, FMAUDLIN, FMAUDRIN, FMAUDLOUT, FMAUDROUT
4. The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is
used).
5. Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative.
6. The device can be reliably operated for 5,000 active-WLAN cumulative hours at TA of 85oC.
Table 4 Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Min
Typ
Max
Unit
VBAT
3.0
3.6
4.8
V
VIO
1.62
1.8
1.92
V
VIH
0.65 x VIO
-
VIO
V
VIL
0
-
0.35 x VIO
V
VOH @ 4, 8 mA
VIO - 0.45
-
VIO
V
VOL @ 4, 8 mA
0
-
0.45
V
Ambient temperature range
-40
25
85
ºC
Table 5 Recommended Operating Conditions
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General Characteristics
Parameter
Min
Typ
Max
Unit
WLAN RF frequency range 1
2412
2472
MHz
WLAN RF frequency range 2
4910
5835
MHz
WLAN RF data rate
1
802.11 a/b/g/n
rates
supported
65
Mbps
BT RF frequency Range
2402
2480
MHz
Table 6 General Characteristics
Power Consumption – WLAN 2.4 GHz
Parameter
Test Conditions
Min
Typ
Max
Unit
CCK (802.11b)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=18.3 dBm, 11 Mbps CCK
L=1200 bytes, tdelay (idle)=4 S
-
247
-
mA
OFDM (802.11g)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=14.4 dBm, 54 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
-
180
-
mA
OFDM (802.11n)
TX Current
2437 MHz, VBAT =3.6V, Tamb=+25°C
Po=12.5 dBm, 65 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
-
166
-
mA
CCK (802.11b)
RX Current
-
93
-
mA
OFDM (802.11g)
RX Current
-
93
-
mA
OFDM (802.11n)
RX Current
-
93
-
mA
Dynamic Mode [1]
-
<1.2
-
mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon
reception in Listen Mode.
Table 7 2.4 GHz WLAN Power Consumption
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Power Consumption – WLAN 5 GHz
Parameter
Test Conditions
Min
Typ
Max
Unit
OFDM 9 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=17.6 dBm, 9 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
-
296
-
mA
OFDM 54 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=15.0 dBm, 54 Mbps OFDM
L=1200 bytes, tdelay (idle)=4 S
-
235
-
mA
MCS0 6.5 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=18.0 dBm, MCS0 OFDM
L=1200 bytes, tdelay (idle)=4 S
-
298
-
mA
MCS7 65 Mbps (802.11a)
TX Current
5745 MHz, VBAT =3.6V, Tamb=+25°C
Po=13.2 dBm, MCS7 OFDM
L=1200 bytes, tdelay (idle)=4 S
-
219
-
mA
54/65 Mbps (802.11a/n)
RX Current
-
100
-
mA
Dynamic Mode [1]
-
<1.2
-
mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon
reception in Listen Mode.
Table 8 5 GHz WLAN Power Consumption
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Power Consumption - Bluetooth
Parameter
Test Conditions
Min
Typ
Max
Unit
GFSK TX Current
Constant Transmit, 1DH5, PRBS9
-
45
-
mA
EDR TX Current
Constant Transmit, 2DH5,3DH5,
PRBS9
-
43
-
mA
GFSK RX Current
Constant Receive, 1DH1
-
35
-
mA
EDR RX Current
Constant Receive, 2DH5, 3DH5
-
41
-
mA
Deep Sleep Current
Deep Sleep Mode
-
70
-
µA
Table 9 Bluetooth Power Consumption
DC Characteristics – General Purpose I/O
Parameter
Test Conditions
Min
Typ
Max
Unit
VIO Current
-
16
mA
Logic input low, VIL
0
-
0.35 x VIO
V
Logic input high, VIH
0.65 x VIO
-
VIO
V
Logic output low, VOL
(Full Drive)
Iout = 8 mA
0
-
0.45
V
Iout = 4 mA
0
-
0.45
V
Logic output low, VOL
(Reduced Drive)
Iout = 1 mA
0
-
0.112
V
Iout = 0.09 mA
0
-
0.01
V
Logic output high, VOH
(Full Drive)
Iout = -8 mA
VIO - 0.45
-
VIO
V
Iout = -4 mA
VIO - 0.45
-
VIO
V
Logic output high, VOH
(Reduced Drive)
Iout = -1 mA
VIO - 0.112
-
VIO
V
Iout = -0.3 mA
VIO - 0.033
-
VIO
V
Table 10 DC Characteristics General Purpose I/O
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WLAN RF Characteristics
WLAN Transmitter Characteristics 2.4 GHz
(TA=25°C, VBAT=3.6 V)
Parameter
Test Conditions
Typ
EVM
Min
Typ
Max
Unit
11 Mbps CCK (802.11b)
TX Output Power
11 Mbps CCK , 802.11(b) Mask
Compliance, 35% EVM
RMS power over TX packet
1.1
-
18.3
-
dBm
9 Mbps OFDM (802.11g)
TX Output Power
9 Mbps OFDM , 802.11(g) Mask
Compliance, -8 dB EVM
RMS power over TX packet
-24
-
18.0
-
dBm
54 Mbps OFDM (802.11g)
TX Output Power
54 Mbps OFDM, 802.11(g) Mask
Compliance, -25 dB EVM
RMS power over TX packet
-34
-
14.4
-
dBm
6.5 Mbps OFDM (802.11n)
TX Output Power
6.5 Mbps OFDM, 802.11(n) Mask
Compliance, -5 dB EVM
RMS power over TX packet
-24
-
18.2
-
dBm
65 Mbps OFDM (802.11n)
TX Output Power
65 Mbps OFDM, 802.11(n) Mask
Compliance, -28 dB EVM
RMS power over TX packet
-35
-
12.5
-
dBm
Table 11 WLAN 2.4 GHz Transmitter RF Characteristics
WLAN Transmitter Characteristics 5 GHz
(TA=25°C, VBAT=3.6 V)
Parameter
Test Conditions
Typ
EVM
Start
Freq
Min
Typ
Max
End
Freq
Unit
9 Mbps
TX Output Power
9 Mbps OFDM , 802.11(a) Mask
Compliance, -8 dB EVM RMS
power over TX packet
-31
5170
-
13.0
-
5240
dBm
-28
5260
15.6
5700
-21
5745
17.8
5825
54 Mbps
TX Output Power
54 Mbps OFDM , 802.11(a) Mask
Compliance, -25 dB EVM RMS
power over TX packet
-31
5170
-
13.0
-
5240
dBm
-30
5260
14.6
5700
-28
5745
15.2
5825
MCS0 6.5 Mbps
TX Output Power
MCS0 OFDM , 802.11(a) Mask
Compliance, -5 dB EVM RMS
power over TX packet
-31
5170
-
13.1
-
5240
dBm
-28
5260
15.7
5700
-21
5745
18.2
5825
MCS7 65 Mbps
TX Output Power
MCS7 OFDM , 802.11(a) Mask
Compliance, -27 dB EVM RMS
power over TX packet
-31
5170
-
12.5
-
5240
dBm
-31
5260
12.8
5700
-29
5745
13.5
5825
Table 12 WLAN 5 GHz Transmitter RF Characteristics
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WLAN Receiver Characteristics 2.4 GHz
(TA=25°C, VBAT=3.6 V) [1]
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps CCK (802.11b)
RX Sensitivity
8% PER
-
-97
-
dBm
11 Mbps CCK (802.11b)
RX Sensitivity
8% PER
-
-88
-
dBm
9 Mbps OFDM (802.11g)
RX Sensitivity
10% PER
-
-89
-
dBm
54 Mbps OFDM (802.11g)
RX Sensitivity
10% PER
-
-74
-
dBm
6.5 Mbps OFDM (802.11n)
RX Sensitivity
10% PER
-
-89
-
dBm
65 Mbps OFDM (802.11n)
RX Sensitivity
10% PER
-
-72
-
dBm
11 Mbps CCK (802.11b)
RX Overload Level
8% PER
-
-
-10
dBm
9 Mbps OFDM (802.11g)
RX Overload Level
10% PER
-
-
-17
dBm
54 Mbps OFDM (802.11g)
RX Overload Level
10% PER
-
-
-17
dBm
65 Mbps OFDM (802.11n)
RX Overload Level
10% PER
-
-
-17
dBm
[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes.
Table 13 2.4 GHz WLAN Receiver RF Characteristics
WLAN Receiver Characteristics 5 GHz
(TA=25°C, VBAT=3.6 V) [1]
Parameter
Test Conditions
Min
Typ
Max
Unit
9 Mbps (802.11a)
RX Sensitivity
10% PER
-
-87
-
dBm
54 Mbps (802.11a)
RX Sensitivity
10% PER
-
-72
-
dBm
MCS0 6.5 Mbps (802.11a)
RX Sensitivity
10% PER
-
-88
-
dBm
MCS7 65 Mbps (802.11a)
RX Sensitivity
10% PER
-
-70
-
dBm
Max Input Level (3)
OFDM (11a or 11n)
<10% PER
-
-
-17
dBm
Table 14 5 GHz WLAN Receiver RF Characteristics
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Bluetooth RF Characteristics
Bluetooth Transmitter GFSK and EDR Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GFSK RF Output Power
-
9.5
-
-
dBm
EDR RF Output Power
-
7.3
-
dBm
Power Control Step Size
2
5
8
2-8
dB
EDR Relative Power
-2
1
-4/+1
dB
Table 15 Bluetooth Transmitter RF Characteristics
Bluetooth Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GFSK Sensitivity
BER=0.1%
-
-91
-
-70
dBm
EDR 2 Mbps Sensitivity
BER=0.01%
-
-90
-
-70
dBm
EDR 3 Mbps Sensitivity
BER=0.01%
-
-83
-
-70
dBm
GFSK Maximum Input Level
BER=0.1%
-
-
-5
-20
dBm
EDR 2 Maximum Input Level
BER=0.1%
-
-
-10
-
dBm
EDR 3 Maximum Input Level
BER=0.1%
-
-
-10
-
dBm
Table 16 Bluetooth Receiver RF Characteristics
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Bluetooth Low Energy RF Characteristics
Bluetooth BLE Transmitter GMSK and EDR Characteristics, Class 1.5
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GMSK RF Output Power
-
10
-
-
dBm
Power Control Step Size
2
5
8
2-8
dB
(1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value
through VS command.
Table 17 Bluetooth Low Energy Transmitter RF Characteristics
Bluetooth BLE Receiver Characteristics
(TA=25°C, VBAT=3.6 V)
Parameter
Test
Conditions
Min
Typ
Max
Bluetooth Spec
Unit
GMSK Sensitivity
PER = 30.8%
-
-90
-
-70
dBm
GMSK Maximum Input Level
PER = 30.8%
-
-5
-
-20
dBm
Table 18 Bluetooth Low Energy Receiver RF Characteristics
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WLAN POWER-UP SEQUENCE
The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the
Bluetooth and FM cores are disabled.
Figure 3 TiWi5 Power-up Sequence Requirements
1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'failsafe’.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can
tolerate external voltages with no VDDS and DC2DC.
2. VBAT, VIO, and SLOWCLK must be available before WL_EN.
3. Twakeup = T1 + T2
The duration of T1 is defined as the time from WL_EN=high until Fref is valid for the SoC. T1=~55ms
The duration of T2 depends on:
– Operating system
– Host enumeration for the SDIO/WSPI
– PLL configuration
– Firmware download
– Releasing the core from reset
– Firmware initialization
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WLAN POWER-DOWN SEQUENCE
Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 4 TiWi5 Module Power-down Sequence Requirements
1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g
BT) it will stay high.
2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and
using the FREF (e.g BT) it will stay high.
3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64sec
before it is re-asserted.
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BLUETOOTH POWER-UP SEQUENCE
The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled;
the WLAN core is disabled.
Notes:
1. (A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown
2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only
Figure 5 Bluetooth Power-up Sequence
Power up requirements:
1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'.
Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can
tolerate external voltages with no VDDS and DC2DC.
2. VDDS and SLOWCLK must be stable before releasing BT_EN.
3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH.
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BLUETOOTH POWER-DOWN SEQUENCE
Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41)
2. DC_REQ and CLK_REQ are internal signals shown for reference only
Figure 6 Bluetooth Power-down Sequence
The TiWi5 module indicates completion of Bluetooth power-up sequence by asserting HCI_RTS low. This
occurs up to 100 ms after BT_EN goes high.
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ENABLE SCHEME
The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2
modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be
grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI
commands.
1. Each core is operated independently by asserting each EN signal to Logic '1'. In this mode it is possible to
control each core asynchronously and independently.
2. Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of
Bluetooth.
IRQ OPERATION
1. The default state of the WLAN_IRQ prior to firmware initialization is 0.
2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes
its state to 1.
3. A WLAN firmware interrupt is handled as follows:
a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the
WLAN_IRQ line (host must be configured as active-low or falling-edge detect).
b. After the host is available, depending on the interrupt priority and other host tasks, it masks the
firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line).
c. The host reads the internal register status to determine the interrupt sources - the register is
cleared after the read.
d. The host processes in sequence all the interrupts read from this register
e. The host unmasks the firmware interrupts.
4. The host is ready to receive another interrupt from the WLAN device.
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SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS
The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital
signal in the range of VIO only. For slow clock frequency and accuracy refer to Table 19. The external slow clock
must be stable before the system exits from shut down mode.
Parameter [1]
Condition
Symbol
Min
Typ
Max
Unit
Input slow clock frequency
32768
Hz
Input slow clock accuracy
WLAN, BT
+/-250
ppm
Input transition time Tr/Tf – 10% to 90%
Tr/Tf
100
ns
Frequency input duty cycle
30
50
70
%
Input voltage limits
Square wave,
DC coupled
VIH
0.65 x VDDS
VDDS
Vpeak
VIL
0
0.35 x VDDS
Input impedance
1
MW
Input capacitance
5
pF
Rise and fall time
100
ns
Phase noise
1 kHz
-125
dBc/Hz
[1] Slow clock is a fail safe input
Table 19 Slow Clock Source Requirements
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BLUETOOTH HCI UART
Figure 7 Bluetooth UART Timing
Table 20 Bluetooth UART Timing
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Figure 8 Bluetooth UART Data Frame
Table 21 Bluetooth UART Data Frame
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SDIO INTERFACE TIMING
Table 22 SDIO Interface Read (see Figure 9)
Figure 9 SDIO Single Block Read
Table 23 SDIO Interface Write (see Figure 10)
Figure 10 SDIO Single Block Write
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SDIO CLOCK TIMING
Table 24 SDIO Timing
Figure 11 SDIO Timing
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SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”
Figure 12 Reflow Profile
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CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Never attempt a rework on the
module itself, e.g. replacing
individual components. Such actions
will terminate warranty coverage.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the TiWi5 modules are delivered
in trays of 100 or reels of 1,000.
Handling
The TiWi5 modules contain a highly sensitive
electronic circuitry. Handling without proper
ESD protection may destroy or damage the
module permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
Storage
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
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Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
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AGENCY CERTIFICATIONS
FCC ID: TFB-TIWI501, 15.247
IC ID: 5969A-TIWI501, RSS 210
CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489
SAR: This wireless mobile and/or portable device has been shown to be compliant for localized specific
absorption rate (SAR) for uncontrolled environment/general exposure limits specified in ANSI/IEEE Std.
C95.1-1999 and had been tested in accordance with the measurement procedures specified in IEEE
1528-2003, OET Bulletin 65 Supp. C, RSS-102 and Safety Code 6.
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
UNII devices operating within 5.15-5.25 GHz are to be restricted to indoor operations to reduce any
potential for harmful interference to co-channel MSS operations.
FCC CAUTION: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
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Industry Canada Statements
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired operation of
the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for
successful communication.
This device has been designed to operate with the antenna(s) listed below, and having a maximum
gain of 4.3 dBi (LSR Dipole) and 1.0dBi (Johanson Chip). Antennas not included in this list or having a
gain greater than 4.3 dBi and 1.0dBi are strictly prohibited for use with this device. The required
antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1) LS Research 001-0009 dipole antenna and LS Research 080-0001 U.FL to Reverse Polarity SMA
cable.
2) Johanson 2450AD46A5400E chip antenna.
UNII devices operating within 5.15-5.25 GHz are to be restricted to indoor operations to reduce any
potential for harmful interference to co-channel MSS operations.
L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer
d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui
peuvent causer un mauvais fonctionnement de l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre
choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle
permise pour une communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de
4,3 dBi (LSR dipôle) et1.0dBi (Chip Johanson). Antennes pas inclus danscette liste ou d'avoir un gain
supérieur à 4,3 dBi et-1.0dBi sont strictement interdites pour l'utilisation avec cet appareil. L'impédance
d'antenne requise est de 50 ohms.
Liste de toutes les antennes acceptables pour une utilization avec l'émetteur
1) LS Research 001-0009 antenne dipôle et LS Research 080-0001 U. FL à Reverse SMA à polarité du
câble.
2) Antenne Johanson puce 2450AD46A5400E.
Dispositifs UNII opérant dans 5.15-5.25 GHz doivent être limitées à des opérations à l'intérieur afin de réduire tout
risque d'interférences nuisibles à la co-canal exploitation du MSS.
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OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA
REGULATIONS
The TiWi5 Module has been certified for integration into products only by OEM integrators under the
following conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed (for example, digital device
emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain
configurations or co-location with another transmitter), then the FCC and Industry
Canada authorizations are no longer considered valid and the FCC ID and IC Certification
Number cannot be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC and Industry Canada authorization.
Le module de TiWi5 a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité
avec la FCC et de l'Industrie Canada, multi-émetteur procédures produit.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne
seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour
toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les
émissions appareil numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour
certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et
Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC
et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.
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OEM LABELING REQUIREMENTS FOR END-PRODUCT
The TiWi5 module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC
certification numbers are not visible when the module is installed inside another device, as such the
end device into which the module is installed must display a label referring to the enclosed module.
The final end product must be labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TFB-TIWI501”
“Contains Transmitter Module IC: 5969A-TIWI501”
or
“Contains FCC ID: TFB-TIWI501”
“Contains IC: 5969A-TIWI501”
The OEM of the TiWi5 Module must only use the approved antenna(s) listed above, which have been
certified with this module.
Le module de TiWi5 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la
FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un
autre appareil, comme par exemple le terminal dans lequel le module est installé doit afficher une
etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un endroit
visible par le suivant:
“Contient Module émetteur FCC ID: TFB-TIWI501"
“Contient Module émetteur IC: 5969A-TIWI501"
ou
“Contient FCC ID: TFB-TIWI501"
“Contient IC: 5969A-TIWI501"
Les OEM du module TiWi5 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec
ce module.
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OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not to provide information to the end user regarding how to install or
remove this RF module or change RF related parameters in the user manual of the end product.
The user manual for the end product must include the following information in a prominent
location:
This device is granted for use in Mobile only configurations in which the antennas used for this
transmitter must be installed to provide a separation distance of at least 20cm from all person and not
be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures.
Other user manual statements may apply.
L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou
de supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit
final.
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans
unendroit bien en vue:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en
conformité avec FCC et Industrie Canada, multi-émetteur procédures produit.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
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EUROPE
CE Notice
This device has been tested and certified for use in the European Union. See the Declaration of
Conformity (DOC) for specifics.
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to
the EU standards. A Declaration of Conformity must be issued and kept on file as described in the
Radio and Telecommunications Terminal Equipment (R&TTE) Directive.
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.
Declaration of Conformity (DOC)
This DOC can be downloaded from the LSR Wiki.
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MECHANICAL DATA
Figure 13 Module Mechanical Dimensions (Maximum Module Height = 1.9mm)
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PCB FOOTPRINT
Figure 14 TiWi5 Recommended PCB Footprint (Top View)
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TAPE AND REEL SPECIFICATION
Figure 15 TiWi5 Tape and Reel Specification
TiWi5 TRANSCEIVER MODULE
DATASHEET
The information in this document is subject to change without notice.
330-0042-R1.1 Copyright © 2011-2012 LS Research, LLC Page 40 of 42
DEVICE MARKINGS
Rev 1 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002
Pre-production devices.
2D
Bar
Code
Where 1 = Revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
LS RESEARCH
TiWi5 450-0053
1-XXXXXX
Rev 2 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002
LSR logo changed from red to black.
Added FCC and IC numbers to the label.
Revision number is no longer part of the serial number.
Minor label format changes.
2D
Bar
Code
Where 2 = Revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
LS RESEARCH
XXXXXX
Model: TiWi5
P/N: 450-0053
FCC: TFB-TIWI501
IC: 5969A-TIWI501
REV 2
TiWi5 TRANSCEIVER MODULE
DATASHEET
The information in this document is subject to change without notice.
330-0042-R1.1 Copyright © 2011-2012 LS Research, LLC Page 41 of 42
Rev 3 Devices
WL1273L: WL1273LYFVR PG3.32
Front End: TQP6M9002
Incorporated PCB DFM improvements.
Where 3 = Revision
XXXXXX = incremental serial number
2D Barcode Format is Data Matrix Standard
LS RESEARCH
XXXXXX
Model: TiWi5
P/N: 450-0053
FCC: TFB-TIWI501
IC: 5969A-TIWI501
REV 3
2D
Bar
Code
TiWi5 TRANSCEIVER MODULE
DATASHEET
The information in this document is subject to change without notice.
330-0042-R1.1 Copyright © 2011-2012 LS Research, LLC Page 42 of 42
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