Li Seng Technology LSN51822 Bluetooth LE module User Manual 1

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Document ID	2366191
Application ID	GO8Vew0YOOnZOoDFORQdEg==
Document Description	Users Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	101.61kB (1270150 bits)
Date Submitted	2014-08-21 00:00:00
Date Available	2014-08-21 00:00:00
Creation Date	2014-07-17 15:24:16
Producing Software	Microsoft® Office PowerPoint® 2007
Document Lastmod	2014-07-31 14:44:06
Document Title	投影片 1
Document Creator	Microsoft® Office PowerPoint® 2007
Document Author:	Julian Kwok

Li Seng Wireless MCU Solution
Bluetooth Low Energy (BLE) Module
LSN51822
User Manual / User Guide
Jun, 2014
Bluetooth Low Energy Module : LSN51822
Specification
Overview
LSN51822 Bluetooth Low Energy (BLE) Module has
developed by LI SENG Technology Ltd.
It’s built in Nordic nRF51822 chip to achieve Bluetooth Core
Specification for Low Energy - Single Mode Design.
Up to date , it can support Nordic SoftDevices S110 or S120
for Slave and Master Mode respectively.
Li Seng provided LSN51822 without module programming
and it’s target for customer own development. If customer
require module programming , Firmware Development, Test
Jig Development…etc. please contact for details.
LSN51822
Features
LSN51822 provide Ultra Low Power Consumption base on its’ Cortex M0 CPU . It can also work
with another proprietary 2.4GHz concurrently.
 Cortex M0 chip set, provide Ultra Low Power Platform
 Support One Chip Solution by using 51822 as Main Controller
or work with another MCU since extra hardware requirements…like Scale or Blood Pressure
Application…etc.
 Nordic PPI ( Programmable Peripheral Interconnect) System to save more power
 Support UART, SPI, TWI, GPIO...etc.
 Pins Swap Ability , provide simple layout of Main PCB.
 Built in 8x 10-bit ADC
 Support Single Mode “Master”or “Slave”Mode*
 Support OTA Firmware Upgrade by DFU
Li Seng Technology Ltd. reserved the right to update and correct the data , information in latest status.
nRF51822 Chip Overview
Module Overview
Installation Guide (1/2)
Finished Assembly
Master PCB (examples)
1) Check LSN51822
Module
connection pin is
clean for
soldering.
2) Ready the Master
PCB which will
connect with
LSN51822 Module.
Check connection
pads is clean for
soldering.
3) Place the Module
on the Master PCB.
Then solder it in
sequence :
Installation Guide (2/2)
Finished Assembly
VDD
GND
4) After soldering,
Check all pads are
well connected.
5) Connect DC Power
1.8-3.6V on
VDD(Vcc / BAT+)
and GND on
Master PCB.
The Module will
work as firmware
preloaded.
Pin Name & Dimension
Antenna
22.0 x 15.2 x (1.8) mm
BLE Module Placement Tips
1) To enable DTM mode for R/F Test like BLE fix frequency Test, FCC test…etc.,
RXD and TXD pad require to connect to RF Equipment though RS232.
RXD and TXD pad located on the back side of the module.
Reserve hole at Main PCB for soldering RXD & TXD pads for RF Equipment .
2) Module Soldering on Main PCB, ensure antenna overlap area do NOT cover Main
PCB Wiring or Ground area, it’s suggested to reserve Min. 5mm apart from
Module Antenna.
Main PCB Wiring / GND
Main PCB Wiring / GND
Min. 5mm
Min. 5mm
3)
Connect All Module Ground Pads to main PCB Ground to obtain better
performance.
4)
BLE Module (Antenna) placement inside the product, it need to avoid to get close
to Metal Part, LCD, Battery…etc. since it’s affect the RF performance.
End
FCC Statement:
The final end product must be labeled in a visible area with the following "Contains TX FCC
ID:RR3-LSN51822". If the size of the end product is smaller than 8x10cm, then additional
FCC part 15.19 stayement is required to be availale in the users manual:
This device complies with part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Caution: Any changes or modifications not expressly approved by the party responsible
for compliance could void the user's authority to operate the equipment.
FCC Radiation Exposure Statement:
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Due to missing shielding the module is strictly limited to integration by the Grantee himself or his dedicated
OEM integrator under control of the Grantee.However, the OEM integrator is still responsible for testing
their end-product for any additional compliance requirements required with this module installed.
This device is intended only for OEM integrators under the following conditions:
1)This module is granted as a Limited Modular Approval.
2)This device has been designed to operate with a PCB antenna having a maximum gain of 0dBi.Only
this type of antenna may be used.

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