Linudix WMGMR01 802.11 WIRELESS LAN SIP MODULE User Manual WM G MR 01 v27 01192006
Linudix Co. Ltd. 802.11 WIRELESS LAN SIP MODULE WM G MR 01 v27 01192006
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USERS MANUAL
802.11g Wireless LAN SiP Module V2.7
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Change Sheet
Rev.
Date
Description of change
Approval & Date
Page Par Change(s)
1.0 09/14/04 All All Draft version for Review
1.1 11/12/04 Update the pin assignment
Update the mechanical drawing
2.0 12/25/04 Update the picture & outpower of 802.11g
2.1 04/11/05 6,15,2
1
1. Updated Executive summary for available
date from
“the middle of 1Q 2005” to “the end of 2Q 2005”.
2.Update the mechanica
l drawing (more specific one) ;
update pin description for xxx_B is from “ Active low”
to
Active high”
2.2 04/28/05 21,22 1. Update Pin”A10” pin definition from “left open no use”
to “
using as address line for CIS and memory access
“and Type change from “No connection “ to “
Input PD
5VT”
2.3 04/28/05 14 1. Update Power consumption and sensitivity
2.4 11/8/05 21,22,
23, 24
Add SDIO Pin Definition
2.5 11/28 8, 15
,
18, 23
1. Operation Voltage
2. Temperature
3. Radio Specification
4. Radio Pre-test
5. Drawing of Pin definition
2.6 01/06/06 9,15 4.3.2
4.5
1.IOH ; IOL value is corrected to typical not Min
2.Remove VOH on Min.
3.Tx output power add 12,24,36Mbps on the power
range 14 +/-1dBm ; 12+/-1 dBm is for 48;54Mbps
2.7 01/19/06 15 4.5 Update 802.11b output power tolerance from +1.5/-1.0
dBm to +2.0/-1.0 dBm
802.11g Wireless LAN SiP Module V2.7
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TABLE OF CONTENTS
1. SUMMARY........................................................................................................................................6
2. DELIVERABLES .............................................................................................................................6
3. REFERENCE DOCUMENTS.........................................................................................................7
4. TECHNICAL SPECIFICATION .....................................................................................................7
4.1. ABSOLUTE MAXIMUM RATING...............................................................................................7
4.2. RECOMMENDABLE OPERATION CONDITION......................................................................8
4.2.1. TEMPERATURE, HUMIDITY.............................................................................................8
4.2.2 SUPPLY VOLTAGE...........................................................................................................8
4.3. COMPACTFLASH SPECIFICATION.........................................................................................9
4.3.1. DC ELECTRICALS.............................................................................................................9
4.3.2. AC ELECTRICALS.............................................................................................................9
4.3.3. COMPACTFLASH PROTOCAL TIMING.........................................................................10
4.4. WIRELESS SPECIFICATIONS................................................................................................15
4.5. RADIO SPECIFICATIONS 802.11G........................................................................................15
4.6. RECEIVER SPECIFICATIONS................................................................................................15
4.7. DIMENSIONS, WEIGHT AND MOUNTING.............................................................................16
4.7.1. DIMENSIONS...................................................................................................................16
4.7.2. WEIGHT............................................................................................................................16
4.7.3. MOUNTING......................................................................................................................16
4.8. SHOCK AND VIBRATION........................................................................................................16
5. COMPATIBILITY AND INTEROPERABILITY .........................................................................17
5.1. WI-FI LOGO..............................................................................................................................17
5.2. WHQL COMPLIANCE..............................................................................................................17
6. CONFIGURABILITY .....................................................................................................................17
7. SECURITY ......................................................................................................................................17
8. OPERATING SYSTEM COMPATIBILITY.................................................................................17
9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS .....................................17
9.1. EMC..........................................................................................................................................18
9.2. COMPONENT SPECIFICATION.............................................................................................18
9.3. RADIO PRETEST.....................................................................................................................19
9.4. PRODUCT MARKING..............................................................................................................20
9.5. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS....................................................21
802.11g Wireless LAN SiP Module V2.7
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1. SUMMARY
The WM-G-MR-01 module - is one of the product families in USI’s product offering, targeting for
system integration requiring a smaller form factor. It also provides the standard migration to high
data rate to USI’s current SIP customers. The WM-G-MR-01 module providing B to B type
connector is provided as option for customers, who want to have Board to board type assembly.
This document outlines the product requirements for a “system in Package” 802.11g/(b) module – here after
referred as WM-G-MR-01 Module.
- The WM-G-MR-01 module is restricted to mobile and fixed operation at 20cm from the body..
2. DELIVERABLES
The following products and software will be part of the product.
WM-G-MR-01 Module with packaging
Evaluation kits
Software utility which supporting customer for integration, performance test, and
homologation. Capable of testing, loading (firmware) and configuring (MAC, CIS) for the
WM-G-MR-01 module.
Unit Test / Qualification report
Product Specifications.
Agency certification pre-test report base on adapter boards
802.11g Wireless LAN SiP Module V2.7
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3. REFERENCE DOCUMENTS
C.I.S.P.R.
Pub. 22
"Limits and methods of measurement of radio interference
characteristics of information technology equipment." International
Special Committee on Radio Interference (C.I.S.P.R.), Third Edition,
1997.
CB Bulletin
No. 96A
"Adherence to IEC Standards: “Requirements for IEC 950, 2
nd Edition
and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product
Categories: Meas, Med, Off, Tron." IEC System for Conformity Testing
to Standards for Safety of Electrical Equipment (IECEE), April 2000.
CFR 47,
Part 15-B
"Unintentional Radiators". Title 47 of the Code of Federal Regulations,
Part 15, FCC Rules, Radio Frequency Devices, Subpart B.
CFR 47,
Part 15-C
"Intentional Radiators". Title 47 of the Code of Federal Regulations,
Part 15, FCC Rules, Subpart C. URL:
http://www.access.gpo.gov/nara/cfr/waisidx_98/47cfr15_98.html
CSA C22.2
No. 950-95
"Safety of Information Technology Equipment including Electrical
Business Equipment, Third Edition." Canadian Standards Association,
1995, including revised pages through July 1997.
EN 60 950 "Safety of Information Technology Equipment Including Electrical
Business Equipment." European Committee for Electrotechnical
Standardization (CENELEC), 1996, (IEC 950, Second Edition, including
Amendment 1, 2, 3 and 4).
IEC 950 "Safety of Information Technology Equipment Including Electrical
Business Equipment." European Committee for Electrotechnical
Standardization, Intentional Electrotechnical Commission. 1991, Second
Edition, including Amendments 1, 2, 3, and 4.
IEEE 802.11 “Wireless LAN Medium Access Control (MAC) And Physical Layer (PHY)
Specifications.” Institute of Electrical and Electronics Engineers. 1999.
4. TECHNICAL SPECIFICATION
The WM-G-MR-01 is a B2B type assembly part, technical supporting.
4.1. ABSOLUTE MAXIMUM RATING
Supply Power Max +3.6 Volt
Non Operating Temperature
- 40° to 85° Celsius
Voltage ripple +/- 2%
10KHz~100KHz
Max. Values not exceeding Operating
voltage
802.11g Wireless LAN SiP Module V2.7
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4.2. RECOMMENDABLE OPERATION CONDITION
4.2.1. TEMPERATURE, HUMIDITY
WM-G-MR-01 module supports the operational requirements as listed in the table below.
Operating Temperature -5° to 60° Celsius
Humidity range Max 95% Non condensing, relative humidity
4.2.2 SUPPLY VOLTAGE
Power supply for the WM-G-MR-01 module will be provided by the host via the power pins
Voltage : VDD
Operating Voltage 3.0~3.5 Volt
4.2.3 SUPPLY CURRENT
802.11b/g
Current (3.3V, 25 degree C)
Condition Minimum
Typical Maximum
Transmit (54Mbps, 12 dBm) - 480 mA 520 mA
Transmit (6Mbps, 14 dBm) - 500 mA 540 mA
Transmit (11Mbps, 14 dBm) - 485 mA 530 mA
Receive (54Mbps, -70 dBm) - 275 mA 300 mA
Receive (11Mbps, -70 dBm) - 255 mA 280 mA
Sleep connected average* - 8 mA 15 mA
Deep Sleep** - 1.2 mA 2.0 mA
Maximum Current (Full temperature and voltage
range)
Condition Maximum
Transmit (54Mbps, 12 dBm) 570 mA
Transmit (6Mbps, 14 dBm) 590 mA
Transmit (11Mbps, 14 dBm) 580 mA
Receive (54Mbps, -70 dBm) 320 mA
Receive (11Mbps, -70 dBm) 300 mA
* The sleep-connected current is measured under Marvell Linux V4 driver, with
100ms beacon interval and skipping 2 beacons.
** The Deep Sleep current is measured under Marvell Linux V4 driver.
802.11g Wireless LAN SiP Module V2.7
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4.3. COMPACTFLASH SPECIFICATION
4.3.1. DC ELECTRICALS
The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended
Operation Condition” unless specified.
Power supply : VDD=3.3V
Symbol
Parameter Condition
Min Typ Max Units
VIH Input high voltage 0.5 VDD - VDD+0.5 V
VIL Input low voltage -0.5 - 0.35VDD V
VOH Output high voltage 2.4 - - V
VOL Output low voltage - - 0.4 V
4.3.2. AC ELECTRICALS
The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended
Operation Condition” unless specified.
Power supply : VDD = 3.3V
Symbol Parameter Condition Min Typ Max Units
IOH Input high voltage =0.7 VDD 11.3 32 mA
IOL Input low voltage =0.18VDD 10.5 38 mA
VOH Output high voltage 0.2VDD- 0.6VDD 0.518 4.0 V/ns
VOL Output low voltage 0.6VDD-0.2VDD - 0.592 4.0 V/ns
802.11g Wireless LAN SiP Module V2.7
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4.3.3. COMPACTFLASH PROTOCAL TIMING
4.3.3.1. RESET SPECIFICATION
802.11g Wireless LAN SiP Module V2.7
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4.3.3.2. ATTRIBUTE MEMORY READ/WRITE TIMING SPECIFICATION
802.11g Wireless LAN SiP Module V2.7
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802.11g Wireless LAN SiP Module V2.7
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4.3.3.3. I/O READ/WRITE TIMING SPECIFICATION
802.11g Wireless LAN SiP Module V2.7
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802.11g Wireless LAN SiP Module V2.7
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4.4. WIRELESS SPECIFICATIONS
The WM-G-MR-01 module complies with the following features and standards;
Features Description
WLAN Standards IEEE 802 Part 11g/b
Antenna No Antenna diversity supported
Data Rates 1,2,5.5, 11, 6,9, 12,18, 24,36,48,54 Mbps
Medium Access Protocol CSMA/CA (Collision Avoidance) with ACK
Network Access Ad-hoc, Infrastructure
4.5. RADIO SPECIFICATIONS 802.11G
Over full range of values specified in the “Recommended Operation Condition” unless
specified otherwise.
Features Description
Frequency Band 2.4000 – 2.4835 GHz (2.4 GHz ISM Band)
Number of selectable Sub
channels
11 channels
Modulation OFDM, DSSS (Direct Sequence Spread Spectrum),
DBPSK, DQPSK, CCK , 16QAM, 64QAM
Supported rates 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Maximum receive level - 10dBm (with PER < 8%)
Output Power 14 dBm +2.0/-1.0 dBm for 1, 2, 5.5, 11Mbps
14 dBm +/- 1.0 dBm for 6, 9, 12, 18, 24, 36Mbps
12 dBm +/- 1.0 dBm for 48, 54Mbps
4.6. RECEIVER SPECIFICATIONS
Receiver Characteristics
( 3.3V, 25 degree C ) Typical Max. Unit
PER <8%, Rx Sensitivity @ 11 Mbps -87 -85 dBm
PER <8%, Rx Sensitivity @ 5.5 Mbps -89 -87 dBm
PER <8%, Rx Sensitivity @ 2 Mbps -90 -88 dBm
PER <8%, Rx Sensitivity @ 1 Mbps -92 -90 dBm
PER <10%, Rx Sensitivity @ 54 Mbps -72 -70 dBm
802.11g Wireless LAN SiP Module V2.7
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4.7. DIMENSIONS, WEIGHT AND MOUNTING
The following paragraphs provide the information for the size, weight and mounting of the WM-
G-MR-01 module.
4.7.1. DIMENSIONS
The size and thickness of the WM-G-MR-01 module is listed below:
4.7.2. WEIGHT
Weight less than 3 gram including the shielding.
4.7.3. MOUNTING
The WM-G-MR-01 module is B2B mounted type component. The B2B connector and additional screw
hole provide mounting mechanism to secure the WM-G-MR-01 module against vibration and shock on
the host system.
4.8. SHOCK AND VIBRATION
All shock and vibration test is performed by using an interface adapter card. Additional shock
and vibration tests can be performed – on request – by using the real host being PDA,
Textbook or any other application.
Vibration
Operating Frequency sweep from 3-150-3 Hz with a constant 0.25 G
input
Non-Operational Frequency sweep from 3-150-3 Hz with a constant 0.5 G input
Shock
802.11g Wireless LAN SiP Module V2.7
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Operational 25 G peak within 3.75 msec in normal base position
Non-Operational 65 G peak in 3.75 msec in normal base position.
30 G within 8 msec square or trapezoidal shock in + and -
direction along the 3 axis. (Total 6 shocks)
Note: Above tests are executed without packaging material.
5. COMPATIBILITY AND INTEROPERABILITY
5.1. WI-FI LOGO
There is no module level WiFi applied for WM-G-MR-01 module.
Wi-Fi certification is dependent on the OS capability and application of the host system. The
certification will be base on customer’s request.
5.2. WHQL COMPLIANCE
Not required for WM-G-MR-01 module
6. CONFIGURABILITY
No user configuration needed. The CIS and MAC Address will be loaded during production of
the WM-G-MR-01 module.
7. SECURITY
The WM-G-MR-01 module supports WEP64/128, WPA , AES-CCM which including TKIP (full
version TKIP SSN /WPA) . Refer to Marvell Libertas solution.
8. OPERATING SYSTEM COMPATIBILITY
Drivers are supported for the following OS:
Windows CE 3.0 /.NET , WinCE 4.2, Win CE 5.0
Linux.
Pocket PC 2003, 2004, 2005
9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS
The WM-G-MR-01 module is pre-tested to ensure that all requirements met as set forth in the
following sections.
Final certification (module certification) requires the antenna of targeted system with a lead-
time of 6 weeks. The product deliverable shall be a pre-tested WM-G-MR-01 module. No
module level certification on WM-G-MR-01 module.
802.11g Wireless LAN SiP Module V2.7
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9.1. EMC
The module will be pre-tested to ensure that we can certify the product in the following
countries when final certification will be performed on products and or platforms.
US. FCC CFR47 Part 15-B, Class B
Canada. CSA C22.2, Class B
Europe. 89/336/EEC, EMC Directive, including CE Mark
ETS300 826, EMC standard for 2.4GHz wideband transmission systems
EN55022, Class B (Emissions)
EN50082-1 (Immunity)
EN61000-3-2 (Harmonic AC current emissions)
Japan. VCCI Standard, Class 2 (Emissions)
Korea (MIC)
9.2. COMPONENT SPECIFICATION
All components used in this device meet the following component approval requirements.
PRINTED WIRING BOARDS: The printed wiring boards shall be Underwriters
Laboratories Inc. "Recognized Component" (ZPMV2) under the category for Printed
Wiring Boards, and shall be flammability rated 94V-1 or less flammable. The board
material shall be rated 130°C minimum.
CONNECTORS: Any connectors, if used, shall be Underwriters Laboratories, Inc.
"Recognized" (ECBT2/RTRT2) in accordance with the requirements in the UL Standard
for Safety, UL 498. Any polymeric connector housing shall be molded of plastics rated
UL 94V-2 or less flammable when tested to UL 94.
WIRING: Any wiring material, if used, shall be UL Recognized Component Appliance
Wiring Material (AVLV2). Wire shall be minimum rated 30V, 105°C.
PLASTIC PARTS - Any plastic parts used shall be molded of plastics that are UL
"Recognized" (QFMZ2) and rated UL 94V-2 or less flammable when tested to UL 94.
“PB FREE” - The entire component Suppliers has to support Green requirement base on
USI’s policy. All of the components which including process and materials has to be Lead
Free and RoHS Compliance.
802.11g Wireless LAN SiP Module V2.7
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9.3. RADIO PRETEST
The WM-G-MR-01 module is tested with adapter card to comply with following standard.
The testing is to assure the performance of regulatory requirement on module. Final
certification will be conducted on system level:
US/CAN: FCC CFR47 Part 15.247
Japan: TELEC
Europe: CE EN 300 328
802.11g Wireless LAN SiP Module V2.7
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9.4. PRODUCT MARKING
The Module is marked which containing the following information:
Description: WM-G-XX-XX
Serial number: yyllwkxxxx
Revision: format to follow USI revision level in PDM System
For the serial number the following format will be followed:
yy = last two digits of current year
ll = Assembly Location:
UT = USI Taiwan
UM = USI Mexico
UC = USI China
wk = current week (week period = starting on Monday)
xxxx = consecutive number, starting at 0000 at beginning of each week.
802.11g Wireless LAN SiP Module V2.7
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9.5. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS
The use of polychlorinated biphenyls (PCB’s) is prohibited (specifically) as dielectric in
capacitors or transformers.
Electrolytic capacitors shall not be composed of any quaternary salt ammonium and/or
gamma-butyrolactone (i.e. no el caps allowed).
No CFC's (chlorofluorocarbons) shall be used anywhere in the manufacture of this product.
The use of tantalum capacitors should be minimized in any product of the product family
[including the power-supply]. Where the use of tantalum caps cannot be avoided, provisions
must be made in the manufacturing process to prevent reverse polarization.
The WM-G-MR-01 module hardware design should take the safety of operation into
consideration and prevent the potential risk on Labor safety for manufacturing process.
9.6. FCC Warning Statements
THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION
IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY
NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST
ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT
MAY CAUSE UNDESIRED OPERATION.
NOTE: THE MANUFACTURER IS NOT RESPONSIBLE FOR ANY RADIO OR TV INTERFERENCE
CAUSED BY UNAUTHORIZED MODIFICATIONS TO THIS EQUIPMENT. SUCH MODIFICATIONS
COULD VOID THE USER¡¯S AUTHORITY TO OPERATE THE EQUIPMENT.