Linx Technologies HUMA-900 HumPRO-A Series High Power Data Transceiver User Manual Trace Layout Reference

Linx Technologies HumPRO-A Series High Power Data Transceiver Trace Layout Reference

Contents

Trace Layout Reference

HUM-A-900-PRO Trace Layout Guide 1 of 9 RG-110 HUM-A-900-PRO PCB Trace Layout Reference Guide 3/29/17 For proper integration of the HUM-A-900-PRO module in end products the following requirements must be met. A host product incorporating the HUM-A-900-PRO module cannot take advantage of the pre-existing certification of the component transmitter without conformity to the specific requirements in these instructions. Contents 1. Approved RF Connections for HUM-A-900-PRO-UFL ............................................................................ 2 2. Approved RF Connections for HUM-A-900-PRO-CAS ............................................................................ 2 2.1. Edge Mount RP-SMA Connection ................................................................................................. 2 2.2. MicroSplatch Antenna Connection ............................................................................................... 4 2.3. Vertical Mount RP-SMA connection ............................................................................................. 6 3. Approved Antennas ............................................................................................................................... 8 4. Design Verification Test Procedures ...................................................................................................... 9 5. Production Test Procedures for Ensuring Compliance .......................................................................... 9
HUM-A-900-PRO Trace Layout Guide 2 of 9 1. Approved RF Connections for HUM-A-900-PRO-UFL The HUM-A-900-PRO-UFL module employs an integrated u.FL RF connector. Therefore, the design and layer stackup of the host PCB does not need to meet any special requirements to maintain the validity of the module’s pre-certified status. 2. Approved RF Connections for HUM-A-900-PRO-CAS 2.1. Edge Mount RP-SMA Connection This is the preferred RF connection design for the HUM-A-900-PRO-CAS module and is approved with all operating modes of the module. This design uses a PCB microstrip to connect the HUM-A-900-PRO-CAS module’s Antenna castellation to an edge mount reverse polarity SMA connector Linx Part number CONREVSMA003.062. A four layer PCB is used in this design. The Top layer 24mil wide RF trace and Mid-Layer 1 ground plane form an RF microstrip.  Table 1 shows the required host PCB layer stackup for the Edge Mount RP-SMA connection. This layer stackup must be matched precisely including material type, dielectric constant, dielectric thickness, and copper thickness.  Figure 1 shows the trace dimensions that must be followed precisely, including trace width, and routing  The Ground plane on Mid-layer 1 must not have any cutouts in the area under the RF trace or the area between the module and the connector. Table 1 – PCB Stackup for Edge Mount RP-SMA Connection
HUM-A-900-PRO Trace Layout Guide 3 of 9 Figure 1 - Trace Dimensions for Edge Mount RP-SMA Connection
HUM-A-900-PRO Trace Layout Guide 4 of 9 2.2. MicroSplatch Antenna Connection This RF connection is approved with all operating modes of the module. This design uses a PCB microstrip to connect the HUM-A-900-PRO-CAS module’s Antenna castellation to a PCB mount antenna Linx Part number ANT-916-uSP. A four layer PCB is used in this design. The Top layer 24mil wide RF trace and Mid-Layer 1 ground plane form an RF microstrip.  Table 2 shows the required host PCB layer stackup for the MicroSplatch Antenna connection. This layer stackup must be matched precisely including material type, dielectric constant, dielectric thickness, and copper thickness.  Figure 2 shows the trace dimensions that must be followed precisely, including trace width, and routing  The Ground plane on Mid-layer 1 must not have any cutouts in the area under the RF trace or the area between the module and the connector. Table 2 - PCB Stackup for MicroSplatch Antenna Connection
HUM-A-900-PRO Trace Layout Guide 5 of 9 Figure 2 - Trace Dimensions for MicroSplatch Antenna Connection
HUM-A-900-PRO Trace Layout Guide 6 of 9 2.3. Vertical Mount RP-SMA connection The Vertical Mount RP-SMA RF connection is approved only for operation at the Low RF Data Rate (19.2kbps) This design uses a PCB microstrip to connect the HUM-A-900-PRO module’s Antenna castellation to an edge mount reverse polarity SMA connector Linx Part number CONREVSMA001. A four layer PCB is used for this design. The Top layer 14mil wide RF trace and Mid-Layer 1 ground plane form an RF microstrip.  Table 3 shows the required host PCB layer stackup for the Vertical Mount RP-SMA connection. This layer stackup must be matched precisely including material type, dielectric constant, dielectric thickness, and copper thickness.  Figure 3 shows the trace dimensions that must be followed precisely, including trace width, routing, and RF matching components. A 15pF series capacitor (Murata GRM0335C1H150GA01D) is located between the module and the RP-SMA connector for RF matching. A 10mil wide microstrip connects the center post of the RP-SMA connector to a 100nH inductor (Bourns CW201212-R10J) for RF matching.  The Ground plane on Mid-layer 1 must not have any cutouts in the area under the RF trace, in the area between the module and the connector, or under the RF matching components. Table 3 - PCB Stackup for Vertical Mount RP-SMA Connection
HUM-A-900-PRO Trace Layout Guide 7 of 9 Note: The vertical SMA connector is a through-hole mount component. The connector must be installed on the bottom of the PCB. Figure 3 shows the top side of the PCB were the HUM-A-900-PRO-CAS module is mounted and the solder side of the RP-SMA connector is visible. Figure 3 - Trace Dimensions and RF Matching Component Placement for Vertical Mount RP-SMA Connection
HUM-A-900-PRO Trace Layout Guide 8 of 9 3. Approved Antennas The antennas in Table 1 are tested and approved for use with the HUM-A-900-PRO Module. According to the FCC Permissive Change Policy (178919 D01) “Additional antennas that are equivalent may be substituted, and then marketed without a Class II permissive change… Equivalent antennas must be of the same type (e.g., yagi, dish, etc.), must be of equal or less gain than an antenna previously authorized under the same grant of certification (FCC ID), and must have similar in-band and out-of-band characteristics (consult specification sheet for cutoff frequencies). Contact Linx for information about other antennas that meet these requirements and may be used with the HUM-A-900-PRO module. Table 4 - Approved Antennas
HUM-A-900-PRO Trace Layout Guide 9 of 9 4. Design Verification Test Procedures After the design is fabricated the following measurements should be executed to verify the design: 1. Mechanical measurement of dimensions specified in the Microstrip Dimensions diagrams above 2. Obtain and review the detailed layer stackup solution used for the build from the PCB manufacturer that specifies dielectric thicknesses and target dielectric constants for substrate materials. Note: Linx Applications Engineers are available to review Layout designs to ensure compliance and optimal RF performance. 5. Production Test Procedures for Ensuring Compliance During production test for the host device, The HUM-A-900-PRO module is to be activated in maximum power transmit mode and the conducted RF output power at the RP-SMA connector is to be measured using a Spectrum Analyzer, RF Power Meter or other appropriate RF measurement equipment. The conducted output power should not exceed the output power specified in the HUM-A-900-PRO Data Guide. If a conducted output power test is not possible on the host device, an equivalent radiated output power test may be used.

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