LumenRadio CRMXCORE101 2.4G Wireless Control Module User Manual Core design guide lines revPA6
LumenRadio AB 2.4G Wireless Control Module Core design guide lines revPA6
Users Manual
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| Document ID | 2556660 |
| Application ID | 9Mo83OUdfwIeyawMlA0MCg== |
| Document Description | Users Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 50.5kB (631231 bits) |
| Date Submitted | 2015-03-17 00:00:00 |
| Date Available | 2015-03-17 00:00:00 |
| Creation Date | 2017-10-14 03:37:09 |
| Producing Software | GPL Ghostscript 9.18 |
| Document Lastmod | 2017-10-14 03:37:09 |
| Document Title | Core design guide lines revPA6 |
| Document Creator | PDFCreator Version 1.7.1 |
| Document Author: | Niclas Norlén |
KZ ŵŽĚƵůĞĚĞƐŝŐŶŐƵŝĚĞůŝŶĞƐ WĂƌƚηϮϬϬͲϭϵϬϭ Revision: PA6 – Jan 28, 2015 CONFIDENTIALITY NOTE dŚŝƐĚŽĐƵŵĞŶƚŵĂLJŶŽƚďĞƌĞĚŝƐƚƌŝďƵƚĞĚǁŝƚŚŽƵƚƉƌŝŽƌǁƌŝƚƚĞŶƉĞƌŵŝƐƐŝŽŶĨƌŽŵ>ƵŵĞŶZĂĚŝŽ͘ Table of Contents ................................................................ ................................................................................................ ................................................................................................ ................................................................................................ ................................................................................................ .................................................................. .................................. 1 ABSOLUTE MAXIMUM RATINGS ................................................................ ................................................................................................ ................................................................................................ ...................................................................... ...................................... 3 Recommended Recommended operating conditions ................................................................ ................................................................................................ ........................................................................................... ........................................................... 3 Electrical characteristics................................ characteristics ................................................................ ................................................................................................ ................................................................................................ .................................................................................... .................................................... 3 General characteristics ................................................................ ................................................................................................ ................................................................................................ ...................................................................................... ...................................................... 4 RF characteristics ................................................................ ................................................................................................ ................................................................................................ ................................................................................................ ................................................................ 4 ADC characteristics ................................................................ ................................................................................................ ................................................................................................ ............................................................................................. ............................................................. 4 Control input AC characteristics characteristics................................ ................................................................ ................................................................................................ ................................................................................................ ..................................................................... ..................................... 5 DC characteristics ................................................................ ................................................................................................ ................................................................................................ ............................................................................................... ............................................................... 5 USB interface DC characteristics ................................................................ ................................................................................................ ................................................................................................ .................................................................... .................................... 5 Pin assignments and functions ................................................................ ................................................................................................ ................................................................................................ ....................................................................... ....................................... 6 Application information ................................................................ ................................................................................................ ................................................................................................ ................................................................................... ................................................... 7 Core module current ramps in TX (transmit) high power mode .............................................................................................................................................. 7 Internal or External Antenna? ............................................................................................................................................................................................................. 10 Internal Antenna .............................................................................................................................................................................................................................. 10 Layout considerations for the main (Customer) board. ............................................................................................................................................................. 10 Layout Example ....................................................................................................................................................................................................................................... 11 Internal antenna radiation pattern ................................................................................................................................................................................................... 12 Mechanical Mechanical dimensions ................................................................ ................................................................................................ ................................................................................................ ................................................................................... ................................................... 13 CORE reflow soldering specification ................................................................ ................................................................................................ ........................................................................................... ........................................................... 14 Compliance information ................................................................ ................................................................................................ ................................................................................................ ................................................................................. ................................................. 15 FCC information ...................................................................................................................................................................................................................................... 15 FCC Information to User ................................................................................................................................................................................................................ 15 FCC Guidelines for Human Exposure ........................................................................................................................................................................................ 15 FCC Declaration of Conformity ................................................................................................................................................................................................... 15 FCC Radio Frequency Interference Warnings & Instructions ............................................................................................................................................ 15 CE.................................................................................................................................................................................................................................................................. 15 Compliance Marking.............................................................................................................................................................................................................................. 15 FCC & Industry Canada .................................................................................................................................................................................................................. 15 Other Compliances ......................................................................................................................................................................................................................... 16 Revision history ................................................................ ................................................................................................ ................................................................................................ ................................................................................................ ................................................................. ................................. 17 - 2 (18) - ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Peak current Voltage on any digital pin Symbol VCC IMAX VIO Minimum -0.3 Storage temperature range Input RF level Electrostatic discharge voltage (human body model) model, JEDEC STD 22, method A114 TSTG PIN VESD –40 Symbol VCC TA Minimum 2.3 –40 -0.3 Maximum 3.6 250 VCC+0.3 <3.9 125 10 Units mA Maximum 3.6 80 Units °C °C dBm kV Recommended operating conditions Parameter Pa rameter Operating Supply Voltage Operating ambient temperature range Electrical characteristics Measured at 3.3V, 25°C. Limits apply over entire frequency range 2405-2480MHz (Channel 11-26). Parameter Symbol MIN TYP MAX Parameter Peak current consumption, continuous transmission, 17dBm ITX_PEAK 120 150 output power, no peripherals active. Peak current consumption, continuous transmission, ITX_PEAK 60 80 -2.7dBm output power, no peripherals active Peak current consumption, battery mode1. +2.5dBm output ITX_BATT_PEAK 60 80 power, no peripherals active Peak current consumption in RX mode, -50dBm input IRX 40 60 power, no peripherals active Peak current consumption in RX battery mode, -50dBm IRX_BATT 35 55 input power, no peripherals active Average current consumption, high power mode, 17dBm ITX_MIN 45 50 output power, no peripherals active Average current consumption2, battery mode, +2.5dBm ITX_AVG 35 40 output power, no peripherals active SPI current consumption ISPI 300 I2C current consumption II2C 100 UART current consumption IUART 700 USB current consumption IUSB 3.8 ADC current consumption when converting IADC 1.2 Flash erase IFL_ER 12 Flash burst-write peak current IFL_W Deep sleep current consumption ISLEEP 10.5 11.1 Transmitting one burst on 16 frequencies One burst transmission including CSMA-CA, TX, MAC ACK, duration 4.9ms - 3 (18) - Unit mA mA mA mA mA mA mA ȝA ȝA ȝA mA mA mA mA ȝA General characteristics Measured at 3.3V, 25°C. Parameter Wake up time from deep sleep to active Time from active to TX or RX RF frequency range Symbol TWAKE_UP MIN TYP 136 MAX ȝs 192 2480 2405 Unit ȝs MHz RF characteristics Measured at 3.3V, 25°C. Limits apply over entire frequency range 2405-2480MHz (Channel 11-26) Parameter Symbol MIN TYP MAX Receiver sensitivity, PER = 1% RXSENS -101 Receiver sensitivity battery mode, PER = 1% RXSENS_BATT -92 Receiver saturation (maximum input level) , PER = 1% RXSAT -5 Transmitter max output VCC = 3.6V 16.5 17 17.5 power VCC = 3.3V 15.8 16.3 16.8 VCC = 3.0V 14.6 15.1 15.6 VCC = 2.7V 13.2 13.7 14.2 VCC = 2.3V 10.3 10.8 11.3 Transmitter min output VCC = 3.6V -3.1 -2.6 -2.1 power VCC = 3.3V -3.5 -3 -2.5 VCC = 3.0V -3.8 -3.3 -2.8 VCC = 2.7V -5.6 -5.1 -4.6 VCC = 2.3V -10.7 -9.2 -8.7 Output return loss at U.FL. antenna connector S22 -10 -5 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dB ADC characteristics TA = 25°C and VCC = 3 V, unless otherwise noted. Parameter Input voltage Input resistance, signal ENOB Effective number of bits Useful power bandwidth THD Total harmonic distortion Signal to non-harmonic ratio CMRR Common-mode rejection ratio Crosstalk Offset Gain Error DNL Differential nonlinearity INL Integral nonlinearity SINAD (–THD+N) Signal-to-noise-and-distortion MIN Mean Maximum Mean Maximum Single-ended input Differential input Conversion time Current consumption Internal reference temperature coefficient TYP 197 10.2 20 -75.2 78.8 84 -84 -3 0.68 0.05 0.9 4.6 13.3 66.6 70.8 TBD 1.2 0.4 - 4 (18) - MAX Vcc Unit kΩ Bits kHz dB dB dB dB mV LSB LSB dB μs mA mV/10°C Control input AC characteristics TA = –40°C to 125°C, VCC = 2 V to 3.6 V, unless otherwise noted. Parameter nRESET low duration, shortest pulse recognized as reset request MIN TYP MAX Unit μs MIN TYP MAX 0.5 Unit nA nA DC characteristics TA = 25°C, VCC = 3 V Parameter Logic 0 input voltage Logic 1 input voltage 2.5 -300 -300 Logic-0 input current Logic-1 input current 300 300 USB interface interface DC characteristics TA = 25°C, unless otherwise noted. Parameter MIN USB pad voltage output, high, VCC 3.6 V, 4-mA load USB pad voltage output, low, VCC 3.6 V, 4-mA load - 5 (18) - TYP 3.4 0.2 MAX Unit Pin assignments and functions Figure 1, Top view pin assignment PIN 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 PIN NAME PIN TYPE PC7 PC6 PC5 PC4 PC3 PC2 PC1 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 GND GND PB5 PB4 PB3 PB2 PB1 RESET USB_N USB_P GND VCC Digital I/O Digital I/O Digital I/O Digital I/O Digital O Digital O Digital O Analog I Analog I Digital I/O Digital I Digital I/O Digital I/O Analog I Analog I DESCRIPTION Do not connect Do not connect Do not connect Do not connect UART RXD UART TXD I2C SDA I2S SCA High current pin, 20 mA sink/source capability High current pin, 20 mA sink/source capability High current pin, 20 mA sink/source capability ADC0 ADC1 SPI CLK /SPI SS SPI MOSI SSI MISO ADC2 ADC3 Digital O Digital O Digital I Digital I Digital I/O Digital input USB I/O USB I/O PWM A PWM B GPT A Trigger / Cycle measurement GPT B Trigger / Cycle measurement GPIO port B pin 1 Device reset, active-low USB differential data minus (D–) USB differential data plus (D+) 2.3 - 3.6VDC power supply connection - 6 (18) - Application information Core module current ramps in TX (transmit) high power mode All measurements done in high power mode, i.e. RF power amplifier enabled in transmit. Current consumption can be calculated using the formula: ܸ௦ ܫൌ ͵Ͳ ITxStandby IStandby Figure 2, current ramp from standby to TX (transmit) standby ܫௌ௧ௗ௬ ൌ ͲǤͶͷ ൎ ͳͷǤͺ݉ܣ ͵Ͳ ்ܫ௫ௌ௧ௗ௬ ൌ ͳǤͳͲ ൎ ͵Ǥ݉ܣ ͵Ͳ - 7 (18) - ITxActive ITxStandby Figure 3, current ramp from TX standby to TX active ்ܫ௫௧௩ ൌ ͵Ǥʹͷ ൎ ͳʹͳ݉ܣ ͵Ͳ ITxActive ITxStandby Figure 4, current ramp from TX active to TX TX standby - 8 (18) - ITxStandby IStandby Figure 5, current ramp from TX standby to standby standby - 9 (18) - Internal or External External Antenna? For short distances the internal antenna will perform well. But if the design is to be placed inside a metal enclosure, or if there is a need to cover large distances, an external antenna is necessary. An external antenna MUST at least be designed for operation between 2.4 – 2.48GHz impedance.. Always use external antennas with a 50 ς characteristic impedance Internal Antenna If the internal antenna is considered, the product case needs to be of a RF transparent plastic material. The circuit board that will hold the CORE module needs to be designed so that the internal chip antenna radiates efficiently. Avoid any ground planes near the antenna chip. When placing the CORE module on a circuit board: • Place the module as close to the (main) circuit board edge as possible with the antenna pointing outward. • Note the absence of ground plane near the chip antenna on the modules´ circuit board. • Remove any copper from the main board as specified in section “Layout Example” • Avoid using metal structures such as mounting hardware close to the antenna chip. Layout considerations ations for the main (Customer) board. The CORE module has been specifically designed in order to achieve good RF performance. In order to maintain this, there are some guidelines that we would like to stress: The use of ground planes also on the main board cannot be overemphasized. Good decoupling of any high speed digital circuitry is a must. Many embedded type micro processors today has clock frequencies with clocks or over tones that reaches well into the GHz range. It is perfectly possible for an embedded design to pass any EMC certification and still cause disturbances that will block the RF reception of the CORE module. The sensitivity of the CORE module receiver is better than -100dBm ___ therefore it is recommended to keep disturbances below this level in the frequency range of operation. A near field probe connected to a spectrum analyzer will show if there are any disturbances present on the 2.45 GHz band generated by the micro processor or any other device that is placed on the main board. Pay special attention to readymade LAN-products "Server in a RJ connector". They pass EMC certifications, but some of them radiates badly on 2.45 GHz. If disturbances can be seen on a spectrum analyzer - then the CORE module will have impaired reception. The CORE module has a supply voltage decoupling on the circuit board. The supply voltage still needs to be adequately filtered. If any disturbance or intermittent communication failures occur, as one of the trouble shooting steps - check the supply voltage for drop-outs, switch supply ripple etc. - 10 (18) - Layout Example 1. 2. The TOP layer inside the footprint must be free from copper. There is a ground plane on the transceiver module, but there are also supply lines. It is an unnecessary risk to rely on solder mask lacquer for isolation. The area around the antenna must be kept clear from copper on all layers. This is shown in the picture below. This shows inner layer 1 (next to TOP) Minimum dimensions for ground plane clearance for optimum antenna performance is shown below: 16mm 6.8mm 7.5mm Place on card edge for optimum antenna performance - 11 (18) - Internal antenna radiation pattern The Core module is utilizing an internal RF Ceramic Chip Antenna from Johanson Technology Inc part number 2450AT18A100E. A detailed specification of the antenna can be found here: http://www.johansontechnology.com/images/stories/ip/rf-antennas/JTI_Antenna-2450AT18A100_1003.pdf The radiation pattern of the antenna can be found on page 3 in the Johanson Technology Inc: - 12 (18) - Mechanical dimensions - 13 (18) - CORE reflow soldering specification The CORE module is a surface mount device (SMD) designed to be easily manufactured including reflow soldering to a PCB. It is ultimately the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. CORE surface mount module conforms to JSTD-020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260° and not for more than 30 seconds Temperatures should not exceed the minimums or maximums presented in table below: Specification Value Unit Temperature Inc./Dec. Rate (max) 1~3 °C / sec Temperature Decrease rate (goal) 2-4 °C / sec Soak Temp Increase rate (goal) .5 - 1 °C / sec Flux Soak Period (min) 70 sec Flux Soak Period (max) 120 sec Flux Soak Temp (min) 150 °C Flux Soak Temp (max) 190 °C Time Above Liquidous (max) 70 sec Time Above Liquidous (min) 50 sec Time In Target Reflow Range 30 sec (goal) Time At Absolute Peak (max) sec Liquidous Temperature (SAC305) 218 °C Lower Target Reflow Temperature 225 °C Upper Target Reflow Temperature 250 °C Absolute Peak Temperature 260 °C - 14 (18) - Compliance information FCC information FCC Information to User This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Guidelines for Human Exposure The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device, for example, USB dongle like transmitters is forbidden. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. FCC Declaration of Conformity We LumenRadio AB Svangatan2B, 41668 Gothenburg, Sweden, declare under our sole responsibility that 200‐1901, CORE, complies with Part 15 of FCC Rules. Operation is subject to the following two conditions: This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation. FCC Radio Frequency Interference Warnings & Instructions This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following methods: Reorient or relocate the receiving antenna Increase the separation between the equipment and the receiver Connect the equipment into an electrical outlet on a circuit different from that which the radio receiver is connected Consult the dealer or an experienced radio/TV technician for help. Modifications made to the product, unless expressly approved by LumenRadio AB., could void the user's right to operate the equipment. CE 200‐1901, CORE, complies with the Essential Requirements of RED (Radio Equipment Directive) of the European Union (2014/53/EU). CORE meets the ETSI EN 300 328 V1.8.1 and ETSI EN 300 328 V1.9.1 conformance standards for radio performance. Compliance Marketing FCC & Industrial Canada The CORE module is certified for FCC as a single‐modular transmitter. CORE is a FCC certified radio module that carries a “Modular” grant CORE complies to the “Intentional Radiator” portion (Part 15c) for FCC certification: Part 15.247 Transmitter tests. - 15 (18) - If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: XRSCRMXCORE101” or “Contains FCC ID: XRSCRMXCORE101”. When the module is installed inside another device, the user manual of this device must contain below warning statements: 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Other Compliances For other local compliance regulations (CE, UL, CSA, SRRC, C-Tick, etc.) you are responsible as the product manufacturer to ensure all required compliance testing is completed. LumenRadio are happy to advise on compliance testing – please contact LumenRadio for details. Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) l’appareil ne doit pas produire de brouillage; (2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. The device meets the exemption from the routine evaluation limits in section 2.5 of RSS 102 and compliance with RSS-102 RF exposure, users can obtain Canadian information on RF exposure and compliance. Le dispositif rencontre l'exemption des limites courantes d'évaluation dans la section 2.5 de RSS 102 et la conformité à l'exposition de RSS-102 rf, utilisateurs peut obtenir l'information canadienne sur l'exposition et la conformité de rf. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. Cet émetteur ne doit pas être Co-placé ou ne fonctionnant en même temps qu'aucune autre antenne ou émetteur. Cet équipement devrait être installé et actionné avec une distance minimum de 20 centimètres entre le radiateur et votre corps. If the IC number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contain IC: 8879A-CRMXC101”. When the module is installed inside another device, the user manual of this device must contain below warning statements: 1. This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. 2. Cet appareil est conforme aux CNR exemptes de licence d'Industrie Canada . Son fonctionnement est soumis aux deux conditions suivantes : ( 1 ) Ce dispositif ne peut causer d'interférences ; et ( 2 ) Ce dispositif doit accepter toute interférence , y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. - 16 (18) - The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device, for example, USB dongle like transmitters is forbidden. This modular complies with IC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. Cette modulaire doit être installé et utilisé à une distance minimum de 20 cm entre le radiateur et le corps de l'utilisateur. - 17 (18) - Revision history Document revision PA1 PA2 PA3 Release date Comment Status 2014-09-15 2014-09-17 2014-09-30 Preliminary Preliminary Preliminary PA4 PA5 PA6 2014-11-11 2014-12-11 2014-01-28 Initial version Specifications added Additional specifications added Layout example added Compliance information added Current ramps added Minor changes Pin functions specified, Mechanical dimensions drawing added - 18 (18) - Preliminary Preliminary Preliminary
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