LuxLabs MeshNetics ZIGBIT-A2 2.4GHz 802.15.4/ZigBee OEM-module User Manual Product Datasheet

Download:
Mirror Download [FCC.gov]
Document ID	784667
Application ID	d/mavneTkv6PatagmJsA/Q==
Document Description	Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	139.83kB (1747901 bits)
Date Submitted	2007-04-25 00:00:00
Date Available	2007-04-26 00:00:00
Creation Date	2007-04-17 12:35:22
Producing Software	Acrobat Distiller 7.0 (Windows)
Document Lastmod	2007-04-25 15:10:56
Document Title	Product Datasheet
Document Creator	Acrobat PDFMaker 7.0 for Word
Document Author:	Sergey Trousenkov

ZigBit™ OEM Modules
ZDM-A1281-*
Ultra-Compact 2.4GHz 802.15.4/ZigBee Modules
for Wireless Networking Applications
Product Datasheet
DOC. M-251~01 V.1.9
WWW.MESHNETICS.COM
© 2007 MeshNetics
APRIL 2007
Zi gBi t™ O EM M odule s
Product Datasheet
Table of Contents
Summary ............................................................................................................................................................. 3
Applications ........................................................................................................................................................ 3
Key features ........................................................................................................................................................ 3
Benefits................................................................................................................................................................ 3
ZigBit™ Module Overview ................................................................................................................................. 4
Specifications ..................................................................................................................................................... 5
Absolute Maximum Ratings*** .......................................................................................................................... 6
Physical/Environmental Characteristics and Outline ..................................................................................... 7
Pin Configuration................................................................................................................................................ 8
Mounting Information....................................................................................................................................... 12
Sample Antenna Reference Designs .............................................................................................................. 13
Agency Certifications....................................................................................................................................... 18
Technical Support ............................................................................................................................................ 20
Development Support ...................................................................................................................................... 20
Ordering Information........................................................................................................................................ 20
Related Documents .......................................................................................................................................... 21
Disclaimer.......................................................................................................................................................... 21
Trademarks ....................................................................................................................................................... 21
Contact Information.......................................................................................................................................... 21
© 2007 MeshNetics
Page 2 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Summary
ZigBit™ stands for ultra-compact, low-power, high-sensitivity 2.4GHz 802.15.4/ZigBee 2006 OEM modules from
MeshNetics, based on the innovative Atmel’s mixed-signal hardware platform. They are designed for wireless
sensing, control and data acquisition applications. The ZigBit modules eliminate the need for costly and timeconsuming RF development, and shorten time to market for a wide range of wireless applications.
Two different versions of ZigBit modules are available: ZDM-A1281-B0 module with balanced RF port for
applications where the benefits of PCB or external antenna can be utilized and ZDM-A1281-A2 module with chip
antenna satisfying the needs of size sensitive applications.
Applications
ZigBit features standards-based networking stack, based on IEEE802.15.4 PHY and MAC layers, and ZigBee
NWK/APS/ZDO layers. It enables multipoint, multihop communications over an area of thousands of square meters
at moderate data rates without expensive infrastructure support. The architecture of the Wireless Sensor Networks
(WSN) allows for use of low powered devices. The applications include, but are not limited to:
•
•
•
•
•
Building automation & monitoring
• Lighting controls
• Wireless smoke and CO detectors
• Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Key features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Ultra compact size (24 x 13.5 mm for
ZDM-A1281-A2 module and 18,8 x 13.5 mm for
ZDM-A1281-B0 module)
Innovative (patent-pending) balanced chip antenna
design with antenna gain of approximately 0 dBi
(for ZDM-A1281-A2 version)
High RX sensitivity (-101 dBm)
Outperforming link budget (104 dB)
Up to 3 dBm output power
Very low power consumption
(<6 µA in deep sleep mode)
Ample memory resources (128 kBytes of flash
memory, 8 kBytes RAM, 4 kBytes EEPROM)
Wide range of interfaces (both analog and digital):
• 10 spare GPIO, 2 spare IRQ lines
• 4 ADC lines
• UART with CTS/RTS control
• I2C, USART/SPI
Up to 30 lines can be configured as GPIO
Capability to write own MAC address into the
EEPROM
Optional antenna reference designs
IEEE 802.15.4 compliant
2.4 GHz ISM band
eZeeNet embedded software, including UART
bootloader and AT command set
© 2007 MeshNetics
•
•
•
Water metering
Industrial monitoring
• Machinery condition and performance monitoring
• Monitoring of plant system parameters such as
temperature, pressure, flow, tank level, humidity,
vibration, etc.
Automated meter reading (AMR)
Benefits
•
•
•
•
•
•
•
•
•
Less physical space constraints
Best-in-class RF link range
Longer battery life
Easy prototyping with 2-layer PCB
More memory for user software application
Mesh networking capability
Easy-to-use low cost Evaluation Kit
Single source of support for HW and SW
Worldwide license-free operation
Page 3 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
ZigBit™ Module Overview
ZigBit is a low-power, high-sensitivity IEEE802.15.4/
ZigBee-2006 compliant OEM module. This multifunctional device occupies less than a square inch of
space, which is comparable to a typical size of a single
chip. Based on a solid combination of Atmel’s latest AVR
Z-Link hardware platform [1], the ZigBit offers superior
radio performance with exceptional ease of integration.
ZigBit modules comply with the FCC (Part 15), IC and
ETSI (CE) rules applicable to the devices radiating in
uncontrolled environment. For details, see section
Agency Certifications below.
ZDM-A1281-B0 Block Diagram
VCC (1.8 – 3.6V)
IRQ
UART
USART/SPI
I2C
JTAG
Analog
ZigBit fully satisfies the requirements of the “Directive
2002/95/EC of the European Parliament and the Council
of 27January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic
equipment” (RoHS). MeshNetics provides fully compliant
product in all regions where the directive is enforced July
1, 2006.
ATmega1281
Micro
controller
GPIO
AT86RF230
RF
Transceiver
SPI Bus
ZDM-A1281-A2 Block Diagram
VCC (1.8 – 3.6V)
The
ZigBit
contains
Atmel’s
ATmega1281V
Microcontroller [1] and AT86RF230 RF Transceiver [2].
The module features 128kb flash memory and 8 kb RAM.
The ZigBit already contains a complete RF/MCU-related
design with all the necessary passive components
included. The module can be easily mounted on a simple
2-layer PCB. Compared to a single-chip, a module-based
solution offers considerable savings in development time
& NRE cost per unit during the design & prototyping
phase.
Innovative (patent-pending) chip antenna design in ZDMA1281-A2 module eliminates the balun and achieves
good performance over ZigBee frequency band.
MeshNetics provides tools for building ready-to-use
applications around the ZigBit module. The Evaluation
Kit and the Development Kit help prototyping and testing
an 802.15.4 or ZigBee networking solution. It includes
the sensor boards with multiple interfaces, an out-of-thebox data acquisition software suite, as well as
accessories and documentation. The sample sensor data
acquisition application allows network monitoring and
data collection, all visualized via graphic interface.
IRQ
UART
USART/SPI
I2C
JTAG
Analog
ATmega1281
Micro
controller
GPIO
AT86RF230
RF
Transceiver
Chip
Antenna
SPI Bus
eZeeNet™ Block Diagram
The ZigBit modules come bundled with the eZeeNet
networking firmware. The eZeeNet enables the modulebased OEM products to form self-healing, self-organizing
mesh networks. The eZeeNet stack conforms to
IEEE802.15.4/ ZigBee specifications [3], [4], [5].
Depending on your design requirements, you can use
the ZigBit to operate a sensor node, where it would
function as a single MCU. Or you can pair it to a host
processor, where the module would serve essentially as
a modem.
In the former case, a user application should be bundled
with the eZeeNet software. The eZeeNet’s programming
interface gives users flexibility to manage network and
minimize power consumption.
© 2007 MeshNetics
Page 4 of 22
RF I/O
Zi gBi t™ O EM M odule s
Product Datasheet
In the latter case, the host processor can control data transmission and manage module peripherals via powerful set
of AT commands. This way, a minimum engineering effort for development of customer’s devices is required.
Additionally, the sensors can be connected directly to the module, thus expanding the existing set of sensor
interfaces. The over-the-air control via AT-commands makes debugging and network testing easier. It also enables
wireless module configuration during OEM mass-production process and provides flexible commissioning protocol
for installation and maintenance of ZigBit-based devices.
The eZeeNet is compact private profile software from MeshNetics that is specifically tailored for data acquisition
applications. It allows optimizing the network traffic, reducing power consumption, scheduling, and smart power
management. The eZeeNet software comes with a set of drivers for standard peripherals (I2C, GPIO, ADC, etc.) that
ensure the ZigBit module easy integration.
Specifications
Test Conditions (unless otherwise stated): Vcc= 3 V, f=2.45 GHz, Tamb= 25 °C
Module Operating Conditions
Parameters
Range
Unit
1.8 to 3.6
Current Consumption: RX mode
19
mA
see Note
Current Consumption: TX mode
18
mA
see Note
Current Consumption: Radio is turned off,
MCU is active for 50% of the time.
14
mA
see Note
Current Consumption: Power Save mode
μA
see Note
Supply Voltage (Vcc)
Condition
Note: Parameters specified above are measured under the following conditions:
•
eZeeNet software is running at 4 MHz clock rate, DTR line management is turned off
•
all interfaces are set to the default state (see Pin Assignment Table)
•
output TX power is 0 dBm
•
JTAG is not connected
•
Vcc = 3.0 V
•
actual current consumption depends on multiple factors, including but not limited to the board
design and materials, extra MCU load by user application, peripherals usage, EEPROM
reading/writing, eZeeNet settings, network activity and so on.
RF Characteristics
Parameters
Frequency Band
Range
Unit
2.400 to 2.4835
GHz
Condition
Number of Channels
16
Channel Spacing
MHz
-17 to +3
dBm
Adjusted in 16
steps
- 101
dBm
PER = 1%
On-Air Data Rate
250
kbps
TX Output / Rx Input Nominal Impedance
100
Ohms
Transmitter Output Power
Receiver Sensitivity
© 2007 MeshNetics
For balanced
output
Page 5 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
ATmega1281V Microcontroller Characteristics
Parameters
Range
Unit
128
kBytes
On-Chip RAM Size
kBytes
On-Chip EEPROM Size
kBytes
Operation Frequency
MHz
On-Chip Flash Memory Size
Condition
Module Interfaces Characteristics
Parameters
Range
Unit
38.4
kbps
10 / 200
Bits / μs
100
MOhm
1.0 to Vcc - 0.3
ADC Input Voltage
0 ÷ Vref
I2C Maximum Clock
222
kHz
GPIO Output Voltage (High/Low)
2.3 / 0.5
Real Time Oscillator Frequency
32.768
kHz
UART Maximum Baud Rate
ADC Resolution / Conversion Time
ADC Input Resistance
ADC Reference Voltage (Vref)
Condition
In the single
conversion mode
(-10 / 5 mA)
Absolute Maximum Ratings***
Parameter
Voltage of any Pin except RESET with respect to
Ground
Min Value
-0.5 V
Max Value
Vcc + 0.5 V
DC Current per I/O Pin
40 mA
DC Current D_VCC and DGND Pins
200 mA
Input RF Level
+10 dBm
***Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in the following table be violated. Stresses beyond those
listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or other conditions, beyond those
indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
****Caution! ESD-sensitive device. Precaution should be used when handling the device in order to prevent
permanent damage.
© 2007 MeshNetics
Page 6 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Physical/Environmental Characteristics and Outline
Parameter
Size
Value
Notes
18.8 x 13.5 x 2.8 mm
ZDM-A1281-B0
24.0 x 13.5 x 2.8 mm
ZDM-A1281-A2
1.3 g
ZDM-A1281-B0
1.5 g
ZDM-A1281-A2
-20°C to +70°C
-40°C to +85°C operational *
Weight
Operating Temperature Range
Operating Relative Humidity
Range
no more than 80%
ZDM-A1281-B0 Mechanical Drawing
18,8
±0,2
17,3±0,2
26
43
25
44
12,0±0,2
13,5±0,2
48
19
18
0,8-0.2
All dimensions are in millimeters
2,0±0,1
0,7±0,1
1,0 typ
ZDM-A1281-A2 Mechanical Drawing
24,0
±0,2
17,3±0,2
26
43
25
12,0±0,2
13,5±0,2
19
18
0,8-0.2
All dimensions are in millimeters
1,0 typ
0,7±0,1
2,0±0,1
Minor degradation of clock stability may occur
© 2007 MeshNetics
Page 7 of 22
© 2007 MeshNetics
IRQ_6
IRQ_7
GPIO8
USART0_EXTCLK
USART0_TXD
USART0_RXD
UART_DTR
OSC32K_OUT
GPIO2
GPIO1
GPIO0
SPI_MISO
SPI_MOSI
SPI_CLK
18 17 16 15 14 13 12 11 10 9
RESET
DGND
CPU_CLK
I2C_CLK
I2C_DATA
UART_TXD
UART_RXD
UART_RTS
IRQ_6
IRQ_7
GPIO8
USART0_EXTCLK
USART0_TXD
USART0_RXD
UART_DTR
GPIO9
AGND
A_VREF
BAT
ADC_INPUT_1
ADC_INPUT_2
ADC_INPUT_3
JTAG_TCK
44 45 46 47 48
OSC32K_OUT
GPIO2
GPIO1
GPIO0
SPI_MISO
SPI_MOSI
SPI_CLK
DGND
CPU_CLK
I2C_CLK
I2C_DATA
UART_TXD
UART_RXD
UART_RTS
UART_CTS
GPIO6
GPIO7
RESET
18 17 16 15 14 13 12 11 10 9
GPIO9
AGND
D_VCC
A_VREF
DGND
BAT
D_VCC
ADC_INPUT_1
DGND
ADC_INPUT_2
GPIO5
ADC_INPUT_3
GPIO3
JTAG_TCK
GPIO4
JTAG_TDO
D_VCC
UART_CTS
D_VCC
JTAG_TDO
DGND
25 24 23 22 21 20 19
DGND
JTAG_TDI
JTAG_TMS
GPIO5
GPIO6
GPIO7
GPIO3
JTAG_TDI
JTAG_TMS
GPIO4
25 24 23 22 21 20 19
Zi gBi t™ O EM M odule s
Product Datasheet
Pin Configuration
ZDM-A1281-B0 Pinout
RF_GND
RFN_IO
RF_GND
RFP_IO
RF_GND
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
ZDM-A1281-A2 Pinout
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
Page 8 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Pin Assignment Table
Conn
ector Pin Name
Pin
Description
I/O
Defaul
t State
after
power
on
Port
ATmega
1281V
ATmega
1281v
Datasheet
Reference*
Notes,
see list
below
SPI_CLK
Reserved for stack operation
PB1
SPI_MOSI
Reserved for stack operation
PB3
SPI_MISO
Reserved for stack operation
I/O
PB2
GPIO0
General purpose digital input/output
I/O
tri-state
PB5
GPIO1
General purpose digital input/output
I/O
tri-state
PB6
GPIO2
General purpose digital input/output
I/O
tri-state
PB7
OSC32K_OUT
32.768 kHz clock output.
PG3
Page 99
3, 4
RESET
Reset input (active low).
RESET
Page 56
9,
22,
23
DGND
Digital ground
10
CPU_CLK
RF clock output. When module is in
active state, 4 MHz signal is present
on this line. While module is in the
sleeping state, clock generation is
stopped also.
11
I2C_CLK
I2C serial clock output
tri-state
PD0
I/O
tri-state
PD1
Page 189
1, 2, 3, 6
Pages 7879, 86-87,
109
1, 2, 3, 6
1, 2, 3, 6
XTAL_In
12
I2C_DATA
I C serial data input/output
13
UART_TXD
UART receive pin
tri-state
PD2
14
UART_RXD
UART transmit pin
tri-state
PD3
15
UART_RTS
RTS input (Request To Send) for
UART hardware flow control. Active
low.
tri-state
PD4
16
UART_CTS
CTS output (Clear To Send) for
UART hardware flow control. Active
low.
tri-state
PD5
17
GPIO6
General purpose digital input/output
I/O
tri-state
PD6
18
GPIO7
General purpose digital input/output
I/O
tri-state
PD7
19
GPIO3
General purpose digital input/output
I/O
tri-state
PG0
20
GPIO4
General purpose digital input/output
I/O
tri-state
PG1
21
GPIO5
General purpose digital input/output
I/O
tri-state
PG2
24,
25
D_VCC
Digital supply voltage (Vcc)
26
JTAG_TMS
JTAG test mode select
© 2007 MeshNetics
Pages 233264,364
Page 198
1, 2, 3, 6
1, 2, 3, 6
1, 2, 3, 6
1, 2, 3, 6
1, 2, 3, 6
Pages 7879, 91, 110
1, 2, 3,
6, 7
1, 2, 3, 6
1, 2, 3, 6
1, 2, 3, 6
Pages 79,
99, 111
1, 2, 3, 6
1, 2, 3, 6
PF5
Pages 7,
1, 2, 3, 5
Page 9 of 22
Zi gBi t™ O EM M odule s
Conn
ector Pin Name
Pin
Description
I/O
Defaul
t State
after
power
on
Product Datasheet
Port
ATmega
1281V
ATmega
1281v
Datasheet
Reference*
97, 288
Notes,
see list
below
27
JTAG_TDI
JTAG test data input
PF7
28
JTAG_TDO
JTAG test data output
PF6
1, 2, 3, 5
29
JTAG_TCK
JTAG test clock
PF4
1, 2, 3, 5
30
ADC_INPUT_3
ADC input channel 3
tri-state
PF3
1, 2, 6
31
ADC_INPUT_2
ADC input channel 2
tri-state
PF2
1, 2, 6
32
ADC_INPUT_1
ADC input channel 1
tri-state
PF1
33
BAT
ADC input channel 0. Used by the
stack for battery level
measurement. Nominal voltage is 1
V in respect to AGND.
34
A_VREF
Output/Input reference voltage for
ADC
35
AGND
Analog ground
36
GPIO9
General purpose digital input/output
37
UART_DTR
DTR input (Data Terminal Ready)
for UART. Active low.
tri-state
PE4
38
USART0_RXD
UART/SPI receive pin
tri-state
PE0
tri-state
PF0
I/O
tri-state
AREF
I/O
Pages 97,
266-287
1, 2, 3, 5
1, 2, 6
1, 2, 6
Pages 274,
280
1, 2, 3, 6
PG5
Pages 73,
93
1, 2, 3, 6
1, 2, 3, 6
Pages 198,
224, 198232
39
USART0_TXD
UART/SPI transmit pin
tri-state
PE1
1, 2, 3, 6
40
USART0_EXT
CLK
UART/SPI external clock
tri-state
PE2
41
GPIO8
General purpose digital input/output
I/O
tri-state
PE3
42
IRQ_7
Digital input interrupt request 7
tri-state
PE7
43
IRQ_6
Digital input interrupt request 6
tri-state
PE6
44,
46,
48
RF_GND
RF analog ground
45
RFP_IO
Differential RF input/output.
I/O
47
RFN_IO
Differential RF input/output.
I/O
1, 2, 3, 6
1, 2, 3, 6
Pages 73,
93-96
1, 2, 3, 6
1, 2, 3, 6
Notes:
1. *Most of pins can be configured for general purpose I/O or for some alternative functions as described in
details in the ATmega1281V Datasheet [1].
2. GPIO pins can be programmed either for output, or input with/without pull-up resistors. Output pin drivers
are strong enough to drive LED displays directly (refer to figures on pages 387-388, [1]).
3. All digital pins are provided with protection diodes to D_VCC and DGND
4. It is strongly recommended to avoid assigning an alternative function for OSC32K_OUT pin because it is
used by eZeeNet Framework. However, this signal can be used if another peripheral or host processor
requires 32.768 kHz clock, otherwise this pin can be disconnected.
5. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging and flash
burning. They can be used for A/D conversion if JTAGEN fuse is disabled.
6. eZeeNet software can configure as general-purpose I/O lines the following pins: GPIO0, GPIO1, GPIO2,
GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO9, I2C_CLK, I2C_DATA, UART_TXD, UART_RXD,
UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2, ADC_INPUT_1, BAT, UART_DTR,
USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6. Additionally, four JTAG lines could be
© 2007 MeshNetics
Page 10 of 22
Zi gBi t™ O EM M odule s
7.
8.
Product Datasheet
programmed with software as GPIO as well, but this requires changing the fuse bits and will disable JTAG
debugging.
CTS pin can be configured by eZeeNet to indicate sleep/active condition of the module thus providing
mechanism for power management of host processor. If such functionality is needed, it is recommended to
connect external pull-down resistor to this pin to prevent undesirable transients during module reset
process.
It is recommended to use ferrite bead and 1 µF capacitor located closely to the power supply pin, as shown
below.
1,8...3,6 V
D_VCC
DGND
9. Pins 44 through 48 are not present on the module with chip antennas
Typical schematics
© 2007 MeshNetics
Page 11 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Mounting Information
ZDM-A1281-B0 PCB Recommended Layout, Top View
19,7
1,0
25
44
14,4
48
19
18
0,8
43
1,2
26
All dimensions are in millimeters
ZDM-A1281-A2 PCB Recommended Layout, Top View
0,5
1,0
25
14,4
19
3,8
18
24,0
0,8
26
All dimensions are in millimeters
43
1,2
0,9
The above diagrams show the recommended PCB layout for ZigBit module. No via-holes and no wires are allowed
on the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be
grounded via several holes located very close to pins thus minimizing inductance and preventing mismatch and
losses.
© 2007 MeshNetics
Page 12 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Sample Antenna Reference Designs
The following reference antenna design shows an example that can serve as a basis for further optimization.
The symmetric dipole antenna shown below has been tuned for a particular case, so the cut-and-paste approach
would not necessarily ensure an optimum performance because of multiple factors affecting the antenna matching
and pattern (for instance, the board material and thickness, shields, the material of enclosure, the board
neighborhood, other components located next to antenna and so on). As a general recommendation, metal
enclosures or setting high profile components closely to antenna should be avoided. Using low profile enclosures
can, furthermore, cause antenna tuning. The holes shown located around the board eliminate the undesirable
antenna pattern distortions which might be induced by radiation from the board edges. The ZigBit module should not
be placed next to components causing undesirable interference in its operating frequency band or adjacent bands,
such as GSM, CDMA, WiFi, and Bluetooth.
PCB Layout: Symmetric Dipole Antenna recommended for ZDM-A1281-B0
Top side
21,0
5,2
25,0
1,4
1,2
1,2
2,6
3,3
4,6
3,3
1.8
1,8
1,9
1,2
4,0
6,5
11,5
0,7
3,0
2 through holes O3,0
2,0
ZigBit
Module
Metallized through holes O0.3~0.4
Recommended step 1 mm
Two capacitors 0402,22pF+/-5%, NP0 High Freq Grade
Murata GRM1555C1H220JZ0D
Bottom side
Components area
52,5
No metallization, wires,
through holes allowed
11,5
1,2
Metallization
Material: FR-4. thickness 1.6 mm
Metallization: 35 um
Coating: HASL, solder mask
All dimensions are in millimeters
ZigBit
Module
60,0
© 2007 MeshNetics
Page 13 of 22
Zi gBi t™ O EM M odule s
112,5º
135º
90º
-1
-2
-3
-4
-5
Product Datasheet
67,5º
ZDM-A1281-B0 Pattern:
Symmetric Dipole Antenna
(horizontal plane)
45º
157,5º
22,5º
180º
0º
202,5º
ZDM-A1281-B0
337,5º
315º
225º
292,5º
247,5º
PCB Antenna
270º
112,5º
135º
90º
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
67,5º
Nylon leg
Battery compartment
45º
ZDM-A1281-B0 Pattern
(vertical plane)
157,5º
22,5º
-15
-20
180º
0º
202,5º
337,5º
225º
315º
247,5º
292,5º
270º
© 2007 MeshNetics
Page 14 of 22
Zi gBi t™ O EM M odule s
112,5º
135º
90º
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
Product Datasheet
ZDM-A1281-A2 Pattern
(horizontal plane)
67,5º
45º
157,5º
22,5º
-15
-20
180º
0º
ZDM-A1281-A2
202,5º
337,5º
225º
315º
247,5º
292,5º
270º
112,5º
135º
90º
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
67,5º
45º
Nylon leg
Battery compartment
157,5º
22,5º
-15
ZDM-A1281-A2 Pattern
(vertical plane)
-20
0º
180º
202,5º
337,5º
225º
315º
247,5º
292,5º
270º
Note: The presented antenna patterns were observed using PCB enhanced with legs made of original nylon.
© 2007 MeshNetics
Page 15 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Normally chip antennas are more tolerant of board and enclosure materials, and ZigBit module neighborhood;
however, general recommendations for board design for the PCB antenna version still apply.
The board should be designed such that it prevents propagation of microwave field inside the board material itself.
High frequency electromagnetic field may penetrate the board and radiate from the edges of the board causing
undesirable pattern distortions. To eliminate this effect, it is often enough to surround the board with metallized
holes connected to module ground.
Since the module with chip antenna is tuned for installation on FR-4 board with thickness 1.6 mm, the performance
is guaranteed only if the board is designed according to the diagram below. Deviations from this design may change
the performance.
Recommended Layout for Chip Antenna Module (ZDM-A1281-A2)
Top side
3,5
6,5
60,0
3,5
2 through holes O3,0
ZigBit
Module
Metallized through holes O0.3~0.4
Recommended step 1 mm
Bottom side
Components area
No metallization, wires,
through holes allowed
Metallization
Material: FR-4. thickness 1.6 mm
Metallization: 35 um
Coating: HASL, solder mask
All dimensions are in millimeters
ZigBit
Module
© 2007 MeshNetics
Page 16 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Recommended PCB Layout for 50 Ohm External Antenna (ZDM-A1281-B0)
Top side
3,4
1,7
0,9
5,1
2,6
5,0
7,5
SMA-Connector
4 through holes O1,9
Balun TDK’s HHM1520
0,7
Two capacitors 0402,22pF+/-5%,
NP0 High Freq Grade
Murata GRM1555C1H220JZ0D
Metallized through holes O0,3~0,4
Recommended step 1 mm
2,0
Components area
No metallization, wires,
through holes allowed
Bottom side
5,0
0,9
Metallization
Material: FR-4. thickness 1.6 mm
Metallization: 35 um
Coating: HASL, solder mask
Detailed dimensions: see datasheets
for Balun and SMA-Connector
All dimensions are in millimeters
In case an external antenna or a 50 Ohm unbalanced antenna is required, they can be easily interfaced to ZigBit
module ZDM-A1281-B0 by using 2:1 balun as shown above. This recommended sample demonstrates how to use
low-profile Murata connector. It can be simply replaced with 50 Ohm microstrip line as shown in TDK’s HHM1520
Balun Datasheet [6].
© 2007 MeshNetics
Page 17 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Agency Certifications
UNITED STATES (FCC)
This equipment complies with Part 15 of the FCC rules and regulations.
To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following
regulations:
1.
The modular transmitter must be labelled with its own FCC ID number, and, if the FCC ID is not
visible when the module is installed inside another device, then the outside of the device into
which the module is installed must also display a label referring to the enclosed module. This
exterior label can use wording such as the following:
Example of label required for OEM product containing ZDM-A1281-A2 module
Contains FCC ID: U6TZIGBIT-A2
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (i.) this device may not cause harmful interference and (ii.) this device
must accept any interference received, including interference that may cause undesired
operation.
Example of label required for OEM product containing ZDM-A1281-B0 module
Contains FCC ID: U6TZIGBIT-B0
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (i.) this device may not cause harmful interference and (ii.) this device
must accept any interference received, including interference that may cause undesired
operation.
Any similar wording that expresses the same meaning may be used.
2.
To be used with the ZDM-A1281-B0 module, the external antennas have been tested and
approved which are specified in Approved Antenna List herebelow. The ZDM-A1281-B0
Module may be integrated with other custom design antennas which OEM installer must
authorize following the FCC 15.21 requirements.
WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be
labeled with its own FCC ID number. This includes a clearly visible label on the outside of the final
product enclosure that displays the contents shown below. If the FCC ID is not visible when the
equipment is installed inside another device, then the outside of the device into which the equipment is
installed must also display a label referring to the enclosed equipment.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation (FCC 15.19).
The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of
at least 20 cm from all persons and must not be co-located or operating in conjunction with any other
antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for
satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF
exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions
(FCC 2.1093) requires separate equipment authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense (FCC section 15.105).
© 2007 MeshNetics
Page 18 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
CANADA (IC)
Equipment is subject to certification under the applicable RSSs, shall be permanently labelled on each
item, or as an inseparable combination. The label must contain the following information for full
compliance:
For ZDM-A1281-A2 module:
Certification Number:
IC: 7036A-ZIGBITA2
Manufacturer’s Name, Trade Name or Brand Name:
ZIGBIT
Model Name:
ZDM-A1281-A2
For ZDM-A1281-B0 module:
Certification Number:
IC: 7036A-ZIGBITB0
Manufacturer’s Name, Trade Name or Brand Name:
ZIGBIT
Model Name:
ZDM-A1281-B0
IMPORTANT: This equipment for which a certificate has been issued is not considered certified if it is not properly
labelled. The information on the Canadian label can be combined with the manufacturer’s other labelling
requirements
IMPORTANT: Operation is subject to the following two conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any interference received, including interference that may
cause undesired operation.
IMPORTANT: To reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for
successful communication.
IMPORTANT: The installer of this radio equipment must ensure that the antenna is located or pointed such that it
does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code
6, obtainable from Health Canada’s website www.hc-sc.gc.ca/rpb.
EUROPEAN UNION (ETSI)
The ZDM-A1281-A2 and ZDM-A1281-B0 Modules has been certified for use in European Union
countries.
If the ZDM-A1281-A2 and ZDM-A1281-B0 Modules are incorporated into a product, the manufacturer
must ensure compliance of the final product to the European harmonized EMC and low-voltage/safety
standards. A Declaration of Conformity must be issued for each of these standards and kept on file as
described in Annex II of the R&TTE Directive.
Furthermore, the manufacturer must maintain a copy of the ZDM-A1281-A2 and ZDM-A1281-B0
Modules documentation and ensure the final product does not exceed the specified power ratings,
antenna specifications, and/or installation requirements as specified in the user manual. If any of these
specifications are exceeded in the final product, a submission must be made to a notified body for
compliance testing to all required standards.
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall consist
of the initials "CE" taking the following form:
•
If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing
must be respected.
•
The CE marking must have a height of at least 5mm except where this is not possible on
account of the nature of the apparatus.
•
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at “DIRECTIVE 1999/5/EC OF
THE EUROPEAN PARLIAMENT AND OF THE COUNCIL” on 9 March 1999 at section 12.
Certification Approved Antennas list is presented in Approved Antenna List below.
© 2007 MeshNetics
Page 19 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Approved Antenna List
ZDM-A1281-A2 Module has only possibility to work with installed chip-antenna. The design of the chipantenna is fully tested and satisfies all the legislation mentioned above.
ZDM-A1281-B0 Module has been tested and approved for use with the antennas listed in the table
below. The ZDM-A1281-B0 Module may be integrated with other custom design antennas which OEM
installer must authorize following the respective legislation requirements.
Part Number
Manufacturer & Description
Gain, dBi
Min. Separation, cm
2010B4844-01
Antenova Titanis, swivel antenna (1/4
wave antenna) with SMA connector,
frequency range 2.4-2.5 GHz
4.1
20
17010.10
WiMo, swivel antenna (1/2 wave
antenna) with SMA connector,
frequency range 2.35-2.5 GHz
2.1
20
Technical Support
Tel: +7 (495) 725 8125
E-mail: support@meshnetics.com
Development Support
•
Easy-to-use Evaluation and Development Kits are available.
•
Source code samples and RF reference designs are available to qualified customers.
•
MeshNetics runs the ZigBit Priority Support Program to facilitate faster delivery of ZigBit-based applications
to the market. The qualified customers enjoy priority samples policy, direct access to MeshNetics RF
experts, 802.15.4 MAC-, eZeeNet stack- and Gateways- development teams, dedicated FAE for application
consulting and other technical resources to accelerate the development of ZigBit-based products and
applications. To qualify for the Program, please contact us at zigbit@meshnetics.com for more details.
Ordering Information
You can contact MeshNetics for additional modules, the Evaluation Kit or the Developer’s Kit to build your custom
network. Please e-mail us at zigbit@meshnetics.com, or visit us online at www.meshnetics.com/contacts.
Please specify the product part number and description when ordering.
Part Number
Description
ZDM-A1281-B0
2.4 GHz IEEE802.15.4/ZigBee OEM Module w/ Balanced RF Port
ZDM-A1281-A2
2.4 GHz IEEE802.15.4/ZigBee OEM Module with chip antennas
© 2007 MeshNetics
Page 20 of 22
Zi gBi t™ O EM M odule s
Product Datasheet
Related Documents
[1] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash.
2549F-AVR-04/06
[2] Atmel Low-Power Transceiver for ZigBee Applications. AT86RF230 Target Specification.
5131A-ZIGB-08/15/05
[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology – Part 15.4 Wireless Medium Access
Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks
(LR-WPANs)
[4] ZigBee Specification. ZigBee Document 053474r14, November 03, 2006
[5] eZeeNet™ IEEE802.15.4/ZigBee Software. Product Datasheet. MeshNetics Doc. M-251~02
[6] Multilayer Baluns, HHM Series. HHM1520 For Bluetooth & IEEE802.11b/g,
www.tdk.co.jp/tefe02/e8balun_hhm.pdf
Disclaimer
MeshNetics believes that all information is correct and accurate at the time of issue. MeshNetics reserves the right
to make changes to this product without prior notice. Please visit MeshNetics website for the latest available version.
MeshNetics does not assume any responsibility for the use of the described product or convey any license under its
patent rights.
Trademarks
MeshNetics®, ZigBit, eZeeNet, ZigBeeNet, SensiLink, LuxLabs, Luxoft Labs, and MeshNetics, Luxoft Labs and
ZigBit logos are trademarks of LuxLabs Ltd.
All other product names, trade names, trademarks, logos or service names are the property of their respective
owners.
© 2007 MeshNetics. All rights reserved.
No part of the contents of this manual may be transmitted or reproduced in any form or by any means without the
written permission of MeshNetics.
Contact Information
MeshNetics
9 Dmitrovskoye Shosse
Moscow 127434, Russia
Tel: +7 (495) 725 8125
Fax: +7 (495) 725 8116
E-mail: zigbit@meshnetics.com
Website: www.meshnetics.com
Office hours: 8:00am – 5:00pm (Central European Time)
© 2007 MeshNetics
Page 21 of 22
Zi gBi t™ O EM M odule s
© 2007 MeshNetics
Product Datasheet
Page 22 of 22

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 22
Page Layout                     : OneColumn
Has XFA                         : No
XMP Toolkit                     : XMP toolkit 2.9.1-13, framework 1.6
About                           : uuid:8287c4b0-c2b2-46e6-a9a3-98e2267b68d6
Producer                        : Acrobat Distiller 7.0 (Windows)
M-Copyright                     : 2007 MeshNetics
M-Document 0020 Date            : April 2007
M-Document 0020 Version         : 1.9
M-Target 0020 Release           : 1.1
M-Target                        : ZigBit™
M-Part 0020 Number              : ZDM-A1281-B0,ZDM-A1281-A2
Status                          : Final
Owner                           : 3
Company                         : MeshNetics
M-Target 0020 Module            : N/A
Guid                            : {20060327-1205-5496-8BA1-06CC6D1F79AE}
M-Document 0020 Code            : M-251~01
Creator Tool                    : Acrobat PDFMaker 7.0 for Word
Modify Date                     : 2007:04:25 15:10:56+02:00
Create Date                     : 2007:04:17 12:35:22+04:00
Metadata Date                   : 2007:04:25 15:10:56+02:00
Document ID                     : uuid:440fb3b4-f702-4377-bc61-8526e081c453
Instance ID                     : uuid:a098ac88-fc92-4dfd-82d7-db135e290c70
Format                          : application/pdf
Title                           : Product Datasheet
Creator                         : Sergey Trousenkov
Description                     : OEM Modules
Author                          : Sergey Trousenkov
Keywords                        : MeshNetics, ZigBee, ZigBit, OEM , ZDM-A1281-U, 802.15.4, ZigBit Evaluation Kit, ZEK, eZeeNet, ZigBee, Wireless Sensor Network, WSN, Private Area Network, PAN, node, channel, router, coordinator, end-device, routing, sensor, protocol, sleep mode, transmission, commissioning, firmware, embedded software, stack, AT-command
Subject                         : OEM Modules
M-Document Date                 : April 2007
M-Document Version              : 1.9
M-Target Release                : 1.1
M-Part Number                   : ZDM-A1281-B0,ZDM-A1281-A2
M-Target Module                 : N/A
GUID                            : {20060327-1205-5496-8BA1-06CC6D1F79AE}
M-Document Code                 : M-251~01

EXIF Metadata provided by EXIF.tools