MICROCHIP TECHNOLOGY CY92024C Network Media Module User Manual Network Media Module

MICROCHIP TECHNOLOGY INC. Network Media Module Network Media Module

Contents

User Manual I

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Document ID2322212
Application IDYpDOg6LuamGN5mAKS+tzOQ==
Document DescriptionUser Manual I
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize107.05kB (1338085 bits)
Date Submitted2014-07-10 00:00:00
Date Available2014-07-10 00:00:00
Creation Date2014-06-30 12:51:45
Producing SoftwareAcrobat Distiller 8.1.0 (Windows)
Document Lastmod2014-06-30 13:06:56
Document TitleNetwork Media Module
Document CreatorFrameMaker 11.0.2
Document Author: Microchip Technology Inc.

CY920
NETWORK MEDIA MODULE
Operating Conditions
Memory Interfaces
• 3.3V, 2.5V, 1.8V, 1.2V supply voltage
• Operating frequency up to 400 MHz
• Operating temperature: 0ºC to 70ºC
• 16 MB on-board serial Flash memory
• 64 MB on-board DDR2 SDRAM
• Off-board serial Flash memory via extended
connector
Features
• Audio networking system on a small footprint
module
• Wi-Fi® certified 802.11 a/b/g/n
• Integrated Ethernet + USB 2.0 OTG
• Optional Bluetooth® v2.1 + EDR
• Diversity enabled external antenna connectors
• Glueless audio, video, and control ports
• FCC certification is planned for production version
• Ideal for enabling network and USB audio playback
for iPod® docks, audio systems, AV receivers,
active speaker systems, internet radios, network
playback adapters
WLAN
• Integrated 802.11 a/b/g/n MAC, Baseband
Processor (BBP) and radio frequency (RF)
transceiver
• Wi-Fi certified 802.11 a/b/g/n supporting both
2.4 GHz and 5 GHz bands
• On-chip wideband sniffer which enables
applications that benefit from efficient interference
management algorithms
• 1x1 dual band with Tx and Rx antenna diversity
• Supports Wi-Fi Direct®
• Two Ultra Small Miniature RF Connector (U.FL)
type external antenna connectors
Communication Interfaces
• 10/100 Mbps Ethernet support with Ethernet PHY
on-board
• USB 2.0 OTG with integrated PHY
• Serial Peripheral Interface (SPI), Inter-Integrated
Circuit™ (I2C™), Universal Asynchronous
Receiver Transmitter (UART) peripheral ports
• 3.3V tolerance on all digital IOs (GPIO, I2S,
SPDIF, SPI, UART, HDMI)
Audio and Graphics Interface
• I2S support with external Digital-to-Analog
Converter (DAC)/Power Amplifier (PA)
• Built-in Digital Signal Processor (DSP) with dual
core 300 MHz each
• HDMI support with in-built 24-bit HD port and
external HDMI transmitter
• Supports analog video (composite, component
and S-Video) using external video encoder
Input/Output
• General Purpose Input Outputs (GPIOs) for
different Stock Keeping Units (SKUs):
- CY920-A: 11 GPIOs
- CY920-B: 13 GPIOs
- CY920-C: 9 GPIOs
Bluetooth (Optional)
Applications
• Compliant with Bluetooth (BT) v2.1 + EDR
specification
• A2DP and AVRCP profiles
• WLAN and Bluetooth co-existence using Packet
Traffic Arbitration (PTA) and Adaptive Frequency
Hopping (AFH)
• Utilizes same antenna as Wi-Fi system
• Supports Class 2 power output
• Low-power consumption
• JukeBlox®: DLNA™, AirPlay® Speaker, network
audio DMR/ DMP, Internet radio, mini/micro
system
• Audio Video Receivers (AVR)
• Sound Bars
• PC OEM, TV and gaming consoles
• Operating as an access point (Wi-Fi Direct Host)
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 1
CY920
NOTES:
DS60001270C-page 2
Preliminary
© 2014 Microchip Technology Inc.
CY920
Table of Contents
System Overview .................................................................................................................................................................................. 5
CY920 Board Layout and Features .................................................................................................................................................... 15
Application Guidelines ........................................................................................................................................................................ 19
Wi-Fi Specification .............................................................................................................................................................................. 21
Bluetooth Specifications ...................................................................................................................................................................... 23
Packaging Information ........................................................................................................................................................................ 25
Electrical Characteristics ..................................................................................................................................................................... 29
Regulatory Compliance and Quality ................................................................................................................................................... 33
Ordering Guide ................................................................................................................................................................................... 35
Appendix A: Certification Notices ........................................................................................................................................................ 37
Appendix B: Revision History .............................................................................................................................................................. 39
The Microchip Web Site ...................................................................................................................................................................... 41
Customer Change Notification Service ............................................................................................................................................... 41
Customer Support ............................................................................................................................................................................... 41
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We
welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 3
CY920
NOTES:
DS60001270C-page 4
Preliminary
© 2014 Microchip Technology Inc.
CY920
1.0
The CY920 module can be connected to standard I/O
components in various audio, video, and control
formats. The CY920 module and the JukeBlox SDK
form a turnkey solution which enables rapid product
development
by
the
Original
Equipment
Manufacturers (OEMs)
and
Original
Design
Manufacturers (ODMs). The software packages
feature an intuitive Application Programming
Interface (API) that enables easy customization result
in faster time-to-market.
SYSTEM OVERVIEW
Note:
This data sheet summarizes the features
of the CY920 network media module. It is
not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
various application notes available on the
Microchip web site www.microchip.com.
The CY920 module is a single-board network media
module based on Microchip's DM920 network media
processor. It enables faster product development with
Ethernet, USB, Wi-Fi, and Bluetooth connectivity.
FIGURE 1-1:
Figure 1-1 illustrates a typical example of the CY920
module based system block diagram.
CY920 BASED SYSTEM BLOCK DIAGRAM
CY920 Network Media Module
2.5V
DM920 SoC
3.3V
1.2V
1.8V
3.3V RTC
Reset In
RJ-45
Transformer
RST
Ethernet
PHY
10/100
Mbps
DDR2
Controller
26.000 MHz
Ethernet
Controller
USB 2.0
OTG
USB
Type-A/Lightning
UART 0
GPIO
Optional External
Serial Flash
Serial Flash
16 MByte
Apple
Coprocessor
DDR2 SDRAM
64 MByte
2.4/5 GHz
FEM
SPI 1
IC
Bluetooth
Baseband and
RF
802.11
a/b/g/n
Antenna Switch
HDMI Tx
Audio A/D,
D/A
HD Data
I2S, S/PDIF
Debug Port
HD Ports
AV Ports
UART 1
JTAG
Host
Controller
Wi-Fi/BT
Antenna
Socket
Wi-Fi
Antenna
Socket
40.000 MHz
SPI 0
GPIO
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 5
CY920
1.1
Connectors and Connections
The following sections provide information on different
connectors and connections in the CY920 module.
1.1.1
MODULE CONNECTORS
The CY920 module uses two board-to-board connectors, basic and extended, as interfaces to the product
main board. Some of the module versions have only
the basic connector installed.
The CY920 module uses female connectors and the
product main board uses male connectors.
Table 1-1 provides part numbers for the male
connectors needed on the product main board that
mate to the female connectors on the CY920 module.
TABLE 1-1:
Connector
Number
J301
(Basic)
J300
(Extended)
MODULE CONNECTORS
Connector Type
64-pin B2B
connector
2 x 32 x 1.27 mm
DS60001270C-page 6
Mating Connector Part
Numbers
Manufacturer
Alternate Part
Number
S1210-64SVB-S01-1R/C
XINYA
1.27*5.7-2*32P
S1210-64SVB-S01-1R/C
Preliminary
1.27*5.7-2*32P
Alternate
Manufacturer
Shen Zhen Hua
Xin Sheng
Electronic Co Ltd
© 2014 Microchip Technology Inc.
CY920
Table 1-2 provides the function of the pins in the
J301-basic connector.
TABLE 1-2:
PIN
Number
J301-BASIC CONNECTOR
Signal
GPIO
Function
PIN
Number
Signal
GPIO
VIN (1.2V)
—
VIN (2.5V)
—
VIN (1.2V)
—
VIN (2.5V)
—
GND
—
VIN (1.8V)
—
VIN (1.8V)
—
Power supply
GND
—
VIN (3.3V)
—
10
VIN (3.3V)
—
11
GND
—
12
VIN(3.3V RTC)
—
13
SPF0
GPIO-16
iPod Access
Power
14
GND
—
Function
Power supply
15
NRESET
—
System Reset
16
UART_RXD1
—
17
SPF1
GPIO-17
Ethernet
Reset
18
UART_TXD1
—
19
MII_TXD3
GPIO-09
IR input
20
AV4DATA1
—
SPDIF input
21
GND
—
Power supply
22
AV4DATA0
—
SPDIF output
23
SPI_DIN
—
24
GND
—
Power supply
25
SPI_DOUT
—
26
AV2CTRL1
—
MCLK
27
SPI_CLK
—
28
AV2CTRL0
—
LRCK
29
SPI_NCS0
—
30
AV2CLK
—
SCLK
31
GND
33
MII_TXD2
35
I2C_SDA
—
SPI
Debug
UART
Power supply
32
AV2DATA1
—
A/D data 0
GPIO-08 Factory Reset
34
AV2DATA0
—
D/A data 0
36
GND
—
Power supply
—
I2C
37
I2C_SCL
—
38
ETH_LED_SPEED
—
Ethernet
39
AV2DATA2
—
D/A Data 1
40
AV2DATA3
—
D/A data 2
41
MII_RXD2
GPIO-10
SPI_REQ
42
ETH_LED_ACT
—
Ethernet
43
AV3CTRL0
GPIO-05
—
44
GND
—
Power supply
45
GND
—
Power supply
46
ETH_TXP
—
47
AV3CLK
GPIO-04
—
48
ETH_TXN
—
49
HDDATA14
GPIO-14
—
50
ETH_RXP
—
51
HDDATA15
GPIO-15
—
52
ETH_RXN
—
53
GND
—
Power supply
54
GND
—
Power supply
55
USB_OTG_DN
—
56
EXT_PA_EN1_5
GPIO-19
Reserved
57
USB_OTG_DP
—
58
MII_RXD3
GPIO-11
—
59
USB_PWR_EN
—
60
AV3CTRL1
GPIO-06 Chip Select for
external Flash
61
USB_VBUS
—
62
EXP_PA_EN1_24
GPIO-18
HD_INT
63
USB_ID
—
64
GND
—
Power supply
Note 1:
USB
Ethernet
The connector definitions are subject to change in future revisions of this document.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 7
CY920
Table 1-3 provides the function of the pins in the
J300-extended connector.
TABLE 1-3:
J300-EXTENDED CONNECTOR
PIN
Number
Signal
PIN
Number
Signal
GPIO
Function
HDDATA12
GPIO-12 HDDATA12
AV0DATA0
—
AV0DATA0
HDDATA13
GPIO-13 HDDATA13
AV0DATA1
—
AV0DATA1
HDDATA14
GPIO-14 HDDATA14
AV0DATA2
—
AV0DATA2
HDDATA15
GPIO-15 HDDATA15
AV0DATA3
—
AV0DATA3
GPIO
Function
GND
—
Power supply
10
GND
—
GND
11
HDDATA11
—
HDDATA11
12
AV1DATA0
—
AV1DATA0
13
HDDATA10
—
HDDATA10
14
AV1DATA1
—
AV1DATA1
15
HDDATA9
—
HDDATA9
16
AV1DATA2
—
AV1DATA2
17
HDDATA8
—
HDDATA8
18
AV1DATA3
—
AV1DATA3
19
GND
—
Power supply
20
GND
—
GND
21
HDDATA7
—
HDDATA7
22
AV0CLK
—
AV0CLK
23
HDDATA6
—
HDDATA6
24
AV0CTRL0
—
AV0CTRL0
25
HDDATA5
—
HDDATA5
26
AV0CTRL1
—
AV0CTRL1
27
HDDATA4
—
HDDATA4
28
AV0CTRL2
—
AV0CTRL2
29
GND
—
Power supply
30
GND
31
HDDATA0
—
HDDATA0
32
NC
—
NC
33
HDDATA1
—
HDDATA1
34
NC
—
NC
35
HDDATA2
—
HDDATA2
36
NC
—
NC
37
HDDATA3
—
HDDATA3
38
GND
—
GND
39
GND
—
Power supply
40
GND
—
GND
41
TCK
—
JTAG
42
NC
—
NC
43
UART_RXD0
—
Shared with
BT
44
SPI_NCS1
—
SPI_NCS1
45
UART_TXD0
—
Shared with
BT
46
MII_TX_ER
GPIO-02
MII_TX_ER
47
TDI
—
JTAG
48
MII_TX_CLK
GPIO-03
MII_TX_CLK
49
TDO
—
50
MII_COL
GPIO-01
MII_COL
51
TMS
—
52
MII_CRS
GPIO-00
MII_CRS
53
SPI1CLK
—
55
SPI1DIN
—
57
GND
—
59
SPI1DOUT
—
61
SPI1CS0
—
63
GND
—
Note 1:
GND
Flash
interface
Power supply
54
AV3DATA0
—
AV3DATA0
56
AV3DATA1
—
AV3DATA1
58
GND
—
GND
Flash
interface
Power supply
60
SPI1HOLDB
—
SPI1HOLDB
62
SPI1WPROT
—
SPI1WPROT
64
NC
—
NC
The connector definitions are subject to change in future revisions of this document.
DS60001270C-page 8
Preliminary
© 2014 Microchip Technology Inc.
CY920
Table 1-4 provides the GPIO assignment on the CY920
module.
TABLE 1-4:
CY920 GPIO MAPPING
GPIO
DM920 Pin Name
Number
Connected To
Assigned Function
MIICRS
BT/extended connector
WLAN_ACTIVE
MIICOL
BT/extended connector
BT_PRIORITY
MIITXER
BT/extended connector
BT_ACTIVE
MIITXCLK
BT/extended connector
BT_LDO_ON
AV3CLK
Basic connector
Available
AV3CTRL0
Basic connector
Available
AV3CTRL1
Basic connector
Chip select for expansion Flash
AV0CTRL2
Extended connector
Available
MIITXD2
Basic connector
Factory Reset
MIITXD3
Basic connector
IR input
10
MIIRXD2
Basic connector
SPI_REQ for Host controller
11
MIIRXD3
Basic connector
Available
12
HDDATA12
Extended connector
Available
13
HDDATA13
Extended connector
Available
14
HDDATA14
Extended connector
Available
15
HDDATA15
Extended connector
Available
16
SPF0
Basic connector
HD_INT
17
SPF1
Basic connector
Ethernet Reset
18
EXT_PA_EN1_5
Basic connector
FEM BSEL
19
EXT_PA_EN1_24
Basic connector
Available
Note 1:
1.1.2
The GPIO assignments are subject to change in future revisions of this document.
ANTENNA CONNECTOR
In the CY920 module two external antenna sockets are
used to enable diversity operation. During the diversity
operation, the firmware selects one antenna at a time
through the on-board Tx/Rx diversity RF switch.
The surface-mounted antenna socket used in the
CY920 module is Ultra Small Surface Mount Coaxial
(U.FL) type.
Note:
Do not use the CY920 module that has
two external antenna sockets with only
one external antenna connected. This will
degrade the Wi-Fi or BT performance.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 9
CY920
1.2
Pin Description
Table 1-5 through Table 1-15 provide an overview of
the important control and interface signals. It also
covers pinouts and signal names.
TABLE 1-5:
POWER
Signal
Type
Description
3.3V
Power input +3.3V
1.2V
Power input +1.2V
1.8V
Power input +1.8V
2.5V
Power input +2.5V
3.3V RTC
Power input +3.3V for Real-Time Clock (RTC). Power can be provided by battery or
external Supercap.
Ground (GND) connection for power supply, signal returns and shielding
GND
O = Output
Legend:
TABLE 1-6:
I /O = Input /Output
I = Input
P = Power
SERIAL PERIPHERAL INTERFACE (SPI)
Signal
Type
SPI_DOUT
Description
SPI data from DM920 to Host controller
SPI_DIN
SPI data from Host controller to DM920
SPI_CLK
SPI clock from Host controller to DM920 (maximum recommended
frequency is 2 MHz and typical frequency is 1 MHz, see Note 1)
SPI_NCS0
SPI Chip Select from Host controller to DM920
MII_RXD2
• This GPIO signal is used as SPI_REQ (SPI request signal) from DM920 to
Host controller for eDMP applications.
• Logic 1 indicates there is an SPI message waiting to be read. The Host
controller should start the SPI clock and read any changed registers.
• Logic 0 indicates that all changed register messages have been read and the
message buffer is empty.
Legend: O = Output
I /O = Input /Output
I = Input
P = Power
Note 1: For SPI timing diagram for eDMP applications, refer to “MCHP-JB Device_Control_Protocol_Registers_v_6_5” or later version. For detailed setup and hold timing details,
refer to the “DM920 Data Sheet” (DS60001278).
TABLE 1-7:
SPI FLASH INTERFACE
Signal
Type
Description
SPI1CS0
Chip Select input for on-board Flash
AV3CTRL1 (GPIO6)
Chip Select for external Flash. For more information on how to connect
and access external Flash, refer to the Chapter 18. External Flash
Interface chapter in the “JukeBlox® Technology 4.X SDK User's Guide”
(DS70005181).
SPI1CLK
Clock signal to drive serial Flash
SPI1DIN
Data line from Flash output to DM920 input
SPI1DOUT
Data line from DM920 output to Flash input
SPI1HOLDB
Serial Flash control input
SPI1WPROT
Legend:
O = Output
DS60001270C-page 10
Write protect input to serial Flash
I /O = Input /Output
I = Input
Preliminary
P = Power
© 2014 Microchip Technology Inc.
CY920
TABLE 1-8:
UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART)
Signal
Type
Description
UART_RXD1
UART1 input to the DM920, used for shell access. Microchip recommends
providing a connection to an external RS-232 transceiver and a DB9 connector to
connect to a PC COM port. This connection can be used for the product
development debugging, module programming control on the product
manufacturing line, and module control during certification procedures.
UART_TXD1
UART1 output from the DM920, used for shell access. Microchip recommends
providing a connection to an external RS-232 transceiver and a DB9 connector to
connect to a PC COM port. This connection can be used for the product
development debugging, module programming control on the product
manufacturing line, and module control during certification procedures.
UART_RXD0
UART0 input, used for Bluetooth (BT) in BT SKU. It can be used as an additional
UART in non-BT SKU.
UART_TXD0
UART0 output, used for Bluetooth in case of BT SKU. It can be used as an
additional UART in non-BT SKU
Legend:
TABLE 1-9:
Signal
O = Output
I /O = Input /Output
I = Input
P = Power
AUDIO
Type
Description
AV2DATA0
AV2DATA2
AV2DATA3
I2S or left justified audio data output. It is typically connected to an external D/A
converter input or an external DSP for further audio processing.
AV2DATA0 is used for the main left and right channel audio output data. AV2DATA2
and AV2DATA3 may be used for surround sound rear channels and sub-woofer.
See Note 1.
AV2DATA1
I2S or left justified audio data input. It can be driven from an optional external A/D
converter used to interface to iPod analog output or other analog audio sources, or
aux in jack. If not used, leave it open.
AV2CTRL0
LRCK, audio data word clock at the audio sample rate (Fs) (currently, maximum
supported frequency is 192 kHz).
AV2CTRL1
MCLK, audio master clock at 256 Fs. It can be used to clock an external D/A
converter or an external DSP. The Fs multiplier may vary at sample rates more than
48 kHz.
AV2CLK
SCLK, audio data bit clock at 64 Fs. It allows up to 32 audio data bits per sample
word.
AV4DATA0
SPDIF format output. It can support sample rate up to 192 kHz. Consequently, the
maximum instantaneous frequency on this pin is 24.576 MHz.
AV4DATA1
AV3DATA0
AV3DATA1
I/O
SPDIF input. Currently it is not used, do not connect.
Used for I2S or left justified audio data, depend on firmware and use case. The AV3
port control and clock signals are defined as GPIOs, see Table 1-15. If required,
succeeding use cases may use AV3 control and clock signals as audio clocks.
Legend: O = Output
I /O = Input /Output
I = Input
P = Power
Note 1: For the audio port timing diagrams, setup and hold timing details, refer to the “DM920 Data Sheet”
(DS60001278).
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 11
CY920
TABLE 1-10:
CONTROL
Signal
Type
Description
MII_TXD2
Factory Reset, GPIO-08. An active-high input with internal pull-down. Pull to
GND with a 10 k Ω resistor, unless return to factory settings from a hardware
control is needed. Generally, return to factory settings is controlled from the Host
controller through SPI register. This pin is monitored only during the boot up
process.
MII_TXD3
Infrared sensor input, GPIO-09. A Schmitt Trigger input which can handle inputs
with slow slopes. It is used for aDMP firmware builds for infrared remote control
sensor output connection to DM920. For applications with a Host controller, pull
this pin to +3.3V through a 10 k Ω resistor.
I/O
No internal pull-ups, use maximum 4.7 k Ω pull-up resistor on each pin to +3.3V.
The maximum frequency is 400 kHz.
Low-active input to reset the module. This signal must be driven by an external
Reset generator or by a GPIO output from a Host controller.
See Section 3.0 “Application Guidelines” for the timing requirements of
NRESET signal. The CY920 module includes internal 10K pull-up resistor to
+3.3V.
I2C_SDA, I2C_SCL
NRESET
Legend:
O = Output
TABLE 1-11:
I /O = Input /Output
I = Input
P = Power
ETHERNET
Signal
Type
ETH_RXN, ETH_RXP,
ETH_TXN ETH_TXP
Ethernet signals between the PHY on the module and the external magnetics
(transformer). The maximum bit rate is 100 Mbps.
ETH_LED_SPEED,
ETH_LED_ACT
•
•
•
•
SPF1
Ethernet PHY Reset signal, GPIO-17. Do not connect if module Ethernet is
used. If Ethernet is not available on the module, it can be used as a GPIO.
Legend:
O = Output
TABLE 1-12:
Description
3.3V push-pull outputs from PHY (max. ±12 mA) to drive the Ethernet LEDs
100 Mbps speed mode and activity are indicated by the outputs being low
Connect ETH_LED_SPEED to LED through 330Ω resistor to +3.3V
Connect ETH_LED_ACT to LED through 330Ω resistor to 0V
I /O = Input /Output
I = Input
P = Power
USB
Signal
Type
Description
USB_OTG_DN,
USB_OTG_DP
USB data signals. It is usually connected to the type A connector, USB switch,
iPod dock connector, or Lightning connector. Maximum bit rate is high-speed USB
at 480 Mbps.
USB_VBUS
Analog input for monitoring the USB type A connector power. Connect to the +5V
power which is driving the USB type A connector power pins. If this pin drops
below 4.6V, then the DM920 module will drive the USB_PWR_EN signal low to
control an external power MOSFET to disconnect +5V power from the USB type
A connector.
USB_PWR_EN
Logic output to control an external MOSFET, that is in series with the USB type A
connector power.
USB_ID
Determines whether the USB port is USB Host or USB device. Pull low for the
Host and pull high for the device.
Legend:
O = Output
DS60001270C-page 12
I /O = Input /Output
I = Input
Preliminary
P = Power
© 2014 Microchip Technology Inc.
CY920
TABLE 1-13:
JTAG
Signal
Type
TMS,TCK,TDI, TDO
I/O
O = Output
Legend:
TABLE 1-14:
Description
JTAG ports for the DM920 SoC. Do not connect these pins.
I /O = Input /Output
I = Input
P = Power
VIDEO
Signal
Type
Description
AV0CLK
HD Clock
AV0CTRL0
HD HSYNC
AV0CTRL1
HD VSYNC
AV0CTRL2
HD data enable, GPIO-07. This GPIO is available if HD interface is not
used.
HDDATA [15:0]
Lower 16 bits of HD video data
AV0DATA [3:0]
HDDATA [19:16]
AV1DATA [3:0]
O = Output
Legend:
TABLE 1-15:
HDDATA [23:20]
I /O = Input /Output
I = Input
P = Power
GPIO (MISCELLANEOUS)
Signal
MII_CRS, MII_COL,
MII_TX_ER,MII_TXCLK
Type
I/O
Description
GPIO-00, 01, 02, 03. It is used for Bluetooth control signals. For a
non-BT module, these signals can be used for other functions.
AV3CLK
I/O
GPIO-04, see Note 1
AV3CTRL0
I/O
GPIO-05, see Note 1
MII_RXD3
I/O
GPIO-11, see Note 1
HDDATA12
I/O
GPIO-12, see Note 2
HDDATA13
I/O
GPIO-13, see Note 2
HDDATA14
I/O
GPIO-14, see Note 2
HDDATA15
I/O
GPIO-15, see Note 2
SPF0
I/O
GPIO-16, HD_INT (for systems with HDMI transmitter)
EXT_PA_EN1_5
I/O
GPIO-18, FEM BSEL
EXT_PA_EN1_24
I/O
GPIO-19, see Note 1
Legend:
Note 1:
2:
O = Output
I /O = Input /Output
I = Input
P = Power
These GPIOs are available.
These GPIOs are available if HD interface is not used.
Microchip has a set of example schematics that shows
how the external circuitry is typically connected to the
module. Please contact Microchip sales team for any
related documents or for any assistance.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 13
CY920
NOTES:
DS60001270C-page 14
Preliminary
© 2014 Microchip Technology Inc.
CY920
2.0
Note:
CY920 BOARD LAYOUT AND
FEATURES
This data sheet summarizes the features
of the CY920 network media module. It is
not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
various application notes available on the
Microchip web site www.microchip.com.
This section describes the CY920 board and its key
components. All production modules include two RF
shields: the top shield and the bottom shield. Figure 2-1
illustrates the top view of the CY920 board. The figure
does not show the RF shields because the shields are
tem porarily removed to indicate the components.
FIGURE 2-1:
2.1
Top View of CY920 Board
The top view of the CY920 board features the following
key components:
1.
2.
3.
4.
5.
6.
7.
8.
DM920 SoC
DDR2 SDRAM
SPI Flash
Ethernet PHY
Wi-Fi Front-end
Bluetooth SoC
Wi-Fi/BT Antenna Socket
Wi-Fi Antenna Socket
CY920 BOARD (TOP VIEW)
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 15
CY920
2.2
Bottom View of CY920 Board
Figure 2-2 illustrates the bottom view of the CY920
board with the following key components:
1.
2.
Basic Connector
Extended Connector (optional)
FIGURE 2-2:
CY920 BOARD (BOTTOM VIEW)
DS60001270C-page 16
Preliminary
© 2014 Microchip Technology Inc.
CY920
2.3
Production Board with RF Shield
(Top View)
Figure 2-3 illustrates the top view of the CY920 board
with RF shield.
FIGURE 2-3:
CY920 BOARD WITH RF SHIELD (TOP VIEW)
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 17
CY920
2.4
Production Board with RF Shield
(Bottom View)
Figure 2-4 illustrates the bottom view of the CY920
board with RF shield.
FIGURE 2-4:
DS60001270C-page 18
CY920 BOARD WITH RF SHIELD (BOTTOM VIEW)
Preliminary
© 2014 Microchip Technology Inc.
CY920
3.0
Note:
APPLICATION GUIDELINES
3.1
This data sheet summarizes the features
of the CY920 network media module. It is
not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
various application notes available on the
Microchip web site www.microchip.com.
This section describes the power-up sequence and the
RF guidelines recommended by Microchip.
FIGURE 3-1:
Power Sequencing and Reset
Timing
The power sequencing during power on should start
with the highest voltage rail. The power sequencing
should progress from the higher voltage rail to the
lower voltage rail, i.e power-up 3.3V, 2.5V, 1.8V, and
then 1.2V with a delay of 2 ms between each power rail.
During power-down, the power sequencing should be
in the reverse direction, i.e., remove 1.2V, 1.8V, 2.5V,
and then 3.3V. The power-up sequence is mandatory
and the power-down sequence is preferred, but
optional. Figure 3-1 illustrates the power-up timing.
POWER-UP SEQUENCE
3.3V
2.5V
1.8V
1.2V
3.2
RF Considerations
The overall performance of the system, RF, and
Wi-Fi/BT is significantly affected by the product design,
environment and application. It is the responsibility of
the product designer to ensure system level shielding
(if required) and to verify the performance of the given
product features and applications.
The Wi-Fi/BT performance will be affected by the RF
environment surrounding the CY920 module. Consider
the following precautions for optimal Wi-Fi/BT
performance:
• The CY920 module is positioned in a noise-free
RF environment, i.e, away from high frequency
clock signals and any other sources of RF energy.
• The antenna is not shielded by any metal objects,
such as loudspeakers or any other metal parts.
• The power supplies are clean and noise-free.
Note:
© 2014 Microchip Technology Inc.
Preliminary
The CY920 module includes RF shielding
on the top and bottom of the board as a
standard feature.
DS60001270C-page 19
CY920
NOTES:
DS60001270C-page 20
Preliminary
© 2014 Microchip Technology Inc.
CY920
4.0
Wi-Fi SPECIFICATION
Table 4-1 describes the Wi-Fi specifications of the
CY920 module.
TABLE 4-1:
Wi-Fi® SPECIFICATIONS (1, 2, 4, 5, 6)
Feature
Description
IEEE 802.11a
WLAN Standards
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Frequency
Band/Channels
2.412 - 2.472 GHz (2.4 GHz ISM Band, 13 Channels)
Channel 1 - Channel 13
5.180 - 5.240 GHz (U-NII lower band)
5.260 - 5.320 GHz (U-NII middle band), see Note 3
5.500 - 5.700 GHz (U-NII middle band extended), see Note 3
5.745 - 5.825 GHz (U-NII upper band/ISM band)
North America FCC, Japan Telec, Europe ETSI
802.11a mode (OFDM: IEEE 802.11a)
Modulation
802.11b mode (DS-SS: IEEE 802.11b)
802.11g mode (OFDM: IEEE 802.11g)
802.11n mode (OFDM: IEEE 802.11n)
802.11a mode
54 Mbps, 48 Mbps, 36 Mbps, 24 Mbps, 18 Mbps, 12 Mbps, 9 Mbps, 6 Mbps
Transmission Speed
802.11b mode
11 Mbps, 5.5 Mbps, 2 Mbps, 1 Mbps
802.11g mode
54 Mbps, 48 Mbps, 36 Mbps, 24 Mbps, 18 Mbps, 12 Mbps, 9 Mbps, 6 Mbps
802.11n mode
MCS0 to MCS7(20 MHz and 40 MHz supported)
Normal and short GI supported (PHY data rates up to 150 Mbps for 40 MHz mode + short GI)
Note 1:
2:
3:
4:
5:
6:
With respect to TX power, different (higher/lower) RF output power settings may be used for specific
regions, antennas and/or enclosures, in which case recertification may be required.
802.11n Greenfield is not supported. (Greenfield forces 802.11n operation even in the presence of
802.11b/g AP)
Dynamic Frequency Selection (DFS) is supported by the hardware. Firmware support for DFS may not be
in initial firmware releases, but will follow in a later firmware release.
802.11n 20 MHz and 40 MHz bandwidth is supported.
The availability of some specific channels and/or operational frequency bands are country dependent and
are firmware programmed at the Host product factory to match the intended destination. The firmware
setting is not accessible to the end user of the Host product.
Specifications are based on nominal test settings during module production at room temperature.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 21
CY920
TABLE 4-1:
Wi-Fi® SPECIFICATIONS (1, 2, 4, 5, 6) (CONTINUED)
Feature
Description
802.11a mode
+12.5 dBm +/-3 dB (U-NII lower and U-NII upper/ISM band)
TX Power
802.11n HT20 mode
+11.5 dBm +/-3 dB (U-NII lower and U-NII upper/ISM band)
802.11n HT40 mode
+10 dBm +/-3 dB (U-NII lower and U-NII upper/ISM band)
802.11b mode
+16.5 dBm +/- 3 dB
802.11g mode
+13 dBm +/-3 dB
802.11n (HT20/40) mode
+12 dBm +/-3 dB (2.4GHz ISM)
Power-on Ramp
Adhering to IEEE specification
RF Carrier
Suppression
Adhering to IEEE specification
802.11a mode
-25 dB at 54 Mbps
TX EVM
802.11b mode
-10 dB at 11 Mbps
802.11g mode
-25 dB at 54 Mbps
802.11n mode
-27 dB at MCS7
RX Sensitivity
802.11a mode
-65 dB at 54 Mbps
802.11b mode
-76 dB at 11 Mbps
802.11g mode
-65 dB at 54 Mbps
802.11n mode
-64 dB at MCS7/20 MHz; -61 dB at MCS7/40 MHz
Throughput rate
(measured for each
module)
Note 1:
2:
3:
4:
5:
6:
See factory test specification
With respect to TX power, different (higher/lower) RF output power settings may be used for specific
regions, antennas and/or enclosures, in which case recertification may be required.
802.11n Greenfield is not supported. (Greenfield forces 802.11n operation even in the presence of
802.11b/g AP)
Dynamic Frequency Selection (DFS) is supported by the hardware. Firmware support for DFS may not be
in initial firmware releases, but will follow in a later firmware release.
802.11n 20 MHz and 40 MHz bandwidth is supported.
The availability of some specific channels and/or operational frequency bands are country dependent and
are firmware programmed at the Host product factory to match the intended destination. The firmware
setting is not accessible to the end user of the Host product.
Specifications are based on nominal test settings during module production at room temperature.
DS60001270C-page 22
Preliminary
© 2014 Microchip Technology Inc.
CY920
5.0
BLUETOOTH SPECIFICATIONS
The Bluetooth (BT) subsystem included in the CY920
module shares the antenna connections with the Wi-Fi
subsystem. Dedicated control signals between the
DM920 module and the BT controller perform Packet
Traffic Arbitration (PTA) to optimise co-existence
between the Wi-Fi and BT subsystems. A high-speed
UART interface is used to send data from the BT
controller to the DM920 SoC for further processing.
5.1
5.2
Bluetooth Radio Characteristics
Table 5-1 provides Rx and Tx characteristics of the
Bluetooth radio.
Features
The following are the Bluetooth features:
• Compliant with Bluetooth v2.1 + EDR
specification
• SBC and AAC codec
• A2DP and AVRCP profiles
• WLAN and Bluetooth co-existence using PTA and
AFH
• Utilises single antenna, shared with Wi-Fi
• Operating band: 2.4 GHz ISM band
• Output power Class 2 (+4 dBm)
• Low power consumption
TABLE 5-1:
RADIO CHARACTERISTICS
Min.
Typical
Max.
Bluetooth
Spec
Sensitivity at 0.1% BER
—
—
—
≤ -70
dBm
RF transmit power
-6
—
≤4
dBm
Initial carrier frequency tolerance
—
25
75
75
kHz
20 dB bandwidth for modulated carrier
—
—
1000
≤ 1000
kHz
Modulation characteristics (f1_ave)
140
165
175
> 140
kHz
Modulation characteristics (f2_max)
115
145
—
≥ 115
kHz
Parameter
Note 1:
Units
Specifications are based on nominal test settings during module production at room temperature.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 23
CY920
NOTES:
DS60001270C-page 24
Preliminary
© 2014 Microchip Technology Inc.
CY920
6.0
PACKAGING INFORMATION
Figure 6-1 and Figure 6-2 illustrate the top and bottom
dimensions of the CY920 board.
FIGURE 6-1:
Note 1:
2:
3:
CY920 BOARD DIMENSIONS (TOP VIEW)
PCB panel width and height tolerance is 0.1 mm.
Plated hole is 0.075 mm.
Non-plated hole is 0.05 mm.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 25
CY920
FIGURE 6-2:
Note 1:
2:
3:
CY920 BOARD DIMENSIONS (BOTTOM VIEW)
PCB panel width and height tolerance is 0.1 mm.
Plated hole is 0.075 mm.
Non-plated hole is 0.05 mm.
DS60001270C-page 26
Preliminary
© 2014 Microchip Technology Inc.
3D View of the CY920 Board
CY920
Figure 6-3 illustrates the 3D view of the CY920 board.
1.00
4.30
CY920 Board (3D View)
4.55
FIGURE 6-3:
2.25
DS60001270C-page 27
6.1
60.00
57.40
Preliminary
16.30
40.00
.60
R1
© 2014 Microchip Technology Inc.
CY920
6.2
Module Weight
Table 6-1 provides the weight for the various SKUs of
the CY920 module.
TABLE 6-1:
MODULE WEIGHT
Configuration Code
Weight (g)
CY920-A
17.5g
CY920-B
18.5g
CY920-C
18.7g
DS60001270C-page 28
Preliminary
© 2014 Microchip Technology Inc.
CY920
7.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the electrical characteristics of the CY920 module. Additional information will be
provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the CY920 network media module are listed in the following table.
Absolute Maximum Ratings
Parameter
Component
3.3V Supply Voltage
1.2V Supply Voltage
1.8V Supply Voltage
Main
2.5V Supply Voltage
†
Min.
Max.
Unit
-0.5
4.6
-0.5
1.8
-0.5
2.1
-0.5
3.0
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Table 7-1 provides the basic electric specifications of the CY920 module.
TABLE 7-1:
BASIC SPECIFICATIONS
Parameter
Symbol
Min.
Typ
Max.
Unit
Power supply input voltage
VIN
3.165
1.14
1.71
2.375
3.3
1.2
1.8
2.5
3.465
1.26
1.89
2.625
Logic input high voltage
VIH
—
3.6
Logic input low voltage
VIL
-0.3
—
0.8
Logic input threshold voltage
VT
1.39
1.51
1.65
Schmitt-trigger input low to high threshold
voltage
VT+
1.63
1.76
1.9
Schmitt-trigger input high to low threshold
voltage
VT-
1.18
1.3
1.44
Logic output high voltage
VOH
2.4
—
—
Logic output low voltage
VOL
—
—
0.4
Logic low-level output current
(VOL=0.4V)
IOL
10.0
15.2
20.2
mA
Logic high-level output current
(VOH=2.4V)
IOH
13.9
28.0
48.2
mA
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 29
CY920
Table 7-2 provides the current consumption details in
various measurement conditions.
The current consumption per voltage rail and power
consumption details will be provided in the future
revision of this document.
TABLE 7-2:
POWER CONSUMPTION(1)
Current Consumption per
Voltage Rail (mA)
1.2V
1.8V
2.5V
3.3V
Power
Consumption
(mW)
Maximum expected current consumption per rail across operating
modes (continuous Tx/Rx mode with all function active), see
Note 2.
—
—
—
—
—
Wi-Fi streaming (Ethernet, USB and Bluetooth power-down)
—
—
—
—
—
Wi-Fi streaming (USB active, Ethernet and Bluetooth power-down)
—
—
—
—
—
Wi-Fi streaming (USB and Bluetooth active)
—
—
—
—
—
Measurement Condition
Ethernet streaming (Wi-Fi, USB and Bluetooth power-down)
—
—
—
—
—
Ethernet streaming (USB active, Wi-Fi and Bluetooth power-down)
—
—
—
—
—
Bluetooth streaming (Ethernet, Wi-Fi and USB power down)
—
—
—
—
—
Bluetooth streaming (USB active, Ethernet and Wi-Fi power-down)
—
—
—
—
—
Bluetooth streaming (Ethernet active, Wi-Fi and USB power down)
—
—
—
—
—
PSM wake up on Wi-Fi (PSM JB Green) (DTIM=1), see Note 2
—
—
—
—
—
PSM wake up on Wi-Fi (PSM JB Green) (DTIM=1), see Note 2
—
—
—
—
—
PSM wake up on Ethernet and wake on Wi-Fi (PSM JB Green)
—
—
—
—
—
Hibernate mode: Wake on Host or GPIO (Wi-Fi, Ethernet,
Bluetooth and USB in power-down), see Note 2
—
—
—
—
—
Hibernate mode: Wake on Host or GPIO (Wi-Fi, Ethernet,
Bluetooth and USB in power-down), see Note 2
—
—
—
—
—
CY920 module held in Reset
—
—
—
—
—
Note 1:
2:
All current consumptions are estimates, and will be revised after initial modules are characterised.
The worst case maximum is when all functions are active and when the Wi-Fi is transmitting in continuous
Tx/Rx mode. This mode is used only during the Wi-Fi RF certification test. A separate software will be
required to perform this test. Power supplies should be designed with some additional derating on top of
the maximum value, typically +30%.
DS60001270C-page 30
Preliminary
© 2014 Microchip Technology Inc.
CY920
Table 7-3 lists the CY920 module operating conditions.
TABLE 7-3:
OPERATING CONDITIONS
Parameter
Operating Temperature
Min.
Max.
Unit
+70
°C
Operating Humidity
10
90 (non-condensing)
%RH
Storage Temperature
-10
+75
°C
Storage Humidity
10
95 (non-condensing)
%RH
Storage Temperature Cycle Test (24 hrs)
-10
+75
°C
Note 1:
For more information on various SKUs of the CY920 module, refer to Table 9-1.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 31
CY920
NOTES:
DS60001270C-page 32
Preliminary
© 2014 Microchip Technology Inc.
CY920
8.0
Note:
REGULATORY COMPLIANCE
AND QUALITY
This data sheet summarizes the features
of the CY920 network media module. It is
not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
various application notes available on the
Microchip web site www.microchip.com.
This section addresses the various regulatory
standards that are compliant with the CY920 module.
Microchip does not certify all module variants for all the
countries. Table 8-1 provides the module versions for
which certain certifications have already been done.
The information about certified modules and Bluetooth
qualifications will be provided in the future revisions of
this document.
TABLE 8-1:
REGULATORY COMPLIANCE
Description
Country
Compliance
USA
FCC CFR47 Part15B
Electromagnetic Compatibility
(Prescan)
Europe
EN 301 489-1
EN 301 489-17
Canada
IC RSS-GEN
USA
FCC CFR47 Part 15C, para 15.247
FCC CFR47 Part 15E, para 15.407
Europe
EN 300 328
EN 301 893
Canada
IC RSS-210
Japan
ARIB STD-T66
ARIB STD-T71
—
—
Radio Regulations
Bluetooth Qualifications
Certified Modules
—
—
—
Contact Microchip’s sales office for the latest
information on certified modules for a particular county,
and arranging for an additional certification for your
chosen module, if needed. Any additional certification
will need to be paid for by the customer.
The product manufacturer is responsible for the end
product certification. Microchip can help manufacturers
to prepare for the Wi-Fi Alliance test for the Wi-Fi
certification by providing an example test plan and the
required commands to enable special test modes.
Please contact Microchip’s sales office for any
assistance on Wi-Fi Alliance Logo certification.
For documents related to Wi-Fi certification and
recommended interfacing and power supply
schematics, refer to the Microchip web site at
www.microchip.com.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 33
CY920
8.1
Antenna Considerations
Table 8.2 provides the list of antennas along with the
manufacturer and part number details.
TABLE 8-2:
ANTENNA LIST
Sl No.
Manufacturer
WALSIN
WALSIN
WALSIN
WALSIN
WALSIN
RFDPA870930IMAB301
Dipole Antenna
1.2 dBi for 2.4 GHz
WALSIN
RFDPA870945IMAB301
Dipole Antenna
1.16 dBi for 2.4 GHz
WALSIN
RFDPA870900SBAB801* +
RFCBA100630SA6B301
Dipole Antenna
0.7 dBi for 2.4 GHz
WALSIN
RFDPA870900SBAB801* +
RFCBA100645SA6B301
Dipole Antenna
0.1 dBi for 2.4 GHz
Note 1:
Part Number
Antenna Type
Peak Gain
PI_RFDPA870920IMLB301_V01
Dipole Antenna
1.84 dBi for 2.4 GHz
PI_RFDPA870920IMLB301_V01
Dipole Antenna
3.26 dBi for 5 GHz
PI_RFDPA870930IMLB301_V01
Dipole Antenna
1.10 dBi for 2.4 GHz
PI_RFDPA870930IMLB301_V01
Dipole Antenna
2.77 dBi for 5 GHz
* The antenna connector is reverse SMA type.
Table 8.3 provides the antennas to be used for the
various SKUs as per Table 8.2.
8.3
Restriction of Use of Hazardous
Substances (RoHS) Compliance
CY920 module uses only RoHS compliant components.
TABLE 8-3:
ANTENNAS FOR VARIOUS
SKUs
Configuration Code
Antenna List (Sl No.)
CY920-A
1, 2, 3, 4, 5, 6, 7, 8
CY920-B
—
CY920-C
1, 2, 3, 4, 5, 6, 7, 8
Note 1:
8.2
The antenna list for CY920-B SKU will be
provided in the future revisions of this
document.
CY920 Usage Guidelines under
Modular Approval
The CY module has received Limited Module
Approval (LMA) from FCC and IC. This is because the
CY module does not have complete built-in Power
regulator circuit. Microchip recommends that
customers follow the supply voltage requirements
provided in this data sheet, and follow the Power
supply design provided in the “CY Module Power
Supply V1.0” document. It is the product manufacturer
responsibility to ensure that the power supply
recommendations are followed, and the RF behavior
adheres the FCC or TCB certification requirements
when the module is installed in the final Host product.
The product manufacturer should work with their test
house for confirming the RF behavior with FCC or TCB.
DS60001270C-page 34
Preliminary
© 2014 Microchip Technology Inc.
ORDERING GUIDE
CY920
DS60001270C-page 35
9.0
This data sheet summarizes the features of the CY920 network
media module. It is not intended to be a comprehensive reference
source. To complement the information in this data sheet, refer to
the various application notes available on the Microchip web site
www.microchip.com.
Note:
Table 9-1 describes the various SKUs of CY920 network media module.
TABLE 9-1:
ORDERING GUIDE(1)
Part
number
Microchip
IC
Status
Two External
Diversity
Antennas
Ethernet
(10/100 Mbps)
USB
Extended
Connector
64 MB
DDR2
16 MB
Serial
Flash
Bluetooth
Top Module
Shield
Bottom
Module
Shield
CY920-A
DM920
Launch
—
—
Preliminary
CY920-B
DM920
Launch
—
CY920-C
DM920
Launch
Note 1:
Note:
The Apple Authentication Coprocessor is not available on the CY920 module. The Apple Authentication Coprocessor should be provided on the product
motherboard, connected to the SDA, SCL signals from the CY920 module.
Do not use a module which has two external antenna connectors
with only one external antenna connected. Leaving one antenna
socket open will degrade Wi-Fi performance. Microchip
recommends using two external antennas for best performance.
© 2014 Microchip Technology Inc.
CY920
NOTES:
DS60001270C-page 36
Preliminary
© 2014 Microchip Technology Inc.
CY920
APPENDIX A:
CERTIFICATION
NOTICES
Labeling Requirements
The CY920 module is not tested for Federal
Communications Commission (FCC). The following
statements are not valid until the production version
modules are tested. It is planned to certify the
production version of the CY920 module as soon as
possible after production versions are made.
Federal Communications Commission
Interference Statement
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful
interference in a residential installation. This equipment
generates, uses, and radiates radio frequency energy
and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio
communications. However, there is no guarantee that
interference will not occur in a particular installation. If
this equipment does cause harmful interference to
radio or television reception, which can be determined
by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or
more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/ TV
technician for help.
Caution: Any changes or modifications not
expressly approved by the grantee of this
device could void the user's authority to
operate the equipment.
Applicable to UNII device only: The
device is restricted to indoor use when
operating in the 5.15 GHz to 5.25 GHz
frequency band. FCC requires this
product to be used indoors for frequency
range 5.15 GHz to 5.25 GHz to reduce
the potential for harmful interference to
co-channel mobile satellite systems.
© 2014 Microchip Technology Inc.
This device complies with Part 15 of the FCC Rules. The
operation is subject to the following two conditions: the
device may not cause harmful interference, and the
device must accept any interference received, including
interferences that may cause undesired operations.
RF Exposure Warning
This equipment must be installed and operated in
accordance with provided instructions. The antennas
used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons
and must not be co-located or operating in conjunction
with any other antenna or transmitter. End users and
installers must be provide with antenna installation
instructions and transmitter operating
conditions for satisfying RF exposure compliance.
Information for the OEMs or Integrators
The following statement must be included in all
versions of this document supplied to OEMs or
integrators, but should not be distributed to the end
user.
“This device is intended for OEM or integrators only.
Please see the full Grant of Equipment document for
other restrictions. This device must be operated and
used with a locally approved Access “.
Information to be Supplied to the End
User by the OEM or Integrator
The following regulatory and safety notices must be
published in all documentation supplied to the end user
of the product or system, incorporating an adapter in
compliance with local regulations.
“The host system must be labelled with: Contains FCC
ID:ZQO-CY920‘X’ and IC: 2581A-CY920‘X’, FCC ID
displayed on the label.
The letter shown in Ordering Guide Part Number
column should be substituted for ‘X’. For example, for
the CY920-C module, the label text should be
"Contains
FCC
ID:ZQO-CY920C"and
"IC:
2581A-CY920C. The label text should be updated
according to the table shown in Section 9.0 “Ordering
Guide” of this document.
Preliminary
DS60001270C-page 37
CY920
Japan
Canada, avis d'Industry Canada (IC)
This device operation in the 5.15 GHz to 5.35 GHz
frequency range is restricted to indoor use. Final
product shall be labelled "For Indoor use only."
Cet appareil numérique de classe B est conforme aux
normes canadiennes ICES-003 et RSS-210.
Canada, Industry Canada (IC) Notices
This Class B digital apparatus complies with Canadian
ICES-003 and RSS-210.
Operation is subject to the following two conditions: the
device may not cause interference, and the device
must accept any interference, including interference
that may cause undesired operation of the device.
This radio transmitter "IC: 2581A-CY920‘X’ has been
approved by Industry Canada to operate with the
antenna types listed in Table 8.2 with the maximum
permissible gain and required antenna impedance for
each antenna type indicated. Antenna types not
included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly
prohibited for use with this device.
RF Exposure Information
The radiated output power of the wireless device is
below the Industry Canada (IC) radio frequency
exposure limits. The Wireless Device should be used in
such a manner that the potential for human contact
during normal operation is minimized.
This device has been evaluated and shown compliant
with the IC radio frequency exposure limits under
mobile exposure conditions. (antennas are greater
than 20cm from a person's body).
This device has been certified for use in Canada.
Status of the listing in the Industry Canada's Radio
Equipment List (REL) can be found at the following
locations:
http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?la
ng=eng
Additional Canadian information on RF exposure can
be found at the following location:
http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.ht
ml
Caution: Applicable to LE-LAN device only: This
device is restricted to indoor use when
operating in the 5.15 GHz to 5.25 GHz
frequency band. Industry Canada
requires this product to be used indoors
for frequency range 5.15 to 5.25 GHz to
reduce the potential for harmful
interference to co-channel Mobile Satellite
systems.
DS60001270C-page 38
Son fonctionnement est soumis aux deux conditions
suivantes: (1) cet appareil ne doit pas causer
d'interférence et (2) cet appareil doit accepter toute
interférence, notamment les interférences qui peuvent
affecter son fonctionnement.
Cet émetteur radio "IC: 2581A-CY920‘X’ a été
approuvé par Industrie Canada pour fonctionner avec
les types d'antennes énumérés dans le tableau 7-2
avec le gain maximal admissible et impédance
d'antenne requise pour chaque type d'antenne indiqué.
Types d'antennes n'est pas inclus dans cette liste,
ayant un gain supérieur au gain maximal indiqué pour
ce type, sont strictement interdits pour une utilisation
avec cet appareil.
Informations concernant l'exposition aux
fréquences radio (RF)
La puissance de sortie émise par l'appareil de sans fil
Dell est inférieure à la limite d'exposition aux
fréquences radio d'Industry Canada (IC). Utilisez
l'appareil de sans fil Dell de façon à minimiser les
contacts humains lors du fonctionnement normal.
Ce périphérique a également été évalué et démontré
conforme aux limites d'exposition aux RF d'IC dans des
conditions d'exposition à des appareils mobiles (les
antennes se situent à moins de 20 cm du corps d'une
personne).
Ce périphérique est homologué pour l'utilisation au
Canada. Pour consulter l'entrée correspondant à
l'appareil dans la liste d'équipement radio (REL - Radio
Equipment List) d'Industry Canada rendez-vous sur:
http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?la
ng=eng
Pour des informations supplémentaires concernant
l'exposition aux RF au Canada rendez-vous sur:
http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.ht
ml
Caution: Prudence (ce n'est applicable qu'aux
dispositif LE-LAN): Ce dispositif est limité
à une utilisation en intérieur à cause de
son fonctionnement dans la gamme 5.15
GHz à 5.25 GHz. Industrie Canada exige
que ce produit est utilisé à l'intérieur pour
la gamme de fréquence de 5,15 à 5,25
GHz
pour
réduire
les
risques
d'interférence nuisible à la co-canal
systèmes mobiles par satellite.
Preliminary
© 2014 Microchip Technology Inc.
CY920
APPENDIX B:
REVISION HISTORY
Revision A (January 2014)
This is the initial release of the CY920 Network Media
Module data sheet.
Revision B (March 2014)
• Replaced Figure 6-1 and Figure 6-2 in
Section 6.0 “Packaging Information”
• Added Figure 2-3 and Figure 2-4
Revision C (June 2014)
This revision includes the following updates:
• Figures:
- Updated Figure 2-1, Figure 2-2, Figure 2-3,
and Figure 2-4
- Added Figure 3-1
- Replaced Figure 6-1 and Figure 6-2
• Notes:
- Updated Note 4 in Table 4-1
- Added Note 6 in Table 4-1
- Removed Note 3 in Table 7-2
• Sections:
- Updated the components in Section 2.1
“Top View of CY920 Board”
- Updated Section 3.1 “Power Sequencing
and Reset Timing”
- Updated Section 8.2 “CY920 Usage
Guidelines under Modular Approval”
• Tables:
- Updated Table 1-1, Table 4-1, and Table 7-2
- Replaced Table 5-1 and Table 8-2
- Removed Table 5-2
- Added Table 6-1 and Table 8-3
- Removed the CY920-E SKU in Table 9-1
• Minor changes related to formatting have been
incorporated in the entire document
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 39
CY920
NOTES:
DS60001270C-page 40
Preliminary
© 2014 Microchip Technology Inc.
CY920
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
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Users of Microchip products can receive assistance
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•
•
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Technical support is available through the web site
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CUSTOMER CHANGE NOTIFICATION
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Microchip’s customer notification service helps keep
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To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
© 2014 Microchip Technology Inc.
Preliminary
DS60001270C-page 41
CY920
NOTES:
DS60001270C-page 42
Preliminary
© 2014 Microchip Technology Inc.
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
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Tel: 631-435-6000
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Tel: 408-735-9110
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Tel: 905-673-0699
Fax: 905-673-6509
DS60001270C-page 43
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
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China - Hong Kong SAR
Tel: 852-2943-5100
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Tel: 86-755-8864-2200
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China - Wuhan
Tel: 86-27-5980-5300
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Tel: 49-2129-3766400
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Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
© 2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63276-344-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
© 2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS60001270C-page 44

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