MICROCHIP TECHNOLOGY CY92024C Network Media Module User Manual Network Media Module
MICROCHIP TECHNOLOGY INC. Network Media Module Network Media Module
Contents
- 1. User Manual I
- 2. User Manual II
User Manual I
CY920 NETWORK MEDIA MODULE Operating Conditions Memory Interfaces • 3.3V, 2.5V, 1.8V, 1.2V supply voltage • Operating frequency up to 400 MHz • Operating temperature: 0ºC to 70ºC • 16 MB on-board serial Flash memory • 64 MB on-board DDR2 SDRAM • Off-board serial Flash memory via extended connector Features • Audio networking system on a small footprint module • Wi-Fi® certified 802.11 a/b/g/n • Integrated Ethernet + USB 2.0 OTG • Optional Bluetooth® v2.1 + EDR • Diversity enabled external antenna connectors • Glueless audio, video, and control ports • FCC certification is planned for production version • Ideal for enabling network and USB audio playback for iPod® docks, audio systems, AV receivers, active speaker systems, internet radios, network playback adapters WLAN • Integrated 802.11 a/b/g/n MAC, Baseband Processor (BBP) and radio frequency (RF) transceiver • Wi-Fi certified 802.11 a/b/g/n supporting both 2.4 GHz and 5 GHz bands • On-chip wideband sniffer which enables applications that benefit from efficient interference management algorithms • 1x1 dual band with Tx and Rx antenna diversity • Supports Wi-Fi Direct® • Two Ultra Small Miniature RF Connector (U.FL) type external antenna connectors Communication Interfaces • 10/100 Mbps Ethernet support with Ethernet PHY on-board • USB 2.0 OTG with integrated PHY • Serial Peripheral Interface (SPI), Inter-Integrated Circuit™ (I2C™), Universal Asynchronous Receiver Transmitter (UART) peripheral ports • 3.3V tolerance on all digital IOs (GPIO, I2S, SPDIF, SPI, UART, HDMI) Audio and Graphics Interface • I2S support with external Digital-to-Analog Converter (DAC)/Power Amplifier (PA) • Built-in Digital Signal Processor (DSP) with dual core 300 MHz each • HDMI support with in-built 24-bit HD port and external HDMI transmitter • Supports analog video (composite, component and S-Video) using external video encoder Input/Output • General Purpose Input Outputs (GPIOs) for different Stock Keeping Units (SKUs): - CY920-A: 11 GPIOs - CY920-B: 13 GPIOs - CY920-C: 9 GPIOs Bluetooth (Optional) Applications • Compliant with Bluetooth (BT) v2.1 + EDR specification • A2DP and AVRCP profiles • WLAN and Bluetooth co-existence using Packet Traffic Arbitration (PTA) and Adaptive Frequency Hopping (AFH) • Utilizes same antenna as Wi-Fi system • Supports Class 2 power output • Low-power consumption • JukeBlox®: DLNA™, AirPlay® Speaker, network audio DMR/ DMP, Internet radio, mini/micro system • Audio Video Receivers (AVR) • Sound Bars • PC OEM, TV and gaming consoles • Operating as an access point (Wi-Fi Direct Host) © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 1 CY920 NOTES: DS60001270C-page 2 Preliminary © 2014 Microchip Technology Inc. CY920 Table of Contents System Overview .................................................................................................................................................................................. 5 CY920 Board Layout and Features .................................................................................................................................................... 15 Application Guidelines ........................................................................................................................................................................ 19 Wi-Fi Specification .............................................................................................................................................................................. 21 Bluetooth Specifications ...................................................................................................................................................................... 23 Packaging Information ........................................................................................................................................................................ 25 Electrical Characteristics ..................................................................................................................................................................... 29 Regulatory Compliance and Quality ................................................................................................................................................... 33 Ordering Guide ................................................................................................................................................................................... 35 Appendix A: Certification Notices ........................................................................................................................................................ 37 Appendix B: Revision History .............................................................................................................................................................. 39 The Microchip Web Site ...................................................................................................................................................................... 41 Customer Change Notification Service ............................................................................................................................................... 41 Customer Support ............................................................................................................................................................................... 41 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 3 CY920 NOTES: DS60001270C-page 4 Preliminary © 2014 Microchip Technology Inc. CY920 1.0 The CY920 module can be connected to standard I/O components in various audio, video, and control formats. The CY920 module and the JukeBlox SDK form a turnkey solution which enables rapid product development by the Original Equipment Manufacturers (OEMs) and Original Design Manufacturers (ODMs). The software packages feature an intuitive Application Programming Interface (API) that enables easy customization result in faster time-to-market. SYSTEM OVERVIEW Note: This data sheet summarizes the features of the CY920 network media module. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the various application notes available on the Microchip web site www.microchip.com. The CY920 module is a single-board network media module based on Microchip's DM920 network media processor. It enables faster product development with Ethernet, USB, Wi-Fi, and Bluetooth connectivity. FIGURE 1-1: Figure 1-1 illustrates a typical example of the CY920 module based system block diagram. CY920 BASED SYSTEM BLOCK DIAGRAM CY920 Network Media Module 2.5V DM920 SoC 3.3V 1.2V 1.8V 3.3V RTC Reset In RJ-45 Transformer RST Ethernet PHY 10/100 Mbps DDR2 Controller 26.000 MHz Ethernet Controller USB 2.0 OTG USB Type-A/Lightning UART 0 GPIO Optional External Serial Flash Serial Flash 16 MByte Apple Coprocessor DDR2 SDRAM 64 MByte 2.4/5 GHz FEM SPI 1 IC Bluetooth Baseband and RF 802.11 a/b/g/n Antenna Switch HDMI Tx Audio A/D, D/A HD Data I2S, S/PDIF Debug Port HD Ports AV Ports UART 1 JTAG Host Controller Wi-Fi/BT Antenna Socket Wi-Fi Antenna Socket 40.000 MHz SPI 0 GPIO © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 5 CY920 1.1 Connectors and Connections The following sections provide information on different connectors and connections in the CY920 module. 1.1.1 MODULE CONNECTORS The CY920 module uses two board-to-board connectors, basic and extended, as interfaces to the product main board. Some of the module versions have only the basic connector installed. The CY920 module uses female connectors and the product main board uses male connectors. Table 1-1 provides part numbers for the male connectors needed on the product main board that mate to the female connectors on the CY920 module. TABLE 1-1: Connector Number J301 (Basic) J300 (Extended) MODULE CONNECTORS Connector Type 64-pin B2B connector 2 x 32 x 1.27 mm DS60001270C-page 6 Mating Connector Part Numbers Manufacturer Alternate Part Number S1210-64SVB-S01-1R/C XINYA 1.27*5.7-2*32P S1210-64SVB-S01-1R/C Preliminary 1.27*5.7-2*32P Alternate Manufacturer Shen Zhen Hua Xin Sheng Electronic Co Ltd © 2014 Microchip Technology Inc. CY920 Table 1-2 provides the function of the pins in the J301-basic connector. TABLE 1-2: PIN Number J301-BASIC CONNECTOR Signal GPIO Function PIN Number Signal GPIO VIN (1.2V) — VIN (2.5V) — VIN (1.2V) — VIN (2.5V) — GND — VIN (1.8V) — VIN (1.8V) — Power supply GND — VIN (3.3V) — 10 VIN (3.3V) — 11 GND — 12 VIN(3.3V RTC) — 13 SPF0 GPIO-16 iPod Access Power 14 GND — Function Power supply 15 NRESET — System Reset 16 UART_RXD1 — 17 SPF1 GPIO-17 Ethernet Reset 18 UART_TXD1 — 19 MII_TXD3 GPIO-09 IR input 20 AV4DATA1 — SPDIF input 21 GND — Power supply 22 AV4DATA0 — SPDIF output 23 SPI_DIN — 24 GND — Power supply 25 SPI_DOUT — 26 AV2CTRL1 — MCLK 27 SPI_CLK — 28 AV2CTRL0 — LRCK 29 SPI_NCS0 — 30 AV2CLK — SCLK 31 GND 33 MII_TXD2 35 I2C_SDA — SPI Debug UART Power supply 32 AV2DATA1 — A/D data 0 GPIO-08 Factory Reset 34 AV2DATA0 — D/A data 0 36 GND — Power supply — I2C 37 I2C_SCL — 38 ETH_LED_SPEED — Ethernet 39 AV2DATA2 — D/A Data 1 40 AV2DATA3 — D/A data 2 41 MII_RXD2 GPIO-10 SPI_REQ 42 ETH_LED_ACT — Ethernet 43 AV3CTRL0 GPIO-05 — 44 GND — Power supply 45 GND — Power supply 46 ETH_TXP — 47 AV3CLK GPIO-04 — 48 ETH_TXN — 49 HDDATA14 GPIO-14 — 50 ETH_RXP — 51 HDDATA15 GPIO-15 — 52 ETH_RXN — 53 GND — Power supply 54 GND — Power supply 55 USB_OTG_DN — 56 EXT_PA_EN1_5 GPIO-19 Reserved 57 USB_OTG_DP — 58 MII_RXD3 GPIO-11 — 59 USB_PWR_EN — 60 AV3CTRL1 GPIO-06 Chip Select for external Flash 61 USB_VBUS — 62 EXP_PA_EN1_24 GPIO-18 HD_INT 63 USB_ID — 64 GND — Power supply Note 1: USB Ethernet The connector definitions are subject to change in future revisions of this document. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 7 CY920 Table 1-3 provides the function of the pins in the J300-extended connector. TABLE 1-3: J300-EXTENDED CONNECTOR PIN Number Signal PIN Number Signal GPIO Function HDDATA12 GPIO-12 HDDATA12 AV0DATA0 — AV0DATA0 HDDATA13 GPIO-13 HDDATA13 AV0DATA1 — AV0DATA1 HDDATA14 GPIO-14 HDDATA14 AV0DATA2 — AV0DATA2 HDDATA15 GPIO-15 HDDATA15 AV0DATA3 — AV0DATA3 GPIO Function GND — Power supply 10 GND — GND 11 HDDATA11 — HDDATA11 12 AV1DATA0 — AV1DATA0 13 HDDATA10 — HDDATA10 14 AV1DATA1 — AV1DATA1 15 HDDATA9 — HDDATA9 16 AV1DATA2 — AV1DATA2 17 HDDATA8 — HDDATA8 18 AV1DATA3 — AV1DATA3 19 GND — Power supply 20 GND — GND 21 HDDATA7 — HDDATA7 22 AV0CLK — AV0CLK 23 HDDATA6 — HDDATA6 24 AV0CTRL0 — AV0CTRL0 25 HDDATA5 — HDDATA5 26 AV0CTRL1 — AV0CTRL1 27 HDDATA4 — HDDATA4 28 AV0CTRL2 — AV0CTRL2 29 GND — Power supply 30 GND 31 HDDATA0 — HDDATA0 32 NC — NC 33 HDDATA1 — HDDATA1 34 NC — NC 35 HDDATA2 — HDDATA2 36 NC — NC 37 HDDATA3 — HDDATA3 38 GND — GND 39 GND — Power supply 40 GND — GND 41 TCK — JTAG 42 NC — NC 43 UART_RXD0 — Shared with BT 44 SPI_NCS1 — SPI_NCS1 45 UART_TXD0 — Shared with BT 46 MII_TX_ER GPIO-02 MII_TX_ER 47 TDI — JTAG 48 MII_TX_CLK GPIO-03 MII_TX_CLK 49 TDO — 50 MII_COL GPIO-01 MII_COL 51 TMS — 52 MII_CRS GPIO-00 MII_CRS 53 SPI1CLK — 55 SPI1DIN — 57 GND — 59 SPI1DOUT — 61 SPI1CS0 — 63 GND — Note 1: GND Flash interface Power supply 54 AV3DATA0 — AV3DATA0 56 AV3DATA1 — AV3DATA1 58 GND — GND Flash interface Power supply 60 SPI1HOLDB — SPI1HOLDB 62 SPI1WPROT — SPI1WPROT 64 NC — NC The connector definitions are subject to change in future revisions of this document. DS60001270C-page 8 Preliminary © 2014 Microchip Technology Inc. CY920 Table 1-4 provides the GPIO assignment on the CY920 module. TABLE 1-4: CY920 GPIO MAPPING GPIO DM920 Pin Name Number Connected To Assigned Function MIICRS BT/extended connector WLAN_ACTIVE MIICOL BT/extended connector BT_PRIORITY MIITXER BT/extended connector BT_ACTIVE MIITXCLK BT/extended connector BT_LDO_ON AV3CLK Basic connector Available AV3CTRL0 Basic connector Available AV3CTRL1 Basic connector Chip select for expansion Flash AV0CTRL2 Extended connector Available MIITXD2 Basic connector Factory Reset MIITXD3 Basic connector IR input 10 MIIRXD2 Basic connector SPI_REQ for Host controller 11 MIIRXD3 Basic connector Available 12 HDDATA12 Extended connector Available 13 HDDATA13 Extended connector Available 14 HDDATA14 Extended connector Available 15 HDDATA15 Extended connector Available 16 SPF0 Basic connector HD_INT 17 SPF1 Basic connector Ethernet Reset 18 EXT_PA_EN1_5 Basic connector FEM BSEL 19 EXT_PA_EN1_24 Basic connector Available Note 1: 1.1.2 The GPIO assignments are subject to change in future revisions of this document. ANTENNA CONNECTOR In the CY920 module two external antenna sockets are used to enable diversity operation. During the diversity operation, the firmware selects one antenna at a time through the on-board Tx/Rx diversity RF switch. The surface-mounted antenna socket used in the CY920 module is Ultra Small Surface Mount Coaxial (U.FL) type. Note: Do not use the CY920 module that has two external antenna sockets with only one external antenna connected. This will degrade the Wi-Fi or BT performance. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 9 CY920 1.2 Pin Description Table 1-5 through Table 1-15 provide an overview of the important control and interface signals. It also covers pinouts and signal names. TABLE 1-5: POWER Signal Type Description 3.3V Power input +3.3V 1.2V Power input +1.2V 1.8V Power input +1.8V 2.5V Power input +2.5V 3.3V RTC Power input +3.3V for Real-Time Clock (RTC). Power can be provided by battery or external Supercap. Ground (GND) connection for power supply, signal returns and shielding GND O = Output Legend: TABLE 1-6: I /O = Input /Output I = Input P = Power SERIAL PERIPHERAL INTERFACE (SPI) Signal Type SPI_DOUT Description SPI data from DM920 to Host controller SPI_DIN SPI data from Host controller to DM920 SPI_CLK SPI clock from Host controller to DM920 (maximum recommended frequency is 2 MHz and typical frequency is 1 MHz, see Note 1) SPI_NCS0 SPI Chip Select from Host controller to DM920 MII_RXD2 • This GPIO signal is used as SPI_REQ (SPI request signal) from DM920 to Host controller for eDMP applications. • Logic 1 indicates there is an SPI message waiting to be read. The Host controller should start the SPI clock and read any changed registers. • Logic 0 indicates that all changed register messages have been read and the message buffer is empty. Legend: O = Output I /O = Input /Output I = Input P = Power Note 1: For SPI timing diagram for eDMP applications, refer to “MCHP-JB Device_Control_Protocol_Registers_v_6_5” or later version. For detailed setup and hold timing details, refer to the “DM920 Data Sheet” (DS60001278). TABLE 1-7: SPI FLASH INTERFACE Signal Type Description SPI1CS0 Chip Select input for on-board Flash AV3CTRL1 (GPIO6) Chip Select for external Flash. For more information on how to connect and access external Flash, refer to the Chapter 18. External Flash Interface chapter in the “JukeBlox® Technology 4.X SDK User's Guide” (DS70005181). SPI1CLK Clock signal to drive serial Flash SPI1DIN Data line from Flash output to DM920 input SPI1DOUT Data line from DM920 output to Flash input SPI1HOLDB Serial Flash control input SPI1WPROT Legend: O = Output DS60001270C-page 10 Write protect input to serial Flash I /O = Input /Output I = Input Preliminary P = Power © 2014 Microchip Technology Inc. CY920 TABLE 1-8: UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) Signal Type Description UART_RXD1 UART1 input to the DM920, used for shell access. Microchip recommends providing a connection to an external RS-232 transceiver and a DB9 connector to connect to a PC COM port. This connection can be used for the product development debugging, module programming control on the product manufacturing line, and module control during certification procedures. UART_TXD1 UART1 output from the DM920, used for shell access. Microchip recommends providing a connection to an external RS-232 transceiver and a DB9 connector to connect to a PC COM port. This connection can be used for the product development debugging, module programming control on the product manufacturing line, and module control during certification procedures. UART_RXD0 UART0 input, used for Bluetooth (BT) in BT SKU. It can be used as an additional UART in non-BT SKU. UART_TXD0 UART0 output, used for Bluetooth in case of BT SKU. It can be used as an additional UART in non-BT SKU Legend: TABLE 1-9: Signal O = Output I /O = Input /Output I = Input P = Power AUDIO Type Description AV2DATA0 AV2DATA2 AV2DATA3 I2S or left justified audio data output. It is typically connected to an external D/A converter input or an external DSP for further audio processing. AV2DATA0 is used for the main left and right channel audio output data. AV2DATA2 and AV2DATA3 may be used for surround sound rear channels and sub-woofer. See Note 1. AV2DATA1 I2S or left justified audio data input. It can be driven from an optional external A/D converter used to interface to iPod analog output or other analog audio sources, or aux in jack. If not used, leave it open. AV2CTRL0 LRCK, audio data word clock at the audio sample rate (Fs) (currently, maximum supported frequency is 192 kHz). AV2CTRL1 MCLK, audio master clock at 256 Fs. It can be used to clock an external D/A converter or an external DSP. The Fs multiplier may vary at sample rates more than 48 kHz. AV2CLK SCLK, audio data bit clock at 64 Fs. It allows up to 32 audio data bits per sample word. AV4DATA0 SPDIF format output. It can support sample rate up to 192 kHz. Consequently, the maximum instantaneous frequency on this pin is 24.576 MHz. AV4DATA1 AV3DATA0 AV3DATA1 I/O SPDIF input. Currently it is not used, do not connect. Used for I2S or left justified audio data, depend on firmware and use case. The AV3 port control and clock signals are defined as GPIOs, see Table 1-15. If required, succeeding use cases may use AV3 control and clock signals as audio clocks. Legend: O = Output I /O = Input /Output I = Input P = Power Note 1: For the audio port timing diagrams, setup and hold timing details, refer to the “DM920 Data Sheet” (DS60001278). © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 11 CY920 TABLE 1-10: CONTROL Signal Type Description MII_TXD2 Factory Reset, GPIO-08. An active-high input with internal pull-down. Pull to GND with a 10 k Ω resistor, unless return to factory settings from a hardware control is needed. Generally, return to factory settings is controlled from the Host controller through SPI register. This pin is monitored only during the boot up process. MII_TXD3 Infrared sensor input, GPIO-09. A Schmitt Trigger input which can handle inputs with slow slopes. It is used for aDMP firmware builds for infrared remote control sensor output connection to DM920. For applications with a Host controller, pull this pin to +3.3V through a 10 k Ω resistor. I/O No internal pull-ups, use maximum 4.7 k Ω pull-up resistor on each pin to +3.3V. The maximum frequency is 400 kHz. Low-active input to reset the module. This signal must be driven by an external Reset generator or by a GPIO output from a Host controller. See Section 3.0 “Application Guidelines” for the timing requirements of NRESET signal. The CY920 module includes internal 10K pull-up resistor to +3.3V. I2C_SDA, I2C_SCL NRESET Legend: O = Output TABLE 1-11: I /O = Input /Output I = Input P = Power ETHERNET Signal Type ETH_RXN, ETH_RXP, ETH_TXN ETH_TXP Ethernet signals between the PHY on the module and the external magnetics (transformer). The maximum bit rate is 100 Mbps. ETH_LED_SPEED, ETH_LED_ACT • • • • SPF1 Ethernet PHY Reset signal, GPIO-17. Do not connect if module Ethernet is used. If Ethernet is not available on the module, it can be used as a GPIO. Legend: O = Output TABLE 1-12: Description 3.3V push-pull outputs from PHY (max. ±12 mA) to drive the Ethernet LEDs 100 Mbps speed mode and activity are indicated by the outputs being low Connect ETH_LED_SPEED to LED through 330Ω resistor to +3.3V Connect ETH_LED_ACT to LED through 330Ω resistor to 0V I /O = Input /Output I = Input P = Power USB Signal Type Description USB_OTG_DN, USB_OTG_DP USB data signals. It is usually connected to the type A connector, USB switch, iPod dock connector, or Lightning connector. Maximum bit rate is high-speed USB at 480 Mbps. USB_VBUS Analog input for monitoring the USB type A connector power. Connect to the +5V power which is driving the USB type A connector power pins. If this pin drops below 4.6V, then the DM920 module will drive the USB_PWR_EN signal low to control an external power MOSFET to disconnect +5V power from the USB type A connector. USB_PWR_EN Logic output to control an external MOSFET, that is in series with the USB type A connector power. USB_ID Determines whether the USB port is USB Host or USB device. Pull low for the Host and pull high for the device. Legend: O = Output DS60001270C-page 12 I /O = Input /Output I = Input Preliminary P = Power © 2014 Microchip Technology Inc. CY920 TABLE 1-13: JTAG Signal Type TMS,TCK,TDI, TDO I/O O = Output Legend: TABLE 1-14: Description JTAG ports for the DM920 SoC. Do not connect these pins. I /O = Input /Output I = Input P = Power VIDEO Signal Type Description AV0CLK HD Clock AV0CTRL0 HD HSYNC AV0CTRL1 HD VSYNC AV0CTRL2 HD data enable, GPIO-07. This GPIO is available if HD interface is not used. HDDATA [15:0] Lower 16 bits of HD video data AV0DATA [3:0] HDDATA [19:16] AV1DATA [3:0] O = Output Legend: TABLE 1-15: HDDATA [23:20] I /O = Input /Output I = Input P = Power GPIO (MISCELLANEOUS) Signal MII_CRS, MII_COL, MII_TX_ER,MII_TXCLK Type I/O Description GPIO-00, 01, 02, 03. It is used for Bluetooth control signals. For a non-BT module, these signals can be used for other functions. AV3CLK I/O GPIO-04, see Note 1 AV3CTRL0 I/O GPIO-05, see Note 1 MII_RXD3 I/O GPIO-11, see Note 1 HDDATA12 I/O GPIO-12, see Note 2 HDDATA13 I/O GPIO-13, see Note 2 HDDATA14 I/O GPIO-14, see Note 2 HDDATA15 I/O GPIO-15, see Note 2 SPF0 I/O GPIO-16, HD_INT (for systems with HDMI transmitter) EXT_PA_EN1_5 I/O GPIO-18, FEM BSEL EXT_PA_EN1_24 I/O GPIO-19, see Note 1 Legend: Note 1: 2: O = Output I /O = Input /Output I = Input P = Power These GPIOs are available. These GPIOs are available if HD interface is not used. Microchip has a set of example schematics that shows how the external circuitry is typically connected to the module. Please contact Microchip sales team for any related documents or for any assistance. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 13 CY920 NOTES: DS60001270C-page 14 Preliminary © 2014 Microchip Technology Inc. CY920 2.0 Note: CY920 BOARD LAYOUT AND FEATURES This data sheet summarizes the features of the CY920 network media module. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the various application notes available on the Microchip web site www.microchip.com. This section describes the CY920 board and its key components. All production modules include two RF shields: the top shield and the bottom shield. Figure 2-1 illustrates the top view of the CY920 board. The figure does not show the RF shields because the shields are tem porarily removed to indicate the components. FIGURE 2-1: 2.1 Top View of CY920 Board The top view of the CY920 board features the following key components: 1. 2. 3. 4. 5. 6. 7. 8. DM920 SoC DDR2 SDRAM SPI Flash Ethernet PHY Wi-Fi Front-end Bluetooth SoC Wi-Fi/BT Antenna Socket Wi-Fi Antenna Socket CY920 BOARD (TOP VIEW) © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 15 CY920 2.2 Bottom View of CY920 Board Figure 2-2 illustrates the bottom view of the CY920 board with the following key components: 1. 2. Basic Connector Extended Connector (optional) FIGURE 2-2: CY920 BOARD (BOTTOM VIEW) DS60001270C-page 16 Preliminary © 2014 Microchip Technology Inc. CY920 2.3 Production Board with RF Shield (Top View) Figure 2-3 illustrates the top view of the CY920 board with RF shield. FIGURE 2-3: CY920 BOARD WITH RF SHIELD (TOP VIEW) © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 17 CY920 2.4 Production Board with RF Shield (Bottom View) Figure 2-4 illustrates the bottom view of the CY920 board with RF shield. FIGURE 2-4: DS60001270C-page 18 CY920 BOARD WITH RF SHIELD (BOTTOM VIEW) Preliminary © 2014 Microchip Technology Inc. CY920 3.0 Note: APPLICATION GUIDELINES 3.1 This data sheet summarizes the features of the CY920 network media module. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the various application notes available on the Microchip web site www.microchip.com. This section describes the power-up sequence and the RF guidelines recommended by Microchip. FIGURE 3-1: Power Sequencing and Reset Timing The power sequencing during power on should start with the highest voltage rail. The power sequencing should progress from the higher voltage rail to the lower voltage rail, i.e power-up 3.3V, 2.5V, 1.8V, and then 1.2V with a delay of 2 ms between each power rail. During power-down, the power sequencing should be in the reverse direction, i.e., remove 1.2V, 1.8V, 2.5V, and then 3.3V. The power-up sequence is mandatory and the power-down sequence is preferred, but optional. Figure 3-1 illustrates the power-up timing. POWER-UP SEQUENCE 3.3V 2.5V 1.8V 1.2V 3.2 RF Considerations The overall performance of the system, RF, and Wi-Fi/BT is significantly affected by the product design, environment and application. It is the responsibility of the product designer to ensure system level shielding (if required) and to verify the performance of the given product features and applications. The Wi-Fi/BT performance will be affected by the RF environment surrounding the CY920 module. Consider the following precautions for optimal Wi-Fi/BT performance: • The CY920 module is positioned in a noise-free RF environment, i.e, away from high frequency clock signals and any other sources of RF energy. • The antenna is not shielded by any metal objects, such as loudspeakers or any other metal parts. • The power supplies are clean and noise-free. Note: © 2014 Microchip Technology Inc. Preliminary The CY920 module includes RF shielding on the top and bottom of the board as a standard feature. DS60001270C-page 19 CY920 NOTES: DS60001270C-page 20 Preliminary © 2014 Microchip Technology Inc. CY920 4.0 Wi-Fi SPECIFICATION Table 4-1 describes the Wi-Fi specifications of the CY920 module. TABLE 4-1: Wi-Fi® SPECIFICATIONS (1, 2, 4, 5, 6) Feature Description IEEE 802.11a WLAN Standards IEEE 802.11b IEEE 802.11g IEEE 802.11n Frequency Band/Channels 2.412 - 2.472 GHz (2.4 GHz ISM Band, 13 Channels) Channel 1 - Channel 13 5.180 - 5.240 GHz (U-NII lower band) 5.260 - 5.320 GHz (U-NII middle band), see Note 3 5.500 - 5.700 GHz (U-NII middle band extended), see Note 3 5.745 - 5.825 GHz (U-NII upper band/ISM band) North America FCC, Japan Telec, Europe ETSI 802.11a mode (OFDM: IEEE 802.11a) Modulation 802.11b mode (DS-SS: IEEE 802.11b) 802.11g mode (OFDM: IEEE 802.11g) 802.11n mode (OFDM: IEEE 802.11n) 802.11a mode 54 Mbps, 48 Mbps, 36 Mbps, 24 Mbps, 18 Mbps, 12 Mbps, 9 Mbps, 6 Mbps Transmission Speed 802.11b mode 11 Mbps, 5.5 Mbps, 2 Mbps, 1 Mbps 802.11g mode 54 Mbps, 48 Mbps, 36 Mbps, 24 Mbps, 18 Mbps, 12 Mbps, 9 Mbps, 6 Mbps 802.11n mode MCS0 to MCS7(20 MHz and 40 MHz supported) Normal and short GI supported (PHY data rates up to 150 Mbps for 40 MHz mode + short GI) Note 1: 2: 3: 4: 5: 6: With respect to TX power, different (higher/lower) RF output power settings may be used for specific regions, antennas and/or enclosures, in which case recertification may be required. 802.11n Greenfield is not supported. (Greenfield forces 802.11n operation even in the presence of 802.11b/g AP) Dynamic Frequency Selection (DFS) is supported by the hardware. Firmware support for DFS may not be in initial firmware releases, but will follow in a later firmware release. 802.11n 20 MHz and 40 MHz bandwidth is supported. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the Host product factory to match the intended destination. The firmware setting is not accessible to the end user of the Host product. Specifications are based on nominal test settings during module production at room temperature. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 21 CY920 TABLE 4-1: Wi-Fi® SPECIFICATIONS (1, 2, 4, 5, 6) (CONTINUED) Feature Description 802.11a mode +12.5 dBm +/-3 dB (U-NII lower and U-NII upper/ISM band) TX Power 802.11n HT20 mode +11.5 dBm +/-3 dB (U-NII lower and U-NII upper/ISM band) 802.11n HT40 mode +10 dBm +/-3 dB (U-NII lower and U-NII upper/ISM band) 802.11b mode +16.5 dBm +/- 3 dB 802.11g mode +13 dBm +/-3 dB 802.11n (HT20/40) mode +12 dBm +/-3 dB (2.4GHz ISM) Power-on Ramp Adhering to IEEE specification RF Carrier Suppression Adhering to IEEE specification 802.11a mode -25 dB at 54 Mbps TX EVM 802.11b mode -10 dB at 11 Mbps 802.11g mode -25 dB at 54 Mbps 802.11n mode -27 dB at MCS7 RX Sensitivity 802.11a mode -65 dB at 54 Mbps 802.11b mode -76 dB at 11 Mbps 802.11g mode -65 dB at 54 Mbps 802.11n mode -64 dB at MCS7/20 MHz; -61 dB at MCS7/40 MHz Throughput rate (measured for each module) Note 1: 2: 3: 4: 5: 6: See factory test specification With respect to TX power, different (higher/lower) RF output power settings may be used for specific regions, antennas and/or enclosures, in which case recertification may be required. 802.11n Greenfield is not supported. (Greenfield forces 802.11n operation even in the presence of 802.11b/g AP) Dynamic Frequency Selection (DFS) is supported by the hardware. Firmware support for DFS may not be in initial firmware releases, but will follow in a later firmware release. 802.11n 20 MHz and 40 MHz bandwidth is supported. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the Host product factory to match the intended destination. The firmware setting is not accessible to the end user of the Host product. Specifications are based on nominal test settings during module production at room temperature. DS60001270C-page 22 Preliminary © 2014 Microchip Technology Inc. CY920 5.0 BLUETOOTH SPECIFICATIONS The Bluetooth (BT) subsystem included in the CY920 module shares the antenna connections with the Wi-Fi subsystem. Dedicated control signals between the DM920 module and the BT controller perform Packet Traffic Arbitration (PTA) to optimise co-existence between the Wi-Fi and BT subsystems. A high-speed UART interface is used to send data from the BT controller to the DM920 SoC for further processing. 5.1 5.2 Bluetooth Radio Characteristics Table 5-1 provides Rx and Tx characteristics of the Bluetooth radio. Features The following are the Bluetooth features: • Compliant with Bluetooth v2.1 + EDR specification • SBC and AAC codec • A2DP and AVRCP profiles • WLAN and Bluetooth co-existence using PTA and AFH • Utilises single antenna, shared with Wi-Fi • Operating band: 2.4 GHz ISM band • Output power Class 2 (+4 dBm) • Low power consumption TABLE 5-1: RADIO CHARACTERISTICS Min. Typical Max. Bluetooth Spec Sensitivity at 0.1% BER — — — ≤ -70 dBm RF transmit power -6 — ≤4 dBm Initial carrier frequency tolerance — 25 75 75 kHz 20 dB bandwidth for modulated carrier — — 1000 ≤ 1000 kHz Modulation characteristics (f1_ave) 140 165 175 > 140 kHz Modulation characteristics (f2_max) 115 145 — ≥ 115 kHz Parameter Note 1: Units Specifications are based on nominal test settings during module production at room temperature. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 23 CY920 NOTES: DS60001270C-page 24 Preliminary © 2014 Microchip Technology Inc. CY920 6.0 PACKAGING INFORMATION Figure 6-1 and Figure 6-2 illustrate the top and bottom dimensions of the CY920 board. FIGURE 6-1: Note 1: 2: 3: CY920 BOARD DIMENSIONS (TOP VIEW) PCB panel width and height tolerance is 0.1 mm. Plated hole is 0.075 mm. Non-plated hole is 0.05 mm. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 25 CY920 FIGURE 6-2: Note 1: 2: 3: CY920 BOARD DIMENSIONS (BOTTOM VIEW) PCB panel width and height tolerance is 0.1 mm. Plated hole is 0.075 mm. Non-plated hole is 0.05 mm. DS60001270C-page 26 Preliminary © 2014 Microchip Technology Inc. 3D View of the CY920 Board CY920 Figure 6-3 illustrates the 3D view of the CY920 board. 1.00 4.30 CY920 Board (3D View) 4.55 FIGURE 6-3: 2.25 DS60001270C-page 27 6.1 60.00 57.40 Preliminary 16.30 40.00 .60 R1 © 2014 Microchip Technology Inc. CY920 6.2 Module Weight Table 6-1 provides the weight for the various SKUs of the CY920 module. TABLE 6-1: MODULE WEIGHT Configuration Code Weight (g) CY920-A 17.5g CY920-B 18.5g CY920-C 18.7g DS60001270C-page 28 Preliminary © 2014 Microchip Technology Inc. CY920 7.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the electrical characteristics of the CY920 module. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the CY920 network media module are listed in the following table. Absolute Maximum Ratings Parameter Component 3.3V Supply Voltage 1.2V Supply Voltage 1.8V Supply Voltage Main 2.5V Supply Voltage † Min. Max. Unit -0.5 4.6 -0.5 1.8 -0.5 2.1 -0.5 3.0 NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 7-1 provides the basic electric specifications of the CY920 module. TABLE 7-1: BASIC SPECIFICATIONS Parameter Symbol Min. Typ Max. Unit Power supply input voltage VIN 3.165 1.14 1.71 2.375 3.3 1.2 1.8 2.5 3.465 1.26 1.89 2.625 Logic input high voltage VIH — 3.6 Logic input low voltage VIL -0.3 — 0.8 Logic input threshold voltage VT 1.39 1.51 1.65 Schmitt-trigger input low to high threshold voltage VT+ 1.63 1.76 1.9 Schmitt-trigger input high to low threshold voltage VT- 1.18 1.3 1.44 Logic output high voltage VOH 2.4 — — Logic output low voltage VOL — — 0.4 Logic low-level output current (VOL=0.4V) IOL 10.0 15.2 20.2 mA Logic high-level output current (VOH=2.4V) IOH 13.9 28.0 48.2 mA © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 29 CY920 Table 7-2 provides the current consumption details in various measurement conditions. The current consumption per voltage rail and power consumption details will be provided in the future revision of this document. TABLE 7-2: POWER CONSUMPTION(1) Current Consumption per Voltage Rail (mA) 1.2V 1.8V 2.5V 3.3V Power Consumption (mW) Maximum expected current consumption per rail across operating modes (continuous Tx/Rx mode with all function active), see Note 2. — — — — — Wi-Fi streaming (Ethernet, USB and Bluetooth power-down) — — — — — Wi-Fi streaming (USB active, Ethernet and Bluetooth power-down) — — — — — Wi-Fi streaming (USB and Bluetooth active) — — — — — Measurement Condition Ethernet streaming (Wi-Fi, USB and Bluetooth power-down) — — — — — Ethernet streaming (USB active, Wi-Fi and Bluetooth power-down) — — — — — Bluetooth streaming (Ethernet, Wi-Fi and USB power down) — — — — — Bluetooth streaming (USB active, Ethernet and Wi-Fi power-down) — — — — — Bluetooth streaming (Ethernet active, Wi-Fi and USB power down) — — — — — PSM wake up on Wi-Fi (PSM JB Green) (DTIM=1), see Note 2 — — — — — PSM wake up on Wi-Fi (PSM JB Green) (DTIM=1), see Note 2 — — — — — PSM wake up on Ethernet and wake on Wi-Fi (PSM JB Green) — — — — — Hibernate mode: Wake on Host or GPIO (Wi-Fi, Ethernet, Bluetooth and USB in power-down), see Note 2 — — — — — Hibernate mode: Wake on Host or GPIO (Wi-Fi, Ethernet, Bluetooth and USB in power-down), see Note 2 — — — — — CY920 module held in Reset — — — — — Note 1: 2: All current consumptions are estimates, and will be revised after initial modules are characterised. The worst case maximum is when all functions are active and when the Wi-Fi is transmitting in continuous Tx/Rx mode. This mode is used only during the Wi-Fi RF certification test. A separate software will be required to perform this test. Power supplies should be designed with some additional derating on top of the maximum value, typically +30%. DS60001270C-page 30 Preliminary © 2014 Microchip Technology Inc. CY920 Table 7-3 lists the CY920 module operating conditions. TABLE 7-3: OPERATING CONDITIONS Parameter Operating Temperature Min. Max. Unit +70 °C Operating Humidity 10 90 (non-condensing) %RH Storage Temperature -10 +75 °C Storage Humidity 10 95 (non-condensing) %RH Storage Temperature Cycle Test (24 hrs) -10 +75 °C Note 1: For more information on various SKUs of the CY920 module, refer to Table 9-1. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 31 CY920 NOTES: DS60001270C-page 32 Preliminary © 2014 Microchip Technology Inc. CY920 8.0 Note: REGULATORY COMPLIANCE AND QUALITY This data sheet summarizes the features of the CY920 network media module. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the various application notes available on the Microchip web site www.microchip.com. This section addresses the various regulatory standards that are compliant with the CY920 module. Microchip does not certify all module variants for all the countries. Table 8-1 provides the module versions for which certain certifications have already been done. The information about certified modules and Bluetooth qualifications will be provided in the future revisions of this document. TABLE 8-1: REGULATORY COMPLIANCE Description Country Compliance USA FCC CFR47 Part15B Electromagnetic Compatibility (Prescan) Europe EN 301 489-1 EN 301 489-17 Canada IC RSS-GEN USA FCC CFR47 Part 15C, para 15.247 FCC CFR47 Part 15E, para 15.407 Europe EN 300 328 EN 301 893 Canada IC RSS-210 Japan ARIB STD-T66 ARIB STD-T71 — — Radio Regulations Bluetooth Qualifications Certified Modules — — — Contact Microchip’s sales office for the latest information on certified modules for a particular county, and arranging for an additional certification for your chosen module, if needed. Any additional certification will need to be paid for by the customer. The product manufacturer is responsible for the end product certification. Microchip can help manufacturers to prepare for the Wi-Fi Alliance test for the Wi-Fi certification by providing an example test plan and the required commands to enable special test modes. Please contact Microchip’s sales office for any assistance on Wi-Fi Alliance Logo certification. For documents related to Wi-Fi certification and recommended interfacing and power supply schematics, refer to the Microchip web site at www.microchip.com. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 33 CY920 8.1 Antenna Considerations Table 8.2 provides the list of antennas along with the manufacturer and part number details. TABLE 8-2: ANTENNA LIST Sl No. Manufacturer WALSIN WALSIN WALSIN WALSIN WALSIN RFDPA870930IMAB301 Dipole Antenna 1.2 dBi for 2.4 GHz WALSIN RFDPA870945IMAB301 Dipole Antenna 1.16 dBi for 2.4 GHz WALSIN RFDPA870900SBAB801* + RFCBA100630SA6B301 Dipole Antenna 0.7 dBi for 2.4 GHz WALSIN RFDPA870900SBAB801* + RFCBA100645SA6B301 Dipole Antenna 0.1 dBi for 2.4 GHz Note 1: Part Number Antenna Type Peak Gain PI_RFDPA870920IMLB301_V01 Dipole Antenna 1.84 dBi for 2.4 GHz PI_RFDPA870920IMLB301_V01 Dipole Antenna 3.26 dBi for 5 GHz PI_RFDPA870930IMLB301_V01 Dipole Antenna 1.10 dBi for 2.4 GHz PI_RFDPA870930IMLB301_V01 Dipole Antenna 2.77 dBi for 5 GHz * The antenna connector is reverse SMA type. Table 8.3 provides the antennas to be used for the various SKUs as per Table 8.2. 8.3 Restriction of Use of Hazardous Substances (RoHS) Compliance CY920 module uses only RoHS compliant components. TABLE 8-3: ANTENNAS FOR VARIOUS SKUs Configuration Code Antenna List (Sl No.) CY920-A 1, 2, 3, 4, 5, 6, 7, 8 CY920-B — CY920-C 1, 2, 3, 4, 5, 6, 7, 8 Note 1: 8.2 The antenna list for CY920-B SKU will be provided in the future revisions of this document. CY920 Usage Guidelines under Modular Approval The CY module has received Limited Module Approval (LMA) from FCC and IC. This is because the CY module does not have complete built-in Power regulator circuit. Microchip recommends that customers follow the supply voltage requirements provided in this data sheet, and follow the Power supply design provided in the “CY Module Power Supply V1.0” document. It is the product manufacturer responsibility to ensure that the power supply recommendations are followed, and the RF behavior adheres the FCC or TCB certification requirements when the module is installed in the final Host product. The product manufacturer should work with their test house for confirming the RF behavior with FCC or TCB. DS60001270C-page 34 Preliminary © 2014 Microchip Technology Inc. ORDERING GUIDE CY920 DS60001270C-page 35 9.0 This data sheet summarizes the features of the CY920 network media module. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the various application notes available on the Microchip web site www.microchip.com. Note: Table 9-1 describes the various SKUs of CY920 network media module. TABLE 9-1: ORDERING GUIDE(1) Part number Microchip IC Status Two External Diversity Antennas Ethernet (10/100 Mbps) USB Extended Connector 64 MB DDR2 16 MB Serial Flash Bluetooth Top Module Shield Bottom Module Shield CY920-A DM920 Launch — — Preliminary CY920-B DM920 Launch — CY920-C DM920 Launch Note 1: Note: The Apple Authentication Coprocessor is not available on the CY920 module. The Apple Authentication Coprocessor should be provided on the product motherboard, connected to the SDA, SCL signals from the CY920 module. Do not use a module which has two external antenna connectors with only one external antenna connected. Leaving one antenna socket open will degrade Wi-Fi performance. Microchip recommends using two external antennas for best performance. © 2014 Microchip Technology Inc. CY920 NOTES: DS60001270C-page 36 Preliminary © 2014 Microchip Technology Inc. CY920 APPENDIX A: CERTIFICATION NOTICES Labeling Requirements The CY920 module is not tested for Federal Communications Commission (FCC). The following statements are not valid until the production version modules are tested. It is planned to certify the production version of the CY920 module as soon as possible after production versions are made. Federal Communications Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and radiates radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/ TV technician for help. Caution: Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment. Applicable to UNII device only: The device is restricted to indoor use when operating in the 5.15 GHz to 5.25 GHz frequency band. FCC requires this product to be used indoors for frequency range 5.15 GHz to 5.25 GHz to reduce the potential for harmful interference to co-channel mobile satellite systems. © 2014 Microchip Technology Inc. This device complies with Part 15 of the FCC Rules. The operation is subject to the following two conditions: the device may not cause harmful interference, and the device must accept any interference received, including interferences that may cause undesired operations. RF Exposure Warning This equipment must be installed and operated in accordance with provided instructions. The antennas used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End users and installers must be provide with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. Information for the OEMs or Integrators The following statement must be included in all versions of this document supplied to OEMs or integrators, but should not be distributed to the end user. “This device is intended for OEM or integrators only. Please see the full Grant of Equipment document for other restrictions. This device must be operated and used with a locally approved Access “. Information to be Supplied to the End User by the OEM or Integrator The following regulatory and safety notices must be published in all documentation supplied to the end user of the product or system, incorporating an adapter in compliance with local regulations. “The host system must be labelled with: Contains FCC ID:ZQO-CY920‘X’ and IC: 2581A-CY920‘X’, FCC ID displayed on the label. The letter shown in Ordering Guide Part Number column should be substituted for ‘X’. For example, for the CY920-C module, the label text should be "Contains FCC ID:ZQO-CY920C"and "IC: 2581A-CY920C. The label text should be updated according to the table shown in Section 9.0 “Ordering Guide” of this document. Preliminary DS60001270C-page 37 CY920 Japan Canada, avis d'Industry Canada (IC) This device operation in the 5.15 GHz to 5.35 GHz frequency range is restricted to indoor use. Final product shall be labelled "For Indoor use only." Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Operation is subject to the following two conditions: the device may not cause interference, and the device must accept any interference, including interference that may cause undesired operation of the device. This radio transmitter "IC: 2581A-CY920‘X’ has been approved by Industry Canada to operate with the antenna types listed in Table 8.2 with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. RF Exposure Information The radiated output power of the wireless device is below the Industry Canada (IC) radio frequency exposure limits. The Wireless Device should be used in such a manner that the potential for human contact during normal operation is minimized. This device has been evaluated and shown compliant with the IC radio frequency exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a person's body). This device has been certified for use in Canada. Status of the listing in the Industry Canada's Radio Equipment List (REL) can be found at the following locations: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?la ng=eng Additional Canadian information on RF exposure can be found at the following location: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.ht ml Caution: Applicable to LE-LAN device only: This device is restricted to indoor use when operating in the 5.15 GHz to 5.25 GHz frequency band. Industry Canada requires this product to be used indoors for frequency range 5.15 to 5.25 GHz to reduce the potential for harmful interference to co-channel Mobile Satellite systems. DS60001270C-page 38 Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement. Cet émetteur radio "IC: 2581A-CY920‘X’ a été approuvé par Industrie Canada pour fonctionner avec les types d'antennes énumérés dans le tableau 7-2 avec le gain maximal admissible et impédance d'antenne requise pour chaque type d'antenne indiqué. Types d'antennes n'est pas inclus dans cette liste, ayant un gain supérieur au gain maximal indiqué pour ce type, sont strictement interdits pour une utilisation avec cet appareil. Informations concernant l'exposition aux fréquences radio (RF) La puissance de sortie émise par l'appareil de sans fil Dell est inférieure à la limite d'exposition aux fréquences radio d'Industry Canada (IC). Utilisez l'appareil de sans fil Dell de façon à minimiser les contacts humains lors du fonctionnement normal. Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20 cm du corps d'une personne). Ce périphérique est homologué pour l'utilisation au Canada. Pour consulter l'entrée correspondant à l'appareil dans la liste d'équipement radio (REL - Radio Equipment List) d'Industry Canada rendez-vous sur: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?la ng=eng Pour des informations supplémentaires concernant l'exposition aux RF au Canada rendez-vous sur: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.ht ml Caution: Prudence (ce n'est applicable qu'aux dispositif LE-LAN): Ce dispositif est limité à une utilisation en intérieur à cause de son fonctionnement dans la gamme 5.15 GHz à 5.25 GHz. Industrie Canada exige que ce produit est utilisé à l'intérieur pour la gamme de fréquence de 5,15 à 5,25 GHz pour réduire les risques d'interférence nuisible à la co-canal systèmes mobiles par satellite. Preliminary © 2014 Microchip Technology Inc. CY920 APPENDIX B: REVISION HISTORY Revision A (January 2014) This is the initial release of the CY920 Network Media Module data sheet. Revision B (March 2014) • Replaced Figure 6-1 and Figure 6-2 in Section 6.0 “Packaging Information” • Added Figure 2-3 and Figure 2-4 Revision C (June 2014) This revision includes the following updates: • Figures: - Updated Figure 2-1, Figure 2-2, Figure 2-3, and Figure 2-4 - Added Figure 3-1 - Replaced Figure 6-1 and Figure 6-2 • Notes: - Updated Note 4 in Table 4-1 - Added Note 6 in Table 4-1 - Removed Note 3 in Table 7-2 • Sections: - Updated the components in Section 2.1 “Top View of CY920 Board” - Updated Section 3.1 “Power Sequencing and Reset Timing” - Updated Section 8.2 “CY920 Usage Guidelines under Modular Approval” • Tables: - Updated Table 1-1, Table 4-1, and Table 7-2 - Replaced Table 5-1 and Table 8-2 - Removed Table 5-2 - Added Table 6-1 and Table 8-3 - Removed the CY920-E SKU in Table 9-1 • Minor changes related to formatting have been incorporated in the entire document © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 39 CY920 NOTES: DS60001270C-page 40 Preliminary © 2014 Microchip Technology Inc. CY920 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. © 2014 Microchip Technology Inc. Preliminary DS60001270C-page 41 CY920 NOTES: DS60001270C-page 42 Preliminary © 2014 Microchip Technology Inc. Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 DS60001270C-page 43 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Poland - Warsaw Tel: 48-22-3325737 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 03/25/14 © 2014 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-344-0 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == © 2014 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS60001270C-page 44
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