MMB Research ZGB357PA10 RAPIDSE ZIGBEE SMART ENEGRY User Manual

MMB Research Inc. RAPIDSE ZIGBEE SMART ENEGRY Users Manual

Users Manual

DRAFTRapidSE ZigBee Smart Energy ModuleZGB.357.PA.1.0 Rev 1.5The RapidSE Module is a drop-in ZigBee Smart Energy solution. Preloaded with MMB Research’s RapidSE ZigBee Smart Energy application, it offers hardware vendors an easy way to integrate a fully-implemented, automated ZigBee Smart Energy platform into their existing devices.MMB Research offers a variety of hardware and software development tools to facilitate integration. For more information, please visit http://www.mmbresearch.comContents1 | General Information 22 | Module Pinout 23 | Electrical Specications 3 3.1 | Absolute Maximum Ratings 3 3.2 | Recommended Operating Conditions 3 3.3 | DC Electrical Characteristics 34 | RF Specications 4 4.1 | Receive Specifications 4 4.2 | Transmit Specifications 5 4.3 | Synthesizer 55 | Functional Specications 6 5.1 | Serial Ports 6 5.2 | GPIO 7 5.3 | Analog to Digital Converter (ADC) 86 | Mechanical Specications 9 6.1 | Physical Dimensions 9 6.2 | Recommended Land Pattern (Surface Mount) 10 6.3 | Connector Specifications 11 6.4 | Labelling 117 | Soldering Temperature Time Prole for reow soldering (Lead-free solder) 118 | Regulatory Approvals 12 8.1 | FCC 12
DRAFT1 | General InformationNote that some of the specifications refer to either EM357 or Module. Please note specifications cited as EM357 are taken from the EM357 datasheet (this should also be noted where referred to). Module means measurements taken with our production module.Numbers in parentheses are the EM357 pin number.Module Pad Function EM357 GPIO1 GND 2 Module UART RX GPIO10 (33)3 Module UART TX GPIO9 (32)4 GPIO6 (29)5 GPIO7 (30)6 GPIO5 (27)7 GPIO4 (26)8 GPIO12 (20)9 GPIO11 (19)10 VCC 11 GND 12 Host Controlled Handshake Line GPIO3 (25)13 Module Controlled Handshake Line GPIO8 (31)14 SPI Slave CLK GPIO2 (24)15 SPI Slave In GPIO0 (21)16 SPI Slave Out GPIO1 (22)17 nReset (13)18 VCC 19 GND 20 n.c. 21 n.c. 22 GND 23 nReset (13)24 SIF CLK (34)25 SIF MISO (35)26 SIF MOSI (36)27 nSIF LOAD (37)28 GPIO16 (40)29 GPIO15 (41)30 GPIO14 (42)31 GPIO13 (43)32 GND 2 | Module Pinout
DRAFT3 | Electrical Specications3.1 | Absolute Maximum Ratings3.2 | Recommended Operating Conditions3.3 | DC Electrical CharacteristicsParameter Minimum Maximum UnitsSupply Voltage (VCC) -0.3 3.6 VVoltage on any GPIO[0:16], SIF CLK, SIF MISO, SIF MOSI, nSIF LOAD, nReset -0.3 VCC +0.3 VAmbient Operating Temperature -40 +85 °CStorage Temperature -40 +125 °CParameter Minimum Typical Maximum UnitsSupply Voltage (VCC) 2.7 3.3 3.6 VTemperature Range -40 +85 °CParameter Test Condition Minimum Typical Maximum UnitsDeep sleep current At 25 °C, VCC = 3.3v, shutdown mode10.5 µAIdle current At 25 °C, VCC = 3.3v, sleep mode7.8 mARX current At 25 °C, VCC = 3.3v 36 mATX current At 25 °C, VCC = 3.3v, boost mode220 mATX current At 25 °C, VCC = 3.3v, normal mode190 mAInput voltage for logic 0 0 0.2 x VCC VInput voltage for logic 1 0.8 x VCC VCC VInput current for logic 0 -0.5 µAInput current for logic 1 0.5 µAInput pull-up resistor value 30 kΩInput pull-down resistor value 30 kΩOutput voltage for logic 0 0 0.18 x VCC VOutput voltage for logic 1 0.82 x VCC VCC VOutput source current(standard current pad)4 mAOutput sink current (standard current pad)4 mAOutput source current (high current pad: GPIO[16:13] )8 mAOutput sink current(high current pad: GPIO[16:13] )8 mATotal output current(for I/O pads)40 mA
DRAFT4 | RF Specications4.1 | Receive Specifications Module Receive CharacteristicsReceive Strength Signal Indicator (RSSI) AccuracyEM357 Receive CharacteristicsParameter Test Condition Min Typical Max UnitsReceive sensitivity Max gain -97.56 dBmReceive sensitivity (Boost) Max gain -99.53 dBmInput 1dB Compression CW +26 dBmInput IP3 Two -7 dBm CW tones spaced 1 MHz apart +36 dBmParameter Test Condition Minimum Typical Maximum UnitsFrequency range 2400 2500 MHzSensitivity (Boost mode) 1% PER, 20 byte packet defined by IEEE 802.15.4-100 -95 dBmSensitivity 1% PER, 20 byte packet defined by IEEE 802.15.4-99 -94 dBmHigh-side adjacent channel rejection IEEE 802.15.4 signal at -82dBm 35 dBLow-side adjacent channel rejection IEEE 802.15.4 signal at -82dBm 35 dB2nd high-side adjacent channel rejection IEEE 802.15.4 signal at -82dBm 43 dB2nd low-side adjacent channel rejection IEEE 802.15.4 signal at -82dBm 43 dBChannel rejection for all other channels IEEE 802.15.4 signal at -82dBm 40 dB802.11g rejection centered at +12MHz or -13MHzIEEE 802.15.4 signal at -82dBm 35 dBMaximum input signal level for correct operation (low gain)0 dBmImage suppression 30 dBCo-channel rejection IEEE 802.15.4 signal at -82dBm -6 dBcChannel Actual Level Measured RSSI18 -40 -40.018 -50 -50.018 -60 -60.018 -70 -70.018 -80 -79.018 -90 -89.2This table lists the key parameters of the integrated IEEE 802.15.4 receiver on the EM357. This information is taken from the Ember EM357 Datasheet. Link to this document can be found in the References section.Note: Receive Measurements were collected with Ember’s EM357 Lattice Balun Reference Design (Version B1) at 2440MHz and using the EmberZNet software stack Version 3.0.1. The Typical number indicates one standard deviation above the mean, measured at room temperature (25C). The Min and Max numbers were measured over process corners at room temperature.
DRAFTParameter Test Condition Minimum Typical Maximum UnitsRelative frequency error (2x40 ppm required by IEEE 802.15.4)-120 +120 ppmRelative timing error (2x40 ppm required by IEEE 802.15.4)-120 +120 ppmLinear RSSI range 40 dBRSSI Range -90 -30 dBEM357 Receive Characteristics | Continued4.2 | Transmit Specifications4.3 | SynthesizerModule Transmitter ParametersEM357 Synthesizer ParametersParameter Test Condition Min Typical Max UnitsMaximum output power (Boost mode)At highest power setting 20.45 dBmCarrier frequency error -40 -10 +40 ppmPSD mask relative 3.5 MHz away -20 dBPSD mask absolute 3.5 MHz away -30 dBmParameter Test Condition Min Typical Max UnitsFrequency range 2400 2500 MHzFrequency resolution 11.7 kHzLock time From off, with correct VCO DAC setting 100 µsRelock time Channel change or Rx/Tx turnaround (IEEE 802.15.4 defines 192μs turnaround time)100 µsPhase noise at 100kHz -71 dBc/HzPhase noise at 1MHz -91 dBc/HzPhase noise at 4MHz -103 dBc/HzPhase noise at 10MHz -111 dBc/HzThis table lists the key parameters of the integrated synthesizer on the EM357. Taken from the EM357 datasheet.
DRAFT5 | Functional Specications5.1 | Serial Ports5.1.1 | SC1 (UART, SPI, I2C)Refer to the EM357 data sheet for functionality and associated GPIO pin outs. Note: The module pin out table in section 2 of this document provides a cross reference between the MMB PA module pins and the EM357 GPIO.The SC1 module provides asynchronous (UART) or synchronous (SPI or I2C) serial communications. The UART mode contains the following features:• Baud rate (300bps up to 921kbps)• Data bits (7 or 8)• Parity bits (none, odd, or even)• Stop bits (1 or 2)• GPIO signals: ʳ TXD ʳ RXD ʳ nRTS (optional) ʳ nCTS (optional)The SPI mode has the following features:• Full duplex operation• Programmable clock frequency (12MHz max.)• Programmable clock polarity and clock phase• Selectable data shift direction (either LSB or MSB first)• Master mode only• Fixed 8 bit word length• The following signals can be made available on the GPIO pins: ʳ MO (master out) ʳ MI (master in) ʳ MCLK (serial clock)The SC1 I2C mode has the following features:• Programmable clock frequency (400kHz max.)• Supports both 7-bit and 10-bit addressing• The SC1 I2C controller is only available in master mode. • The I2C Master controller supports Standard (100kbps) and Fast (400kbps) I2C modes. • Multiple master applications are not supported. • The I2C signals are open-collector and external pull-up resistors are required.• The following signals can be made available on the GPIO pins: ʳ MSDA (serial data) ʳ MSCL (serial clock)
DRAFT5.1.2 | SC2 (SPI, I2C)The SC2 module provides synchronous (SPI or I2C) serial communications.The SC2 SPI mode has the following features:• The SPI mode of the SC2 supports both master and slave modes. • It has a fixed word length of 8 bits. • Master and slave modes• Full duplex operation• Programmable master mode clock frequency (12MHz max.)• Slave mode up to 5MHz bit rate• Programmable clock polarity and clock phase• Selectable data shift direction (either LSB or MSB first)• Optional slave select input• The following signals can be made available on the GPIO pins: ʳ MOSI (master out/slave in) ʳ MISO (master in/slave out) ʳ MSCLK (serial clock) ʳ nSSEL (slave select—only in slave mode)The SC2 I2C mode has the following features:• The SC2 I2C controller is only available in master mode. • The I2C Master controller supports Standard (100kbps) and Fast (400kbps) I2C modes. • Multiple master applications are not supported. • The I2C signals are open-collector, and external pull-up resistors are required.• Programmable clock frequency (400kHz max.)• 7- and 10-bit addressing• The following signals can be made available on the GPIO pins: ʳ SDA (serial data) ʳ SCL (serial clock)5.2 | GPIOThe EM357 has 17 multi-purpose GPIO pins that can be configured in a variety of ways. All pins have the followingprogrammable features:• Selectable as input, output, or bi-directional.• Output can be totem-pole, used as open drain or open source output for wired-OR applications.• Can have internal pull-up or pull-down.
DRAFT5.3 | Analog to Digital Converter (ADC)The ADC is a first-order sigma-delta converter sampling at 1MHz with programmable resolution and conversionrate. the ADC Module supports both single-ended and differential inputs.Parameter Minimum Typical Maximum UnitsConversion time 32 4096 µ SVREF 1.19 1.2 1.21 VVREF output current 1 mAVREF load capacitance 10 nFMinimum input voltage 0 VMaximum input voltage VCC VSingle-ended signal range 0 VREF VDifferential signal range - VREF + VREF VCommon mode range 0 VREF VInput referred ADC offset -10 10 mVInput impedance When taking a sample 1 M Ohm When not taking a sample 10 M OhmINL -0.5 0.5 LSBDNL -0.5 0.5 LSB
DRAFT6.1 | Physical DimensionsSymbol Description DistanceL Length of the module 34.73 mmW Width of the module 28.43 mmH Height of the module 4.45 mmA1 Pitch 2 mmA2 Distance centre of pad to PCB edge 2.59 mmA3 Distance center of pad to PCB edge 5.22 mmA4 Distance pad edge to PCB edge 0.29 mmA5 Distance center of via to PCB edge 0.84 mmR1 Keep-out zone from corner of PCB 5 mm (minimum)R2 Keep-out zone from corner of PCB 5 mm (minimum)R3 Width of keep-out zone 15 mmR4 Length of keep-out zone 5.5 mm1 1132 221221A5LWA4A2A3A12.6 mm0.6 mm0.8 mmR2R1 R4R3ANTENNA6 | Mechanical Specications
DRAFTSymbol Description DistanceF1 Distance pad edge to pad edge 21.9 mmF2 Distance pad edge to pad edge 1.523 mmF3 Distance pad center to pad center 1.3 mmF4 Pitch 2 mm1 1132 221221F1F21.51 mm3.94 mm0.854 mmd = 0.8 mmF4 F3module outline6.2 | Recommended Land Pattern (Surface Mount)Note: It is advised that for surface mount applications, through holes / vias should not be designed into the carrier board.
DRAFT7 | Soldering Temperature Time Prole for reow soldering (Lead-free solder)150˚C - 190˚C220˚C30 +20/-10s90 ±30s230˚C - 240˚C maxTemp[ ˚C ]Time [ s ]Maximum reflow cycles: 2Opposite-side reflow is prohibited due to the module weight. You must not place the module on the bottom / underside of your PCB and re-flow.6.3 | Connector Specifications6.4 | Labelling6.3.1 | Edge Mount (USNAP) Connector6.3.2 | SIP Header / Socket10 pin 2mm pitch right angle female header11 + 11 + 10 (if no USNAP populated) pin 2mm pitch 0.8mm diameter through hole footprint20 mm20 mm
DRAFT8.1.1 | FCC Notice8.1 | FCC8 | Regulatory ApprovalsThis device (ZGB.357.PA.1.0) complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or configured to operate with a separation distance of 20cm or more from all persons.8.1.3 | Labeling RequirementsThe user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior enclosure of an incorporating device must list the MMB Research Inc. FCC ID “XFFZGB357PA10” and the FCC Notice above (section 7.1.1).Devices intended for sale in the Canadian market should also include the Industry Canada (IC) ID “8365A-ZGB357PA10”8.1.2 | Modular ApprovalThis device (ZGB.357.PA.1.0) meets the requirements for modular transmitter approval as detailed in the FCC public notice DA 00-1407.It should be noted that:“While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to the appropriate equipment authorization).” -- FCC Public Notice DA 00-1407Caution:Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.Rev 1.5 | Apr 1, 201025 Prince Arthur Ave.Toronto, Ontario, CanadaM5R1B2416.636.3145info@mmbresearch.comwww.mmbresearch.comCopyright © 2010 MMB Research Inc. All rights reserved.The information in this document is subject to change without notice. This document is believed to be accurate and reliable, but the statements contained herein are presented without expressed or implied warranty.RapidSE is a trademark of MMB Research Inc.All other trademarks are the property of their respective holders.

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