Microchip Technology A090666 ATZB-900-B0 900 MHz B0, 802.15.4/Zigbee OEM-Module User Manual doc8227

Download:
Mirror Download [FCC.gov]
Document ID	1460897
Application ID	YVha9VoljfjAEkyI75UYDQ==
Document Description	User Manual techn
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	24.06kB (300779 bits)
Date Submitted	2011-05-09 00:00:00
Date Available	2011-05-09 00:00:00
Creation Date	2011-04-25 20:53:11
Producing Software	PDF-XChange Viewer [Version: 2.0 (Build 52.0) (Jun 7 2010; 19:37:04)]
Document Lastmod	2011-04-27 10:51:29
Document Title	doc8227.pdf
Document Creator	PScript5.dll Version 5.2.2
Document Author:	saravana.kumar

ZigBit™ 700/800/900 MHz Wireless Modules
....................................................................................................................
ATZB-900-B0
Datasheet
8227C–MCU Wireless–06/09
ZigBit™ 700/800/900 MHz Wireless Modules
1-2
8227C–MCU Wireless–06/09
Section 1
1.1
Summary............................................................................................................................ 1-1
1.2
Applications........................................................................................................................ 1-1
1.3
Key Features...................................................................................................................... 1-2
1.4
Benefits .............................................................................................................................. 1-2
1.5
Abbreviations and Acronyms ............................................................................................. 1-2
1.6
Related Documents............................................................................................................ 1-3
Section 2
2.1
Overview ............................................................................................................................ 2-1
Section 3
3.1
Electrical Characteristics.................................................................................................... 3-3
3.1.1
Absolute Maximum Ratings ................................................................................. 3-3
3.1.2
Test Conditions .................................................................................................... 3-3
3.1.3
RF Characteristics ............................................................................................... 3-4
3.1.4
ATmega1281V Microcontroller Characteristics ................................................... 3-4
3.1.5
Module Interfaces characteristics ........................................................................ 3-5
3.2
Physical/Environmental Characteristics and Outline.......................................................... 3-5
3.3
Pin Configuration................................................................................................................ 3-6
3.4
Mounting Information ......................................................................................................... 3-9
3.5
Soldering Profile............................................................................................................... 3-10
3.6
Antenna Reference Design .............................................................................................. 3-10
3.6.1
General recommendations ................................................................................ 3-11
Section 4
4.1
Ordering Information ........................................................................................................ 4-12
ZigBit™ 700/800/900 MHz Wireless Modules
1-i
8227C–MCU Wireless–06/09
Section 1
Introduction
1.1
Summary
ZigBit ™ 900 is an ultra-compact, extended range, low-power, high-sensitivity 784/868/915 MHz
IEEE 802.15.4/ZigBee® OEM module, based on the innovative Atmel’s mixed-signal hardware platform.
It is designed for wireless sensing, control and data acquisition applications. ZigBit modules eliminate
the need for costly and time-consuming RF development, and shortens time to market for a wide range
of wireless applications.
This module is the latest addition to the ZigBit family also represented by 2.4 GHz modules ATZB-24A2/B0 [1], and ATZB-A24-UFL/U0 [3].
1.2
Applications
ZigBit 900 module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing,
self-organizing mesh network, while optimizing network traffic and minimizing power consumption. Atmel
offers two stack configurations: BitCloud and SerialNet. BitCloud is a ZigBee PRO certified software
development platform supporting reliable, scalable, and secure wireless applications running on Atmel’s
ZigBit modules. SerialNet allows programming of the module via serial AT-command interface.
The applications include, but are not limited to:
• Building automation & monitoring
•
•
•
•
•
•
•
– Lighting controls
– Wireless smoke and CO detectors
– Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
– Machinery condition and performance monitoring
– Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity,
vibration, etc.
Automated meter reading (AMR)
ZigBit™ 700/800/900 MHz Wireless Modules
1-1
8227C–MCU Wireless–06/09
Introduction
1.3
Key Features
•
•
•
•
•
•
•
•
•
•
•
•
•
1.4
Ultra compact size (18.8 x 13.5 mm)
High RX sensitivity (-110 dBm)
Outperforming link budget (120 dB)
Up to 11 dBm output power
Very low power consumption (< 6 µA in Sleep mode)
Ample memory resources (128K bytes of flash memory, 8K bytes RAM, 4K bytes EEPROM)
Wide range of interfaces (both analog and digital):
– 9 spare GPIO, 2 spare IRQ lines
– 4 ADC lines + 1 line for supply voltage control (up to 9 lines with JTAG disabled)
– UART with CTS/RTS control
– USART
– I2C
– SPI
– 1-Wire
– Up to 30 lines configurable as GPIO
Capability to write own MAC address into the EEPROM
Optional antenna reference designs
IEEE 802.15.4 compliant transceiver
868 / 915 MHz band
784 MHz Chinese band
BitCloud embedded software, including serial bootloader and AT command set
Benefits
•
•
•
•
•
•
Over 6 km (4 miles) outdoor line-of-sight range
Small physical footprint and low profile for optimum fit in even the smallest of devices(1)
Extended battery life
Mesh networking capability
Easy-to-use low cost Evaluation Kit
Single source of support for HW and SW
Note:
1.5
1. The module is to be certified
Abbreviations and Acronyms
ADC
Analog-to -Digital Converter
API
Application Programming Interface
BPSK
Binary Phase-Shift Keying modulation scheme
DC
Direct Current
DTR
Data Terminal Ready
EEPROM
Electrically Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
ZigBit™ 700/800/900 MHz Wireless Modules
1-2
8227C–MCU Wireless–06/09
Introduction
1.6
GPIO
General Purpose Input/Output
HVAC
Heating, Ventilating and Air Conditioning
HW
Hardware
I2C
Inter-Integrated Circuit
IEEE
Institute of Electrical and Electrionics Engineers
IRQ
Interrupt Request
ISM
Industrial, Scientific and Medical radio band
JTAG
Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
MAC
Medium Access Control layer
MCU
Microcontroller Unit. In this document it also means the processor, which is the core of ZigBit
module
O-QPSK
Offset Quadrature Phase-Shift Keying modulation scheme
OEM
Original Equipment Manufacturer
OTA
Over-The-Air upgrade
PCB
Printed Circuit Board
PER
Package Error Ratio
RAM
Random Access Memory
RF
Radio Frequency
RTS/CTS
Request to Send/ Clear to Send
RX
Receiver
SMA
Surface Mount Assembly
SPI
Serial Peripheral Interface
SW
Software
TTM
Time To Market
TX
Transmitter
UART
Universal Asynchronous Receiver/Transmitter
USART
Universal Synchronous/Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
ZDK
ZigBit Development Kit
ZigBee,
ZigBee PRO
Wireless networking standards targeted at low-power applications
802.15.4
The IEEE 802.15.4-2006 standard applicable to low-rate wireless Personal Area Network
Related Documents
[1] ZigBit™ 2.4 GHz Wireless Modules ATZB-24-A2/B0 Datasheet. Atmel’s doc8226.pdf
[2] ZigBit™ Development Kit. User Guide. MeshNetics Doc. S-ZDK-451 - TBD
[3] ZigBit™ Amplified 2.4 GHz Wireless Modules datasheet. Atmel’s doc8228.pdf
ZigBit™ 700/800/900 MHz Wireless Modules
1-3
8227C–MCU Wireless–06/09
Introduction
[4] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash. 2549F
AVR 04/06
[5] Atmel AT86RF212 Low Power 800/900 MHz Transceiver for IEEE 802.15.4b, Zigbee, and ISM Applications. Preliminary specification
[6] Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height.
http://www.hirose.co.jp/cataloge_hp/e32119372.pdf
[7] ZigBit 900 Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~03 TBD
[8] IEEE Std 802.15.4-2006 IEEE Standard for Information technology - Part 15.4 Wireless Medium
Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area
Networks (LR-WPANs)
[9] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
[10] BitCloud™ IEEE 802.15.4/ZigBee Software. AVR2050: BitCloud User Guide. Atmel’s doc8199.pdf
ZigBit™ 700/800/900 MHz Wireless Modules
1-4
8227C–MCU Wireless–06/09
Section 2
Zigbit™700/800/900 MHz Wireless Modules Overview
2.1
Overview
ZigBit 900 is an extended-range low-power, a low-power, high-sensitivity IEEE 802.15.4/ ZigBee-compliant OEM module, which occupies less than a square inch. Based on a solid combination of Atmel’s latest
MCU Wireless hardware platform [5], power amplifier and low-noise amplifier, the ZigBit 900 offers superior radio performance, ultra-low power consumption and exceptional ease of integration.
Figure 2-1.
ATZB-900-B0 Block Diagram
ZigBit 900 contains Atmel’s ATmega1281V Microcontroller [4] and AT86RF212 RF Transceiver [5]. The
module features 128 Kbytes flash memory and 8 Kbytes RAM.
The ZigBit 900 already contains a complete RF/MCU-related design with all the necessary passive components included. The module can be easily mounted on a simple 2-layer PCB with a minimum of
required external connection. Compared to a custom RF/MCU design, a module-based solution offers
considerable savings in development time and NRE cost per unit during the design, prototyping, and
mass production phases of product development.
To jumpstart evaluation and development, Atmel also offers a complete set of evaluation and development tools. The new ZigBit 900 Development Kit [7] comes with everything you need to create custom
applications featuring ZigBit 900 module.
The kit features MeshBean development boards (ATZB-EVB-900-SMA) with an easy-to-access extension connector for attaching third party sensors and other peripherals, and a JTAG connector for easy
application uploading and debugging.
The kit also includes reference applications to speed up application development, source code for hardware interface layer and reference drivers for the all the module interfaces, intuitive development
environment from Atmel, and comprehensive set of application notes and product documentation.
ZigBit™ 700/800/900 MHz Wireless Modules
2-1
8227C–MCU Wireless–06/09
Zigbit™700/800/900 MHz Wireless Modules Overview
ZigBit 900 modules come bundled with BitCloud, a 2nd generation embedded software stack from Atmel.
BitCloud is fully compliant with ZigBee PRO and ZigBee standards for wireless sensing and control [8],
[9], [10] and it provides an augmented set of APIs which, while maintaining 100% compliance with the
standard, offer extended functionality designed with developer's convenience and ease-of-use in mind.
Depending on end-user design requirements, ZigBit 900 can operate as a self-contained sensor node,
where it would function as a single MCU, or it can be paired with a host processor driving the module
over a serial interface. In the former case, a user application may be used with the BitCloud software
allowing customization of embedded applications through BitCloud’s C API.
In the latter case, the host processor controls data transmission and manages module peripherals via an
extensive set of SerialNet AT commands. Thus, no firmware customization is required for a successful
module design-in. Additionally, third-party sensors can be connected directly to the module, thus
expanding the existing set of peripheral interfaces.
ZigBit™ 700/800/900 MHz Wireless Modules
2-2
8227C–MCU Wireless–06/09
Section 3
Specifications
3.1
Electrical Characteristics
3.1.1
Absolute Maximum Ratings
Table 3-1. Absolute Maximum Ratings(1)(2)
Parameters
Min
Max
Voltage on any pin, except RESET with respect to Ground
-0.5V
VCC + 0.5V
DC Current per I/O Pin
40 mA
DC Current DVCC and DGND pins
300 mA
Input RF Level
+5 dBm
Notes:
1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond
those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those
indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. Attention! ZigBit 900 is an ESD-sensitive device. Precaution should be taken when handling the device
in order to prevent permanent damage.
3.1.2
Test Conditions
Table 3-2. Test conditions (unless otherwise stated), VCC = 3V, Tamb = 25 C
Parameters
Condition
Supply Voltage, VCC
(1)
Current Consumption: RX mode
(1)
PTX = 5 dBm
Current Consumption: TX mode
Current Consumption: Power-save mode
Note:
(1)
Range
Unit
1.8 to 3.6
15
mA
20
mA
µA
1. Preliminary data
Current consumption actually depends on multiple factors, including but not limited to, the board design
and materials, BitCloud settings, network activity, EEPROM read/write operations. It also depends on
MCU load and/or peripherals used by an application.
ZigBit™ 700/800/900 MHz Wireless Modules
3-3
8227C–MCU Wireless–06/09
Specifications
3.1.3
RF Characteristics
Table 3-3. RF Characteristics
Parameters
Condition
Frequency Band
Range
Unit
779 to 787
868 to 868.6
902 to 928
MHz
Number of Channels
15
Channel Spacing
MHz
-11 to +11
dBm
Transmitter Output Power
Receiver Sensitivity
AWGN channel, PER = 1%
(2)
20 kbit/s
-110
(2)
-108
40 kbit/s
PSDU length of 20 octets
(2)
-101
100 kbit/s
(2)
250 kbit/s
-100
200 kbit/s
-97
dBm
400 kbit/s
-90
PSDU length of 127 octets
500 kbit/s
-97
1000 kbit/s
-92
BPSK modulation
20 (at 868 MHz),
40 (at 915 MHz)
O-QPSK modulation
100 (at 868 MHz)
250 (at 915 MHz
and 784 MHz)
For balanced output
100
For balanced output
On-Air Data Rate
TX Output/ RX Input Nominal Impedance
Range, outdoors
Notes:
3.1.4
(1)
kbps
km
1. Preliminary data
2. IEEE 802.15.4-2006 compliant
ATmega1281V Microcontroller Characteristics
Table 3-4. ATmega1281V Characteristics
Parameters
Range
Unit
128
Kbytes
On-chip RAM size
Kbytes
On-chip EEPROM size
Kbytes
Operation Frequency
MHz
On-chip Flash Memory size
ZigBit™ 700/800/900 MHz Wireless Modules
Condition
3-4
8227C–MCU Wireless–06/09
Specifications
3.1.5
Module Interfaces characteristics
Table 3-5. Module Interfaces characteristics
Parameters
Condition
UART Maximum Baud Rate
ADC Resolution/ Conversion Time
In the single
conversion mode
ADC Input Resistance
ADC Input Voltage
I C Maximum Clock
-10/ 5 mA, VCC=3V
Real Time Oscillator Frequency
3.2
Unit
38.4
kbps
10/200
Bits/µs
>1
ADC Reference Voltage (VREF)
GPIO Output Voltage (High/Low)
Range
1.0 to VCC - 3
0 - VREF
222
kHz
2.3/ 0.5
32.768
kHz
Physical/Environmental Characteristics and Outline
Parameters
Size
Operating Temperature Range
Operating Relative Humidity Range
Note:
Value
Comments
18.8 x 13.5 x 2.0 mm
ATZB-900-B0
-20 C to +70 C
-40 C to +85 C operational(1)
no more than 80%
1. Minor degration of clock stability may occur.
Figure 3-1.
ATZB-900-B0 Mechanical drawing
ZigBit™ 700/800/900 MHz Wireless Modules
3-5
8227C–MCU Wireless–06/09
Specifications
3.3
Pin Configuration
Figure 3-2.
ATZB-900-B0 Pinout
Table 3-6. Pin descriptions
Connector
Pin
Pin Name
Description
I/O
SPI_CLK
SPI_MISO
Reserved for stack operation(4)
I/O
SPI_MOSI
Reserved for stack operation(4)
I/O
GPIO0
GPIO1
GPIO2
OSC32K_OUT
Reserved for stack operation
(4)
Default
State after
Power on
General Purpose digital Input/Output 0
(2)(3)(4)(7)
I/O
tri-state
General Purpose digital Input/Output 1
(2)(3)(4)(7)
I/O
tri-state
General Purpose digital Input/Output 2
(2)(3)(4)(7)
I/O
tri-state
32.768 kHz clock output(4)(5)
RESET
9,22,23
DGND
Digital Ground
10
CPU_CLK
RF clock output. When module is in active state,
4 MHz signal is present on this line. While module
is in the sleeping state, clock generation is also
stopped(4).
11
I2C_CLK
I2C serial clock output(2)(3)(4)(7)
tri-state
I/O
tri-state
tri-state
12
I2C_DATA
Reset input (active low)
(4)
(2)(3)(4)(7)
I C serial clock input/output
13
UART_TXD
14
UART_RXD
UART receive input(1)(2)(3)(4)(7)
tri-state
15
UART_RTS
RTS input (Request To send) for UART hardware
flow control. Active low(2)(3)(4)(7)
tri-state
ZigBit™ 700/800/900 MHz Wireless Modules
UART transmit output
(1)(2)(3)(4)(7)
3-6
8227C–MCU Wireless–06/09
Specifications
Table 3-6. Pin descriptions (Continued)
Connector
Pin
Pin Name
Description
I/O
Default
State after
Power on
16
UART_CTS
CTS output (Clear To send) for UART hardware
flow control. Active low(2)(3)(4)(7)
tri-state
17
GPIO6
General Purpose digital Input/Output 6(2)(3)(4)(7)
I/O
tri-state
GPIO7
(2)(3)(4)(7)
I/O
tri-state
(2)(3)(4)(7)
18
General Purpose digital Input/Output 7
19
GPIO3
General Purpose digital Input/Output 3
I/O
tri-state
20
GPIO4
General Purpose digital Input/Output 4(2)(3)(4)(7)
I/O
tri-state
GPIO5
(2)(3)(4)(7)
General Purpose digital Input/Output 5
I/O
tri-state
24,25
D_VCC
(9)
26
JTAG_TMS
21
27
28
29
JTAG_TDI
JTAG_TDO
JTAG_TCK
Digital Supply Voltage (VCC)
JTAG Test Mode Select(2)(3)(4)(6)
(2)(3)(4)(6)
JTAG Test Data Input
JTAG Test Data Output
JTAG Test Clock
(2)(3)(4)(6)
(2)(3)(4)(6)
(2)(3)(7)
tri-state
30
ADC_INPUT_3
ADC Input Channel 3
31
ADC_INPUT_2
ADC Input Channel 2(2)(3)(7)
tri-state
32
ADC_INPUT_1
ADC Input Channel 1(2)(3)(7)
tri-state
33
BAT
ADC Input Channel 0, used for battery level
measurement. This pin equals VCC/3.(2)(3)(7)
tri-state
34
A_VREF
Input/Output reference voltage for ADC
I/O
tri-state
35
AGND
Analog ground
36
GPIO_1WR
1-wire interface(2)(3)(4)(7)
I/O
37
UART_DTR
DTR input (Data Terminal Ready) for UART.
Active low(2)(3)(4)(7)
tri-state
38
USART0_RXD
USART/SPI Receive pin(2)(3)(4)(7)
tri-state
USART0_TXD
(2)(3)(4)(7)
tri-state
I/O
tri-state
39
USART /SPI Transmit pin
40
USART0_EXTCLK
41
GPIO8
General Purpose Digital Input/Output 8(2)(3)(4)(7)
I/O
tri-state
42
IRQ_7
Digital Input Interrupt request 7(2)(3)(4)(7)
tri-state
43
IRQ_6
(2)(3)(4)(7)
tri-state
44,46,48
RF GND
RF Analog Ground
45
RFP_IO
Differential RF Input/Output
I/O
47
RFN_IO
Differential RF Input/Output
I/O
Notes:
USART/SPI External Clock
(2)(3)(4)(7)
Digital Input Interrupt request 6
1. The UART_TXD pin is intended for input (i.e. its designation as "TXD" implies some complex system
containing ZigBit 900 as its RF terminal unit), while UART_RXD pin, vice versa, is for output.
2. Most of pins can be configured for general purpose I/O or for some alternate functions as described in
details in the ATmega1281V Datasheet [1].
3. GPIO pins can be programmed either for output, or for input with/without pull-up resistors. Output pin
drivers are strong enough to drive LED displays directly (refer to figures on pages 387-388, [1]).
4. All digital pins are provided with protection diodes to D_VCC and DGND
ZigBit™ 700/800/900 MHz Wireless Modules
3-7
8227C–MCU Wireless–06/09
Specifications
5. It is strongly recommended to avoid assigning an alternate function for OSC32K_OUT pin because it is
used by BitCloud. However, this signal can be used if another peripheral or host processor requires
32.768 kHz clock, otherwise this pin can be disconnected.
6. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging and
flash burning. They can be used for A/D conversion if JTAGEN fuse is disabled.
7. The following pins can be configured with the BitCloud software to be general-purpose I/O lines:
GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO_1WR, I2C_CLK,
I2C_DATA, UART_TXD, UART_RXD, UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2,
ADC_INPUT_1, BAT, UART_DTR, USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6.
Additionally, four JTAG lines can be programmed with software as GPIO as well, but this requires
changing the fuse bits and will disable JTAG debugging.
8. With BitCloud, CTS pin can be configured to indicate sleep/active condition of the module thus providing mechanism for power management of host processor. If this function is necessary, connection of
this pin to external pull-down resistor is recommended to prevent the undesirable transients during
module reset process.
9. Using ferrite bead and 1 µF capacitor located closely to the power supply pin is recommended, as
shown below.
10. In SPI mode, USART0_EXTCLK is output. In USART mode, this pin can be configured as either input or
output pin.
ZigBit™ 700/800/900 MHz Wireless Modules
3-8
8227C–MCU Wireless–06/09
Specifications
Figure 3-3.
3.4
Typical Reference Schematic
Mounting Information
The below diagrams show the PCB layout recommended for ZigBit 900 module. Neither via-holes nor
wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,
RF_GND pins should be grounded via several holes to be located right next to the pins thus minimizing
inductance and preventing both mismatch and losses.
ZigBit™ 700/800/900 MHz Wireless Modules
3-9
8227C–MCU Wireless–06/09
Specifications
Figure 3-4.
3.5
ATZB-900-B0 PCB Recommended Layout, Top View
Soldering Profile
The J-STD-020C-compliant soldering profile is recommended, as given below.
Table 3-7. Soldering Profile(1)
Profile Feature
Average ramp-up rate (217 °C to peak)
3 °C/s max.
Preheat temperature 175 °C ± 25 °C
180 s max.
Temperature maintained above 217 °C
60 s to 150 s
Time within 5 °C of actual peak temperature
20 s to 40 s
Peak temperature range
6 °C/s max.
Ramp-down rate
Note:
3.6
Green Package
8 minutes max.
1. The package is backward compatible with Pb/Sn soldering profile
Antenna Reference Design
This section presents PCB design which may be used to combine ZigBit 900 with an external antenna
This antenna reference designs is recommended for successful design-in.
ZigBit™ 700/800/900 MHz Wireless Modules
3-10
8227C–MCU Wireless–06/09
Specifications
Figure 3-5.
FCC/CE compliant RF reference design with RP-SMA connector recommended for ATZB-900-B0
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors
are the board material and thickness, shields, the material used for enclosure, the board neighborhood,
and other components adjacent to antenna.
3.6.1
General recommendations
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
Placing high profile components next to antenna should be avoided.
Having holes punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
ZigBit 900 module should not be placed next to the consumer electronics which might interfere with
ZigBit 900's RF frequency band.
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate,
which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes must be
placed around the board's edges.
The external antenna used for this product must provide a separation distance of at least 20 cm from all persons
and must not be co located or operating in conjunction with any other antenna or transmitter.
ZigBit™ 700/800/900 MHz Wireless Modules
3-11
8227C–MCU Wireless–06/09
Section 4
Ordering Information
4.1
Ordering Information
Part Number
Description
ATZB-900-B0R(1)
783/868/915 MHz IEEE802.15.4/ZigBee Wireless Module w/ Balanced RF Port
Note:
1. Tape and Reel quantity: 200
Section 5
Agency Certifications
5.1 UNITED STATES (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an OEM
manufacturer must comply with the following regulations:
1. The modular transmitter must be labelled with its own FCC ID number, and, if the FCC ID is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must also display a label referring to
the enclosed module. This exterior label can use wording such as the following:
Contains FCC ID: VW4A090666
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may
not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause
undesired operation.
Any similar wording that expresses the same meaning may be used.
2. To be used with the ATZB 900 B0 module, the external antennas have been tested and approved which are specified in here
below. The ATZB 900 B0 Module may be integrated with other custom design antennas which OEM installer must authorize following
the FCC 15.21 requirements. If there are major deviations on the custom design antenna, then the product which carries the
ATZB 900 B0 module has to be recertified by the OEM of the end product.
WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own
FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below.
If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment
is installed must also display a label referring to the enclosed equipment.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation (FCC 15.19).
The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons
and must not be co located or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is
approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions
(FCC 2.1093) requires separate equipment authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own expense (FCC section 15.105).
ZigBit™ 700/800/900 MHz Wireless Modules
4-12
8227C–MCU Wireless–06/09
5.2. EUROPEAN UNION (ETSI)
The
ATZB 900 B0 Modules has been certified
for use in European Union countries. If the ATZB 900 B0 Modules are incorporated into
Headquarters
International
a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and low voltage/safety
standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the
Atmel Japan
Atmel Europe
Atmel Asia
Atmel Corporation
R&TTE Directive.
9F, Tonetsu Shinkawa Bldg.
Le Krebs
Unit 1-5 & 16, 19/F
2325 Orchard Parkway
1-24-8 Shinkawa
8, Rue Jean-Pierre Timbaud
BEA Tower, Millennium City 5
San Jose, CA 95131
Furthermore,
the manufacturer must maintain
a copy of the ATZB 900 B0
Modules documentation and ensure
the final product does
Chuo-ku, Tokyo 104-0033
BP 309
418 Kwun Tong Road
USA
not
exceed
the
specified
power
ratings,
antenna
specifications,
and/or
installation
requirements
as
specified
in
the
user manual. If any
Japan
78054 Saint-Quentin-enKwun Tong, Kowloon
Tel: 1(408) 441-0311
of
these specifications are exceeded inHong
the final
product, a submission must
be made to a notified body for
compliance testing to all
Tel: (81) 3-3523-3551
Yvelines Cedex
Kong
Fax: 1(408) 487-2600
required standards.
Fax: (81) 3-3523-7581
France
Tel: (852) 2245-6100
Tel: (33) 1-30-60-70-00
Fax: (852) 2722-1369
IMPORTANT: The 'CE' marking must be affixed to a visible location on the
OEM product. The CE mark shall consist of the initials
Fax: (33) 1-30-60-71-11
"CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
Product Contact
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT
AND OF THE COUNCIL" on 9 March 1999 at section 12.
Web Site
www.atmel.com
Technical Support
avr@atmel.com
Sales Contact
www.atmel.com/contacts
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
© 2009 Atmel Corporation. All rights reserved. Atmel ®, Atmel logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
8227C–MCU Wireless–06/09

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Author                          : saravana.kumar
Modify Date                     : 2011:04:27 10:51:29+05:30
Create Date                     : 2011:04:25 20:53:11+05:30
Page Count                      : 20
XMP Toolkit                     : XMP Core 4.1.1
Creator Tool                    : PScript5.dll Version 5.2.2
Format                          : application/pdf
Title                           : doc8227.pdf
Creator                         : saravana.kumar
Document ID                     : uuid:33aac4dc-6d2f-458b-9795-0143cf1b75e3
Instance ID                     : uuid:b2d56aec-4985-4f57-97d3-9f760a0d07a6
Producer                        : PDF-XChange Viewer [Version: 2.0 (Build 52.0) (Jun  7 2010; 19:37:04)]

EXIF Metadata provided by EXIF.tools