Microchip Technology A092074 ATZB-S1-256-3-0-U 2.4GHz ZigBit with ATmega256RFR2 and UFL connector User Manual Manual
Atmel Norway AS ATZB-S1-256-3-0-U 2.4GHz ZigBit with ATmega256RFR2 and UFL connector Manual
Manual
ZigBit 2.4GHz Single chip Wireless Module
ATZB-S1-256-3-0-U
DATASHEET
Features
Ultra compact size (30.0 × 20.0 mm)
High RX sensitivity (-98 dBm)
Outperforming link budget (up to 102 dB)
Up to +4dBm output power
Very low power consumption:
17 mA in RX mode (1)
16.4 mA in TX mode (1)
0.6 µA in sleep mode (2)
Ample memory resources (256K Bytes In-System, Self-Programmable Flash
memory, 8K Bytes EEPROM, 32K Bytes SRAM)
Wide range of interfaces (both analog and digital)
4- wire SPI, TWI
ISP, JTAG
2 Analog comparator Input
UART, USART
Timer, PWM
4 ADC lines
External Clock Input, Internal Clock Output
Upto 31 lines configurable as GPIO
Preassigned Atmel MAC address that can be used on end product
Capability to use MAC address into the internal EEPROM
IEEE® 802.15.4 compliant Transceiver
2.4GHz ISM band
Serial bootloader
High Performance Low power AVR 8-bit Microcontroller
U.FL Antenna Connector to select approved antennae upto 5dBi
Small physical footprint and low profile for optimum fit in very small application
boards
Mesh networking capability
Easy-to-use low cost development kit
Single source of support for HW and SW
Worldwide license-free operation
Note: 1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),
PHY_TX_PWR=0x0 (for TX current), All digital outputs pulled high.
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Note: 2. Controller Sleep Mode – SLEEP_MODE_PWR_DOWN
Table of Contents
1. Introduction ........................................................................................ 3
1.1 Summary ........................................................................................................... 3
1.2 Abbreviations and Acronyms ............................................................................ 3
1.3 Related Documents ........................................................................................... 4
2. ZigBit Module Overview ..................................................................... 5
2.1 Overview ........................................................................................................... 5
3. Specifications ..................................................................................... 7
3.1 Electrical Characteristics ................................................................................... 7
3.1.1 Absolute Maximum Ratings ................................................................ 7
3.1.2 Power Supply ...................................................................................... 7
3.2 RF Characteristics ............................................................................................. 8
3.2.2 Microcontroller Characteristics ............................................................ 8
3.2.3 Module Interfaces Characteristics ....................................................... 9
3.3 Physical/Environmental Characteristics and Outline ......................................... 9
3.4 Pin Configuration ............................................................................................... 9
3.5 Mounting Information ...................................................................................... 11
3.6 List of Approved Antennas .............................................................................. 12
3.7 Soldering Profile .............................................................................................. 12
4. Schematics ...................................................................................... 13
4.1 Handling Instructions ....................................................................................... 14
4.2 General Recommendations ............................................................................ 14
5. Persistence Memory ........................................................................ 14
6. Ordering Information ........................................................................ 16
7. Agency Certifications ....................................................................... 17
7.1 United States (FCC) ........................................................................................ 17
7.2 European Union (ETSI) ................................................................................... 17
7.3 Industry Canada (IC) Compliance statements ................................................ 18
8. Revision History ............................................................................... 19
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1. Introduction
1.1 Summary
ATZB-S1-256-3-0-U ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from
Atmel®. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATmega256RFR2
SoC with the AVR 8-Bit Microcontroller and a high data rate transceiver for the 2.4GHz ISM band. The radio transceiver
provides high data rates from 250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit
output power enabling a very robust wireless communication. The module is designed for wireless sensing, monitoring,
control, data acquisition applications, to name a few. This ZigBit module eliminates the need for costly and time-
consuming RF development, and shortens time-to-market for wireless applications.
The module has an U.FL RF connector that can be used to connect any of the approved antenna – cable assembly.
This give freedom to applications to choose the external antenna1 that can be mounted on an end product.
The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing
mesh network, while optimizing network traffic and minimizing power consumption.
For detailed Software support information, please visit www.atmel.com/wireless
The applications include, but are not limited to:
Building automation & monitoring
o Lighting controls
o Wireless smoke- and CO-detectors
o Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
o Machinery condition and performance monitoring
o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.
Automated meter reading (AMR)
1.2 Abbreviations and Acronyms
ADC Analog-to-Digital Converter
API Application Programming Interface
DC Direct Current
DTR Data Terminal Ready
EEPROM Electrically Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
GPIO General Purpose Input/Output
HAF High Frequency
HVAC Heating, Ventilating, and Air Conditioning
Notes: 1. External antenna must be selected from a list of approved antennae.
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HW Hardware
I2C Inter-Integrated Circuit
IEEE Institute of Electrical and Electronics Engineers
IRQ Interrupt Request
ISM Industrial, Scientific and Medical radio band
JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
MAC Medium Access Control layer
MCU Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit
module
NRE Network layer
OEM Original Equipment Manufacturer
OTA Over-The-Air upgrade
PA Power Amplifier
PCB Printed Circuit Board
PER Package Error Ratio
RAM Random Access Memory
RF Radio Frequency
RTS/CTS Request to Send/ Clear to Send
RX Receiver
SMA Surface Mount Assembly
SoC System on Chip
SPI Serial Peripheral Interface
SW Software
TTM Time-To-Market
TX Transmitter
UART Universal Asynchronous Receiver/Transmitter
USART Universal Synchronous/Asynchronous Receiver/Transmitter
USB Universal Serial Bus
ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications
802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
1.3 Related Documents
[1] ATmegaAllRFR2 8-bit AVR Microcontroller with 2.4GHz Transceiver for ZigBee and IEEE 802.15.4
[2] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[3] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
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2. ZigBit Module Overview
2.1 Overview
The ATZB-S1-256-3-0-U ZigBit is an ultra compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module.
Based on a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and
Atmel Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low
power consumption and exceptional ease of integration.
Figure 2-1. ATZB-S1-256-3-0-U Block Diagram.
This ZigBit module contains the Atmel ATmega256RFR2 Microcontroller and a 2.4GHz ISM band Transceiver for
ZigBee and IEEE 802.15.4 [1]. The module features 256KB In-System Self-Programmable flash memory, 32KB SRAM
and 8KB EEPROM.
The compact all-in-one integration of MCU and Radio Transceiver inside the chip along with very minimal components
on the RF path to Antenna dramatically improves the ZigBit's compact size, range performance on signal transmission
and increases its sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop
applications on smaller footprint.
ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module
can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module
Evaluation kit containing the ZigBit Extension board for the Atmel Xplained PRO HW Evaluation platform can be used to
develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU
solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the
HW/FW design, prototyping, and mass production phases of product development.
All ZigBits are preloaded with a Bootloader when they are sold as Modules, either in Single units or T&R.
Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would
function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.
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The MAC stack running on the host processor can then control data transmission and manages module peripherals.
Thus very minimal firmware customization is required for a successful module design-in. Third-party sensors can then
be connected directly to the module, thus expanding the existing set of peripheral interfaces.
Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the
device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy
a MAC address separately for the product using the ZigBit.
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3. Specifications
3.1 Electrical Characteristics
3.1.1 Absolute Maximum Ratings
Table 3-1. Absolute maximum ratings (1)(2).
Parameter
Minimum
Maximum
Voltage on any pin, except RESET with respect to ground
-0.3V
3.6V (VDD max)
Input RF level
+14dBm
Voltage on any Analog configured pin
-0.3V
2.0V
Voltage on Aref (pin 24)
-0.3V
2.0V
1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no circumstances must the absolute
maximum ratings given in this table be violated. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent
damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated in the operational
sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
2. Attention! The ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to prevent permanent
damage.
3.1.2 Power Supply
Table 3-2. Test conditions (unless otherwise stated), F = 2.45GHz, VDD = 3V, Tamb = 25°C.
Parameter
Range
Unit
Supply voltage, VDD
1.8 to 3.6
V
Active Current consumption: RX mode - RX_ON – Listening state
17.0
mA
Active Current consumption: TX mode (1) – BUSY_TX – Transmit state
16.3
mA
Active Current consumption: TX mode – PLL_ON
9.9
mA
Active Current consumption: TRX_OFF
4.7
mA
Sleep Current consumption: Power-save mode (2)
0.62
µA
Sleep Current consumption: Power-down mode (2)
0.6
µA
Sleep Current consumption: Standby (2)
2.4
mA
Sleep Current consumption: Idle (2)
4.9
mA
Sleep Current consumption: Ext_Standby (2)
0.9
mA
Note 1:
a) Output TX power (when measuring consumption in TX mode) is +3 dBm.
Note 2:
a) All interfaces are set to the default state (see Pin Assignment Table).
b) JTAG is not connected.
c) CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down modes
Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol
settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an
application.
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3.2 RF Characteristics
Table 3-3. RF characteristics.
Parameter
Condition
Range
Unit
Frequency band
2.4000 to 2.4835
GHz
Numbers of channels
16
Channel spacing
5
MHz
Transmitter output power
Adjusted in 16 steps
-16.5 to +3.5
dBm
Receiver sensitivity
PER = 1%
-97
dBm
On-air data rate
250, upto 2000
kbps
TX output/ RX input nominal impedance
Unbalanced
50
Ω
Table 3-4. TX power settings
PHY_TX_PWR 3:0
Register value
Power register setting [dBm]
Output power [dBm] (at RF connector)
0
+3.5
+3.79
1
+3.3
+3.40
2
+2.8
+3.41
3
+2.3
+2.43
4
+1.8
+2.41
5
+1.2
+1.21
6
+0.5
+0.58
7
-0.5
-0.11
8
-1.5
-1.02
9
-2.5
-1.97
10
-3.5
-3.12
11
-4.5
-4.48
12
-6.5
-6.28
13
-8.5
-8.52
14
-11.5
-11.64
15
-16.5
-16.26
3.2.2 Microcontroller Characteristics
Table 3-5. ATmega256RFR2 characteristics.
Parameters
Condition
Range
Unit
On-chip flah memory size
256K
Bytes
On-chip SRAM size
32K
Bytes
On-chip EEPROM size
8K
Bytes
Operation frequency
16
MHz
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3.2.3 Module Interfaces Characteristics
Table 3-6. Module interfaces characteristics.
Parameters
Condition
Range
Unit
UART maximum baud rate
115.2
Kbps
ADC resolution conversion time
Free running conversion
3 - 240
µs
ADC input resistance
Static load resistor of
input signal
100
MΩ
ADC reference voltage (VREF)
AVDD=1.8V
1.5V to AVDD
V
ADC input voltage
AVDD=1.8V
0 - AVDD
V
TWI maximum clock
400
kHz
GPIO High level input voltage
Except nRST
Min 0.7 VDD
V
GPIO Low level input voltage
Except nRST
Max 0.3 VDD
V
GPIO High level input voltage
nRST
Min 0.9 VDD
V
GPIO Low level input voltage
nRST
Max 0.1 VDD
V
GPIO High level output voltage VOH
IOH = -12mA, VDD = 3.6V
IOH = -6mA, VDD = 1.8V
Min VDD – 0.4
V
GPIO Low level output voltage VOL
IOL = 16mA, VDD = 3.6V
IOL = 10mA, VDD = 1.8V
Max 0.4
V
Real-time oscillator frequency
32.768
kHz
3.3 Physical/Environmental Characteristics and Outline
Table 3-7. Physical characteristics.
Parameters
Value
Comments
Size
30.0 x 20.0 mm
Operating temperature range
-40°C to +85°C
-40°C to +85°C operational
3.4 Pin Configuration
Table 3-8. ATZB-S1-256-3-0-U Pinout description
Pinout
Pin descriptions
Function
1
AVSS
Analog Ground
2
AVSS
Analog Ground
3
DEVDD
Digital Power input pin
4
DEVDD
Digital Power input pin
5
RSTN
RESET
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Pinout
Pin descriptions
Function
6
PB0/SSN/PCINT0
SPI
7
PB2/MOSI/PDI/PCINT2
SPI/ ISP Prog
8
PB3/MISO/PDO/PCINT3
SPI/ ISP Prog
9
PB1/SCK/PCINT1
SPI/ ISP Prog
10
PE2/AINO
GPIO/AINO
11
PE3/AIN1/OC3A
GPIO/AIN1/PWM out
12
DVSS
Digital Ground
13
PD2/RXD1/INT2
UART
14
PD3/TXD1/INT3
UART
15
PD5/XCK1
USART
16
PD4/ICP1
TIMER counter input trigger
17
PD6/T1
TC
18
PG2/AMR
GPIO/TC
19
PB4/OC2A/PCINT4
PWM/PCINT4
20
PB6/OC1B/PCINT6
PWM/PCINT6
21
PB7/OC0A/OC1C/PCINT7
PWM/PCINT/GPIO
22
PE0:RXD0:PCINT8
GPIO/PCINT8/RXD0
23
PE1:TXD0
GPIO/TXD0
24
AREF
Adc ref
25
PF0/ADC0
ADC/ GPIO
26
PF1/ADC1
ADC/ GPIO
27
PF2/ADC2/DIG2
ADC/ GPIO
28
PF3/ADC3/DIG4
ADC/ GPIO
29
DVSS
Digital Ground
30
PF4/ADC4/TCK
JTAG
31
PF5/ADC5/TMS
JTAG
32
PF6/ADC6/TDO
JTAG
33
PF7/ADC7/TDI
JTAG
34
PG5/OC0B
pwm output timer
35
PE4/OC3B/INT4
Wakeup INT
36
PD0/SCL/INT0
TWI/INT/GPIO
37
PD1/SDA/INT1
TWI/INT/GPIO
38
CLKI
Ext CLKI/ ISP Programming
39
PE7/ICP3/INT7/CLKO
Clock out put
40
PD7/T0
TC
41
DVSS
Digital Ground
42
DVSS
Digital Ground
NOTE: TXD, RXD of UART are crossed inside ZigBit Module. External UART devices connecting to ZigBit Module should follow straight
connection for UART:
UART_TXD_external_device <-> UART_TXD
UART_RXD_external_device <-> UART_RXD
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3.5 Mounting Information
The Figure below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on
the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded
via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
Figure 3-1. ATZB-S1-256-3-0-U Dimensions
Figure 3-2. ATZB-S1-256-3-0-U Pinout
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Figure 3-3. ATZB-S1-256-3-0-U Foot Print Dimensions
Figure 3-4. ATZB-S1-256-3-0-U Mounting Information
3.6 List of Approved Antennas
The ATZB-S1-256-3-0-U Module has been tested and approved by Certification body to use any of the antenna listed
below or similar antenna with lesser gain
Description
Manufacturer Partnumber
Antenna gain
2.4GHz Miniature Pigtail Antenna from RF
Solutions
ANT-24G-S21-P5FL
odBi
2.4GHz 5dBi Rubber Antenna with pigtail cable
(Flying Lead) from Tekfun
M07-FL
5dBi
3.7 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9. Soldering Profile(1).
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max
Preheat temperature 175°C ±25°C
180s max
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max
Time within 25°C to peak temperature
8 minutes
Note: 1. The package is backward compatible with PB/Sn soldering profile.
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4. Schematics
The following schematic drawings for the ATZB-S1-256-3-0-U are in the following order:
Top level schematics
Connector schematics
ATmega256RFR2 schematics
ATmega256RFR2 RF antenna schematics
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4.1 Handling Instructions
The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is
galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection
coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this
should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying
the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure
suitable Ingress Protection standards are complied with.
The UFL connector should never be exposed to Varnish / similar conformal coating material which will affect electrical
connection on the surfaces of connector.
4.2 General Recommendations
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning
Placing high profile components next to antenna should be avoided
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges
also distorting antenna pattern
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit's RF frequency
band
5. Persistence Memory
A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The
organization of the persistence memory is as follows:
Table 5-1. Persistence Memory
Data
Size
Structure Revision
2 bytes
MAC address(1)
8 bytes
Board information overall
49 bytes
Board information – PCBA Name
30 bytes
Board information – PCBA Serial number
10 bytes
Board information – PCBA Atmel Part Number
8 bytes
Board information – PCBA Revision
1 byte
Resereved
3 bytes
Xtal Calibration Value
1 byte
Reserved
7 bytes
Reserved
4 bytes
CRC
1 byte
In ATZB-S1-256-3-0-U persistence memory is stored in the User Signature Data (Page 1) of Atmega256RFR2 SoC with
starting address 0x0100. User Signature Data is isolated from the main flash and will not be cleared by Chip erase
Command.
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Special commands are available to erase and write data to user signature pages via the JTAG interface (see section
on "Programming via the JTAG Interface" in Atmega256RFR2 datasheet [1] for details). User signature rows can
be read from software in the same way as the device and JTAG identifiers (see section "Reading the Signature Row
from Software" of Atmega256RFR2 datasheet[1]).
Note: 1 The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel.
User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The MAC ID
can be read from the ZigBit using the Performance Analyzer Application that can be downloaded from
www.atmel.com/wireless.
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6. Ordering Information
Part number
Description
ATZB-S1-256-3-0-U
2.4GHz IEEE802.15.4/ZigBee OEM module based on ATmega256RFR2 SoC with UFL Antenna
connector, Single unit
ATZB-S1-256-3-0-UR
2.4GHz IEEE802.15.4/ZigBee OEM module based on ATmega256RFR2 SoC with UFL Antenna
connector, tape and reel
Note: Tape and reel quantity: 200.
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7. Agency Certifications
7.1 United States (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an
OEM manufacturer must comply with the following regulations:
1. The ATZB-S1-256-3-0-U modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID
is not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. This exterior label can use
wording such as the following:
IMPORTANT: Contains FCC ID : VW4A092074. This equipment complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this
device must accept any interference received, including interference that may cause undesired operation (FCC
15.19).
The antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and
must not be colocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may
only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105).
7.2 European Union (ETSI)
The ATZB-S1-256-3-0-U Module has been certified for use in European Union countries. If these modules are
incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized
EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and
kept on file as described in Annex II of the R&TTE Directive.
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Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does
not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body
for compliance testing to all required standards.
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall
consist of the initials "CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the
apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.
7.3 Industry Canada (IC) Compliance statements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20 cm between the device and
the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le
dispositif et l'utilisateur ou des tiers
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end product
must be labelled in a visible area with the following:
“Contains Transmitter Module IC:11019A-092074”
OR
“Contains IC: 11019A-092074”
Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à
l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le
produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 11019A-092074”
OR
“Contains IC: 11019A-092074”
ATZB-S1-256-3-0-U ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
42199AWIRELESS10/2013
19
8. Revision History
Doc. Rev.
Date
Comments
42199A
10/2013
Initial revision.
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© 2013 Atmel Corporation. All rights reserved. / Rev.: 42199AWIRELESS10/2013
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