Microchip Technology BM77SPPSYC2A Bluetooth Module User Manual Manual
Microchip Technology Inc. Bluetooth Module Manual
Manual
Datasheet of Bluetooth
BM77SPPS5MC2 Module
ISSC Technologies Corp.
Revision History
Date Revision Content Version
2013/07/03 First Version 1.0
2013/07/09 Add descriptions in current consumption part 1.1
2013/08/20 Update UART baud rate information 1.2
2013/10/01 Update current consumption & Timing Sequence photo 1.3
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© 2000~2012 iSSC Technologies Corp.
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Content
1. Introduction ..................................................................................................................... 3
1.1. Major Components ................................................................................................................................ 3
1.2. Features ............................................................................................................................................... 3
1.3. Application ............................................................................................................................................ 3
2. Product Specification ..................................................................................................... 4
2.1. Chipset ................................................................................................................................................. 4
2.2. Interfaces .............................................................................................................................................. 4
3. Hardware Architecture .................................................................................................... 5
4. Compatibility Requirements ........................................................................................... 5
5. Environmental Requirements......................................................................................... 6
5.1. Temperature.......................................................................................................................................... 6
5.2. Humidity................................................................................................................................................ 6
Appendix A: Dimension and Foot Print ................................................................................... 7
Appendix B: Product Image ...................................................................................................... 7
Appendix C: Reflow Profile ....................................................................................................... 7
Appendix D: Label Information ................................................................................................. 8
Appendix E: Reversion History ................................................................................................ 9
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© 2000~2012 iSSC Technologies Corp.
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1. Introduction
Part Name: ISSC BM77SPPS5MC2 Bluetooth module
Part Number: BM77SPPS5MC2-xxxxxx
The ISSC BM77SPPS5MC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for
iPad logos) and Bluetooth standard SPP/ BLE electronic accessories via Bluetooth connectivity. It is available in the
2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0/ 4.0 + EDR.
ISSC IS1677NM single chip solution combines transceiver and baseband function to decrease the external
components. It narrows down the module size and minimizes its cost.
The optimized power design minimize power consumption to keep low battery and the module is integrated with
shielding case and 2.4GHz RF Chip antenna. It has passed the Bluetooth SIG and FCC Part 15 certification.
1.1. Major Components
- ISSC IS1677NM (40 pin QFN, single-chip Bluetooth transceiver and baseband processor)
- Serial EEPROM 8K (1024*8) TSSOP 8P
1.2. Features
- Bluetooth 3.0/ 4.0+ EDR compliant
- Low power 1.8V RF operation
- RF transmitter output power Class 2
- RF receiver GFSK typical -90dBm, π/4 PSK typical -90dBm, 8DPSK typical -83dBm, BLE typical -92dBm
- Internal ROM and 4Mibts of flash
- I2C for external EEPROM and authentication chip (to enable functionality between your electronic accessory and
the iPod, iPhone and iPad)
- 1 LED driver
1.3. Application
- GPS
- Printers
- Electric Scale
- Blood Pressure Monitors
- Bar code Scanner
- Industrial Applications (CNC, PLC, RFID)
- Embedded systems
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© 2000~2012 iSSC Technologies Corp.
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2. Product Specification
2.1. Chipset
6x6 mm2 40 pin QFN IS1677NM
2.2. Interfaces
- Multi function GPIO interface
- Bluetooth RF interface
- UART up to 921600 bps
- I2C for external EEPROM and authentication chip
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© 2000~2012 iSSC Technologies Corp.
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3. Hardware Architecture
Block Diagram
Power Tree
4. Compatibility Requirements
The BM77SPPS5MC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility
and reliability, and software compatibility test.
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© 2000~2012 iSSC Technologies Corp.
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5. Environmental Requirements
5.1. Temperature
Conditions Operating Temperature
Non-Operating Temperature
Minimum -10 ℃ -40℃
Maximum +70 ℃ +85 ℃
5.2. Humidity
Conditions Operating Humidity Non-Operating Humidity
Minimum 10% 5%
Maximum 90% 95%
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© 2000~2012 iSSC Technologies Corp.
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Appendix A: Dimension and Foot Print
1. Dimension
- Dimension: 22 mm* 12 mm* 1.86 mm (Length* Width* Height)
- Tolerance: +/- 0.25 mm
2. Suggested Load Board Foot Print
Appendix B: Product Image
Appendix C: Reflow Profile
1.) Follow: IPC/JEDEC J-STD-020 C
2.) Condition:
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© 2000~2012 iSSC Technologies Corp.
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Average ramp-up rate (217℃ to peak): 1~2℃/sec max.
Preheat：150~200C、60~180 seconds
Temperature maintained above 217℃ : 60~150 seconds
Time within 5℃ of actual peak temperature: 20 ~ 40 sec.
Peak temperature：250+0/-5℃ or 260+0/-5℃
Ramp-down rate : 3℃/sec. max.
Time 25℃ to peak temperature : 8 minutes max.
Cycle interval：5 minus
Slope: 1~2℃/ sec max.
(217℃ to peak)
217℃
Peak: 250+0/-5℃
Or 260+0/-5℃
Ramp down rate:
Max. 3℃/sec.
20~40 sec.
60~150 sec.60~180 sec.
25℃
Preheat: 150~200℃
Time (sec)
Appendix D: Label Information
FCC Label Instructions:
The outside of final products that contains this module device must display a label referring to the enclosed module.
This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID:
A8TBM77SPPSYC2A ” or “Contains FCC ID: A8TBM77SPPSYC2A.” Any similar wording that expresses the same
meaning may be used.
Changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
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© 2000~2012 iSSC Technologies Corp.
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Appendix E: Reversion History
Version
Date History
0.2 2012/8/15 Modified support baud rate
0.3 2012/10/31 Modified the values of Calibration LDO18
Fixed for module schematic
0.4 2013/01/30 Modified Figure Error in page_15
1.0 2013/07/03 First Version
1.1 2013/07/09 Add descriptions in current consumption part
1.2 2013/08/20 Update UART Baud rate information
1.3 2013/10/01 Update current consumption & Timing Sequence photo