Microchip Technology BM8NSPXSYC2A Bluetooth Module User Manual Manual
Microchip Technology Inc. Bluetooth Module Manual
Manual
Datasheet of Bluetooth
BM87SPPS5MC2 Module
ISSC Technologies Corp.
Revision History
Date Revision Content Version
2013/09/05 The first version 0.9
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© 2000~2013 ISSC Technologies Corp.
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Content
1. Introduction ...................................................................................................................... 3
1.1. Major Components ................................................................................................................................. 3
1.2. Features ................................................................................................................................................. 3
1.3. Application ............................................................................................................................................. 3
2. Product Specification ...................................................................................................... 4
2.1. Chipset ................................................................................................................................................... 4
2.2. Interfaces ............................................................................................................................................... 4
3. Hardware Architecture ..................................................................................................... 5
4. Compatibility Requirements ............................................................................................ 5
5. Environmental Requirements ......................................................................................... 6
5.1. Temperature ........................................................................................................................................... 6
5.2. Humidity ................................................................................................................................................. 6
Appendix A: Dimension and Foot Print ................................................................................... 7
Appendix B: Product Image ...................................................................................................... 7
Appendix C: Reflow Profile ....................................................................................................... 8
Appendix D: Label Information ................................................................................................. 8
Appendix E: Packaging Information ........................................................................................ 8
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1. Introduction
Part Name: ISSC BM87SPPS5MC2 Bluetooth module
Part Number: BM87SPPS5MC2-xxxxxx
The ISSC BM87SPPS5MC2 Bluetooth module is designed for both MFi (The Made for iPhone, iPad and iPod badge)
and Bluetooth SPP App-Enabled Accessories with audio solution. It is available in the 2.4GHz ISM band Class 2
Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR and has passed the Bluetooth SIG and FCC
Part 15 certification
ISSC IS1687SM single chip solution combines transceiver and baseband function to decrease the external
components. It narrows down the module size, minimizes its cost and the optimized power design minimize power
consumption to keep low battery.
To provide the best audio and voice quality, IS1687SM also integrates a DSP co-processor, a PLL, and a stereo
CODEC to handle voice and audio applications. For voice, not only basic A-law/μ-law/CVSD encoding /decoding but
also enhanced noise reduction and echo cancellation are implemented by the built-in DSP to reach the best quality
in the both sending and receiving sides. For enhanced audio applications, SBC or MP3 encoding/decoding functions
can be also carried out by DSP to satisfy A2DP requirements.
1.1. Major Components
- ISSC IS1687SM (7x7 mm2, 56 pin QFN, single-chip Bluetooth transceiver and baseband processor)
- 4M bits flash and 32K bits (24C32) EEPROM
1.2. Features
- Bluetooth 3.0 EDR compliant
- Profiles: HSP 1.0, HFP 1.5, A2DP 1.0, AVRCP 1.0, SPP 1.0
- Low power 1.8V RF operation
- RF transmitter output power Class 2
- RF receiver GFSK typical -90dBm, π/4 PSK typical -91dBm, 8DPSK typical -84dBm
- Internal ROM and 4Mibts of flash
- 36-MIPS DSP co-processor (32/24/16-bit fixed point core)
- I2C for external EEPROM and Apple CP (to accomplish certification and authorization flow in MFi App-Enabled
Accessories)
- 2 LED drivers
1.3. Application
- Stereo Headset
- Bluetooth Speakerphone
- Toys
- Gaming
- Health & Fitness
- Smart Watch/Feature Watch
- Wearable Accessories
- Conference/Education system
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© 2000~2013 ISSC Technologies Corp.
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Product Specification
1.4. Chipset
7x7 mm2 56 pin QFN IS1687SM
1.5. Interfaces
- Multi function GPIO interface
- Bluetooth RF interface
- UART up to 921600 bps
- I2C for external EEPROM and authentication chip
- UART interface for external peripherals control.
- Serial audio interface
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Hardware Architecture
Block Diagram
Power Tree
2. Compatibility Requirements
The BM87SPPS5MC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility
and reliability, and software compatibility test.
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3. Environmental Requirements
3.1. Temperature
Conditions Operating Temperature
Non-Operating Temperature
Minimum - 40 ℃ - 40℃
Maximum +85 ℃ +85 ℃
3.2. Humidity
Conditions Operating Humidity Non-Operating Humidity
Minimum 10% 5%
Maximum 90% 95%
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Appendix A: Dimension and Foot Print
1. Dimension & Foot Print
- Dimension: 25.7 mm* 14.3 mm* 1.86 mm (Length* Width* Height)
- Tolerance: +/- 0.25 mm
Appendix B: Product Image
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Appendix C: Reflow Profile
1.) Follow: IPC/JEDEC J-STD-020 C
2.) Condition:
Average ramp-up rate (217℃ to peak): 1~2℃/sec max.
Preheat：150~200C、60~180 seconds
Temperature maintained above 217℃ : 60~150 seconds
Time within 5℃ of actual peak temperature: 20 ~ 40 sec.
Peak temperature：250+0/-5℃ or 260+0/-5℃
Ramp-down rate : 3℃/sec. max.
Time 25℃ to peak temperature : 8 minutes max.
Cycle interval：5 minus
Slope: 1~2℃/ sec max.
(217℃ to peak)
217℃
Peak: 250+0/-5℃
Or 260+0/-5℃
Ramp down rate:
Max. 3℃/sec.
20~40 sec.
60~150 sec.60~180 sec.
25℃
Preheat: 150~200℃
Time (sec)
Appendix D: Label Information
FCC Label Instructions:
The outside of final products that contains this module device must display a label referring to the enclosed module.
This exterior label can use wording such as the following: “Contains Transmitter Module FCC
ID:A8TBM8NSPXSYC2A ” or “Contains FCC ID: A8TBM8NSPXSYC2A.” Any similar wording that expresses the
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same meaning may be used.
Changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
Appendix E: Packaging Information
TBA