MICROCHIP TECHNOLOGY MRF24J40MC Modular Data Transmitter User Manual manual

Microchip Technology Inc Modular Data Transmitter manual

manual

© 2011 Microchip Technology Inc. Preliminary DS00000AMRF24J40MC Data Sheet2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module with PA/LNA External Antenna Connector
DS00000A-page ii Preliminary © 2011 Microchip Technology Inc.Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.TrademarksThe Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.All other trademarks mentioned herein are property of their respective companies.© 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.ISBN: Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.• Microchip is willing to work with the customer who is concerned about the integrity of their code.• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 1MRF24J40MC Features:• IEEE Std. 802.15.4™ Compliant RF Transceiver• Supports ZigBee®, MiWi™ Development Environment Proprietary Wireless Networking Protocols• Small 0.9" x 1.3" (22.9 mm x 33.0 mm), Surface Mountable – Pin Compatible with MRF24J40MB• Integrated Crystal, Internal Voltage Regulator, Matching Circuitry, Power Amplifier, Low Noise Amplifier• External antenna connector: ultra miniature coaxial (U.FL), 50Ω• Easy Integration into Final Product – Minimize Product Development, Quicker Time to Market• Radio Regulation Certified for United States (FCC), Canada (IC), Europe (ETSI) and Australia/New Zealand (C-TICK)• Compatible with Microchip microcontroller families (PIC16F, PIC18F, PIC24F/H, dsPIC33 and PIC32)• Range up to 4000 ft. Operational:• Operating Voltage: 2.7V – 3.6V (3.3V typical)• Temperature Range: –40°C to +85°C Industrial• 4-Wire Serial Peripheral Interface (SPI)• Low-Current Consumption:- 25 mA (typical) in RX mode- 120 mA (typical) in TX mode-5 μA (typical) in Sleep mode RF/Analog Features: • ISM Band 2.405 GHz – 2.475 GHz Operation• Data Rate: 250 kbps• -108 dBm Typical Sensitivity with –23 dBm Maximum Input Level• +19 dBm Typical Output Power with 56 dB TX Power Control Range• Integrated Low Phase Noise VCO, Frequency Synthesizer and PLL Loop Filter• Digital VCO and Filter Calibration• Integrated RSSI ADC and I/Q DACs• Integrated LDO• High Receiver RSSI Dynamic RangeMAC/Baseband Features:• Hardware CSMA-CA Mechanism, Automatic ACK Response and FCS Check• Independent Beacon, Transmit and GTS FIFO• Supports all CCA modes and RSS/LQI• Automatic Packet Retransmit Capable• Hardware Security Engine (AES-128) with CTR, CCM and CBC-MAC modes• Supports Encryption and Decryption for MAC Sub layer and Upper LayerPin Diagram:2345617VINGND8910RESETWAKESDOSDISCKCSNCGNDINT1211 GND2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module with PA/LNA and External Antenna Connector
MRF24J40MC DS00000A-page 2 Preliminary © 2011 Microchip Technology Inc.Table of Contents1.0 Device Overview .......................................................................................................................................................................... 32.0 Circuit Description ...................................................................................................................................................................... 113.0 Regulatory Approval................................................................................................................................................................... 174.0 Electrical Characteristics ........................................................................................................................................................... 25Appendix A: Revision History............................................................................................................................................................... 27The Microchip Web Site ....................................................................................................................................................................... 29Customer Change Notification Service ................................................................................................................................................ 29Customer Support ................................................................................................................................................................................ 29Reader Response ................................................................................................................................................................................ 30Product Identification System............................................................................................................................................................... 31TO OUR VALUED CUSTOMERSIt is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback.Most Current Data SheetTo obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:http://www.microchip.comYou can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).ErrataAn errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.To determine if an errata sheet exists for a particular device, please check with one of the following:• Microchip’s Worldwide Web site; http://www.microchip.com• Your local Microchip sales office (see last page)When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using.Customer Notification SystemRegister on our web site at www.microchip.com to receive the most current information on all of our products.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 3MRF24J40MC 1.0 DEVICE OVERVIEWThe MRF24J40MC is a 2.4 GHz IEEE Std. 802.15.4™ compliant, surface mount module with integrated crystal, internal voltage regulator, matching circuitry, Power Amplifier (PA), Low Noise Amplifier (LNA) with 50Ω external antenna connector. The MRF24J40MC module operates in the non-licensed 2.4 GHz frequency band. The integrated module design frees the integrator from extensive RF and antenna design, and regulatory compliance testing, allowing quicker time to market.The MRF24J40MC module is compatible with Microchip’s ZigBee®, and MiWi™ Development Environment software stacks. The MiWi Development Environment software stack is available as a free download, including source code, from the Microchip web site: http://www.microchip.com/wireless.The MRF24J40MC module has received regulatory approvals for modular devices in the United States (FCC) and Canada (IC). Modular approval removes the need for expensive RF and antenna design, and allows the end user to place the MRF24J40MC module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter). To maintain conformance, refer to module settings in Section 3.1.1, MRF24J40MC SETTINGS for the United States and Section 3.2.1, MRF24J40MC SETTINGS for Canada. The MRF24J40MC module has been tested and conforms to ETS EN 300 328 V1.7.1 (2006-10) European Standards. The module tests can be applied toward final product certification and Declaration of Conformity (DoC). To maintain conformance, refer to module settings in Section , . Additional testing may be required depending on the end application.1.1 Interface DescriptionFigure 1-1 shows a simplified block diagram of the MRF24J40MC module. The module is based on the Microchip Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver IC. The module interfaces to many popular Microchip PIC® microcontrollers through a 4-wire SPI interface, interrupt, wake, reset, power and ground, as shown in Figure 1-2. Table 1-1 provides the pin descriptions.Serial communication and module configuration for the MRF24J40MC module are documented in the “MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver Data Sheet” (DS39776). Refer to the “MRF24J40 Data FIGURE 1-1: PIC18FXXXX BLOCK DIAGRAMTABLE 1-1: PIN DESCRIPTIONPin Symbol Type Description1 GND Ground Ground2 RESET DI Global hardware Reset pinLegend: Pin type abbreviation: D = Digital, I = Input, O = OutputAntennaU.FLPAPhysical MACInterfacePowerManagementSPI20 MHzCrystalDigitalI/OPowerPIC18FXXXX IEEE Std. 802.15.4™ ModuleMRF24J40LNAConnector
MRF24J40MC DS00000A-page 4 Preliminary © 2011 Microchip Technology Inc.FIGURE 1-2: MICROCONTROLLER TO MRF24J40MC INTERFACE3 WAKE DI External wake-up trigger4 INT DO Interrupt pin to microcontroller5 SDI DI Serial interface data input 6 SCK DI Serial interface clock7 SDO DO Serial interface data output from MRF24J408CS DI Serial interface enable9 NC — No connection10 VIN Power Power supply11 GND Ground Ground12 GND Ground GroundTABLE 1-1: PIN DESCRIPTIONPin Symbol Type DescriptionLegend: Pin type abbreviation: D = Digital, I = Input, O = OutputSDOI/OSDISCKINTXMRF24J40MCCSSDISDOSCKINTI/O WAKEVINGNDPIC® MCUI/O RESET
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 5MRF24J40MC 1.2 Mounting DetailsThe MRF24J40MC is a surface mountable module. Module dimensions are shown in Figure 1-3. The module Printed Circuit Board (PCB) is 0.032" thick with castellated mounting points on the edge. Figure 1-4 is a recommended host PCB footprint for the MRF24J40MC .The MRF24J40MC has 50Ω ultra miniature coaxial (U.FL) connector.FIGURE 1-3: MODULE DETAILS
MRF24J40MC DS00000A-page 6 Preliminary © 2011 Microchip Technology Inc.FIGURE 1-4: RECOMMENDED PCB FOOTPRINT
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 7MRF24J40MC 1.3 OperationThe MRF24J40MC module is based on the Microchip Technology MRF24J40 2.4 GHz IEEE 802.15.4 RF Transceiver IC. Serial communication and configuration are documented in the “MRF24J40 Data Sheet” (DS39776).This section emphasizes operational settings that are unique to the MRF24J40MC module design that must be followed for proper operation.1.3.1 PA/LNA CONTROLOperation of the PA U3 and LNA U2 is controlled by the MRF24J40 internal RF state machine through RF switches, U1 and U4, and the GPIO1 and GPIO2 pins on the MRF24J40. Figure 1-5 shows the PA/LNA block diagram. Figure 2-2 is the schematic diagram for the module.The internal RF state machine is configured for the PA/LNA mode by setting TESTMODE (0x22<2:0>) = 111. Pins GPIO1 and GPIO2 control the RF switches, PA and LNA automatically when the MRF24J40 receives and transmits data.Voltage regulator U5 supplies a regulated 2.2V to the PA. This provides a stable voltage to the PA over the VINvoltage range of the module. U5 is enabled or shutdown from GPIO3. Ensure that the GPIO3 direction has been set to output (TRISGP3 (0x34<3>) = 1). Setting a logic high (GPIO3 (0x33<3>) = 1) enables the voltage regulator and supplies voltage to the PA. Setting a logic low (GPIO3 (0x33<3>) = 0) will shutdown the voltage regulator, disabling the PA, and provides the lowest shutdown current.FIGURE 1-5: PA/LNA BLOCK DIAGRAMNote: A complete explanation of the operation of the PA/LNA control is documented in the “MRF24J40 Data Sheet” (DS39776), Section 4.2 “External PA/LNA Control”.MRF24J40GPIO1GPIO2U.FLConnectorBalunRFPRFNPAuPG2250T5NLNAPARF SwitchUPG2179TBRF SwitchUPG2179TBLNAuPC8233TKV2 V1 V2 V1GPIO3Voltage RegulatorTC1187VCT713VOUTSHDN50 ohm
MRF24J40MC DS00000A-page 8 Preliminary © 2011 Microchip Technology Inc.1.3.2 ENERGY DETECTION (ED)Before performing an energy detection (see Section 3.6.1 “RSSI Firmware Request (RSSI Mode 1)” in the “MRF24J40 Data Sheet” (DS39776)), perform the following steps:1. Configure the internal RF state machine to normal operation (TESTMODE (0x22F<2:0>) = 000).2. Configure GPIO2 and GPIO1 direction for output (TRISGP2 (0x34<2>) = 1 and TRISGP1 (0x34<1>) = 1).3. Set GPIO2 (0x33<2>) = 1 and GPIO1 (0x32<1>) = 0. This enables the LNA and disables the PA.4. Perform the energy detection following the steps in Section 3.6.1 “RSSI Firmware Request (RSSI Mode 1)” in the “MRF24J40 Data Sheet”(DS39776).1.3.3 SLEEPTo get the lowest power consumption from the MRF24J40MC module during Sleep, it is necessary to disable the PA, PA voltage regulator and LNA. To do this, perform the following steps:1. Configure the internal RF state machine to normal operation (TESTMODE (0x22F<2:0>) = 000).2. Configure the GPIO3, GPIO2 and GPIO1 direction for output (TRISGP3 (0x34<3>) = 1, TRISGP2 (0x34<2>) = 1 and TRISGP1 (0x34<1>) = 1).3. Set GPIO2 (0x33<2>) = 0 and GPIO1 (0x32<1>) = 0. This disables the LNA and the PA.4. Set GPIO3 (0x33<3>) = 0. This shuts down the voltage regulator U5 that supplies 2.2 volts to the PA.5. Put the MRF24J40 to Sleep following the steps in the “MRF24J40 Data Sheet” (DS39776).When waking the module, re-enable the PA/LNA mode.Note: The LNA will amplify the received signal. The RSSI value will include the receive signal strength plus the LNA amplification.
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 9MRF24J40MC 1.3.4 TRANSMIT POWER SETTINGSTable 1-2 lists the power settings in register RFCON3 (0x203<7:3>) and the output power at antenna connector J1.Note 1: Typical output power at antenna connector J1, Channel 11, 50Ω impedance.TABLE 1-2: TRANSMIT POWER SETTINGSRFCON3 (0x203<7:3>) MRF24J40 Power Setting Output Power(1) (dBm)11111 –36.3 –26.411110 –34.9 –25.211101 –33.7 –24.111100 –32.8 –23.411011 –31.9 –22.711010 –31.2 –22.411001 –30.5 –21.911000 –30.0 –21.610111 –26.3 –15.710110 –24.9 –14.510101 –23.7 –13.710100 –22.8 –12.910011 –21.9 –12.310010 –21.2 –11.810001 –20.5 –11.510000 –20.0 –11.101111 –16.3 –6.601110 –14.9 –5.501101 –13.7 –4.701100 –12.8 –4.001011 –11.9 –3.401010 –11.2 –2.901001 –10.5 –2.501000 –10.0 –2.000111 –6.3 10.700110 –4.9 18.000101 –3.7 18.5Note: Refer to Section 3.0, Regulatory Approval for the required maximum power setting necessary to maintain certification requirements for each country the module will be used.
MRF24J40MC DS00000A-page 10 Preliminary © 2011 Microchip Technology Inc.NOTES:
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 11MRF24J40MC 2.0 CIRCUIT DESCRIPTIONThe MRF24J40MC is a 2.4 GHz IEEE Std. 802.15.4™ compliant surface mount module with integrated crystal, internal voltage regulator, matching circuitry, power amplifier, low noise amplifier with 50Ω external antenna connector. The MRF24J40MC module interfaces to many popular Microchip PIC microcontrollers through a 4-wire SPI Interface, interrupt, wake, reset, power and ground. An example application schematic is illustrated in Figure 2-1.Serial communications and register definitions for the MRF24J40MC module are documented in the “MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver Data Sheet” (DS39776). Refer to the “MRF24J40 Data Sheet” for specific serial interface protocol and register definitions. Also, see Section 1.3, Operation for specific register settings that are unique to the MRF24J40MC module.2.1 External AntennaThe MRF24J40MC module has a 50Ω ultra miniature coaxial (U.FL) connector to connect to an external 2.4 GHz antenna. The choice of antenna is limited to the antenna types the module has been tested with. Refer to the respective country in Section 3.0, Regulatory Approval for a list of tested and approved antenna types that may be used with the MRF24J40MC module.2.2 Module SchematicA schematic diagram of the module is illustrated in Figure 2-2 and the Bill of Materials (BOM) is shown in Table 2-1.The MRF24J40MC module is based on the Microchip Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver IC (U6). The Serial I/O (SCK, SDI, SDO and CS), RESET, WAKE and INT pins are brought out to the module pins. The SDO signal is tri-state buffered by U7 to solve a silicon errata, where the SDO signal does not release to a high-impedance state, after the CS pin returns to its inactive state. Crystal, X1, is a 20 MHz crystal with a frequency tolerance of ±10 ppm @ 25°C to meet the IEEE Std. 802.15.4 symbol rate tolerance of ±40 ppm.A balun is formed by components: L11, L12, L13, C25, C27 and C31. L12 is also a pull-up for the RFP and RFN pins on the MRF24J40. C25 also acts as a DC block capacitor. RF switches, U1 and U2, switch between the power amplifier, U3, when transmitting and low noise amplifier, U2, when receiving. A band-pass filter FL1 is placed after the PA U3 to reduce harmonics. The remaining passive components provide bias and decoupling. FIGURE 2-1: MRF24J40MC APPLICATION SCHEMATIC
MRF24J40MC DS00000A-page 12 Preliminary © 2011 Microchip Technology Inc.FIGURE 2-2: MRF24J40MC SCHEMATIC
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 13MRF24J40MC TABLE 2-1: MRF24J40MC BILL OF MATERIALS Designator Value Description Manufacturer Part Number CommentsC27, C31 0.5 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI Q NP0, SMT 0402Johanson Technology 500R07S0R5BV4T do not substituteC25 0.7 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI Q NP0, SMT 0402Johanson Technology 500R07S0R7BV4T do not substituteC1, C15 1.0 pF Capacitor, Ceramic, 50V, ±0.25 pF, HI-Q C0G, SMT 0402Murata Electronics GJM1555C1H1R0CB01D—C9 1.2 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI Q NP0, SMT 0402Johanson Technology 500R07S1R2BV4T do not substituteC2 1.5 pF Capacitor, Ceramic, 50V, ±0.25 pF, HI-Q C0G, SMT 0402Murata Electronics GJM1555C1H1R5CB01D—C18 2.4 pF Capacitor, Ceramic, 50V, ±-0.25 pF, HI-Q C0G, SMT 0402Murata Electronics GJM1555C1H2R4CB01D—C7 5.6 pF Capacitor, Ceramic, 50V, ±0.25 pF, HI-Q C0G, SMT 0402Murata Electronics GJM1555C1H5R6CB01D—C8 6.8 pF Capacitor, Ceramic, 50V, ±0.25 pF, HI-Q C0G, SMT 0402Murata Electronics GJM1555C1H6R8CB01D—C3, C6 10 pF Capacitor, Ceramic, 50V, ±5%, HI-Q C0G, SMT 0402Murata Electronics GJM1555C1H100JB01D—C11 12 pF Capacitor, Ceramic, 50V, ±5%, HI-Q C0G, SMT 0402Murata Electronics GJM1555C1H120JB01D—C38, C41 18 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT 0402Murata Electronics GRM1555C1H180JZ01Ddo not substituteC19, C26, C30, C32, C37, C40, C4247 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT 0402Murata Electronics GRM1555C1H470JZ01D—C4, C5, C12, C17, C21, C22, C36100 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT 0402Murata Electronics GRM1555C1H101JZ01D—C10, C13, C14, C16, C291000 pF Capacitor, Ceramic, 50V, ±10%, X7R, SMT 0402Murata Electronics GRM155R71H102KA01D—C24, C34, C430.01 μFCapacitor, Ceramic, 25V, ±10%, X7R, SMT 0402Murata Electronics GRM155R71E103KA01D—C20, C23, C33, C440.1 μFCapacitor, Ceramic, 10V, ±10%, X5R, SMT 0402Murata Electronics GRM155R61A104KA01D—C28, C35, C391 μFCapacitor, Ceramic, 6.3V, ±20%, X5R, SMT 0402Murata Electronics GRM155R60J105ME19D—FL1 —Filter, Bandpass, 2.4 GHz Johanson Technology 2450BP15B100E —J1 — Connector, Receptical, Ultra-mini coax SMDHirose Electric Co Ltd U.FL-R-SMT(10) —
MRF24J40MC DS00000A-page 14 Preliminary © 2011 Microchip Technology Inc.L1, L2, L3 2.4 nH Inductor, Ceramic, ±0.3 nH, SMT 0402Johanson Technology L-07C2N4SV6T do not substituteL8 2.7 nH Inductor, Ceramic, ±0.3 nH, SMT 0402Johanson Technology L-07C2N7SV6T do not substituteL10 3.3 nH Inductor, Ceramic, ±0.3 nH, SMT 0402Johanson Technology L-07C3N3SV6T do not substituteL6 3.9 nH Inductor, Ceramic, ±0.3 nH, SMT 0402Johanson Technology L-07C3N9SV6T do not substituteL11, L12 4.7 nH Inductor, Ceramic, ±0.3 nH, SMT 0402Johanson Technology L-07C4N7SV6T do not substituteL7, L9 5.6 nH Inductor, Ceramic, ±0.3 nH, SMT 0402Johanson Technology L-07C5N6SV6T do not substituteL13 7.5 nH Inductor, Ceramic, ±5%, SMT 0402Johanson Technology L-07C7N5JV6T do not substituteL4 18 nH Inductor, Ceramic, ±5%, SMT 0402Johanson Technology L-07C18NJV6T do not substituteR5 2.2 ohms Resistor, 1%, ±100 ppm/C, SMT 0402 Vishay/Dale CRCW04022R00FKED—R2 360 ohms Resistor, 1%, ±100 ppm/C, SMT 0402Panasonic – ECG ERJ-2RKF3600X —R1 1.60 kohms Resistor, 1%, ±100 ppm/C, SMT 0402Panasonic – ECG ERJ-2RKF1601X —R3 470 kohms Resistor, 1%, ±100 ppm/C, SMT 0402Yageo RC0402FR-07470KL—R4 560 kohms Resistor, 1%, ±100 ppm/C, SMT 0402Panasonic – ECG ERJ-2RKF5603X —U6 MRF24J40 Transceiver, 2.4 GHz, IEEE 802.15.4 QFNMicrochip Technology Inc.MRF24J40-I/ML —U7 NC7SZ125P5X Buffer, Tri-State, SC-70-5 Fairchild SemiconductorNC7SZ125P5X —U5 TC1187VCT713 Regulator, LDO Microchip Technology Inc.TC1187VCT713 —U1, U4 UPG2179TB Switch, RF, SPDT, 6-SMINICEL/NEC UPG2179TB-E4-A —U2 UPC8233TK Amplifier, Low-noise, 6MINIMOLDCEL/NEC UPC8233TK-A —U3 UPG2250T5N Amplifier, RF, 6-TSON CEL/NEC UPG2250T5N-E2-A—X1 20.000 MHz Crystal, 20.000 MHz, 3.5 x 2.5 mm SMDAbracon ABM8-156-20.000MHz—TABLE 2-1: MRF24J40MC BILL OF MATERIALS (CONTINUED)Designator Value Description Manufacturer Part Number Comments
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 15MRF24J40MC 2.3 Printed Circuit BoardThe MRF24J40MC module PCB is constructed with high temperature FR4 material, four layers and 0.032 inches thick. The layers are illustrated in Figure 2-3 through Figure 2-7. The stack up of the PCB is illustrated in Figure 2-9.FIGURE 2-3: TOP SILK SCREENFIGURE 2-4: TOP COPPERFIGURE 2-5: LAYER 2 – GROUND PLANEFIGURE 2-6: LAYER 3 – POWER PLANE
MRF24J40MC DS00000A-page 16 Preliminary © 2011 Microchip Technology Inc.FIGURE 2-7: BOTTOM COPPER FIGURE 2-8: BOTTOM SILK SCREENFIGURE 2-9: PCB LAYER STACK UPTop CopperGround PlanePower PlaneBottom Copper1/2 oz. Copper1/2 oz. Copper1/2 oz. Copper1/2 oz. Copper8 mil FR412 mil FR48 mil FR40.032”±0.005”
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 17MRF24J40MC 3.0 REGULATORY APPROVALThe MRF24J40MC module has received regulatory approvals for modular devices in the United States and Canada. Modular approval allows the end user to place the MRF24J40MC module inside a finished product and not require regulatory testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance.The MRF24J40MC module has been tested and conforms to EN 300 328 V1.7.1 (2006-10), European Standards. The module tests can be applied toward final product certification and Declaration of Conformity (DoC). Additional testing may be required depending on the end application.The integrator is still be responsible for testing the end product for any additional compliance requirements required with this module installed (digital device emission, PC peripheral requirements, etc.) in the specific country that the end device will be marketed.Annex F of the IEEE Std. 802.15.4 document has a good summary of regulatory requirements in various countries concerning IEEE Std. 802.15.4 devices. The standard can be downloaded from the IEEE Standards web page: http://standards.ieee.org/getieee802/802.15.html.For more information on details on regulatory compliance, refer to the specific country radio regulations in the following sections. 3.1 United StatesThe MRF24J40MC has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” 15.247 and modular approval in accordance with FCC Public Notice DA 00-1407 Released: June 26, 2000, Part 15 Unlicensed Modular Transmitter Approval. The MRF24J40MC module can be integrated into a finished product without obtaining subsequent and separate FCC certification.The MRF24J40MC module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as following:The user’s manual should include the following statement:Contains Transmitter Module FCC ID: OA3MRF24J40MC -or- Contains FCC ID: OA3MRF24J40MC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment OFF and ON, the user is encouraged to try to correct the interference by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.
MRF24J40MC DS00000A-page 18 Preliminary © 2011 Microchip Technology Inc.3.1.1 MRF24J40MC SETTINGSTo meet the FCC requirements, the following settings must be observed by the integrator:• The MRF24J40MC transmit power setting shall not exceed 18.5 dBm (RFCON3 0x203<7:3> = 00101). Refer to Section 1.3.4, Transmit Power Settings.• Only channels 11 through 25 may be selected (RFCON0 0x200).3.1.2 APPROVED EXTERNAL ANTENNA TYPESTo maintain modular approval in the United States, only the antenna types that have been tested shall be used. It is permissible to use different antenna manufacturer provided the same antenna type, antenna gain (equal to or less than), and MRF24J40MC power setting is used for the same antenna type tested.Testing of the MRF24J40MC module was performed with the antenna types listed in Table 3-13.1.3 RF EXPOSUREAll transmitters regulated by FCC must comply with RF exposure requirements. OET Bulletin 65 “Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields” provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to RF fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance.If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas.The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF Exposure compliance:If the MRF24J40MC module is used in a portable application (antenna is less than 20 cm from persons during operation), the integrator is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091.3.1.4 HELPFUL WEB SITESFederal Communications Commission (FCC) http://www.fcc.govNote 1: Typical output power at antenna connector J1, Channel 11, 50Ω impedance.To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended.The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.TABLE 3-1: APPROVED EXTERNAL ANTENNA TYPESType Manufacture Part Number Gain Output Power1Whip, Dipole Aristotle Enterprises Inc. RFA-02-5-F7H1-70B-150 5 dBi 18.5 dBm
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 19MRF24J40MC 3.2 CanadaThe MRF24J40MC module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010):The host device shall be properly labeled to identify the module within the host device.The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December 2010):User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both.3.2.1 MRF24J40MC SETTINGSTo meet Industry Canada (IC) requirements, the following settings must be observed by the integrator:• The MRF24J40MC transmit power setting shall not exceed 18.5 dBm (RFCON3 0x203<7:3> = 00101). Refer to Section 1.3.4, Transmit Power Settings.• Only channels 11 through 25 may be selected (RFCON0 0x200).3.2.2 APPROVED EXTERNAL ANTENNA TYPESTransmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010):The MRF24J40MC module can only be sold or operated with antennas with which it was approved. Transmitter may be approved with multiple antenna types. An antenna type comprises antennas having similar in-band and out-of-band radiation patterns. Testing shall be performed using the highest gain antenna of each combination of transmitter and antenna type for which approval is being sought, with the transmitter output power set at the maximum level. Any antenna of the same type having equal or lesser gain as an antenna that had been successfully tested with the transmitter, will also be considered approved with the transmitter, and may be used and marketed with the transmitter. When a measurement at the antenna connector is used to determine RF output power, the effective gain of the device's antenna shall be stated, based on measurement or on data from the antenna manufacturer. For transmitters of output power greater than 10 milliwatts, the total antenna gain shall be added to the measured RF output power to demonstrate compliance to the specified radiated power limits. User manuals for transmitters shall display the following notice in a conspicuous location:The above notice may be affixed to the device instead of displayed in the user manual.Contains transmitter module IC: 7693A-24J40MCThis device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
MRF24J40MC DS00000A-page 20 Preliminary © 2011 Microchip Technology Inc.User manuals for transmitters equipped with detachable antennas shall also contain the following notice in a conspicuous location.Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each.Approved external antenna types for the MRF24J40MC module are listed in Table 3-2.3.2.3 HELPFUL WEB SITESIndustry Canada: http://www.ic.gc.ca/Note 1: Typical output power at antenna connector J1, Channel 11, 50Ω impedanceThis radio transmitter (identify the device by certification number, or model number if Category II) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.TABLE 3-2: APPROVED EXTERNAL ANTENNA TYPESType Manufacture Part Number Gain Output Power(1) E.I.R.P.Whip, Dipole Aristotle Enterprises Inc. RFA-02-5-F7H1-70B-150 5 dBi 18.5 dBm 23.5 dBm
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 21MRF24J40MC 3.3 EuropeThe MRF24J40MC module conforms to the emission standards summarized in Table 3-3. The module tests can be applied toward product Declaration of Conformity (DoC).The European Standards do not provide a modular approval similar to the USA (FCC) and Canada (IC). However, the completed compliance testing can be used as part of the customer’s application for product compliance approvals. The module test report data can be used as part of the customer’s product test plan and can significantly lower customer’s compliance burden.Depending on the end application, additional testing may be required. The integrator is responsible for testing the end product for any additional compliance requirements that become necessary with this module installed (for example, digital device emission, PC peripheral requirements and so on) in the specific country where end device is marketed)Note: To maintain conformance tested ETSI standards, the module shall not be modified and settings in Section 1.3, Operation must be observed.TABLE 3-3: EMISSIONS STANDARDS TESTEDSpecification Test MethodEmission StandardsEN 300 328 V1.7.1 (2006-10) 4.3.1 Maximum Transmit Power 5.7.2EN 300 328 V1.7.1 (2006-10) 4.3.2 Maximum EIRP Spectral Density 5.7.3EN 300 328 V1.7.1 (2006-10) 4.3.3 Frequency Range 5.7.4EN 300 328 V1.7.1 (2006-10) 4.3.6 Transmitter Spurious Emissions 5.7.5EN 300 328 V1.7.1 (2006-10) 4.3.7 Receiver Spurious Emissions 5.7.6
MRF24J40MC DS00000A-page 22 Preliminary © 2011 Microchip Technology Inc.3.3.1 MRF24J40MC SETTINGSTo meet ETSI requirements, the following settings must be observed by the integrator:• The MRF24J40MC transmit power setting shall not exceed 10.7 dBm (RFCON3 0x203<7:3> = 00111). Refer to Section 1.3.4, Transmit Power Settings. This is to meet the requirements of ETSI EN 300 328 v1.7.1 (2006-10), Maximum e.i.r.p. spectral density limit, Section 4.3.2.2, “For wideband modulations other then FHSS (DSSS, OFDM, etc.), the maximum e.i.r.p. spectral density is limited to 10 mW per MHz”.• Only channels 11 through 25 may be selected (RFCON0 0x200).3.3.2 APPROVED EXTERNAL ANTENNA TYPESThe MRF24J40MC module was tested with the antenna types listed in Table 3-4. In order to use the emissions testing listed in Table 3-3, the same antenna type, antenna gain (equal to or less than), and MRF24J40MC power setting as listed in Table 3-4 should be used. Additional emissions testing will be required by the integrator for any antenna types not tested with the module and listed in Table 3-4.3.3.3 HELPFUL WEB SITESA helpful document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, downloadable from the European Radio Communications Office (ERO): http://www.ero.dk/. Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htmEuropean Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.orgEuropean Telecommunications Standards Institute (ETSI): http://www.etsi.org European Radio Communications Office (ERO): http://www.ero.dk/Note 1: Typical output power at antenna connector J1, Channel 11, 50Ω impedance.TABLE 3-4: APPROVED EXTERNAL ANTENNA TYPESType Manufacture Part Number Gain Output Power(1)Whip, Dipole Aristotle Enterprises Inc. RFA-02-5-F7H1-70B-150 5 dBi 10.7 dBm
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 23MRF24J40MC 3.4 Australia/New ZealandThe MRF24J40MC module conforms to compliance levels 1, 2 and 3 in Australia and levels of conformity 1, 2 and 3 in New Zealand as required by notices under:• Section 182 of the Australian Radiocommunications Act 1992;• Section 407 of the Australian Telecommunications Act 1997; and• Section 134 of the New Zealand Radiocommunications Act 1989.3.4.1 MRF24J40MC SETTINGS To meet ETSI requirements, the following settings must be observed by the integrator:• The MRF24J40MC transmit power setting shall not exceed 10.7 dBm (RFCON3 0x203<7:3> = 00111). Refer to Section 1.3.4, Transmit Power Settings. This is to meet the requirements of ETSI EN 300 328 v1.7.1 (2006-10), Maximum e.i.r.p. spectral density limit, Section 4.3.2.2, “For wide band modulations other then FHSS (DSSS, OFDM, etc.), the maximum e.i.r.p. spectral density is limited to 10 mW per MHz”. • Only channels 11 through 25 may be selected (RFCON0 0x200).3.4.2 APPROVED EXTERNAL ANTENNA TYPESThe MRF24J40MC module was tested with the antenna types listed in Table 3-5. In order to use the emissions testing listed in Table 3-3, the same antenna type, antenna gain (equal to or less than), and MRF24J40MC power setting as listed in Table 3-5 should be used. Additional emissions testing will be required by the integrator for any antenna types not tested with the module and listed in Table 3-5.3.4.3 HELPFUL WEBSITESAustralian Communications and Media Authority – Radiocommunications (Short Range Devices) Standard: http://www.acma.gov.au/WEB/STANDARD/pc=PC_100141Note 1: Typical output power at antenna connector J1, Channel 11, 50Ω impedance.TABLE 3-5: APPROVED EXTERNAL ANTENNA TYPESType Manufacture Part Number Gain Output Power(1)Whip, Dipole Aristotle Enterprises Inc. RFA-02-5-F7H1-70B-150 5 dBi 10.7 dBm
MRF24J40MC DS00000A-page 24 Preliminary © 2011 Microchip Technology Inc.NOTES:
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 25MRF24J40MC 4.0 ELECTRICAL CHARACTERISTICS TABLE 4-1: RECOMMENDED OPERATING CONDITIONSParameters Min Typ Max UnitsAmbient Operating Temperature –40 —+85 °CSupply Voltage for RF, Analog and Digital Circuits2.7 —3.6 VSupply Voltage for Digital I/O 2.7 3.3 3.6 VInput High Voltage (VIH)0.5 x VDD — VDD + 0.3 VInput Low Voltage (VIL)–0.3 —0.2 x VDD VTABLE 4-2: CURRENT CONSUMPTION(TA = 25°C, VDD = 3.3V)Chip Mode Condition Min Typ Max UnitsSleep Sleep Clock and PA voltage regulator Disabled—5 μA— μATX At Maximum Output Power — 120 mA — mARX — — 25 mA — mATABLE 4-3: RECEIVER AC CHARACTERISTICSTypical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHzParameters Condition Min Typ Max UnitsRF Input Frequency Compatible to IEEE Std. 802.15.4™, 20032.405 — 2.480 GHzRF Sensitivity — — –108 — dBmMaximum RF Input 50Ω ——–23dBmLO Leakage Measured at Balun Matching Network Input at Frequency, 2.405 GHz – 2.48 GHz—–60—dBmInput Return Loss 50Ω–8 –12 — dBNoise Figure (including matching)— — 1.8 — dBAdjacent Channel Rejection@ ±5 MHz 30 — — dBAlternate Channel Rejection@ ±10 MHz 40 — — dBRSSI Range — — 50 — dBRSSI Error — –5 — 5 dB
MRF24J40MC DS00000A-page 26 Preliminary © 2011 Microchip Technology Inc.Note 1: Output power at antenna connector J1.TABLE 4-4: TRANSMITTER AC CHARACTERISTICSTypical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHzParameters Condition Min Typ Max UnitsRF Carrier Frequency — 2.405 — 2.475 GHzMaximum RF Output Power50Ω—19(1) —dBmRF Output Power Control Range——56—dBTX Gain Control ResolutionProgrammed by Register — 1.25 — dBCarrier Suppression — — –0 — dBcTX Spectrum Mask for O-QPSK SignalOffset Frequency >3.5 MHz, at 0 dBm Output Power–33 — — dBmTX EVM — — 15 — %
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 27MRF24J40MC APPENDIX A: REVISION HISTORYRevision A (February 2011)This is the initial release of the document.
MRF24J40MC DS00000A-page 28 Preliminary © 2011 Microchip Technology Inc.NOTES:
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 29MRF24J40MC THE MICROCHIP WEB SITEMicrochip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:•Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software•General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing•Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representativesCUSTOMER CHANGE NOTIFICATION SERVICEMicrochip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.CUSTOMER SUPPORTUsers of Microchip products can receive assistance through several channels:• Distributor or Representative• Local Sales Office• Field Application Engineer (FAE)• Technical Support• Development Systems Information LineCustomers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.Technical support is available through the web site at: http://support.microchip.com
MRF24J40MC DS00000A-page 30 Preliminary © 2011 Microchip Technology Inc.READER RESPONSEIt is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.Please list the following information, and use this outline to provide us with your comments about this document.TO: Technical Publications ManagerRE: Reader ResponseTotal Pages Sent ________From: NameCompanyAddressCity / State / ZIP / CountryTelephone: (_______) _________ - _________Application (optional):Would you like a reply? Y NDevice: Literature Number: Questions:FAX: (______) _________ - _________DS00000AMRF24J40MC 1. What are the best features of this document?2. How does this document meet your hardware and software development needs?3. Do you find the organization of this document easy to follow? If not, why?4. What additions to the document do you think would enhance the structure and subject?5. What deletions from the document could be made without affecting the overall usefulness?6. Is there any incorrect or misleading information (what and where)?7. How would you improve this document?
© 2011 Microchip Technology Inc. Preliminary DS00000A-page 31MRF24J40MC PRODUCT IDENTIFICATION SYSTEMTo order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. Device MRF24J40MC: 2.4 GHz IEEE Std. 802.15.4 RF Transceiver Module with PA/LNA External Antenna ConnectorTemperature RangeI = -40ºC to +85ºC (Industrial)Example:a) PIC18F1220/1320-I/MQ: Industrial temperature, tray.b) MRF24J40MCT-I/RM: Industrial temperature, tape and reel. PART NODeviceMModuleXModuleTypeTape and Reel-XTemperature RangeT
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