MobileTek Communication L600A IOT module User Manual

L600 Hardware Design

IoT LTE Module Series

Version： V1.0

Date： 2017-06-06

Shanghai Mobiletek Communication Ltd

L600 Hardware Design

Notice

Some features of the product and its accessories described herein rely on the software installed,

capacities and settings of local network, and therefore may not be activated or may be limited by local

network operators or network service providers.

Thus, the descriptions herein may not exactly match the product or its accessories which you purchase.

Shanghai Mobiletek Communication Ltd reserves the right to change or modify any information or

specifications contained in this manual without prior notice and without any liability.

Copyright

This document contains proprietary technical information which is the property of Shanghai Mobiletek

Communication Ltd. copying of this document and giving it to others and the using or communication

of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of

design. All specification supplied herein are subject to change without notice at any time.

DISCLAIMER

ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY

APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED,

INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY

AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE

ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL.

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REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT.

L600 Hardware Design

Version History

Date Version Description of change Author

2017-06-06 V1.0 Initial

L600 Hardware Design

Contents

1 ABOUT THIS DOCUMENT ...................................... 7

1.1Applicable scope ....................................................................................................................................... 7

1.2 Writing purpose ....................................................................................................................................... 7

1.3 Support and reference documents list .................................................................................................... 7

1.4 Terms and Abbreviations ........................................................................................................................ 8

2 PRODUCT OVERVIEW ........................................ 10

2.1 Package Dimensions .............................................................................................................................. 11

2.2 Product Function Outline ..................................................................................................................... 12

2.2.1 Hardware Diagram ....................................................... 12

2.2.2 Radio frequency function ............................................... 13

3 INTERFACE DESCRIPTION ................................... 16

3.1 PIN Definition ...................................................................................................................................... 16

3.1.1 Pin I/O parameter definition ........................................... 16

3.1.2 Pin Map ................................................................ 16

3.1.3 PIN Definition and function description ................................ 17

3.2 Operating condition ............................................................................................................................. 22

3.3 Digital I/O characteristics ..................................................................................................................... 22

3.4 Power Interface ...................................................................................................................................... 23

3.4.1 Power supply pin description ........................................... 23

3.4.2 Power supply requirements .............................................. 23

3.4.3 Power Supply Design Guide .............................................. 24

3.4.4 Recommended Power supply circuit ....................................... 25

3.4.5 Power Supply Layout guide .............................................. 25

3.5 UIM interface ......................................................................................................................................... 26

3.5.1 Pin definition ......................................................... 26

3.5.2 Design Guide ........................................................... 26

3.5.3 UIM interface reference circuit ........................................ 27

3.6 PCM interface ........................................................................................................................................ 27

3.6.1 PCM interface definition ............................................... 27

3.6.2 PCM interface application .............................................. 29

3.7 USB2.0 interface .................................................................................................................................... 30

3.7.1 USB interface pin definition ........................................... 30

3.7.2 USB Interface application .............................................. 30

3.8 UART Interface ...................................................................................................................................... 31

3.8.1 Pin description ........................................................ 31

3.8.2 UART interface application ............................................. 32

3.9 Power on/off and reset interface ........................................................................................................... 34

L600 Hardware Design

3.9.1 Pin definition ......................................................... 34

3.9.2 Power on sequence ...................................................... 34

3.9.3 Power off sequence ..................................................... 35

3.9.4 Reset sequence ......................................................... 36

3.9.5 Power on/off and reset interface application ........................... 37

3.10 Interactive interface ............................................................................................................................. 38

3.10.1 Pin definition ........................................................ 38

3.10.2 interactive interface application ..................................... 39

3.11 Net Light interface ............................................................................................................................... 40

3.11.1 Pin define ............................................................ 40

3.11.2 Net light application ................................................. 40

3.12 System boot configuration and download ................................................................................... ....... 41

3.12.1 Pin definition ........................................................ 41

3.12.2 Boot configuration and force USB interface application ................ 41

3.13 Analog and Digital conversion (ADC) interface ................................................................................ 41

3.14 I2C interface ......................................................................................................................................... 42

3.14.1 I2C pin definition .................................................... 42

3.15 Antenna interface ................................................................................................................................. 43

3.15.1 RF signal PCB layout guide ............................................ 43

3.15.2 applications .......................................... 错误！未定义书签。

4 PRODUCT CHARACTERISTICS ................................. 45

4.1 Absolute parameters .............................................................................................................................. 45

4.2 Operation condition ............................................................................................................................... 45

4.2.1 Operation voltage ...................................................... 45

4.2.2 Work mode(TBD) ......................................................... 45

4.2.3 current consumption(TBD) ............................................... 46

4.3 Working and storage temperature ....................................................................................................... 47

4.4 ESD performance .................................................................................................................................. 47

5 DESIGN GUIDELINE ........................................ 49

5.1 General design rules and requirements ............................................................................................... 49

5.2 Reference circuit .................................................................................................................................... 49

5.3 RF part design guideline ....................................................................................................................... 50

5.3.1 Early antenna design considerations ................................................................................................. 50

5.4 EMC and ESD design advice ................................................................................................................ 50

5.5 PCB Recommended land pattern ......................................................................................................... 51

5.6 Products recommended upgrade .......................................................................................................... 51

6 MANUFACTURERS ........................................... 52

6.1 Steel mesh design ................................................................................................................................... 52

6.2 Temperature curve ................................................................................................................................. 53

L600 Hardware Design

6.3 The Moisture Sensitivity Level (MSL) ................................................................................................. 54

6.4 Baking Requirements ............................................................................................................................ 55

7 PACKAGE STORAGE INFORMATION(TBD) ........................ 56

7.1 Package information(TBD) ................................................................................................................... 56

7.1.1 Tape and reel information .............................................. 56

7.1.1 Package information .................................................... 56

7.2 Bagged storage conditions ..................................................................................................................... 56

L600 Hardware Design

1 About this document

1.1Applicable scope

This document describes the L600 series 4G LTE CAT-M1 and NB-IoT LCC Module (hereinafter

referred to as L600), the basic specifications, product electrical characteristics, design guidance and

hardware interface development guidance. Users need to follow this documentation requirements and

guidance for design.

This document applies only to L600 series products in the application development.

1.2 Writing purpose

This document provides the design and development basis for the product users. By reading this

document, users can have a whole understanding of the product, the technical parameters of the

product have a clear understanding, and can be used in this document to complete the development of

wireless LTE CAT-M1 and NB-IOT Internet access functions.

This hardware development document not only provides the product functional features and

technical parameters, but also provides product reliability testing and related testing standards,

business functions to achieve process, RF performance indicators and user circuit design guidance.

1.3 Support and reference documents list

In addition to the hardware development documentation, we also provide a guide to the

development board based on this product manual and software development instruction manual, 1-1 is

supported as a list.

Table 1-1 support document list

No. Documents

1 《L600 AT Command User Guide》

2 《L600_SPEC.docx》

3 《L600 EVB User Manual》

4 《L600 Schematic checklist》

5 《L600 Layout checklist》

6 《L600_Reference Design_V1.pdf》

7 《L600_V1_DECAL.sch》

L600 Hardware Design

8 《L600_V1_DECAL.PCB》

1.4 Terms and Abbreviations

Table 1-2 is the Document relative Terms and Abbreviations。

Table 1-2 Terms and Abbreviations

Abbreviation Descriptions

ESD Electro-Static discharge

USB Universal Serial Bus

UART Universal Asynchronous Receiver Transmitter

SDCC Secure Digital Card Controller

USIM Universal Subscriber Identification Module

SPI Serial Peripheral Interface

I2C Inter-Integrated Circuit

PCM Pulse-coded Modulation

I/O Input/output

LED Light Emitting Diode

GPIO General-purpose Input/Output

GSM Global Standard for Mobile Communications

GPRS General Packet Radio Service

WCDMA Wideband Code Division Multi Access

UMTS Universal Mobile Telecommunication System

HSDPA High Speed Downlink Packet Access

HSUPA High Speed Uplink Packet Access

AGPS Assisted Global Positioning System

BER Bit Error Rate

DL Downlink

COEX WLAM/LTE-ISM coexistence

SMPS Switched-mode power supplies

LTE Long Term Evolution

FDD Frequency Division Duplexing

TDD Time Division Duplexing

L600 Hardware Design

DPCH Dedicated Physical Channel

DPCH_Ec Average energy per PN chip for DPCH. DPCH

IoT Internet of Things

L600 Hardware Design

2 Product Overview

L600 is a series of LTE CAT M1 and CAT NB1 module and special design for global IoT market,

and it’s have integrated rich peripheral interface. User can choose the module based on the wireless

network configuration. In this document, the supported radio band is described in the following items.

This product is a LCC interface of 4G wireless internet module, with the high speed, small size, light

weight, high reliability can be widely used in various products and devices with wireless internet

access:

Table 2-1 L600 series module type correspond band

Support band L600-V L600-A L600-C

LTE CAT M1 B1 ●

B2 ●

B4 ● ●

B8 ●

B12 ●

B13 ●

Data transmission specifications

 LTE-FDD CAT M1

- Uplink up to 375k bps,

- Downlink up to 375K bps

 LTE-FDD CAT NB-IoT

- Uplink up to 70k bps,

- Downlink up to 32K bps

Interface

 USB2.0

 UART

 USIM (3V/1.8V)

 GPIO

 ADC

 PCM

 SPI

 I2C

 NETLIGHT

 POWER KEY

 RESET

Dimensions（L×W×H）:25mm×21.5mm×2.6mm

L600 Hardware Design

TOP VIEW BOTTOM VIEW SIDE VIEW

Figure 2-1 Product Physical Map

2.1 Package Dimensions

The product module is 64-PIN LCC package module. The size of L600 is extremely small, it is only

21.5.0 x 25.0 x 2.6 mm with LCC package, It is cost competitive and high integrated which make it

convenient for customer to design their own application products. Pin 1 position from the bottom of

the belt angle welding plate to identify, the missing corner where the direction of the corresponding

module angle pad, figure 2-2 is the product dimension type map:

L600 Hardware Design

(a)Top Dimensions (Unit mm) (b)Side View (Unit mm)A

(c)Bottom Dimensions (Unit mm)

Note: BGA test pin in actual use of the customers don't need (PCB assembly, the stencil file).

Figure 2-2 Module Dimensions

2.2 Product Function Outline

2.2.1 Hardware Diagram

This product mainly includes the following signal group：USB Interface signal、USIM card Interface

signal、I2C Interface signal、UART Interface signal、PCM Interface signal、SPI interface、Module

startup、Module control signal、Power supply and ground. The global architecture of the L600 module

is described in the figure below.

L600 Hardware Design

RF

Transceiver

Baseband

FLASH

DDR

19.2

MHZXO

Power on/off

PMIC

LTE CATM1/NB1

MAIN ANT

GNSS IQ

VBAT

LDO

UART/SPI

SIM CARD

PCM

I/O STATUS

VDD_RF

DATA

RF IQ

CLK

Reset

ASM

Figure 2-3 L600 System Functional Architecture

2.2.2 Radio frequency function

RF Function Overview：

 Dual -Band FULL Duplex FDD-LTE CATM1

 Dual -Band FULL Duplex FDD-LTE CATNB1

The operating frequency range of the transmitter is shown in table 2-2.

Table 2-3 RF frequency band

Working band Upstream band（Uplink） Downlink frequency（Downlink）

FDD_LTE B1 1920 MHz~1980 MHz 2110 MHz~2170 MHz

FDD_LTE B2 1850 MHz — 1910 MHz 1930 MHz — 1990MHz

FDD_LTE B3 1710 MHz~1785 MHz 1805 MHz~1880 MHz

FDD_LTE B4 1710 MHz~1755 MHz 2110 MHz~2155 MHz

FDD_LTE B5 824 MHz~849 MHz 869 MHz~894 MHz

FDD_LTE B8 880 MHz~915 MHz 925 MHz~960 MHz

FDD_LTE B12 699 MHz~716 MHz 729 MHz~746 MHz

FDD_LTE B13 777 MHz~787 MHz 746 MHz~756 MHz

FDD_LTE B17 704 MHz~716 MHz 734 MHz~746 MHz

FDD_LTE B18 815 MHz~830 MHz 860 MHz~875 MHz

L600 Hardware Design

FDD_LTE B19 830 MHz~845 MHz 875 MHz~890 MHz

FDD_LTE B20 832 MHz~862 MHz 791 MHz~821 MHz

FDD_LTE B26 814 MHz~849 MHz 859 MHz~894 MHz

FDD_LTE B28 703 MHz~748 MHz 758 MHz~803 MHz

TDD_LTE B39 1880 MHz~1920 MHz 1880 MHz~1920 MHz

Table 2-4 Conducted transmission power

Working Band Max Power Min Power

FDD_LTE B1 23dBm +/-2.7dB <-40dBm

FDD_LTE B2 23dBm +/-2.7dB <-40dBm

FDD_LTE B3 23dBm +/-2.7dB <-40dBm

FDD_LTE B4 23dBm +/-2.7dB <-40dBm

FDD_LTE B5 23dBm +/-2.7dB <-40dBm

FDD_LTE B8 23dBm +/-2.7dB <-40dBm

FDD_LTE B12 23dBm +/-2.7dB <-40dBm

FDD_LTE B13 23dBm +/-2.7dB <-40dBm

FDD_LTE B17 23dBm +/-2.7dB <-40dBm

FDD_LTE B18 23dBm +/-2.7dB <-40dBm

FDD_LTE B19 23dBm +/-2.7dB <-40dBm

FDD_LTE B20 23dBm +/-2.7dB <-40dBm

FDD_LTE B26 23dBm +/-2.7dB <-40dBm

FDD_LTE B28 23dBm +/-2.7dB <-40dBm

TDD_LTE B39 23dBm +/-2.7dB <-40dBm

Table 2-6 Reference sensitivity (QPSK)

Channel bandwidth

E-UTRA

Band

200 KHz (CAT NB1)

REF SENS

(Total)

200 KHz(CAT NB1)

REF SENS

(EPRE @15KHz)

200 KHz(CAT NB1)

NB-PDSCH

repetitions

(Total)

200 KHz(CAT NB1)

NB-PDSCH

repetitions

(EPRE

@15KHz)

1.4 MHz

(CAT M1)

Duplex

Mode

1 -110 -120.8 TBD = Total – 10.8dBm -105 FDD

2 -110 -120.8 TBD = Total – 10.8dBm -103 FDD

3 -110 -120.8 TBD = Total – 10.8dBm -102 FDD

4 -- -- -- -- -105 FDD

5 -111 -121.8 TBD = Total – 10.8dBm -104 FDD

8 -111 -121.8 TBD = Total – 10.8dBm -103 FDD

12 -111 -121.8 TBD = Total – 10.8dBm -103 FDD

13 -111 -121.8 TBD = Total – 10.8dBm -103 FDD

17 -111 -121.8 TBD = Total – 10.8dBm -- FDD

L600 Hardware Design

18 -111 -121.8 TBD = Total – 10.8dBm -105 FDD

19 -111 -121.8 TBD = Total – 10.8dBm -105 FDD

20 -111 -121.8 TBD = Total – 10.8dBm -103 FDD

26 -111 -121.8 TBD = Total – 10.8dBm -104 FDD

28 -111 -121.8 TBD = Total – 10.8dBm -104 FDD

39 -- -- -- -- -105 TDD

L600 Hardware Design

3 Interface Description

3.1 PIN Definition

3.1.1 Pin I/O parameter definition

The I/O parameter definition of the product is shown in table 3-1.

Table 3-1 I/O parameter definitions

Pin attribute symbol Description

PI Power input PIN

PO Power output PIN

AI Analog input

AIO Analog signal input/output PIN

I/O Digital signal input/output PIN

DI Digital signal input

DO Digital signal output

DOH Digital output with high level

DOL Digital output with low level

PD Pull down

PU Pull up

AO Analog output

3.1.2 Pin Map

L600 is a extremely small LCC package module and special design for the IoT marketing, and it’s

have integrated rich peripheral interface. Such as USIM, USB ,PCM ,UART and interactive interface,

detail description show as below chart. All hardware interfaces which connect L600 to customers’

application platform are through 64 pins pads (Metal half hole). Figure 3-1 is L600 PIN outline

diagram.

L600 Hardware Design

1

2#

3#

4

6

7

8

9

10

11

12

13

14

15

16

5

17

SPI_CS

SPI_MOSI

SPI_MISO

SPI_CLK

GND

USB_HS_DM

USB_HS_DP

GND

USB_VBUS

USB_ID

GND

UIM_CLK

UIM_RESET

UIM_DATA

UIM_PRESENT

VREG_L6_UIM

GND

49

48

47

45

44

43

42

41

40

39

38

37

36

35

34

46

33

NC

FLIGHTMODE

WAKEUP_OUT

WAKEUP_IN

GND

I2C_SDA

I2C_SCL

MB_GPIO_0

GND

VREG_L11_1P8

NETLIGHT

NC

RESET_N

PHONE_ON_N

ADC1

ADC2

NC

Top View

Figure 3-1 Pin Map View (Top View)

Note:1. # flag Pin standard this pin is a Multi-function pin and it’s integrated different function in

different system status, and the detail function please refer to the correspond chapter.

3.1.3 PIN Definition and function description

Table 3-2 Pin definition

Pin No. Pin description Pin No. Pin description

1 SPI_CS 2 SPI_MOSI

3 SPI_MISO 4 SPI_CLK

5 GND 6 USB_HS_DM

7 USB_HS_DP 8 GND

L600 Hardware Design

9 USB_VBUS 10 USB_ID

11 GND 12 UIM_CLK

13 UIM_RESET 14 UIM_DATA

15 UIM_PRESENT 16 VREG_L6_UIM

17 GND 18 ANT_MAIN

19 GND 20 GND

21 NC 22 NC

23 BOOT_CONFIG_0 24 NC

25 VBAT_RF 26 VBAT_RF

27 GND 28 GND

29 VBAT_BB 30 VBAT_BB

31 GND 32 GND

33 NC 34 ADC2

35 ADC1 36 PHONE_ON_N

37 RESET_N 38 NC

39 NETLIGHT 40 VREG_L11_1P8

41 GND 42 MB_GPIO_0

43 I2C_SCL 44 I2C_SDA

45 GND 46 WAKEUP_IN

47 WAKEUP_OUT 48 FLIGHTMODE

49 NC 50 GND

51 UART_RTS_N 52 UART_CTS_N

53 UART_RX 54 UART_TX

55 UART_RI 56 UART_DCD

57 UART_DTR 58 FORCE_USB_BOOT

59 STATUS 60 GND

61 PCM_OUT 62 PCM_IN

63 PCM_SYNC 64 PCM_CLK

L600 Hardware Design

Table 3-3 Pin Function Description

Power interface

Pin Name Pin No. I/O Description Content

VBAT_BB 29,30 PI

Power supply voltage,

VBAT=3.4V~4.2V.

The power supply

for system Maximum

load current must

above 2A. Keep

de-cap capacitor

close to the this

Net.

VBAT_RF 25,26 PI Power supply voltage,

VBAT=3.4V~4.2V.

VREG_L6_UIM 16 PO

Module LDO output

power, dual-voltage

output, Max current

300mA.

Only use for

external SIM Card

VDD.

VREG_L11_1P8 40 PO

Module LDO output

power for MCP and

accessories

If not use please

let it open or add

a 10 uF de-cap

capacitor to

ground.

GND

5,8,11,17,19,2

0,27,28,31,32,

41,45,50,60

-- Ground.

System control interface

Pin Name Pin No. I/O Description Content

PHONE_ON_N 36 DI System power on/off

input, active low.

RESET_N 37 DI System reset input,

active low.

FLIGHTMODE 48 DI, PU

The input signal, used

to control the system

into flight mode, L:

flight mode; H: normal

mode

Pull UP to

VDD_1V8（PIN 40）

with 10K resistor

Interactive interface

Pin Name Pin No. I/O Description Content

NETLIGHT 51 DO Identify the system

network status.

STATUS 40 DO

Module status

identify: High level

power on, low level

L600 Hardware Design

power off.

WAKEUP_IN 46 DI AP weak up module

WAKEUP_OUT 47 DO Module wake up AP

SIM interface

Pin Name Pin No. I/O Description Content

UIM_PRESENT 15 DI，PU

Input pin as USIM card

detect pin.

H: UIM is removed

L: UIM is inserted

If not use keep it

open.

UIM_DATA 14 I/O

USIM Card data I/O,

which has been

pulled up with a 10KR

resistor to

UIM_VDD in module. Do

not pull

up or pull down in

users’ application

circuit. All signals of

USIM

interface should

be protected with

ESD/EMC.

UIM_RESET 13 DO UIM Reset

UIM_CLK 12 DO UIM Clock

UIM_VDD 16 PO

UIM Card Power output,

output

Voltage depends on UIM

mode

automatically， and

one is

3.0V±10%, another is

1.8V±10%.

Current is less than

50mA.

PCM interface

Pin Name Pin No. I/O Description Content

PCM_CLK 64 DO PCM data bit clock.

If not use keep it

open.

PCM_SYNC 63 DO PCM data frame sync

signal.

PCM_IN 62 DI PCM data input.

PCM_OUT 61 DO PCM data output.

FULL UART

Pin Name Pin No. I/O Description Content

RTS 51 DI DET Request to send. If not use keep it

open.

L600 Hardware Design

CTS 52 DO Clear to Send. If not use keep it

open.

RX 53 DI Receive Data. If not use keep it

open.

RI 55 DO Ring Indicator. If not use keep it

open.

DCD 56 DO Carrier detects. If not use keep it

open

TX 54 DO Transmit Data. If not use keep it

open.

DTR 57 DI DTE get ready. If not use keep it

open.

DEBUG PORT(Multiplex)

SPI_MOSI(MDM_DBG

_UART_TX) 2 DI

Before system On：

module UART debug port

System On: SPI_MOSI

Suggest add test

point

SPI_MISO(MDM_DBG

_UART_RX) 3 DO

Before system On：

module UART debug port

System On: SPI_MISO

Suggest add test

point

I2C interface

Pin Name Pin No. I/O Description Content

I2C_SCL 43 DO I2C clock output. If not use keep it

open.

I2C_SDA 44 I/O I2C data input/output.

RF port

Pin Name Pin No. I/O Description Content

MAIN _ANT 18 AIO Main Antenna

Others

Pin Name Pin No. I/O Description Content

ADC1 35 AI

Analog conversion

digital input

interface1 If not use keep it

open.

ADC2 34 AI

Analog conversion

digital input

interface2

FORCE_USB_BOOT 58 I/O

Pull up to 1.8V (L600

VDD_1V8) with 10K

resistor force module

in USB download mode

Recommend placing

test points for

debug.

BOOT_CFG0 23 DI, PD

Pull up to 1.8V (L600

VDD_1V8) with 10K

resistor force module

L600 Hardware Design

in fastboot mode

3.2 Operating condition

Table 3-4 module recommended operating condition

Parameter Description Min. Typ. Max. Unit

VBAT Main power supply for

the module

3.4 3.8 4.2 V

3.3 Digital I/O characteristics

Table 3-5 1.8V Digital I/O characteristics

Parameter Description Min. Typ. Max. Unit

VIH High level input voltage 0.7*VDD_PX VDD_PX VDD_PX+0.3 V

VIL Low level input voltage -0.3 0 0.2* VDD_PX V

VOH High level output voltage VDD_PX-0.45 - VDD_PX V

VOL Low level output voltage 0 0 0.45 V

IOH

High-level output current

(no pull down resistor) - 2 - mA

IOL

Low-level output current

(no pull up resistor) - -2 - mA

IIH

Input high leakage

current (no

pull down resistor)

- - 1 uA

IIL

Input low leakage current

(no pull up resistor) -1 - - uA

*Note: 1. These parameters are for digital interface pins, such as SPI, I2C,GPIOs

UART, PCM, BOOT_CFGn.

2. L600 USIM card signal (USIM_CLK, USIM_DATA, USIM_RST) support dual-voltage (1.8V

and 3.0V) mode, and the DC character show in corresponding function block.

L600 Hardware Design

3.4 Power Interface

3.4.1 Power supply pin description

Table 3-6 DC Power Characteristics

Pin No. Net Name Description

DC Characteristic（V）

Min. Typ. Max.

25,26 VBAT_RF Power supply for

the module RF 3.4 3.8 4.2

29,30 VBAT_BB Power supply for

the module BB 3.4 3.8 4.2

5,8,11,17,19,20,27

,28,31,32,41,45,50

,60

GND GND - - -

3.4.2 Power supply requirements

L600 power supply requirement as below table:

Table 3-7 VBAT power supply interface characteristics

Symbol Description Min Typ Max Unit

VBAT Power supply

voltage 3.4 3.8 4.2 V

IVBAT(peak) Power supply p

current - 460* - mA

IVBAT(average,

Power Saving Mode

disabled,

Module registered

with network)

Power supply

average

current

- 9 - mA

IVBAT(power-off) Power supply

current

in power off

mode

- - 8 uA

IVBAT(power-save

mode)

Power supply

current

in power save

mode(Deep

sleep mode)

- - 8 uA

L600 Hardware Design

3.4.3 Power Supply Design Guide

Make sure that the input voltage at the VBAT pin will never drop below 3.4V even during a

transmit burst when the current consumption rises up to more than 800mA. If the power voltage drops

below 3.4V, the RF performance of module may be affected. Using large tantalum capacitors (above

300uF) will be the best way to reduce the voltage drops. If the power current cannot support up to 800

mA, users must introduce larger capacitor (typical 1000uF) to storage electric power. For the

consideration of RF performance and system stability, some multi-layer ceramic chip (MLCC)

capacitors (0.1/1uF) need to be used for EMC because of their low ESR in high frequencies. Note that

capacitors should be put beside VBAT pins as close as possible. Also User should keep VBAT net

wider than 2 mm to minimize PCB trace impedance on circuit board. The following figure is the

recommended circuit.

Figure 3-3 VBAT input application circuit

Note: The Cd, Ce, Cb, Cc and Cf are recommended being mounted for L600, but the Ca, Cb, Ce, Cc

and Cf for tune.

In addition, in order to get a stable power source, it is suggested to use a Zener diode of which

reverse Zener voltage is 5.1V and dissipation power is more than 500mW.

Table 3-8: Recommended Zener diode models

NO. Manufacturer Part Number Power Package

1 On semi MMSZ5231BT1G 500mW SOD123

2 Prisemi PZ3D4V2H 500mW SOD123

3 Vishay MMSZ4689-V 500mW SOD123

L600 Hardware Design

3.4.4 Recommended Power supply circuit

If the voltage difference is not big, we recommend LDO is used for the power supply of the module,

make sure that the peak current of power components can rise up to more than 800A. The following

figure is the reference design of +5V input linear regulator power supply. The designed output for the

power supply is 3.8V.

Figure 3-4 Reference circuit of the LDO power supply

If there is a big difference between the input voltage and the desired output (VBAT) or better

efficiency is more important, a switching converter power (DC/DC) supply will be preferable. The

following figure is the reference circuit.

Figure 3-5 Reference circuit of the DCDC power supply

Note: DCDC may deprave RF performance because of ripple current intrinsically.

3.4.5 Power Supply Layout guide

The layout of the power supply section and the related components is of vital importance in the

power module design. If processes this part layout is not good, will lead to various effects, such as bad

EMC, effective the emission spectrum and receiving sensitivity, etc. So the power supply part design

is very important, when you design this part you should notes below contents: 1. DC/DC switch power

should place away from the antenna and other sensitivity circuit; 2. Consider the voltage drop and the

module current requirement, the layout line should better above 100mil. If conditions allow should add

a power shape plane.

L600 Hardware Design

3.5 UIM interface

3.5.1 Pin definition

The L600 integrated a ISO 7816-2 standard USIM port, and the module can automatic identify the

voltage demo according the USIM to allow the mobile equipment to attach to the network. Both 1.8V

and 3.0V SIM Cards are supported.

Table 3-9 UIM Electronic characteristic in 1.8V mode (USIM_VDD =1.8V)

Symbol Parameter Min. Typ. Max. Unit

UIM_VDD LDO power output 1.75 1.8 1.95 V

VIH High-level input voltage 0.65·UIM

_VDD -

UIM_VD

D +0.3

V

VIL Low-level input voltage -0.3 0 0.35·UIM

_VDD V

VOH High-level output voltage UIM_VD

D -0.45 -- UIM_VD

D V

VOL Low-level output voltage 0 0 0.45 V

Table 3-10: USIM Electronic characteristic 3.0V mode (USIM_VDD =3.0V)

Symbol Parameter Min. Typ. Max. Unit

UIM_VDD LDO power output 2.75 3.0 3.05 V

VIH High-level input voltage 0.65*UIM

_VDD - UIM_VD

D +0.3 V

VIL Low-level input voltage -0.3 0 0.25·UIM

_VDD V

VOH High-level output voltage UIM_VD

D -0.45 - UIM_VD

D V

VOL Low-level output voltage 0 0 0.45 V

3.5.2 Design Guide

UIM electronic characteristics as the table 3-9,3-10 show.

In order to meet the 3 GPP TS 51.010 1 protocol and EMC certification requirements. Suggest

UIM slot near the location of the module USIM card interface, to avoid running for too long, lead to

serious deformation of waveform and effect signal integrity, UIM_CLK and UIM_DATA signal lines

suggest ground protect. Between the UIM VCC & GND add a 1uF and a 33pF capacitor in parallel,

Between the SIM_CLK& GND, UIM_RST& GND, UIM DATA& GND add a 33pF capacitor in

L600 Hardware Design

parallel, for filter the RF signal interference.

3.5.3 UIM interface reference circuit

Figure 3-6 UIM Reference circuit

Note:1. UIM_DATA should have added the10K pull-up resistance to VREG_UIM in your design.

2. L600 support hot-plug detect, if need the function, please add this pin, detail as the L600

reference design .

3.6 PCM interface

3.6.1 PCM interface definition

L600 provides hardware PCM interface for external codec. L600 PCM interface can be used in short

sync master mode only, and only supports 16 bits linear format：

Table 3-11 PCM interface definition

Pin No. Signal name I/O Type

DC Characteristics（V）

Min. Typ. Max.

63 PCM_SYNC

PCM

synchronizing

signal

-0.3 1.8 1.9

62 PCM_DIN PCM data input -0.3 1.8 1.9

61 PCM_DOUT PCM Data output -0.3 1.8 1.9

L600 Hardware Design

64 PCM_CLK PCM Data clock -0.3 1.8 1.9

Figure 3-7 PCM_SYNC timing

Figure 3-8 Codec to L600 module timing

Figure 3-9 L600 to codec module timing

Table 3-12 PCM interface Timing

Parameter Descriptions

DC characters

Min. Typ. Max. Unit

T(sync) PCM_SYNC cycle - 125 - us

L600 Hardware Design

T(synch) PCM_SYNC high level hold

time

- 488 - ns

T(syncl) PCM_SYNC low level hold

time

- 124.5 - us

T(clk) PCM_CLK cycle - 488 - ns

T(clkh) PCM_CLK high level hold

time

- 244 - ns

T(clkl) PCM_CLK low level hold time - 244 - ns

T(susync) PCM_SYNC establish time - 122 - ns

T(hsync) PCM_SYNC hold time - 366 - ns

T(sudin) PCM_IN establish time 60 - - ns

T(hdin) PCM_IN hold time 60 - - ns

T(pdout) From PCM_CLK rising edge to

PCM_OUT valid time

- - 60 ns

T(zdout)

From PCM_CLK falling edge

to PCM_OUT high

impendence delay time

- - 60 ns

3.6.2 PCM interface application

L600 only support the host mode, PCM_SYNC,PCM_CLK is the output pin，PCM_SYN as the

synchronizing output 8kHz sync signal. PCM Data support 8bit or 16bit data.

Figure 3-10 PCM application circuit（L600 in host mode）

Note:1. L600 PCM port DC character is base on 1.8 voltage, please pay attention the voltage

matching.

2. If your design need this function, you should add the crystal for PCM clock. About the

crystal type please contact our market.

3. L600 default design base on NAU8814 as the codec chip, the detail design please refer to

《

L600 reference design

》

.

L600 Hardware Design

3.7 USB2.0 interface

3.7.1 USB interface pin definition

L600 module include a high-speed USB 2.0 compliant interface with maximum 480 Mb/s data

rate according to USB 2.0 specification, representing the main interface for transferring high speed

data with a host application processor. The module itself acts as a USB device and can be connected to

any USB host equipped with compatible drivers.

The USB is the most suitable interface for transferring high speed data between module and a

host processor, available for AT commands, data communication, FW upgrade, below table is the

module USB pin definition:

Table 3-13 USB interface pin definition

Pin No. Signal name I/O type

DC characteristic（V）

Min. Typ. Max.

6 USB_DM USB2.0 date D- - - -

7 USB_DP USB2.0 data D+ - - -

3.7.2 USB Interface application

USB bus is mainly used for data transmission, software upgrading, module testing. Work in the

high-speed mode of the USB line, if you need ESD design, ESD protection device must meet the

junction capacitance value <5pf, otherwise the larger junction capacitance will cause waveform

distortion, the impact of bus communication. Differential impedance of differential data line in 90ohm

+ 10%. In your application must add a 47Kohm resistor between USB_VBUS to ground.

L600 Hardware Design

Figure 3-11 USB application

3.8 UART Interface

3.8.1 Pin description

L600 module provides a flexible 7-wire UART (universal asynchronous serial transmission)

interface. UART as a full asynchronous communication interface, Support the standard modem

handshake signal control, Comply with the RS - 232 interface protocols. And also support four wire

serial bus interface or the 2-wire serial bus interface mode, and the module can be through the UART

interface for serial communication with the outside (DET) and the AT command input, etc. L600

module is a DCE (Data Communication Equipment) and client PC is a DTE (Data Terminal

Equipment).AT commands are entered and serial communication is performed through UART

interface. The pin signal is defined as shown in below table.

Table 3-14 UART pin definition

Pin No. Pin I/O type Descriptions

54 UART_TX DO UART data transmission

53 UART_RX DI UART data receive

55 UART_RI DO Ring Indicator.

51 UART_RTS DO UART DET request to send

57 UART_DTR DI DTE get ready.

52 UART_CTS DI UART Clear to Send.

56 UART_DCD DO UART Carrier detects.

L600 Hardware Design

3.8.2 UART interface application

L600 UART is COMS 1.8V level, Complete serial port with RS-232 functionality conforming to the

ITU-T V.24 Recommendation, with CMOS compatible signal levels (0 V for low data bit or ON state

and 1.8 V for high data bit or OFF state), if the AP voltage level is not the 1.8V should add a voltage

transfer module in your application. Below is RS-232 voltage transfer module application diagram

TXD1

RXD1

RTS1

CTS1

DTR1

DCD1

RING1

TXD

RXD

RTS

CTS

DTR

DCD

RING

Serial Port Serial Port

L600 DCE Client(DET)

GND GND

Figure 3-12 UART 4 Line connection mode

TXD1

RXD1

RTS1

CTS1

DTR1

DCD1

RING1

TXD

RXD

RTS

CTS

DTR

DCD

RING

Serial Port Serial Port

L600(DCE) Client (DTE)

GND GND

Figure 3-13 UART 2 Line connection mode

L600 Hardware Design

Figure 3-14 UART Full mode

The L600 UART is 1.8V interface. A level shifter should be used if user’s application is equipped

with a 3.3V UART interface. The level shifter TXB0108RGYR provided by Texas Instruments is

recommended. The reference design of the TXB0108RGYR is in the following figures. About the

application as below:

L600 Hardware Design

Figures 3-16 Voltage transfer Reference Circuit

3.9 Power on/off and reset interface

3.9.1 Pin definition

L600 can be powered on by pulling PWRKEY pin down to ground. This pin is already internal

pulled up to 1.8V in module (because the internal resistance divided voltage, so in actual measure

voltage is approximately 800mV), so external pull-up resistor is not necessary. Placing a100nF

capacitor and an ESD protection diode close to the PWRKEY pin is strongly recommended. Please

refer to the following figure for recommended reference circuit.

Table 3-15 power on/off and reset key define

Pin No. Net name I/O Typ. descriptions

36 PHONE_ON_N(PWRKEY) DI L600 power on/off pin (internal pull-up to

1.8V)

37 RESET_N DI L600 RESET pin (internal pull-up to 1.8V)

3.9.2 Power on sequence

Table 3-16 power on timing chart.

Ton Power on low level pulse 100 500 -- ms

Ton(status) Power on time (According to the

STATUS pin judgment)

15 -- 25 s

Ton(uart) Power on time (according the UART

pin judgement)

10 -- 20 s

VIH Input high level voltage of

PWRKEY pin

1.17 1.8 2.1 V

VIL Input low level voltage of PWRKEY

-0.3 0 0.3 V

L600 Hardware Design

Figures 3-17 Power on Timing sequence

Note: the STATUS pin can be used to identify whether has been power on, when the module has

access to electricity and initialization is completed, the STATUS output high level, or has

maintained low level.

3.9.3 Power off sequence

The following methods can be used to power down. These procedures will make module

disconnect from the network and allow the software to enter a safe state, and then save data before

completely powering the module off.

● Method 1: Power off L600 by pulling the PWRKEY pin down

● Method 2: Power off L600 by AT command “AT+CPOF”

● Method 3: over-voltage or under-voltage automatic power down.

● Method 4: over-temperature or under-temperature automatic power down.

Note: 1. About the AT command “AT+CPOF” detail please refer document [1].

2. Over-voltage or under-voltage may cause automatic power down.

3. Over-temperature or under-temperature may cause automatic power down.

Table 3-17 Power off timing chart.

Toff The time of active low level

pulse on PWRKEY pin to power off

module

2.5 -- -- s

Toff(status

)

The time from power-off issue to

STATUS pin output low level

(indicating power off)

6 -- -- s

L600 Hardware Design

Toff(uart) The time from power-off issue to

UART port off

6 -- -- s

Toff-on The buffer time from power-off

issue to power-on issue

0 -- -- V

VIH Input high level voltage of

PWRKEY pin

1.17 1.8 2.1 V

VIL Input low level voltage of PWRKEY

-0.3 0 0.3 V

User can power off the L600 by pulling PWRKEY down to ground for a specific time. The

power off scenario is illustrated in the following figure.

Figures 3-18 Power off Timing sequence

Note: the STATUS pin can be used to identify whether has been power on, when the module has

access to electricity and initialization is completed, the STATUS output high level, or has

maintained low level.

3.9.4 Reset sequence

L600 also have a RESET pin to reset module. This function is used as an emergency reset only

when AT command “AT+CPOF” and the PWRKEY pin has no effect. User can pull RESET pin to

ground, and then pull down the PWRKEY, the module will reset. This pin is already pulled up with a

40KΩ resistor to 1.8V in module, so external pull-up resistor is not necessary. Placing a100nF

capacitor and an ESD protection diode close to the RESET pin is strongly recommended. Please refer

to the following figure for recommended reference circuit, you can pull-down this pin to ground and

hold about 200 MS and then release will force the module enter reset state.

Table 3-18 Reset pin electrical properties

Symbol Net name Min. Typ. Max. Unit

Treset Reset pin low level hold time 50 100 500 ms

VIH Reset pin input high level 1.17 1.8 2.1 V

L600 Hardware Design

VIL Reset pin input low level -0.3 0 0.3 V

Note: it is recommended that only in an emergency, such as module without response, use the

RESET pin. In addition, under the module power off status the RESET pin is invalid.

3.9.5 Power on/off and reset interface application

4.7K

47K

4.7K

47K

37

36

500mS

Figure 3-19: Reference power on/off reset circuit

Another way to control the PWRKEY pin is directly using a push button switch. Need to set a

button near the TVS to ESD protection. The image below for reference circuit:

L600 Hardware Design

Figure 3-20: power on/off and reset recommended circuit (physical buttons)

3.10 Interactive interface

3.10.1 Pin definition

Table 3-19 list the interface is mainly with the application processor interactive interface,

including query, wake up four types, status indication, flight mode interface.

Table 3-19 Interactive interface

Pin No. Signal I/O type Descriptions

46 GPIO_2/WAKEUP_IN DI Default: GPIO

Optional: Input pin as wake up interrupt

signal to module from host.

47 GPIO_1/WAKEUP_OU

T

DO Default: GPIO

Optional: Output pin as the module wake up

the AP

59 STATUS DO AP inquire the module status

48 FLGHTMODE DI Pull up to 1.8V made the system enter in

flight mode, at this mode will tune off all

the wireless function

42 GPIO_0 DO General GPIO module output (used for

keyboard backlighting, etc.)

28 GPIO_3 I/O GPIO

L600 Hardware Design

3.10.2 interactive interface application

L600 provides three shook hands with application processor communication signals. Application

processor can query whether the module boot normal work through STATUS. Through the

WAKEUP_OUT query module is in sleep mode, and sleep in the module, through WAKEUP_IN

wake module. Similarly, when application processor in the sleep state, the L600 modules can through

WAKEUP_OUT wake application processor.

 STATUS：Module sleep instructions, high level indicator to sleep, low level instructions for the

awakened state;

 WAKEUP_IN： The host can lower the signal awakens the module，If, low level has maintained,

module can't sleep.

 WAKEUP_OUT: when L600 need to communicate with the AP, module can be set this pin for low

level to awaken application processor.

 FLGHTMODE：Through the external output high level module into flight mode;

FLIGHTMODE pin can be used to control module to enter or exit the flight mode. In flight mode, L600 internal

radio frequency circuit is closed. FLIGHTMODE reference circuit as shown in the figure below:

Figure 3-21: Flight mode recommended circuit (physical buttons)

L600 Hardware Design

3.11 Net Light interface

3.11.1 Pin define

Table 3-20 LED pin definitions

Pin No. Net name I/O type description

39 NETLIGHT DO Module net state identify control LED port

3.11.2 Net light application

The L600 module has 1 pins for controlling the LED display, which can be used as an indicator

of network connection status. Different network states are represented by the mode of the flashing

light. This pin is an GPIO，with An external NPN Transistor，External connect VBAT can directly

drive LED. Drive current capacity varies according to external NPN model，recommend use

DTC143ZEBTL，Drive current biggest can reach 100 mA, below is the reference circuit.

L600

LED

R2

R1

Figure 3-22 Status indicator reference circuit

Note: R1, R2 value according to the voltage VLED and LED working current.

Table 3-21 NETLIGHT status

Net Status Module working status

Always on Searching Network/Call Connect

200ms ON, 200ms OFF Data Transmit

800ms ON, 800ms OFF Registered network

OFF Power off / Sleep

Note: NETLIGHT output low level as “ON”, and high level as “OFF”.

L600 Hardware Design

3.12 System boot configuration and download

3.12.1 Pin definition

L600 can configure BOOT_CONFIG (Boot Configuration) pin to Configuration module power-on

mode and the forced entry USB download mode.

Table 3-23 Boot configuration and force USB download

Pin No. Net name Function description note

23 GPIO(System

on)

BOOT_CFG0(befo

re system on)

Pull up this pin change boot

configuration register value

Multiplex

58 GPIO(System

on)

FOCE_USB_BOOT

(before system

on)

Pull up this pin change boot

configuration register value

Multiplex

3.12.2 Boot configuration and force USB interface application

10K

SW1

SW2

Figure 3-25 boot configuration and force USB download recommended circuit

3.13 Analog and Digital conversion (ADC) interface

L600 integrated two analog-to-digital conversion interface, specific parameters are as follows:

Table 3-25 ADC1, ADC2 characters

L600 Hardware Design

characters Min. Typ. Max. Unit

ADC resolution -- 15 -- Bits

Transfer time -- 442 -- ms

Input voltage range 0.3 -- VBAT V

Input resistance 1 -- -- MΩ

Note: 1. use "AT + CADC" and "AT + CADC2" can read ADC1 and ADC2 voltage on the pin.

More information please refer to the document [1].

2. The need for special software version to support access to the ADC.

3.14 I2C interface

3.14.1 I2C pin definition

I2C is used to communicate with peripheral equipment and can be operated as either a transmitter or

receiver, depending on the device function. Both SDA and SCL are bidirectional lines connected with

I2C interface. Its operation voltage is 1.8V. High speed mode transmission rate can reach 400 KBPS,

Because L600 haven’t internal pulled up to the I2C interface, so in your design need pull up. Below

figure is the reference design:

Figure 3-28 I2C reference design

Note: 1. L600 I2C only support host mode.

2. Only special software version support inquire the I2C.

L600 Hardware Design

3.15 Antenna interface

3.15.1 RF signal PCB layout guide

a) Trace layout and dimensions including specific designs for each type:

1) Customer’s antenna should be located in the host board and connected to module’s antenna pad

through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50Ω.

RF antenna interface type can be SMA , RF connector and so on. And isolation is required greater than

35 dB.

2) In layout design, antenna RF transmission line must ensure the characteristic impedance = 50 ohm.

The characteristic impedance depend on substrate board, line width and the distance from the ground

plane.

3) For convenience of antenna tuning and certification test, should increase RF connectors and the

antenna matching circuit, below is a recommended circuit:

Figure 3-29 Main antenna matching circuit diagram（MAIN_ANT）

In this figure, the components R1, C1, C2 and R2 is used for antenna matching, the value of

components can only be got after the antenna tuning, usually, they are provided by antenna vendor. By

default, the R1, R2 are 0 Ohm resistors, and the C1, C2 are reserved for tuning.

The RF test connector in the figure is used for the conducted RF performance test, and should be

placed as close as to the module’s antenna pin. The traces impedance between components must be

controlled in 50ohm. And antenna gain is required not less than 3 dBi.

4) As shown in figure 3-20 is the layout of antenna feed point of reference for clearance area.

L600 Hardware Design

Figure 3-33 antenna feed point

b) To facilitate the antenna tuning and certification test, a RF connector and an antenna matching

circuit should be added. The following figure is the recommended circuit.

The antenna feed point is defined as shown in below table：

Table 3-26 antenna pin definition

Pin No. Signal I/O Typ. Description

18 MAIN_ANT AI/AO Module main antenna

c) we recommends that the total insertion loss between the antenna pad and antenna should meet the

following requirements and test procedures for design verification:

● LTE (F<1GHz) <0.5dB

● LTE (1GHz<F<2GHz) <0.9dB

● LTE (2GHz<F) <1.2dB

L600 Hardware Design

4 Product characteristics

4.1 Absolute parameters

The following table shows the state of the absolute maximum work in abnormal situation. Exceed the limit

value will likely result in permanent damage to the module.

Table 4-1 L600 absolute parameters

Parameter Min. Max. Unit

VBAT absolute voltage parameter -0.5 6.0 V

USB_VBUS absolute voltage parameter -0.5 5.25 V

I/O absolute voltage parameter：

PWRKEY, RESET, SPI, GPIO, I2C, PCM, UART, USIM_DET

-0.3 2.1 V

I/O absolute voltage parameter：

USIM

-0.3 3.05 V

4.2 Operation condition

4.2.1 Operation voltage

This product is a DC input voltage range of 3.4 V to 4.2 V, the typical value of 3.8 V, as shown in below

table.

Table 4-2 Input DC voltage

Parameter Min. Typ. Max. Unit

VBAT Voltage 3.4 3.8 4.2 V

USB_VBUS Votage 2.0 5.0 5.25 V

About L600 dc electric property, please refer to part 3.3 digital I/O characteristics.

4.2.2 Work mode(TBD)

Table 4-3 work mode

Mode Description

Normal operation

mode

(LTE)Sleep In this case, the current consumption of module

will be reduced to the minimal level.

In sleep mode, the module can still receive paging

message and SMS.

(LTE)

Idle

Software is active. Module is registered to the

GSM/WCDMA/TD-SCDMA/EVDO/LTE network, and the

L600 Hardware Design

module is ready to communicate.

(LTE) taking Connection between two subscribers is in progress.

In this case, the power consumption depends on

network settings such as DTX off/on, FR/EFR/HR,

hopping sequences, antenna.

(LTE) Standby Module is ready for

GPRS/EDGE/WCDMA/TD-SCDMA/EVDO/LTE

data transfer, but no data is currently sent or

received. In this case, power consumption depends

on network settings and EDGE/HSPA+ /LTE

configuration.

(LTE) Data transfer There is GPRS/EDGE/WCDMA/TD-SCDMA/EVDO/LTE

data transfer in progress. In this case, power

consumption is related to network settings (e.g.

power control level); uplink/downlink data rates

and GPRS configuration (e.g. used multi-slot

settings).

Minimum mode AT command “AT+CFUN” can be used to set the module

to a minimum functionality mode without removing

the power supply. In this mode, the RF

part of the module will not work or the USIM card

will not be accessible, or both RF part and USIM

card will be closed, and the serial port is still

accessible. The power consumption in this mode is

lower than normal mode.

Flight mode Use the "AT + CFUN = 7" command or lower FLIGHTMODE

pins, the module can be configured to flight mode

under without removing the power supply condition.

In this case, the RF part does not work, but still

can use the serial port and USB, the power

consumption is lower than normal working mode.

Power off Through the "AT + CPOF" command or lower PWRKEY pin

can power off L600. At this mode, the module of

internal power supply will be closed, and the

system is stop running also. The UART and USB are

unavailable.

Sleep mode In sleep mode, the module power consumption to a

minimum, but the module is still able to receive

paging information and SMS.

4.2.3 current consumption(TBD)

The power consumption in suspended mode and without USB connection is listed in the table below.

L600 Hardware Design

Table 4-4 working current consumption (VBAT=3.8V)

Power off

Power off current 8uA

LTE Sleep/Idle

LTE supply current Sleep mode typical：TBD

Idle mode typical：TBD

LTE Data transmission

FDD B2 @1.4Mbps typical：TBD

FDD B4 @1.4Mbps typical：TBD

FDD B12 @1.4Mbps typical：TBD

FDD B13 @1.4Mbps typical：TBD

FDD B8 @180Kbps typical：TBD

FDD B20 @180Kbps typical：TBD

4.3 Working and storage temperature

The operating temperature and storage temperature of L600 is listed in the following table.

Table 4-5 Operating temperature

Parameter

Min. Typ. Max. Unit

Extended operation

temperature*

-40 25 85 ℃

Storage temperature -45 25 90 ℃

4.4 ESD performance

L600 is electrostatic sensitive device, therefore, the user in the production, assembly and

operation of the module must pay attention to the electrostatic protection. L600 ESD performance

parameters in the following table:

Table 4-6 ESD performance parameters (temperature 25 ℃, humidity: 45%)

Net contact air

VBAT GND ±5KV ±10KV

Antenna port ±4KV ±8KV

UART ±2KV ±4KV

L600 Hardware Design

USB ±3KV ±6KV

Other PADS ±2KV ±4KV

L600 Hardware Design

5 Design guideline

This chapter provides a general design of the products instruction, the user can refer to design

guidance for design, make products to achieve better performance.

5.1 General design rules and requirements

Users in the design of this product is peripheral circuit, the first to ensure the external power

supply circuit can provide enough power supply capacity, And the requirements for high speed signal

lines USB control 90 ohm + / - 10% difference impedance. For general signal interface, require the

user to us in strict accordance with the requirements of design, in line with the interface signal level

matching, in case the level of damage to the module. This product its own radio frequency index is

good, customers need to design in accordance with the requirements the mainboard side antenna

circuit and corresponding impedance control, otherwise it will affect the whole RF index.

5.2 Reference circuit

Request system board VPH_PWR side power supply ability of power supply to achieve more

than 1 A, meet the demand of modules, peak current, and the system side the power of the average

current will reach more than 0.9 A. System board side power supply cord shall ensure enough line

width, and wants to form a good return with the ground plane, moreover should increase in the power

supply circuit design the method of micro level energy storage capacitor, guarantee the instantaneous

power supply capacity, and the power supply ripple control within the 100 mv, the specific function of

each functional module can be found in the corresponding description, overall reference circuit design

please refer《L600 reference design》.

L600 Hardware Design

5.3 RF part design guideline

5.3.1 Early antenna design considerations

 Pre-project evaluation

The selection of the antenna position must first ensure that the antenna and the base station are

kept in the horizontal direction, this produces the highest efficiency; Secondly, try to avoid placing the

switch in the power supply or data line, chip and other devices or chips that produce electromagnetic

interference. At the same time, the position of the hand can be avoided, so as to prevent the human

body to produce attenuation; But also to reduce the radiation and the structure of the realization of the

need to take into account. So, At the beginning of the design need to structure, ID, circuit, antenna

engineers together to evaluate the layout.

 Antenna matching circuit

If the module's radio frequency port and the antenna interface need to be transferred, the main

board circuit design, The design of microstrip line or strip line between the module RF test base and

the antenna interface between the microstrip line or the strip line by characteristic impedance 50 ohm,

at the same time, reserved double L type matching circuit; If the antenna's RF connector can be

directly stuck in the module's RF test base, can save the module of the RF port and the antenna

interface between the transfer.

5.4 EMC and ESD design advice

Users should take full account of the EMC problem caused by signal integrity and power integrity

in the design of the whole machine, In the module of the peripheral circuit layout, for power and signal

lines, etc., to maintain the spacing of 2 times line width. Can effectively reduce the coupling between

the signal, so that the signal has a clean, the return path. When the peripheral power supply circuit is

designed, the decoupling capacitor should be placed close to the module power supply pin, High

frequency high speed circuit and sensitive circuit should be far from the edge of PCB, and the layout

of the layout as far as possible to reduce the interference between each other, and the sensitive signal is

protected. The circuit or device that may interfere with the operation of the system board is designed.

This product is embedded in the system board side, design, need to pay attention to the ESD

protection, the key input and output signal interface, such as (U) SIM card interface need to be placed

close to the protection of ESD devices. In addition to the

motherboard side, the user is required to design the structure and PCB layout, ensure that the

metal shield is fully grounded, and set up an unobstructed discharge passage for the electrostatic

discharge.

L600 Hardware Design

5.5 PCB Recommended land pattern

Recommended at 64 of peripheral signal pads to the module with a length of 1.0 mm.

Recommended PCB pads as shown in below.

Figure 5-1 RECOMMENDED LAND PATTERN (Unit: mm)

5.6 Products recommended upgrade

L600 default through the USB firmware updates, so products to facilitate the software update,

when the design proposal to set aside the USB test points or interface to facilitate subsequent product

of the firmware upgrade.

L600 Hardware Design

6 Manufacturers

6.1 Steel mesh design

 At the bottom of the module pad thermal, can be reduced by way of steel mesh

openings, reduce the risk of short circuit between the thermal and the module of the module Pin, have

certain effect;

 Module pad thermal welded steel mesh openings are recommended for reference. Figure

6-1 is recommended for steel mesh and size.

Figure 6-1 Steel mesh (unit mm)

L600 Hardware Design

Note: The direction mark point only for identify the pin 1 position, should not embody in the steel

mesh file.

6.2 Temperature curve

The temperature curve of the welding quality and material status influence, please pay special

attention. Temperature rise speed should not be too fast, from room temperature to 150, the

temperature rise rate is less than 3s. At the same time in more than 217 degrees, please try to keep time

no more than 70 seconds, at intermediate values of 55 seconds is appropriate. The thermal shock

strength is too general will lead to part of the device failure, resulting in a decline in yield and

maintenance difficulty. And please control the maximum temperature of no more than 245 degrees,

partial material, such as crystal at high temperature easy to occur the package rupture, cause unable to

play the problem, and then affect the function of the product, The temperature can be set using the

curve shown in table 6-1.

Table 6-1 Temperature curve

Lead-free process temperature curve

Stage Temperature time

Preheat Temperature rise from room

temperature to 150

rate of temperature rising

<3 / ℃ s

keep warm 150℃~200℃ 40~110 s

Welding

< 217℃ 40~70 s

< 230℃ 15~45 s

Peak temperature

MAX：245℃

MIN：230℃

L600 Hardware Design

Figure 6-2 The reference temperature curve

6.3 The Moisture Sensitivity Level (MSL)

L600 module complies with the humidity level 3. At a temperature of <30 degrees and relative

humidity of <60% of the environmental conditions, dry pack to perform J-STD-020C specification

according to IPC / JEDEC standard. At a temperature of <40 degrees and a relative humidity of <90%

L600 Hardware Design

of the environmental conditions, in the case of unopened shelf life of at least six months. After

unpacking, Table 6-2 shows the module shelf life at different times corresponding to the level of

humidity.

Table6-2: Moisture sensitivity level and floor life

The Moisture Sensitivity Level

(MSL)

Floor Life(out of bag) at factory ambient≦+30

/60%RH

1 Unlimited at ≦+30 /85%

2 1 Year

2a 4 weeks

3 168 hours

4 72 hours

5 48 hours

5a 24 hours

6

Mandatory bake before use. After bake, it must be

reflowed within the time limit specified on the

label.

After unpacking,<30 degrees in temperature and relative humidity <60% environmental

conditions, 168 hours in the SMT patch. If not meet the above conditions need to be baked.

NOTES: For product handling, storage, processing, IPC / JEDEC J-STD-020C must be

followed

6.4 Baking Requirements

Due to the humidity sensitive characteristics of the L600 module, the L600 is a vacuum

packaging, which can be stored for 6 months without damage to the package, and the ambient

temperature is less than 40 C and the relative humidity is less than 90%. To meet one of the following

conditions, the process of reflow soldering should be performed before the full bake (if trays are used,

please note whether the tray is heat-resistant.), or the module may cause permanent damage to the

process.

L600 Hardware Design

1、Vacuum packing damage or leakage

2、The module is exposed in the air for 168 hours or more

3、The module is exposed in air for 168 hours, not meet the temperature <30 degrees and

relative humidity of the environment conditions <60%

Table6-3: Baking requirements

Baking temperature Humidity Baking time

40°C±5°C <5% 192 Hours

120°C±5°C <5% 4 Hours

7 Package Storage information(TBD)

7.1 Package information(TBD)

7.1.1 Tape and reel information

7.1.1 Package information

7.2 Bagged storage conditions

L600 shipments in the form of vacuum sealing anti-static bag. Module of storage need to follow the following

conditions: Environment below 40 Degrees Celsius temperature, air humidity is less than 90% of cases, the

module can be in vacuum sealed bags for 12 months. Conditions set the storage environment Suggestions

with reference to the following form.

Table 7-1 Storage conditions (less than 90% humidity of the air vacuum sealed packaging)

Parameter Min. Typ. Max. Unit

Storage

temperature

-45 25 90 ℃

When on the vacuum bags, if meet the following conditions, the module can be directly for reflow soldering

(furnace temperature setting reference 6.2 furnace temperature curve) or other high temperature process:

L600 Hardware Design

 Module temperature below 30 degrees c, the air humidity is less than 60%, factory within 72 hours to

complete the SMT.

 The humidity is less than 10%.

If the module is in the following conditions, to be baked before SMT:

 When the environment temperature is 23 degrees Celsius (allow upper and lower volatility of 5 degrees

Celsius), humidity index greater than 10%.

 When open vacuum bags, module temperature below 30 degrees Celsius, air humidity is less than 60%,

but the factory have not finished the SMT within 72 hours.

 When open the vacuum bags, module storage air humidity is more than 10%.

FCC Certification Requirements.

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device

is a mobile device.

And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.

The antenna installation and operating configurations of this transmitter, including any applicable

source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical

Exclusion Requirements of 2.1091.

2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the

user’s body and must not transmit simultaneously with any other antenna or transmitter.

3.A label with the following statements must be attached to the host end product: This device

contains FCC ID: 2AK9DL600A.

4.To comply with FCC regulations limiting both maximum RF output power and human

exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

❒LTE band 2 <=3dBi

❒LTE band 4 <=3dBi

❒LTE band 12 <=3dBi

5. This module must not transmit simultaneously with any other antenna or transmitter

6. The host end product must include a user manual that clearly defines operating requirements

and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate

approval is required to satisfy the SAR requirements of FCC Part 2.1093

If the device is used for other equipment that separate approval is required for all other operating

configurations, including portable configurations with respect to 2.1093 and different antenna

configurations.

For this device, OEM integrators must be provided with labeling instructions of finished products.

Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a

L600 Hardware Design

permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2

Certification (labeling requirements) above). The OEM manual must provide clear instructions

explaining to the OEM the labeling requirements, options and OEM user manual instructions that are

required (see next paragraph).

For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not

visible when installed in the host, or (2) if the host is marketed so that end users do not have straight

forward commonly used methods for access to remove the module so that the FCC ID of the module is

visible; then an additional permanent label referring to the enclosed module:“Contains Transmitter

Module FCC ID:2AK9DL600A” or “Contains FCC ID: 2AK9DL600A” must be used. The host OEM

user manual must also contain clear instructions on how end users can find and/or access the module

and the FCC ID.

The final host / module combination may also need to be evaluated against the FCC Part 15B

criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital

device.

The user’s manual or instruction manual for an intentional or unintentional radiator shall caution

the user that changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate the equipment. In cases where the manual is provided only in

a form other than paper, such as on a computer disk or over the Internet, the information required by

this section may be included in the manual in that alternative form, provided the user can reasonably

be expected to have the capability to access information in that form.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) This device may not cause harmful interference, and (2) this device must accept any

interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s

authority to operate the equipment.

To ensure compliance with all non-transmitter functions the host manufacturer is responsible for

ensuring compliance with the module(s) installed and fully operational. For example, if a host was

previously authorized as an unintentional radiator under the Declaration of Conformity procedure

without a transmitter certified module and a module is added, the host manufacturer is responsible for

ensuring that the after the module is installed and operational the host continues to be compliant with

the Part 15B unintentional radiator requirements.

MobileTek Communication L600A IOT module User Manual

Shanghai MobileTek Communication Ltd. IOT module Users Manual

Users Manual

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