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MultiConnect®xDotTMMTXDOT Developer Guide
MULTICONNECT XDOT DEVELOPER GUIDE2 MultiConnect®xDotTM MTXDOT Developer GuideMultiConnect xDot Developer GuideModels: MTXDOT-NA1-xxx, MTXDOT-EU1-xxxPart Number: S000645, Version 1.0CopyrightThis publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer ofMulti-Tech Systems, Inc. All rights reserved. Copyright © 2016 by Multi-Tech Systems, Inc.Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information,material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and non-infringement.Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation ofMulti-Tech Systems, Inc. to notify any person or organization of such revisions or changes.Trademarks and Registered TrademarksMultiTech, and the MultiTech logo, and MultiConnect are registered trademarks and xDot and Conduit are trademarks of Multi-Tech Systems, Inc. All otherproducts and technologies are the trademarks or registered trademarks of their respective holders.Legal NoticesThe MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection withapplications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury ordeath, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other lifepreserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, ormissile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such RestrictedApplications is at the user’s sole risk and liability.MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BEUNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULARCOMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES,COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULARCOMMUNICATIONS NETWORK USING THE PRODUCTS.The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTechproducts as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product intowhich the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers.MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenanceof such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed writtendocument. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggestedchanges is performed only as a courtesy and without any representation or warranty whatsoever.Contacting MultiTechKnowledge BaseThe Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go.Support PortalTo create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.SupportBusiness Hours: M-F, 8am to 5pm CTCountry By Email By PhoneEurope, Middle East, Africa: support@multitech.co.uk +(44) 118 959 7774U.S., Canada, all others: support@multitech.com (800) 972-2439 or (763) 717-5863WarrantyTo read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go.World HeadquartersMulti-Tech Systems, Inc.2205 Woodale Drive, Mounds View, MN 55112Phone: (800) 328-9717 or (763) 785-3500Fax (763) 785-9874
CONTENTSMultiConnect®xDotTM MTXDOT Developer Guide 3ContentsChapter 1 Product Overview .................................................................................................................................... 6Overview ....................................................................................................................................................................... 6Documentation Overview ............................................................................................................................................. 6Related Documentation.............................................................................................................................................. 6mbed Documentation ................................................................................................................................................... 6Programming the xDot Microcontroller ..................................................................................................................... 7General mBed Links .................................................................................................................................................... 7xDot Platform ............................................................................................................................................................. 7EUI and Networking ...................................................................................................................................................... 7Product Build Options ................................................................................................................................................... 8Chapter 2 Getting Started ........................................................................................................................................ 9Getting Started with the xDot Developer Kit................................................................................................................ 9COM Port Enumeration by Operating System .............................................................................................................. 9Linux............................................................................................................................................................................ 9Windows ..................................................................................................................................................................... 9Mac ........................................................................................................................................................................... 10Chapter 3 Mechanical Drawings with Pinouts ........................................................................................................ 11xDot............................................................................................................................................................................. 11Chapter 4 Specifications and Pin Information ........................................................................................................ 12MTXDOT Specifications............................................................................................................................................... 12Mapping Data Rate to Spreading Factor/Bandwidth................................................................................................ 14Power Draw................................................................................................................................................................. 15Measuring the Power Draw ...................................................................................................................................... 15Electrical Characteristics ............................................................................................................................................. 16xDot and Processor Pin Information .......................................................................................................................... 16Pin Information ......................................................................................................................................................... 16Pull-Up/Down............................................................................................................................................................ 19xDot Pinout Design Notes ........................................................................................................................................... 20Serial Pinout Notes.................................................................................................................................................... 20Serial Settings.............................................................................................................................................................. 20LoRa ............................................................................................................................................................................ 20Throughput Rates...................................................................................................................................................... 20Range ........................................................................................................................................................................ 20Chapter 5 Antennas ............................................................................................................................................... 22Antenna System ......................................................................................................................................................... 22U.FL and Trace Antenna Options ............................................................................................................................... 22Pulse Electronics Antenna........................................................................................................................................... 23
CONTENTS4 MultiConnect®xDotTM MTXDOT Developer GuideAntenna Specifications ............................................................................................................................................. 23RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 24Coaxial Cable Specifications ..................................................................................................................................... 24Ethertronics Chip Antenna.......................................................................................................................................... 25Antenna Specifications ............................................................................................................................................. 25Stackup Information.................................................................................................................................................... 25Developer Board Layer Stackup................................................................................................................................ 25Stackup Table............................................................................................................................................................ 26Impedance ................................................................................................................................................................ 26Chip Antenna Design Guidelines................................................................................................................................. 28Antenna Pad Layout.................................................................................................................................................. 29PCB Layout ................................................................................................................................................................ 29OEM Integration ......................................................................................................................................................... 30FCC & IC Information to Consumers ......................................................................................................................... 30FCC Grant Notes........................................................................................................................................................ 30Host Labeling............................................................................................................................................................... 30Chapter 6 Safety Information................................................................................................................................. 31Handling Precautions .................................................................................................................................................. 31Radio Frequency (RF) Safety ....................................................................................................................................... 31Sécurité relative aux appareils à radiofréquence (RF).............................................................................................. 31Interference with Pacemakers and Other Medical Devices ...................................................................................... 32Potential interference............................................................................................................................................... 32Precautions for pacemaker wearers ........................................................................................................................ 32Device Maintenance ................................................................................................................................................... 32User Responsibility...................................................................................................................................................... 32Chapter 7 Regulatory Information ......................................................................................................................... 33EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 3347 CFR Part 15 Regulation Class B Devices ................................................................................................................. 33FCC Interference Notice ............................................................................................................................................. 33FCC Notice................................................................................................................................................................... 33Industry Canada Class B Notice................................................................................................................................... 34Chapter 8 Environmental Notices........................................................................................................................... 35Waste Electrical and Electronic Equipment Statement .............................................................................................. 35WEEE Directive.......................................................................................................................................................... 35Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 35REACH Statement ....................................................................................................................................................... 36Registration of Substances........................................................................................................................................ 36Substances of Very High Concern (SVHC) ................................................................................................................ 36Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 37Information on HS/TS Substances According to Chinese Standards ......................................................................... 38Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 39
CONTENTSMultiConnect®xDotTM MTXDOT Developer Guide 5Chapter 9 Labels .................................................................................................................................................... 40Label Examples............................................................................................................................................................ 40Chapter 10 Developer Kit Overview ....................................................................................................................... 41xDot Developer Kit ..................................................................................................................................................... 41Developer Kit Package Contents............................................................................................................................... 41Firmware Updates..................................................................................................................................................... 41Programming Devices in Production ........................................................................................................................ 41xDot Developer Kit Mechanical Drawings................................................................................................................... 42Micro Developer Board LEDs ...................................................................................................................................... 43Chapter 11 Developer Board Schematics................................................................................................................ 44Assembly Diagrams and Schematics........................................................................................................................... 44Assembly Diagrams................................................................................................................................................... 44Schematics ................................................................................................................................................................ 46Chapter 12 Design Considerations.......................................................................................................................... 50Noise Suppression Design........................................................................................................................................... 50PC Board Layout Guideline ......................................................................................................................................... 50Electromagnetic Interference .................................................................................................................................... 50Electrostatic Discharge Control................................................................................................................................... 51Chapter 13 Mounting xDots and Programming External Targets ............................................................................ 52Mounting the Device on Your Board .......................................................................................................................... 52Solder Profile............................................................................................................................................................... 52Setpoints (Celsius)..................................................................................................................................................... 53xDot Packing ............................................................................................................................................................... 53Programming External Targets ................................................................................................................................... 53JTAG/SWD Connector .............................................................................................................................................. 54Index...................................................................................................................................................................... 55
CHAPTER 1 PRODUCT OVERVIEW6 MultiConnect®xDotTM MTXDOT Developer GuideChapter 1 Product OverviewOverviewThe MultiConnect xDot (MTXDOT) is a LoRaWANTM, low-power RF device, capable of two way communication overlong distances, deep into buildings, or within noisy environments*using the unlicensed ISM bands in NorthAmerica, Europe and worldwide. The xDot is a compact surface-mount device with an mbed enabled processor andenhanced security. The xDot features an integrated ARM®Cortex®-M3 processor and mbedTM compatible softwarelibrary for developers to control, monitor and bring edge intelligence to their Internet of Things (IoT) applications.*Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. Indense urban environments, a typical range is 1-2 miles.Documentation OverviewThis manual is one part of xDot documentation. Refer to the Related Documentation and mbed sections foradditional information needed to program your xDot and integrate your application with the MultiConnect Conduitgateway.This document includes:■xDot device information: including mechanical drawings, specifications, safety and regulatory information,and other device specific content.■Developer Kit information: including design considerations, schematics, and installation and operationinformation.This current version of this manual is available at www.multitech.com/support.Related Documentation■DOT Series AT Command Reference: Includes details on the AT commands available for xDots.■MultiTech Developer Site: Application notes, LoRa information, and documentation for related productssuch as the MultiConnect Conduit (MTCDT) gateway and the LoRa accessory card (MTAC-LORA) are availableon the MultiTech developer site. This site includes information on using the Conduit with xDots. Go to:www.multitech.net■Processor Datasheet: ST ARM®Cortex®-M3 processor (STM32L151CCU6) datasheet is available on the STwebsite: http://www.st.com/resource/en/datasheet/stm32l151cc.pdfmbed DocumentationARM mbed is a free, open-source platform and operating system for embedded devices using the ARM Cortex-Mmicrocontrollers. The mbed website provides free software libraries, hardware designs, and online tools for rapidprototyping of products. The platform includes a standards-based C/C++ SDK, a microcontroller HDK, andsupported development boards, an online compiler and online developer collaboration tools.Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's MultiConnect Conduit(MTCDT) with an MTAC-LORA accessory card installed.
CHAPTER 1 PRODUCT OVERVIEWMultiConnect®xDotTM MTXDOT Developer Guide 7Programming the xDot MicrocontrollerNote: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on adeveloper board.Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resultingbinary file to the mbed USB drive, and reset the xDot.On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC andETSI certification, some portions of the software is available only as binary libraries.MultiTech offers both development and stable release versions of the library.■Development version: libmxDot-dev-mbed5■Stable release version: libmxDot-mbed5You can use either the mbed online compiler or offline tools.■Online: Use the mbed-os library in your mbed application■Offline: Use mbed-cli tools to create, manage, and build your mbed 5.1 application.General mBed Links■Explore mbed: http://developer.mbed.org/explore■Getting Started with mbed: http://developer.mbed.org/getting-started■mbed Handbook: http://developer.mbed.org/handbook/Homepage■mbed online compiler documentation: https://developer.mbed.org/handbook/mbed-Compiler■mbed cli documentation: https://github.com/ARMmbed/mbed-cli/blob/master/README.md■mbed workspace tools documentation: https://github.com/ARMmbed/mbed-os/blob/master/docs/BUILDING.md#workspace-toolsxDot PlatformThe xDot mbed page includes the xDot library, firmware, and test caseshttps://developer.mbed.org/platforms/MTS-xDot-L151CC/EUI and NetworkingxDots have an Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI:AT+DI=<8-BYTE-HEX-MSB>AT+DI=001122AABBCCDDEEFor information on setting up xDots as part of a LoRa network, go to www.multitech.net.
CHAPTER 1 PRODUCT OVERVIEW8 MultiConnect®xDotTM MTXDOT Developer GuideProduct Build OptionsProduct Description Package QuantityNorth AmericaMTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1 or 100MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) 100EMEAMTXDOT-EU1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100MTXDOT-EU1-A01 868 MHz LoRa Module TRC (EU) 100Developer KitsMTMDK-XDOT-NA1-A00 MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDotMTMDK-XDOT-EU1-A00 MultiConnect xDot Micro Developer Kit - Includes a 868 MHz xDotNote:■The complete product code may end in .Rx. For example, MTXDOT-NA1-A00.Rx, where R is revisionand x is the revision number.
CHAPTER 2 GETTING STARTEDMultiConnect®xDotTM MTXDOT Developer Guide 9Chapter 2 Getting StartedGetting Started with the xDot Developer KitGetting started depends on what you want to do. By default, xDot ships with firmware that supports ATCommands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT CommandReference Guide.Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot andthe other is for debug messages. Refer to Chapter 4, Specifications and Pin Information for information on whichpins are available out of the box.Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot.Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/To send commands to the xDot:1. Plug the developer board into a USB port.2. Open communications software, such as TeraTerm, Putty, or Minicom.3. Set the following:■Baud rate = 115,200■Data bits = 8■Parity = N■Stop bits = 1■Flow control = OffTo develop using mbed, the xDot mbed page includes libraries and test cases. Refer to mbed Documentation fordetails and links.For help setting up a MultiConnect®Conduit™to send data to and from an xDot, refer to Related Documentation .COM Port Enumeration by Operating SystemxDots create an AT Commands port and a debug port.LinuxThe following COM ports are created on Linux systems:■/dev/ttyACMx■/dev/ttyACMyWhere x and y may be 0 and 1, 3 and 4, etc.The COM port with lower number is the AT command port and COM port with the higher number is the debugport.WindowsOn Windows systems, COM ports appear in the Device Manager:■Debug Port: mbed Serial Port
CHAPTER 2 GETTING STARTED10 MultiConnect®xDotTM MTXDOT Developer Guide■AT Command Port: XR21V1410 USB UARTYou may need to install a driver for the debug port to function properly. Go to:https://developer.mbed.org/handbook/Windows-serial-configurationMacOn Mac systems, COM ports appear in the Device Manager as:■/dev/cu.usbmodemxWhere x is a string of numbers and possibly letters, ending in a number.The COM port with lower number is the AT command port and COM port with the higher number is the debugport.
CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTSMultiConnect®xDotTM MTXDOT Developer Guide 11Chapter 3 Mechanical Drawings with PinoutsxDot
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION12 MultiConnect®xDotTM MTXDOT Developer GuideChapter 4 Specifications and Pin InformationMTXDOT SpecificationsCategory DescriptionGeneralCompatibility LoRaWAN 1.0 specificationsInterfaces Note that pin functions are multiplexed.Up to 19 digital I/OUp to 10 analog inputs2 DAC outputsI2CSPIWake pinReset pinFull UARTmbed/simple UART (RX & TX only)mbed programming interfaceCPU PerformanceCPU 32 MHzMax Clock 32 MHzFlash Memory 256 KB, with xDot library 136 KB available; with AT firmware, 56 KB availableEEPROM 8 KB, available 6 KBSRAM 32 KBBackup Register 128 byte, available 88Radio FrequencyISM Bands 863 MHz - 868 MHz, 902 MHz - 928 MHz, 915 MHz - 935 MHzPhysical DescriptionWeight 0.0001 oz. (0.003g)Dimensions Refer to Mechanical Drawings for Dimensions.RF Connectors-UFL Models U.FL-Trace Models Trace Connection
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATIONMultiConnect®xDotTM MTXDOT Developer Guide 13Category DescriptionEnvironmentOperatingTemperature-40° C to +85° CStorageTemperature-40° C to +85° CHumidity 20%-90% RH, non-condensingPower RequirementsOperating Voltage 2.4 to 3.57 VCertifications and ComplianceEMC and RadioComplianceEN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012EN 301 489-03 V1.6.1:2013 ICES-003:2012FCC 15.247:2015 CISPR 22:2008FCC 15.109:2015 AS/NZS CISPR 22FCC 15.107:2015 AS/NZS 4268:2012 + a1:2013RSS 247:2015 Standard 2014 MPESafety Compliance UL 60950-1 2nd EDcUL 60950-1 2nd EDIEC 60950-1 2nd ED AM1 + AM2AS/NZS 60950.1:2015Category DescriptionTransmissionNorth America EMEAMax TransmitterPower Output (TPO)19 dBm 14 dBmMaximum ReceiveSensitivity-137 dBm -137 dBmLink Budget1147 dB Point-to-Point 147 dB Point-to-PointMax EffectiveIsotropic RadiatedPower (EiRP)22 dBm 10 dBm
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION14 MultiConnect®xDotTM MTXDOT Developer GuideCategory DescriptionReceive SensitivitySpreading Factor North America Typical Sensitivity2EMEA Typical Sensitivity36 -111 dBm -121 dBm7 -116 dBm -124 dBm8 -119 dBm -127 dBm9 -122 dBm -130 dBm10 -125 dBm -133 dBm11 -127 dBm -135 dBm12 -129 dBm -137 dBm1Greater link budget is possible with higher gain antenna.2RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Txpath.3RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Txpath.Mapping Data Rate to Spreading Factor/BandwidthUplink DownlinkUS/AU DR0: SF10BW125 DR8: SF12BW500DR1: SF9BW125 DR9: SF11BW500DR2: SF8BW125 ...DR3: SF7BW125 DR13: SF7BW500DR4: SF8BW500DR5-DR7: RFUEU DR0: SF12BW125...DR5: SF7BW15DR6: SF7BW250DR7: FSK
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATIONMultiConnect®xDotTM MTXDOT Developer Guide 15Power DrawNote:■Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power sourcewhen determining product load.■Transmit power measured with MTXDOT-NA1-xxx transmitting to a MultiConnect Conduit with anMTAC-LORA-915 accessory card installed.■Power measurements are similar for MTXDOT-EU1-xxx models. Some 868 MHz sub-band frequenciesdo not support maximum TXP power of 20.■Idle current measured with the xDot joined with Conduit, but idle without data transferring.■Transmit power measured while transferring data packets using spread factor 9. Packet size limitedto 53 bytes. The Conduit was set to receive packets from and send back to the xDot. A script was runto send the packet 100 times with either 10 or 53 bytes of data, with an average measurement takenduring that time.■For Inrush charge, recorded the highest observed value from five separate measurements.Voltage USB = 5v Standby ModeCurrent, (Sleep = 0Deep Sleep)Stop ModeCurrent,(Sleep = 1)Idle currentAverageSpreading Factor Setting Packet Size (#Bytes)LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 10LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 53Voltage USB =5vAverage Current(Amps) at LowTransmit PowerSetting (TXP 2)Average Current(Amps) at DefaultTransmit PowerSetting (TXP 11)Average Current(Amps) atMaximumTransmit PowerSetting (TXP 20)Total InrushChargemeasured inMilliCoulombsTotal Inrush ChargeDURATION duringPowerup (INRUSHDuration)LDO = 3.3 0.013 0.017 0.018 0.132mC 153uSLDO = 3.3 0.017 0.024 0.025 0.132mC 147uSMeasuring the Power DrawTo measure the power draw on an xDot developer board:1. Flash the latest AT command firmware on the xDot.2. Unplug the xDot from the computer and then reconnect it.3. Connect current meter across JP30 on the developer board.4. Set wake pin to wake, AT+WP=6.5. Set wake mode to interrupt, AT+WM=1.6. Put the xDot to sleep, AT+SLEEP=0|1.7. Put jumper across JP5.Note: After this step, AT command and debug ports no longer work.8. Measure current draw.9. Press the S2 button on the developer board to wake the xDot
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION16 MultiConnect®xDotTM MTXDOT Developer GuideElectrical CharacteristicsSignal Description Min MaxVin Low Input low level -- 0.3 * VDDVin High Input high level 0.45 * VDD +0.6 --Vout Low Output low level -- .4Vout High Output high level 0.4 --VCC Standard operating voltage 2.4 3.6ICC Operating current (mA)@5V-- 135Operating current (mA)@3.3V-- 200xDot and Processor Pin InformationPin InformationNote:■Using the mbed platform expands your pin functionality options.■Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left)■The xDot is 0.045 x 0.045, board is 0.93 x 0.93
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATIONMultiConnect®xDotTM MTXDOT Developer Guide 1748QFN xDot Pin Pin Name SW Name FunctionDescriptionProcessor PinAlt1Processor Pin Alt225 9 PB12 SPI2_NSS GPIO / SPI TIM10_CH1/I2C2_SMBA/SPI2_NSS/I2S2_WS/USART3_CK/LCD_SEG12ADC_IN18/COMP1_INP/VLCDRAIL226 10 PB13 SPI2_SCK GPIO / SPI TIM9_CH1/SPI2_SCK/I2S2_CK/USART3_CTS/LCD_SEG13ADC_IN19/COMP1_INP28 11 PB15 SPI2_MOSI GPIO / SPI TIM11_CH1/SPI2_MOSI/I2S2_SD/LCD_SEG15ADC_IN21/COMP1_INP/RTC_REFIN27 12 PB14 SPI2_MISO GPIO / SPI TIM9_CH2/SPI2_MISO/USART3_RTS/LCD_SEG14ADC_IN20/COMP1_INP30 13 PA9 UART1_TX GPIO / UART USART1_TX/LCD_COM1-31 14 PA10 UART1_RX GPIO / UART USART1_RX/LCD_COM2-12 15 PA2 UART2_TX Debug UART13 16 PA3 UART2_RX Debug UART20 23 PB2 GPIO3 GPIO BOOT1 VLCDRAIL1/ ADCIN0b18 24 PB0 GPIO2 GPIO TIM3_CH3/LCD_SEG5ADC_IN8/COMP1_INP/OPAMP2_VOUT/VLCDRAIL3/VREF_OUT15 25 PA5 GPIO1 GPIO TIM2_CH1_ETR/SPI1_SCKADC_IN5/DAC_OUT2/COMP1_INP14 26 PA4 GPIO0 GPIO SPI1_NSS/SPI3_NSS/I2S3_WS/USART2_CKADC_IN4/DAC_OUT1/COMP1_INP45 27 PB8 I2C1_SCL GPIO / I2C TIM4_CH3/TIM10_CH1/I2C1_SCL/LCD_SEG16-
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION18 MultiConnect®xDotTM MTXDOT Developer Guide48QFN xDot Pin Pin Name SW Name FunctionDescriptionProcessor PinAlt1Processor Pin Alt246 28 PB9 I2C1_SDA GPIO / I2C TIM4_CH4/TIM11_CH1/I2C1_SDA/LCD_COM3-37 29 PA14 MBED SWCLK JTCK-SWCLK -34 30 PA13 MBED SWDIO JTMS-SWDIO -33 31 PA12 UART1_RTS GPIO / UART USART1_RTS/SPI1_MOSIUSB_DP32 32 PA11 UART1_CTS GPIO / UART USART1_CTS/SPI1_MISOUSB_DM7 33 NRST NRESET - -10 34 PA0-WKUP1 WAKE GPIO / WAKE TIM2_CH1_ETR/TIM5_CH1/USART2_CTSWKUP1/RTC_TAMP2/ADC_IN0/COMP1_INP37 ANT147 RFU (ANT2)8,23,35,47,491, 5, 17,20,35, 36,38, 39,40, 41,42, 43,44, 45,46, 48,49, 50,51, 52,53, 54,55, 56,57, 58VSS GND2, 6, 7, 8,18, 19,21, 22Reserved16 PA6 LORA_DIO0 LORA Radio17 PA7 LORA_DIO1 LORA Radio29 PA8 LORA_DIO2 LORA Radio42 PB6 LORA_DIO3 LORA Radio43 PB7 LORA_DIO4 LORA Radio40 PB4 LORA_MISO LORA Radio41 PB5 LORA_MOSI LORA Radio
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATIONMultiConnect®xDotTM MTXDOT Developer Guide 1948QFN xDot Pin Pin Name SW Name FunctionDescriptionProcessor PinAlt1Processor Pin Alt238 PA15 LORA_NSS LORA Radio11 PA1 LORA_RESET LORA Radio39 PB3 LORA_SCK LORA Radio22 PB11 SE_CLK Secure Element19 PB1 SE_CTRL Secure Element21 PB10 SE_IO Secure Element2 PC13-WKUP2 SE_RESET Secure Element44 BOOT0 Boot0 - -3 PC14-OSC32_IN(4)RTC_CLK - OSC32_IN4 PC15-OSC32_OUTRTC_CLK - OSC32_OUT5 PH0-OSC_IN(5)Main 24M - OSC_IN6 PH1-OSC_OUT(5)Main 24M - OSC_OUTPull-Up/Down48QFN xDot Pin Pin Name SW Name PU/PD7 33 NRST 10k PU38 PA15 LORA_NSS 100k PU19 PB1 SE_CTRL 10k PU44 BOOT0 10k PD
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION20 MultiConnect®xDotTM MTXDOT Developer GuidexDot Pinout Design NotesRefer to the mechanical drawing for your model for pin locations.■All pins that go to connectors are directly connected to the processor.■Refer to Pin Information table for pull up and pull down information.xDots allow you to program pins depending on your application:■Serial: Available out of the box. See Serial Pinout Notes for details.■mbed: Designed with the STM32L151CCU6 48-pin processor, this option provides the most flexibility. Formore information about processor capabilities, see the processor datasheet.Serial Pinout NotesOut of the box, these pins are available for serial applications. Refer to the mechanical drawing for your model forpin locations.■18 PTA1 UART1_CTS■19 PTA2 UART1_RTS■36 PTC3 UART1_RX■37 PTC4 UART1_TXSerial SettingsWhen creating a serial connection with the device on the developer board, open communications software (suchas TeraTerm, Putty, or Minicom ), and use the following settings:■Baud rate = 115,200■Data bits = 8■Parity = N■Stop bits = 1■Flow control = OffLoRaThroughput RatesTheoretical maximum speeds for LoRa mode with ACKs off are:■Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps).■Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps).Note: Data rates in the LoRaWAN specification vary by geographic region.RangeVariables effecting the range include TX power, antenna gain, RX sensitivity, fade margin, earth's curvature. Usethe following formula to calculate the maximum range:
CHAPTER 4 SPECIFICATIONS AND PIN INFORMATIONMultiConnect®xDotTM MTXDOT Developer Guide 21The following table provides example settings and the theoretical maximum range based on these settings.Example 18dB Transmit Power for915 MHz ModelsUnits Example 14dB Transmit Power for868MHz ModelsFrequency 915 MHz 868TX Power 19 dBm 14TX Antenna Gain 3 dB 3RX Sensitivity1-120 dBm -120RX Antenna Gain 3 dB 3Fade Margin230 dB 30Distance 8.14 Miles 5.41Distance 13.08 Km 8.701RX Sensitivity is set to a conservative -120dBm, but can vary from -117 to -137dBm.2Fade Margin is set at the worst case of 30dB. Fade margin is an allowance a system designer includes to accountfor unknown variables. The higher the fade margin, the better the overall link quality will be. With a fade marginset to zero, the link budget is still valid, but only in LOS conditions, which is not practical for most designs. Theamount of fade margin to include in a calculation depends on the environment in which you will deploy thesystem. A fade margin of 12 dBm is good, but a better number would be 20 to 30 dBm.
CHAPTER 5 ANTENNAS22 MultiConnect®xDotTM MTXDOT Developer GuideChapter 5 AntennasAntenna SystemThe LoRa antenna performance depends on the implementation and antenna design. The integration of theantenna system into the product is a critical part of the design process; therefore, it is essential to consider it earlyso the performance is not compromised. If changes are made to the device's certified antenna system, thenrecertification will be required.This radio transmitter has been tested with both the Pulse and Ethertronics antennas listed below. If you followour design guidelines, you do not need to re-certify your design. The antenna you use must maintain the samespecifications. It must be of the same type, with similar in-band and out-of-band radiation patterns. Antennashaving a greater gain than the maximum gain indicated for the listed type, are strictly prohibited for use with thisdevice.U.FL and Trace Antenna OptionsIf using U.FL or trace antennas, note the following:■For a simple trace to RF antennas: Routing must follow standard RF design rules and practices forstripline/miscrostrip for a 50 ohm impedance line. Use the developer board schematics for a referencecircuit for the a trace antenna.■For U.FL antennas: The antenna and cable combination in your design cannot exceed the performance ofthe SMA antenna as listed in the next topic.■The xDot Developer Board includes an Ethertronics M620710-1K chip antenna, which by default connectsthe xDot to the chip antenna. Only one antenna, either U.FL or chip, may be used at a time. To use thexDot’s U.FL connector, remove resistor C23 and L1, marked on the following image, to disconnect the chipantenna.
CHAPTER 5 ANTENNASMultiConnect®xDotTM MTXDOT Developer Guide 23Pulse Electronics AntennaManufacturer: Pulse ElectronicsDescription: 868-915 MHz RP-SMA Antenna, 8"Model Number: W1063MultiTech Part Number: 45009830LMultiTech ordering information:Ordering Part Number QuantityAN868-915A-1HRA 1AN868-915A-10HRA 10AN868-915A-50HRA 50Antenna SpecificationsCategory DescriptionFrequency Range 868-928 MHzImpedance 50 OhmsVSWR < 2.0Gain 3.0 dBiRadiation Omni
CHAPTER 5 ANTENNAS24 MultiConnect®xDotTM MTXDOT Developer GuideCategory DescriptionPolarization VerticalRSMA-to-U.FL Coaxial CablesCoaxial Cable SpecificationsOptional antenna cables can be ordered from MultiTechCable Type Coaxial CableAttenuation <1.0dbConnector Impedance 50 ohmMaximum Cable Length 16" (40 cm)Ordering InformationPart Number DescriptionCARSMA-UFL-1 RSMA-to-UFL Coax Cable (Single Pack)CARSMA-UFL-10 RSMA-to-UFL Coax Cable (Ten Pack)CARSMA-UFL-100 RSMA-to-UFL Coax Cable (One Hundred Pack)
CHAPTER 5 ANTENNASMultiConnect®xDotTM MTXDOT Developer Guide 25Ethertronics Chip AntennaThis is the developer board's default antenna.Manufacturer: EthertronicsDescription: 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface MountModel Number: M620710-1KDatasheet: http://www.ethertronics.com/files/2914/0652/9246/2-Savvi_M620710_ISM__6x2.pdfAntenna SpecificationsCategory DescriptionElectrical SpecificationsFrequency Range 902—928 MHzPeak Gain 2.56 dBiVSWR 2:6:1 maxImpedance 50 ohms unbalancedAverage Efficiency 58%Power Handling 0.5 Watt cwPolarization LinearMechanical SpecificationsMounting Surface MountSize 6.00 x 2.00 x 1.1mmStackup InformationDeveloper Board Layer Stackup
CHAPTER 5 ANTENNAS26 MultiConnect®xDotTM MTXDOT Developer GuideStackup TableImpedancePolar trial balance (L1 refer to L2) impedance 50.87 ohms, using 11 mil tracs, 22mil space.
CHAPTER 5 ANTENNASMultiConnect®xDotTM MTXDOT Developer Guide 27Polar trial balance (L1 refer to L2/L4 refer to L3) impedance 93.54 ohms, using 8 mil tracs, 7mil space.
CHAPTER 5 ANTENNAS28 MultiConnect®xDotTM MTXDOT Developer GuideChip Antenna Design GuidelinesWhen designing antenna placement for the chip antenna, note the following:■The antenna's long side must be along the edge of the ground plane.■Remove the ground plane from all layers below the antenna.■The distance from the antenna to the enclosure or plastic cover should be greater than 1.5 mm.The distance from the antenna to relatively large perturbations, such as a shield or large components, depends onthe height of surrounding components. It should not be less than 1.5mm.We recommend a distance equal to or greater than 10mm from the end of the antenna to either end of the PCBdistance. Performance is better from larger distances.Use the recommended land pattern shown in the figures below. Land patterns are composed of a 50 ohm lineconnected to each antenna feed point. Ground clearance around and under the antenna as shown in the PCBlayout is recommended to maximize antenna performance.
CHAPTER 5 ANTENNASMultiConnect®xDotTM MTXDOT Developer Guide 29Antenna Pad LayoutPCB Layout
CHAPTER 5 ANTENNAS30 MultiConnect®xDotTM MTXDOT Developer GuideOEM IntegrationFCC & IC Information to ConsumersThe user manual for the consumer must contain the statements required by the following FCC and IC regulations:47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4.FCC Grant NotesThe OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may benecessary.FCC DefinitionsPortable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that theradiating structure(s) of the device is/are within 20 centimeters of the body of the user.Mobile: (§2.1091) — A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20 centimeters is normallymaintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons.Actual content pending Grant:This device is a mobile device with respect to RF exposure compliance. Theantenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from allpersons, and must not be collocated or operate in conjunction with any other antenna or transmitter except inaccordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specificinformation required to satisfy RF exposure compliance for installations and final host devices. (See note underGrant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee.Note: Host design configurations constituting a device for portable use (<20 cm from human body) requireseparate FCC/IC approval.Host LabelingThe following statements are required to be on the host label:■This device contains FCC ID: AU792U13A16858■This device contains equipment certified under IC: 125A-0055For labeling examples, see Cellular Approvals and Labeling Requirements.
CHAPTER 6 SAFETY INFORMATIONMultiConnect®xDotTM MTXDOT Developer Guide 31Chapter 6 Safety InformationHandling PrecautionsTo avoid damage due to the accumulation of static charge, use proper precautions when handling any cellulardevice. Although input protection circuitry has been incorporated into the devices to minimize the effect of staticbuild-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting thedevice.Radio Frequency (RF) SafetyDue to the possibility of radio frequency (RF) interference, it is important that you follow any special regulationsregarding the use of radio equipment. Follow the safety advice given below.■Operating your device close to other electronic equipment may cause interference if the equipment isinadequately protected. Observe any warning signs and manufacturers’ recommendations.■Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use ofradio equipment in fuel depots, chemical plants, or where blasting operations are in process. Followrestrictions for any environment where you operate the device.■Do not place the antenna outdoors.■Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft mayendanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restrictionmay lead to suspension or denial of cellular services to the offender, legal action, or both.■Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehiclewith fuel.■Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use.Sécurité relative aux appareils à radiofréquence (RF)À cause du risque d'interférences de radiofréquence (RF), il est important de respecter toutes les réglementationsspéciales relatives aux équipements radio. Suivez les conseils de sécurité ci-dessous.■Utiliser l'appareil à proximité d'autres équipements électroniques peut causer des interférences si leséquipements ne sont pas bien protégés. Respectez tous les panneaux d'avertissement et lesrecommandations du fabricant.■Certains secteurs industriels et certaines entreprises limitent l'utilisation des appareils cellulaires. Respectezces restrictions relatives aux équipements radio dans les dépôts de carburant, dans les usines de produitschimiques, ou dans les zones où des dynamitages sont en cours. Suivez les restrictions relatives à chaquetype d'environnement où vous utiliserez l'appareil.■Ne placez pas l'antenne en extérieur.■Éteignez votre appareil sans fil dans les avions. L'utilisation d'appareils électroniques portables en avion estillégale: elle peut fortement perturber le fonctionnement de l'appareil et désactiver le réseau cellulaire. S'ilne respecte pas cette consigne, le responsable peut voir son accès aux services cellulaires suspendu ouinterdit, peut être poursuivi en justice, ou les deux.■Éteignez votre appareil sans fil à proximité des pompes à essence ou de diesel avant de remplir le réservoirde votre véhicule de carburant.
CHAPTER 6 SAFETY INFORMATION32 MultiConnect®xDotTM MTXDOT Developer Guide■Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sontsusceptibles d'être utilisés.Interference with Pacemakers and Other Medical DevicesPotential interferenceRadio frequency energy (RF) from cellular devices can interact with some electronic devices. This iselectromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implantedcardiac pacemakers and defibrillators from cellular devices. This test method is part of the Association for theAdvancement of Medical Instrumentation (AAMI) standard. This standard allows manufacturers to ensure thatcardiac pacemakers and defibrillators are safe from cellular device EMI.The FDA continues to monitor cellular devices for interactions with other medical devices. If harmful interferenceoccurs, the FDA will assess the interference and work to resolve the problem.Precautions for pacemaker wearersIf EMI occurs, it could affect a pacemaker in one of three ways:■Stop the pacemaker from delivering the stimulating pulses that regulate the heart's rhythm.■Cause the pacemaker to deliver the pulses irregularly.■Cause the pacemaker to ignore the heart's own rhythm and deliver pulses at a fixed rate.Based on current research, cellular devices do not pose a significant health problem for most pacemaker wearers.However, people with pacemakers may want to take simple precautions to be sure that their device doesn't causea problem.■Keep the device on the opposite side of the body from the pacemaker to add extra distance betweenthe pacemaker and the device.■Avoid placing a turned-on device next to the pacemaker (for example, don’t carry the device in a shirtor jacket pocket directly over the pacemaker).Device MaintenanceWhen maintaining your device:■Do not attempt to disassemble the device. There are no user serviceable parts inside.■Do not expose your device to any extreme environment where the temperature or humidity is high.■Do not expose the device to water, rain, or spilled beverages. It is not waterproof.■Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. Theinformation contained on discs or cards may be affected by the device.■Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant withMultiTech's accessory specifications may invalidate the warranty.If the device is not working properly, contact MultiTech Technical Support.User ResponsibilityRespect all local regulations for operating your wireless device. Use the security features to block unauthorized useand theft.
CHAPTER 7 REGULATORY INFORMATIONMultiConnect®xDotTM MTXDOT Developer Guide 33Chapter 7 Regulatory InformationEMC, Safety, and R&TTE Directive ComplianceThe CE mark is affixed to this product to confirm compliance with the following European Community Directives:Council Directive 2014/30/EU on the approximation of the laws of Member States relating toelectromagnetic compatibility;andCouncil Directive 2014/35/EU on the harmonization of the laws of Member States relating to electricalequipment designed for use within certain voltage limits;andCouncil Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electricaland electronic equipment;andCouncil Directive 1999/5/EC on radio equipment and telecommunications terminal equipment and themutual recognition of their conformity.47 CFR Part 15 Regulation Class B DevicesThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in aresidential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installedand used in accordance with the instructions, may cause harmful interference to radio communications. However,there is no guarantee that interference will not occur in a particular installation. If this equipment does causeharmful interference to radio or television reception, which can be determined by turning the equipment off andon, the user is encouraged to try to correct the interference by one or more of the following measures:■Reorient or relocate the receiving antenna.■Increase the separation between the equipment and receiver.■Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.■Consult the dealer or an experienced radio/TV technician for help.Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliancecould void the user’s authority to operate the equipment.FCC Interference NoticePer FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions: (1) This device may not cause harmful interference, and (2) this device must accept anyinterference received, including interference that may cause undesired operation.FCC NoticexDot products are open development based products that contain a sub ghz radio technology. MultiTech hascertified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC15.247:2015 & IC RSS 247:2015)
CHAPTER 7 REGULATORY INFORMATION34 MultiConnect®xDotTM MTXDOT Developer GuideMultiTech provides software code meant to operate the radio to a level that maintains compliance with theoperating modes under which these radio devices were certified. To ensure this level of compliance, the softwarecode is provided in binary form only. Users are prohibited from making any changes that affect the operation ofthe radio performance. Accessing or controlling the radio through any means other than the provided binarysoftware will require the user to obtain their own intentional radiator license from the certification body governingtheir locality, as all pre-certification provided with xDot will have been made invalid.Industry Canada Class B NoticeThis Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.Cet appareil numérique de la classe B respecte toutes les exigences du Reglement Canadien sur le matérielbrouilleur.This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for thefollowing two conditions:1. the device may not cause harmful interference, and2. the user of the device must accept any interference suffered, even if the interference is likely tojeopardize the operation.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.L'exploitation est autorisée aux deux conditions suivantes:1. l'appareil ne doit pas produire de brouillage, et2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage estsusceptible d'en compromettre le fonctionnement.
CHAPTER 8 ENVIRONMENTAL NOTICESMultiConnect®xDotTM MTXDOT Developer Guide 35Chapter 8 Environmental NoticesWaste Electrical and Electronic Equipment StatementNote: This statement may be used in documentation for your final product applications.WEEE DirectiveThe WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to take-back electronics products at the end of their useful life. A sister directive, ROHS (Restriction of HazardousSubstances) complements the WEEE Directive by banning the presence of specific hazardous substances in theproducts at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recoveryfrom municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements.Instructions for Disposal of WEEE by Users in the European UnionThe symbol shown below is on the product or on its packaging, which indicates that this product must not bedisposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handingit over to a designated collection point for the recycling of waste electrical and electronic equipment. The separatecollection and recycling of your waste equipment at the time of disposal will help to conserve natural resourcesand ensure that it is recycled in a manner that protects human health and the environment. For more informationabout where you can drop off your waste equipment for recycling, please contact your local city office, yourhousehold waste disposal service or where you purchased the product.July, 2005
CHAPTER 8 ENVIRONMENTAL NOTICES36 MultiConnect®xDotTM MTXDOT Developer GuideREACH StatementRegistration of SubstancesAfter careful review of the legislation and specifically the definition of an “article” as defined in EC Regulation1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view Multi-Tech Systems, Inc. products would beconsidered as “articles”. In light of the definition in § 7.1(b) which requires registration of an article only if itcontains a regulated substance that “is intended to be released under normal or reasonably foreseeable conditionsof use,” Our analysis is that Multi-Tech Systems, Inc. products constitute nonregisterable articles for their intendedand anticipated use.Substances of Very High Concern (SVHC)Per the candidate list of Substances of Very High Concern (SVHC) published October 28, 2008 we have reviewedthese substances and certify the Multi-Tech Systems, Inc. products are compliant per the EU “REACH”requirements of less than 0.1% (w/w) for each substance. If new SVHC candidates are published by the EuropeanChemicals Agency, and relevant substances have been confirmed, that exceeds greater than 0.1% (w/w), Multi-Tech Systems, Inc. will provide updated compliance status.Multi-Tech Systems, Inc. also declares it has been duly diligent in ensuring that the products supplied are compliantthrough a formalized process which includes collection and validation of materials declarations and selectivematerials analysis where appropriate. This data is controlled as part of a formal quality system and will be madeavailable upon request.
CHAPTER 8 ENVIRONMENTAL NOTICESMultiConnect®xDotTM MTXDOT Developer Guide 37Restriction of the Use of Hazardous Substances (RoHS)Multi-Tech Systems, Inc.Certificate of Compliance2011/65/EUMulti-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitationsset forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain HazardousSubstances in electrical and electronic equipment - RoHS).These MultiTech products do not contain the following banned chemicals1:■Lead, [Pb] < 1000 PPM■Mercury, [Hg] < 1000 PPM■Hexavalent Chromium, [Cr+6] < 1000 PPM■Cadmium, [Cd] < 100 PPM■Polybrominated Biphenyl, [PBB] < 1000 PPM■Polybrominated Diphenyl Ether, [PBDE] < 1000 PPMEnvironmental considerations:■Moisture Sensitivity Level (MSL) =1■Maximum Soldering temperature = 260C (in SMT reflow oven)1Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentrationwould be found in some modules (>1000 PPM);- Resistors containing lead in a glass or ceramic matrix compound.
CHAPTER 8 ENVIRONMENTAL NOTICES38 MultiConnect®xDotTM MTXDOT Developer GuideInformation on HS/TS Substances According to Chinese StandardsIn accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic InformationProducts (EIP) # 39, also known as China RoHS, the following information is provided regarding the names andconcentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-TechSystems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII).Hazardous/Toxic Substance/ElementsName of the Component Lead(PB)Mercury(Hg)Cadmium(CD)HexavalentChromium(CR6+)PolybrominatedBiphenyl(PBB)Polybrominated DiphenylEther (PBDE)Printed Circuit Boards O O O O O OResistors X O O O O OCapacitors X O O O O OFerrite Beads O O O O O ORelays/Opticals O O O O O OICs O O O O O ODiodes/ Transistors O O O O O OOscillators and Crystals X O O O O ORegulator O O O O O OVoltage Sensor O O O O O OTransformer O O O O O OSpeaker O O O O O OConnectors O O O O O OLEDs O O O O O OScrews, Nuts, and otherHardwareX O O O O OAC-DC Power Supplies O O O O O OSoftware /Documentation CDs O O O O O OBooklets and Paperwork O O O O O OChassis O O O O O OXRepresents that the concentration of such hazardous/toxic substance in all the units of homogeneousmaterial of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits.ORepresents that no such substances are used or that the concentration is within the aforementioned limits.
CHAPTER 8 ENVIRONMENTAL NOTICESMultiConnect®xDotTM MTXDOT Developer Guide 39Information on HS/TS Substances According to Chinese Standards (inChinese)依依照照中中国国标标准准的的有有毒毒有有害害物物质质信信息息根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准－中华人民共和国《电子信息产品污染控制管理办法》（第 39 号），也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒物质 (TS) 或有害物质 (HS) 的名称及含量水平方面的信息。有有害害//有有毒毒物物质质//元元素素成成分分名名称称 铅铅 (PB) 汞汞 (Hg) 镉镉 (CD) 六六价价铬铬 (CR6+) 多多溴溴联联苯苯(PBB)多多溴溴二二苯苯醚醚(PBDE)印刷电路板 O O O O O O电阻器 X O O O O O电容器 X O O O O O铁氧体磁环 O O O O O O继电器/光学部件 O O O O O OICs O O O O O O二极管/晶体管 O O O O O O振荡器和晶振 X O O O O O调节器 O O O O O O电压传感器 O O O O O O变压器 O O O O O O扬声器 O O O O O O连接器 O O O O O OLEDs O O O O O O螺丝、螺母以及其它五金件 X O O O O O交流-直流电源 O O O O O O软件/文档 CD O O O O O O手册和纸页 O O O O O O底盘 O O O O O OX表示所有使用类似材料的设备中有害/有毒物质的含量水平高于 SJ/Txxx-2006 限量要求。O表示不含该物质或者该物质的含量水平在上述限量要求之内。
CHAPTER 9 LABELS40 MultiConnect®xDotTM MTXDOT Developer GuideChapter 9 LabelsLabel ExamplesNote: Actual labels vary depending on the regulatory approval markings and content.This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) Thisdevice may not cause harmful interference, and (2) this device must accept any interference received, includinginterference that may cause undesired operation.The label shown is not the actual size.1 - MultiTech Model Identification.2 - MultiTech Ordering Part Number.3 - Device Node Number.Example xDot Device Label Example Developer Board Device Label
CHAPTER 10 DEVELOPER KIT OVERVIEWMultiConnect®xDotTM MTXDOT Developer Guide 41Chapter 10 Developer Kit OverviewxDot Developer KitThe xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kitinto a USB port on your computer to test, program, and evaluate your application.Developer Kit Package ContentsYour Developer Kit (MTMDK-NX-XDOT-xx) includes the following:Developer Board 1 - xDot Developer Board with xDotCustomer Notices Quick StartFirmware UpdatesBefore starting your project development, make sure you have the latest firmware for the Developer Kit and xDot.Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/Programming Devices in ProductionConsult developer kit schematics for programming options.
CHAPTER 10 DEVELOPER KIT OVERVIEW42 MultiConnect®xDotTM MTXDOT Developer GuidexDot Developer Kit Mechanical DrawingsNote: The Reset and Wake buttons reset and wake the xDot processor.
CHAPTER 10 DEVELOPER KIT OVERVIEWMultiConnect®xDotTM MTXDOT Developer Guide 43Micro Developer Board LEDsLED DescriptionLED1 User-definable LED.LED3/SDA Programming Status.LED2/PWR Power, blue light when the board has power.LED4/PROXY LED for the proximity sensor, which is next to it (labeled U14 on the top assemblydiagram).
CHAPTER 11 DEVELOPER BOARD SCHEMATICS44 MultiConnect®xDotTM MTXDOT Developer GuideChapter 11 Developer Board SchematicsAssembly Diagrams and SchematicsAssembly DiagramsTop
CHAPTER 11 DEVELOPER BOARD SCHEMATICSMultiConnect®xDotTM MTXDOT Developer Guide 45Bottom
CHAPTER 11 DEVELOPER BOARD SCHEMATICS46 MultiConnect®xDotTM MTXDOT Developer GuideSchematics
CHAPTER 11 DEVELOPER BOARD SCHEMATICSMultiConnect®xDotTM MTXDOT Developer Guide 47
CHAPTER 11 DEVELOPER BOARD SCHEMATICS48 MultiConnect®xDotTM MTXDOT Developer Guide
CHAPTER 11 DEVELOPER BOARD SCHEMATICSMultiConnect®xDotTM MTXDOT Developer Guide 49
CHAPTER 12 DESIGN CONSIDERATIONS50 MultiConnect®xDotTM MTXDOT Developer GuideChapter 12 Design ConsiderationsNoise Suppression DesignAdhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppressionis essential to the proper operation and performance of the modem and surrounding equipment.Any OEM board design must consider both on-board and off-board generated noise that can affect digital signalprocessing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levelsand quality. Noise in frequency ranges that affect modem performance is of particular concern.On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board isequally important. This type of noise can affect the operation of surrounding equipment. Most local governmentagencies have certification requirements that must be met for use in specific environments.Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on)component selection (composition, value, and tolerance), interface connections, and shielding are required for theboard design to achieve desired modem performance and to attain EMI certification.Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noisesuppression techniques described in technical publications and journals, electronics and electrical engineering textbooks, and component supplier application notes.PC Board Layout GuidelineIn a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and groundare typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide.The recommended hole size for the device pins is 0.036 in. +/-0.003 in. in diameter. Use spacers to hold the devicevertically in place during the wave solder process.Electromagnetic InterferenceThe following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are thesame as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, youmust understand the major sources of EMI and how to reduce them to acceptable levels.■Keep traces carrying high frequency signals as short as possible.■Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers forground and power distribution.■Decouple power from ground with decoupling capacitors as close to the device's power pins as possible.■Eliminate ground loops, which are unexpected current return paths to the power source and ground.■Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of seriesinductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar todecoupling power lines; however, telephone line decoupling may be more difficult and deserves additionalattention. A commonly used design aid is to place footprints for these components and populate asnecessary during performance/EMI testing and certification.■Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouplepower lines are similar to decoupling telephone lines.
CHAPTER 12 DESIGN CONSIDERATIONSMultiConnect®xDotTM MTXDOT Developer Guide 51■Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits.■Locate cables and connectors to avoid coupling from high frequency circuits.■Lay out the highest frequency signal traces next to the ground grid.■If using a multilayer board design, make no cuts in the ground or power planes and be sure the groundplane covers all traces.■Minimize the number of through-hole connections on traces carrying high frequency signals.■Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turnsare better.■On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board totraces carrying high frequency signals. This will be effective as a high frequency ground return if it is threetimes the width of the signal traces.■Distribute high frequency signals continuously on a single trace rather than several traces radiating fromone point.Electrostatic Discharge ControlHandle all electronic devices with precautions to avoid damage due to the static charge accumulation.See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the Development of anElectrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” Thisdocument covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program PlanTechnical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking,equipment, and handling), and Sensitivity Testing.MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devicesto minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge duringhandling.MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designedto exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a productand when you ship your products to your customers.
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS52 MultiConnect®xDotTM MTXDOT Developer GuideChapter 13 Mounting xDots and Programming Exter-nal TargetsMounting the Device on Your BoardA footprint diagram is included on the xDot Mechanical Diagram.Solder ProfileSolder Paste: SAC NC 254Note: Calculate slope over 120 secondsName Low Limit High Limit UnitsMax Rising Slope (Target=1.0) 0 2 Degrees/SecondMax Falling Slope -2 -0.1 Degrees/SecondSoak Time 150-170C 15 45 SecondsPeak Temperature 235 250 Degrees CelsiusTotal Time Above 218C 30 90 Seconds
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETSMultiConnect®xDotTM MTXDOT Developer Guide 53Setpoints (Celsius)Zone 1 2 3 4 5 6 7Top 130 160 170 190 230 245 255Bottom 130 160 170 190 230 245 255Conveyer Speed 32.0 inch/minuteMax Rising Slope Max Falling Slope Soak Time 150-170CPeak Temp Total Time /218CTC Position Slope PWI Slope PWI Time PWI Temp PWI Time PWI1 <TC2> 1.38 38% -0.63 45% 28.82 -8% 240.22 -30% 43.61 -55%2 <TC3> 1.38 38% -0.75 32% 26.75 -22% 241.21 -17% 43.66 -54%3 <TC4> 1.38 38% -0.70 36% 29.47 -4% 239.56 -39% 43.29 -56%Delta 0.00 0.12 2.72 1.65 0.37xDot PackingxDots ship on 20 piece trays, which you can use for pick and place handling.Warning: Maximum temperature for these trays is 65° C.Programming External TargetsYou can use the xDot developer board to program external targets. To do this:1. Connect header JP1 to your target board with a 9-position ribbon cable.12. Apply power to your target board.
CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS54 MultiConnect®xDotTM MTXDOT Developer Guide3. When the xDot developer board detects a target voltage on Pin 1 of header JP1, it redirects the mbedprogramming interface to the external target. You can use the mbed programming environment asnormal to program and debug the external target.1MultiTech recommends the Samtec FFSD-05-D-06.00-01-N ribbon cable.JTAG/SWD ConnectorThe developer board uses an unshrouded 10-pin header.Suitable connector headers include:■Harwin: M50-3500542■Mouser: 855-M50-3500542■Samtec shrouded header: FTSH-105-01-F-D-KThe Samtec FTSH-105 header dimensions are 0.25"x 0.188" (6.35mm x 4.78mm).Ensure that you connect your cable correctly, typically by matching the "1" marked on the board to the cable's redstripe.
INDEXMultiConnect®xDotTM MTXDOT Developer Guide 55IndexschematicsDeveloper Board ...................................................44Aantenna ....................................................................22 23developer board ......................................................25antenna design guidelines ............................................28assembly diagramsDeveloper Board ......................................................44AT commandport ............................................................................9Bbaud rate.......................................................................20board componentsMicro Developer Board............................................43build options ...................................................................8Ccablecoaxial ......................................................................24certifications .................................................................12Chinese hazardous substancesChinese version........................................................39English version .........................................................38Class B ..........................................................................33Industry Canada.......................................................34COM ports.......................................................................9Conduit............................................................................6Ddata bits ........................................................................20debug port ......................................................................9design guidelinesantenna....................................................................28devicemaintenance ............................................................32dimensions ....................................................................11documentation................................................................6Eelectrical characteristics................................................16electromagnetic interference .......................................50electrostatic discharge..................................................51EMI ................................................................................50ESD ................................................................................51EUI...................................................................................7external targets.............................................................53FFCCgrant notes...............................................................30FCC NoticeClass B .....................................................................33flow control...................................................................20Gground plane.................................................................50Hhandling precautions due to ESD..................................51hazardous substances ...................................................37host labeling..................................................................30IIndustry CanadaClass B .....................................................................34interférence des radiofréquences.................................31JJTAG connector .............................................................54KKDB 447498 Section 8 ..................................................30Llabelinghost ..........................................................................30
INDEX56 MultiConnect®xDotTM MTXDOT Developer Guidelabels .............................................................................40Linux................................................................................9LoRarange ........................................................................20MMac .................................................................................9maintenance .................................................................32mbed ..............................................................................6mechanical drawings.....................................................11Micro Developer Board............................................42MTAC-LORA.....................................................................6MTCDT.............................................................................6MultiConnect ..................................................................6Nnetwork, connecting .......................................................7noise suppression..........................................................50Ppacking list ....................................................................41parity .............................................................................20PC board layout.............................................................50pin information .............................................................16pinout notes..................................................................20ports ................................................................................9power draw...................................................................15measuring ................................................................15processor.........................................................................6programming external targets......................................53Rradio frequency interference........................................31range .............................................................................20receive sensitivity..........................................................12related products..............................................................6ribbon cable ..................................................................53RoHS..............................................................................37RSMA-to-UFL cable .......................................................24SsafetyRF interference ........................................................31safety standards............................................................50serial settings ................................................................20solder profile.................................................................52specifications.................................................................12static..............................................................................31stop bits.........................................................................20sécuritéinterférences RF.......................................................31Ttrace antenna................................................................22transmission..................................................................12UU.FL antenna .................................................................22user responsibility.........................................................32WWindows .........................................................................9XxDot packing..................................................................53

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