Multi Tech Systems 92U13A16858 MTXDOT-NA1 User Manual tmp 0Btyto
Multi Tech Systems Inc MTXDOT-NA1 tmp 0Btyto
Contents
- 1. user manual
- 2. MANUAL
user manual
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MultiConnect® xDotTM MTXDOT Developer Guide MULTICONNECT XDOT DEVELOPER GUIDE MultiConnect xDot Developer Guide Models: MTXDOT-NA1-xxx, MTXDOT-EU1-xxx Part Number: S000645, Version 1.0 Copyright This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer of Multi-Tech Systems, Inc. All rights reserved. Copyright © 2016 by Multi-Tech Systems, Inc. Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information, material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement. Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes. Trademarks and Registered Trademarks MultiTech, and the MultiTech logo, and MultiConnect are registered trademarks and xDot and Conduit are trademarks of Multi-Tech Systems, Inc. All other products and technologies are the trademarks or registered trademarks of their respective holders. Legal Notices The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted Applications is at the user’s sole risk and liability. MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES, COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS. The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers. MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenance of such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever. Contacting MultiTech Knowledge Base The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go. Support Portal To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com. Support Business Hours: M-F, 8am to 5pm CT Country By Email By Phone Europe, Middle East, Africa: support@multitech.co.uk +(44) 118 959 7774 U.S., Canada, all others: support@multitech.com (800) 972-2439 or (763) 717-5863 Warranty To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go. World Headquarters Multi-Tech Systems, Inc. 2205 Woodale Drive, Mounds View, MN 55112 Phone: (800) 328-9717 or (763) 785-3500 Fax (763) 785-9874 MultiConnect® xDotTM MTXDOT Developer Guide CONTENTS Contents Chapter 1 Product Overview .................................................................................................................................... 6 Overview ....................................................................................................................................................................... 6 Documentation Overview ............................................................................................................................................. 6 Related Documentation .............................................................................................................................................. 6 mbed Documentation ................................................................................................................................................... 6 Programming the xDot Microcontroller ..................................................................................................................... 7 General mBed Links .................................................................................................................................................... 7 xDot Platform ............................................................................................................................................................. 7 EUI and Networking ...................................................................................................................................................... 7 Product Build Options ................................................................................................................................................... 8 Chapter 2 Getting Started ........................................................................................................................................ 9 Getting Started with the xDot Developer Kit................................................................................................................ 9 COM Port Enumeration by Operating System .............................................................................................................. 9 Linux ............................................................................................................................................................................ 9 Windows ..................................................................................................................................................................... 9 Mac ........................................................................................................................................................................... 10 Chapter 3 Mechanical Drawings with Pinouts ........................................................................................................ 11 xDot ............................................................................................................................................................................. 11 Chapter 4 Specifications and Pin Information ........................................................................................................ 12 MTXDOT Specifications ............................................................................................................................................... 12 Mapping Data Rate to Spreading Factor/Bandwidth................................................................................................ 14 Power Draw................................................................................................................................................................. 15 Measuring the Power Draw ...................................................................................................................................... 15 Electrical Characteristics ............................................................................................................................................. 16 xDot and Processor Pin Information .......................................................................................................................... 16 Pin Information ......................................................................................................................................................... 16 Pull-Up/Down............................................................................................................................................................ 19 xDot Pinout Design Notes ........................................................................................................................................... 20 Serial Pinout Notes.................................................................................................................................................... 20 Serial Settings.............................................................................................................................................................. 20 LoRa ............................................................................................................................................................................ 20 Throughput Rates...................................................................................................................................................... 20 Range ........................................................................................................................................................................ 20 Chapter 5 Antennas ............................................................................................................................................... 22 Antenna System ......................................................................................................................................................... 22 U.FL and Trace Antenna Options ............................................................................................................................... 22 Pulse Electronics Antenna........................................................................................................................................... 23 MultiConnect® xDotTM MTXDOT Developer Guide CONTENTS Antenna Specifications ............................................................................................................................................. 23 RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 24 Coaxial Cable Specifications ..................................................................................................................................... 24 Ethertronics Chip Antenna.......................................................................................................................................... 25 Antenna Specifications ............................................................................................................................................. 25 Stackup Information.................................................................................................................................................... 25 Developer Board Layer Stackup................................................................................................................................ 25 Stackup Table ............................................................................................................................................................ 26 Impedance ................................................................................................................................................................ 26 Chip Antenna Design Guidelines................................................................................................................................. 28 Antenna Pad Layout.................................................................................................................................................. 29 PCB Layout ................................................................................................................................................................ 29 OEM Integration ......................................................................................................................................................... 30 FCC & IC Information to Consumers ......................................................................................................................... 30 FCC Grant Notes........................................................................................................................................................ 30 Host Labeling............................................................................................................................................................... 30 Chapter 6 Safety Information................................................................................................................................. 31 Handling Precautions .................................................................................................................................................. 31 Radio Frequency (RF) Safety ....................................................................................................................................... 31 Sécurité relative aux appareils à radiofréquence (RF).............................................................................................. 31 Interference with Pacemakers and Other Medical Devices ...................................................................................... 32 Potential interference ............................................................................................................................................... 32 Precautions for pacemaker wearers ........................................................................................................................ 32 Device Maintenance ................................................................................................................................................... 32 User Responsibility...................................................................................................................................................... 32 Chapter 7 Regulatory Information ......................................................................................................................... 33 EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 33 47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 33 FCC Interference Notice ............................................................................................................................................. 33 FCC Notice ................................................................................................................................................................... 33 Industry Canada Class B Notice................................................................................................................................... 34 Chapter 8 Environmental Notices........................................................................................................................... 35 Waste Electrical and Electronic Equipment Statement .............................................................................................. 35 WEEE Directive.......................................................................................................................................................... 35 Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 35 REACH Statement ....................................................................................................................................................... 36 Registration of Substances........................................................................................................................................ 36 Substances of Very High Concern (SVHC) ................................................................................................................ 36 Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 37 Information on HS/TS Substances According to Chinese Standards ......................................................................... 38 Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 39 MultiConnect® xDotTM MTXDOT Developer Guide CONTENTS Chapter 9 Labels .................................................................................................................................................... 40 Label Examples............................................................................................................................................................ 40 Chapter 10 Developer Kit Overview ....................................................................................................................... 41 xDot Developer Kit ..................................................................................................................................................... 41 Developer Kit Package Contents............................................................................................................................... 41 Firmware Updates..................................................................................................................................................... 41 Programming Devices in Production ........................................................................................................................ 41 xDot Developer Kit Mechanical Drawings................................................................................................................... 42 Micro Developer Board LEDs ...................................................................................................................................... 43 Chapter 11 Developer Board Schematics................................................................................................................ 44 Assembly Diagrams and Schematics ........................................................................................................................... 44 Assembly Diagrams ................................................................................................................................................... 44 Schematics ................................................................................................................................................................ 46 Chapter 12 Design Considerations.......................................................................................................................... 50 Noise Suppression Design ........................................................................................................................................... 50 PC Board Layout Guideline ......................................................................................................................................... 50 Electromagnetic Interference .................................................................................................................................... 50 Electrostatic Discharge Control................................................................................................................................... 51 Chapter 13 Mounting xDots and Programming External Targets ............................................................................ 52 Mounting the Device on Your Board .......................................................................................................................... 52 Solder Profile............................................................................................................................................................... 52 Setpoints (Celsius)..................................................................................................................................................... 53 xDot Packing ............................................................................................................................................................... 53 Programming External Targets ................................................................................................................................... 53 JTAG/SWD Connector .............................................................................................................................................. 54 Index...................................................................................................................................................................... 55 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 1 PRODUCT OVERVIEW Chapter 1 Product Overview Overview The MultiConnect xDot (MTXDOT) is a LoRaWANTM, low-power RF device, capable of two way communication over long distances, deep into buildings, or within noisy environments* using the unlicensed ISM bands in North America, Europe and worldwide. The xDot is a compact surface-mount device with an mbed enabled processor and enhanced security. The xDot features an integrated ARM® Cortex®-M3 processor and mbedTM compatible software library for developers to control, monitor and bring edge intelligence to their Internet of Things (IoT) applications. Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. In dense urban environments, a typical range is 1-2 miles. Documentation Overview This manual is one part of xDot documentation. Refer to the Related Documentation and mbed sections for additional information needed to program your xDot and integrate your application with the MultiConnect Conduit gateway. This document includes: ■ xDot device information: including mechanical drawings, specifications, safety and regulatory information, and other device specific content. ■ Developer Kit information: including design considerations, schematics, and installation and operation information. This current version of this manual is available at www.multitech.com/support. Related Documentation ■ DOT Series AT Command Reference: Includes details on the AT commands available for xDots. ■ MultiTech Developer Site: Application notes, LoRa information, and documentation for related products such as the MultiConnect Conduit (MTCDT) gateway and the LoRa accessory card (MTAC-LORA) are available on the MultiTech developer site. This site includes information on using the Conduit with xDots. Go to: www.multitech.net ■ Processor Datasheet: ST ARM® Cortex®-M3 processor (STM32L151CCU6) datasheet is available on the ST website: http://www.st.com/resource/en/datasheet/stm32l151cc.pdf mbed Documentation ARM mbed is a free, open-source platform and operating system for embedded devices using the ARM Cortex-M microcontrollers. The mbed website provides free software libraries, hardware designs, and online tools for rapid prototyping of products. The platform includes a standards-based C/C++ SDK, a microcontroller HDK, and supported development boards, an online compiler and online developer collaboration tools. Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's MultiConnect Conduit (MTCDT) with an MTAC-LORA accessory card installed. MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 1 PRODUCT OVERVIEW Programming the xDot Microcontroller Note: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on a developer board. Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resulting binary file to the mbed USB drive, and reset the xDot. On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC and ETSI certification, some portions of the software is available only as binary libraries. MultiTech offers both development and stable release versions of the library. ■ Development version: libmxDot-dev-mbed5 ■ Stable release version: libmxDot-mbed5 You can use either the mbed online compiler or offline tools. ■ Online: Use the mbed-os library in your mbed application ■ Offline: Use mbed-cli tools to create, manage, and build your mbed 5.1 application. General mBed Links ■ Explore mbed: http://developer.mbed.org/explore ■ Getting Started with mbed: http://developer.mbed.org/getting-started ■ mbed Handbook: http://developer.mbed.org/handbook/Homepage ■ mbed online compiler documentation: https://developer.mbed.org/handbook/mbed-Compiler ■ mbed cli documentation: https://github.com/ARMmbed/mbed-cli/blob/master/README.md ■ mbed workspace tools documentation: https://github.com/ARMmbed/mbedos/blob/master/docs/BUILDING.md#workspace-tools xDot Platform The xDot mbed page includes the xDot library, firmware, and test cases https://developer.mbed.org/platforms/MTS-xDot-L151CC/ EUI and Networking xDots have an Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI: AT+DI=<8-BYTE-HEX-MSB> AT+DI=001122AABBCCDDEE For information on setting up xDots as part of a LoRa network, go to www.multitech.net. MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 1 PRODUCT OVERVIEW Product Build Options Product Description Package Quantity MTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1 or 100 MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) 100 MTXDOT-EU1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100 MTXDOT-EU1-A01 868 MHz LoRa Module TRC (EU) 100 North America EMEA Developer Kits MTMDK-XDOT-NA1-A00 MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDot MTMDK-XDOT-EU1-A00 MultiConnect xDot Micro Developer Kit - Includes a 868 MHz xDot Note: ■ The complete product code may end in .Rx. For example, MTXDOT-NA1-A00.Rx, where R is revision and x is the revision number. MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 2 GETTING STARTED Chapter 2 Getting Started Getting Started with the xDot Developer Kit Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command Reference Guide. Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot and the other is for debug messages. Refer to Chapter 4, Specifications and Pin Information for information on which pins are available out of the box. Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot. Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/ To send commands to the xDot: 1. 2. 3. Plug the developer board into a USB port. Open communications software, such as TeraTerm, Putty, or Minicom. Set the following: ■ Baud rate = 115,200 ■ Data bits = 8 ■ Parity = N ■ Stop bits = 1 ■ Flow control = Off To develop using mbed, the xDot mbed page includes libraries and test cases. Refer to mbed Documentation for details and links. For help setting up a MultiConnect® Conduit™ to send data to and from an xDot, refer to Related Documentation . COM Port Enumeration by Operating System xDots create an AT Commands port and a debug port. Linux The following COM ports are created on Linux systems: ■ /dev/ttyACMx ■ /dev/ttyACMy Where x and y may be 0 and 1, 3 and 4, etc. The COM port with lower number is the AT command port and COM port with the higher number is the debug port. Windows On Windows systems, COM ports appear in the Device Manager: ■ Debug Port: mbed Serial Port MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 2 GETTING STARTED ■ AT Command Port: XR21V1410 USB UART You may need to install a driver for the debug port to function properly. Go to: https://developer.mbed.org/handbook/Windows-serial-configuration Mac On Mac systems, COM ports appear in the Device Manager as: ■ /dev/cu.usbmodemx Where x is a string of numbers and possibly letters, ending in a number. The COM port with lower number is the AT command port and COM port with the higher number is the debug port. 10 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS Chapter 3 Mechanical Drawings with Pinouts xDot MultiConnect® xDotTM MTXDOT Developer Guide 11 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Chapter 4 Specifications and Pin Information MTXDOT Specifications Category Description General Compatibility LoRaWAN 1.0 specifications Interfaces Note that pin functions are multiplexed. Up to 19 digital I/O Up to 10 analog inputs 2 DAC outputs I2C SPI Wake pin Reset pin Full UART mbed/simple UART (RX & TX only) mbed programming interface CPU Performance CPU 32 MHz Max Clock 32 MHz Flash Memory 256 KB, with xDot library 136 KB available; with AT firmware, 56 KB available EEPROM 8 KB, available 6 KB SRAM 32 KB Backup Register 128 byte, available 88 Radio Frequency ISM Bands 863 MHz - 868 MHz, 902 MHz - 928 MHz, 915 MHz - 935 MHz Physical Description Weight 0.0001 oz. (0.003g) Dimensions Refer to Mechanical Drawings for Dimensions. RF Connectors 12 -UFL Models U.FL -Trace Models Trace Connection MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Description Environment Operating Temperature -40° C to +85° C Storage Temperature -40° C to +85° C Humidity 20%-90% RH, non-condensing Power Requirements Operating Voltage 2.4 to 3.57 V Certifications and Compliance EMC and Radio Compliance Safety Compliance EN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012 EN 301 489-03 V1.6.1:2013 ICES-003:2012 FCC 15.247:2015 CISPR 22:2008 FCC 15.109:2015 AS/NZS CISPR 22 FCC 15.107:2015 AS/NZS 4268:2012 + a1:2013 RSS 247:2015 Standard 2014 MPE UL 60950-1 2nd ED cUL 60950-1 2nd ED IEC 60950-1 2nd ED AM1 + AM2 AS/NZS 60950.1:2015 Category Description Transmission North America EMEA Max Transmitter Power Output (TPO) 19 dBm 14 dBm Maximum Receive Sensitivity -137 dBm -137 dBm Link Budget1 147 dB Point-to-Point 147 dB Point-to-Point Max Effective Isotropic Radiated Power (EiRP) 22 dBm 10 dBm MultiConnect® xDotTM MTXDOT Developer Guide 13 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Category Description Receive Sensitivity Spreading Factor North America Typical Sensitivity2 EMEA Typical Sensitivity3 -111 dBm -121 dBm -116 dBm -124 dBm -119 dBm -127 dBm -122 dBm -130 dBm 10 -125 dBm -133 dBm 11 -127 dBm -135 dBm 12 -129 dBm -137 dBm Greater link budget is possible with higher gain antenna. RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx path. RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx path. Mapping Data Rate to Spreading Factor/Bandwidth US/AU Uplink Downlink DR0: SF10BW125 DR8: SF12BW500 DR1: SF9BW125 DR9: SF11BW500 DR2: SF8BW125 ... DR3: SF7BW125 DR13: SF7BW500 DR4: SF8BW500 DR5-DR7: RFU EU DR0: SF12BW125 ... DR5: SF7BW15 DR6: SF7BW250 DR7: FSK 14 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Power Draw Note: ■ Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source when determining product load. ■ Transmit power measured with MTXDOT-NA1-xxx transmitting to a MultiConnect Conduit with an MTAC-LORA-915 accessory card installed. ■ Power measurements are similar for MTXDOT-EU1-xxx models. Some 868 MHz sub-band frequencies do not support maximum TXP power of 20. ■ Idle current measured with the xDot joined with Conduit, but idle without data transferring. ■ Transmit power measured while transferring data packets using spread factor 9. Packet size limited to 53 bytes. The Conduit was set to receive packets from and send back to the xDot. A script was run to send the packet 100 times with either 10 or 53 bytes of data, with an average measurement taken during that time. ■ For Inrush charge, recorded the highest observed value from five separate measurements. Voltage USB = 5v Standby Mode Stop Mode Current, (Sleep = 0 Current, Deep Sleep) (Sleep = 1) Idle current Spreading Factor Setting Packet Size (# Average Bytes) LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 10 LDO = 3.3 1.9uA 2.2uA 11.1mA DR1 - SF9BW125 53 Voltage USB = Average Current 5v (Amps) at Low Transmit Power Setting (TXP 2) Average Current (Amps) at Default Transmit Power Setting (TXP 11) Average Current (Amps) at Maximum Transmit Power Setting (TXP 20) Total Inrush Charge measured in MilliCoulombs Total Inrush Charge DURATION during Powerup (INRUSH Duration) LDO = 3.3 0.013 0.017 0.018 0.132mC 153uS LDO = 3.3 0.017 0.024 0.025 0.132mC 147uS Measuring the Power Draw To measure the power draw on an xDot developer board: 1. 2. 3. 4. 5. 6. 7. Flash the latest AT command firmware on the xDot. Unplug the xDot from the computer and then reconnect it. Connect current meter across JP30 on the developer board. Set wake pin to wake, AT+WP=6. Set wake mode to interrupt, AT+WM=1. Put the xDot to sleep, AT+SLEEP=0|1. Put jumper across JP5. Note: After this step, AT command and debug ports no longer work. 8. 9. Measure current draw. Press the S2 button on the developer board to wake the xDot MultiConnect® xDotTM MTXDOT Developer Guide 15 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION Electrical Characteristics Signal Description Min Max Vin Low Input low level -- 0.3 * VDD Vin High Input high level 0.45 * VDD +0.6 -- Vout Low Output low level -- .4 Vout High Output high level 0.4 -- VCC Standard operating voltage 2.4 3.6 ICC Operating current (mA) @5V -- 135 Operating current (mA) @3.3V -- 200 xDot and Processor Pin Information Pin Information Note: ■ Using the mbed platform expands your pin functionality options. ■ Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left) ■ The xDot is 0.045 x 0.045, board is 0.93 x 0.93 16 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description Processor Pin Alt1 Processor Pin Alt2 25 PB12 SPI2_NSS GPIO / SPI TIM10_CH1/ I2C2_SMBA/ SPI2_NSS/ I2S2_WS/ USART3_CK/ LCD_SEG12 ADC_IN18/ COMP1_INP/ VLCDRAIL2 26 10 PB13 SPI2_SCK GPIO / SPI TIM9_CH1/ SPI2_SCK/ I2S2_CK/ USART3_CTS/ LCD_SEG13 ADC_IN19/ COMP1_INP 28 11 PB15 SPI2_MOSI GPIO / SPI TIM11_CH1/ SPI2_MOSI/ I2S2_SD/ LCD_SEG15 ADC_IN21/ COMP1_INP/ RTC_REFIN 27 12 PB14 SPI2_MISO GPIO / SPI TIM9_CH2/ SPI2_MISO/ USART3_RTS/ LCD_SEG14 ADC_IN20/ COMP1_INP 30 13 PA9 UART1_TX GPIO / UART USART1_TX/ LCD_COM1 31 14 PA10 UART1_RX GPIO / UART USART1_RX/ LCD_COM2 12 15 PA2 UART2_TX Debug UART 13 16 PA3 UART2_RX Debug UART 20 23 PB2 GPIO3 GPIO BOOT1 VLCDRAIL1/ ADCIN0b 18 24 PB0 GPIO2 GPIO TIM3_CH3/ LCD_SEG5 ADC_IN8/ COMP1_INP/ OPAMP2_VOUT/ VLCDRAIL3/ VREF_OUT 15 25 PA5 GPIO1 GPIO TIM2_CH1_ETR/ SPI1_SCK ADC_IN5/ DAC_OUT2/ COMP1_INP 14 26 PA4 GPIO0 GPIO SPI1_NSS/ SPI3_NSS/ I2S3_WS/ USART2_CK ADC_IN4/ DAC_OUT1/ COMP1_INP 45 27 PB8 I2C1_SCL GPIO / I2C TIM4_CH3/ TIM10_CH1/ I2C1_SCL/ LCD_SEG16 MultiConnect® xDotTM MTXDOT Developer Guide 17 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description Processor Pin Alt1 Processor Pin Alt2 46 28 PB9 I2C1_SDA GPIO / I2C TIM4_CH4/ TIM11_CH1/ I2C1_SDA/ LCD_COM3 37 29 PA14 MBED SWCLK JTCK-SWCLK 34 30 PA13 MBED SWDIO JTMS-SWDIO 33 31 PA12 UART1_RTS GPIO / UART USART1_RTS/ SPI1_MOSI USB_DP 32 32 PA11 UART1_CTS GPIO / UART USART1_CTS/ SPI1_MISO USB_DM 33 NRST NRESET 10 34 PA0-WKUP1 GPIO / WAKE TIM2_CH1_ETR/ TIM5_CH1/ USART2_CTS WKUP1/ RTC_TAMP2/ ADC_IN0/ COMP1_INP WAKE 37 ANT1 47 RFU (ANT2) 8,23,35 1, 5, 17, VSS ,47,49 20,35, 36, 38, 39, 40, 41, 42, 43, 44, 45, 46, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58 GND 2, 6, 7, 8, 18, 19, 21, 22 18 Reserved 16 PA6 LORA_DIO0 LORA Radio 17 PA7 LORA_DIO1 LORA Radio 29 PA8 LORA_DIO2 LORA Radio 42 PB6 LORA_DIO3 LORA Radio 43 PB7 LORA_DIO4 LORA Radio 40 PB4 LORA_MISO LORA Radio 41 PB5 LORA_MOSI LORA Radio MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION 48QFN xDot Pin Pin Name SW Name Function Description Processor Pin Alt1 Processor Pin Alt2 38 PA15 LORA_NSS LORA Radio 11 PA1 LORA_RESET LORA Radio 39 PB3 LORA_SCK LORA Radio 22 PB11 SE_CLK Secure Element 19 PB1 SE_CTRL Secure Element 21 PB10 SE_IO Secure Element PC13-WKUP2 SE_RESET Secure Element 44 BOOT0 Boot0 PC14OSC32_IN(4) RTC_CLK OSC32_IN PC15OSC32_OUT RTC_CLK OSC32_OUT PH0OSC_IN(5) Main 24M OSC_IN PH1OSC_OUT(5) Main 24M OSC_OUT Pull-Up/Down 48QFN xDot Pin Pin Name 33 NRST SW Name PU/PD 10k PU 38 PA15 LORA_NSS 100k PU 19 PB1 SE_CTRL 10k PU 44 BOOT0 MultiConnect® xDotTM MTXDOT Developer Guide 10k PD 19 CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION xDot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations. ■ All pins that go to connectors are directly connected to the processor. ■ Refer to Pin Information table for pull up and pull down information. xDots allow you to program pins depending on your application: ■ Serial: Available out of the box. See Serial Pinout Notes for details. ■ mbed: Designed with the STM32L151CCU6 48-pin processor, this option provides the most flexibility. For more information about processor capabilities, see the processor datasheet. Serial Pinout Notes Out of the box, these pins are available for serial applications. Refer to the mechanical drawing for your model for pin locations. ■ 18 PTA1 UART1_CTS ■ 19 PTA2 UART1_RTS ■ 36 PTC3 UART1_RX ■ 37 PTC4 UART1_TX Serial Settings When creating a serial connection with the device on the developer board, open communications software (such as TeraTerm, Putty, or Minicom ), and use the following settings: ■ Baud rate = 115,200 ■ Data bits = 8 ■ Parity = N ■ Stop bits = 1 ■ Flow control = Off LoRa Throughput Rates Theoretical maximum speeds for LoRa mode with ACKs off are: ■ Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps). ■ Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps). Note: Data rates in the LoRaWAN specification vary by geographic region. Range Variables effecting the range include TX power, antenna gain, RX sensitivity, fade margin, earth's curvature. Use the following formula to calculate the maximum range: 20 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION The following table provides example settings and the theoretical maximum range based on these settings. Example 18dB Transmit Power for 915 MHz Models Units Example 14dB Transmit Power for 868MHz Models Frequency 915 MHz 868 TX Power 19 dBm 14 dB RX Sensitivity -120 dBm -120 RX Antenna Gain dB Fade Margin2 30 dB 30 Distance 8.14 Miles 5.41 Distance 13.08 Km 8.70 TX Antenna Gain RX Sensitivity is set to a conservative -120dBm, but can vary from -117 to -137dBm. Fade Margin is set at the worst case of 30dB. Fade margin is an allowance a system designer includes to account for unknown variables. The higher the fade margin, the better the overall link quality will be. With a fade margin set to zero, the link budget is still valid, but only in LOS conditions, which is not practical for most designs. The amount of fade margin to include in a calculation depends on the environment in which you will deploy the system. A fade margin of 12 dBm is good, but a better number would be 20 to 30 dBm. MultiConnect® xDotTM MTXDOT Developer Guide 21 CHAPTER 5 ANTENNAS Chapter 5 Antennas Antenna System The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. If changes are made to the device's certified antenna system, then recertification will be required. This radio transmitter has been tested with both the Pulse and Ethertronics antennas listed below. If you follow our design guidelines, you do not need to re-certify your design. The antenna you use must maintain the same specifications. It must be of the same type, with similar in-band and out-of-band radiation patterns. Antennas having a greater gain than the maximum gain indicated for the listed type, are strictly prohibited for use with this device. U.FL and Trace Antenna Options If using U.FL or trace antennas, note the following: ■ For a simple trace to RF antennas: Routing must follow standard RF design rules and practices for stripline/miscrostrip for a 50 ohm impedance line. Use the developer board schematics for a reference circuit for the a trace antenna. ■ For U.FL antennas: The antenna and cable combination in your design cannot exceed the performance of the SMA antenna as listed in the next topic. ■ The xDot Developer Board includes an Ethertronics M620710-1K chip antenna, which by default connects the xDot to the chip antenna. Only one antenna, either U.FL or chip, may be used at a time. To use the xDot’s U.FL connector, remove resistor C23 and L1, marked on the following image, to disconnect the chip antenna. 22 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Pulse Electronics Antenna Manufacturer: Pulse Electronics Description: 868-915 MHz RP-SMA Antenna, 8" Model Number: W1063 MultiTech Part Number: 45009830L MultiTech ordering information: Ordering Part Number Quantity AN868-915A-1HRA AN868-915A-10HRA 10 AN868-915A-50HRA 50 Antenna Specifications Category Description Frequency Range 868-928 MHz Impedance 50 Ohms VSWR < 2.0 Gain 3.0 dBi Radiation Omni MultiConnect® xDotTM MTXDOT Developer Guide 23 CHAPTER 5 ANTENNAS Category Description Polarization Vertical RSMA-to-U.FL Coaxial Cables Coaxial Cable Specifications Optional antenna cables can be ordered from MultiTech Cable Type Coaxial Cable Attenuation <1.0db Connector Impedance 50 ohm Maximum Cable Length 16" (40 cm) Ordering Information 24 Part Number Description CARSMA-UFL-1 RSMA-to-UFL Coax Cable (Single Pack) CARSMA-UFL-10 RSMA-to-UFL Coax Cable (Ten Pack) CARSMA-UFL-100 RSMA-to-UFL Coax Cable (One Hundred Pack) MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Ethertronics Chip Antenna This is the developer board's default antenna. Manufacturer: Ethertronics Description: 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount Model Number: M620710-1K Datasheet: http://www.ethertronics.com/files/2914/0652/9246/2Savvi_M620710_ISM__6x2.pdf Antenna Specifications Category Description Electrical Specifications Frequency Range 902—928 MHz Peak Gain 2.56 dBi VSWR 2:6:1 max Impedance 50 ohms unbalanced Average Efficiency 58% Power Handling 0.5 Watt cw Polarization Linear Mechanical Specifications Mounting Surface Mount Size 6.00 x 2.00 x 1.1mm Stackup Information Developer Board Layer Stackup MultiConnect® xDotTM MTXDOT Developer Guide 25 CHAPTER 5 ANTENNAS Stackup Table Impedance Polar trial balance (L1 refer to L2) impedance 50.87 ohms, using 11 mil tracs, 22mil space. 26 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Polar trial balance (L1 refer to L2/L4 refer to L3) impedance 93.54 ohms, using 8 mil tracs, 7mil space. MultiConnect® xDotTM MTXDOT Developer Guide 27 CHAPTER 5 ANTENNAS Chip Antenna Design Guidelines When designing antenna placement for the chip antenna, note the following: ■ The antenna's long side must be along the edge of the ground plane. ■ Remove the ground plane from all layers below the antenna. ■ The distance from the antenna to the enclosure or plastic cover should be greater than 1.5 mm. The distance from the antenna to relatively large perturbations, such as a shield or large components, depends on the height of surrounding components. It should not be less than 1.5mm. We recommend a distance equal to or greater than 10mm from the end of the antenna to either end of the PCB distance. Performance is better from larger distances. Use the recommended land pattern shown in the figures below. Land patterns are composed of a 50 ohm line connected to each antenna feed point. Ground clearance around and under the antenna as shown in the PCB layout is recommended to maximize antenna performance. 28 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 5 ANTENNAS Antenna Pad Layout PCB Layout MultiConnect® xDotTM MTXDOT Developer Guide 29 CHAPTER 5 ANTENNAS OEM Integration FCC & IC Information to Consumers The user manual for the consumer must contain the statements required by the following FCC and IC regulations: 47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4. FCC Grant Notes The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may be necessary. FCC Definitions Portable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile: (§2.1091) — A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons. Actual content pending Grant: This device is a mobile device with respect to RF exposure compliance. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specific information required to satisfy RF exposure compliance for installations and final host devices. (See note under Grant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee. Note: Host design configurations constituting a device for portable use (<20 cm from human body) require separate FCC/IC approval. Host Labeling The following statements are required to be on the host label: ■ This device contains FCC ID: AU792U13A16858 ■ This device contains equipment certified under IC: 125A-0055 For labeling examples, see Cellular Approvals and Labeling Requirements. 30 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 6 SAFETY INFORMATION Chapter 6 Safety Information Handling Precautions To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellular device. Although input protection circuitry has been incorporated into the devices to minimize the effect of static build-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting the device. Radio Frequency (RF) Safety Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations regarding the use of radio equipment. Follow the safety advice given below. ■ Operating your device close to other electronic equipment may cause interference if the equipment is inadequately protected. Observe any warning signs and manufacturers’ recommendations. ■ Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use of radio equipment in fuel depots, chemical plants, or where blasting operations are in process. Follow restrictions for any environment where you operate the device. ■ Do not place the antenna outdoors. ■ Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft may endanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restriction may lead to suspension or denial of cellular services to the offender, legal action, or both. ■ Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehicle with fuel. ■ Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use. Sécurité relative aux appareils à radiofréquence (RF) À cause du risque d'interférences de radiofréquence (RF), il est important de respecter toutes les réglementations spéciales relatives aux équipements radio. Suivez les conseils de sécurité ci-dessous. ■ Utiliser l'appareil à proximité d'autres équipements électroniques peut causer des interférences si les équipements ne sont pas bien protégés. Respectez tous les panneaux d'avertissement et les recommandations du fabricant. ■ Certains secteurs industriels et certaines entreprises limitent l'utilisation des appareils cellulaires. Respectez ces restrictions relatives aux équipements radio dans les dépôts de carburant, dans les usines de produits chimiques, ou dans les zones où des dynamitages sont en cours. Suivez les restrictions relatives à chaque type d'environnement où vous utiliserez l'appareil. ■ Ne placez pas l'antenne en extérieur. ■ Éteignez votre appareil sans fil dans les avions. L'utilisation d'appareils électroniques portables en avion est illégale: elle peut fortement perturber le fonctionnement de l'appareil et désactiver le réseau cellulaire. S'il ne respecte pas cette consigne, le responsable peut voir son accès aux services cellulaires suspendu ou interdit, peut être poursuivi en justice, ou les deux. ■ Éteignez votre appareil sans fil à proximité des pompes à essence ou de diesel avant de remplir le réservoir de votre véhicule de carburant. MultiConnect® xDotTM MTXDOT Developer Guide 31 CHAPTER 6 SAFETY INFORMATION ■ Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sont susceptibles d'être utilisés. Interference with Pacemakers and Other Medical Devices Potential interference Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implanted cardiac pacemakers and defibrillators from cellular devices. This test method is part of the Association for the Advancement of Medical Instrumentation (AAMI) standard. This standard allows manufacturers to ensure that cardiac pacemakers and defibrillators are safe from cellular device EMI. The FDA continues to monitor cellular devices for interactions with other medical devices. If harmful interference occurs, the FDA will assess the interference and work to resolve the problem. Precautions for pacemaker wearers If EMI occurs, it could affect a pacemaker in one of three ways: ■ Stop the pacemaker from delivering the stimulating pulses that regulate the heart's rhythm. ■ Cause the pacemaker to deliver the pulses irregularly. ■ Cause the pacemaker to ignore the heart's own rhythm and deliver pulses at a fixed rate. Based on current research, cellular devices do not pose a significant health problem for most pacemaker wearers. However, people with pacemakers may want to take simple precautions to be sure that their device doesn't cause a problem. ■ Keep the device on the opposite side of the body from the pacemaker to add extra distance between the pacemaker and the device. ■ Avoid placing a turned-on device next to the pacemaker (for example, don’t carry the device in a shirt or jacket pocket directly over the pacemaker). Device Maintenance When maintaining your device: ■ Do not attempt to disassemble the device. There are no user serviceable parts inside. ■ Do not expose your device to any extreme environment where the temperature or humidity is high. ■ Do not expose the device to water, rain, or spilled beverages. It is not waterproof. ■ Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. The information contained on discs or cards may be affected by the device. ■ Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with MultiTech's accessory specifications may invalidate the warranty. If the device is not working properly, contact MultiTech Technical Support. User Responsibility Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use and theft. 32 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 7 REGULATORY INFORMATION Chapter 7 Regulatory Information EMC, Safety, and R&TTE Directive Compliance The CE mark is affixed to this product to confirm compliance with the following European Community Directives: Council Directive 2014/30/EU on the approximation of the laws of Member States relating to electromagnetic compatibility; and Council Directive 2014/35/EU on the harmonization of the laws of Member States relating to electrical equipment designed for use within certain voltage limits; and Council Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic equipment; and Council Directive 1999/5/EC on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity. 47 CFR Part 15 Regulation Class B Devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ■ Reorient or relocate the receiving antenna. ■ Increase the separation between the equipment and receiver. ■ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. ■ Consult the dealer or an experienced radio/TV technician for help. Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. FCC Interference Notice Per FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC Notice xDot products are open development based products that contain a sub ghz radio technology. MultiTech has certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC 15.247:2015 & IC RSS 247:2015) MultiConnect® xDotTM MTXDOT Developer Guide 33 CHAPTER 7 REGULATORY INFORMATION MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified. To ensure this level of compliance, the software code is provided in binary form only. Users are prohibited from making any changes that affect the operation of the radio performance. Accessing or controlling the radio through any means other than the provided binary software will require the user to obtain their own intentional radiator license from the certification body governing their locality, as all pre-certification provided with xDot will have been made invalid. Industry Canada Class B Notice This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe B respecte toutes les exigences du Reglement Canadien sur le matériel brouilleur. This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for the following two conditions: 1. 2. the device may not cause harmful interference, and the user of the device must accept any interference suffered, even if the interference is likely to jeopardize the operation. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. 2. 34 l'appareil ne doit pas produire de brouillage, et l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 8 ENVIRONMENTAL NOTICES Chapter 8 Environmental Notices Waste Electrical and Electronic Equipment Statement Note: This statement may be used in documentation for your final product applications. WEEE Directive The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to takeback electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements. Instructions for Disposal of WEEE by Users in the European Union The symbol shown below is on the product or on its packaging, which indicates that this product must not be disposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or where you purchased the product. July, 2005 MultiConnect® xDotTM MTXDOT Developer Guide 35 CHAPTER 8 ENVIRONMENTAL NOTICES REACH Statement Registration of Substances After careful review of the legislation and specifically the definition of an “article” as defined in EC Regulation 1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view Multi-Tech Systems, Inc. products would be considered as “articles”. In light of the definition in § 7.1(b) which requires registration of an article only if it contains a regulated substance that “is intended to be released under normal or reasonably foreseeable conditions of use,” Our analysis is that Multi-Tech Systems, Inc. products constitute nonregisterable articles for their intended and anticipated use. Substances of Very High Concern (SVHC) Per the candidate list of Substances of Very High Concern (SVHC) published October 28, 2008 we have reviewed these substances and certify the Multi-Tech Systems, Inc. products are compliant per the EU “REACH” requirements of less than 0.1% (w/w) for each substance. If new SVHC candidates are published by the European Chemicals Agency, and relevant substances have been confirmed, that exceeds greater than 0.1% (w/w), MultiTech Systems, Inc. will provide updated compliance status. Multi-Tech Systems, Inc. also declares it has been duly diligent in ensuring that the products supplied are compliant through a formalized process which includes collection and validation of materials declarations and selective materials analysis where appropriate. This data is controlled as part of a formal quality system and will be made available upon request. 36 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 8 ENVIRONMENTAL NOTICES Restriction of the Use of Hazardous Substances (RoHS) Multi-Tech Systems, Inc. Certificate of Compliance 2011/65/EU Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS). These MultiTech products do not contain the following banned chemicals1: ■ Lead, [Pb] < 1000 PPM ■ Mercury, [Hg] < 1000 PPM ■ Hexavalent Chromium, [Cr+6] < 1000 PPM ■ Cadmium, [Cd] < 100 PPM ■ Polybrominated Biphenyl, [PBB] < 1000 PPM ■ Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM Environmental considerations: ■ Moisture Sensitivity Level (MSL) =1 ■ Maximum Soldering temperature = 260C (in SMT reflow oven) Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration would be found in some modules (>1000 PPM); - Resistors containing lead in a glass or ceramic matrix compound. MultiConnect® xDotTM MTXDOT Developer Guide 37 CHAPTER 8 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII). Hazardous/Toxic Substance/Elements Name of the Component Lead (PB) Mercury (Hg) Cadmium Hexavalent (CD) Chromium (CR6+) Polybromi Polybrominat nated ed Diphenyl Biphenyl Ether (PBDE) (PBB) Printed Circuit Boards Resistors Capacitors Ferrite Beads Relays/Opticals ICs Diodes/ Transistors Oscillators and Crystals Regulator Voltage Sensor Transformer Speaker Connectors LEDs Screws, Nuts, and other Hardware AC-DC Power Supplies Software /Documentation CDs Booklets and Paperwork Chassis X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneous material of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits. O Represents that no such substances are used or that the concentration is within the aforementioned limits. 38 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 8 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards (in Chinese) 依照中国标准的有毒有害物质信息 根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准－中华人民共和国《电子信息产品污染 控制管理办法》（第 39 号），也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒 物质 (TS) 或有害物质 (HS) 的名称及含量水平方面的信息。 有害/有毒物质/元素 成分名称 铅 (PB) 汞 (Hg) 镉 (CD) 六价铬 (CR6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE) 印刷电路板 电阻器 电容器 铁氧体磁环 继电器/光学部件 ICs 二极管/晶体管 振荡器和晶振 调节器 电压传感器 变压器 扬声器 连接器 LEDs 螺丝、螺母以及其它五金件 交流-直流电源 软件/文档 CD 手册和纸页 底盘 X 表示所有使用类似材料的设备中有害/有毒物质的含量水平高于 SJ/Txxx-2006 限量要求。 O 表示不含该物质或者该物质的含量水平在上述限量要求之内。 MultiConnect® xDotTM MTXDOT Developer Guide 39 CHAPTER 9 LABELS Chapter 9 Labels Label Examples Note: Actual labels vary depending on the regulatory approval markings and content. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The label shown is not the actual size. 1 - MultiTech Model Identification. 2 - MultiTech Ordering Part Number. 3 - Device Node Number. Example xDot Device Label 40 Example Developer Board Device Label MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 10 DEVELOPER KIT OVERVIEW Chapter 10 Developer Kit Overview xDot Developer Kit The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application. Developer Kit Package Contents Your Developer Kit (MTMDK-NX-XDOT-xx) includes the following: Developer Board 1 - xDot Developer Board with xDot Customer Notices Quick Start Firmware Updates Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot. Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/ Programming Devices in Production Consult developer kit schematics for programming options. MultiConnect® xDotTM MTXDOT Developer Guide 41 CHAPTER 10 DEVELOPER KIT OVERVIEW xDot Developer Kit Mechanical Drawings Note: The Reset and Wake buttons reset and wake the xDot processor. 42 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 10 DEVELOPER KIT OVERVIEW Micro Developer Board LEDs LED Description LED1 User-definable LED. LED3/SDA Programming Status. LED2/PWR Power, blue light when the board has power. LED4/PROXY LED for the proximity sensor, which is next to it (labeled U14 on the top assembly diagram). MultiConnect® xDotTM MTXDOT Developer Guide 43 CHAPTER 11 DEVELOPER BOARD SCHEMATICS Chapter 11 Developer Board Schematics Assembly Diagrams and Schematics Assembly Diagrams Top 44 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS Bottom MultiConnect® xDotTM MTXDOT Developer Guide 45 CHAPTER 11 DEVELOPER BOARD SCHEMATICS Schematics 46 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS MultiConnect® xDotTM MTXDOT Developer Guide 47 CHAPTER 11 DEVELOPER BOARD SCHEMATICS 48 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 11 DEVELOPER BOARD SCHEMATICS MultiConnect® xDotTM MTXDOT Developer Guide 49 CHAPTER 12 DESIGN CONSIDERATIONS Chapter 12 Design Considerations Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels and quality. Noise in frequency ranges that affect modem performance is of particular concern. On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is equally important. This type of noise can affect the operation of surrounding equipment. Most local government agencies have certification requirements that must be met for use in specific environments. Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on) component selection (composition, value, and tolerance), interface connections, and shielding are required for the board design to achieve desired modem performance and to attain EMI certification. Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise suppression techniques described in technical publications and journals, electronics and electrical engineering text books, and component supplier application notes. PC Board Layout Guideline In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and ground are typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide. The recommended hole size for the device pins is 0.036 in. +/-0.003 in. in diameter. Use spacers to hold the device vertically in place during the wave solder process. Electromagnetic Interference The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are the same as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, you must understand the major sources of EMI and how to reduce them to acceptable levels. ■ Keep traces carrying high frequency signals as short as possible. ■ Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers for ground and power distribution. ■ Decouple power from ground with decoupling capacitors as close to the device's power pins as possible. ■ Eliminate ground loops, which are unexpected current return paths to the power source and ground. ■ Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines; however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design aid is to place footprints for these components and populate as necessary during performance/EMI testing and certification. ■ Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple power lines are similar to decoupling telephone lines. 50 MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 12 DESIGN CONSIDERATIONS ■ Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits. ■ Locate cables and connectors to avoid coupling from high frequency circuits. ■ Lay out the highest frequency signal traces next to the ground grid. ■ If using a multilayer board design, make no cuts in the ground or power planes and be sure the ground plane covers all traces. ■ Minimize the number of through-hole connections on traces carrying high frequency signals. ■ Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns are better. ■ On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to traces carrying high frequency signals. This will be effective as a high frequency ground return if it is three times the width of the signal traces. ■ Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point. Electrostatic Discharge Control Handle all electronic devices with precautions to avoid damage due to the static charge accumulation. See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” This document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking, equipment, and handling), and Sensitivity Testing. MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devices to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during handling. MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers. MultiConnect® xDotTM MTXDOT Developer Guide 51 CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Chapter 13 Mounting xDots and Programming External Targets Mounting the Device on Your Board A footprint diagram is included on the xDot Mechanical Diagram. Solder Profile Solder Paste: SAC NC 254 Note: Calculate slope over 120 seconds 52 Name Low Limit High Limit Units Max Rising Slope (Target=1.0) Degrees/Second Max Falling Slope -2 -0.1 Degrees/Second Soak Time 150-170C 15 45 Seconds Peak Temperature 235 250 Degrees Celsius Total Time Above 218C 30 90 Seconds MultiConnect® xDotTM MTXDOT Developer Guide CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Setpoints (Celsius) Zone Top 130 160 170 190 230 245 255 Bottom 130 160 170 190 230 245 255 Conveyer Speed 32.0 inch/minute Max Rising Slope Max Falling Slope Soak Time 150170C Peak Temp Total Time /218C TC Position Slope PWI Slope PWI Time PWI Temp PWI Time PWI1.38 38% -0.63 45% 28.82 -8% 240.22 -30% 43.61 -55% 1.38 38% -0.75 32% 26.75 -22% 241.21 -17% 43.66 -54% 1.38 38% -0.70 36% 29.47 -4% 239.56 -39% 43.29 -56% Delta 0.00 0.12 2.72 1.65 0.37 xDot Packing xDots ship on 20 piece trays, which you can use for pick and place handling. Warning: Maximum temperature for these trays is 65° C. Programming External Targets You can use the xDot developer board to program external targets. To do this: 1. 2. Connect header JP1 to your target board with a 9-position ribbon cable.1 Apply power to your target board. MultiConnect® xDotTM MTXDOT Developer Guide 53 CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS 3. When the xDot developer board detects a target voltage on Pin 1 of header JP1, it redirects the mbed programming interface to the external target. You can use the mbed programming environment as normal to program and debug the external target. MultiTech recommends the Samtec FFSD-05-D-06.00-01-N ribbon cable. JTAG/SWD Connector The developer board uses an unshrouded 10-pin header. Suitable connector headers include: ■ Harwin: M50-3500542 ■ Mouser: 855-M50-3500542 ■ Samtec shrouded header: FTSH-105-01-F-D-K The Samtec FTSH-105 header dimensions are 0.25"x 0.188" (6.35mm x 4.78mm). Ensure that you connect your cable correctly, typically by matching the "1" marked on the board to the cable's red stripe. 54 MultiConnect® xDotTM MTXDOT Developer Guide INDEX Index schematics Developer Board ...................................................44 antenna ....................................................................22 23 developer board ......................................................25 antenna design guidelines ............................................28 assembly diagrams Developer Board ......................................................44 AT command port ............................................................................9 baud rate.......................................................................20 board components Micro Developer Board............................................43 build options ...................................................................8 electrical characteristics................................................16 electromagnetic interference .......................................50 electrostatic discharge ..................................................51 EMI ................................................................................50 ESD ................................................................................51 EUI ...................................................................................7 external targets.............................................................53 FCC grant notes...............................................................30 FCC Notice Class B .....................................................................33 flow control...................................................................20 ground plane.................................................................50 cable coaxial ......................................................................24 certifications .................................................................12 Chinese hazardous substances Chinese version........................................................39 English version .........................................................38 Class B ..........................................................................33 Industry Canada .......................................................34 COM ports .......................................................................9 Conduit............................................................................6 data bits ........................................................................20 debug port ......................................................................9 design guidelines antenna....................................................................28 device maintenance ............................................................32 dimensions ....................................................................11 documentation................................................................6 handling precautions due to ESD..................................51 hazardous substances ...................................................37 host labeling..................................................................30 Industry Canada Class B .....................................................................34 interférence des radiofréquences.................................31 JTAG connector .............................................................54 KDB 447498 Section 8 ..................................................30 labeling host ..........................................................................30 MultiConnect® xDotTM MTXDOT Developer Guide 55 INDEX labels .............................................................................40 Linux ................................................................................9 LoRa range ........................................................................20 related products..............................................................6 ribbon cable ..................................................................53 RoHS..............................................................................37 RSMA-to-UFL cable .......................................................24 Mac .................................................................................9 maintenance .................................................................32 mbed ..............................................................................6 mechanical drawings.....................................................11 Micro Developer Board............................................42 MTAC-LORA.....................................................................6 MTCDT.............................................................................6 MultiConnect ..................................................................6 safety RF interference ........................................................31 safety standards............................................................50 serial settings ................................................................20 solder profile .................................................................52 specifications.................................................................12 static..............................................................................31 stop bits.........................................................................20 sécurité interférences RF.......................................................31 network, connecting .......................................................7 noise suppression..........................................................50 packing list ....................................................................41 parity .............................................................................20 PC board layout.............................................................50 pin information .............................................................16 pinout notes..................................................................20 ports ................................................................................9 power draw...................................................................15 measuring ................................................................15 processor.........................................................................6 programming external targets ......................................53 trace antenna................................................................22 transmission ..................................................................12 U.FL antenna .................................................................22 user responsibility.........................................................32 Windows .........................................................................9 xDot packing..................................................................53 radio frequency interference........................................31 range .............................................................................20 receive sensitivity..........................................................12 56 MultiConnect® xDotTM MTXDOT Developer Guide
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