Murata Electronics North America 2100 Class 1 Bluetooth compliant device User Manual SN2100 Datasheet
Murata Electronics North America Class 1 Bluetooth compliant device SN2100 Datasheet
Users Manual
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| Document ID | 1690087 |
| Application ID | e2vjdZmZexgKl7aeLSGo+A== |
| Document Description | Users Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 60.35kB (754418 bits) |
| Date Submitted | 2012-05-04 00:00:00 |
| Date Available | 2012-05-04 00:00:00 |
| Creation Date | 2012-04-11 13:59:25 |
| Producing Software | Microsoft® Word 2010 |
| Document Lastmod | 2012-04-11 13:59:25 |
| Document Title | SN2100 Datasheet |
| Document Creator | Microsoft® Word 2010 |
| Document Author: | Norihito Nagayama |
SN2100 Bluetooth Class 1 Module User Manual And Datasheet Version: 0.62 April 10, 2012 Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license is generated under any rights of SyChip or its supporters unless specifically agreed. Revision History Revision Date 0.1 Jul-07-2011 0.5 Nov-15-2011 Author Change Description Release the first datasheet. N. Nagayama Update the block diagram / BT IC product number Update the SyChip Part Number 0.6 Jan-05-2012 Viet H. 0.61 Jan-31-2012 Yong Fang 0.62 Apr-10-2012 JAG SyChip/Murata Confidential Update the spec table Added disclaimer Added packaging, labeling and regulatory information Page 2 of 27 SN2100 Datasheet V0.62 Table of Contents SYSTEM DESCRIPTIONS ......................................................................................................................... 5 1.1 1.2 1.3 MECHANICAL SPECIFICATIONS ............................................................................................................ 7 2.1 2.2 2.3 2.4 2.5 BLUETOOTH SPECIFICATION .................................................................................................................... 13 RF CHARACTERISTICS (TX) .................................................................................................................... 13 RF CHARACTERISTICS (RX) .................................................................................................................... 15 ENVIRONMENTAL SPECIFICATIONS ................................................................................................... 16 5.1 5.2 TYPICAL POWER CONSUMPTION .............................................................................................................. 12 DIGITAL IO SPECIFICATION...................................................................................................................... 12 RF SPECIFICATIONS .............................................................................................................................. 13 4.1 4.2 4.3 MODULE DIMENSION ................................................................................................................................. 7 MODULE TOP AND SIDE VIEW ..................................................................................................................... 7 MODULE BOTTOM VIEW ............................................................................................................................. 8 DETAILED MECHANICAL DATA (TOP VIEW) ................................................................................................... 9 MODULE PIN-OUT ................................................................................................................................... 10 DC ELECTRICAL SPECIFICATIONS ..................................................................................................... 12 3.1 3.2 APPLICATIONS .......................................................................................................................................... 5 MODULE SUMMARY .................................................................................................................................. 5 BLOCK DIAGRAM ...................................................................................................................................... 6 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 16 OPERATION CONDITIONS ......................................................................................................................... 16 APPLICATION INFORMATION ............................................................................................................... 17 6.1 HOST PCB LAYOUT RECOMMENDATIONS ................................................................................................. 17 6.2 MODULE LOCATION ................................................................................................................................ 18 6.2.1 Location in x-y plane .................................................................................................................... 18 6.2.2 Location in z-plane ...................................................................................................................... 19 ASSEMBLY INFORMATION ................................................................................................................... 20 7.1 LEAD-FREE SOLDERING REFLOW PROFILE ................................................................................................ 20 PACKAGE INFORMATION ..................................................................................................................... 21 8.1 8.2 TAPE AND REEL SPECIFICATION ............................................................... ERROR! BOOKMARK NOT DEFINED. MODULE MARKING .................................................................................. ERROR! BOOKMARK NOT DEFINED. ORDERING INFORMATION .................................................................................................................... 22 10 ROHS DECLARATION ............................................................................................................................ 22 11 TECHNICAL SUPPORT CONTACT ........................................................................................................ 22 12 DISCLAIMER .................................................................................ERROR! BOOKMARK NOT DEFINED. SyChip/Murata Confidential Page 3 of 27 SN2100 Datasheet V0.62 LIST OF FIGURES FIGURE 1 SN2100 MODULE BLOCK DIAGRAM .................................................................................................................. 6 FIGURE 2 MODULE TOP AND SIDE VIEW ............................................................................................................................ 7 FIGURE 3 MODULE BOTTOM VIEW ..................................................................................................................................... 8 FIGURE 4 DETAILED MECHANICAL DATA (TOP VIEW)......................................................................................................... 9 FIGURE 5 RECOMMENDED HOST CIRCUIT BOARD DESIGN UNDERNEATH THE MODULE ................................................ 17 FIGURE 6 RECOMMENDED LOCATIONS IN XY-PLANE ....................................................................................................... 18 FIGURE 7 LOCATIONS NOT RECOMMENDED IN XY-PLANE ............................................................................................... 18 FIGURE 8 RECOMMENDED LOCATIONS IN Z-PLANE.......................................................................................................... 19 FIGURE 9 LOCATIONS NOT RECOMMENDED IN XY-PLANE ............................................................................................... 19 FIGURE 10 REFLOW PROFILE PATTERN .......................................................................................................................... 20 FIGURE 11 CARRIER TAPE DIMENSIONS .......................................................................................................................... 21 FIGURE 12 MODULE MARKING DETAIL............................................................................................................................. 21 LIST OF TABLES TABLE 1 TABLE 2 TABLE 3 TABLE 4 TABLE 5 TABLE 6 TABLE 7 TABLE 8 TABLE 9 MODULE CONNECTOR SIGNAL DESCRIPTION.................................................................................................... 10 TYPICAL POWER CONSUMPTION........................................................................................................................ 12 DIGITAL IO SPECIFICATION ................................................................................................................................ 12 RF SPECIFICATIONS ........................................................................................................................................... 13 RF SPECIFICATIONS ........................................................................................................................................... 15 ABSOLUTE MAXIMUM RATING ............................................................................................................................ 16 RECOMMENDED OPERATING CONDITIONS ........................................................................................................ 16 REFLOW PROFILE RECOMMENDATION.............................................................................................................. 20 ORDERING INFORMATION ................................................................................................................................... 22 SyChip/Murata Confidential Page 4 of 27 SN2100 Datasheet V0.62 System Descriptions 1.1 Applications SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with onboard antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO and chip antenna into a small LGA form factor and can be simply dropped into the OEM’s design. The SN2100 offers total 110 dB link budget, which is significantly better than most of the Bluetooth® modules do in the market. This makes it a good fit for industrial control application that usually requires longer distance coverage. The module offers extended product life and industrial standard operating temperature range to fit the industrial usage. The SN2100 offers standard HCI interface to the host CPU. 1.2 Module Summary Bluetooth V4.0 Power Grade: Class 1 Dimensions: 17.5mm x 16.0mm x 2.0 mm Supply voltage: 2.2V to 3.3V Antenna: on-module 32kHz clock circuit : on-module Host Interface : UART/PCM RoHS compliant MSL JEDEC level 3 FCC/IC certified; CE compliant SyChip/Murata Confidential Page 5 of 27 SN2100 Datasheet V0.62 1.3 Block Diagram Figure 1 SN2100 Module Block Diagram SyChip/Murata Confidential Page 6 of 27 SN2100 Datasheet V0.62 2 Mechanical Specifications 2.1 Module Dimension Parameter Dimension (LxWxH) Dimension tolerances (LxWxH) 2.2 Typical Unit 17.5 x 16.0 x 2.0 +/- 0.2 mm mm mm Module top and side view UNIT : mm Figure 2 Module Top and Side View SyChip/Murata Confidential Page 7 of 27 SN2100 Datasheet V0.62 2.3 Module bottom view Figure 3 Module Bottom View SyChip/Murata Confidential Page 8 of 27 SN2100 Datasheet V0.62 2.4 Detailed mechanical data (top view) Figure 4 Detailed Mechanical Data (top view) SyChip/Murata Confidential Page 9 of 27 SN2100 Datasheet V0.62 2.5 Module Pin-out Table 1 Module Connector Signal Description Pin # Pin name I/O Description GND Ground VIN Module Power Supply Reserved Internal for debugging use only HCI_CTS HCI UART Clear-To-Send. Module is allowed to send data when HCI_CTS is low. HCI_TX HCI UART data transmit HCI_RTS HCI UART Request-To-Send Host is allowed to send data when RTS is low. HCI_RX HCI UART data receive nRESET Shutdown input (Active Low) GND Ground 10 AUD_IN PCM Data Input 11 AUD_OUT PCM Data Output 12 AUD_CLK I/O PCM Clock 13 AUD_SYNC I/O PCM Frame Sync 14 GND Ground 15 GND Ground 16 GND Ground 17 GND Ground 18 GND Ground 19 GND Ground 20 GND Ground 21 GND Ground 22 GND Ground 23 GND Ground 24 GND Ground 25 GND Ground 26 Reserved Internal use only 27 GND Ground 28 GND Ground SyChip/Murata Confidential V0.62 Page 10 of 27 SN2100 Datasheet Pin # Pin name I/O Description 29 GND Ground 30 GND Ground 31 GND Ground 32 GND Ground SyChip/Murata Confidential V0.62 Page 11 of 27 SN2100 Datasheet 3 DC Electrical Specifications 3.1 Typical Power Consumption Table 2 Typical Power Consumption Values Item Condition Units Min Typ Max VIN = 3.0V, TEMP = 25°C 3.5 DH1 Packet 50% Rx/Tx slot duty 1 cycle Average VIN = 3.0V, TEMP = 25°C 60 mA DH5 Packet 50% Rx/Tx slot duty 1 cycle Average VIN = 3.0V, TEMP = 25°C 87 mA TX maximum current VIN = 3.0V, TEMP = 25°C 150 mA RX maximum current VIN = 3.0V, TEMP = 25°C 50 mA Standby mode send script) 3.2 (after mA Digital IO Specification VIN = 3.0V, TEMP = 25°C, unless otherwise stated Table 3 Digital IO Specification Item Symbol Min Max UNIT High Level Input Voltage VIH 0.65 x VDD VDD Low Level Input Voltage VIL 0.35 x VDD 0.8 x VDD VDD VDD – 0.2 VDD 0.2 x VDD 0.2 High Level Output Voltage Low Level output Voltage Condition At 2/4/8 mA At 0.1 mA At 2/4/8 mA At 0.1 mA VOH VOL VDD : 1.8V SyChip/Murata Confidential V0.62 Page 12 of 27 SN2100 Datasheet 4 RF Specifications 4.1 Bluetooth Specification Parameter Contents Bluetooth Specification Ver.4.0 Channel Spacing 1 MHz The number of channel 79 Power Class 4.2 RF Characteristics (TX) VIN = 3.0V, TEMP = 25°C, at 50Ω terminal load connected to the RF connector Table 4 RF Specifications Parameter Min Typ Max 18 2402 2480 MHz 0.928 MHz [M-N] = 2 -40 <-20 dBm [M-N] >= 3 -43 <-40 dBm Modulation delta f1 avg 159 140< <175 kHz Modulation delta f2 max 136 115< kHz Modulation delta f2 avg/delta f1 avg 0.9 0.8< -2 -75< <75 kHz 1 slot -25 -25< <25 kHz 3 slot -40 -40< <40 kHz 5 slot -40 -40< <40 kHz Maximum drift rate -20 0.5 -20< <20 kHz/50 us 30 – 1000 MHz (Operation Mode) -50 <-36 dBm 1000 – 12750 MHz (Operation Mode) -52 <-30 dBm 1800 – 1900 MHz (Operation Mode) -54 <-47 dBm Output Power Operation Frequency range (RX/TX) -20 dB bandwidth BT Spec 20 (1) Units dBm Adjacent Channel Power Modulation Characteristics Initial Carrier Frequency Tolerance Carrier Frequency Drift Out of Band Spurious Emissions SyChip/Murata Confidential V0.62 Page 13 of 27 SN2100 Datasheet 5150 – 5300 MHz (Operation Mode) SyChip/Murata Confidential V0.62 Page 14 of 27 -54 <-47 dBm SN2100 Datasheet 4.3 RF Characteristics (RX) VIN = 3.0V, TEMP = 25°C, at 50Ω terminal load connected to the RF connector Table 5 RF Specifications Parameter Min Typ Max BT Spec Units -92 < -70 dBm Co-channel ratio (-60 dBm input) 10 < 11 dB 1MHz ratio (-60dBm input) -7 <0 dB 2MHz ratio (-60dBm input) -21 < -30 dB 3MHz ratio (-67dBm input) -44 < -40 dB 30MHz – 2000MHz -5 -10< dBm 2000MHz – 2400MHz -5 -27< dBm 2500MHz – 3000MHz -5 -27< dBm 3000MHz – 12750MHz -5 -10< dBm Intermodulation Performance (BER <= 0.1%, -64 dBm input) -36 -39< dBm Maximum Input Level -4 -20< dBm Sensitivity (BER <= 0.1%) C/I Performance (BER <= 0.1%) Blocking Performance (BER <= 0.1%) (1) It is EIRP. SyChip/Murata Confidential V0.62 Page 15 of 27 SN2100 Datasheet 5 Environmental Specifications 5.1 Absolute maximum ratings Table 6 Absolute Maximum Rating Symbol Description Min Max Units Top Operating temperature -40 85 C Tst Storage temperature -40 85 C VIN Power supply -0.3 5.0 MSL Moisture Sensitivity Level RoHS Restriction of Hazardous Substances 5.2 Compliant Operation conditions Table 7 Recommended Operating Conditions Symbol Parameter Min Typ Max Units VIN Power supply 2.2 3.0 3.3 Top Operating temperature -40 85 C SyChip/Murata Confidential V0.62 Page 16 of 27 SN2100 Datasheet 6 Application Information 6.1 Host PCB layout recommendations The SN3020 module has an onboard antenna therefore it requires some special host PCB layout underneath the module such that the radio can achieve its best RF performance. Refer to Figure 5 for the requirements. Zone 1 Zone 2 Figure 5 Recommended Host Circuit Board Design underneath the Module Notes: 1. Due to the surface mount antenna on the module, the area in ‘Zone1’ on all layers of the customer circuit board should be free of any metal objects. Specifically, there should be no ground plane, traces, or metal shield case. 2. The area in ‘Zone2’ on the top layer of the customer circuit board should have ground only with no signal traces. SyChip/Murata Confidential V0.62 Page 17 of 27 SN2100 Datasheet 6.2 Module Location For optimum EIRP, customer is advised to use the recommended module location on their respective PCB. 6.2.1Location in x-y plane Antenna Connector No GND in this area (See Fig.8) Antenna Shield Case Figure 6 Recommended Locations in xy-plane Figure 7 Locations Not Recommended in xy-plane SyChip/Murata Confidential V0.62 Page 18 of 27 SN2100 Datasheet 6.2.2 Location in z-plane Metal Module Antenna Connector Antenna Mother Board Metal Figure 8 Recommended Locations in z-plane Metal Metal Metal Figure 9 Locations Not Recommended in xy-plane SyChip/Murata Confidential V0.62 Page 19 of 27 SN2100 Datasheet 7 Assembly Information 7.1 Lead-free soldering reflow profile The lead-free solder reflow profile is recommended in the table & graph below. The profile is used to attach the module to its host PCB. The module is designed to withstand 2 reflows. Opposite side reflow is prohibited due to the module weight. Table 8 Reflow Profile Recommendation Ramp up rate Maximum time maintained above 217 C Peak temperature Maximum time within 5 C of peak temperature Ramp down rate 3 C/second max 120 seconds 250 C 20 seconds 6 C/second max Reflow Profile Temperature, C 250 200 150 100 50 Time, seconds Figure 10 Reflow Profile Pattern SyChip/Murata Confidential V0.62 Page 20 of 27 SN2100 Datasheet 8 Packaging and Marking Information 8.1 Carrier Tape Dimensions Figure 11 Carrier Tape Dimensions 8.2 Module Marking Information The following marking information may be printed on a permanent label affixed to the module shield or permanently laser written into the module shield itself. The 2D barcode is used for internal purposes. A pin 1 ID is stamped into the shield. Figure 12 Module Marking Detail SyChip/Murata Confidential V0.62 Page 21 of 27 SN2100 Datasheet 9 Ordering Information Table 9 Ordering Information Product Evaluation/Development Kit Module in Tape and Reel SyChip Model Number SyChip Part Number Standard Order Increment SN2100EVK 88-0150-85 1 pc SN2100 88-0150-00 500 pcs 10 RoHS Declaration Given supplier declarations, this product does not contain substances that are banned by Directive 2002/95/EC or contains a maximum concentration of 0.1% by weight in homogeneous materials for Lead and lead compounds Mercury and mercury compounds Chromium (VI) PBB (polybrominated biphenyl) PBDE (polybrominated biphenyl ether) And a maximum concentration of 0.01% by weight in homogeneous materials for Cadmium and cadmium compounds 11 Regulatory Information SN2100 has obtained the certifications described below. 11.1 FCC Notice (USA) This device using the integrated antenna has been tested to comply with FCC CFR Part 15. The device meets the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The FCC requires the OEM (original equipment manufacturer) to be notified that any changes or modifications not expressly approved by SyChip, L.L.C may void the user’s authority to operate the equipment. While an application of the SN2100 module in a product is not required to obtain a new FCC authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for that end product. SyChip/Murata Confidential V0.62 Page 22 of 27 SN2100 Datasheet This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: reorient or relocate the receiving antenna, increase the separation between the equipment and receiver, connect the equipment into an outlet on a circuit different from that to which the receiver is connected, or consult the dealer or an experienced radio/TV technician for help. 11.2 FCC Labeling Requirements When integrating the SN2100 into a product, the FCC labeling requirements must be met by the OEM. This includes placing a clearly visible label on the outside of the finished product specifying the SN2100 FCC identifier (FCC ID:QPU2100) as well as the underlined FCC Notice above. The exterior label can use wording such as “Contains Transmitter Module FCC ID:QPU2100” or “Contains FCC ID:QPU2100” although any similar wording that expresses the same meaning may be used. 11.3 RF Exposure This module has been certified for remote and base radio applications and is not intended to be operated within 20cm of the body. If the module will be used for portable applications, the device must undergo SAR testing. The following statement must be included as a CAUTION statement in manuals for the products to alert users on FCC RF exposure compliance: “WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operations at closer distances than this are not recommended.” 11.4 IC Notice (Canada) The term “IC” before the certification/registration number only signifies that the Industry Canada technical specifications were met. Le terme “IC” devant le numéro de certification /d’enregistrement signifie seulement que les spécifications techniques Industrie Canada ont été respectées. SyChip/Murata Confidential V0.62 Page 23 of 27 SN2100 Datasheet This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s). Son utilisation est soumise à Les deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter Toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement du dispositif. This device complies with Health Canada’s Safety Code 6 / IC RSS-210. The installer of this device should ensure that RF radiation is not emitted in excess of the Health Canada’s requirement. Information can be obtained at: http://www.hc-sc.gc.ca/ewhsemt/pubs/radiation/radio_guide-lignes_direct-eng.php Cet appareil est conforme avec Santé Canada Code de sécurité 6 / IC RSS-210. Le programme d'installation de cet appareil doit s'assurer que les rayonnements RF n'est pas émis au-delà de l'exigence de Santé Canada. Les informations peuvent être obtenues: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php 11.5 IC Labeling Requirements The host device should be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC:4523A-SN2100, where 4523A-SN2100 is the module’s certification number. 11.6 CE Notice (Europe) This device has been tested and certified for use in the European Union. If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in Annex II of the Radio and Telecommunications Terminal Equipment Directive. 11.7 CE Labeling Requirements The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive. Given that the operating frequency band is not harmonized by a few European countries, the restriction or alert sign must be placed alongside the ‘CE’ mark as shown below. The restriction is that, if the radio is operated outdoors in the 2450-2483.5 MHz SyChip/Murata Confidential V0.62 Page 24 of 27 SN2100 Datasheet band, the power must be limited to 10 mW instead of 100 mW. The OEM must account for this and the product must have the alert mark. It does not require country notifications, however. 12 Technical Support Contact SyChip, LLC 2805 Dallas Parkway, Suite 400 Plano, TX 75093 USA Tel: (972) 202-8900 Fax: (972) 633-0327 Note: SyChip, LLC is an operating unit within Murata Wireless Solutions 13 Disclaimer Please read this notice before using the SN2100 product. 1. Please note that the only warranty that SyChip LLC (“SyChip”) provides regarding the products is its conformance to the specifications provided herein. Accordingly, SyChip shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. SYCHIP HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECTFREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. YOU AGREE TO INDEMNIFY AND DEFEND SYCHIP AND ITS AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF PRODUCTS. 2. The product is designed and manufactured for general applications, and not for any particular application, so testing and use of the product shall be conducted at your own risk and responsibility. Specifically, please observe the following: SyChip/Murata Confidential V0.62 Page 25 of 27 SN2100 Datasheet i) Please conduct validation and verification of the products in actual condition of mounting and operating environment before commercial shipment of the equipment. ii) Please pay attention to minimize any mechanical vibration or shock, not to drop the product or a substrate that contains the product during transportation. iii) Since the application of static electricity or overvoltage may cause a defect in the product or deterioration of its reliability, caution must be taken against exposure to any static electricity generated by electrified items such as work benches, soldering irons, tools, carrying containers, etc. iv) Caution shall be taken to avoid overstress to the product during and after the soldering process. v) Since the applied soldering method may deteriorate the reliability, thorough evaluation is recommended. vi) In case the product is to be used in equipment or electric circuit that requires high safety or reliability function or performance, sufficient reliability evaluation checks for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. Please provide an appropriate fail-safe function on your product to prevent any damages that may be caused by the abnormal function or the failure of our product. Notwithstanding the foregoing, the product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. - Aircraft equipment - Aerospace equipment - Undersea equipment - Power plant control equipment - Medical equipment - Transportation equipment (vehicles, trains, ships, etc.) - Traffic signal equipment - Disaster prevention / crime prevention equipment - Application of similar complexity and/or reliability requirements to the applications listed in the above. 3. SyChip’s warranty as provided in Clause 1 above that the products comply with descriptions expressly specified in the specifications shall be effective for a period of six (6) months from the date of delivery. SyChip shall not be liable for any defects that occur in dry packed products that are installed more than six (6) months after shipment. SyChip/Murata Confidential V0.62 Page 26 of 27 SN2100 Datasheet SyChip’s liability under this warranty shall be limited to products that are returned during the warranty period to the address designated by SyChip and that are determined by SyChip not to conform to such warranty. If SyChip elects to repair or replace such products, SyChip shall have reasonable time to repair such products or provide replacements. Repaired products shall be warranted for the remainder of the original warranty period. Replaced products shall be warranted for a new full warranty period. For avoidance of doubt, SyChip shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than SyChip including improper installation or testing, or for any products that have been altered or modified in any way by an entity other than SyChip. Moreover, SyChip shall not be liable for any defects that result from your or third party’s design, specifications or instructions for such products. 4. Testing and other quality control techniques are used to the extent SyChip deems necessary. Unless mandated by government requirements, SyChip does not necessarily test all parameters of each product. 5. End of Life - Please note that we may discontinue the manufacture of products, due to reasons such as, but not limited to, end of supply of materials and/or components from our suppliers. SyChip/Murata Confidential V0.62 Page 27 of 27 SN2100 Datasheet
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