User Manual
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LoRa Module Data Sheet
MP P/N: CMWX1ZZABZ
Sample P/N: CMWX1ZZABZ-TEMP
For LoRaTM
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Revision History
Revision
Code
Date
Description
Comments
A
June 8, 2016
Initial Draft
B
July 1, 2016
Updated height and package info
C
July 30,2016
Revised some formats and ΔRF_OPH_V test condition
from 2.4-3.7V to 2.2-3.6V. Updated some electronic
Characteristics. Added the recommended land pattern.
D
Aug 29,2016
Updated the RF performance, Electrical Characteristics
and power up sequence.
E
Oct 11, 2016
Added FCC and IC statements.
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TABLE OF CONTENTS
1. Features ······················································································································· 4
2. Part Number ················································································································· 4
3. Block Diagram ··············································································································· 4
4. Dimensions, Marking and Terminal Configurations ···························································· 5
5. Label Information ·········································································································· 8
6. Absolute Maximum Ratings ····························································································· 8
7. Operating Condition ······································································································· 8
8. Electrical Characteristics ································································································ 9
9. Power Sequences ··········································································································· 10
10. Recommend Land Pattern ····························································································· 11
11. Reference circuit ·········································································································· 12
12. Tape and Reel packing ·································································································· 13
13. Notice ························································································································ 16
14. Regulatory Statements ································································································· 18
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1. Features
Interfaces : I2C, UART, USB, SPI
Main ICs : STM32L082, SX1276
Reference Clocks : Integrated 32MHz clock (TCXO with frequency error=±2 ppm)
and 32.768KHz clock (frequency error=±20 ppm)
Supported Frequencies : 868 MHz, 915 MHz
Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max)
Package : Metal Shield can
RoHS : This module is compliant with the RoHS directive
2. Part Number
Ordering Part Number
Description
CMWX1ZZABZ
MP P/N
CMWX1ZZABZ-TEMP
Engineering sample
3. Block Diagram
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4. Dimensions, Marking and Terminal Configurations
Top View Bottom View
Side View
Table 1 Dimension (Unit: mm)
Mark
Dimension
Mark
Dimension
Mark
Dimension
L
12.5±0.20
W
11.6±0.20
T
1.76 max
a1
0.50±0.10
a2
0.50±0.10
a3
1.50±0.10
b1
0.20±0.15
b2
1.60±0.15
b3
3.00±0.15
b4
3.50±0.15
b5
0.20±0.15
b6
1.15±0.15
b7
2.55±0.15
c1
0.80±0.10
c2
0.80±0.10
c3
1.50±0.10
e1
0.30±0.10
e2
0.30±0.10
e3
1.00±0.10
e4
1.00±0.10
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Terminal Configurations
< Top View >
Table 2 Terminal Configurations
Pin
NO.
Terminal Name
Type
Connection to
IC terminal
Description
1
PA12/USB_DP
I/O
STM32L082_PA12
GPIO Mode:PA12
USB_DP
2
PA11/USB_DM
I/O
STM32L082_PA11
GPIO Mode:PA11
USB_DM
3
GND
Ground
-
Ground
4
VDD_USB
Power
-
Power supply for USB
5
VDD_MCU
Power
-
Power supply for MCU
6
VDD_RF
Power
-
Power supply for RF IC
7
GND
Ground
-
Ground
8
DBG_SX1276_DIO2
I/O
SX1276_DIO2
Debug pin for SX1276
9
DBG_SX1276_DIO3
I/O
SX1276_DIO3
Debug pin for SX1276
10
SX1276_DIO4
I/O
SX1276_DIO4
SX1276 DIO4
11
DBG_SX1276_DIO5
I/O
SX1276_DIO5
Debug pin for SX1276
12
DBG_SX1276_DIO1
I/O
SX1276_DIO1
Debug pin for SX1276
13
DBG_SX1276_DIO0
I/O
SX1276_DIO0
Debug pin for SX1276
14
PB15/SPI2_MOSI
I/O
STM32L082_PB15
GPIO Mode:PB15
SPI2_MOSI
15
PB14/SPI2_MISO
I/O
STM32L082_PB14
GPIO Mode:PB14
SPI2_ MISO
16
PB13/SPI2_SCK
I/O
STM32L082_PB13
GPIO Mode:PB13
SPI2_SCK
17
PB12/SPI2_NSS
I/O STM32L082_PB12
GPIO Mode:PB12
SPI2_NSS
18
PA10/USART1_RX
I/O
STM32L082_PA10
GPIO Mode:PA10
USART1_RX
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19
PA9/USART1_TX
I/O
STM32L082_PA9
GPIO Mode:PA9
USART1_TX
20
PA8/MCO
I/O
STM32L082_PA8
GPIO Mode:PA8
MCO
21
PA5/ADC5/DAC2
I/O
STM32L082_PA5
GPIO Mode:PA5
COMP2_INM
ADC_IN5
DAC_OUT2
22
PA4/ADC4/DAC1
I/O
STM32L082_PA4
GPIO Mode:PA4
COMP2_INM
ADC_IN4
DAC_OUT1
23
PA3/ADC3
I/O STM32L082_PA3
GPIO Mode:PA3
COMP2_ INP
ADC_IN3
24
PA2/ADC2
I/O STM32L082_PA2
GPIO Mode:PA2
COMP2_OUT
ADC_IN2
25
GND
Ground -
Ground
26
ANT
A,I/O -
Transmit / Receive Antenna
27
GND
Ground -
Ground
28
DBG_CRF1
I/O STM32L082_PA1
Debug pin
29
DBG_CRF3
I/O STM32L082_PC1
Debug pin
30
DBG_CRF2
I/O
STM32L082_PC2
Debug pin
31
STSAFE_nRST
I
-
Reset for Security IC
32
VREF+
Power
-
Reference Voltage For ADC and DAC
33
PA0/WKUP1
I/O
STM32L082_PA0
GPIO Mode:PA0
COMP2_OUT
ADC_IN2
34
MCU_nRST
I
STM32L082_PD5
NRST
35
PB8/I2C1_SCL
I/O
STM32L082_ PB8
GPIO Mode:PB8
I2C mode: SCL
36
PB9/I2C1_SDA
I/O
STM32L082_ PB9
GPIO Mode: PB9
I2C mode: SDA
37
PB2/LPTIM1_OUT
I/O
STM32L082_PB2
GPIO Mode:PB2
LPTIM1_OUT
38
PB7/LPTIM1_IN2
I/O
STM32L082_PB7
GPIO Mode:PB7
LPTIM1_IN2
39
PB6/LPTIM1_ETR
I/O
STM32L082_ PB6
GPIO Mode:PB6
LPTIM1_ETR
40
PB5/LPTIM1_IN1
I/O
STM32L082_ PB5
GPIO Mode:PB5
LPTIM1_IN1
41
PA13/SWDIO
I/O
STM32L082_PA13
GPIO Mode:PA13
SWDIO
LPUART1_RX
42
PA14/SWCLK
I/O STM32L082_PA14
GPIO Mode:PA14
SWCLK
LPUART1_TX
43
BOOT0
I
STM32L082_PA5
Boot Option
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44
GND
Ground
-
-
45
PH1-OSC_OUT
I/O
STM32L082_PH1
GPIO Mode:PH1
High-speed external clock OSC output
46
PH0-OSC_IN
I/O
STM32L082_PH0
GPIO Mode:PH0
High-speed external clock OSC input
47
TCXO_OUT
O
-
Internal TCXO output
48
VDD _TCXO
Power
-
Power supply for the TCXO IC
49~57
GND
Ground
-
Ground
Note: GPIO pins are to be left OPEN if not used.
5. Label Information
TBD
6. Absolute Maximum Ratings
Table 3 Maximum ratings
Parameters
Min
Typ
Max
Unit
Storage Temperature
-40
25
+90
degC
Input RF Level
-
-
10
dBm
Supply Voltage
VDD_USB
-0.3
-
3.9
V
VDD_MCU, VDD_RF, VDD_TCXO
-0.3
-
3.9
V
VREF+
-0.3
-
VDD_MCU+0.4
V
7. Operating Condition
Table 4 Operating specification
Parameters
Min
Typ
Max
Unit
Operating Temperature
-40
25
+85
degC
Supply Voltage
VDD_USB (USB peripheral used) (1)
3.0
-
3.6
V
VDD_USB(USB peripheral not used) (1)
VDD_MCU_min
VDD_MCU
VDD_MCU_max
V
VDD_MCU,VDD_RF,VDD_TCXO
2.2(3)
-
3.6
V
VREF+(2)
1.8
-
VDD_MCU
V
(1) VDD_USB must respect the following conditions:
- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.
- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than
VDD_MCU.
- In operating mode, VDD_USB could be lower or higher than VDD_MCU.
- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os.
(2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is
on the STM32L082*** datasheet and user guider.
(3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V.
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8. Electrical Characteristics
8.1 FSK/OOK Transceiver Specification
Conditions:
Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation
without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx
and Tx path matching, unless otherwise specified.
FSK/OOK Receiver Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
RFS_F_HF
LnaBoost is turned on
FDA = 5 kHz, BR = 4.8 kb/s
-117.5
dBm
IDDR
Supply current in Receive
mode
LnaBoost Off, band 1
22
mA
LnaBoost On, band 1
23
mA
FSK/OOK Transmitter Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
RF_OP
RF output power in 50 ohms
on RFO pin ( High efficiency
PA)
Programmable with
steps
Max
14
dBm
Min
-5
dBm
RF_OPH
RF output power in 50 ohms
on PA_BOOST pin( Regulated
PA)
Programmable with
1dB steps
Max
18.5
dBm
Min
2
dBm
ΔRF_
OPH_V
RF output power stability on
PA_BOOST pin versus voltage
supply.
VDD = 2.2 V to 3.6 V
+/-1
dB
ΔRF_T
RF output power stability
versus temperature on
PA_BOOST pin.
From T = -40 °C to +85 °C
+/-1.5
dB
IDDT
Supply current in Transmit
mode with impedance
matching
RFOP = +20 dBm, on
PA_BOOST
128
mA
RFOP = +17 dBm, on
PA_BOOST
106
mA
RFOP = +14 dBm, on
RFO_HF pin
47
mA
RFOP = + 7 dBm, on
RFO_HF pin
34
mA
8.2 LoRa Transceiver Specification
Conditions:
The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following
conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error
Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes.
With matched impedances
LoRa Receiver Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
IDDR_L
Supply current in receiver
LoRa mode, LnaBoost off
Band 1, BW = 125 kHz
21.5
mA
Band 1, BW = 250 kHz
22.2
mA
Band 1, BW = 500 kHz
23.6
mA
RFS_L125_HF
RF sensitivity, Long-Range
Mode, highest LNA gain,
LnaBoost for Band1, using
split Rx/Tx path
125 kHz bandwidth
SF = 6
-117.5
dBm
SF = 7
-122.5
dBm
SF = 8
-125.5
dBm
SF = 9
-128.5
dBm
SF = 10
-131.0
dBm
SF = 11
-133.5
dBm
SF = 12
-135.5
dBm
RFS_L250_HF
RF sensitivity, Long-Range
Mode, highest LNA gain,
LnaBoost for Band1, using
split Rx/Tx path
250 kHz bandwidth
SF = 6
-114.0
dBm
SF = 7
-119.0
dBm
SF = 8
-122.0
dBm
SF = 9
-125.0
dBm
SF = 10
-127.5
dBm
SF = 11
-130.0
dBm
SF = 12
-133.0
dBm
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LoRa Transmitter Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
IDDT_L
Supply current in transmitter
mode
RFOP setting = 14 dBm
47
mA
RFOP setting = 10 dBm
36
mA
IDDT_H_L
Supply current in transmitter
mode
Using PA_BOOST pin
RFOP setting = 20 dBm
128
mA
9. Power Sequences
9.1 Power Up Sequence
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10. Recommend Land Pattern
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11. Reference circuit
U4
LoRa module
PA12/USB_DP
1
PA11/USB_DM
2
GND
3
VDD_USB
4
VDD_MCU
5
VDD_RF
6
GND
7
DBG_SX1276_DIO2
8
DBG_SX1276_DIO3
9
SX1276_DIO4
10
DBG_SX1276_DIO5
11
DBG_SX1276_DIO1
12
DBG_SX1276_DIO0
13
PB15/SPI2_MOSI
14
PB14/SPI2_MISO
15
PB13/SPI2_SCK
16
PB12/SPI2_NSS
17
PA10/USART1_RX
18
PA9/USART1_TX
19
PA8/MCO
20
PA5/ADC5/DAC2
21
PA4/ADC4/DAC1
22
PA3/ADC3
23
PA2/ADC2
24
GND 25
ANT 26
GND 27
DBG_CRF1 28
DBG_CRF3 29
DBG_CRF2 30
STSAFE_nRST 31
VREF+ 32
PA0/WKUP1 33
MCU_nRST 34
PB8/I2C1_SCL 35
PB9/I2C1_SDA 36
PB2/LPTIM1_OUT 37
PB7/LPTIM1_IN2 38
PB6/LPTIM1_ETR 39
PA13/SWDIO 41
PA14/SWCLK 42
BOOT0 43
GND 44
PB5/LPTIM1_IN1 40
PH1-OSC_OUT 45
PH0-OSC_IN 46
TCXO_OUT 47
VDD_TCXO 48
GND 49
GND 50
GND 51
GND 52
GND 53
GND
54
GND
55
GND
56
GND
57
C3
10uF
C5
0.1uF
J1
1
1
2
2
3
3
4
4
5
5
6
6
Notes for VREF+
1. VREF+ can be grounded when
ADC and DAC are not active.
2. VREF+ can be connected to a
separate voltage which is between
1.8V and VDD for better accuracy
on low-voltage inputs and outputs
of ADC and DAC.
C6
1uF
VDD_TCXO
Button
1 2
C7 0.1uF
VDD
R2
10K
J2 2
3
4
1
5
SMA connector to
868MHz/915MHz Antenna
C4
1uF
VDD
VDD_USB
C8 C9
SWD connector
L1
VDD
R1
10K
for VDD_TCXO connection
Option1: Connect VDD_TCXO to VDD
Option2: Connect VDD_TCXO to PA12
to make sure MCU can control TCXO on/off
VREF+
C1
10uF
C2
0.1uF
Optional
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12. Tape and Reel packing
12.1 Dimension of Tape (Plastic tape)
(unit : mm)
12.2 Dimensions of Reel
2.0±0.1
1.75±0.10
0.30±0.05
24.0±0.1
11.5±0.1
13±0.1
1.5+0.1/-0.0
24.0±0.3
feeding direction
4.0±0.1 *1
12.1±0.1
1.5+0.1/-0
2±0.15
W1
W2
R80
R135
R5
5
22
φ
10
120
°
φ330±2
φ 80±1
φ13±0.2
Label
Reel inside width W1: 25.5±1.0
Reel outside width W2: 29.5±1.0
Unit: mm
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12.3 Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 62μm in thickness
[4] Base tape : As specified in (1)
12.4 Leader and Tail tape
40 to 200mm
(No components)
Components
No components
Feeding direction
Leader tape
(Cover tape alone)
150mm min.
250mm min.
Tail tape
Feeding Hole
Chip
Feeding Direction
[2]
[3]
[4]
[3]
[1]
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- The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
- The cover tape and base tape are not adhered at no components area for 250mm min.
- Tear off strength against pulling of cover tape : 5N min.
- Packaging unit : 1000 pcs/ reel
- Material
Base tape : Plastic
Reel : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
- Peeling of force: 1.3N max. in the direction of peeling as shown below.
- Packaging (Humidity proof Packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
165 to 180 ?
0.7 N max.
Base tape
Cover tape
1.3 N max.
湿度
イ ン ジケ－タ
乾燥剤
表示ラ べル
防湿梱包袋
表示ラ ベル
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Plastic Bag
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13. Notice
13.1 Storage Conditions
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35 °C and humidity from 20 ~ 70 %RH.
(Packing materials, in particular, may be deformed at the temperature over 40 °C)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
- After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be
used within 168 hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125 +5/-0 °C, 24 hours, 1 time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
13.2 Handling Conditions
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solderability.
13.3 Standard PCB Design (Land Pattern and Dimensions)
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
13.4 Notice for Chip Placer :
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
13.5 Soldering Conditions：
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C .
Contact Murata before use if concerning other soldering conditions.
Preliminary Specification Number : SP-ABZ-D
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
Reflow Soldering Standard Conditions (Example)
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
13.6 Cleaning :
Since this Product is Moisture Sensitive, any cleaning is not permitted.
13.7 Operational Environment Conditions :
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
13.8 Input Power Capacity :
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
Within 120 s
Pre-heatin
g
time(s)
220 °C
Within 60 s
Cooling down
Slowly
180 °C
150 °C
240 ~ 250 °C
Within 3 s
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
14. Regulatory Statements
14.1 FCC Statements
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired
operation.
Cet appareil est conforme à la section 15 des réglementations de la FCC. Le fonctionnement de
l’appareil est sujetaux deux conditions suivantes :
(1) cet appareil ne doit pas provoquer d’interférences néfastes, et
(2) cet appareil doit tolérer les interférences reçues, y compris celles qui risquent de provoquer un
fonctionnement indésirable.
Note: This product has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This product generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this product does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Please take attention that changes or modification not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
This equipment should be installed and operated with a minimum distance 20cm between the radiator
and your body
Cet équipement doit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et votre
corps
When the FCC ID is not visible when the module is installed inside another device, then the outside of
the device into which the module is installed must also display a label referring to the enclosed module.
This exterior label can be use wording ”Contains transmitter module FCC ID: VPYCMABZ” or “Contains
FCC ID: VPYCMABZ”.
Preliminary Specification Number : SP-ABZ-D
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
14.2 IC Statements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts
de licence. L'exploitation est autorisée aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type
and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential
radio interference to other users, the antenna type and its gain should be so chosen that the equivalent
isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par
Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée
équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication
satisfaisante.
When the Industry Canada certification number is not visible when the module is installed inside another
device, then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. This exterior label can be use wording ”Contains transmitter module
IC: 772C-CMABZ”or “Contains IC: 772C-CMABZ”.
14.3 eneral Statements
G
Therefore, the final host product must be submitted to [Sychip] for confirmation that the installation of the module
the model documented in the Filing is used, a Class 2 Permissive Change must be filed with the FCC.
into the host is in compliance with the regulations of FCC and IC Canada. Specifically, if an antenna other than
Changes or modifications not expressly approved by the manufacture could void the user's authority to operate
the equipment.
The module is limited to OEM installation ONLY
The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or
install module.
install
The Lora module is for use with external antennas ONLY.
The antenna is Monopole Antenna and maximum gain is 1.04 dBi.
This module has been approved by FCC to operate with the antenna types with the maximum permissible gain
indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for
that type, are strictly prohibited for use with this device.
Preliminary Specification Number : SP-ABZ-D
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
CAUTION
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for
the specifications of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the
premise that our product is used for the purpose, under the condition and in the environment specified in
this specification. You are requested not to use our product deviating from the condition and the
environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the
specifications provided herein. Accordingly, we shall not be responsible for any defects in products or
equipment incorporating such products, which are caused under the conditions other than those
specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR
IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR
PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for
the prevention of such defect as may directly cause damage to the third party's life, body or property. You
acknowledge and agree that, if you use our products in such applications, we will not be responsible for
any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL
CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT
LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH
APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and
reproducing our product. Our product cannot be used for the product which is prohibited from being
manufactured, used, and sold by the regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our
patent right, copyright, mask work right, or our other intellectual property right relating to any combination,
machine, or process in which our products or services are used. Information provided by us regarding
third-party products or services does not constitute a license from us to use such products or services or
a warranty or endorsement thereof. Use of such information may require a license from a third party
under the patents or other intellectual property of the third party, or a license from us under our patents or
other intellectual property.
Please do not use our products, our technical information and other data provided by us for the
purpose of developing of mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export
administration regulations", etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of
supply of materials and/or components from our suppliers.
Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or
alleged defect of Products only at the level required for consumer grade Products, and thus such
analysis may not always be available or be in accordance with your request (for example, in cases
where the defect was caused by components in Products supplied to Murata from a third party).
By signing on specification sheet or approval sheet, you acknowledge that you are the legal
representative for your company and that you understand and accept the validity of the contents herein.
When you are not able to return the signed version of specification sheet or approval sheet within 90
days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent
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< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
on the content of specification sheet or approval sheet.
Customer acknowledges that engineering samples may deviate from specifications and may contain
defects due to their development status.
We reject any liability or product warranty for engineering samples.
In particular we disclaim liability for damages caused by
・the use of the engineering sample other than for evaluation purposes, particularly the installation or
integration in the product to be sold by you,
・deviation or lapse in function of engineering sample,
・improper use of engineering samples.
We disclaims any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.