Murata LB1CDIMP003 1CD User Manual SP ZV1CD E
Murata Manufacturing Co., Ltd. 1CD SP ZV1CD E
Murata >
User Manual
Preliminary Specification Number : SP-ZV1CD-E
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
WiFi Module Data Sheet
Broadcom BCM43362 WiFi + ST Micro STM32F405 MCU
Tentative P/N : LBWA1ZV1CD-716
Preliminary Specification Number : SP-ZV1CD-E
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The revision history of the product specification
Issued
Date
Revision
Code
Revision
Page Changed Items
Change
Reason
Apr.11.2014 First issued
May.23.2014 AP4 3. Block Diagram, 2MBit -> 4MBi
Jun.3.2014 B
P10
P17
7. Absolute Maximum Rating
8. Operating Condition
9. Electric characteristics
14. Recommended Components
Jul.1.2014 C
P9
P11
P12
P18
5. LED Drive
6. Phototransistor
Corrected reference paragraph
10. External clock source
characteristics add
11. Power Up Sequence
Changed "NRST" to "RESET_L"
15.4. Low Power Schematic
-ABS07-120-32.768kHz-T add
-Changed "ST3215SB32768B0HPWB1" to
"ST3215SB32768B0HPWB3"
Jul.31.2014 D
P10
P18
7. SPI Flash Requirements
Added SPI Flash Requirements
16. Recommended Components
Added SPI Flash
Oct.14.2014 E P18
16. Recommended Components
-Changed APT2012P3BT with KDT00030TR
-Changed S24FLxxx with S25FLxxx
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TABLE OF CONTENTS
1. Scope ..................................................................................................................................................... 3
2. Part Number ........................................................................................................................................... 3
3. Block Diagram ........................................................................................................................................ 4
4. Dimensions, Marking and Terminal Configurations ............................................................................... 5
4.1. Dimensions ...................................................................................................................................... 5
4.2. Terminal Configurations................................................................................................................... 6
4.3. Pin Mux Table .................................................................................................................................. 8
5. LED Drive ............................................................................................................................................... 9
6. Phototransistor ....................................................................................................................................... 9
7. SPI Flash Requirements ...................................................................................................................... 10
8. Absolute Maximum Rating ................................................................................................................... 10
9. Operating Condition ............................................................................................................................. 10
10. Electric characteristics.........................................................................................................................11
11. External clock source characteristics ..................................................................................................11
11.1. Low-speed external user clock characteristics.............................................................................11
12. Power Up Sequence .......................................................................................................................... 12
12.1. Without RESET_L control............................................................................................................ 12
12.2. With RESET_L control................................................................................................................. 12
12.2.1. RESET_L Circuit................................................................................................................... 12
13. RF Characteristics.............................................................................................................................. 13
13.1. RF Characteristics for IEEE802.11b (11Mbps mode unless otherwise specified.)..................... 13
13.2. RF Characteristics for IEEE802.11g (54Mbps mode unless otherwise specified.)..................... 13
13.3. RF Characteristics for IEEE802.11n (65Mbps(MCS7) mode unless otherwise specified.) ........ 14
14. Land Pattern (Top View)..................................................................................................................... 15
15. Reference Circuit................................................................................................................................ 16
15.1. Low Cost Schematic.................................................................................................................... 16
15.2. Low Power Schematic ................................................................................................................. 17
16. Recommended Components ............................................................................................................. 18
16.1. Bi-color LED................................................................................................................................. 18
16.2. Phototransistor............................................................................................................................. 18
16.3. SPI Flash ..................................................................................................................................... 18
16.4. Low Cost Schematic.................................................................................................................... 18
16.5. Low Power Schematic ................................................................................................................. 18
17. Tape and Reel Packing ...................................................................................................................... 19
18. NOTICE.............................................................................................................................................. 22
18.1. Storage Conditions: ..................................................................................................................... 22
18.2. Handling Conditions: ................................................................................................................... 22
18.3. Standard PCB Design (Land Pattern and Dimensions): ............................................................. 22
18.4. Notice for Chip Placer:................................................................................................................. 22
18.5. Soldering Conditions: .................................................................................................................. 23
18.6. Cleaning:...................................................................................................................................... 23
18.7. Operational Environment Conditions: ......................................................................................... 23
18.8. Input Power Capacity: ................................................................................................................. 23
19. PRECONDITION TO USE OUR PRODUCTS................................................................................... 24
Please be aware that an important notice concerning availability, standard warranty and use in critical
applications of Murata products and disclaimers thereto appears at the end of this specification sheet.
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1. Scope
This specification is for the LBWA1ZV1CD smart module that provides connectivity to the internet via
WiFi with embedded OS that works with the Electric Imp cloud service.
802.11 b/g/n WiFi
- 20MHz 11n channels, 1 x 1
32-bit Cortex M4 processor
- Robust embedded operating system with fail-safe firmware updates
- Virtual machine for vendor firmware
LED drive for red/green status LEDs
Phototransistor input for Electric imp’s patent-pending BlinkUpTM technology to provide
optical configuration
23 user selectable I/Os
- GPIO, PWM, Analog input & output, SPI, UART, I2C
- Dedicated SPI bus for local storage
Low power 4uA sleep mode (with external load switch)
- Option for coin cell RTC battery backup
Compliant with the RoHS directive
2. Part Number
Sample Part Number
LBWA1ZV1CD-716
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3. Block Diagram
STM32F405
BCM43362
SPDT LPF
32.768KHz
xtal
26MHz
xtal
26MHz
xtal
DC/DC
inductor
opto
23
I/Os
4Mbit or higher density
SPI Flash
3.3V switch power supply
Load switch
antenna
LBWA1ZV1CD-716
<Low Power Block Diagram>
STM32F405
BCM43362
SPDT LPF
26MHz
xtal
26MHz
xtal
DC/DC
inductor
opto
23
I/Os
4Mbit SPI
Flash 3.3V LDO
antenna
LBWA1ZV1CD-716
<Low Cost Block Diagram>
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4. Dimensions, Marking and Terminal Configurations
4.1. Dimensions
Mark Dimensions Mark Dimensions Mark Dimensions
L 10.0 +/- 0.2 W 7.9 +/- 0.2 T 1.25 max.
a1 0.65 +/- 0.1 a2 0.35 +/- 0.1 a3 0.35 +/- 0.1
a4 0.35 +/- 0.1 a5 0.80 +/- 0.1 b1 0.30 +/- 0.2
b2 0.30 +/- 0.2 c1 0.80 +/- 0.1 c2 0.80 +/- 0.1
c3 0.80 +/- 0.1 c4 0.80 +/- 0.1 c5 0.80 +/- 0.1
e1 0.30 +/- 0.1 e2 0.30 +/- 0.1 e3 0.30 +/- 0.1
e4 0.80 +/- 0.1 e5 0.40 +/- 0.1 e6 0.30 +/- 0.1
e7 0.75 +/- 0.1 e8 0.30 +/- 0.1 e9 0.50 +/- 0.1
e10 0.60 +/- 0.1 m1 0.40 +/- 0.1 m2 0.40 +/- 0.1
(unit : mm)
< Side View > < Bottom View >
< Top View >
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4.2. Terminal Configurations
No. Terminal Name Type Description
1 GND - Ground
2 OPTO_Bias O Phototransistor bias voltage
3 OPTO_IN I Phototransistor input
4 PinW I/O I/O, please refer to Pin mux table
5 OSC32_IN I MCU sleep clock input
6 OSC32_OUT O MCU sleep clock output
7 PinN I/O I/O, please refer to Pin mux table
8 PSU_EN O External power supply enable
9 WLAN_POWER_EN O External power gate enable
10 GND - Ground
11 GND - Ground
12 ANT - Antenna
13 GND - Ground
14 GND - Ground
15 VDD PI Power supply for MCU VDD and WLAN Digital IO
16 WLAN_ANT_CTL2 O Antenna switch control. Default is low.
NC if not in use.
17 WLAN_ANT_CTL1 O Antenna switch control. Default is high.
NC if not in use.
18 VDD_PA PI
Power supply for Internal Power Amplifier.
19 VDD_PA PI
20 VDD_WLAN PI
Power supply for WLAN IC
21 VDD_WLAN PI
22 VDD_DCDC_IN PI Voltage input for core LDO, low noise LDO1 and VCO/LDO
23 GND - Ground
24 VDD_DCDC_OUT PO Voltage output for core LDO.
25 SPIFLASH_NCS O SPI flash nCS
26 SPIFLASH_MISO I SPI flash MISO
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27 SPIFLASH_MOSI O SPI flash MOSI
28 SPIFLASH_SCK O SPI flash CLK
29 LED_RED O Must be connected to the Red terminal of the indicator LED
30 LED_GREEN O Must be connected to the Green terminal of the indicator LED
31 PinM I/O I/O, please refer to Pin mux table
32 PinL I/O I/O, please refer to Pin mux table
33 PinK I/O I/O, please refer to Pin mux table
34 PinJ I/O I/O, please refer to Pin mux table
35 PinH I/O I/O, please refer to Pin mux table
36 GND - Ground
37 PinG I/O I/O, please refer to Pin mux table
38 PinF I/O I/O, please refer to Pin mux table
39 PinE I/O I/O, please refer to Pin mux table
40 PinD I/O I/O, please refer to Pin mux table
41 PinC I/O I/O, please refer to Pin mux table
42 PinB I/O I/O, please refer to Pin mux table
43 PinA I/O I/O, please refer to Pin mux table
44 VDDA PI MCU analog power and reference, must be connected to VDD
45 VBAT PI MCU retention RAM and RTC backup supply
46 PinY I/O I/O, please refer to Pin mux table
47 GND - Ground
48 PinV I/O I/O, please refer to Pin mux table
49 GND - Ground
50 DNC - Do not connect
51 GND - Ground
52 RESET_L I MCU reset, internally pulled up
53 GND - Ground
54 GND - Ground
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55 GND - Ground
56 GND - Ground
57 GND - Ground
58 PinQ I/O I/O, please refer to Pin mux table
59 PinR I/O I/O, please refer to Pin mux table
60 PinT I/O I/O, please refer to Pin mux table
61 PinP I/O I/O, please refer to Pin mux table
62 PinS I/O I/O, please refer to Pin mux table
63 PinU I/O I/O, please refer to Pin mux table
64 PinX I/O I/O, please refer to Pin mux table
65 VSSA - MCU analog ground, must be connected to GND
66-76 GND - Ground
4.3. Pin Mux Table
Pin uartFG uartQRPW uartUVGD uartWJ uartDM i2cFG i2cAB spiEBCA spiLGDK ADC DAC PWM Wake from
sleep
State
change
callback
Pin trig
pulse gen
Pin A SCL nSS yes yes yes
Pin B SDA MISO yes yes yes
Pin C SCLK yes yes yes yes
Pin D CTS TX SCLK yes
Pin E MOSI yes yes yes for C
Pin F TX SCL yes yes for K,X
Pin G RX RTS SDA MISO yes
Pin H yes
Pin J RX yes
Pin K nSS yes yes
Pin L MOSI yes for G
Pin M RX yes yes for D
Pin N yes
Pin P RTS yes
Pin Q TX yes
Pin R RX yes
Pin S
Pin T yes
Pin U TX yes
Pin V RX yes
Pin W CTS TX yes yes yes
Pin X yes
Pin Y
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5. LED Drive
The indicator LED should be bicolor, because red, green and amber (red+green) are used to indicate status.
The LED drive pins will auto-detect common anode or common cathode parts. The detection is done by
looking to see which way up the LED_RED pin is idling at boot; to ensure this works correctly, please place a
100k resistor in parallel with the red LED.
The current drive on these pins is 20mA maximum.
Please refer to paragraph 15 for the recommended LEDs.
<Common anode diagram> <Common cathode diagram>
6. Phototransistor
The phototransistor is used to receive BlinkUp configuration data. The bias resistor connected between
OPTO_IN and GND may need to be adjusted to ensure adequate sensitivity and response time - in general
you need at least 500mV swing on the OPTO_IN pin between black and white states, with the worst
(dimmest) BlinkUp sender you can find.
End-user BlinkUp send data at between 30 and 60 bits per second, depending on the user’s device. For
factory configuration, data is typically sent at 142 bits per second using red LED(s) in a test fixture. If your
application does not require optical configuration, config can be sent electrically at 120 bits per second from
another micro using the OPTO_IN pin. Please contact us for more details.
Please refer to paragraph 15 for the recommended phototransistors.
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7. SPI Flash Requirements
An external SPI Flash part is required. The minimum size of the SPI Flash is 4 Mbit (512 kByte). The area
below address 0x70000 (448 kByte) is reserved for use by the OS. The remainder of the available space is
made available to user code programmatically. Areas below address 0x70000 will be erased and
reprogrammed by the OS; applications using pre-programmed SPI Flash components must not use space
below this address.
Minimum Size 4 Mbit (512 kByte)
Reserved for OS (do not pre-program) 0x000000 to 0x70000 (448 kByte)
8. Absolute Maximum Rating
min. max. unit
Storage Temperature -40 +85 deg.C
Supply Voltage
VDD -0.3 4 V
VDD_PA -0.3 6 V
VDD_WLAN -0.3 6 V
Caution! The absolute maximum ratings indicate levels where permanent damage to the device can occur, even if
these limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions.
Opertation at absolute maximum conditions for extended periods can adversely affect long-term reliabilty of the
device.
9. Operating Condition
min. typ. max. unit
Operating Temperature Range(*1) -40 +85 deg.C
Specification Temperature Range -20 +70 deg.C
Supply Voltage
VDD 1.8 3.3 3.6 V
VDD_PA 2.3(*2) 3.3 4.8(*2) (*3) V
VDD_WLAN 2.3(*2) 3.3 4.8(*2) (*3) V
Backup operating Voltage VBAT 1.65 3.3 3.6 V
[Note] All RF characteristics in this datasheet are defined by Specification Temperature Range
(*1) Functionality is guaranteed but specifications require derating at extreme temperatures.
(*2)The BCM43362 is functional across this range of voltage. RF performance is guaranteed only 3.0V < VDD_PA/WLAN < 4.8V
(*3) The maximum continuous voltage is 4.8V. Voltages up to 5.5V for up to 10 seconds, cumulative duration, over the lifetime of the
device are allowed voltages as high 5.0V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.
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10. Electric characteristics
Parameter Description Min Typ Max Unit
IDD
Normal operation, WiFi on 80 250(*1) mA
Normal operation, WiFi power-save
mode enabled 8250(*1) mA
WiFi is off, processor sleep, RTC on,
nvram preserved 6uA
IDDA Current input on VDDA 70 500 uA
VIH I/O input high level voltage 0.7Vdd 3.6 V
VIL I/O input low level voltage Vss-0.3 0.3Vdd V
IOUT
Output current on any single I/O pin -8 8 mA
Output current on LED_RED pin -20 20 mA
Output current on LED_GREEN pin -20 20 mA
Total output current on all I/O pins
including LED_RED & LED_GREEN -80 -80 mA
I/O input
leakage
current
VSS VIN VDD 6 uA
Load
capacitance Pins A to Y 15 pF
(*1) 250mA current is during worst-case TX events. These are a maximum of ~4.8ms long (802.11b 1Mbps)
11. External clock source characteristics
11.1. Low-speed external user clock characteristics
Symbol Parameter Conditions Min Typ Max Unit
fLSE_ext User External clock source frequency
(
*
1)
-32.7681,000 kHz
VLSEH OSC32_IN input pin high level voltage 0.7VDD -V
DD V
VLSEL OSC32_IN input pin low level voltage VSS -0.3V
DD
tW(LSE)
t
f(LSE)
OSC32_IN high or low time(*1) 450 - -
ns
tr(LSE)
t
r(LSE)
OSC32_IN rise or fall time(*1) --50
Cin(LSE) OSC32_IN input capacitance(*1) -5- pF
DuCy(LSE) Duty cycle 30 - 70 %
ILOSC32_IN Input leakage current VSSINDD --±1uA
CL Load Capacitance 6pF
C0 Shunt Capacitance 1.5 pF
(*1) Guaranteed by design, not tested in production
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12. Power Up Sequence
12.1. Without RESET_L control
*Power down sequence is opposite sequence of power up.
12.2. With RESET_L control
*Power down sequence is opposite sequence of power up.
12.2.1. RESET_L Circuit
(1) The reset network protects the device against parasitic resets.
(2) The use must ensure that the level on the RESET_L pin can go below the 0.8V. Otherwise the reset is not taken into account by the
device.
(3) Vdd=3.3V(for the 1.8Vdd3.6 voltage range)
(4) RPU=40k ohm (for the 30RPU50kohm range)
Filter
Internal
Reset
V
DD (3)
R
PU (4)
RESET_L
(2)
External
Reset circuit
(1)
Murata
Module
0.1uF
VDD_3P3
Ramp time 90% > 40µs
VDD_PA
VDD_WLAN
Timing same as VDD_3P3
VDD_3P3
Ramp time 90% > 40µs
VDD_PA >2SleepClockcycles(>61µs)
RESET_L
VDD_WLAN
Timing same as VDD_3P3
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13. RF Characteristics
13.1. RF Characteristics for IEEE802.11b (11Mbps mode unless otherwise specified.)
Conditions: 25deg.C, VDD=VDD_WLAN=3.3V
Items Contents
Specification IEEE802.11b
Mode DSSS / CCK
Frequency 2400 - 2483.5MHz
Data rate 1, 2, 5.5, 11Mbps
Target Max Output Power 17.0
- DC Characteristics - min. Typ. max. Unit
1. DC current
1) Tx mode - TBD TBD mA
2) Rx mode - 120 170 mA
- Tx Characteristics - min. Typ. max. Unit
2. Power Levels 15.0 17.0 19.0 dBm
- Rx Characteristics - min. typ. max. Unit
3. Minimum Input Level Sensitivity
1) 11Mbps (FER < 8%) - -87 -76 dBm
4. Maximum Input Level (FER < 8%) -10 - - dBm
5. Adjacent Channel Rejection
(FER < 8%) 35 - - dB
13.2. RF Characteristics for IEEE802.11g (54Mbps mode unless otherwise specified.)
Conditions: 25deg.C, VDD=VDD_WLAN=3.3V
Items Contents
Specification IEEE802.11g
Mode OFDM
Frequency 2400 - 2483.5MHz
Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps
Target Max Output Power 13.0dBm
- DC Characteristics - min. Typ. max. Unit
1. DC current
1) Tx mode (1024byte, 20usec interval) - 295 370 mA
2) Rx mode - 125 170 mA
- Tx Characteristics - min. typ. max. unit
2. Power Levels 11.0 13.0 15.0 dBm
- Rx Characteristics - min. typ. max. Unit
3. Minimum Input Level Sensitivity
1) 54Mbps (PER < 10%) - -73 -65 dBm
4. Maximum Input Level (PER < 10%) -20 - - dBm
5. Adjacent Channel Rejection
(PER < 10%) -1 - - dB
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13.3. RF Characteristics for IEEE802.11n (65Mbps(MCS7) mode unless otherwise specified.)
Conditions: 25deg.C, VDD=VDD_WLAN=3.3V
Items Contents
Specification IEEE802.11n
Mode OFDM
Frequency 2400 - 2483.5MHz
Data rate 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
Target Max Output Power 12.0dBm
- DC Characteristics - min. Typ. max. Unit
1. DC current
1) Tx mode (1024byte, 20usec interval) - 280 350 mA
2) Rx mode - 125 170 mA
- Tx Characteristics - min. typ. max. Unit
2. Power Levels 10.0 12.0 14.0 dBm
- Rx Characteristics - min. typ. max. Unit
3. Minimum Input Level Sensitivity
1) 65Mbps (PER < 10%) - -70 -64 dBm
4. Maximum Input Level (PER < 10%) -20 - - dBm
5. Adjacent Channel Rejection
(PER < 10%) -2 - - dB
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14. Land Pattern (Top View)
Unit : mm
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15. Reference Circuit
15.1. Low Cost Schematic
Please refer to paragraph 16 for the low cost recommended components.
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15.2. Low Power Schematic
Please refer to paragraph 16 for the low power recommended components.
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16. Recommended Components
16.1. Bi-color LED
Manufacturer Manufacturer’s part number
Surface mount
top-view SunLED XZMDKVG59W-1
Liteon LTST-C195KGJRKT
side-view SunLED XZMDKVG88W
Bivar SM1204BC
Through
-
hole
3mm SunLED XLMDKVG34M
Liteon LTL1BEKVJNN
16.2. Phototransistor
Manufacturer Manufacturer’s part number
Surface mount
top-view Everlight PT17-21C/L41/TR8
Fairchild KDT00030TR
side-view SunLED XZRNI56W-1
Everlight PT12-21C/TR8
Through
-
hole
3mm SunLED XRNI30W-1
Honeywell SDP8405-003
16.3. SPI Flash
Size Manufacturer Manufacturer’s part number
4Mbit Spansion S25FL204K
4Mbit Macronix MX25L4006E
32 Mbit Spansion S25FL132K
32 Mbit Macronix MX25L3206E
16.4. Low Cost Schematic
Size Manufacturer Manufacturer’s part number Description
U2 please refer to paragraph 16.3 SPI Flash
Q1 please refer to paragraph 16.2 clear lens phototransistor
D1 please refer to paragraph 16.1 red/green bicolor LED
L1 Murata LQM21PN1R5MC0 1.5uH inductor
16.5. Low Power Schematic
Ref Des Manufacturer Manufacturer’s part number Description
U2 please refer to paragraph 16.3 SPI Flash
U3 Diodes Inc. AP2281 2A load switch
Q1 please refer to paragraph 16.2 clear lens phototransistor
D1 please refer to paragraph 16.1 red/green bicolor LED
L1 Murata LQM21PN1R5MC0 1.5uH inductor
Y1
Kyocera ST3215SB32768B0HPWB3
32.768kHz crystalAbracon ABS25-32.768KHZ-T
Abracon ABS07-120-32.768kHz-T
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17. Tape and Reel Packing
(1) Dimensions of Tape (Plastic tape)
1) The corner and ridge radiuses (R) of inside cavity are 0.3mm max.
2) Cumulative tolerance of 10 pitches of the sprocket hole is +/-0.2mm
3) Measuring of cavity positioning is based on cavity center in accordance with JIS/IES standard.
(2) Dimensions of Reel
(unit : mm)
2.0±0.1
1.75±
0.10
0.30±0.05
1.5 max.
(1.4±0.1)
16.0±0.1
11.5±
0.1
1.5+0.1/-0.0
24
.0±0.3/-0,1
feeding direction
4.0±0.1
8.4±0.1
2.0±0.1/-0.0
1
0.5±0.1
30.5 max.
(100)
13±0.2
2.0±0.5
25.5±0.6
(330)
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(3) Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[4] Base tape : As specified in (1)
(4) Leader and Tail tape
[2]
[3]
[4]
[3]
[1]
Feeding Hole
Chip
Feeding Direction
Pin 1 Marking
Tail tape
(No components)
40 to 200mm
Components No components
150mm min.
Leader tape
(Cover tape alone)
250mm min.
Feeding direction
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(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(6) The cover tape and base tape are not adhered at no components area for 250mm min.
(7) Tear off strength against pulling of cover tape : 5N min.
(8) Packaging unit : 1000pcs./ reel
(9) material : Base tape : Plastic
Real : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
(10) Peeling of force : 0.7N max. in the direction of peeling as shown below.
(11) Packaging (Humidity proof Packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
165 to 180 °
0.7 N max.
Base tape
Cover tape
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Plastic Bag
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< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
18. NOTICE
18.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2,NH
3,SO
2,No
x, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
18.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
18.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
18.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
Preliminary Specification Number : SP-ZV1CD-E
23 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
18.5. Soldering Conditions:
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.
Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions(Example)
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
18.6. Cleaning:
Since this Product is Moisture Sensitive, any cleaning is not permitted.
18.7. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOxetc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
18.8. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
Within 120s
Pre-heating
time(s)
220 deg.C
Within 60s
Cooling down
Slowly
180 deg.C
150 deg.C
240to 250 deg.C
Within 3s
Preliminary Specification Number : SP-ZV1CD-E
24 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
19. PRECONDITION TO USE OUR PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications
of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our
product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided
herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products,
which are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE
DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for the prevention of
such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if
you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment. - Aerospace equipment - Undersea equipment.
- Power plant control equipment -Medicalequipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment. - Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the
regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright,
mask work right, or our other intellectual property right relating to any combination, machine, or process in which our
products or services are used. Information provided by us regarding third-party products or services does not constitute a
license from us to use such products or services or a warranty or endorsement thereof. Use of such information may
require a license from a third party under the patents or other intellectual property of the third party, or a license from us
under our patents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing of
mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials
and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples.
We disclaim any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.
FCC#Warning#
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IC#Warning#
#
Canada!LowVpower!licenseVexempt!radio!communication!devices!(RSSV210)!
a.!Common!information!Operation!is!subject!to!the!following!two!conditions:!
1.!This!device!may!not!cause!interference,!!and!
2.!This!device!must!accept!any!interference,!including!interference!that!may!cause!
undesired!operation!of!the!device.!
!
a.!Informations!communes!
Son!fonctionnement!est!soumis!aux!deux!conditions!suivantes:!
1.!Ce!dispositive!ne!peut!causer!des!interferences,!et!
2.!Ce!dispositive!doit!accepter!toute!interference,!y!compris!les!interferences!qui!
peuvent!causer!un!mauvais!fonctionnement!du!dispositive.!
!
Information!To!Be!Supplied!to!the!End!User!by!the!OEM!or!Integrator!
Modular!information!form!OEM!
Information!to!be!Supplied!to!the!End!User!by!the!OEM!or!Integrator!
The!following!regulatory!and!safety!notices!must!be!published!in!documentation!
supplied!to!the!end!user!of!the!product!or!system!incorporating!an!adapter!in!
compliance!with!local!regulations.!
Host!system!must!be!labeled!with!“Contains!IC:!772CVLB1CDIMP003”!
!
This!1CD!module!is!to!be!used!only!for!mobile!and!fixed!application.!In!order!to!reV
use!the!1CD!module!IC!approvals,!the!antenna(s)!used!for!this!transmitter!must!be!
installed!to!provide!a!separation!distance!of!at!least!20cm!from!all!persons!and!must!
not!be!coVlocated!or!operating!in!conjunction!with!any!other!antenna!or!transmitter.!
If!antenna!is!installed!with!a!separation!distance!of!less!than!20cm!from!all!person!
or!is!coVlocated!or!operating!in!conjunction!with!any!other!antenna!or!transmitter!
then!additional!IC!testing!may!be!required.!EndVUsers!must!be!provided!with!
transmitter!operation!conditions!for!satisfying!RF!exposure!compliance.!
!
OEM!integrators!must!ensure!that!the!end!user!has!no!manual!instructions!to!
remove!or!install!the!1CD!module.!Antennas!used!with!the!1CD!module!must!not!
exceed!2.1dBi!gain!for!chip!antennas!or!2.24dBi!gain!for!PIFA!antennas.!
!