NXP Laboratories UK JN5142M3 JN5142-001-M03 IEEE802.15.4 Wireless Module User Manual JN DS JN5142 x01 Myy

NXP Laboratories UK Ltd JN5142-001-M03 IEEE802.15.4 Wireless Module JN DS JN5142 x01 Myy

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Manual

 Data Sheet: JN5142-x01-Myy JenNet-IP,RF4CE and IEEE802.15.4 Module     JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 Features: Module   2.4GHz IEEE802.15.4, JenNet-IP and RF4CE compatible  Sleep current (with active sleep timer) 0.73µA  JN5142-x01-M00/03 up to 1km range (Ext antenna) M00: integral antenna 18x32mm M03: uFl connector 18x30mm o  TX power +2.5dBm o  Receiver sensitivity –95dBm o  TX current 15mA  o  RX current 17.5mA o  2.3-3.6V operation Features: Microcontroller  32-bit RISC CPU, 1-32MHz clock speed   Low power operation   Variable instruction width for high coding efficiency   Multi-stage instruction pipeline   128KB ROM and 32KB RAM for bootloaded program code   Master/Slave I2C interface.   3xPWM and Application timer/counter   UART   SPI port with 3 selects   Supply Voltage Monitor with 8 programmable thresholds   4-input 8-bit ADC   Comparator   Battery and temperature sensors   Watchdog timer and Power-on-Reset (with brown-out) circuit   Up to 18 DIO  Industrial temp (-40°C to +125°C) 6x6mm 40-lead Punched QFN  Lead-free and RoHS compliant     Overview The JN5142-x01-Myy family is a range of ultra low power, high performance surface mount modules targeted at JenNet-IP and RF4CE networking applications, enabling users to realise products with minimum time to market and at the lowest cost.  They remove  the  need  for  expensive  and  lengthy  development  of  custom  RF  board designs and test suites. The modules use NXP‟s JN5142 wireless microcontroller to provide  a  comprehensive  solution  with  large  memory,  high  CPU  and  radio performance  and all  RF  components  included.    All  that is  required  to  develop  and manufacture wireless control or sensing products is to connect a power supply and peripherals  such  as  switches,  actuators  and  sensors,  considerably  simplifying product development. Two module variants are available: JN5142-x01-M00 with an integrated antenna and the  JN5142-x01-M03  with  antenna  connector.  The  modules  can  implement networking stacks such as JenNet-IP and RF4CE, as well as customer applications. Module Block Diagram 128kB Serial Flash MemoryPower MatchinguFl ConnectorIntegrated AntennaExternal AntennaM00 OptionM03 Option32-bitRISC CPU TimerUART4-Chan 8-bit ADCBattery &Temp sensors,2-Wire Serial (Master)SPI128-bit AESEncryptionAccelerator2.4GHzRadio2.4GHzRadioROM128KBPowerManagementXTALO-QPSKModem29-byteOTP eFuse2-Wire Serial (Slave)Sleep CounterWatchdogTimerWatchdogTimerVoltage Supply MonitorRAM32KBIEEE802.15.4MACAcceleratorMatching    Benefits   Single chip optimized for simple applications   Very low current solution for long battery life – over 10 yrs   Highly featured 32-bit RISC CPU for high performance and low power   System BOM is low in component count and cost   FCC part 15.247 rules, IC Canada RSS 210e and ETSI EN 300-328 v 1.7 compliant  Applications   Robust and secure low power wireless applications using RF4CE   Remote Control   Toys and gaming peripherals   Active RFID tags   Point-to-point or star networks using IEEE802.15.4   Energy harvesting, for example self powered light switch
 ii   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 Contents 1. Introduction  3 1.1.  Variants  3 1.2.  Regulatory Approvals  3 2. Specifications  4 3. Product Development  5 3.1.  JN5142 Single Chip Wireless Microcontroller  5 4. Pin Configurations  6 4.1.  Pin Assignment  7 4.2.  Pin Descriptions  8 4.2.1  Power Supplies  8 4.2.2  SPI Memory Connections  8 5. Electrical Characteristics  9 5.1.  Maximum Ratings  9 5.2.  Operating Conditions  9 Appendix A Additional Information  10 A.1 Outline Drawing  10 A.2 Module PCB Footprint  12 A.3 Manufacturing  13 A.3.1 Reflow Profile  13 A.3.2 Soldering Paste and Cleaning  13 A.4 Ordering Information  14 A.5 Tape and Reel Information:  15 A.5.1 Tape Orientation and dimensions  15 A.5.2 Cover tape details  15 A.5.3 Leader and Trailer  16 A.5.4 Reel Dimensions:  16 A.6 Related Documents  16 A.7 Federal Communication Commission Interference Statement  17 A.7.1 Antennas approved by FCC for use with JN5142 modules  18 A.7.2 FCC End Product Labelling  18 A.8 Industry Canada Statement  18 A.8.1 Industry Canada End Product Labelling  18 A.9 European R & TTE Directive 1999/5/EC Statement  19 A.10 RoHS Compliance  19 A.11 Status Information  19 A.12 Disclaimers  20 Version Control  20
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  3 1. Introduction The  JN5142-x01-Myy  module  family  provides  designers  with  a  ready-made  component  that  provides  a  fully integrated solution for applications using the  IEEE802.15.4 standard  in the  2.4  -  2.5GHz ISM frequency  band [1], including RF4CE. A later version of the JN5142 will provide support for JenNet-IP “Smart Device” applications such as lighting. Applications  that  transfer  data  wirelessly  tend  to  be  more  complex  than  wired  ones.  Wireless  protocols  make stringent  demands  on  frequencies,  data  formats,  timing  of  data  transfers,  security  and  other  issues.  Application development must consider the requirements of the wireless network in addition to the product functionality and user interfaces. To minimise this complexity, NXP provides a series of software libraries and interfaces that control the transceiver  and  peripherals  of  the  JN5142.  These  libraries  and  interfaces  remove  the  need  for  the  developer  to understand wireless protocols and greatly simplifies the programming complexities of power modes, interrupts and hardware functionality. In view of the above, it is not necessary to provide the register details of the JN5142 in the datasheet. The device includes a Wireless Transceiver, RISC CPU, on chip memory and an extensive range of peripherals. The modules integrate all of the RF components required, removing the need to perform expensive RF design and test.  Products can be designed by simply connecting sensors and switches to the module IO pins.  The modules use an NXP single  chip  IEEE802.15.4 Wireless Microcontroller, allowing  designers  to make use of the  extensive chip development  support  material.    Hence,  this  range  of  modules  allows  designers  to  bring  wireless  applications  to market in the minimum time with significantly reduced development effort and cost. Two  variants  are  available:  JN5142-x01-M00  (standard  module  with  integral  antenna)  and  the  JN5142-x01-M03 (standard module with uFL connector for use with external antennae). All modules have FCC modular approvals and are compliant with EU regulations.  The variants available are described below. 1.1. Variants 1.2. Regulatory Approvals All module types have been tested against the requirements of European standard EN 300 328 v1.7.1 and a Notified Body statement of opinion for this standard is available on request.  Additionally, all module types have received FCC “Modular Approvals”, in compliance with CFR 47 FCC part 15 regulations and in accordance to FCC Public notice DA00-1407, appendix A.7 contains details on the conditions applying to this modular approval. The modules are approved for use with a range of different antennas; further details of which can be found in section Appendix A.7.1. The modular approvals notice and test reports are available on request. In addition, all modules have Industry Canada modular approval and RSS210e Issue 7 (June 2007) certification. Variant Description FCCID Industry Canada ID JN5142-001-M00 Standard Power, integrated antenna,  IEEE802.15.4 stack TYOJN5142M0 IC: 7438A-CYO5142M0 JN5142-J01-M00 Standard Power, integrated antenna, Jennet IP stack TYOJN5142M0 IC: 7438A-CYO5142M0 JN5142-001-M03 Standard Power, uFl connector,  IEEE802.15.4 stack   TYOJN5142M3 IC: 7438A-CYO5142M3 JN5142-J01-M03 Standard Power, uFl connector,  Jennet IP stack TYOJN5142M3 IC: 7438A-CYO5142M3
 4   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 2. Specifications Most specification parameters for the modules are specified in the chip datasheet - JN-DS-JN5142 Wireless Microcontroller Datasheet, [2].  Where there are differences, the parameters are defined here. VDD=3.0V @ +25°C Typical DC Characteristics Notes  JN5142-x01-M00/03  Deep sleep current 100nA  Sleep current 0.73uA With active sleep timer Radio transmit current 14.8mA CPU in doze, radio transmitting Radio receive current 16.5mA CPU in doze, radio receiving Centre frequency accuracy +/-25ppm Additional +/-15ppm allowance for temperature and ageing Typical RF Characteristics Notes Receive sensitivity -95dBm Nominal for 1% PER, as per 802.15.4 section 6.5.3.3 (Note 1) Maximum Transmit power +2.5dBm Nominal (Note 1) Maximum input signal +10dBm For 1% PER, measured as sensitivity RSSI range -95 to -10 dBm  RF Port impedance – uFl connector 50 ohm 2.4 - 2.5GHz VSWR (max) 2:1 2.4 - 2.5GHz Peripherals Notes Master SPI port  3 selects 250kHz - 16MHz Slave SPI port  250kHz - 8MHz UART  16550 compatible Two-wire serial I/F (compatible with SMbus & I2C)   Up to 400kHz  Two programmable Timer/Counters with capture/compare facility, Tick timer  16MHz clock Two programmable Sleep Timers   32kHz clock Digital IO lines (multiplexed with UARTs, timers and SPI selects)  18  Four channel Analogue-to-Digital converter  8-bit, up to 100ks/s Programmable analogue comparator  Ultra low power mode for sleep  Internal temperature sensor and battery monitor   The performance of all peripherals is defined in the JN-DS-JN5142 Wireless Microcontroller Datasheet [2]  Note 1:  Sensitivity is defined for conducted measurements on connectorised modules. Modules with an integrated antenna have approximately 3 dB less e.i.r.p and reciprocal receive sensitivity.
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  5 3. Product Development NXP supplies all the development tools and networking stacks needed to enable end-product development to occur quickly and efficiently. These are all freely available from www.nxp.com/jennic.  A range of evaluation/developer kits is also available, allowing products to be quickly bread boarded.  Efficient development of software applications is enabled by the provision of a complete, unlimited, software developer kit.  Together with the available libraries for the IEEE802.15.4  MAC  and  the  JenNet-IP  and  RF4CE  network  stacks,  this  package  provides  everything  required  to develop application code and to trial it with hardware representative of the final module. The  modules  can  be  user  programmed  both  in  development  and  in  production  using  software  supplied  by  NXP.  Access  to  the  on-chip  peripherals,  MAC  and  network  stack  software  is  provided  through  specific  APIs.  This information is available on the NXP/Jennic support website, together with many example applications, user guides, reference manuals and application notes.  3.1. JN5142 Single Chip Wireless Microcontroller The  JN5142-x01-Myy  series  is  constructed  around  the  JN5142-x01  single  chip  wireless  microcontroller,  which includes  the  radio  system,  a  32-bit  RISC  CPU,  ROM  and  RAM  memory  and  a  range  of  analogue  and  digital peripherals. The chip is described fully in JN-DS-JN5142 Wireless Microcontroller Datasheet [2]. The module also includes a 1Mbit serial flash memory, which holds the application code that is loaded into the JN5142 during the boot sequence and provides static data storage, required by the application.
 6   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 4. Pin Configurations 123416ADC1NCNCNCNCSPICLKSPIMISOSPIMOSISPISSZDIO0DIO1DIO2SPISSMSPISWPDIO3DIO4DIO5DIO6DIO7DIO8DIO9DIO10DIO11VDDGNDVSSANCADC2NCNCNCNCDIO17DIO16DIO15RESETNDIO14DIO13DIO125678910111213141517 18 19 20 21 22 23 24 25 26414039383736353433323130292827NCNC Figure 1: Pin Configuration (top view)  Note that the same basic pin configuration applies for all module designs.
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  7 Pin Assignment Pin No Pin Functions Signal Type Description Primary Alternate Functions 1 ADC1     3.3V  Analogue to Digital Input 2  NC       3 NC       4 NC       5 NC       6 SPICLK     CMOS SPI Clock Output 7 SPIMISO     CMOS SPI Master In Slave Out Input 8 SPIMOSI     CMOS SPI Master Out Slave In Output 9 SPISSZ     CMSO SPI Select From Module – SS0 Output 10 DIO0 SPISEL1 ADC3   CMOS DIO0 or SPI Slave Select Output 1 or ADC input 3 11 DIO1 SPISEL2 ADC4 PC0  CMOS DIO1, SPI Slave Select Output 2, ADC input 4 or Pulse Counter0 Input 12 DIO2 TIM0CK_GT RFRX   CMOS DIO2, Timer0 Clock/Gate Input or Radio Receive Control Output 13 SPISSM     CMOS SPI Select to FLASH (Input) 14 SPISWP     CMOS FLASH Write Protect (Input) 15 DIO3 TIM0CAP RFTX   CMOS DIO3, Timer0 Capture Input or Radio Transmit Control Output 16 DIO4 CTS0 JTAG_TCK TIM0OUT  CMOS DIO4, UART 0 Clear To Send Input, JTAG CLK or Timer0 PWM Output 17 DIO5 RTS0 JTAG_TMS PWM1 PC1 CMOS DIO5, UART 0 Request To Send Output, JTAG Mode Select, PWM1 Output or Pulse Counter 1 Input 18 DIO6 TXD0 JTAG_TDO PWM2  CMOS DIO6, UART 0 Transmit Data Output, JTAG Data Output or PWM2 Output 19 DIO7 RXD0 JTAG_TDI PWM3  CMOS DIO7, UART 0 Receive Data Input, JTAG Data Input or PWM 3 Output 20 DIO8 TIM0CK_GT PC1   CMOS DIO8, Timer0 Clock/Gate Input or Pulse Counter1 Input 21 DIO9 TIM0CAP 32KXTALIN   CMOS DIO9, Timer0 Capture Input or 32K External Crystal Input  22 DIO10 TIM0OUT 32KXTALOUT   CMOS DIO10, Timer0 PWM Output or 32K External Crystal Output 23 DIO11 PWM1    CMOS DIO11 or PWM1 Output 24 VDD     3.3V Supply Voltage 25 GND     0V Digital Ground 26 VSSA     0V Analogue Ground 27 DIO12 PWM2 CTS0 JTAG_TCK AD0 CMOS DIO12, PWM2 Output, UART 0 Clear To Send Input, JTAG CLK or Antenna Diversity Odd 28 DIO13 PWM3 RTS0 JTAG_TMS ADE CMOS DIO13, PWM3 Output, UART 0 Request To Send Output, JTAG Mode Select or Antenna Diversity Even 29 RESETN     CMOS Reset input
 8   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 30 DIO14 SIF_CLK TXD0 JTAG_TDO SPISEL1 CMOS DIO14, Serial Interface Clock, UART 0 Transmit Data Output, JTAG Data Output or SPI Slave Select Output 1 31 DIO15 SIF_D RXD0 JTAG_TDI SPISEL2 CMOS DIO15, Serial Interface Data, UART 0 Receive Data Input, JTAG Data Input or SPI Slave Select Output 2 32 DIO16 COMP1P  SIF_CLK   CMOS DIO16, Comparator Positive Input or Serial Interface clock 33 DIO17 COMP1M SIF_D   CMOS DIO17, Comparator Negative Input or Serial Interface Data 34 NC       35 NC       36 NC       37 NC       38 NC       39 NC       40 ADC2 VREF    3.3V Analogue peripheral reference voltage or ADC input 2 41 NC       4.2. Pin Descriptions All pins behave as described in the JN-DS-JN5142 Wireless Microcontroller Datasheet [2], with the exception of the following: 4.2.1 Power Supplies A single power supply pin, VDD is provided.  Separate analogue (VSSA) and digital (GND) grounds are provided. These should be connected together at the module pins.  4.2.2 SPI Memory Connections SPISWP is a write protect pin for the serial flash memory.  This should be held low to inhibit writes to the flash device. SPISSZ is connected to SPI Slave Select 0 on the JN5142.  SPISSM is connected to the Slave Select pin on the memory.  This configuration allows the flash memory device to be programmed using an external SPI programmer if required.  For programming in this mode, the JN5142 should be held in reset by taking RESETN low.  Two suggested flash 1Mbit memory devices that may be used in the module are, the Micron M25P10A and the Winbond W25X10B. The memory can also be programmed over the UART by using the flash programmer software provided by NXP. This is available as part of the Software Developer kit and libraries available from www.nxp.com/jennic. To enter this programming mode, SPIMISO (pin 7) should be held low whilst the chip is reset. Once programming has finished, the chip should be reset, when it will execute the new code downloaded. For normal operation of the module and programming over the UART, SPISSZ should be connected to SPISSM.
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  9 5. Electrical Characteristics In most cases, the Electrical Characteristics are the same for both module and chip.  They are described in detail in the chip datasheet.  Where there are differences, they are detailed below. 5.1. Maximum Ratings Exceeding these conditions will result in damage to the device. Parameter Min Max Device supply voltage VDD -0.3V 3.6V Voltage on analogue pins ADC1-2 -0.3V VDD + 0.3V Voltage on 5v tolerant digital pins DIO0-DIO8 & DIO11-17, RESETN -0.3V Lower of (VDD + 2V) and 5.5V Voltage on 3v tolerant digital pins DIO9, DIO10, SPISSM, SPISWP, SPICLK, SPIMOSI, SPIMISO, SPISSZ -0.3V VDD + 0.3V Storage temperature -40ºC 150ºC 5.2. Operating Conditions Supply Min Max VDD  2.3V 3.6V Ambient temperature range -40ºC 125ºC
 10   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 Appendix A Additional Information   A.1 Outline Drawing 32.2mm18mm2.76mm2.54mm2.54mm1.27mm Thickness: 3.5mm   Figure 2 JN5142-x01-M00 Outline Drawing
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  11    30mm18mm2.76mm2.54mm2.54mm6.58mm9.76mm1.27mm Thickness: 3.5mm  Figure 3 JN5142-x01-M03 Outline Drawing
 12   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 A.2 Module PCB Footprint All dimensions are in mm.    Note: All modules have the same footprint. Figure 4 Module PCB footprint  RF note for –M00 modules with integral antenna: No components, ground plane or tracks on any layer of the mother board should be placed within 20mm of the 3 free sides of the antenna. Tracks etc may be placed adjacent to the can, but should not extend past the can towards the antenna end of the module for 20mm from the antenna.
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  13 A.3 Manufacturing  A.3.1 Reflow Profile For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates.    Figure 5: Recommended solder reflow profile   A.3.2 Soldering Paste and Cleaning NXP would not recommend use of a solder paste that requires the module and pcb assembly to be cleaned (rinsed in water) for the following reasons: Solder flux residues and water can be trapped by the pcb, can or components and result in short circuits. The module label could be damaged or removed. NXP recommends use of a 'no clean' solder paste for all its module products.       Temperature 25~160 ºC 160~190 ºC > 220º C 230~Pk. Pk. Temp (235ºC) Target Time (s)  90~130 30~60 20~50 10~15 150~270
 14   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 A.4 Ordering Information  Ordering Code Format:              Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or Prototypes. Devices of this status have an Rx suffix after the module type to identify qualification status during these product phases - for example, JN5142-X01-M00R1T.  Part Number Ordering Code Description JN5142-x01-M00T JN5142-x01-M/00T JN5142 module, variant as detailed above JN5142-x01-M03T JN5142-x01-M/03T                                    Shipping T  Tape Mounted 500-piece reel    JN5142 - x01 – M / Y1Y2 Y3  Module Type 00  Standard Power, Integral antenna 03         Standard Power, uFl connector Label line 1: IC ID Number Label line 2: FCC ID Number Label line 3: Part Number Label line 4: Barcode Label Label line 5: YYWWTNNNNN (see below)  Identifier Description Format  YY Year 06 (example) WW Week 45 (example) T Module type  NNNNN Serial Number      YYWWTNNNNN     IC: 7438A   CYO5142M0  FCC ID: TYOJN5142M0 M0      JN51XX - XXX - XXX NXP     Part Name   YYWWTNNNNN FCC ID: TYOJN5139M0 Figure 6: Example module labelling for FCC approved modules Figure 7: Example module labelling for FCC approved modules
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  15 A.5 Tape and Reel Information: A.5.1 Tape Orientation and dimensions All dimensions are in mm Module type: A B W F E P0 P1 P2 T Cover Tape width (W) JN5142-x01-M00 18.4 32.6 44 20.2 1.75 4.0 2.0 24.0 3.4 37.5 JN5142-x01-M03 18.4 30.4 44 20.2 1.75 4.0 2.0 24.0 3.4 37.5 Tolerance ±0.1 ±0.1 ±0.3 ±0.1 +0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 A.5.2 Cover tape details  Thickness (T) 0.061mm Surface resistivity (component side) 104 to 107 Ohms/sq Surface resistivity (component side) Non-conductive Backing type: Polyester Adhesive type:  PSA Sealing: Room ambient
 16   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 A.5.3 Leader and Trailer  A.5.4 Reel Dimensions: All dimensions are in mm.    Module type: A  B C N  W (min)  JN5142-x01-M00/03 330 ±1.0 2.2±0.5 13 ±0.2 100 +0.1 44.5 ±0.3    A.6 Related Documents [1]  IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2]  JN-DS-JN5142 Wireless Microcontroller Datasheet   300 MM300 MM
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  17 A.7 Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help.  This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.  FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.  WARNING!  FCC Radiation Exposure Statement: This portable equipment with its antenna complies with FCC‟s RF radiation exposure limits set forth for an uncontrolled environment. To maintain compliance follow the instructions below;  1. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipment.  This transmitter module is authorized to be used in other devices only by OEM integrators under the following condition:  The transmitter module must not be co-located with any other antenna or transmitter.   As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
 18   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 A.7.1 Antennas approved by FCC for use with JN5142 modules  Brand Model Number Description Gain (dBi) Connector type 1 Antenna Factor ANT-2.4-CW-RCT-RP Vertical - knuckle antenna 2.2 RP-SMA 2 Antennova 2010B6090-01 Vertical - knuckle antenna 2.2 RP-SMA 3 Hyperlink Technology HG2402RD-RSF Vertical - knuckle antenna 2.2 RP-SMA 4 Aveslink Technology, Inc E-0005-AC Vertical- flying lead 2 RP-SMA 5 Aveslink Technology, Inc E-2411-GC Vertical - swivel 2 RP-SMA 6 Aveslink Technology, Inc E-2410-CA Vertical - bulkhead- flying lead 2 uFL 7 Aveslink Technology, Inc E-2410-GC Vertical - swivel 2 RP-SMA 8 Aveslink Technology, Inc E-2820-CA Vertical - bulkhead- flying lead 2 uFL 9 Aveslink Technology, Inc E-2820-GC Vertical - swivel 2 RP-SMA 10 Aveslink Technology, Inc E-0903-AX Embedded - nickel silver strip 2 None 11 Aveslink Technology, Inc E-0904-AX Embedded - nickel silver strip 2 None 12 Embedded Antenna Design FBKR35068-RS-KR Vertical - knuckle antenna 2 RP-SMA 13 Nearson S131CL-L-PX-2450S Vertical - knuckle-flying lead 2 uFL 14 Laird Technologies WRR2400-IP04 Vertical - knuckle-flying lead 1.5 uFL 15 Laird Technologies WRR2400-RPSMA Vertical - knuckle-flying lead 1.3 RP-SMA 16 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 uFL 17 Laird Technologies WCR2400-SMRP Vertical - knuckle antenna 1 RP-SMA  These antennae or versions with alternative connectors may be used to meet European regulations. This device has been designed to operate with the antennas listed above, and having a maximum gain of 2.2 dBi. Antennas not included in this list or having a gain greater than 2.2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. A.7.2 FCC End Product Labelling The final „end product‟ should be labelled in a visible area with the following:    “Contains TX FCC ID: TYOJN5142M0 or TYOJN5142M3” to reflect the version of the module being used inside the product. A.8 Industry Canada Statement To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.  These modules have been designed to operate with antennas having a maximum gain of 2.2 dBi. Antennas having a gain greater than 2.2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc). A.8.1 Industry Canada End Product Labelling For Industry Canada purposes the following should be used. “Contains Industry Canada ID IC: 7438A-CYO5142M0 or IC: 7438A-CYO5142M3” to reflect the version of the module being used inside the product.
 © NXP Laboratories UK 2012   JN-DS-JN5142-x01-Myy 1v0  19   A.9 European R & TTE Directive 1999/5/EC Statement All modules listed in this datasheet are compliant with ETSI EN 300 328V1.7.1 (2006/05) and are subject to a Notified Body Opinion. The modules are approved for use with the antennas listed in the following table.   Brand Model Number Description Gain (dBi) Connector type 1 Antenna Factor ANT-2.4-CW-RCT-RP Vertical - knuckle antenna 2.2 RP-SMA 2 Antennova 2010B6090-01 Vertical - knuckle antenna 2.2 RP-SMA 3 Hyperlink Technology HG2402RD-RSF Vertical - knuckle antenna 2.2 RP-SMA 4 Aveslink Technology, Inc E-0005-AC Vertical- flying lead 2 RP-SMA 5 Aveslink Technology, Inc E-2411-GC Vertical - swivel 2 RP-SMA 6 Aveslink Technology, Inc E-2410-CA Vertical - bulkhead- flying lead 2 uFL 7 Aveslink Technology, Inc E-2410-GC Vertical - swivel 2 RP-SMA 8 Aveslink Technology, Inc E-2820-CA Vertical - bulkhead- flying lead 2 uFL 9 Aveslink Technology, Inc E-2820-GC Vertical - swivel 2 RP-SMA 10 Aveslink Technology, Inc E-0903-AX Embedded - nickel silver strip 2 None 11 Aveslink Technology, Inc E-0904-AX Embedded - nickel silver strip 2 None 12 Embedded Antenna Design FBKR35068-RS-KR Vertical - knuckle antenna 2 RP-SMA 13 Nearson S131CL-L-PX-2450S Vertical - knuckle-flying lead 2 uFL 14 Laird Technologies WRR2400-IP04 Vertical - knuckle-flying lead 1.5 uFL 15 Laird Technologies WRR2400-RPSMA Vertical - knuckle-flying lead 1.3 RP-SMA 16 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 uFL 17 Laird Technologies WCR2400-SMRP Vertical - knuckle antenna 1 RP-SMA  A.10 RoHS Compliance JN5142-x01-Myy devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS). The JN5142-x01-M00 and M03 modules meet the requirements of Chinese RoHS requirements SJ/T11363-2006. Full data can be found at www.nxp.com/jennic. A.11 Status Information The status of this Data Sheet is Preliminary. NXP products progress according to the following format:  Advanced The Data Sheet shows the specification of a product in planning or in development. The functionality and electrical performance specifications are target values and may be used as a guide to the final specification. NXP reserves the right to make changes to the product specification at anytime without notice.
 20   JN-DS-JN5142-x01-Myy 1v0  © NXP Laboratories UK 2012 Preliminary The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified. The functionality of the product is final. The electrical performance specifications are target values and may be used as a guide to the final specification. Modules are identified with an Rx suffix, for example JN5142-x01-M00R2. NXP reserves the right to make changes to the product specification at anytime without notice.  Production This is the production Data Sheet for the product. All functional and electrical performance specifications, where included, including min and max values are derived from detailed product characterization. This Data Sheet supersedes all previous document versions. NXP reserves the right to make changes to the product specification at anytime.  A.12 Disclaimers The contents of this document are subject to change without notice.  NXP reserves the right to make changes, without notice, in the products, including circuits and/or software, described or contained therein.  Information contained in this document regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. NXP warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with NXP‟s standard warranty. Testing and other quality control techniques are used to the extent NXP deems necessary to support this warranty. Except where mandatory by government requirements, testing of all parameters of each product is not necessarily performed. NXP assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work infringement, unless otherwise specified. NXP products are not intended for use in life support systems, appliances or systems where malfunction of these products can reasonably be expected to result in personal injury, death or severe property or environmental damage.  NXP customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify NXP for any damages resulting from such use.  All products are sold subject to NXP's terms and conditions of sale supplied at the time of order acknowledgment. All trademarks are the property of their respective owners.  Version Control Version Notes 1.0 1st  Issue of Preliminary Datasheet  NXP Laboratories UK Ltd Furnival Street Sheffield S1 4QT United Kingdom  Tel: +44 (0)114 281 2655 Fax: +44 (0) 114 281 2951  For the contact details of your local NXP office or distributor, refer to the NXP web site:  www.nxp.com/jennic

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