NXP Laboratories UK JN5168M6 JN5168-001-MØ6 IEEE802.15.4 Wireless Module User Manual JN DS JN5168 001 Myy

NXP Laboratories UK Ltd JN5168-001-MØ6 IEEE802.15.4 Wireless Module JN DS JN5168 001 Myy

User guide

 Data Sheet: JN5168-001-Myy JenNet, ZigBee PRO and IEEE802.15.4 Module       JN-DS-JN5168-001-Myy  © NXP Laboratories UK 2012 Features: Module • 2.4GHz IEEE 802.15.4, JenNet-IP, ZigBee Light Link, ZigBee Smart Energy and RF4CE compatible  • JN5168-001-M00/03 up to 1km range (Ext antenna) M00: integral antenna 16x30mm M03: uFl connector 16x21mm o TX power +2.5dBm o Receiver sensitivity –95dBm o TX current 15mA  o RX current 17.5mA o 2.0-3.6V operation  • JN5168-001-M05   up to 2km range (Ext 2dBi Antenna) o 9.5 dBm TX Power o Receiver sensitivity -96dBm o uFl connector o TX current 35mA  o RX current 22mA o 16x30mm o 2.0-3.6V operation  • JN5168-001-M06   up to 6km range (Ext 2 dBi Antenna) o 22dBm TX Power o Receiver sensitivity -100dBm o uFl connector o TX current 175mA  o RX current 22mA o 16x30mm o 2.0-3.6V operation  Features: Microcontroller • 32-bit RISC CPU, up to 32MIPs with low power  • Data EEPROM with guaranteed 100k write operations • RF4CE, JenNet-IP, ZigBee Smart Energy stacks • JTAG debug interface •  4-input 10-bit ADC, 1 comparator • 5 x PWM (4 x timer, 1 x timer/counter) • 2 UARTs  • SPI Master & Slave port with 3 selects •  2-wire serial interface • Battery and Temperature Sensor • Watchdog timer and BOR • Up to 20 DIO  Industrial temp (-40°C to +85°C)  Lead-free and RoHS compliant     Overview   The JN5168-001-Myy family is a range of ultra low power, high performance surface mount modules targeted at IEEE 802.15.4, JenNet-IP, ZigBee Light Link, ZigBee Smart Energy and RF4CE networking applications, enabling users to realise products with minimum time to market and at the lowest cost.  They remove the need for expensive and lengthy development of custom RF board designs and test suites. The modules use NXP’s JN5168 wireless microcontroller to provide a comprehensive solution with large memory, high CPU and radio performance and all RF components included.  All that is required to develop and manufacture wireless control or sensing products is to connect a power supply and peripherals such as switches, actuators and sensors, considerably simplifying product development. Four module variants are available: JN5168-001-M00 with an integrated antenna, JN5168-001-M03 with an antenna connector and the JN5168-001-M05 and M06 with an antenna connector, power amplifier and LNA for extended range. The JN5168-001-M05 output power has been optimised for use in Europe and Asia.  Module Block Diagram    Benefits • Microminiature module solutions • Ready to use in products • Minimises product development time • No RF test required for systems • Compliant with o FCC 47CFR Part 15C  o IC Canada RSS 210 Issue 8 - Annex 8,  o ETSI EN 300-328 V1.7.1 o EN 301-489-17 V2.1.1 o EN60950-1-2006 +A1, A11, A12  Applications • Robust and secure low power wireless applications • ZigBee and JenNet-IP networks • Home and commercial building automation • Utilities metering (e.g. AMR) • Location Aware services (e.g. Asset Tracking) • Toys and gaming peripherals • Industrial systems • Telemetry • Remote Control 4xPWM + Timers2x UART4 Chan 10-bit ADCBattery and Temp Sensor2-Wire Serial (Master/Slave)SPI Master & SlaveRAM8/32K128-bit AESEncryptionAccelerator2.4GHz RadioIncluding DiversityFlash64/160/256K32 -Bit RISC CPUPowerManagementXTALO-QPSKModemIEEE802.15.4MAC AcceleratorPower MatchinguFl ConnectorMatchingIntegrated AntennaMatchinguFl Connector PA / LNAExternal AntennaM00 OptionM03 OptionM05/M06 Option20 DIOSleep Counter4kBEEPROMWatchdog TimerVoltage Brownout
 ii   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 Contents 1.  Introduction  3 1.1. Variants  3 1.2. Regulatory Approvals  3 2.  Specifications  4 2.1. JN5168 Single Chip Wireless Microcontroller  5 3.  Pin Configurations  6 3.1. Pin Assignment  7 3.2. Pin Descriptions  8 3.2.1 Power Supplies  8 4.  Electrical Characteristics  9 4.1. Maximum Ratings  9 4.2. Operating Conditions  9 Appendix A Additional Information  10 A.1  Outline Drawing 10 A.2  Module PCB Footprint 13 A.3   Optimal PCB placement of the JN5168-001-M00 Module 14 A.4  JN5168-001-M00 Antenna Radiation Pattern 15 A.5  Manufacturing 18 A.5.1  Reflow Profile 18 A.5.2 Soldering Paste and Cleaning 19 A.6  Ordering Information 19 A.7 Related Documents 20 A.8  Federal Communication Commission Interference Statement 20 A.8.1  Antennas approved by FCC for use with JN5168 modules 21 A.8.2  High Power Module usage limitation 21 A.8.3 FCC End Product Labelling 21 A.9  Industry Canada Statement 22 A.9.1   Industry Canada End Product Labelling 22 A.10  European R & TTE Directive 1999/5/EC Statement 22 A.11  RoHS Compliance 23 A.12  Status Information 23 A.13  Disclaimers 23  Version Control 24
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0  3 1. Introduction The JN5168-001-Myy module family provides designers with a ready-made component that provides a fully integrated solution for applications, using the IEEE802.15.4 standard in the 2.4-2.5GHz ISM frequency band [1], including JenNet-IP and ZigBee Smart Energy, and can be quickly and easily included in product designs.  The modules integrate all of the RF components required, removing the need to perform expensive RF design and test.  Products can be designed by simply connecting sensors and switches to the module IO pins.  The modules use NXP’s single chip IEEE802.15.4 Wireless Microcontroller, allowing designers to make use of the extensive chip development support material.  Hence, this range of modules allows designers to bring wireless applications to market in the minimum time with significantly reduced development effort and cost. Four  variants are available: JN5168-001-M00,  JN5168-001-M03,  JN5168-001-M05 and JN5168-001-M06.  All modules have FCC and Industry Canada modular approvals. All modules other than the JN5168-001-M06 are also CE compliant and subject to a Notified Body Opinion. The variants available are described below. 1.1. Variants 1.2. Regulatory Approvals The JN5168-001-M00, M03 and M05 have been tested against the requirements of the following European standards.  • Radio EN 300 328 v1.7.1.   • EMC, EN 301 489-17 v2.1.1  • Basic Safety Assessment (BSA) EN 60950-1:2006  A Notified Body statement of opinion for this standard is available on request.  The High Power module with M06 suffix is not approved for use in Europe, instead the JN5168-001-M05 module may be used with an antenna with up to 2.2dBi; 10mW/MHz power spectral density e.i.r.p is the maximum permitted in Europe.  Additionally, all module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC part 15 regulations and in accordance to FCC Public notice DA00-1407. Appendix A.8 contains details on the conditions applying to this modular approval. The modules are approved for use with a range of different antennas; further details of which can be found in section Appendix A.8.1. The modular approvals notice and test reports are available on request. All modules are compliant with Industry Canada RSS210 (Issue 8, Annex 8) and have Industry Canada modular approval. The JN5168-001-M06 module is subject to user proximity restrictions under FCC and Industry Canada regulations; more specific information is available in A.8.2. Variant Description FCCID Industry Canada ID JN5168-001-M00 Standard Power, integrated antenna TYOJN5168M0 7438A-CYO5168M0 JN5168-001-M03 Standard Power, uFL connector   TYOJN5168M3 7438A-CYO5168M3 JN5168-001-M05 Medium Power, uFL connector TYOJN5168M5 7438A-CYO5168M5 JN5168-001-M06 High Power, uFL connector TYOJN5168M6  7438A-CYO5168M6
 4   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 2. Specifications Most specification parameters for the modules are specified in the chip datasheet - JN-DS-JN5168 Wireless Microcontroller Datasheet [2].  Where there are differences, the parameters are defined here. VDD=3.0V @ +25°C Typical DC Characteristics Notes  JN5168-001-M00/03 JN5168-001- M06 JN5168-001-M05  Deep sleep current 100nA 100nA 100nA  Sleep current 0.70uA 0.70uA 0.70uA With active sleep timer Radio transmit current 15mA 175mA 35mA CPU in doze, radio transmitting Radio receive current 17.5mA 22mA 22mA CPU in doze, radio receiving Centre frequency accuracy +/-25ppm +/-25ppm +/-25ppm Additional +/-15ppm allowance for temperature and ageing Typical RF Characteristics Notes Receive sensitivity  -95dBm  -100dBm  -96dBm Nominal for 1% PER, as per 802.15.4 section 6.5.3.3 (Note 1) Transmit power 2.5dBm 22dBm 9.5 dBm Nominal Maximum input signal 10dBm  5dBm  10dBm  For 1% PER, measured as sensitivity  RSSI range -95 to -10dBm -105 to -20dBm -95 to -10dBm  RF Port impedance – uFL connector 50 ohm 50 ohm 50 ohm 2.4 - 2.5GHz Rx Spurious Emissions -61dBm  -69dBm  -69dBm Measured conducted into 50ohms Tx Spurious Emissions -40dBm  -49dBm  -45dBm Measured conducted into 50ohms VSWR (max) 2:1 2:1 2:1 2.4 - 2.5GHz Peripherals Notes Master SPI port 3 selects 3 selects 3 selects 250kHz - 16MHz Slave SPI port    250kHz - 8MHz Two UARTs    16550 compatible Two-wire serial I/F (compatible with SMbus & I2C)    Up to 400kHz 5 x PWM (4 x timer, 1 x timer/counter)    16MHz clock Two programmable Sleep Timers     32kHz clock Digital IO lines (multiplexed with UARTs, timers and 20 18  18  DIO2 & DIO3 not available on JN5168-001-M05 and JN5168-001-M06 modules
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0  5 SPI selects) Four channel Analogue-to-Digital converter    10-bit, up to 100ks/s Programmable analogue comparators    Ultra low power mode for sleep Internal temperature sensor and battery monitor     The performance of all peripherals is defined in the JN-DS-JN5168 Wireless Microcontroller Datasheet [2].  Note 1:  Sensitivity is defined for conducted measurements on connectorised modules. Modules with an integrated antenna have approximately 1.5 dB less e.i.r.p and reciprocal receive sensitivity.  NXP supplies all the development tools and networking stacks needed to enable end-product development to occur quickly and efficiently. These are all freely available from www.nxp.com/jennic.  A range of evaluation/developer kits is also available, allowing products to be quickly bread boarded.  Efficient development of software applications is enabled by the provision of a complete, unlimited, software developer kit.  Together with the available libraries for the IEEE802.15.4 MAC and the JenNet-IP and ZigBee PRO network stacks, this package provides everything required to develop application code and to trial it with hardware representative of the final module. The modules can be user programmed both in development and in production using software supplied by NXP.  Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This information is available on the NXP support website, together with many example applications, user guides, reference manuals and application notes.  2.1. JN5168 Single Chip Wireless Microcontroller The JN5168-001-Myy series is constructed around the JN5168-001 single chip wireless microcontroller, which includes the radio system, a 32-bit RISC CPU, Flash, RAM & EEPROM memory and a range of analogue and digital peripherals. The chip is described fully in JN-DS-JN5168 Wireless Microcontroller Datasheet [2].
 6   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 3. Pin Configurations 10ADC1SPICLKSPIMISOSPIMISISPISSZDIO0DIO1DIO2DIO3DIO4DIO5DIO6DIO7DIO8DIO9DIO10VDDGNDADC2DIO17DIO16DIO15DIO14DIO13RESETNDIO12DIO1112345678911 12 13 14 15 16 17 18272625242322212019 Figure 1: Pin Configuration (top view) Note that the same basic pin configuration applies for all module designs.  However, DIO3 (pin 9) and DIO2 (pin 8) are not available on the JN5168-001-M05 and JN5168-001-M06.
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0  7 3.1. Pin Assignment  Pin No Pin Functions Signal Type Description Primary Alternate Functions 1 ADC1     3.3V  Analogue to Digital Input 2  SPICLK PWM2        CMOS SPI Master Clock Output or PWM2 Output  3 SPIMISO     CMOS SPI Master In Slave Out Input 4  SPIMOSI PWM3        CMOS SPI Master In Slave Out Input or PWM3 Output  5 SPISEL0     CMSO SPI Select From Module – SS0 Output 6 DIO0 SPISEL1 ADC3   CMOS DIO0, SPI Master Select Output 1 or ADC input 3  7 DIO1 SPISEL2 ADC4 PC0  CMOS DIO1, SPI Master Select Output 2, ADC input 4 or Pulse Counter 0 Input  8 DIO2*  RFRX TIM0CK_GT  CMOS DIO2, Radio Receive Control Output or Timer0 Clock/Gate Input  9 DIO3*  RFTX TIM0CAP  CMOS DIO3, Radio Transmit Control Output or Timer0 Capture Input  10 DIO4 CTS0 JTAG_TCK TIM0OUT PC0 CMOS DIO4, UART 0 Clear To Send Input, JTAG CLK Input, Timer0 PWM Output, or Pulse Counter 0 input  11 DIO5 RTS0 JTAG_TMS PWM1 PC1 CMOS DIO5, UART 0 Request To Send Output, JTAG Mode Select Input, PWM1 Output or Pulse Counter 1 Input  12 DIO6 TXD0 JTAG_TDO PWM2  CMOS DIO6, UART 0 Transmit Data Output, JTAG Data Output or PWM2 Output  13 DIO7 RXD0 JTAG_TDI PWM3    CMOS DIO7, UART 0 Receive Data Input, JTAG Data Input or PWM 3 Output  14 DIO8 TIM0CK_GT PC1 PWM4  CMOS DIO8, Timer0 Clock/Gate Input, Pulse Counter1 Input or PWM 4 Output  15 DIO9 TIM0CAP 32KXTALIN RXD1 32KIN CMOS DIO9, Timer0 Capture Input, 32K External Crystal Input, UART 1 Receive Data Input or 32K external clock Input  16 DIO10 TIM0OUT 32KXTALOUT   CMOS DIO10, Timer0 PWM Output or 32K External Crystal Output 17 VDD     3.3V Supply Voltage 18 GND     0V Digital Ground 19 DIO11 PWM1 TXD1   CMOS DIO11, PWM1 Output or UART 1 Transmit Data Output  20 DIO12 PWM2 CTS0 JTAG_TCK ADO or  SPISMOSI   CMOS DIO12, PWM2 Output, UART 0 Clear To Send Input, JTAG CLK Input, Antenna Diversity Odd Output or SPI Slave Master Out Slave In Input  21 DIO13 PWM3 RTS0 JTAG_TMS ADE or  SPISMISO   CMOS DIO13, PWM3 Output, UART 0 Request To Send Output, JTAG Mode Select Input, Antenna Diversity Even output or SPI Slave Master In Slave Out Output  22 RESETN     CMOS Reset input 23 DIO14 SIF_CLK TXD0 TXD1 JTAG_TDO SPISEL1 or CMOS DIO14, Serial Interface Clock,
 8   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 SPISSEL   UART 0 Transmit Data Output, UART 1 Transmit Data Output, JTAG Data Output, SPI Master Select Output 1 or SPI Slave Select Input  24 DIO15 SIF_D RXD0 RXD1 JTAG_TDI SPISEL2 CMOS DIO15, Serial Interface Data or Intelligent Peripheral Data Out 25 DIO16 COMP1P SIF_CLK SPISMOSI  CMOS DIO16, Comparator Positive Input, Serial Interface clock or SPI Slave Master Out Slave In Input  26 DIO17 COMP1M PWM4 I2C DATA SPISIMO CMOS DIO17, Comparator Negative Input, Serial Interface Data or SPI Slave Master In Slave Out Output  27 ADC2          3.3V Analogue to Digital  Input * These two pins are not connected for JN5168-001-M05 & JN5168-001-M06 modules. 3.2. Pin Descriptions All pins behave as described in the JN-DS-JN5168 Wireless Microcontroller Datasheet [2], with the exception of the following: 3.2.1 Power Supplies A single power supply pin, VDD is provided.
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0  9 4. Electrical Characteristics In most cases, the Electrical Characteristics are the same for both module and chip.  They are described in detail in the chip datasheet.  Where there are differences, they are detailed below. 4.1. Maximum Ratings Exceeding these conditions will result in damage to the device. Parameter Min Max Device supply voltage VDD -0.3V 3.6V All Pins -0.3V VDD + 0.3V Storage temperature -40ºC 150ºC 4.2. Operating Conditions Supply Min Max VDD  2.0V  3.6V Ambient temperature range  -40ºC  85ºC
 10   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 Appendix A Additional Information   A.1 Outline Drawing 30.0mm16mm2.76mm2.54mm2.54mm1.27mm Thickness: 3.5mm   Figure 2 JN5168-001-M00 Outline Drawing
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0 11  21mm16mm3.30mm2.54mm2.54mm2.56mm9.76mm1.27mm Thickness: 3.5mm  Figure 3 JN5168-001-M03 Outline Drawing
 12   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 30mm16mm.3.30mm2.54mm1.27mm2.54mm2.90mm8.0mmThickness: 3.5mm Figure 4 JN5168-001-M05 and JN5168-001-M06 Outline Drawing
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0 13 A.2 Module PCB Footprint All dimensions are in mm. 2.492.232.231.2714.8811.5Ø1    Note: All modules have the same footprint   Figure 5 Module PCB footprint
 14   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 A.3 Optimal PCB placement of the JN5168-001-M00 Module The JN5168-001-M00 module features an optimised, low cost, integrated, inverted F, printed PCB antenna. The antenna has a vertically polarised near omnidirectional radiation pattern and up to 1.6 dBi of peak gain. The PCB design has been elongated in order to increase the ground plane area which increases the antenna efficiency. This allows stand alone operation without any additional ground plane however care must be taken when mounting this module onto another PCB. The area around the antenna must be kept clear of conductors or other metal objects for an absolute minimum of 20 mm. This is true for all layers of the PCB and not just the top layer. Any conductive objects close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and high directivity in some directions.  The diagrams below show various possible scenarios. The top 3 scenarios are correct; groundplane may be placed beneath JN5168-001-M00 module as long as it does not protrude beyond the edge of the top layer ground plane on the module PCB.  The bottom 3 scenarios are incorrect; the left hand side example because there is groundplane underneath the antenna, the middle example because there is insufficient clearance around the antenna (it is best to have no conductors anywhere near the antenna), finally the right hand example has a battery’s metal casing in the recommended keep out area.      Figure 6 PCB placement of the JN5168-001-M00 Module
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0 15 A.4 JN5168-001-M00 Antenna Radiation Pattern Figure 7, 8 & 9 are simulated 3D radiation plots of the JN5168-001-M00. They are provided here to help the user orientate the module in end equipment in an optimal way. These visualisations are an accurate representation of the antenna radiation pattern in the 3D space.   The 2D XZ plots for each channel are shown in Figure 10. These are actual measurements in an anechoic chamber with the JN5168-001-M00 mounted on a DR1174 carrier board from the JN516x-EK001 Evaluation kit. The device under test and the antenna height was 1m and the values are in dBuV/m at a distance of 3m.   Figure 11 is a plot of the peak field strengths for a JN5168-001-M00, JN5148-001-M00 and JN5168-001-M03. The M03 is used with a λ/2 vertical antenna. Figure 11 shows that the new integrated antenna is 1.5-3dB better than the JN5148-001-M00 and is within 1.5 dB of a JN5168-001-M03 λ/2 vertical.    Figure 7: 3D radiation plot JN5168-001-M00 XY Orientation (simulation)
 16   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012  Figure 8: 3D radiation plot JN5168-001-M00 XZ Orientation (simulation)  Figure 9: 3D radiation plot JN5168-001-M00 YZ Orientation (simulation)
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0 17  dBuV 104 94 84 74 64 54 44 34 24 14 4 14 24 34 44 54 64 74 84 94 104JN5168-001-M00  Radiation Plots @ 3 meters  (XZ Orientation)CH11 CH18 CH26Mkr  Trace  X-Axis  Value11 CH11  40.0 deg  101.04 dBuV22 CH18  40.0 deg  100.67 dBuV33 CH26  40.0 deg  101.26 dBuVFigure 10: Actual radiation plot of JN5168-001-M00 Mounted on a carrier PCB – XZ orientation
 18   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012   Figure 11: Peak Field Strengths for various modules optimised for height and azimuth A.5 Manufacturing  A.5.1 Reflow Profile For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste manufacturer’s guidelines on peak flow temperature, soak times, time above liquid and ramp rates.    Figure 12: Recommended solder reflow profile 98.0 98.5 99.0 99.5 100.0 100.5 101.0 101.5 102.0 102.5 103.0 103.5 104.0 11 18 26 dBuV/m @ 3m Channel Module Peak Field Strengths JN5168-001-M03 with vertical JN5168-001-M00 JN5148-001-M00 Temperature 25~160 ºC 160~190 ºC > 220º C 230~Pk. Pk. Temp (235ºC) Target Time (s)  90~130 30~60 20~50 10~15 150~270
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0 19 A.5.2 Soldering Paste and Cleaning NXP does not recommend use of a solder paste that requires the module and PCB assembly to be cleaned (rinsed in water) for the following reasons: Solder flux residues and water can be trapped by the PCB, can or components and result in short circuits. The module label could be damaged or removed. NXP recommends use of a 'no clean' solder paste for all its module products. A.6 Ordering Information Ordering Code Format:          Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or Prototypes.   Part Number Description JN5168-001-M00 Shipped in tape mounted 500 piece reel JN5168-001-M03 JN5168-001-M05 JN5168-001-M06    Line Content Format Options Sample 1 NXP Logo B&W outline logo   JN5168-001-M00ZSDYWW    NNNNNFCC ID:TYOJN5168M0IC:7438A-CYO5168M0 2 Part ID JN5168-001-M0x  x is module type, 0, 3, 5 or 6  3   Z  SSMC  S APK  D RoHs Compliant  Y Year  WW Week 3 Serial No. NNNNN Serial number from test 5 FCC ID FCCID:TYOJN5168Mx x is module type 0,3,5 or 6 6 IC ID IC:7438A-CYO5168Mx x is module type 0,3,5 or 6    JN5168 - 001 – MYY Module Type (YY) 00 Standard Power, Integral antenna 03          Standard Power, uFl connector 05   Medium Power, uFL connector 06          High Power, uFl connector  Figure 13: Example module labelling
 20   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 A.7 Related Documents [1]  IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2]  JN-DS-JN5168 Wireless Microcontroller Datasheet A.8 Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help.  This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.  FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.  WARNING!  FCC Radiation Exposure Statement: This portable equipment with its antenna complies with FCC’s RF radiation exposure limits set forth for an uncontrolled environment. To maintain compliance follow the instructions below;  1. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipment.  This transmitter module is authorized to be used in other devices only by OEM integrators under the following condition:  The transmitter module must not be co-located with any other antenna or transmitter.   As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0 21   A.8.1 Antennas approved by FCC for use with JN5168 modules  Brand  Model Number Description Gain (dBi) Connector type 1  Antenna Factor ANT-2.4-CW-RCT-RP  Vertical - knuckle antenna 2.2 RP-SMA 2  Antennova 2010B6090-01  Vertical - knuckle antenna 2.2 RP-SMA 3 Hyperlink Technology HG2402RD-RSF Vertical - knuckle antenna 2.2 RP-SMA 4 Aveslink Technology, Inc E-0005-AC Vertical- flying lead 2 RP-SMA 5 Aveslink Technology, Inc E-2411-GC Vertical - swivel 2 RP-SMA 6 Aveslink Technology, Inc E-2410-CA Vertical - bulkhead- flying lead 2 uFL 7  Aveslink Technology, Inc  E-2410-GC  Vertical - swivel  2  RP-SMA 8  Aveslink Technology, Inc  E-2820-CA  Vertical - bulkhead- flying lead  2  uFL 9  Aveslink Technology, Inc  E-2820-GC  Vertical - swivel  2  RP-SMA 10 Embedded Antenna Design FBKR35068-RS-KR Vertical - knuckle antenna 2 RP-SMA 11 Nearson S131CL-L-PX-2450S Vertical - knuckle-flying lead 2 uFL 12 Laird Technologies WRR2400-IP04 Vertical - knuckle-flying lead 1.5 uFL 13 Laird Technologies WRR2400-RPSMA Vertical - knuckle-flying lead 1.3 RP-SMA 14 Aveslink Technology, Inc  E-6170-DA  Vertical - right angle  1  uFL 15 Laird Technologies WCR2400-SMRP  Vertical - knuckle antenna  1  RP-SMA This device has been designed to operate with the antennas listed above, and having a maximum gain of 2.2 dBi. Alternative vertical antennas may be used provided that the gain does not exceed 2.2 dBi. Antennas having a gain greater than 2.2 dBi are strictly prohibited for use with this device.  The required antenna impedance is 50 ohms. A.8.2 High Power Module usage limitation The high power module variants are classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used at a distance of < 20 cm (8”) from any people.   IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.  The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual for the end product must include the following information in a prominent location; “To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.” A.8.3 FCC End Product Labelling The final ‘end product’ should be labelled in a visible area with the following:    “Contains TX FCC ID: TYOJN5168M0, TYOJN5168M3, TYOJN5168M5 or TYOJN5168M6” to reflect the version of the module being used inside the product.
 22   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 A.9 Industry Canada Statement This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject  to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropic radiated power (e.i.r.p.) is not more than that permitted for successful communication.  These modules have been designed to operate with antennas having a maximum gain of 2.2 dBi. Antennas having a gain greater than 2.2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc). A.9.1 Industry Canada End Product Labelling For Industry Canada purposes the following should be used. “Contains Industry Canada ID IC: 7438A-CYO5168M0, IC: 7438A-CYO5168M3, IC: 7438A-CYO5168M5 or IC: 7438A-CYO5168M6” to reflect the version of the module being used inside the product. A.10 European R & TTE Directive 1999/5/EC Statement All modules listed in this datasheet with the exception of the JN5168-001-M06 are compliant with ETSI EN 300 328 V1.7.1 (2006-10), EMC, EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN 60950-1:2006 (2006-06) and are subject to a Notified Body Opinion. The modules are approved for use with the antennas listed in the following table. The JN5168-001-M06 module is not approved for use in Europe, instead use the JN5168-001-M05 which produces the maximum permitted power.  Alternative vertical antennas may be used provided that the gain does not exceed 2.2 dBi.  Brand  Model Number Description Gain (dBi) Connector type 1 Antenna Factor ANT-2.4-CW-RCT-SMA Vertical - knuckle antenna 2.2 SMA 2 Antennova B6090 Vertical - knuckle antenna 2.2 RP-SMA 3 Hyperlink Technology HG2402RD-RSF Vertical - knuckle antenna 2.2 RP-SMA 4 Aveslink Technology, Inc E-0005-AC Vertical- flying lead 2 RP-SMA 5  Aveslink Technology, Inc  E-2411-GC  Vertical - swivel  2  RP-SMA 6  Aveslink Technology, Inc  E-2410-CA  Vertical - bulkhead- flying lead  2  uFL 7 Aveslink Technology, Inc E-2410-GC Vertical - swivel 2 RP-SMA 8 Aveslink Technology, Inc E-2820-CA Vertical - bulkhead- flying lead 2 uFL 9 Aveslink Technology, Inc E-2820-GC Vertical - swivel 2 RP-SMA 10 Embedded Antenna Design FBKR35068-RS-KR Vertical - knuckle antenna 2 RP-SMA 11 Nearson S131CL-L-PX-2450S  Vertical - knuckle-flying lead  2  uFL 12 Laird Technologies WRR2400-IP04  Vertical - knuckle-flying lead 1.5 uFL 13 Laird Technologies WRR2400-RPSMA  Vertical - knuckle-flying lead 1.3 RP-SMA 14 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 uFL 15 Laird Technologies WCR2400-SMRP Vertical - knuckle antenna 1 RP-SMA
 © NXP Laboratories UK 2012   JN-DS-JN5168-001-Myy 1v0 23 A.11 RoHS Compliance JN5168-001-Myy devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS). The JN5168-001-M00, M03, M05 and M06 modules meet the requirements of Chinese RoHS requirements SJ/T11363-2006. Full data can be found at www.nxp.com/jennic. A.12 Status Information The status of this Data Sheet is Preliminary. NXP products progress according to the following format:  Advanced The Data Sheet shows the specification of a product in planning or in development. The functionality and electrical performance specifications are target values and may be used as a guide to the final specification. NXP reserves the right to make changes to the product specification at anytime without notice.   Preliminary The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified. The functionality of the product is final. The electrical performance specifications are target values and may be used as a guide to the final specification. NXP reserves the right to make changes to the product specification at anytime without notice.  Production This is the production Data Sheet for the product. All functional and electrical performance specifications, where included, including min and max values are derived from detailed product characterization. This Data Sheet supersedes all previous document versions. NXP reserves the right to make changes to the product specification at anytime.  A.13 Disclaimers The contents of this document are subject to change without notice.  NXP reserves the right to make changes, without notice, in the products, including circuits and/or software, described or contained therein.  Information contained in this document regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. NXP warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with NXP’s standard warranty. Testing and other quality control techniques are used to the extent NXP deems necessary to support this warranty. Except where mandatory by government requirements, testing of all parameters of each product is not necessarily performed. NXP assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work infringement, unless otherwise specified. NXP products are not intended for use in life support systems, appliances or systems where malfunction of these products can reasonably be expected to result in personal injury, death or severe property or environmental damage.  NXP customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify NXP for any damages resulting from such use.  All products are sold subject to NXP's terms and conditions of sale supplied at the time of order acknowledgment. All trademarks are the property of their respective owners.
 24   JN-DS-JN5168-001-Myy 1v0  © NXP Laboratories UK 2012 Version Control Version  Notes 1.0 Initial release                                NXP Laboratories UK Ltd Furnival Street Sheffield S1 4QT United Kingdom  Tel: +44 (0)114 281 2655 Fax: +44 (0) 114 281 2951   For the contact details of your local NXP office or distributor, refer to the NXP web site:  www.nxp.com/jennic

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