NXP Semiconductors JN5169M6V2 ZigBee Modular Transmitter User Manual UM11016

NXP Semiconductors ZigBee Modular Transmitter UM11016

User Manual.pdf

  UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modulesRev. 1.0 — 15 June 2016 User manualDocument informationInfo ContentKeywords JN5169, Zigbee, moduleAbstract JN5169-001-M0x-2 modules user manual
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  2 of 24Contact informationFor more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules Revision historyRev Date Description1.0 20160613 Initial version
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  3 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules1. General descriptionThe JN5169-001-M0x-2 (with x = 0, 3 or 6) module family provides designers with a ready-made component that provides a fully integrated solution for applications, using the IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee Smart Energy, Home Automation and ZigBee 3.0 and can be quickly and easily included in product designs. The modules integrate all of the RF components required, removing the need to perform expensive RF design and test. Products can be designed by simply connecting sensors and switches to the module IO pins. The module uses NXP’s single chip IEEE802.15.4 wireless microcontroller, allowing designers to make use of the extensive chip development support material. Hence, these modules allow designers to bring wireless applications to market in the minimum time with significantly reduced development effort and cost.3 variants are available: JN5169-001-M00-2, JN5169-001-M03-2 and JN5169-001-M06-2.The variants available are described in the Table 1.1.1  Variants and identifications information 1.2 Regulatory approvalsThe JN5169-001-M0x-2 has been tested against the requirements of the following European standards.•Radio EN 300 328 v 1.9.1•EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2•Basic Safety Assessment (BSA) EN 60950-1:2006A Notified Body statement of opinion for this standard is available on request.The High-power module with M06 suffix is not approved for use in Europe.All module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC part 15 regulations and in accordance to FCC public notice DA00-1407. The modular approvals notice and test reports are available on request.Additionally, all module types have also received ANATEL “Modular Approval”2.  Features and benefits2.1 Benefits•Microminiature module solutionsTable 1. Variants and identifications informationType number Description FCCID IC ID ANATEL IDJN5169-001-M00-2 Standard power, integrated printed antenna XXMJN5169M0V2 8764A-JN5169M0 <tbd>JN5169-001-M03-2 Standard power, FL connector XXMJN5169M3V2 8764A-JN5169M3 <tbd>JN5169-001-M06-2 High power, FL connector XXMJN5169M6V2 8764A-JN5169M6 <tbd>
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  4 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules•Ready to use in products•Minimises product development time•No RF test required for systems•Compliant with:–FCC 47CFR Part 15C–ETSI EN 300-328 V1.9.1–EN 301-489-17 V2.2.1–EN60950-1-2006–ANATEL•Temperature range: 40 C to +85 C•Lead-free and RoHS compliant2.2 Features: modules•2.4 GHz IEEE 802.15.4, ZigBee Smart Energy and Home Automation compatible•JN5169-001-M00-2–Dimensions: 16 mm 30 mm–Integrated printed antenna –TX power 8.5 dBm/10 dBm–Receiver sensitivity –96.5 dBm–TX current 27.2 mA at 10 dBm–TX current 23.6 mA at 8.5 dBm–RX current 17.8 mA at maximum input level 10 dBm–RX current 16.2 mA at maximum input level 0 dBm–2.0 V/3.6 V operation•JN5169-001-M03-2–Dimensions: 16 mm 21 mm–Fl connector–TX power 8.5 dBm/10 dBm–Receiver sensitivity –96.5 dBm–TX current 27.2 mA at 10 dBm–TX current 23.6 mA at 8.5 dBm–RX current 17.8 mA at maximum input level 10 dBm–RX current 16.2 mA at maximum input level 0 dBm–2.0 V/3.6 V operation•JN5169-001-M06-2–Dimensions: 16 mm 30 mm–Fl connector–TX power 21 dBm–Receiver sensitivity –100 dBm
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  5 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules–TX current 181 mA at 21 dBm–RX current 22.8 mA–2.0 V/3.6 V operation2.3 Features: microcontroller•32-bit RISC CPU; 1 MHz to 32 MHz clock speed•Variable instruction width for high coding efficiency•Multi-stage instruction pipeline•512 kB Flash•32 kB RAM•4 kB EEPROM•Data EEPROM with guaranteed 100 k write operations•ZigBee PRO stack with Home Automation and Smart Energy profiles•2-wire I2C-bus compatible serial interface; can operate as either master or slave•5PWM (4 timers, 1 timer/counter)•2 low-power sleep counters•2UARTs•SPI-bus Master and Slave port, 3 selects•Supply voltage monitor with 8 programmable thresholds•6-input 10-bit ADC, comparator•Battery and temperature sensors•Watchdog and Supply Voltage Monitor (SVM)•Up to 20 Digital IO (DIO) pins3. Applications•Robust and secure low-power wireless applications•ZigBee Smart Energy networks•ZigBee Home Automation networks•ZigBee 3.0 networks•Toys and gaming peripherals•Energy harvesting - for example, self-powered light switch4. OverviewThe JN5169-001-M0x-2 family is a range of ultra-low power, high performance surface mount modules targeted at IEEE 802.15.4, ZigBee Smart Energy, Home Automation and ZigBee 3.0 networking applications, enabling users to realize products with minimum time to market and at the lowest cost. It removes the need for expensive and lengthy development of custom RF board designs and test suites. The module uses NXP’s JN5169 wireless microcontroller to provide a comprehensive solution with large memory, high CPU and radio performance and all RF components included. All that is required to
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  6 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modulesdevelop and manufacture wireless control or sensing products is to connect a power supply and peripherals such as switches, actuators and sensors, considerably simplifying product development.3 module variants are available:•JN5169-001-M00-2 with an integrated printed antenna•JN5169-001-M03-2 with a FL antenna connector•JN5169-001-M06-2 with a FL antenna connector and also a power amplifier and LNA for extended range5. Marking5.1 JN5169-001-M00-2 and JN5169-001-M03-2  [1] With x = 0 or 3.The JN5169-001-M0x-2 (with x = 0 or 3) family modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force on 1st March 2007.Fig 1. JN5169-001-M00-2 and JN5169-001-M03-2 packages marking (top view)Table 2. Marking codeLine number Marking codeLine 1 NXP Logo: B&W outline logoLine 2 part ID: JN5169-001-M0x-2[1]Line 3 serial number: NNNNNLine 4 PMC code: ZbHYWWZ: SSMCb: SPILH: Halogen freeY: yearWW: weekLine 5 FCC ID: XXMJN5169MxV2[1]Line 6 IC: 8764A-JN5169Mx[1]JN5169-001-M0x-2(1)FCC ID:XXMJN5169MxV2(1)NNNNNZbHYWWIC: 8764A-JN5169Mx(1)
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  7 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules5.2 JN5169-001-M06-2 The JN5169-001-M06-2 module meets the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force on 1st March 2007.Fig 2. JN5169-001-M06-2 package marking (top view)Table 3. Marking codeLine number Marking codeLine 1 NXP Logo: B&W outline logoLine 2 part ID: JN5169-001-M06-2Line 3 serial number: NNNNNLine 4 PMC code: ZbHYWWZ: SSMCb: SPILH: Halogen freeY: yearWW: weekLine 5 FCC ID: XXMJN5169M6V2Line 6  IC: 8764A-JN5169M6JN5169-001-M06-2FCC ID:XXMJN5169M6V2NNNNNZbHYWWIC: 8764A-JN5169M6
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  8 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules6. Block diagram Fig 3. Block diagramaaa-022823MATCHING2.4 GHzRADIOINCLUDINGDIVERSITYPOWERMANAGEMENTM00-2 optionintegratedantennaexternalantennaexternalantennaMATCHINGµFLCONNECTORM03-2 optionMATCHINGPA/LNAXTALµFLCONNECTORM06-2 optionWATCHDOGTIMERRAM32 kB32-BITRISC CPU4kBEEPROMFLASH512 kBVOLTAGEBROWNOUTO-QPSKMODEM128-BIT AESENCRYPTIONACCELERATORIEEE802.15.4MACACCELERATORSPI-BUSMASTER AND SLAVE2-WIRE SERIAL(MASTER/SLAVE)4 X PWMPLUS TIMER2 X UART20 DIOPLUS 2 DOSLEEPCOUNTER6 CHAN10 BIT ADCBATTERY ANDTEMP SENSORSPOWER
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  9 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules7. Pinning information7.1 Pinning 7.2 Pin description The same basic pin configuration applies for all module designs. However, DIO2 (pin 8) and DIO3 (pin 9) are not available on the JN5169-001-M06-2.(1) Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI.(2) Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO.(3) Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL.(4) Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.Fig 4. Pin configuration101112131415161718DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0DIO5/RTS0/JTAG_TMS/PWM1/PC1DIO6/TXD0/JTAG_TDO/PWM2DIO7/RXD0/JTAG_TDI/PWM3DIO8/TIM0CK_GT/PC1/PWM4DIO9/TIM0CAP/32KXTALIN/RXD1/32KINDIO10/TIM0OUT/32KXTALOUTVDDGND123456789272625242322212019VREF/ADC2DIO17/SPISMISO/SIF_D/COMP1M/PWM4DIO16/SPISMISO/SIF_CLK/COMP1PDIO15(4)DIO14(3)RESET_NDIO13(2)DIO12(1)DIO11/PWM1/TXD1ADC1DO0/SPICLK/PWM2DO1/SPIMISO/PWM3DIO18/SPIMOSIDIO19/SPISEL0DIO0/ADO/SPISEL1/ADC3DIO1/ADE/SPISEL2/ADC4/PC0DIO2/RFRX/TIM0CK_GT/ADC5DIO3/RFTX/TIM0CAP/ADC6Transparent top viewTable 4. Pin descriptionSymbol Pin Type[1] DescriptionADC1 1 I ADC1 — ADC input
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  10 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modulesDO0/SPICLK/PWM2[2] 2O DO0 — DO0SPICLK — SPI-bus master clock outputPWM2 — PWM2 outputDO1/SPIMISO/PWM3[3] 3I/O DO1 — DO1SPIMISO — SPI-bus Master In, Slave Out inputPWM3 — PWM3 outputDIO18/SPIMOSI 4 I/O DIO18 — DIO18SPIMOSI — SPI-bus Master Out Slave In outputDIO19/SPISEL0 5 I/O DIO19 — DIO19SPISEL0 — SPI-bus Master Select Output 0DIO0/ADO/SPISEL1/ADC3 6 I/O DIO0 — DIO0ADO — antenna diversity odd outputSPISEL1 — SPI-bus master select output 1ADC3 — ADC input: ADC3DIO1/ADE/SPISEL2/ADC4/PC0 7 I/O DIO1 — DIO1ADE — antenna diversity even outputSPISEL2 — SPI-bus master select output 2ADC4 — ADC input: ADC4PC0 — pulse counter 0 inputDIO2/RFRX/TIM0CK_GT/ADC5[4] 8I/O DIO2 — DIO2RFRX — radio receives control outputTIM0CK_GT — timer0 clock/gate inputADC5 — ADC input: ADC5DIO3/RFTX/TIM0CAP/ADC6[4] 9I/O DIO3 — DIO3RFTX — radio transmit control outputTIM0CAP — timer0 capture inputADC6 — ADC input: ADC6DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0 10 I/O DIO4 — DIO4CTS0 — UART 0 clear to send inputJTAG_TCK — JTAG CLK inputTIM0OUT — timer0 PWM outputPC0 — pulse counter 0 inputDIO5/RTS0/JTAG_TMS/PWM1/PC1 11 I/O DIO5 — DIO5RTS0 — UART 0 request to send outputJTAG_TMS — JTAG mode select inputPWM1 — PWM1 outputPC1 — pulse counter 1 inputDIO6/TXD0/JTAG_TDO/PWM2 12 I/O DIO6 — DIO6TXD0 — UART 0 transmit data outputJTAG_TDO — JTAG data outputPWM2 — PWM2 data outputTable 4. Pin description …continuedSymbol Pin Type[1] Description
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  11 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modulesDIO7/RXD0/JTAG_TDI/PWM3 13 I/O DIO7 — DIO7RXD0 — UART 0 receive data inputJTAG_TDI — JTAG data inputPWM3 — PWM 3 data outputDIO8/TIM0CK_GT/PC1/PWM4 14 I/O DIO8 — DIO8TIM0CK_GT — timer0 clock/gate inputPC1 — pulse counter1 inputPWM4 — PWM 4 outputDIO9/TIM0CAP/32KXTALIN/RXD1/32KIN 15 I/O DIO9 — DIO9TIM0CAP — Timer0 Capture input32KXTALIN — 32 kHz External Crystal inputRXD1 — UART1 Receive Data input32KIN — 32 kHz External clock inputDIO10/TIM0OUT/32KXTALOUT 16 I/O DIO10 — DIO10TIM0OUT — Timer0 PWM Output32KXTALOUT — 32 kHz External Crystal outputVDD 17 P VDD — supply voltageGND 18 GND groundDIO11/PWM1/TXD1 19 I/O DIO11 — DIO11PWM1 — PWM1 outputTXD1 — UART1 Transmit Data outputDIO12[5] 20 I/O DIO12 — DIO12PWM2 — PWM2 outputCTS0 — UART0 clear to send inputJTAG_TCK — JTAG CLK inputADO — antenna diversity odd outputSPISMOSI — SPI-bus slave Master Out, Slave In inputDIO13[6] 21 I/O DIO13 — DIO13PWM3 — PWM3 outputRTS0 — UART0 request to send outputJTAG_TMS — JTAG mode select inputADE — antenna diversity even outputSPISMISO — SPI-bus slave master in slave out outputRESET_N 22 I RESET_N — reset inputDIO14[7] 23 I/O DIO14 — DIO14SIF_CLK — serial interface clockTXD0 — UART 0 transmit data outputTXD1 — UART 1 transmit data outputJTAG_TDO — JTAG data outputSPISEL1 — SPI-bus master select output 1SPISSEL — SPI-bus slave select inputTable 4. Pin description …continuedSymbol Pin Type[1] Description
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  12 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules[1] P = power supply; G = ground; I = input, O = output; I/O = input/output.[2] JTAG programming mode: must be left floating high during reset to avoid entering JTAG programming mode.[3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode or hold it low to program.[4] Not available on the JN5169-001-M06-2 since they are used to control the front-end module.[5] Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI.[6] Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO.[7] Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL.[8] Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.8. Functional description8.1  JN5169 single chip wireless microcontrollerThe JN5169-001-M0x-2 is constructed around the JN5169-001 single chip wireless microcontroller, which includes the radio system, a 32-bit RISC CPU, Flash, RAM and EEPROM memory and a range of analogue and digital peripherals.The chip is described fully in JN5169 Wireless Microcontroller Datasheet (see Ref. 2).DIO15[8] 24 I/O DIO15 — DIO15SIF_D — serial interface dataRXD0 — UART 0 receive data inputRXD1 — UART 1 receive data inputJTAG_TDI — JTAG data inputSPISEL2 — SPI-bus master select output 2SPISCLK — SPI-bus slave clock inputDIO16/SPISMOSI/SIF_CLK/COMP1P 25 I/O DIO16 — DIO16COMP1P — comparator positive inputSIF_CLK — Serial Interface clockSPISMOSI — SPI-bus Slave Master Out Slave In inputDIO17/SPISMISO/SIF_D/COMP1M 26 I/O DIO17 — DIO17COMP1M — COMP1M; comparator negative inputSIF_D — Serial Interface DataSPISMISO — SPI-bus Slave Master In Slave Out outputPWM4 — PWM 4 outputVREF/ADC2 27 P VREF — analog peripheral reference voltageIADC2 — ADC input 2Table 4. Pin description …continuedSymbol Pin Type[1] Description
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  13 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules8.2 Peripherals The performance of all peripherals is defined in the JN5169 Wireless Microcontroller Datasheet (see Ref. 2).NXP supplies all the development tools and networking stacks needed to enable end-product development to occur quickly and efficiently. These are all freely available from the NXP Wireless Connectivity TechZone (see Ref. 3). A range of evaluation/developer kits is also available, allowing products to be quickly bread boarded. Efficient development of software applications is enabled by the provision of a complete, unlimited, software developer kit. Together with the available libraries for the IEEE802.15.4 MAC and ZigBee PRO network stacks, this package provides everything required to develop application code and to trial it with hardware representative of the final module.The modules can be user programmed both in development and in production using software supplied by NXP. Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This information is available on the NXP support website, together with many example applications, user guides, reference manuals and application notes.9. Limiting values Table 5. PeripheralsPeripherals JN5169-001-M0x-2 NotesMaster SPI-bus port 3 selects 250 kHz - 16 MHzSlave SPI-bus port 1 250 kHz - 4 MHzUART 2 16550 compatibleTwo-wire serial I/F (compatible with SMbus and I2C-bus) 1 Up to 400kHzPWM 16 MHz clocktimer 4timer/counter 1Programmable Sleep Timers 2 32 kHz clockDigital IO lines (multiplexed with UARTs, timers and SPI-bus selects) 20 DIO2 and DIO3 are not available on JN5169-001-M06 modulesAnalog-to-Digital converter 4 10-bit, up to 100 ks/sProgrammable analogue comparator 1 ultra low power mode for sleepInternal temperature sensor 1Internal battery sensor 1Table 6. Limiting valuesSymbol Parameter Conditions Min Max UnitVDD supply voltage 0.3 +3.6 VVVREF/ADC2 voltage on pin VREF/ADC2 0.3 VDDA + 0.3V VVADC1 voltage on pin ADC1 0.3 VDDA + 0.3V V
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  14 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules10. Recommended operating conditions [1] To reach the maximum TX power, 2.8 V is the minimum.11. Characteristics11.1 DC current [1] To reach the maximum TX power, 2.8 V is the minimum. VIO(dig) digital input/output voltage 0.3 VDDD + 0.3V VTstg storage temperature 40 +150 CVESD electrostatic discharge voltage according to ETSI EN 301 489-17 2012 V2.2.1 and ETSI EN 301 489-1 2011 V1.9.24- kVTable 6. Limiting values …continuedSymbol Parameter Conditions Min Max UnitTable 7. Operating conditionsSymbol Parameter Conditions Min Max UnitVDD supply voltage [1] 23.6VTamb ambient temperature standard range 40 +85 CTable 8. Active processingVDD = 2 V to 3.6 V; Tamb =40C to +85C; unless otherwise specified.Symbol Parameter Conditions Min Typ Max UnitIDD supply current M00radio in receive mode; maximum input level at 10 dBm - 17.8 - mAradio in receive mode; maximum input level at 0 dBm - 16.7 - mAradio in transmit mode 10 dBm [1] - 27.2 - mAradio in transmit mode 8.5 dBm [1] - 23.6 - mAM03radio in receive mode; maximum input level at 10 dBm - 17.8 - mAradio in receive mode; maximum input level at 0 dBm - 16.7 - mAradio in transmit mode 10 dBm [1] - 27.2 - mAradio in transmit mode 8.5 dBm [1] - 23.6 - mAM06radio in receive mode - 22.8 - mAradio in transmit mode [1] - 181 - mATable 9. Sleep modeVDD = 2 V to 3.6 V; Tamb =40C to +85C; unless otherwise specified.Symbol Parameter Conditions Min Typ Max UnitIDD(IO) input/output supply current in sleep mode; with I/O and RC oscillator timer wake-up; Tamb =25C-0.73-A
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  15 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules [1] Waiting on chip RESET or I/O event.11.2 AC characteristics11.2.1 Radio transceiverThese modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V to 3.6 V and offers the improved RF characteristics shown in Table 11. All RF characteristics are measured single ended. [1] With external matching inductors and assuming PCB layout. Table 10. Deep sleep modeVDD = 2 V to 3.6 V; Tamb =40C to +85C; unless otherwise specified.Symbol Parameter Conditions Min Typ Max UnitIDD supply current deep sleep mode; measured at 25 C[1] -70-nATable 11. RF port characteristicsSingle-ended; Impedance = 50 [1]; VDD = 2 V to 3.6 V; Tamb =40C to +85C; unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unitfrange frequency range 2.4 - 2.485 GHzTable 12. Radio transceiver characteristics: +25 CVDD = 2 V to 3.6 V; unless otherwise specified.Symbol Parameter Conditions Min Typ Max UnitReceiverM00SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96.5 - dBmPi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity; supply current at 17.8 mA -10-dBm1 % PER, measured as sensitivity; supply current at 16.2 mA -0-dBmRSSI RSSI variation 95 dBm to 10 dBm; available through UM11016 Integrated Peripherals API4- +4dBM03SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 96.5 - dBmPi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity; supply current at 17.8 mA -10-dBm1 % PER, measured as sensitivity; supply current at 16.2 mA -0-dBmRSSI RSSI variation 95 dBm to 10 dBm; available through UM11016 Integrated Peripherals API4- +4dBM06SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - 100 - dBmPi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity - 5 - dBmRSSI RSSI variation 100 dBm to 25 dBm; available through UM11016 Integrated Peripherals API4- +4dBTransmitter
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  16 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules[1] To reach the maximum TX power, 2.8 V is the minimum on VDD.[2] Up to an extra 2.5 dB of attenuation is available if required.12. Federal Communication Commission Statement•This equipment has been tested and found to comply with the limits for a Class Bdigital device, pursuant to Part 15 of the FCC Rules see Ref. 4. These limits aredesigned to provide reasonable protection against harmful interference in aresidential installation. This equipment generates, uses, and can radiate radiofrequency energy and, if not installed and used in accordance with the instructions,may cause harmful interference to radio communications. However, there is noguarantee that interference will not occur in a particular installation. If this equipmentdoes cause harmful interference to radio or television reception, which can bedetermined by turning the equipment off and on, the user is encouraged to try tocorrect the interference by one of the following measures:–Reorient or relocate the receiving antenna–Increase the separation between the equipment and receiver–Connect the equipment into an outlet on a circuit different from that to which thereceiver is connected–Consult the dealer or an experienced radio/TV technician for help•OEM integrators instructions–The OEM integrators are responsible for ensuring that the end-user has no manualinstructions to remove or install module–The module is limited to installation in mobile or fixed applications, according toCFR 47 Part 2.1091(b)–Separate approval is required for all other operating configurations, includingportable configurations with respect to CFR 47 Part 2.1093 and different antennaconfigurations•User guide mandatory statementsM00Pooutput power IDD = 27.2 mA [1] -10-dBmIDD = 23.6 mA [1] -8.5-dBmPo(cr) control range output power in 6 major steps and then 4 fine steps [2] -42 - dBM03Pooutput power IDD = 27.2 mA [1] -10-dBmIDD = 23.6 mA [1] -8.5-dBmPo(cr) control range output power in 6 major steps and then 4 fine steps [2] -42 - dBM06Pooutput power [1] -21-dBmTable 12. Radio transceiver characteristics: +25 C …continuedVDD = 2 V to 3.6 V; unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  17 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules–User's instructions of the host device must contain the following statements inaddition to operation instructions:* “This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions:(1) This device may not cause harmful interference, and(2) This device must accept any interference received, including interference that may cause undesired operation”* “Changes or modifications not expressly approved by the party responsible forcompliance could void the user's authority to operate the equipment”•FCC RF Exposure requirements–User's instructions of the host device must contain the following instructions inaddition to operation instructions:Avoid direct contact to the antenna, or keep it to a 20 cm minimum distance whileusing this equipment. This device must not be collocated or operating inconjunction with another antenna or transmitter.The JN5169-001-M03-2 and JN5169-001-M06-2 modules have  been designed to operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with these devices. The required antenna impedance is 50 ohms.The JN5169-001-M00-2 integrates a printed antenna. The maximum gain of the printed antenna is 1 dBi. 12.1  FCC end product labellingThe final ‘end product’ should be labelled in a visible area with the following:“Contains TX FCC ID: XXMJN5169M0V2, XXMJN5169M3V2 or XXMJN5169M6V2” to reflect the version of the module being used inside the product.13. Industry Canada statementTo reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropic radiated power (e.i.r.p.) is not more than that permitted for successful communication.This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.This device complies with Industry Canada RF radiation exposure limits set forth for general population (uncontrolled exposure). This device must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter.Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: (1) il ne doit pas produire de brouillage, et (2) l’utilisateur du dispositif doit être prêt a accepter tout brouillage radioélectrique reçu, même si ce brouillage est susceptible de compromettre le fonctionnement du dispositif.Le présent appareil est conforme aux niveaux limites d’exigences d’exposition RF aux personnes définies par Industrie Canada. Cet appareil doit être installé afin d’offrir une distance de séparation d’au moins 20 cm avec l’utilisateur, et ne doit pas être installé à proximité ou être utilisé en conjonction avec une autre antenne ou un autre émetteur.
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  18 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modulesThe JN5169-001-M03-2 and JN5169-001-M06-2 modules have  been designed to operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with these devices. The required antenna impedance is 50 ohms.The JN5169-001-M00-2 integrates a printed antenna. The maximum gain of the printed antenna is 1 dBi. As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc).13.1  Industry Canada end product labellingFor Industry Canada purposes the following should be used:“Contains Industry Canada ID IC: 8764A-JN5169Mx” (with x = 0 or 3 or 6).14.Footprint information for reflow solderingAll modules have the same footprint.Fig 5. Module PCB footprintaaa-022825Dimensions in mm162.542.541.273.301.5Ø 11
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  19 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules15. Package outlineFig 6. Package outline JN5169-001-M00-2Fig 7. Package outline JN5169-001-M03-230162.54 3.302.541.27aaa-022826Dimensions in mmThickness: 3.5 mmaaa-022827Dimensions in mmThickness: 3.5 mm21162.54 3.302.541.272.5310.85
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  20 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modulesFig 8. Package outline JN5169-001-M06-2aaa-022828Dimensions in mmThickness: 3.5 mm30162.54 3.302.541.272.818
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  21 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules16. Abbreviations 17. References[1] IEEE Std 802.15.4-2011 — IEEE Std 802.15.4-2011 IEEE Standard for Information Technology.[2] JN5169 — JN5169 wireless microcontroller datasheet.[3] Wireless Connectivity — http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRELESS-CONNECTIVITY[4] Part 15 of the FCC Rules — http://www.ecfr.gov/cgi‐bin/text‐idx?SID=d01e00935bfcb0d53b914e7c8e63f383&node=47:1.0.1.1.16&rgn=div5Table 13. AbbreviationsAcronym DescriptionAPI Application Program InterfaceADC Analog to Digital ConverterFCC Federal Communication CommissionIO Input OutputOEM Original Equipment ManufacturerPCB Printed Circuit BoardPER Packet Error RatePWM Pulse Width ModulationR&TTE Radio and Telecommunications Terminal EquipmentRF Radio FrequencyRISC Reduce Instruction Set ComputingRSSI Receive Signal Strength IndicatorRTS Request-To-SendSPI Serial Peripheral InterfaceSVM Supply Voltage MonitorSYNTH SYNTHesizerUART Universal Asynchronous Receiver/Transmitter
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  22 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules18. Legal information18.1 DefinitionsDraft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.18.2 DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer.In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.18.3 TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.I2C-bus  — logo is a trademark of NXP Semiconductors N.V.
UM11016 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.User manual Rev. 1.0 — 15 June 2016  23 of 24NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules19. TablesTable 1.  Variants and identifications information . . . . . . .3Table 2.  Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .6Table 3.  Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .7Table 4.  Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .9Table 5.  Peripherals  . . . . . . . . . . . . . . . . . . . . . . . . . . .13Table 6.  Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .13Table 7.  Operating conditions  . . . . . . . . . . . . . . . . . . . .14Table 8.  Active processing  . . . . . . . . . . . . . . . . . . . . . . 14Table 9.  Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Table 10.  Deep sleep mode  . . . . . . . . . . . . . . . . . . . . . . 15Table 11.  RF port characteristics  . . . . . . . . . . . . . . . . . . 15Table 12.  Radio transceiver characteristics: +25 °C . . . . 15Table 13.  Abbreviations  . . . . . . . . . . . . . . . . . . . . . . . . . 2120. FiguresFig 1.  JN5169-001-M00-2 and JN5169-001-M03-2 packages marking (top view) . . . . . . . . . . . . . . . . .6Fig 2.  JN5169-001-M06-2 package marking (top view). .7Fig 3.  Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .8Fig 4.  Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .9Fig 5.  Module PCB footprint. . . . . . . . . . . . . . . . . . . . . .18Fig 6.  Package outline JN5169-001-M00-2 . . . . . . . . . .19Fig 7.  Package outline JN5169-001-M03-2 . . . . . . . . . .19Fig 8.  Package outline JN5169-001-M06-2 . . . . . . . . . .20
NXP Semiconductors UM11016ZigBee PRO and IEEE802.15.4 JN5169-001-M0x-2 modules© NXP Semiconductors N.V. 2016. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.comDate of release: 15 June 2016Document identifier: UM11016Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’. 21. Contents1  General description . . . . . . . . . . . . . . . . . . . . . .  31.1  Variants and identifications information  . . . . . .  31.2  Regulatory approvals . . . . . . . . . . . . . . . . . . . .  32  Features and benefits . . . . . . . . . . . . . . . . . . . .  32.1  Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  32.2  Features: modules . . . . . . . . . . . . . . . . . . . . . .  42.3  Features: microcontroller . . . . . . . . . . . . . . . . .  53  Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .  54  Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  55  Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  65.1  JN5169-001-M00-2 and JN5169-001-M03-2 . .  65.2  JN5169-001-M06-2. . . . . . . . . . . . . . . . . . . . . .  76  Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .  87  Pinning information. . . . . . . . . . . . . . . . . . . . . .  97.1  Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  97.2  Pin description . . . . . . . . . . . . . . . . . . . . . . . . .  98  Functional description  . . . . . . . . . . . . . . . . . .  128.1  JN5169 single chip wireless microcontroller. .  128.2  Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . .  139  Limiting values. . . . . . . . . . . . . . . . . . . . . . . . .  1310  Recommended operating conditions. . . . . . .  1411  Characteristics. . . . . . . . . . . . . . . . . . . . . . . . .  1411.1  DC current  . . . . . . . . . . . . . . . . . . . . . . . . . . .  1411.2  AC characteristics. . . . . . . . . . . . . . . . . . . . . .  1511.2.1  Radio transceiver . . . . . . . . . . . . . . . . . . . . . .  1512  Federal Communication Commission Statement 1612.1  FCC end product labelling  . . . . . . . . . . . . . . .  1713  Industry Canada statement. . . . . . . . . . . . . . .  1713.1  Industry Canada end product labelling . . . . . .  1814  Footprint information for reflow soldering . .  1815  Package outline . . . . . . . . . . . . . . . . . . . . . . . .  1916  Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . .  2117  References . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2118  Legal information. . . . . . . . . . . . . . . . . . . . . . .  2218.1  Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . .  2218.2  Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .  2218.3  Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .  2219  Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2320  Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2321  Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  24

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