NXP Semiconductors JN5179M16 ZigBee Modular Transmitter User Manual UM11018

NXP Semiconductors ZigBee Modular Transmitter UM11018

User Manual

UM11018 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Rev. 1.0 — 15 September 2016 User manual Document information Info Content Keywords JN5179, Zigbee, module Abstract JN5179-001-M1x modules user manual
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Revision history Rev Date Description 1.0 20160913 Initial version Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 1. General description The JN5179-001-M1x (with x = 0, 3 or 6) module family provides designers with a ready-made component that provides a fully integrated solution for applications, using the IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee Smart Energy and Home Automation and can be quickly and easily included in product designs. The modules integrate all of the RF components required, removing the need to perform expensive RF design and test. Products can be designed by simply connecting sensors and switches to the module IO pins. The modules use NXP’s single chip IEEE802.15.4 wireless microcontroller, allowing designers to make use of the extensive chip development support material. Hence, this range of modules allows designers to bring wireless applications to market in the minimum time with significantly reduced development effort and cost. 3 variants are available: JN5179-001-M10, JN5179-001-M13 and JN5179-001-M16. All modules have FCC modular approval. The JN5179-001-M10 and JN5179-001-M13 are also CE-compliant and subject to a Notified Body Opinion. The variants available are described in the Ta ble 2. 1.1 Regulatory Approvals The JN5179-001-M10 and JN5179-001-M13 have been tested against the requirements of the following European standards. • Radio EN 300 328 v 1.9.1 • EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2 • Basic Safety Assessment (BSA) EN 60950-1:2006 A Notified Body statement of opinion for this standard is available on request. The High-power module with M16 suffix is not approved for use in Europe. Additionally, both module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC part 15 regulations and in accordance to FCC public notice DA00-1407. The modular approvals notice and test reports are available on request. The JN5179-001-M16 module is subject to user proximity restrictions under FCC regulations; more specific information is available in Section 12.2. 2. Features and benefits 2.1 Benefits • Microminiature module solutions • Ready to use in products • Minimizes product development time • No RF test required for systems • Compliant with: – FCC 47CFR Part 15C
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules – ETSI EN 300-328 V1.9 – EN 301-489-17 V2.2.1 – EN60950-1-2006 – Temperature range: −40 °C to +85 °C – Lead-free and RoHS compliant 2.2 Features: modules • 2.4 GHz IEEE 802.15.4, ZigBee Smart Energy and Home Automation compatible • JN5179-001-M10 – Dimensions: 14.5 mm × 20.5 mm – Integrated printed antenna – TX power 8.5 dBm/10 dBm – Receiver sensitivity –96 dBm – TX current 26.2 mA at 10 dBm – TX current 22.6 mA at 8.5 dBm – RX current 16.6 mA at maximum input level –2 dBm – 2.0 V/3.6 V operation • JN5179-001-M13 – Dimensions: 14.5 mm × 20.5 mm – µFl connector – TX power 8.5 dBm/10 dBm – Receiver sensitivity –96 dBm – TX current 26.2 mA at 10 dBm – TX current 22.6 mA at 8.5 dBm – RX current 16.6 mA at maximum input level –2 dBm – 2.0 V/3.6 V operation • JN5179-001-M16 – Dimensions: 14.5 mm × 20.5 mm – Integrated printed antenna and µFl connector – Antenna diversity – TX power 21 dBm – Receiver sensitivity –100 dBm – TX current 125 mA at 21 dBm – RX current 21.42 mA at maximum input level –11 dBm – 2.0 V/3.6 V operation 2.3 Features: microcontroller • ARM Cortex-M3 CPU with debug support • 512 kB/32 kB/4 kB (Flash/RAM/EEPROM)
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules • OTA firmware upgrade capability • 32 MHz clock selectable down to 1 MHz for low-power operation • Dual PAN ID support • Fail-safe I2C-bus interface. operates as either master or slave • 9 × Timers (6 × PWM and 3 timer/counter) • 2 low-power sleep counters • 2 × UART supporting DALI and DMX512, one with flow control • SPI-bus master and slave port, 2 simultaneous selects • Variable instruction width for high coding efficiency • Multi-stage instruction pipeline • Data EEPROM with guaranteed 100 k write operations • ZigBee PRO stack with Smart Home, Smart Lighting and Smart Energy profiles • Supply voltage monitor with 8 programmable thresholds • Battery voltage and temperature sensors • 6-input 10-bit ADC • Analog comparator • Digital monitor for ADC • Watchdog timer and POR • Standby power controller • Up to 18 Digital IO (DIO) and 2 digital outputs pins 3. Applications • Robust and secure low-power wireless applications • ZigBee Home Automation networks • Toys and gaming peripherals • Energy harvesting - for example, self-powered light switch 4. Overview The JN5179-001-M1x family is a range of ultra-low power, high performance surface mount modules targeted at IEEE 802.15.4, ZigBee Home Automation networking applications, enabling users to realize products with minimum time to market and at the lowest cost. They remove the need for expensive and lengthy development of custom RF board designs and test suites. The modules use NXP’s JN5179 wireless microcontroller to provide a comprehensive solution with large memory, high CPU and radio performance and all RF components included. All that is required to develop and manufacture wireless control or sensing products is to connect a power supply and peripherals such as switches, actuators and sensors, considerably simplifying product development. 3 module variants are available: JN5179-001-M10 with an integrated printed antenna, JN5179-001-M13 with a µFL antenna connector and JN5179-001-M16 with a power amplifier, LNA for extended range and antenna diversity, thanks to the integrated antenna and µFL antenna connector.
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules The dimensions of the 3 module variants are: 14.5 x 20.5 mm. 5. Ordering information Table 1. Ordering information Type number Description FCCID JN5179-001-M10 standard power, integrated printed antenna XXMJN5179M1X JN5179-001-M13 standard power, µFL antenna connector XXMJN5179M1X JN5179-001-M16 high power, LNA, antenna diversity (integrated printed antenna and µFL antenna connector) XXMJN5179M16 6. Marking Table 2. Marking code Line number Marking code Line 1 NXP Logo: B&W outline logo - 2D barcode (internal NXP usage) Line 2 part ID: JN5179-001-M1x, with x the module type 0, 3 or 6 Line 3 serial number: NNNNN Line 4 • Z: SSMC • b: SPIL • H: halogen free • Y: year • WW: week code Line 5 FFC ID = FCCID: XXMJN5179M1x, with x = X for JN5179-001-M10 and JN5179-001-M13 and x = 6 for JN5179-001-M16 Line 6 IC ID = IC: 8764A-JN5179M1x, with x = X for JN5179-001-M10 and JN5179-001-M13 and x = 6 for JN5179-001-M16 JN5179-001-M1x XXMJN5179M1x(2) 8764A-JN5179M1x(2) (1) With x = 0, 3 or 6. (2) x = X for JN5179-001-M10 and JN5179-001-M13 and x = 6 for JN5179-001-M16. Fig 1. UM11018 package marking (top view)
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 27 2.4 GHz RADIO INCLUDING DIVERSITY EEPROM IEEE802.15.4 MAC ACCELERATOR 128-BIT AES ENCRYPTION ACCELERATOR POWER MANAGEMENT MATCHING µFL CONNECTOR MATCHING µFL CONNECTOR PA/LNA MATCHING XTAL integrated antenna M10 option ARM Cortex-M3 external antenna M13 option external antenna integrated antenna M16 option JN5179 POWER aaa-023361 Fig 2. Block diagram ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules JN5179-001-M1x modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force on 1 March 2007. 7. Block diagram SPI-BUS MASTER AND SLAVE I2C-BUS MASTER/SLAVE 6 X PWM PLUS TIMER 2 X UART DIO SLEEP COUNTER 6 CHAN 10 BIT ADC SUPPLY AND TEMP SENSORS WATCHDOG TIMER RAM FLASH VOLTAGE BROWNOUT O-QPSK MODEM
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 8. Pinning information 8.1 Pinning 8.2 Pin description Table 3. Pin description Symbol Pin Type[1] Description DIO2 1 IO DIO2 — digital input/output 2 ADC5 — ADC input 5 SDA — I2C-bus master/slave SDA input/output (push-pull output) RXD1 — UART 1 receive data input TIM0CAP — Timer0 capture input RFRX — radios receiver control output ADC0 2 I ADC0 — ADC input 0 DIO2 1 ADC0 2 DIO0(1) 3 DIO1(2) 4 DIO3 5 DIO4 6 DIO10/RXD0 7 DIO9/TXD0 8 DIO8 9 27 ADC1 26 DIO18 25 DIO15 24 RESET_N23 DIO14 22 DIO13 21 DIO12 20 n.c. 19 DIO5 Transparent top view aaa-023363(1) DIO0 pin of the JN5179-001-M16 is not connected to DIO0 pin of the JN5179. The DIO0 of the module is LNA_BYPASS. (2) DIO1 pin of the JN5179-001-M16 is not connected to DIO1 pin of the JN5179. The DIO1 of the module is ANT_SEL. Fig 3. Pin configuration DIO7/SPIMOSI 10 DIO6/SPISEL0 11 DO1/SPIMISO 12 DO0/SPICLK 13 DIO17 14 DIO11 15 n.c. 16 VSS VDDD 17 18
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 3. Pin description …continued Symbol Pin Type[1] Description DIO0[2] 3 DIO0 — digital input/output 0 ADC4 — ADC input 4 SPISEL0 — SPI-bus master select output 0 RFRX — radio receiver control output FLICK_CTRL — flicker control output ADO — antenna diversity odd output DIO1[2] 4 IO DIO1 — digital input/output 1 ADC3 — ADC input 3 RFTX — radio transmitter control input PC0 — pulse counter 0 input ADE — antenna diversity even output DIO3 5 IO DIO3 — digital input/output 3 ADC2 — ADC input 2 PWM4 — PWM4 output SCL — I2C-bus master/slave SCL input/output (push-pull output) TXD1 — UART 1 transmit data output TIM0OUT — Timer0 output RFTX — radio transmit control input FLICK_CTRL — flicker control output DIO4 6 IO DIO4 — digital input/output 4 SCL — I2C-bus master/slave SCL input/output (open-drain) RXD0 — UART 0 receive data input TIM0CK_GT — Timer0 clock/gate input ADO — antenna diversity odd output DIO10/RXD0 7 IO DIO10 — digital input/output 10 JTAG_TDI — JTAG TDI data input RXD0 — UART 0 receive data input DIO9/TXD0 8 IO DIO9 — digital input/output 9 JTAG_TDO — JTAG TDO data output TXD0 — UART 0 transmit data output TRACESWV — ARM trace serial wire viewer output DIO8 9 IO DIO8 — digital input/output 8 PWM5 — PWM5 output TIM0OUT — Timer0 output TRACECLK — trace clock output 32KXTALIN — 32 kHz clock input
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 3. Pin description …continued Symbol Pin Type[1] Description DIO7/SPIMOSI 10 IO DIO7 — digital input/output 7 SPIMOSI — SPI-bus master data output JTAG_TDI — JTAG TDI data input SPISEL2 — SPI-bus master select output 2 SPISSEL — SPI-bus slave select input CMP_OUT — comparator output 32KIN — 32 kHz External clock input 32KXTALOUT — 32 kHz clock output DIO6/SPISEL0 11 IO DIO6 — digital input/output 6 SPISEL0 — SPI-bus master select output 0 CTS0 — UART 0 clear to send input RXD1 — UART 1 receive data input JTAG_TCK — JTAG TCK input SWCK — Serial Wire Debugger Clock input SPISCLK — SPI-bus slave clock input TIM1CAP — Timer1 capture input DO1/SPIMISO[3] 12 IO DO1 — digital output 1 SPIMISO — SPI-bus master data input SPISMISO — SPI-bus slave data output ADO — antenna diversity odd output DO0/SPICLK[4] 13 O DO0 — digital output 0 SPICLK — SPI-bus master clock output ADE — antenna diversity even output DIO17 14 IO DIO17 — digital input/output 17 JTAG_TCK — JTAG TCK input SWCK — Serial Wire Debugger Clock input SPISEL0 — SPI-bus master select output 0 TIM1CAP — Timer1 capture input COMP1P — comparator plus input SPISMISO — SPI-bus slave data output DIO11 15 IO DIO11 — digital input/output 11 JTAG_TMS — JTAG TMS input SWD — serial wire debugger input RTS0 — UART 0 request to send output TXD1 — UART 1 transmit data output SPICLK — SPI-bus master clock output SPISMOSI — SPI-bus slave data input TIM1OUT — Timer1 output TRACED0 — ARM trace data0 output n.c. 16 - not connected; keep floating or ground VSS 17 G VSS — ground
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Table 3. Pin description …continued Symbol Pin Type[1] Description VDDD 18 P VDDD — digital supply voltage DIO5[5] 19 IO DIO5 — digital input/output 5 SDA — I2C-bus master/slave SDA input/output (open-drain) TXD0 — UART 0 transmit data output PC1 — pulse counter 1 input TIM0CAP — Timer0 capture input n.c. 20 - not connected; keep floating or ground DIO12 21 IO DIO12 — digital input/output 12 PWM1 — PWM1 output TXD0 — UART 0 transmit data output TRACED3 — ARM trace data3 output DIO13 22 IO DIO13 — digital input/output 13 PWM2 — PWM2 output RXD0 — UART 0 receive data input PC0 — pulse counter 0 input TRACED2 — ARM trace data2 output DIO14 23 IO DIO14 — digital input/output 14 PWM3 — PWM3 output PC1 — pulse counter 1 input CMP_OUT — comparator output TRACED1 — ARM trace data1 output SPISMOSI — SPI-bus slave data input RESET_N 24 IO RESET_N — reset input DIO15 25 IO DIO15 — digital input/output 15 PWM6 — PWM6 output JTAG_TDO — JTAG TDO data output SPIMOSI — SPI-bus master data output SPISEL1 — SPI-bus master select output 1 TIM0CK_GT — Timer0 - clock gate input TRACESWV — ARM trace Serial Wire Viewer output SPISSEL — SPI-bus slave select input DIO18 26 IO DIO18 — digital input/output 18 JTAG_TMS — JTAG TMS input SWD — Serial Wire Debugger input SPIMISO — SPI-bus master data input TIM1OUT — Timer1 output COMP1M — comparator minus input SPISCLK — SPI-bus slave clock input ADC1 27 I VREF — analog peripheral reference voltage ADC1 — ADC input 1
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules [1] P = power supply; G = ground; I = input, O = output; IO = input/output. [2] Not available on the JN5179-001-M16 since they are used to control the front-end module. DIO0 of the module is LNA_BYPASS and the DIO1 of the module is ANT_SEL. [3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode or hold it low to program. [4] JTAG programming mode: must be left floating high during reset to avoid entering JTAG programming mode. [5] Open-drain. 9. Functional description 9.1 JN5179 single chip wireless microcontroller The JN5179-001-M1x series is constructed around the JN5179-001 single chip wireless microcontroller, which includes the radio system, an ARM Cortex-M3 CPU, Flash, RAM and EEPROM memory and a range of analog and digital peripherals. The chip is described fully in JN5179 Wireless Microcontroller Datasheet (see Ref. 2). 9.2 Peripherals Table 4. Peripherals description Peripherals JN5179-001-M10 JN5179-001-M13 JN5179-001-M16 Notes Master SPI-bus port 3 selects 3 selects 3 selects 250 kHz - 16 MHz Slave SPI-bus port 1 1 1 250 kHz - 4 MHz UART 2 2 2 16550 compatible Two-wire serial I/F (compatible with SMbus and I2C-bus) 1 1 1 Up to 400 kHz PWM 16 MHz clock timer 4 4 4 timer/counter 1 1 1 Programmable Sleep Timers 2 2 2 32 kHz clock Digital IO lines (multiplexed with UARTs, timers and SPI-bus selects) 20 20 18 DIO2 and DIO3 are not available on JN5179-001-M16 modules Analog-to-Digital converter 4 4 4 10 bit, up to 100 ks/s Programmable analog comparator 1 1 1 ultra low-power mode for sleep Internal temperature sensor 1 1 1 Internal battery sensor 1 1 1 The performance of all peripherals is defined in the JN5179 Wireless Microcontroller Datasheet (see Ref. 2). NXP supplies all the development tools and networking stacks needed to enable end-product development to occur quickly and efficiently. These are all freely available from the NXP Wireless Connectivity TechZone (see Ref. 3). A range of evaluation/developer kits is also available, allowing products to be quickly bread boarded.
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules Efficient development of software applications is enabled by the provision of a complete, unlimited, software developer kit. Together with the available libraries for the IEEE802.15.4 MAC and ZigBee PRO network stacks, this package provides everything required to develop application code and to trial it with hardware representative of the final module. The modules can be user programmed both in development and in production using software supplied by NXP. Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This information is available on the NXP support website, together with many example applications, user guides, reference manuals and application notes. 9.3 JN5179-001-M16 Antenna diversity ANT_SEL is used to select between the two antennas on the M16 module. Leaving ANT_SEL unconnected or connecting to VCC selects the printed antenna. Tying ANT_SEL to ground selects the µFL connector. The module can also be used in antenna diversity solutions where the module will automatically swap between the two antennas in order to achieve the best radio performance. This can be done connecting ANT_SEL to DIO4, DIO5, DO0 or DO1 depend upon your application. The antenna diversity functionality can be enabled by calling vAHI_AntennaDiversityEnable. The DIO can be selected using vAHI_SetDIOpinMultiplexValue. Please see JN-UG-3118-JN517x-Integrated-Peripherals-API for more details. The LNA bypass signal can be used to switch off the LNA in the frontend. This can be useful when in the presence of strong Wifi signals that can overload the frontend. If the pin is left unconnected or tied to VCC then the LNA is enabled. If the signal is tied to ground then the LNA will be bypassed during RX. The signal can be connected to a DIO to give software control over the LNA if required. 10. Limiting values Table 5. Limiting values Symbol Parameter Conditions Min Max Unit VDD supply voltage −0.3 +3.6 V VADC0 voltage on pin ADC0 −0.3 VDD + 0.3 V V VADC1 voltage on pin ADC1 −0.3 VDD + 0.3 V V VIO(dig) digital input/output voltage −0.3 VDD + 0.3 V V Tstg storage temperature −40 +150 °C 11. Recommended operating conditions Table 6. Operating conditions Symbol Parameter Conditions Min Max Unit VDD supply voltage [1] 2 3.6 V Tamb ambient temperature standard range −40 +85 °C
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 14 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules [1] To reach the maximum TX power, 2.8 V is the minimum. 12. Characteristics 12.1 DC current Table 7. Active processing VDD = 2 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IDD supply current M10 radio in receive mode; maximum input level at –2 dBm - 16.6 - mA radio in transmit mode 10 dBm [1] - 26.2 - mA radio in transmit mode 8.5 dBm [1] - 22.6 - mA M13 radio in receive mode; maximum input level at –2 dBm - 16.6 - mA radio in transmit mode 10 dBm [1] - 26.2 - mA radio in transmit mode 8.5 dBm [1] - 22.6 - mA M16 radio in receive mode - 16.6 - mA radio in transmit mode [1] - 125 - mA [1] To reach the maximum TX power, 2.8 V is the minimum. Table 8. Sleep mode VDD = 2 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IDD(IO) input/output supply current in sleep mode; with I/O and RC oscillator timer wake-up; Tamb = 25 °C - 0.73 - µA Table 9. Deep sleep mode VDD = 2 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IDD supply current deep sleep mode; measured at 25 °C and [1] VDD = 3.3 V - 80 - nA [1] Waiting on chip RESET or I/O event. 12.2 AC characteristics 12.2.1 Radio transceiver These modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V to 3.6 V and offers the improved RF characteristics shown in Ta ble 10. All RF characteristics are measured single ended. Table 10. RF port characteristics Single-ended; Impedance = 50 Ω[1]; VDD = 2 V to 3.6 V; Tamb = −40°C to +85°C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit frange frequency range 2.4 - 2.485 GHz
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 15 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules [1] With external matching inductors and assuming PCB layout. Table 11. Radio transceiver characteristics: +25 °C VDD = 2 V to 3.6 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Receiver M10 SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - −96 - dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity; supply current at 16.6 mA - −2 - dBm ∆αRSSI RSSI variation −95 dBm to −10 dBm; available through UM11018 Integrated Peripherals API −4 - +4 dB M13 SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - −96 - dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity; supply current at 16.6 mA - −2 - dBm ∆αRSSI RSSI variation −95 dBm to −10 dBm; available through UM11018 Integrated Peripherals API −4 - +4 dB M16 SRX receiver sensitivity nominal for 1 % PER, as per 802.15.4 - −100 - dBm Pi(RX)(max) maximum receiver input power 1 % PER, measured as sensitivity - −11 - dBm ∆αRSSI RSSI variation −100 dBm to −25 dBm; available through UM11018 Integrated Peripherals API −4 - +4 dB Transmitter M10 Po output power IDD = 26.2 mA [1] - 10 - dBm IDD = 22.6 mA [1] - 8.5 - dBm Po(cr) control range output power in 6 major steps and then 4 fine steps [2] - −42 - dB M13 Po output power IDD = 26.2 mA [1] - 10 - dBm IDD = 22.6 mA [1] - 8.5 - dBm Po(cr) control range output power in 6 major steps and then 4 fine steps [2] - −42 - dB M16 Po output power IDD = 125 mA [1] - 21 - dBm [1] To reach the maximum TX power, 2.8 V is the minimum on VDD. [2] Up to an extra 2.5 dB of attenuation is available if required. 13. Federal Communication Commission Statement • This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules see Ref. 4. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 16 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: – Reorient or relocate the receiving antenna – Increase the separation between the equipment and receiver – Connect the equipment into an outlet on a circuit different from that to which the receiver is connected – Consult the dealer or an experienced radio/TV technician for help • OEM integrators instructions – The OEM integrators are responsible for ensuring that the end-user has no manual instructions to remove or install module – The module is limited to installation in mobile or fixed applications, according to CFR 47 Part 2.1091(b) – Separate approval is required for all other operating configurations, including portable configurations with respect to CFR 47 Part 2.1093 and different antenna configurations • User guide mandatory statements – User's instructions of the host device must contain the following statements in addition to operation instructions: * “This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation” * “Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment” • FCC RF Exposure requirements – User's instructions of the host device must contain the following instructions in addition to operation instructions: Avoid direct contact to the antenna, or keep it to a 20 cm minimum distance while using this equipment. This device must not be collocated or operating in conjunction with another antenna or transmitter. This module has been designed to operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. 13.1 FCC end product labelling The final ‘end product’ should be labelled in a visible area with the following: Contains TX FCC ID: XXMJN5179M1X or XXMJN5179M16 to reflect the version of the module being used inside the product.
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 17 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 13.2 European R&TTE Directive 1999/5/EC statement JN5179-001-M10 and JN5179-001-M13 are compliant with ETSI EN 300 328 V1.9, EMC, EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN 60950-1:2006 (2006-06) and are subject to a Notified Body Opinion. These modules are approved for use with the antennas listed in the following table. The JN5179-001-M16 module is not approved for use in Europe. Alternative vertical antennas may be used provided that the gain does not exceed 2 dBi. Table 12. Antennas description (R&TTE) Brand Model Number Description Gain (dBi) Connector type 1 Aveslink Technology, Inc E-0005-AC vertical- flying lead 2 RP-SMA 2 Aveslink Technology, Inc E-2411-GC vertical - swivel 2 RP-SMA 3 Aveslink Technology, Inc E-2410-CA vertical - bulkhead- flying lead 2 µFL 4 Aveslink Technology, Inc E-2410-HA vertical- flying lead 2 µFL 5 Aveslink Technology, Inc E-2410-GC vertical - swivel 2 RP-SMA 6 Aveslink Technology, Inc E-2820-CA vertical - bulkhead- flying lead 2 µFL 7 Aveslink Technology, Inc E-2820-GC vertical - swivel 2 RP-SMA 8 Embedded Antenna Design FBKR35068-RS-KR vertical - knuckle antenna 2 RP-SMA 9 Nearson S131CL-L-PX-2450S vertical - knuckle-flying lead 2 µFL 10 Laird Technologies WRR2400-IP04 vertical - knuckle-flying lead 1.5 µFL 11 Laird Technologies WRR2400-RPSMA vertical - knuckle-flying lead 1.3 RP-SMA 12 Aveslink Technology, Inc E-6170-DA Vertical - right angle 1 µFL 13 Laird Technologies WCR2400-SMRP Vertical - knuckle antenna 1 RP-SMA 14. Industry Canada statement To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropic radiated power (e.i.r.p.) is not more than that permitted for successful communication. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. This device complies with Industry Canada RF radiation exposure limits set forth for general population (uncontrolled exposure). This device must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: (1) il ne doit pas produire de brouillage, et (2) l’utilisateur du dispositif doit être prêt a accepter tout brouillage radioélectrique reçu, même si ce brouillage est susceptible de compromettre le fonctionnement du dispositif. Le présent appareil est conforme aux niveaux limites d’exigences d’exposition RF aux personnes définies par Industrie Canada. Cet appareil doit être installé afin d’offrir une distance de séparation d’au moins 20 cm avec l’utilisateur, et ne doit pas être installé à proximité ou être utilisé en conjonction avec une autre antenne ou un autre émetteur.
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 18 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules This module has been designed to operate with antennas having a maximum gain of 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc). 14.1 Industry Canada end product labelling For Industry Canada purposes the following should be used: Contains Industry Canada ID IC: 8764A-JN5179M1x (with x = X or 6). 15. Footprint and PCB placement 15.1 Footprint information for reflow soldering 14.50 1.27 2.63Ø1.00 1.50 2.17 2.17 1.00 aaa-023943 All modules have the same footprint. Fig 4. Footprint information for reflow soldering of modules
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 19 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 15.2 Optimal PCB placement of JN5179-001-M10 and JN5179-001-M16 modules The JN5179-001-M10 and JN5179-001-M16 modules feature an optimised, low-cost, integrated, inverted F, printed PCB antenna. For size reduction no ground plane has been added between the antenna and the JN5179 chip. So an additional ground plane must be added on the main PCB beneath the module in order to ensure a good antenna efficiency. This ground plane can be a rectangle or a square with respect to 2 conditions: it must be as wide as the module (14.5 mm) and the area must be equal or greater than 610 mm2. See Figure 5 below for correct placement of the module. The antenna has a vertically polarised near omnidirectional radiation pattern and up to 1.8 dBi of peak gain. On the antenna side the ground plane of the module must be vertically aligned with the ground plane of the main PCB. The area around the antenna must be kept clear of conductors or other metal objects by a minimum distance of 20 mm except the mandatory ground plane as indicated above. This is true for all layers of the PCB and not just the top layer. Any conductive objects close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and high directivity in some directions. The Figure 5 show various possible scenarios. The top 3 scenarios are correct - the ground plane must be placed beneath the JN5179-001-M10 or M16 module but it does not protrude beyond the edge of the top layer ground plane on the module PCB. The bottom fours scenarios are incorrect – in the left-hand side there is ground plane underneath the antenna, in the middle-left example the ground planes of the main PCB and the module are not vertically aligned, in the middle-right there is insufficient clearance around the antenna, and in the right-hand example a battery’s metal casing is in the recommended ‘keep out’ area. Fig 5. PCB placement of the JN5179-001-M10 and JN5179-001-M16 modules
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 20 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 15.3 Reflow Profile For reflow soldering, it is recommended to follow the reflow profile in Figure 6 as a guide, as well as the paste manufacturer’s guidelines on peak flow temperature, soak times, time above liquid and ramp rates. Table 13. Recommended solder reflow profile Temperature range (°C) Target time range (s) from 25 to ~160 between 90 and ~130 from 160 to ~220 between 30 and ~60 from 220 to ~230 between 20 and ~50 from 230 to ~peak between 10 and ~20 from 25 to ~peak between 150 and ~260 15.4 Soldering paste and cleaning NXP does not recommend use of a solder paste that requires the module and PCB assembly to be cleaned (rinsed in water) for the following reasons: • Solder flux residues and water can be trapped by the PCB, can or components and result in short circuits NXP recommends use of a 'no clean' solder paste for all its module products. aaa-024461 250 Temperature (°C) 200 150 100 50 0 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 Time (seconds) Fig 6. Guide for reflow profile of JN5179-001-M1x
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 21 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 16. Package outline (14.5) (2.27) (1.71) (20.50) (10.16) (1.27) (2.17) (2.17) (10.16) aaa-023973 Fig 8. Package outline JN5179-001-M13 (14.5) (20.50) (10.16) (1.27) (2.17) (2.17) (10.16) aaa-023972 Fig 7. Package outline JN5179-001-M10
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 22 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules (14.5) (2.27) (1.71) (20.50) (10.16) (1.27) (2.17) (2.17) (10.16) aaa-023974 Fig 9. Package outline JN5179-001-M16
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 23 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 17. Abbreviations Table 14. Abbreviations Acronym Description AC Alternating Current ADC Analog-to-Digital Converter API Application Program Interface CE Conformity European CPU Central Processing Unit DC Direct Current DIO Digital Input Output EEPROM Electrically-Erasable Programmable Read-Only Memory FCC Federal Communication Commission ID IDentification IO Input Output ISM Industrial, Scientific and Medical radio bands JTAG Joint Test Action Group LNA Low Noise Amplifier MAC Media Access Control OEM Original Equipment Manufacturer PC Pulse Counter PCB Printed-Circuit Board PER Packet Error Rate PRO PROtocol PWM Pulse-Width Modulation TX Transmit R&TTE Radio And Terminal Telecommunication Equipment RAM Random Access Memory RC Resistance-Capacitance RF Radio Frequency RISC Reduced Instruction Set Computing RoHS Restriction of Hazardous Substance RSSI Received Signal Strength Indicator RX Receive UART Universal Asynchronous Receiver Transmitter
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 24 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 18. References [1] IEEE Std 802.15.4-2003 — IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs). [2] JN5179 — JN5179 wireless microcontroller data sheet. [3] Wireless Connectivity — http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRE LESS-CONNECTIVITY [4] Part 15 of the FCC Rules — http://www.ecfr.gov/cgi-bin/text-idx?SID=d01e00935bfcb0d53b914e7c8e63f383&no de=47:1.0.1.1.16&rgn=div5
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 25 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 19. Legal information 19.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 19.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 19.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP Semiconductors N.V.
UM11018 NXP Semiconductors UM11018 User manual All information provided in this document is subject to legal disclaimers. Rev. 1.0 — 15 September 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 26 of 27 ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 20. Tables Table 1. Marking code ...................................................... 6 Table 2. Pin description .................................................... 8 Table 3. Peripherals description ..................................... 12 Table 4. Limiting values.................................................. 13 Table 5. Operating conditions ........................................ 13 Table 6. Active processing ............................................. 14 Table 7. Sleep mode ...................................................... 14 Table 8. Deep sleep mode ............................................. 14 Table 9. RF port characteristics ..................................... 14 Table 10. Radio transceiver characteristics: +25 °C ......... 15 Table 11. Antennas description (R&TTE) ......................... 17 Table 12. Recommended solder reflow profile .................. 20 Table 13. Abbreviations .................................................... 23 21. Figures Fig 1. UM11018 package marking (top view) ................... 6 Fig 2. Block diagram ........................................................ 7 Fig 3. Pin configuration.................................................... 8 Fig 4. Footprint information for reflow soldering of modules 18 Fig 5. PCB placement of the JN5179-001-M10 and JN5179-001-M16 modules................................... 19 Fig 6. Guide for reflow profile of JN5179-001-M1x ......... 20 Fig 7. Package outline JN5179-001-M10 ....................... 21 Fig 8. Package outline JN5179-001-M13 ....................... 21 Fig 9. Package outline JN5179-001-M16 ....................... 22
UM11018 NXP Semiconductors ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 3 20 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 1.1 Regulatory Approvals . . . . . . . . . . . . . . . . . . . . 3 21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 3 2.1 Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 Features: modules . . . . . . . . . . . . . . . . . . . . . . 4 2.3 Features: microcontroller . . . . . . . . . . . . . . . . . 4 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 8 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Functional description . . . . . . . . . . . . . . . . . . 12 8.1 JN5179 single chip wireless microcontroller. . 12 8.2 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8.3 JN5179-001-M16 Antenna diversity . . . . . . . . 13 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 10 Recommended operating conditions. . . . . . . 13 11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 14 11.1 DC current . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 11.2 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 14 11.2.1 Radio transceiver . . . . . . . . . . . . . . . . . . . . . . 14 12 Federal Communication Commission Statement 15 12.1 FCC end product labelling ................................ 16 12.2 European R&TTE Directive 1999/5/EC statement 17 13 Industry Canada statement ............................... 17 13.1 Industry Canada end product labelling.............. 18 14 Footprint and PCB placement .......................... 18 14.1 Footprint information for reflow soldering .......... 18 14.2 Optimal PCB placement of JN5179-001-M10 and JN5179-001-M16 modules ............................... 19 14.3 Reflow Profile ................................................... 20 14.4 Soldering paste and cleaning ............................ 20 15 Package outline ................................................. 21 16 Abbreviations ..................................................... 23 17 References ......................................................... 24 18 Legal information............................................... 25 18.1 Definitions ......................................................... 25 18.2 Disclaimers ....................................................... 25 18.3 Trademarks ...................................................... 25 19 Tables .................................................................... 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 September 2016 Document identifier: UM11018

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