Neoway Technology 123X GPRS Module User Manual

Shenzhen Neoway Technology Co., Ltd GPRS Module

User Manual

M660 GPRS Module User Manual Shenzhen Neoway Technology Co.,Ltd. Enjoy your wireless life
Shenzhen Neoway Technology Co., Ltd. Page 2 of 32 Copyright Copyright © 2008 Neoway Technology All rights reserved. is a trade mark of Shenzhen Neoway Technology Co., Ltd. Notice This document is intended for the customer engineers. This document is subject to change without any notice. No responsibility is assumed by Neoway Technology for the use of this document. Neoway Technology always provides the best supports. For pricing, ordering information and delivery please contact: Sales@neoway.com.cn For any technical support requests please contact: Support@neoway.com.cn For further information please visit: http://www.neoway.com.cn
Shenzhen Neoway Technology Co., Ltd. Page 3 of 32 Contents 1. Introduction ................................................................................................................................ 6 2. General Description ................................................................................................................... 6 3. Simplified Block Diagram ......................................................................................................... 6 4. Key Features ............................................................................................................................... 7 5. Product Specifications ............................................................................................................... 8 5.1 Variants ................................................................................................................................. 8 5.2 Dimension & Package ........................................................................................................... 8 5.3 Pin Description ...................................................................................................................... 9 5.4 PCB foot print ..................................................................................................................... 10 6. Application Interface ............................................................................................................... 11 6.1 Power Supply Requirements ............................................................................................... 11 6.1.1 Power Supply Basic Design Rules ........................................................................ 11 6.1.2 Extended Design Rules for Power Supply ............................................................ 13 6.2 ON/OFF Procedure ............................................................................................................. 15 6.2.1 Turning on the module .......................................................................................... 16 6.2.2 Turning off the module ......................................................................................... 16 6.2.3 RESET .................................................................................................................. 17 6.2.4 VCCIO .................................................................................................................. 17 6.3 UART .................................................................................................................................. 18 6.3.1 Basic Descriptions of UART ................................................................................. 18 6.3.2 Level Translators for UART .................................................................................. 18 6.4 Sleep mode .......................................................................................................................... 20 6.4.1 DTR ....................................................................................................................... 20 6.4.2 RING ..................................................................................................................... 21 6.5 SIM interface ...................................................................................................................... 21 6.6 Running LED Indicator ....................................................................................................... 23 6.7 Audio Interface ................................................................................................................... 24 6.8 Antenna Interface ................................................................................................................ 26 7. Mounting the Module onto the Application Board ............................................................... 28 8. Package ..................................................................................................................................... 29
Shenzhen Neoway Technology Co., Ltd. Page 4 of 32 9. Terms and Abbreviations ......................................................................................................... 29
Shenzhen Neoway Technology Co., Ltd. Page 5 of 32 Document History Revision History Version Remarks Date Issue V3.0 Modified Version 2013-9 V3.1 Change receive sensitivity index 2013-10 V3.2 Change 24pin definition 2013-11
Shenzhen Neoway Technology Co., Ltd. Page 6 of 32 1. Introduction This document describes the hardware features of M660, and guides for the relevant application design. 2. General Description With the ultra-compact design, M660 is intended to be used in a wide range of applications, including industrial and consumer devices. M660 is a GSM/GPRS module with EDGE of downlink. It features with voice, SMS, and data services. 3. Simplified Block Diagram Figure 1 M660 Block Diagram
Shenzhen Neoway Technology Co., Ltd. Page 7 of 32 4. Key Features Table1 M660 Key Features Feature Implementation Frequency Bands 850/900/1800/1900 MHz Quad-band Compliant with GSM/GPRS Phase2/2+ Sensitivity < -107dBm Transmit Power 850/900 Class4(2W) 1800/1900 Class1(1W) AT GSM07.07 Extended AT commands Audio CODEC FR、EFR、HR、AMR SMS TEXT/PDU Point-to-point / cell broadcast DATA GPRS:Class 12 Supplementary Service Call forwarding（CFB, CFNA, CFU） Call waiting & Call hold Multiparty call USSD CPU ARM7-EJ@260MHz, 32Mbits SRAM, 16~32Mbits Nor Flash Open Resources 16Mbits RAM, 0.3~16Mbits Flash Interfaces UART, SIM Operational Temperature -40℃～+85℃ Operating Voltage 3.5V～4.3V（typical 3.9V） Peak Current Max 1.8A Power Consumption < 2mA @DRX5 (Sleep mode)
Shenzhen Neoway Technology Co., Ltd. Page 8 of 32 5. Product Specifications 5.1 Variants Variants Frequencies Packages M660-QUAD-AA0/A00 850/900/1800/1900MHz Quad-band 28 Pin LCC 5.2 Dimension & Package Physical Characteristics Dimensions 22mm*18.4mm*2.7mm (Length*Width*Thickness) Weight 2.2 g Package 28 Pin LCC Figure 2 M660 Sketch
Shenzhen Neoway Technology Co., Ltd. Page 9 of 32 5.3 Pin Description Table2 M660 pin definition M660 Pin Signal I/O Function Note 1 VSIM PWR SIM supply voltage 1.8/3.0V compatible. 2 SIM_CLK DO SIM clock 3 SIM_DATA DIO SIM data 5KΩ internal pull-up 4 GND PWR GND 5 SIM_RST DO SIM reset Prompted by module 6 MICP AI MIC+ Vi ≤ 200mVpp 7 MICN AI MIC- Vi ≤ 200mVpp 8 EAR-L AO Earpiece output L Signal Ended Output. Can drive a 16Ω/32Ω earpiece directly. 9 EAR-R AO Earpiece output R Signal Ended Output. Can drive a 16Ω/32Ω earpiece directly. 10 DTR DI Data Terminal Ready Can be used to control sleep mode. 11 GND PWR GND 12 RING DO Output for RING indicator Can be used to indicate an incoming voice call or SMS. 13 VCCIO PWR 2.8V power output Can be used to power the level translators. Imax=5mA 14 Reserved Reserved 15 Reserved Reserved 16 URXD1 DI Serial data input of module V.24: TXD 17 UTXD1 DO Serial data output of module V.24: RXD 18 GND PWR GND 19 RESET DI Reset input Active low > 60mS 20 BACK_LIGHT DO Status LED 2.8V/4mA output Can drive a LED directly 21 ON/OFF DI Switch the module on/off Low level pulse triggered 22 ANT I/O Antenna interface A 50ohm antenna expected 23 GND PWR GND 24 Reserved Reserved 25 GND PWR GND 26 VBAT PWR Main power supply 3.5V~4.3V (typical 3.9V) 27 VBAT PWR Main power supply 28 GND PWR GND
Shenzhen Neoway Technology Co., Ltd. Page 10 of 32 5.4 PCB foot print Recommended foot print: Figure 3 Recommended foot print of M660 (all dimensions in millimeters) Note：  Every other pitch not specified is 2.0mm.  The circle on the top-right with a 1.3mm radius, defines a keep-out region, under which any copper or wire is inhibited, due to the RF test point here needs to be surrounded by restricted area filled with air.  There may be some masks on the bottom of the module PCB, created by hollowing the solder resist layer, causing reveal of copper. To avoid short circuits, it is recommended to cover the application PCB with a silkscreen block at the area under the module, but excluding soldering area.
Shenzhen Neoway Technology Co., Ltd. Page 11 of 32 6. Application Interface 6.1 Power Supply Requirements Table3 Power Supply and ON/OFF Control Signal I/O Function Note VCCIO PWR 2.8V power output Can be used to power the level translators. Imax=5mA RESET DI Reset input Active low > 60mS. ON/OFF DI Switch the module on/off Low level pulse triggered. VBAT PWR Main Power Supply 3.5V~4.3V(typical 3.9V) 6.1.1 Power Supply Basic Design Rules VBAT is the main power supply for internal base band and radio PA of the module, in a range of 3.5V-4.3V. A 3.9V voltage is preferable. The performance of power supply issued, is a critical path to module’s performance and stability. The GSM bursts can cause current peaks up to 1.8A, therefore large bypass capacitors are expected to reduce voltage drops during the bursts. The biggest current occurs when the received signal is very low. It’s very important to ensure that the voltage of supply rail never drops below 3.5V while any burst occurs. Figure 4 shows how the GSM bursts and voltage drops. Figure 5 shows how the capacitor helps to improve peak current performance.
Shenzhen Neoway Technology Co., Ltd. Page 12 of 32 Figure 4 Burst Caused Current Peaks and Voltage Drops Figure 5 Test Circuit and Peak Current Results may vary depending on the ESR of capacitors, and the impedance of power source.  A low ESR 1000uF aluminum capacitor for C1 can be selected. As an alternative, a 470uF tantalum capacitor is also suited. In case of Li-Ion cell battery used, 220uF or even 100uF tantalum capacitor may be applicable because of the battery’s low internal impedance and the ability to provide high transient current.  Use a low impedance power source, and keep the resistance of the power supply lines as low as possible.
Shenzhen Neoway Technology Co., Ltd. Page 13 of 32  The power source should be able to output an average current greater than 1A.  Some small capacitors, with values of 0.1uF, 100pF, 33pF, placed close to the module’s power pin, are very helpful to suppress high frequency disturbances.  The voltage range of power supply must never be exceeded. Over-voltage can even destroy the module permanently.  Ensure the trace for VBAT to be wide enough, in order to pass the current peaks without significant voltage drops. The width of 2mm is preferable. 6.1.2 Extended Design Rules for Power Supply 6.1.2.1 Power Control A controlled power supply is preferable if used in harsh conditions. RESET pin may be not functioning under strong disturbance. The output enable pin of LDO or DC/DC chipset could be used for emergency power control of the module, as shown in Figure 6. Figure 6 Using LDO’s enable pin for emergency power control The alternative way is to use a P-MOSFET to control the module’s power, as shown in Figure 7. The GPRS_EN signal is routed to host GPIO, controlling the ON/OFF of the P-MOSFET. The host can cut off and then switch on the power supply in case of abnormal conditions, such as no response from the module or the disconnection of GPRS.
Shenzhen Neoway Technology Co., Ltd. Page 14 of 32 Figure 7 Using PMOS for power control Q2 is for eliminating the need for a high enough voltage level of the host GPIO. In case that the GPIO can output a high voltage greater than VDD3V9 - |VGS(th)|, where VGS(th) is the Gate Threshold Voltage, Q2 is not needed. Reference components: Q1: IRML6401 Q2: MMBT3904 C4: 470uF tantalum capacitor rated at 6.3V; or 1000uF aluminum capacitor. It’s strongly recommended to place a TVS diode on VBAT to ground, in order to absorb the power surges subjected. The SMAJ5.0A from Vishay can be as a choice. 6.1.2.2 Power Separating As described in section 6.1.1, the GSM device works in burst mode generating voltage drops on power supply. And furthermore this results in a 217Hz TDD noise through power (One of the way generating noise. Another way is through RF radiation). Analog parts, especially the audio circuits, are subjected to this noise, known as a “buzz noise” in GSM systems. To prevent other parts from being affected, it’s better to use separated power supplies. The module shall be supplied by an independent power, like a DC/DC or LDO. The inductor used in Reference Design (b), should be a power inductor and have a very low
Shenzhen Neoway Technology Co., Ltd. Page 15 of 32 resistance. The value of 10uH, with average current ability>1.2A and low DC resistance, is recommended. Figure 8 Using separated power supply for module Never use a diode to make the drop voltage between a higher input and module power. It will obviously decrease the module performances, or result in unexpected restarts, due to the forward voltage of diode will vary greatly in different temperature and current. 6.1.2.3 EMC Considerations for Power Supply Place transient overvoltage protection components like TVS diode on power supply, to absorb the power surges. SMAJ5.0A could be a choice. 6.1.2.4 Power-on Sequence Prior to turning on the module, turn on the host MCU and finish the UART initialization. Otherwise conflictions may occur during initialization, due to unstable conditions. 6.2 ON/OFF Procedure ON/OFF is a low level pulse active input, used to turn on or off the module.
Shenzhen Neoway Technology Co., Ltd. Page 16 of 32 Figure 9 Turning on /off the module using ON/OFF 6.2.1 Turning on the module While the module is off, drive the ON/OFF pin to ground for at least 600mS (800mS is recommended) and then release, the module will start. An unsolicited message will be sent to host through AT port (“+EIND: 1”), indicating the powering up of the module and the AT commands can respond. It’s recommended to drive the ON/OFF to low before applying the VBAT to module. 300mS (400mS is recommended) later from the VBAT applied, release the ON/OFF. Therefore the module starts up. The simplest way to power on the module, is to directly tie the ON/OFF to ground, issuing to an auto-power-on feature. After the module is operating, keep ON/OFF being high level. 6.2.2 Turning off the module While the module is on, drive the ON/OFF pin to ground for at least 500mS and then release, the module will try to detach to network and normally 1 second later it will shut down. Another approach to turn off the module is with AT command. Figure 10 shows a reference circuits for ON/OFF control with inverted control logic.
Shenzhen Neoway Technology Co., Ltd. Page 17 of 32 Figure 10 Reference circuit for ON/OFF control Reference Components: Q1: MMBT3904, or to use digital transistor with bias resistors built in, like DTC123/114 The combination of R3 and R4, should limit the high voltage of ON/OFF less than 3.0V. Note:  If the host itself is not initialized before turning on the module, some abnormal conditions on IO or UART may affect the power on procedure.  The better way to rescue the module from abnormal condition, is to apply a power OFF-ON procedure, rather than using the ON/OFF control signal. In fact ON/OFF signal is software-dependent. 6.2.3 RESET Pull the RESET signal to low level for at least 60mS to reset the module. A pull-up resistor is internally included. Reset pin can be left open if not used. 6.2.4 VCCIO VCCIO is provided to power the level translators, with a 2.8V / 5mA output. VCCIO can also be used to monitor the on/off state of module. It outputs 2.8V high level while the module is on, and low level while the module is off.
Shenzhen Neoway Technology Co., Ltd. Page 18 of 32 6.3 UART 6.3.1 Basic Descriptions of UART Table4 UART Signal I/O Function Note URXD1 DI Serial input of module UTXD1 DO Serial output of module DTR DI Signal for controlling sleep mode RING DO Ringing output UART1 is for AT commands, data sending/receiving, firmware updating, etc. As a DCE device, the module is connected to DTE as shown in Figure 11. Supported baud rates are 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400bps, and the default is 115200. Figure 11 Connection between DCE (module) and DTE The UART of M660 works at 2.8V CMOS logic level. The voltages for input high level should not exceed 3.0V. 6.3.2 Level Translators for UART If the UART is interfacing with a MCU that has 3.3V logic levels, resistors should be connected in series with the signals.
Shenzhen Neoway Technology Co., Ltd. Page 19 of 32 Figure 12 Interfacing with 3.3V logic levels of MCU If the UART is interfacing with a MCU that has 5V logic levels, general level translators are required, for both inputs and outputs. As shown in Figure 13. Figure 13 Interfacing with 5V logic levels of MCU Reference components: R2: 2K-10K. The higher rate the UART works at, the smaller value used R3: 4.7K-10K. The higher rate the UART works at, the smaller value used Q1: MMBT3904 or MMBT2222. High-speed transistors preferred. Used for 5V logic -> 2.8V logic: While this circuit used between MCU TXD and module URXD1, the INPUT signal is connected to MCU TXD, and OUTPUT connected to module URXD1. VCC_IN powered from 5V and VCC_OUT powered from 2.8V (module’s VCCIO can be used). This applies to DTR control as well. Used for 2.8V logic -> 5V logic: It can be used between module UTXD1 and MCU RXD as well, with INPUT connected to module UTXD1, and OUTPUT connected to MCU RXD. VCC_IN powered from 2.8V (module’s VCCIO) and VCC_OUT powered from 5V. This applies to RING signal as well.
Shenzhen Neoway Technology Co., Ltd. Page 20 of 32 Note: Avoid sparks and glitches on UART signals while the module is in a turning on procedure. Avoid sending any data to UART during the beginning of 2 seconds after the module being turned on. 6.4 Sleep mode 6.4.1 DTR Generally DTR is used for sleep mode control. For details, see AT commands manual. Based on the setting of the selected mode, pulling DTR low will bring the module into relevant power saving mode. Working in this mode, the power consumption is around 2mA, depending on the DRX setting of network. In sleep mode, the module can also respond to the incoming call, SMS, and GPRS data. The host MCU can also control the module to exit sleep mode by controlling DTR. The controlling of sleep mode: 1) Keep DTR high in normal working mode. Activate the sleep mode by using the AT command AT+ENPWRSAVE=1. 2) Pull DTR low, the module will enter sleep mode, but only after process and pending data finished. 3) UART is not available in sleep mode. 4) In sleep mode, the module can be woken up by the events of incoming voice call, received data, or SMS. Meanwhile the module will send out the unsolicited messages by the interface of RING or UART. Upon receipt of the unsolicited messages, the host MCU should pull DTR high firstly, otherwise the module will resume sleep mode shortly. And then the host MCU can process the voice call, received data, or SMS. After processing is finished, pull DTR low again to put the module into sleep mode.
Shenzhen Neoway Technology Co., Ltd. Page 21 of 32 5) Pull DTR high, the module will exit from sleep mode actively, and furthermore enable the UART. Thus the voice call, received data, or SMS can be processed through UART. After processing finished pull it low again, to take the module back to sleep mode. 6.4.2 RING 1) Once the incoming voice call, the module sends out “ring” message through UART and meanwhile outputs 250mS low pulses at 4S period on RING signal. See Figure 14. Figure 14 RING indicator for incoming call 2) Upon receipt of SMS, the module outputs one 600mS low pulse. See Figure 15. Figure 15 RING Indicator for SMS 6.5 SIM interface Table5 SIM Interface Signal I/O Function Note VSIM PWR SIM supply voltage 1.8/3.0V SIM_CLK DO SIM clock SIM_RST DO SIM reset SIM_DATA DIO SIM data Internal pull up
Shenzhen Neoway Technology Co., Ltd. Page 22 of 32 Figure 16a Reference design of SIM interface Pin1=VCC, Pin2=RST, Pin3=CLK, Pin4=GND, Pin5=VPP, Pin6=DATA Figure 16b a sample of SIM card socket Figure 16c the recommended ESD diode array M660 SIM interface is 3V/1.8V compatible. VSIM is for SIM power and can supply a 30mA current. SIM_DATA is internally pulled up with a 5KΩ resistor. External pull-up resistor is not needed. SIM_CLK can work at several frequencies, but at 3.25MHz typically. ESD protectors, such as ESD diodes or ESD Varistors, are recommended on the SIM signals, especially in automotive electronics or other applications with badly ESD. The total equivalent capacitance on any SIM signal, include the junction capacitance of the ESD diode and the distributed capacitance of PCB trace, can’t be higher than 120pF. If the SIM card is installed in a closed case without human touch or ESD, 22~33pF MLCC capacitors can replace the ESD diodes for cost down. SIM card is sensitive to GSM TDD noise and RF interference. So, the rule is very important in the PCB design, listed as the following.
Shenzhen Neoway Technology Co., Ltd. Page 23 of 32  The antenna should be installed a long distance away from the SIM card and SIM card traces, especially to the build-in antenna.  The PCB traces of SIM should be as short as possible and shielded with GND copper.  The ESD diodes or small capacitors should be closed to SIM card. Note: Small capacitors and the junction capacitance of the ESD diode are to avoid the interference from/to antenna, ensuring the correct SIM access and good RF performance. 6.6 Running LED Indicator Table6 Running Indicator Signal I/O Function Note BACK_LIGHT DO Running Status Can drive a LED directly The various blink behaviors of LED indicate different of module status. It can output a 4mA current and 2.8V voltage, therefore a LED can be directly connected to this pin with a resistor in series. For better luminance, drive the LED with a transistor instead, see Figure 17. Figure 17 LED Indicator
Shenzhen Neoway Technology Co., Ltd. Page 24 of 32 6.7 Audio Interface Table7 Audio Interface Signal I/O Function Note MICP AI MIC+ input Vpp ≤ 200mV MICN AI MIC- input Vpp ≤ 200mV EAR-L AO Earpiece output L Can drive a 16Ω/32Ω earpiece directly EAR-R AO Earpiece output R Can drive a 16Ω/32Ω earpiece directly For reference audio interface see Figure 18. The peak-peak voltage routed to MIC+/MIC- should not exceed 200mV. AGC circuit is integrated inside the module. Electret microphone is suited. Figure 18 Reference design of microphone interface A bias voltage for microphone is provided through MICP and MICN, as shown in Figure 19. But if an amplifier is used between the microphone and module, capacitors like C1 and C2, should be placed between the outputs of amplifier and module, to block the bias voltage. For a peak-peak voltage greater than 200mV, an attenuation circuit comprised of R1-R4 should be used.
Shenzhen Neoway Technology Co., Ltd. Page 25 of 32 Figure 19 Reference design for MIC interface Figure 20 Reference design for Ear interface Figure 20 shows a reference design for earpiece interface. A 16Ω/32Ω earpiece can be directly driven by the module. To pass the low frequency audio, use large capacitors for C1 and C2. If an external amplifier is used for driving the speakers, 1uF~4.7uF coupling capacitors should be used to block the DC voltage, as shown in Figure 21.
Shenzhen Neoway Technology Co., Ltd. Page 26 of 32 Figure 21 Using capacitors to couple audio outputs As the description of TDD noise before, the GSM radio frequency is modulated at 217Hz. The 217Hz and its derivative frequency is well within audio band, therefore a TDD noise often affect the audio performance through power and air. Some small capacitors between 27pF-100pF and ferrite beads, placed on the audio path can attenuate TDD noise. For Suppressing the TDD noise, differential audio interface is preferable. The PCB trace of audio signal should be routed as differential line. In particular, the microphone interface is a pair of small signal, peak-peak voltage <200mV, must comply the rule of differential line. The microphone interface should be routed as short as possible. 6.8 Antenna Interface A 50Ω antenna is required. VSWR < 1.5. The antenna should be well matched to achieve best performance. It should be installed far away from high speed logic circuits, DC/DC power, or any other strong disturbing sources. ESD protection is built in module. For special ESD protection, a ESD diode can be placed close to the antenna. But ensure to use a low junction capacitance one. The junction capacitance should be less than 0.5pF, otherwise the RF signal will be attenuated. RCLAMP0521P from Semtech, or ESD5V3U1U from Infineon, can be used here. See Figure 22. The trace between the antenna pad of module and the antenna connector, should have a 50Ω characteristic impedance, and be as short as possible. The trace should be surrounded by ground copper. Place plenty of via holes to connect this ground copper to main ground plane, at the copper edge.
Shenzhen Neoway Technology Co., Ltd. Page 27 of 32 If the trace between the module and connector has to be longer, or built-in antenna is used, a π-type matching circuit should be needed, as shown in Figure 22. The types and values of C1, L1, and L2 should be verified by testing using network analyzer instrument. If the characteristic impedance is well matched, and VSWR requirement is met, just use a 0Ω resistor for C1 and leave L1, L2 un-installed. Avoid any other traces crossing the antenna trace on neighboring layer. Figure 22 Reference design for antenna interface Figure 23 Reference parameters for 50Ω trace on a 1.6mm double layer PCB
Shenzhen Neoway Technology Co., Ltd. Page 28 of 32 Figure 24 Reference layout for antenna interface 7. Mounting the Module onto the Application Board M660 is compatible with industrial standard reflow profile for lead-free SMT process. The reflow profile is process dependent, so the following recommendation is just a start point guideline:  Only one flow is supported.  Quality of the solder joint depends on the solder volume. Minimum of 0.15mm stencil thickness is recommended.  Use bigger aperture size of the stencil than actual pad size.  Use a low-residue, no-clean type solder paste. This GND Pad should be well routed to ground Antenna pad should be surrounded by ground Antenna trace should be surrounded by ground which is connected to main ground plane with plenty of via holes. The trace width and the space to ground should be decided by calculating of 50Ω impedance match.
Shenzhen Neoway Technology Co., Ltd. Page 29 of 32 8. Package M660 modules are packaged in sealed bags on delivery to guarantee a long shelf life. Package the modules again in case of opening for any reasons. If exposed in air for more than 48 hours at conditions not worse than 30°C/60% RH, a baking procedure should be done before SMT. Or, if the indication card shows humidity greater than 20%, the baking procedure is also required. The baking should last for at least 24 hours at 90℃. 9. Terms and Abbreviations ADC Analog-Digital Converter AGC Automatic Gain Control AMR Acknowledged multirate (speech coder) CSD Circuit Switched Data CPU Central Processing Unit DCE Data Communication Equipment DTE Data Terminal Equipment DTR Data Terminal Ready EFR Enhanced Full Rate EMC Electromagnetic Compatibility EMI Electro Magnetic Interference ESD Electronic Static Discharge FR Full Rate GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HR Half Rate IC Integrated Circuit IMEI International Mobile Equipment Identity LED Light Emitting Diode PCB Printed Circuit Board RAM Random Access Memory RF Radio Frequency SIM Subscriber Identification Module SMS Short Message Service SMT Surface Mounted Technology SRAM Static Random Access Memory
Shenzhen Neoway Technology Co., Ltd. Page 30 of 32 TDMA Time Division Multiple Access UART Universal asynchronous receiver-transmitter Varistor Voltage Dependent Resistor VSWR Voltage Standing Wave Ratio
Shenzhen Neoway Technology Co., Ltd. Page 31 of 32 Warning Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try correct the interference by one or more of the following measures: - Reorient the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into and outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment. This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: 1) this device may not cause harmful interference, and 2) this device must accept any interference received, including interference that may cause undesired operation. Important announcement FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. IMPORTANT NOTE: This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module.
Shenzhen Neoway Technology Co., Ltd. Page 32 of 32 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT: In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed 2dBi in the cellular band and 2dBi in the PCS band. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded M660 Module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093.

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