Novatel Wireless GSM0408 GSM/ GPRS Transmitter Module User Manual Integration Guide
Novatel Wireless Inc. GSM/ GPRS Transmitter Module Integration Guide
Integration Guide
Integration Guide: GSM0408IG001 Enfora Enabler IIIG BGA Integration Guide Version: Draft Enfora Enabler IIIG BGA Modem Integration Guide Document Title: Enfora Enabler IIIG BGA Modem Integration Guide Version: 1.0x Date: 3/3/08 Status: Draft Document Control ID: GSM0408IG001 General All efforts have been made to ensure the accuracy of material provided in this document at the time of release. However, the items described in this document are subject to continuous development and improvement. All specifications are subject to change without notice and do not represent a commitment on the part of Enfora, Inc. Enfora, Inc. will not be responsible for any loss or damages incurred related to the use of information contained in this document. This product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Enfora, Inc. customers using, integrating, and/or selling this product for use in such applications do so at their own risk and agree to fully indemnify Enfora, Inc. for any damages resulting from illegal use or resale. Copyright Complying with all applicable copyright laws is the responsibility of the user. Without limiting the rights under copyright, no part of this document may be reproduced, stored in or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying, recording or otherwise), or for any purpose, without the express written permission of Enfora, Inc. Enfora may have patents, patent applications, trademarks, copyrights or other intellectual property rights covering subject matter in this document. Except as expressly provided in any written license agreement from Enfora, the furnishing of this document does not give you any license to these patents, trademarks, copyrights or other intellectual property. ©2002, 2003, 2004, 2005, 2006, 2007, 2008 Enfora, Inc. All rights reserved. Enabler and Spider are either registered trademarks or trademarks of Enfora, Inc. in the United States. GSM0408IG002 Version 1.00 – 12/07/2007 Enfora Enabler IIIG BGA Modem Integration Guide Table of Contents 1. SAFETY PRECAUTIONS .................................................................................................................. 1 1.1. 2. IMPORTANT SAFETY INFORMATION ..................................................................................................... 1 REGULATORY COMPLIANCE FCC ................................................................................................ 1 2.1. 2.2. 3. INTEGRATION CONSIDERATIONS AND INSTALLATION REQUIREMENTS ................................................... 1 DISCLAIMER ...................................................................................................................................... 3 MANUAL OVERVIEW ....................................................................................................................... 4 3.1. REVISION HISTORY ........................................................................................................................... 4 3.2. REFERENCE DOCUMENTS.................................................................................................................. 5 3.2.1. Enfora Enabler IIIG BGA Product Documentation .................................................................. 5 3.2.2. GSM Device Specifications ..................................................................................................... 6 3.2.3. US Government ....................................................................................................................... 6 3.2.3.1. 3.2.3.2. 3.2.4. 3.2.5. 3.2.6. 3.2.7. 3.2.8. 4. Federal Communications Commission (FCC) ................................................................................6 FCC Office of Engineering and Technology (OET) ........................................................................6 Industry Canada ...................................................................................................................... 6 Environmental Regulations ..................................................................................................... 6 Mechanical Specifications ....................................................................................................... 7 RF and EMI Specifications ...................................................................................................... 7 Joint Industry Standards .......................................................................................................... 7 INTRODUCTION ................................................................................................................................ 8 4.1. PRODUCT OVERVIEW ........................................................................................................................ 8 4.2. KEY FEATURES OF THE ENABLER IIIG BGA MODULE ......................................................................... 8 4.3. PROVIDING MULTI-BAND OPERATION ............................................................................................... 10 4.4. WIRELESS DATA APPLICATION POSSIBILITIES ................................................................................... 10 4.5. SUMMARY OF FEATURES FOR THE ENABLER IIIG BGA MODULE ....................................................... 11 4.6. LAYOUT GUIDELINES FOR THE ENABLER IIIG BGA ........................................................................... 13 4.6.1. Placement.............................................................................................................................. 13 4.6.2. Ground Plane ........................................................................................................................ 14 4.6.3. Thermal Relief ....................................................................................................................... 15 4.6.4. Antenna and RF Signal Trace ............................................................................................... 15 4.6.5. Vbat Input .............................................................................................................................. 16 4.6.6. I/O Routing and Fanout ......................................................................................................... 16 4.6.7. Audio Reference Design ....................................................................................................... 18 4.6.7.1. 4.6.7.2. 4.7. 5. Audio Schematic ..........................................................................................................................18 Audio Layout ................................................................................................................................19 BGA HANDLING AND SOLDERING GUIDELINES.................................................................................. 20 TECHNICAL SPECIFICATIONS ..................................................................................................... 21 5.1. ENABLER IIIG BGA MODULE BLOCK DIAGRAM................................................................................. 21 5.2. DETAILED PRODUCT SPECIFICATIONS .............................................................................................. 22 5.3. OPERATING POWER ........................................................................................................................ 23 5.3.1. Typical Input Current ............................................................................................................. 23 5.3.2. GSM Transmit Power ............................................................................................................ 23 5.3.3. GSM Receiver Sensitivity ...................................................................................................... 24 5.4. PHYSICAL INTERFACES .................................................................................................................... 24 5.4.1. Module ................................................................................................................................... 24 5.4.2. Host PCB Footprint ............................................................................................................... 24 5.5. ELECTRICAL CONNECTIONS ............................................................................................................. 25 5.5.1. BGA Map ...............................................................................................................................30 5.6. CIRCUIT PROTECTION ..................................................................................................................... 31 5.7. PAD SIGNAL DESCRIPTIONS AND FUNCTIONS ................................................................................... 32 GSM0408IG002 Version 1.00 – 12/07/2007 Enfora Enabler IIIG BGA Modem Integration Guide 5.7.1. 5.7.2. 5.7.3. 5.7.4. 5.7.5. 5.7.6. 5.7.7. 5.7.8. 5.7.9. 5.7.10. 5.7.11. 5.7.12. 5.7.13. 5.7.14. 5.7.15. 5.7.16. 5.7.17. 5.7.18. 5.7.19. 5.7.20. 5.7.21. 5.7.22. Module Power (Pads C1, C2, D1, D2, E1, E2) ..................................................................... 32 Antenna (Pad A1) .................................................................................................................. 33 Reset Signal (Pad F6, also known as ON_\OFF) ................................................................. 33 Power Control (Pad K9) (PWR_CTL) ................................................................................... 34 Level Translation Reference Power (Pad G5) ...................................................................... 37 USB (Pads J2, J3, K1, K2) .................................................................................................... 37 General Purpose Input/Output Interface ............................................................................... 37 RTC Sleep ............................................................................................................................. 39 Serial Interface ...................................................................................................................... 40 MCSI – Multi-Channel Serial Interface (Pads D13, D14, E13, E14) ................................. 41 VBACKUP Input (Pad G6) ................................................................................................. 42 32 kHz output (Pad A11) ................................................................................................... 43 Analog-To-Digital Input (Pad K3) ....................................................................................... 43 Handset Microphone Input (Pads K4, L4) ......................................................................... 43 Handset Microphone Bias Output (Pad J4) ....................................................................... 44 Handset Speaker Output (Pads M4, M5) .......................................................................... 44 Headset Microphone Input (Pad M2) ................................................................................. 45 Headset Microphone Bias Output (Pad J5) ....................................................................... 45 Headset Speaker Output Left & Right (Pads M3, L3) ....................................................... 46 Headset Output Common Mode (Pad M6) ........................................................................ 46 Headset Detect (Pad H4)................................................................................................... 47 Remote Subscriber Identity Module (SIM) (Pads A7, A9, B7, B8, H5).............................. 47 5.7.22.1. 6. GSM/GPRS MODES OF OPERATION ........................................................................................... 50 6.1. 6.2. 6.3. 6.4. 7. ENABLING THE TRANSMISSION MODES FOR THE GSM/GPRS SERVICES ........................................... 50 VOICE COMMUNICATION .................................................................................................................. 50 CIRCUIT-SWITCHED DATA ............................................................................................................... 50 SMS: SHORT MESSAGE SERVICES .................................................................................................. 51 SIM OPERATION............................................................................................................................. 52 7.1. 7.2. 7.3. 7.4. 8. Remote SIM Component Information ...........................................................................................49 PROVISIONING THE SIM .................................................................................................................. 52 GSM SERVICES SUPPORTED BY THE ENABLER IIIG BGA MODULE ................................................... 52 GPRS SERVICES SUPPORTED BY THE ENABLER IIIG BGA MODULE ................................................. 52 SELECTING THE GSM MODES OF OPERATION .................................................................................. 52 SOFTWARE INTERFACE ............................................................................................................... 54 8.1. SOFTWARE INTERFACE .................................................................................................................... 54 8.2. ENFORA AT COMMAND SET ............................................................................................................ 55 8.3. ENFORA PACKET APPLICATION PROGRAMMING INTERFACE ............................................................... 55 8.3.1. API Architecture..................................................................................................................... 55 8.4. SETUP AND INITIALIZATION............................................................................................................... 55 8.4.1. General Setup ....................................................................................................................... 55 8.4.2. HyperTerminal Configuration for the Enabler IIIG BGA module ........................................... 55 8.4.3. Initialization (AT Command Interface) ................................................................................... 56 8.4.4. Initial Response to the AT Command ................................................................................... 57 8.4.5. Sending an Initialization String to the Enabler IIIG BGA Module .......................................... 57 8.4.6. Setting Up the Communication Mode for the Enabler IIIG BGA Module .............................. 58 8.4.7. Querying the Status of the Enabler IIIG BGA Module ........................................................... 58 8.4.8. Setting Module Reporting Parameters for GSM and GPRS ................................................. 58 8.5. GSM/SMS EXAMPLES .................................................................................................................... 58 8.5.1. Initialize the Enabler IIIG BGA Module to Send and Receive SMS Text Messages............. 58 8.5.2. Managing SMS Messages .................................................................................................... 58 8.5.3. Data Call Configuration ......................................................................................................... 58 8.5.4. Voice Call Configuration ........................................................................................................ 58 GSM0408IG002 Version 1.00 – 12/07/2007 Enfora Enabler IIIG BGA Modem Integration Guide 8.6. GPRS PACKET EXAMPLES .............................................................................................................. 58 8.6.1. GPRS ATTACH and ACTIVATE ........................................................................................... 58 8.6.2. Windows PPP Setup ............................................................................................................. 59 9. INTEGRATION AND TESTING ....................................................................................................... 60 9.1. 10. INTEGRATING THE ENFORA ENABLER IIIG BGA MODULE .................................................................. 60 APPENDIX A - LIMITED WARRANTY........................................................................................... 62 10.1. 10.2. 10.3. 10.4. 11. SCOPE ........................................................................................................................................ 62 HARDWARE ................................................................................................................................. 62 SOFTWARE ................................................................................................................................. 62 OTHER CONSIDERATIONS ............................................................................................................ 63 APPENDIX B - REGULATIONS AND COMPLIANCE.................................................................... 64 11.1. GCF/PTCRB APPROVAL (FORMERLY FTA) ................................................................................. 64 11.2. ELECTROMAGNETIC COMPATIBILITY (EMC) AND SAFETY REQUIREMENTS ...................................... 64 11.3. EMC/SAFETY REQUIREMENTS FOR THE USA ............................................................................... 64 11.4. HUMAN EXPOSURE COMPLIANCE STATEMENT .............................................................................. 65 11.5. COMPLIANCE WITH FCC REGULATIONS ........................................................................................ 65 11.6. UNINTENTIONAL RADIATORS, PART 15 ......................................................................................... 65 11.7. INTENTIONAL RADIATORS, PART 22 & 24 ..................................................................................... 66 11.8. INSTRUCTIONS TO THE ORIGINAL EQUIPMENT MANUFACTURER (OEM) .......................................... 66 11.8.1. OEM Responsibilities for All Products Containing the Enabler IIIG BGA module ............. 67 11.8.2. Specific OEM Responsibilities for Portable Products and Applications ............................ 69 11.8.3. Specific OEM Responsibilities for Mobile Products and Applications ............................... 69 11.8.4. Specific OEM Responsibilities for Fixed Products and Applications ................................. 69 11.9. EMC/SAFETY REQUIREMENTS FOR THE COUNTRIES OF THE EUROPEAN UNION (EU) ..................... 70 11.10. EMC/SAFETY REQUIREMENTS FOR OTHER COUNTRIES ................................................................ 70 12. APPENDIX C - GLOSSARY AND ACRONYMS ............................................................................. 71 13. APPENDIX D – TABLES AND FIGURES ....................................................................................... 73 14. APPENDIX E - CONTACTING ENFORA ........................................................................................ 74 GSM0408IG002 Version 1.00 – 12/07/2007 Enfora Enabler IIIG BGA Modem Integration Guide 1. Safety Precautions 1.1. Important Safety Information The following information applies to the devices described in this manual. Always observe all standard and accepted safety precautions and guidelines when handling any electrical device. • Save this manual: it contains important safety information and operating instructions. • Do not expose the Enfora Enabler IIIG BGA product to open flames. • Ensure that liquids do not spill onto the device. • Do not attempt to disassemble the product: Doing so will void the warranty. This product does not contain consumer-serviceable components. 2. Regulatory Compliance FCC 2.1. Integration Considerations and Installation Requirements The Enabler IIIG BGA modem is designed for use in a variety of host units, "enabling" the host platform to perform wireless data communications. However, there are certain criteria relative to integrating the modem into a host platform such as a PC, laptop, handheld or PocketPC®, monitor and control unit, etc. that must be considered to ensure continued compliance with FCC compliance requirements. • Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. In order to use the Enabler IIIG BGA modem without additional FCC certification approvals, the installation must meet the following conditions: • Maximum RF output power and antenna gain to meet Maximum Permissible Exposure Requirements: GSM850 mode: Power at antenna port is +33 dBm, the maximum gain is 1.4 dBi. GSM1900 mode: Power at antenna port is 30 dBm, the maximum gain is 7.0 dBi. • If used in a "portable" application such as a handheld or body worn device with the antenna less than 20 cm (7.9 in.) from the human body when the device is operating, then the integrator is responsible for passing additional "as installed" testing and the device will require its own FCC ID: i. SAR (Specific Absorption Rate) testing, with results submitted to the FCC for approval prior to selling the integrated unit. If unable to meet SAR requirements, then the host unit must be restricted to "mobile" use (see below). ii. Unintentional emissions, FCC Part 15; results do not have to be submitted to the FCC unless requested, although the test provides substantiation for required labeling (see below). iii. ERP and EIRP measurements for FCC Parts 22 and 24, alternatively a full retest on FCC Parts 22 and 24 can be performed GSM0408IG001 Page 1 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide • If used in a "mobile" application where the antenna is normally separated at least 20 cm (7.9 in) from the human body during device operation, then an appropriate warning label must be placed on the host unit adjacent to the antenna. The label should contain a statement such as the following: WARNING RF exposure. Keep at least 20 cm (7.9 in) separation distance from the antenna and the human body. • Host unit user manuals and other documentation must also include appropriate caution and warning statements and information. • If the FCCID for the modem is not visible when installed in the host platform, then a permanently attached or marked label must be displayed on the host unit referring to the enclosed modem. For example, the label should contain wording such as: Contains GSM/GPRS modem transmitter module FCC ID: MIVGSM0408 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. OR Contains FCC ID: MIVGSM0408 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. • Any antenna used with the modem must be approved by the FCC or as a Class II Permissive Change (including MPEL or SAR data as applicable). The "professional installation" provision of FCC Part 15.203 does not apply. GSM0408IG001 Page 2 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide • The transmitter and antenna must not be co-located or operating in conjunction with any other antenna or transmitter. Violation of this would allow a user to plug another transmitter in to the product and potentially create an RF exposure condition. WARNING The transmitter and antenna must not be collocated or operating in conjunction with any other antenna or transmitter. Failure to observe this warning could produce an RF exposure condition. 2.2. Disclaimer The information and instructions contained within this publication comply with all FCC, GCF, PTCRB, R&TTE, IMEI and other applicable codes that are in effect at the time of publication. Enfora disclaims all responsibility for any act or omissions, or for breach of law, code or regulation, including local or state codes, performed by a third party. Enfora strongly recommends that all installations, hookups, transmissions, etc., be performed by persons who are experienced in the fields of radio frequency technologies. Enfora acknowledges that the installation, setup and transmission guidelines contained within this publication are guidelines, and that each installation may have variables outside of the guidelines contained herein. Said variables must be taken into consideration when installing or using the product, and Enfora shall not be responsible for installations or transmissions that fall outside of the parameters set forth in this publication. Enfora shall not be liable for consequential or incidental damages, injury to any person or property, anticipated or lost profits, loss of time, or other losses incurred by Customer or any third party in connection with the installation of the Products or Customer's failure to comply with the information and instructions contained herein. The Enabler IIIG BGA platform is designed with features to support a robust connection. There are instances where the module performance is beyond the control of the intended design. Integrated designs that require 24 by 7 operation must implement power control via an external circuit or by implementing power management as specified within this design guide. GSM0408IG001 Page 3 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 3. Manual Overview This document describes the available hardware interface of the Enabler IIIG BGA modem (herein also noted as “modem” or “module”). The purpose of this document is to define the electrical, mechanical and software interfaces while providing detailed technical information in order to streamline the process of hardware and system integration. 3.1. Revision History Date 03/10/08 GSM0408IG001 Rev .01 Description Initial Release Draft Page 4 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 3.2. Reference Documents 3.2.1. Enfora Enabler IIIG BGA Product Documentation Manuals • • GSM0308AT001 - Enfora GSM/GPRS OEM Module AT Command Set Reference GSM0308UG001 - Enfora GSM-GPRS Family API Reference GSM0408IG001 Page 5 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 3.2.2. GSM Device Specifications • 3GPP TS 51010-1 (850, 900,1800,1900 MHz devices) To view the latest release, go to: http://www.3gpp.org/ftp/Specs/html-info/51010-1.htm 3.2.3. US Government 3.2.3.1. Federal Communications Commission (FCC) Internet: http://www.fcc.gov FCC Rules, Part 24 • • • 47 CFR Subpart E--Broadband PCS 47 CFR § 24.52, sections 1.1307(b), 2.1091, and 2.1093 • FCC Rules, Part 22 for GSM 850 • FCC Rules, Part 15 • FCC Rules, Part 2 • • Subpart J--Equipment Authorization Procedures Section 2.925 3.2.3.2. FCC Office of Engineering and Technology (OET) Internet: http://www.fcc.gov/oet 3.2.4. 3.2.5. • Bulletin Number 65 "Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields" • Supplement C "Additional Information for Evaluating Compliance of Mobile and Portable Devices with FCC Limits for Exposure to Radio Frequency Emissions" Industry Canada • RSS-132 • RSS-133 • ICES-003 Environmental Regulations • GSM0408IG001 National Environmental Policy Act (NEPA) of 1969 (Part 1, Subpart 1) Page 6 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 3.2.6. • • • • • • • 3.2.7. • • • • • 3.2.8. • Mechanical Specifications ASTM D999 ASTM D775 IEC 68-2-27 Bellcore Gr-63-CORE ETS 300 019-1-1 Class 1.2 ETS 300 019-1-2 Class 2.1 ETS 300 019-1-3 Class 3.1 RF and EMI Specifications ETSI Standards EN 61000-4-6 EN 61000-4-3 3GPP TS 51.010-1, Section 12.2 EN 55022 Class B Joint Industry Standards IPC/JEDEC J-STD-020C GSM0408IG001 Page 7 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 4. Introduction 4.1. Product Overview The Enfora Enabler IIIG BGA modem is a compact, wireless Ball Grid Array surface mount OEM module that utilizes the Global System for Mobile Communications (GSM) and GPRS (General Packet Radio Services) international communications standards to provide two-way wireless capabilities via GSM services. The module is a fully Type-approved GSM/GPRS device, enabling application-specific, two-way communication and control. The small size of the module allows it to be integrated easily into the application and packaging. 4.2. Key Features of the Enabler IIIG BGA Module The following table summarizes the main features of the module. Table 1 - Enabler IIIG BGA Key Features Interface Data, RF input/output interface Primary serial port USB port GPIO Audio Voice Command protocol Voltage backup Power Radio Features Reference clock ADC Remote Subscriber Identity Module (SIM) Electrical power Peak currents and average power consumption Frequency bands GSM/GPRS features supported Regulatory GSM0408IG001 Agency approvals Page 8 167 pad soldered BGA V.24 protocol, 1.8V levels, full 9-pin, UART implementation USB – Debug only (Enfora Use only) Up to 20 GPIO Some GPIO pins have dualpurpose functionality. Digital audio via MCSI port Supports four vocoder modes: full-rate (FR), enhanced full-rate (EFR), half-rate (HR), and adaptive multi-rate (AMR) Enfora Packet API, GSM AT command set Voltage backup pad available to maintain RTC, battery capable 32kHz output reference clock 1 ADC port 1.8/3 V compatible with SIM detect 3.3 to 4.5 Vdc (VBAT) Refer to the Operating Power table in the Technical Specifications for peak currents and average power consumption for various modes of operation. EGSM 900, GSM1800, GSM 850 and GSM 1900 capability. Provides for all GSM/GPRS authentication, encryption, and frequency hopping algorithms. GPRS Coding Schemes CS1-CS4 supported. Multi-Slot Class 10 (4RX/2TX, Max 5 Slots). • GCF Type Approval • PTCRB Type Approval • FCC Certification • RTTE • CE (European Community Certification) • IC (Industry Canada) Approval Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide GSM/GPRS Functionality Audio Features Outputs GSM0408IG001 • Mobile-originated and mobile-terminated SMS messages: up to 140 bytes or up to 160 GSM 7-bit ASCII characters. • Reception of Cell Broadcast Message • SMS Receipt acknowledgement • Circuit Switched Data (Transparent & Non-transparent up to 9.6 Kbps) • Voice (EFR, FR, HR) • Supports Unstructured Supplementary Service Data (USSD) • Multi-Slot Class 10 Supported (4Rx/2TX), (5 Slot Max) • • PBCCH/PCCCH Supported Handset Microphone biasing • Headset Microphone biasing • Headset Plug/Unplug detection • Headset Hook detection (call answer/end button on equipped Headset microphone device) • High output dynamic differential Earphone mode, using Headset outputs • Pop Noise attenuation circuitry implemented for all single-ended output stages • Handset microphone input (MICIN, MICIP pads) • • Headset microphone input (HSMIC pad) Handset earphone outputs (EARP, EARN pads) • Headset 32 Ω stereo outputs (HSOL, HSOR pads) Page 9 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 4.3. Providing Multi-Band Operation The Enfora Enabler IIIG BGA module provides 4 frequency bands for compatibility with worldwide frequency standards. 850/1900 frequency bands are primarily used in North and South America, while 900/1800 bands are used through out the world. 4.4. Wireless Data Application Possibilities A variety of applications can use the module for transmitting/receiving data/voice, such as: • Automated Meter Reading • Point of Sale Applications • E-mail and Internet access • Automated Vehicle Location (AVL) • Machine to Machine communication (M2M) • Telematics • Telemetry • Wireless Security • Smart Phones • Telemedicine GSM0408IG001 Page 10 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 4.5. Summary of Features for the Enabler IIIG BGA Module The following summarizes the main features of the module. Mechanical Dimensions................................... 28.0 mm x 24.0 mm x 2.50 mm Weight .......................................... 3.6g Packet Data Transfer: Protocol................................................................... GPRS Release 97 and 99 Coding Schemes .................................................... CS1-CS4 Multi-Slot Capability: (Demonstrated @MS10) .............. MS10 (4RX/2TX) (Max 5 Slots) Packet Channel Support......................................... PBCCH/PCCCH Circuit Switched Data Transfer: V110 ............................................. 300 bps/1200 bps/2400 bps/4800 bps/9600 bps/14,400 bps Non-Transparent .......................... 300 bps/1200 bps/2400 bps/4800 bps/9600 bps/14,400 bps Short Message Services: GSM SMS .................................... MO, MT, CB, Text and PDU Modes GPRS SMS .................................. MO, MT, CB, Text and PDU Modes Voice Capability: Speech Codec.............................. EFR, FR, HR, AMR GSM/GPRS Radio Performance Multi-Band: GSM0408 Radio Frequencies.............850 MHz, 900 MHz, 1800 MHz, and 1900 MHz Sensitivity ............................................<-106 dBm (Typical GPRS CS1) 850 & 900 MHz Transmit Power .........Class 4 (2 W) 1800 & 1900 MHz Transmit Power .....Class 1 (1 W) System Requirements: Host Interface ............................... Serial Interface DC Voltage ................................... 3.3 to 4.5 Vdc GSM0408IG001 Page 11 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Application Interface: Host Protocol................................ Enfora Packet API and AT Commands Internal Protocols ......................... UDP stack, TCP/IP stack, PPP, PAD, and CMUX Physical Interface......................... 1 serial (primary/Default, rate auto baud), 1 USB (debug) MCSI (PCM Audio only) Audio Interface.............................. Handset microphone input (MICIN, MICIP pads); Headset microphone input (HSMIC pad); Handset earphone outputs (EARP, EARN pads); Headset 32 Ω stereo outputs (HSOL, HSOR pads). SIM Interface: Remote SIM ................................. 1.8/3-Volt SIM Compatible Environmental: Compliant Operating Temp. ......... -20 °C to 60 °C (Fully GSM Spec Compliant) Operating Temperature................ -30 °C to 70 °C Storage Temperature ................... -40 °C to 85 °C Humidity ....................................... 5 to 95% non-condensing EMC: Emissions ..................................... FCC Parts 15,22 & 24, Class B 3GPP TS 51010-1, Section 12.2 EN 55022 Class B Operating Power (TYPICAL): GSM Operation GSM 850/900 (1 RX/1 TX, full power) ............. 250 mA average, 1.6 A peak GSM 1800 (1 RX/1 TX, full power) .................. 215 mA average, 1.3 A peak GSM 1900 (1 RX/1 TX, full power) .................. 204 mA average, 1.2 A peak Idle.................................................................... <2.5 mA Average in DFX 5 Shutdown .........................................................≈ 55 uA GPRS Operation Power EGSM 850/900 (4 RX/1 TX, full power) ........... 272 mA average, 1.6 A peak EGSM 850/900 (2 RX/2 TX, full power) ........... 420 mA average, 1.6 A peak GSM 1800 (4 RX/1 TX, full power) .................. 242 mA average, A peak GSM 1800 (2 RX/2 TX, full power) .................. 354 mA average, A peak GSM 1900 (4 RX/1 TX, full power) .................. 235 mA average, A peak GSM 1900 (2 RX/2 TX, full power) .................. 340 mA average, A peak Idle.................................................................... <2.5 mA average in DFX 5 Shutdown .........................................................≈ 55 uA GSM0408IG001 Page 12 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide GSM Transmit Power 1800/1900 MHz............................ GSM Power Class 1 (30 dBm ± 2 dB @ antenna connection) 850/900 MHz ................................ GSM Power Class 4 (33 dBm ± 2 dB @ antenna connection) GSM/GPRS Receiver Sensitivity (Typical) 1800/1900 MHz............................ <-106 dBm, GPRS Coding Scheme 1 (CS1) 850/900 MHz ................................ <-106 dBm, GPRS Coding Scheme 1 (CS1) 4.6. Layout Guidelines for the Enabler IIIG BGA The following guidelines are provided in an effort to allow Enabler IIIG BGA module users to successfully implement their PCB layout to obtain the best performance. This includes the lowest possible EMI emissions, maximum thermal conduction, mechanical integrity, and voice quality. The module is a very compact, high performance design, yet it is easy to interface into the final product. In order to realize its full potential, designers should pay close attention to ground structures, the routing of RF and Digital traces, and the size of the power supply lines. These design tips are strictly guidelines and are not meant to be a complete list of items that guarantee actual performance. Each application is different and may require variation from these guidelines, however, care should be given to utilize these sound engineering principles whenever possible. 4.6.1. Placement When integrating the Enabler IIIG BGA into a host design, it is critical for the design engineer and system architect to take steps early on in the design to minimize the potential noise and interference issues associated with proximity of RF sources, clock sources and receivers. Carefully determining the optimum placement for the module will ensure the best performance for GSM communication. All potential sources of noise and interference should be taken into consideration before determining where each module and circuit should be physically placed in the design. A system frequency plan is recommended in order to avoid system clock frequencies with harmonics at 13MHz, 26MHz, or the GSM 850/900/1800/1900 operational bands. Please refer to Figure 1. The module should be rotated and placed such that the RF antenna trace is as short as possible. Refer to section 4.6.4 for more detail on RF routing. Bulk bypass capacitance should be placed adjacent to the power input pads as shown, and power traces should be 0.1” (2.54mm) wide as a minimum, or wider if routing is longer than 5” (127mm). Refer to section 4.6.5 for detailed discussion of power input. GSM0408IG001 Page 13 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Figure 1 – Example of placement and ground plane for the module host board 4.6.2. Ground Plane To ensure the lowest possible EMI emissions and maximum thermal conductivity, it is imperative that all ground balls on the Enabler IIIG BGA module be soldered to a continuous ground plane. This ground plane should cover a minimum of the RF/power quadrant of the module, as shown in the upper left area of Figure 1, and should be interconnected to ground flooding on other layers so that there are no ground loops between module pads. Ground vias should be provided under or adjacent to each ground pad to create a low impedance ground. It is recommended to minimize the number of top-layer I/O traces under the module to allow for as much ground plane as possible. An example of a good ground structure and pad layout is shown in Figure 1, and solid grounding through via interconnect in Figure 2. Figure 2 – Example of solid flooding on layer 4 with via interconnect GSM0408IG001 Page 14 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 4.6.3. Thermal Relief Because the ground plane acts as a large heat sink, it can affect the solder adhesion of the module. A common method to reduce this effect is to use thermal relief around the pad in question. However, great care must be taken when using thermal relief for high current or high frequency applications. Insufficient grounding caused by narrow elongated thermals will result in poor thermal transfer, constricted ground current return, and inadequate RF grounding. Poor RF grounding may be manifested by excessive radiated or conducted harmonics. Figure 3 shows an example of host board grounding in the RF/power area of the module. Recommended design parameters are 10 mils (.254 mm) copper flood clearance and 15 mils (.381 mm) thermal spoke width. A grounding via should be located either directly adjacent to the pad if using thru-hole vias or can optionally be located in the pad for blind via design. For blind via technology with via-inpad, the vias must be filled and plated over to remove the dimple. See section ??? for process specifications with regard to module attachment to the host. Figure 3 – Example of thermal relief and Vbat feed 4.6.4. Antenna and RF Signal Trace The PCB trace that feeds the RF output port must be designed for a 50 ohm characteristic impedance. It should be coplanar, or routed into internal layers to keep the top layer continuous around and underneath the Enabler module. Ample ground vias should be provided around the RF trace and launch pad. Special care should be taken when the RF trace changes layers between the module and the antenna port or connector, as such transitions can introduce an additional mismatch and degrade system sensitivity. If possible, keep I/O and power traces away from the RF port. This includes traces running parallel or orthogonal to it. The designer must pay close attention to the thickness of the dielectric beneath the signal pad and trace. Most PCB manufacturers can adjust the trace width to maintain 50 ohms impedance if the traces are identified and instructions are included on the FAB drawing. This service is typically provided at no or minimal additional cost. For minimum RF emissions due to the fundamental frequency of operation, the Enabler module works best with an antenna load that has a VSWR of 1.5:1 or better. The antenna should not have gain at the harmonic frequencies; otherwise, the conducted harmonics could be amplified to a point where the product no longer passes type approval. However, for applications where antenna quality is less than ideal, it is recommended to have a low pass filter (Pi structure with N=3) in the RF path to the antenna. This is a secondary plan should there be a need to lower harmonic levels at frequencies above the PCS band. The pad structure may also be used to GSM0408IG001 Page 15 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide match the antenna load impedance, if required. If it is not needed, a capacitor of low reactance may be used to bridge the Pi structure. 4.6.5. Vbat Input The Enabler Vbat input can have a relative high current draw that can fluctuate rapidly, especially when transmitting at max power and burst mode. The Vbat interface must be designed to provide the required instantaneous voltage and current with minimal voltage droop. This includes both sufficient bulk decoupling capacitance as well as adequate layout provisions. When routing connections to the Enabler Vbat pads, it would seem reasonable to use traces of the same width as the pads. However, such traces will not have sufficient copper. The use of narrow traces to connect the Vbat pads to the source voltage can act like a high impedance and cause a significant voltage droop when higher currents are required, as shown in Figure 4. Figure 4 - Example of Vbat Voltage Droop If Vbat drops too low, the Enabler module will reset. To minimize the trace loss, it is recommended to use a larger trace that spans several pads as shown in Figure 3. The layout should provide sufficient trace width over the entire route from the module to the source of the Vbat voltage. Any transitions between layers for this trace should utilize multiple vias. Since even the best layout will have some impedance from the source to the Enabler module, sufficient bulk decoupling capacitance is required at the Vbat input to the module. It is suggested to use at least two 1000 uF low ESR tantalum capacitors located adjacent to the module Vbat pads. Any thermal relief used on these capacitors should comply with the information given above in order to provide the lowest impedance possible. The design should include multiple vias to the internal ground plane, placed close to the capacitors, as grounding of these capacitors is critical. 4.6.6. I/O Routing and Fanout The Enabler IIIG BGA interface is grouped by functions, as shown in the BGA map of section 5.5.1. Each functional group should be fanned out and routed as a group from the module. It is preferred to route as much of the I/O nets as possible on internal layers in order to maintain continuous grounding. Pad spacing on the module allows for flexibility in placing vias adjacent to the pads. Figure 5 and Figure 6 are both examples of functional grouping and fanout. Note that GSM0408IG001 Page 16 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide I/O is routed down/away from the power/RF area of the module in order to minimize interference. Recommended audio I/O design is detailed in section 4.6.7 below. I2S USB Audio Figure 5 – Example of layer 2 routing fanout UART Audio Figure 6 – Example of layer 3 UART and audio fanout GSM0408IG001 Page 17 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 4.6.7. Audio Reference Design The audio quality is very dependent on the circuit design and layout. As an aid to obtaining good audio quality, a reference design has been included below. It has been proven to provide good performance on the SDK module. 4.6.7.1. Audio Schematic Figure 8 and Figure 8 show examples for both handset and headset audio connections. The 47pF capacitors should be placed as close as possible to the interface connector in order to filter the 217Hz noise inherent in GSM mobile devices. All capacitors are low ESR ceramic; small values are NP0, while larger values are X7R or X5R. Resistors are all 5% thick film chip. The connector part numbers shown in the last line of each callout are available from CUI Inc. Figure 7– Handset Audio Reference Schematic GSM0408IG001 Page 18 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Figure 8 – Headset Audio Reference Schematic 4.6.7.2. Audio Layout Layout plots for the audio interface section of the SDK are shown below in Figure 9. Audio lines should be routed from the module on internal layers in groups with differential pairs routed together. Care should be taken to isolate the audio signals from Vbat, higher speed digital I/O, and RF. An audio routing example is shown in Figure 5. Figure 9 – Audio interface layout examples GSM0408IG001 Page 19 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 4.7. BGA Handling and Soldering Guidelines The guidelines presented in IPC/JEDEC J-STD-020C for handling, preparation, and reflow of leadfree devices should be applied to the Enabler IIIG BGA module. Care should be taken to minimize module moisture exposure before reflow. The module is classified as a Type 3 MSL (moisture sensitivity level). Additional information forthcoming GSM0408IG001 Page 20 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5. Technical Specifications 5.1. Enabler IIIG BGA Module Block Diagram GSM0408 GSM/GPRS VBAT Memory 32 Mbit flash/16 Mbit pSRAM (max 128 Mb/64 Mb) Remote SIM (4) SIM Detect GPIO (8) Clock Camera (6) Serial I/O, 9 wire Locosto Digital Signal Processing (ARM7) & Digital RF Transceiver System on Chip I2S Digital Audio (8) SPI (6) JTAG (6) 26 MHz XTL APC TSPACT (4) HB TX LB TX MCSI (4) I2C RX-GSM BGA Pads (167) Keyboard (10) RX-EGSM LCD (14) RF Power Amplifer + Switch Module RX-1800 Pwr Rails I/O RX-1900 Buffered 32KHz Backup Battery Reset Microphone w/Bias (3) 32 kHz XTL Analog/Aux Processing & Power Mgmt (Triton Lite) Ear Speaker (2) 8ohm Speaker w/Bias (5) Stereo Headset w/Mic (4) Aux Stereo Audio In (2) Battery Charger (10) USB OTG (4) Vibrator Drv LED Drv (Paging, Backlight) (3) PWRON ADC In RF 2/22/08 Figure 10 - Enabler IIIG BGA Module Block Diagram GSM0408IG001 Page 21 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.2. Detailed Product Specifications Physical Dimensions and Weight Size (L x W x H) 28.0 mm x 24.0 mm x 2.50 mm Weight Without SIM Connector – < 3.6 grams With SIM Connector (no SIM inserted) – < 4.2 grams Climatic: Operational GSM Compliant temperature Operating temperature -20°C to +60°C -30°C to +70°C Relative humidity 5 - 95% Air pressure (altitude) 70 kPa to 106 kPa (-400 m to 3000 m) Climatic: Storage and Transportation Duration Ambient temperature Relative humidity Thermal shock Altitude 24 months -40°C to +85°C 5% to 95%, non condensing (at 40C) -50°C to +23°C, +70°C to +23°C; < 5 min -400 m to 15,000 m Mechanical: Operational Operational vibration, sinusoidal 3.0 mm disp, 2 to 9 Hz; 1 m/s2 , 9 to 350 Hz Operational vibration, random 0.1 m2 /s3 , 2 to 200 Hz Mechanical: Storage and Transportation Transportation vibration, packaged Drop, packaged Shock, un-packaged Drop, un-packaged ASTM D999 ASTM D775 method A, 10 drops 150 m/s2 , 11 ms, half-sine per IEC 68-2-27 4-inch drop per Bellcore GR-63-CORE Mechanical: Proposed Standards Transportation ETSI Standard ETS 300 019-1-2 Class 2.3 Transportation ETSI Standard ETS 300 019-1-3 Class 3.1 Operational ETSI Standard ETS 300 019-1-1 Class 1.2 Storage Operational Storage Electromagnetic Emissions Radiated spurious GSM0408IG001 FCC Part 22 & 24 / Part 15 Class \ B3GPP TS 51.010-1 Section 12.2 EN 55022 Class B Page 22 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.3. Operating Power The module requires an input voltage of 3.3 Vdc to 4.5 Vdc. 5.3.1. Typical Input Current Test Conditions: Typical Results @ 3.8 V, 20 deg C, with 2000 μF at connector input on VBAT and RF terminated into a 50 Ω resistive load. GSM Operation Band 1900 1800 900 850 ALL N/A Input Current Mode 1 RX/1 TX, Full Power Idle Shutdown Low 21 21 21 21 600uA GPRS Operation Band 1900 1800 900 850 ALL N/A 5.3.2. Nom/Avg 204 215 248 250 2.4mA 53uA High/Peak 1180 1280 1600 1600 154mA Units mA mA mA mA High/Peak 1180 1180 1180 1280 1280 1280 1600 1600 1600 1600 1600 1600 140mA Units mA mA mA mA mA mA mA mA mA mA mA mA Input Current Mode 4 RX/1TX, Full Power 2 RX/2TX, Full Power 1 RX/1TX, Full Power 4 RX/1TX, Full Power 2 RX/2TX, Full Power 1 RX/1TX, Full Power 4 RX/1TX, Full Power 2 RX/2TX, Full Power 1 RX/1TX, Full Power 4 RX/1TX, Full Power 2 RX/2TX, Full Power 1 RX/1TX, Full Power Idle Shutdown Low 15 15 15 15 15 15 15 15 15 15 15 15 600uA Nom/Avg 235 340 192 242 354 201 272 422 232 268 420 231 2.4mA 53uA GSM Transmit Power Enfora Enabler IIIG BGA module Power Class Transmit Power 1900 MHz 1800 MHz GSM Power Class 1 850 MHz 900 MHz GSM Power Class 4 1-W conducted power maximum (30 dBm +/- 2 dB), measured at the antenna port 2-W conducted power maximum (33 dBm +/- 2 dB), measured at the antenna port GSM0408IG001 Page 23 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.3.3. GSM Receiver Sensitivity Enfora Enabler IIIG BGA module Sensitivity Mode 1900 MHz 1800 MHz 900 MHz 850 MHz -106 dBm (typical) GPRS Coding Scheme 1 (CS1) -106 dBm (typical) GPRS Coding Scheme 1 (CS1) 5.4. Physical Interfaces 5.4.1. Module Figure 11 - Module Dimensions All dimensions are in millimeters (mm). Shield cosmetics may change. 5.4.2. Host PCB Footprint The recommend footprint for the host PCB is shown in Figure 12. Note that the pad dimensions given are for a solder mask defined pad, in order to avoid irregularities due to flooding, thermals, and routes. GSM0408IG001 Page 24 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Figure 12 - Host PCB Footprint (Dimensions are in millimeters.) 5.5. Electrical Connections Pad Signal Name I/O A1 ANT I/O A2 GND GND A3 GND GND A4 GND GND A5 GND GND A6 GND GND A7 SIM_IO A8 GND I/O Description Alternate Description/Function RF Port to Antenna SIM Data GND A9 VRSIM SIM Power A10 GPIO-2 I/O GPIO-2 A11 CLK32K_BUF Buffered 32 kHz clock A12 GND GND A13 GPIO-5 A14 GND GSM0408IG001 I/O *USB_BOOT: Input @ boot, I/O after boot. Must be Tri-State or Low at boot. GPIO-5 GND Page 25 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Pad Signal Name I/O Description Alternate Description/Function B1 GND GND B2 GND GND B3 GND GND B4 GND GND B5 GND GND B6 GND GND B7 SIM_CLK SIM Clock B8 SIM_RST SIM Reset B9 GND GND B10 GND GND B11 UART_RX UART Serial Data Output B12 UART_DTR B13** TRSTN B14* I2C_2_SCL C1 UART Data Terminal Ready JTAG Test Reset Input I/O I C Serial Clock VBAT Main Power Input C2 VBAT Main Power Input C3 GND GND C4 GND GND C5 GND GND C6 GND GND C7 TSPACT_12 Timed Gen Purpose Output C8* KBR3 Keyboard Input C9 GPIO-1 I/O GPIO-1 C10 UART_RING UART Ring Indicator C11 UART_DCD UART DCD Output C12 UART_CTS UART CTS Output C13 UART_RTS UART RTS Input C14* I2C_2_SDA D1 I/O I C Serial Data VBAT Main Power Input D2 VBAT Main Power Input D3 GND GND D4 GND GND D5 GND GND D6 GND GND D7 KBC0 Keyboard Input D8 GND GND D9 GND GND D10 GND GND D11 UART_TX UART Serial Data Input D12 UART_DSR UART Data Set Ready D13 GPIO-10 I/O GPIO-10 GPIO-12 I/O D14 *MCSI_FSYNC: Frame Synchronization I/O *MCSI_RX: Serial data input GPIO-12 E1 VBAT Main power input E2 VBAT Main power input GSM0408IG001 Page 26 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Pad Signal Name E3* ADCIN3 I/O ADCIN3 E4* LED_A LED Current Sink E5* LED_C LED Current Sink E6* KBC2 Keyboard Input E7* KBR0 Keyboard Input I/O Description Alternate Description/Function BATT_TEMP: Battery Temperature Input E8 GPIO-19 E9 GND GPIO-19 E10 GND E11 GPIO-17 I/O GPIO-17 E12 GPIO-8 I/O GPIO-8 E13 GPIO-11 I/O GPIO-11 *MCSI_TX: Serial Data Output E14 GPIO-9 I/O GPIO-9 *MCSI_CLK: Serial Clock I/O F1* ICTLUSB1 USB External Pass Transistor Control F2* ICTLUSB2 USB External Pass Transistor Control F3* BM_PRECH Pre-Charge Boot Mode F4* LED_B LED Current Sink F5* ADCIN2 ADCIN2 GND GND *KBR4: Keyboard Input *SPI_\CS1: MSSPI Chip Select 1 Output BATT_TYPE: Battery Type F6 ON_\OFF Module Reset; Must be driven by open collector/drain. F7* KBC1 Keyboard Input F8* KBR1 Keyboard Input F9 GND GND F10 GND GND F11 GPIO-14 I/O F12 GPIO-7 I/O F13 No Connect GPIO-14 *SPI_MISO: MSSPI Master-In Slave-Out GPIO-7 Do not connect. Leave open. F14 GPIO-3 I/O GPIO-3 G1* PCHGAC AC Pre-Charge Output Current G2* ICTLAC1 AC External Pass-Transistor Control G3* ICTLAC2 AC External Pass-Transistor Control G4* VRWLED PWM Drive for LED Control G5 VRIO 1.8 V Interface Voltage G6 VBACKUP Battery Backup Input G7* KBC3 Keyboard Input Keyboard Input G8* KBR2 G9** \EMU0 I/O G10 GND G11 GPIO-13 I/O GPIO-13 *SPI_CLK: MSSPI Serial Clock G12 GPIO-18 I/O GPIO-18 *SPI_\CS2: MSSPI Chip Select 2 Output G13 GPIO-6 I/O GPIO-6 G14* CAM_RST JTAG Test Emulation 0 GND I/O Camera Reset H1* PCHGUSB Car-Kit Pre-Charge Output Current H2* VAC Battery Charger Input Power Supply H3* VBATS Charge Current Sense H4 HSDETECT Headset Detect GSM0408IG001 Page 27 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Pad Signal Name I/O Description H5 SIMDTC SIM Detect H6 CDO H7 CSCLK H8 CDI H9 GPIO-20 I S data out from Locosto (slave mode; mode only supported when used with onboard codec); Must be connected to J6 (I2S_SDR) on Host PCB if external codec is not used. I S clock into Locosto (slave mode; mode only supported when used with onboard codec); Must be connected to J7 (I2S_SCK) on Host PCB if external codec is not used. I S data into Locosto (slave mode; mode only supported when used with onboard codec); Must be connected to K7 (I2S_SDX) on Host PCB if external codec is not used. GPIO-20 *KBC4: Keyboard Input I/O Alternate Description/Function H10* LCD_R\W I/O 6800 Mode: Read/write Control Pin. High = Read; Low = Write. 8086 Mode: Write Enable Clock. High = Read; Low = Write Send data to the LCD controller on the RnW falling edge. Can be used as GPIO (by default). H11 GPIO-16 I/O GPIO-16 *SPI_\CS0: MSSPI Chip Select 0 H12 GPIO-15 I/O GPIO-15 *SPI_MOSI: MSSPI Master-Out Slave-In JTAG Test Data Out H13** TDO H14 GND GND J1* VCCS Charge Current Sense J2* USB_DP J3* VBUS J4 MICBIAS Microphone Bias Voltage J5 HSMICBIAS Headset Microphone bias voltage J6 I2S_SDR J7 I2S_SCK J8 CSYNC I/O USB Data I/O Positive USB Bus Power; Must be tied to ground if not used. GPIO-4 I/O I S Serial-Data into Analog Processor (master mode); Must be connected to H6 (CDO) on Host PCB if external codec is not used. I S Serial-Clock from Analog Processor (master mode); Must be connected to H7 (CSCLK) on Host PCB if external codec is not used. I S Sync Into Base-Band Processor (slave mode; mode only supported when used with onboard codec); Must be connected to K8 (I2S_WS) on Host PCB if external codec is not used. GPIO-4 J10* LCD_DATA3 I/O LCD Interface I/O Data Bus J11* CCP_CKN Serial Camera Clock, Negative. J12* CCP_DTP Serial Camera Data, Positive. J13* CAM PWR DN J9 J14** TDI I/O Camera Power Down JTAG Test Data In K1* ID_USB I/O USB Connector Identification K2* USB_DM I/O USB Data I/O Negative K3 ADCIN ADC Input K4 MICIN Negative Microphone input K5* SPKPA 8 Ω speaker amplifier positive output (A) K6* SPKNA 8 Ω speaker amplifier negative output (A) K7 I2S_SDX K8 I2S_WS K9 \PWON I S serial data from Triton (master mode); Must be connected to H8 (CDI) on Host PCB if external codec is not used. I S sync from Triton (master mode); Must be connected to J8 (CSYNC) on Host PCB if external codec is not used. Module Power Control K10* LCD_DATA0 GSM0408IG001 I/O LCD interface I/O data bus Page 28 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide I/O Description K11* LCD_RS K12* CCP_DTN Pad Signal Name I/O LCD interface register selection (by default), used also as GPIO; Serial camera data negative K13* CCP_CKP K14** TCK Alternate Description/Function Serial camera clock positive JTAG Test Clock GND FML FM audio in - left HSOR Headset Output - Right L1 GND L2* L3 L4 MICIP Positive Microphone Input L5* SPKPD 8 Ω speaker amplifier positive output (D) L6* SPKND 8 Ω speaker amplifier negative output (D) L7* SPKVDD Speaker driver bias L8* VIBDR Vibrator driver L9* LCD_CS0 LCD interface chip-select for chip 0. Data I/O are available when low. When high, data I/O are in a high impedance state. Bits shared with the GPIO module and used as GPIO by default. These bits are used as outputs for LCD interface. L10* LCD_CS1 LCD interface chip-select for chip 1. Data I/O are available when low. When high, data I/O are in a high impedance state. Bits shared with the GPIO module and used as GPIO by default. These bits are used as outputs for LCD interface. L11* LCD_DATA5 I/O LCD Interface I/O Data Bus L12* LCD_DATA2 I/O LCD Interface I/O Data Bus L14** TMS M1* AUXI_FMR JTAG Test Mode Select Auxiliary audio/FM Input - Right M2 HSMIC Headset microphone input M3 HSOL Headset Output - Left M4 EARN Handset Output - Negative M5 EARP Handset Output - Positive M6 HSOVMID Headset Amplifier Pseudo-Ground M7 GND GND M8* LCD_\RST LCD Controller Reset M9* LCD_STB I/O 6800 Mode: Strobe enable (by default). Read data from the LCD controller on the strobe falling edge. Send data to the LCD controller on the strobe rising edge. 8086 Mode: Read Enable (by default); Read data from the LCD controller on the strobe rising edge. Can be used as GPIO. M10* LCD_DATA1 I/O LCD Interface I/O Data Bus M11* LCD_DATA6 I/O LCD Interface I/O Data Bus M12* LCD_DATA4 I/O LCD Interface I/O Data Bus M13* LCD_DATA7 I/O LCD Interface I/O Data Bus M14 GND Types * Note 1: GND I = Input, O = Output, P = Power, G = Ground For hardware reference only. The current version of generic firmware does not support the use of this pad/function. Contact Enfora for further details. **Note 2: For Enfora Use ONLY GSM0408IG001 Page 29 Rev. DRAFT – 03/10/2008 14 13 12 11 10 GND LCD_ DATA7 LCD_ DATA4 LCD_ DATA6 LCD_ DATA1 LCD_ STB LCD_ \RST GND HSOVMID EARP EARN HSOL HSMIC AUXI_ FMR TMS No-Ball LCD_ DATA2 LCD_ DATA5 LCD_ CS1 LCD_ CS0 VIBDR SPKVDD SPKND SPKPD MICIP HSOR FML GND TCK CCP_ CKP CCP_ DTN LCD_ RS LCD_ DATA0 \PWON I2S_ WS I2S_ SDX SPKNA SPKPA MICIN ADCIN USB_ DM ID_ USB TDI CAM PWR DOWN CCP_ DTP CCP_ CKN LCD_ DATA3 GPIO-4 CSYNC I2S_ SCK I2S_ SDR HSMIC BIAS MIC BIAS VBUS USB_ DP VCCS GND TDO GPIO-15 GPIO-16 LCD_ R\W GPIO-20 CDI CSCLK CDO SIMDTC HS DETECT VBATS VAC PCHG USB CAM RST GPIO-6 GPIO-18 GPIO-13 GND \EMU0 KBR2 KBC3 VBACK UP VRIO VRW LED ICTLAC2 ICTLAC1 PCHGAC GPIO-3 GPIO (future) GPIO-7 GPIO-14 GND GND KBR1 KBC1 ON_ \OFF ADCIN2 LED_B BM_ PRECH ICTL USB2 ICTL USB1 GPIO-9 GPIO-8 GPIO-17 GND GND GPIO-19 KBR0 KBC2 LED_C LED_A ADCIN3 VBAT VBAT GPIO-12 GPIO-10 GPIO-11 UART_ DSR UART_ TX GND GND GND KBC0 GND GND GND GND VBAT VBAT I2C_2_ SDA UART_ RTS UART_ CTS UART_ DCD UART_ RING GPIO-1 KBR3 TSPACT _12 GND GND GND GND VBAT VBAT I2C_2_ SCL TRSTN UART_ DTR UART_ RX GND GND SIM_ RST SIM_ CLK GND GND GND GND GND GND GND GPIO-5 GND CLK32K_ BUF GPIO-2 VRSIM GND SIM_ IO GND GND GND GND GND ANT Enfora Enabler IIIG BGA Modem Integration Guide 5.5.1. BGA Map 14 13 12 11 10 GSM0408IG001 Page 30 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.6. Circuit Protection Other than very low level ESD protection within the module’s integrated circuits, the module does not have any protection against ESD events or other excursions that exceed the specified operating parameters. Generally, ESD protection (typically TVS/Transzorb devices) should be added to all signals that leave the host board. This includes VBAT/VCC. Series resistors (typically 47 Ω) can also be added in series with data lines to limit the peak current during a voltage excursion. NOTE: DO NOT ADD SERIES RESISTANCE TO THE SIM ELECTRICAL LINES. Minimum ESD Protection Levels Pad #’s ESD Test Method All I/O, other than VBUS/PWR All VBUS/PWR) RF Antenna, A1 Human Body Model EIA/JEDEC22-A114-A Charge Device Model EIA/JEDEC22-C101-A Human Body Model EIA/JEDEC22A114-A Charge Device Model EIA/JEDEC22C101-A IEC 61000-4-2 Min ESD/Input Voltage Nom/ High/ Avg Peak Units 500 200 2000 500 8000 Caution – It is the Integrator’s responsibility to protect the Enabler IIIG BGA module from electrical disturbances and excursions that exceed the specified operating parameters. GSM0408IG001 Page 31 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.7. Pad Signal Descriptions and Functions Please note that the following descriptions are intended to provide hardware-level definitions. In some cases, specific lines will have no firmware functionality implemented. Information for each hardware-specific feature will be noted in the appropriate section. 5.7.1. Module Power (Pads C1, C2, D1, D2, E1, E2) The module uses a single voltage source of VCC=+3.3V to 4.5V. (The exact values of the uplink currents are shown in the tables in section 5.3.1.) VBAT Main Battery Supply Parameter/Conditions Voltage In Regulation Peak Current 1000 μF on Host at module interface Min 3.3 Typ Max 4.5 TBD Units Vdc mA The uplink burst will cause strong ripple on the voltage lines and should be effectively filtered. It is recommended that 1000 to 2000 μF of capacitance be placed as close to the modem power input pads as possible. It should be noted that the input voltage level should not drop below the minimum voltage rating under any circumstances, especially during the uplink burst period. GSM0408IG001 Page 32 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.7.2. Antenna (Pad A1) The module has one RF antenna pad on the module. The connection is for the GSM section of the module. 5.7.3. Reset Signal (Pad F6, also known as ON_\OFF) The Reset signal is used to force the modem to start at a known state. When the Reset is pulled low the modem will immediately suspend any function and will not exit the reset state until the Reset signal is released to be pulled high. Once the transition from low to high is complete, the modem will boot. The Reset signal is falling edge triggered, so the reset function is set immediately when the signal is pulled low. When using Reset, it will immediately detach the connection from the GSM network, which is not considered ideal. Typically during a normal shutdown, the modem will issue a detach request to the network to indicate that it is being removed. Reset should be used during network operations only when there is no response from the module. Controlling the Reset signal must only be preformed by an open collector/open drain device. Driving the Reset signal high will interfere with the normal operation of the modem power on/off sequences. Power sequencing cannot be guaranteed if Reset is being driven high by an external device. If driving from an external microprocessor, the reset can be controlled by driving the control pin low as an output, then change the pin control to be an input. This will satisfy the high impedance requirement. Parameter VIL VIH IPU IIL Reset Pulse Duration GSM0408IG001 Parameter/Conditions Input Voltage – Low or float Input Voltage – High Internal Pull-Up Resistor Current sink MIN TYP 1.36 -40 -31 10 Page 33 MAX 0.58 1.95 -15 -2.0 UNIT Vdc Vdc μA mA mS Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.7.4. Power Control (Pad K9) (PWR_CTL) The input is equivalent to a “phone ON-button”. A falling-edge on this Active-Low input will switch-ON the module or switch-OFF the module after a delay*. This input has a “weak pull-up” resistor internal to the module. This input can be left grounded if the “RTC Sleep Function” is not required. If RTC Sleep is required, then the PWR_CTL line must be floated to allow the internal resistor to pull the line high. See section 6.6.9 for more info on the RTC. Controlling the Power Control signal must only be performed by an open collector/open drain device. Driving the Power Control signal high may interfere with the normal operation of the modem. If driving from an external microprocessor, the Power Control can be controlled by driving the control pin low as an output, then change the microprocessor’s pin control to be an input (this will satisfy the high impedance requirement). *The OFF Delay is controlled by the AT$OFFDLY command. A value of 0 disables the PWR_CTL line from turning the module off. 0 is the default value. To enable the module to switch-OFF via PWR_CTL you must set AT$OFFDLY to a value other than 0. The valid range is 100 to 1000 milliseconds. Turning ON the Enabler IIIG BGA Pulling the PWR_CTL line on the module LOW for at least 50mS (after Vbat is applied and stabilized) is required to turn it ON. Section 0 describes various ways to provide the signal. Do not use a pull-up resistor on the PWR_CTL line since the line is pulled up internal to the modem. Turning OFF the Enabler IIIG BGA The module can be turned off by either a low pulse on the PWR_CTL line, or by a software command (AT$OFF, see AT guide for further details). Section 0 describes various ways to provide the signal. GSM0408IG001 Page 34 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Using the Power Control Signal Typical use powering module on/off with a switch: Figure 13 – Power Control Switch Modem VBAT PWR_CTL Float RESET Figure 14 – Typical connection of PWR_CTL to modem: Figure 15 – Typical use controlling PWR_CTL from microcontroller: Figure 16 shows a typical connection to the module in a machine-to-machine application using the external PWR_CTL signal, when there is not an external processor controlling the power on/off states. The RTC deep sleep functions will NOT function since the PWR_CTL pad is tied low, the processor will never stay in a “RTC Sleep” mode. Either the RESET pad must be toggled (as described in section 5.7.3), or power (VBAT) must be cycled to reset the module. GSM0408IG001 Page 35 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Modem VBAT PWR_CTL Float RESET Figure 16 - External Power Control Signal (no external processor) Figure 17 shows a typical connection from an external processor to the module, using the external PWR_CTL signal. The module can be powered on by using the PWR_CTL signal, and reset with the RESET signal. When using PWR_CTL, the I/O or serial lines can be at any voltage state desired. It is recommended that the I/O and serial lines be tri-stated or set low when the module is shutdown for an extended period of time to prevent any leakage current from the processor to the modem. CPU Modem VBAT GPIO SERIAL Open drain, or Tri-State I/O PWR_CTL Open drain, or Tri-State I/O RESET Figure 17 - Power Control Signal (using external processor) Parameter VIL VIH IPU IIL ON Pulse Duration OFF Pulse Duration Boot time GSM0408IG001 Parameter/Conditions Input Voltage – Low or float Input Voltage – High Internal Pull-Up Resistor Current sink Minimum is programmable (AT$OFFDLY) Time to boot from power on to command prompt Page 36 MIN TYP 0.7 x VBAT -40 -31 10 10 50 100 1.1 MAX 0.3 x VBAT 1.95 -15 -2.0 5000 UNIT Vdc Vdc μA mA mS mS Sec Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.7.5. Level Translation Reference Power (Pad G5) To be used as a voltage reference source ONLY. Do not connect current loads to this pad. This pad must be decoupled to ground with at least a 0.1 μF capacitor at the output. Noise induced on this pad will affect the performance of the baseband. Low Power Mode is entered when RTCWAKE is used to power down the modem with just the RTC running. VR I/O Output voltage VOUT Rated output current IOUT 5.7.6. Parameter/Conditions ON mode LOW POWER mode ON mode LOW POWER mode Min 1.65 1.65 Typ 1.8 1.8 Max 1.95 1.95 20 0.5 Units Vdc mA USB (Pads J2, J3, K1, K2) Pad Name USB_VBUS Pad Number J3 Signal Direction In J2 K2 K1 I/O I/O I/O USB_DP USB_DM ID_USB Description 5 V tolerant power Supply VBUS line; Used only as a USB sense, not for powering the module. (optional connection) 5 V tolerant USB differential positive data pin 5 V tolerant USB differential negative data pin 5 V tolerant ID line, it defines the type of device connected to the phone’s USB port; And also the default state (host / device) at the cable connection; The transceiver senses the voltage of this pin to determine if the pin is either floating (typical), grounded or resistively connected to ground (102 kΩ, 200 kΩ, 440 kΩ); This is for Enfora Debug only 5V Tolerant Transceiver USB Input Voltage Output voltage Parameter/Conditions High (Driven) Low Transceiver D+/Leakage Current 5.7.7. Min 4.4 2.8 0.0 -2 Typ 4.65 3.3 0.1 Max 5.25 3.6 0.3 Units Vdc Vdc μA General Purpose Input/Output Interface Each general-purpose signal may be selected as inputs or outputs. The GPIOs can be used independently as a user-specified function, or may be used to provide modem control and status signals. Several examples of modem control signals are: power shutdown command, GSM0408IG001 Page 37 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide register/deregister on network command, and transmitter disable. Several examples of modem status signals are: registration status and ready-for-power-down status to be used with power shutdown command signal. GPIO number GPIO 1 GPIO 2 GPIO 3 GPIO 4 GPIO 5 GPIO 6 GPIO 7 GPIO 8 GPIO 9 GPIO 10 GPIO 11 GPIO 12 GPIO 13 GPIO 14 GPIO 15 GPIO 16 GPIO 17 GPIO 18 GPIO 19 GPIO 20 I/O Lines VIL VIH VOL VOH IOL / IOH GSM0408IG001 Pad number C9 A10 F14 J9 A13 G13 F12 E12 E14 D13 E13 D14 G11 F11 H12 H11 E11 G12 E8 H9 Parameter/Conditions Input Voltage – Low Input Voltage – High Output Voltage – Low Output Voltage – High Rated Output Current Page 38 Secondary Fuction MCSI_CLK MCSI_FSYNC MCSI_TX MCSI_RX Min 1.11 Typ Max 0.60 1.8 0.45 1.26 Units Vdc Vdc Vdc Vdc mA Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide The below table shows the factory default modem GPIO configuration: I/O No PU/PD Enabled PU/DN I/O setting PU/PD capability PU Value KOhm PD Value KOhm Iout PU IN IN PU/PD 18 90 10 11 12 13 14 15 16 17 18 19 20 PD PU PU PU PU PU PU PU PU PU PD PD PD PU PU PU PU PU IN IN IN IN IN IN IN IN IN IN IN IN IN IN IN IN IN IN PD PU/PD PU/PD PU/PD PU/PD PU/PD PU PU PU PU PD PD PD PU/PD PU/PD PU PU/PD PU/PD 18 18 18 18 90 90 18 18 90 18 90 90 90 90 90 18 18 18 90 90 90 90 Notes 10k Pulldown on Modem Factory Default Settings for I/O Pads, PU/PD Capability and Value of PU/PD Resistors. 5.7.8. RTC Sleep In this mode, the modem is off except for its Real-Time-Clock. When put into this mode, the modem can wake itself up at a designated time/interval. See Section 4.10 of the Enabler III AT command manual for details GSM0408IG001 Page 39 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.7.9. Serial Interface The pad naming for TX/RX/RTS/CTS/DTR/DSR is referenced as a DCE .The DTE device should match their input pads to the Enfora outputs and visa-versa. Additionally, there are AT commands that may need to be executed in order to ensure proper operation. See the chart below. NOTE: The UART interface on the Enabler IIIG BGA, as well as other I/O, is 1.8V logic. It should not be directly connected to a higher voltage interface. The table below is a reference of D connector pin numbers only. 9 way D Connector Pin Number Signal Signal Direction Carrier Detect (CD) Receive Data (RD) Transmit Data (TD) Data Terminal Ready (DTR) Signal Ground Data Set Ready (DSR) Request To Send (RTS) Clear To Send (CTS) Ring Indicator (RI) Enfora Pad Number C11 B11 D11 B12 from DCE from DCE from DTE from DTE both from DCE from DTE from DCE from DCE D12 C13 C12 C10 Enfora AT Command AT&C AT&D AT+IFC AT+IFC The key features of the UART in the modem mode are as follows: • 16C750 compatibility • Baud rate from 300 bits/s up to 921600 Kbits/s, autobaud • Configurable data format: • Data bit: 5, 6, 7, or 8 bits • Parity bit: even, odd, none • Stop bit: 1, 1.5, 2 bit(s) • Hardware flow control RTS/CTS • Software flow control using XON/XOFF characters Default settings are 8 data, 1 stop, no parity, and autobaud. DTR may be used to force the modem into AT command mode from online data mode (See AT Command Document, command AT&D). RTS and CTS may be used for hardware handshaking. DSR is always active (asserted low) while the modem is on. RING may be used to alert the host to a variety of incoming calls. For a minimal implementation, connect RxData and TxData to the COM port serial data lines (through level translation if the interface is not 1.8V). Connect DTR and RTS on the host side of the interface to GND, while leaving the corresponding lines on the module floating. Ring Indicate (Pad C10) The module is capable of using the Ring line to discern the type of incoming call. The function of the Ring line depends on the type of the call received. When the module is receiving a voice call, the Ring line goes low for 1 second and high for another 2 seconds. Every 3 seconds the ring string is generated and sent over the Receive (Data Out) (Rx) line. If there is a call in progress and call waiting is activated for a connected handset GSM0408IG001 Page 40 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide or hands free device, Ring switches to ground in order to generate acoustic signals that indicate the waiting call. Ring 2 seconds 1 second RING String 2 seconds 1 second RING String When a Fax or data call is received, Ring goes low and will remain low. Every 3 seconds a ring string is generated and sent over the Receive (Data Out) (Rx) line. Ring 3 seconds 3 seconds RING String RING String RING String When an incoming SMS is received , Ring indicate goes low for 1 second, then returns to a high state. See below logic diagram. Ring 1 second URC Figure 18 - Ring Indicate Timing Serial I/O & Control VIL VIH VOL VOH IOL / IOH Parameter/Conditions Input Voltage – Low Input Voltage – High Output Voltage – Low Output Voltage – High Rated Output Current Min 1.26 1.26 Typ Max 0.54 1.95 0.54 1.95 2.0 Units Vdc Vdc Vdc Vdc mA 5.7.10. MCSI – Multi-Channel Serial Interface (Pads D13, D14, E13, E14) This port is only available in Master mode and to be used for PCM digital audio. Below are the settings for configuring it operation and the interface specification: Digital Audio Configuration The default settings for the digital audio are: Mode = Master MCSI_CLK = 520KHz Word Size = 16 Bits Sync Pulse = 8KHz Frame mode = burst Clock edge Sync = rising edge GSM0408IG001 Page 41 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Configuring the MCSI for Digital Audio The following two commands are required to set the unit up in digital audio mode: AT$voicepth=2 at$ioblks=0,1 This configures the EIII module to use digital audio instead of analog audio. This configures the I/O pads of the module to be used as the secondary function which is the MCSI port. It automatically configures the direction of the pads. Do not alter the settings for these 4 pads manually (direction, pull up or alternate configuration) as this will stop the MCSI port working for digital audio. Data Format The 16-bit word is sent MSB first. Data received is also MSB first. No other data manipulation is done within the module. Pad Name MCSI_RX MCSI_TX MCSI_CLK MCSI_FSYNC Pad Number D14 E13 E14 D13 Signal Direction IO IO Description Serial Data Input Serial Data Output Serial Clock I/O Frame Synchronization I/O 5.7.11. VBACKUP Input (Pad G6) The backup battery can be recharged from the main battery. A programmable voltage regulator powered by the main battery allows recharging the backup battery. The backup battery charge starts when the following conditions are met: Backup battery charge is enabled by a control bit: • Main Battery voltage > Backup Battery voltage • Main battery > 2.8 Vdc Note: If the backup battery is not present, the backup battery pad is connected to main battery pad. VBACKUP is a power input for the Real-Time-Clock when using RTC-Sleep Function (Section 5.7.8) VBACKUP Input Voltage Range Parameter/Conditions ON mode BACKUP mode, VBAT=0v BACKUP mode, VBACKUP=0v Input Current Min 2.5 1.9 1.9 Typ VCC1 VBACKUP VCC2 Max 5.5 5.5 3.0 10 Units Vdc μA VBACKUP is a backup voltage that can maintain the RTC clock and alarm functions. If VBACKUP is not present in the system (intentionally or not) the RTC clock may still be powered if leakage voltage exists on VCC. Otherwise, the RTC clock will lose power and be reset when VCC is restored. GSM0408IG001 Page 42 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide PARAMETER Parameter/Conditions Backup Voltage (Real-Time-Clock) Backup Voltage for Real-Time-Clock VBACKUP Input Current (VBACKUP = 3.2 V, VBAT = IBACKUP 0 V, No Load on GPIO or Serial Port) Min Typ Max 2.7 3.0 3.0 4.5 6.0 Units Vdc μAdc VBACKUP has been tested in the above scenarios and does not contribute to leakage. It will properly provide backup power to the RTC clock. 5.7.12. 32 kHz output (Pad A11) A 32.768 kHz signal is available as an output from the module. This signal should only be used as an input to a high impedance device. Additional loads or capacitance on the line may cause performance issues with the module. If the line is not used, leave floating. 32kHz Clock-Out VIH VIL Maximum capacitor load Maximum resistive load Frequency Parameter/Conditions Min Typ Max tbd ± 30 ppm Units Vdc Vdc pF Ω kHz 32.768 5.7.13. Analog-To-Digital Input (Pad K3) The monitoring ADC (MADC) consists of a successive approximation 10–bit analog–to–digital converter (ADC). Analog-To-Digital Input ADCBRES ADCREF VADC Integral/Differential NonLinearity Input Leakage Retuning Frequency Parameter/Conditions ADC Binary Resolution ADC Reference Voltage ADC Range Min Typ Max 10 1.75 -2 1.75 Units Bits Vdc Vdc LSB μA MHz tbd 5.7.14. Handset Microphone Input (Pads K4, L4) The handset differential inputs MICIP and MICIN can be amplified by the differential handset microphone amplifier. This amplifier has a gain of 25.6 dB and a bias generator MICBIAS provides an external voltage of 2 V or 2.5 V to bias the microphone. Handset Mic Input Maximum Input Range – Mic(+) to Mic(-) Nominal Ref. Level – Mic(+) to Mic(-) GSM0408IG001 Parameter/Conditions Inputs 3 dBm0 (Max. digital sample amplitude when PGA gain set to 0 dB) Differential MIC Page 43 Min Typ -10 Max 32.5 Units mVRMS dBm0 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Differential Input Resistance – Mic(+) to Mic(-) Differential MIC, MICAMP gain = 25.6 dB (INMODE = 0001) Microphone PreAmplifier Gain Differential MIC 36 kΩ 25.6 dB 5.7.15. Handset Microphone Bias Output (Pad J4) Mic Bias Output Bias Voltage on Mic(+) Parameter/Conditions Set to 2.0 V Set to 2.5 V Min 1.9 2.4 Typ Mic Bias Current Capability Max 2.1 2.6 2.0 Units Vdc Vdc mA 5.7.16. Handset Speaker Output (Pads M4, M5) Pad Name EARP EARN Pad Number 71 73 Signal Direction Description Earphone positive output Earphone negative output The earphone amplifier provides a full differential signal on the terminals EARP and EARN (Earphone). Handset Spkr Output Maximum Differential Resistive Load Maximum Differential Capacitive Load Common Mode Minimum Resistive Load Common Mode Maximum Capacitive Load Amplifier Gain Parameter Earphone output swing at EARP-EARN Earphone amplifier gain GSM0408IG001 Parameter/Conditions Output Swing 3.9 VPP Output Swing 1.5 VPP Min Typ 120 33 Max 100 At Internal Speaker (+) or (-) 200 kΩ At Internal Speaker (+) or (-) 50 EARG = 1 EARG = 0 Page 44 pF -11 Test Conditions Distortion ≤ 2% and 120 Ω, VSP input level = +3 dBm0, amp gain = -11 dB Distortion ≤ 2% and 33 Ω, VSP input level = -5.34 dBm0, amp gain = -11 dB Distortion ≤ 2% and 120 Ω, I2S input level = +3 dBm0, amp gain = -11 dB Distortion ≤ 2% and 120 Ω, VSP input level = +3 dBm0, amp gain = 1 dB Distortion ≤ 2% and 33 Ω, VSP input level = -5.34 dBm0, amp gain = 1 dB Distortion ≤ 2% and 120 Ω, I2S input level = +3 dBm0, amp gain = 1 dB EARG = 1 EARG = 0 Min Units Ω Ω pF dB dB Typ 0.98 Max Units VP-P 0.38 0.93 3.1 3.92 1.2 1.5 2.96 3.7 -11 dB dB Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Earphone amplifier state in power down Earphone amplifier power supply rejection High 50 1 kHz, 100 mVp-p dB An external audio amplifier should be used for loads of less than 16 Ω or if volume is inadequate. 5.7.17. Headset Microphone Input (Pad M2) Mic Input The headset differential inputs HSMIC and AUXI can be amplified by the differential handset microphone amplifier. This amplifier has two different gains 4.9 dB or 25.6 dB and a bias generator HSMICBIAS provides an external voltage of 2 V or 2.5 V to bias the microphone. Headset Mic Input Maximum Input Range Nominal Ref. Level Microphone PreAmplifier Gain Input resistance at HSMIC Parameter/Conditions Min Typ Inputs 3 dBm0 (Maximum digital sample amplitude with PGA gain set to 0 dB), AUXAMP gain = 18 dB, Single HSMIC Max Units 78 mVRMS 18 dBm0 dB -10 HSMIC single input, AUXAMP gain = 18 dB 40.5 kΩ 5.7.18. Headset Microphone Bias Output (Pad J5) Mic Bias Output Bias Voltage on Mic(+) Parameter/Conditions Set to 2.0 V Set to 2.5 V Mic Bias Current Capability GSM0408IG001 Page 45 Min 1.9 2.4 Typ Max 2.1 2.6 2.0 Units Vdc Vdc mA Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.7.19. Headset Speaker Output Left & Right (Pads M3, L3) Pad Name HSOL HSOR HSOVMID Pad Number 57 59 61 Signal Direction Description Headset Out 32Ω Speaker Left Headset Out 32Ω Speaker Right Headset Out pseudo ground return The left and right headset amplifiers provide the stereo signal on terminals HSOL and HSOR. A pseudo ground is provided on terminal HSOVMID to eliminate external capacitors. The mono audio signal can be provided on the Right or the Right and Left headset outputs. HSOVMID is available to allow integrators to supply a bias or DC offset to increase the dynamic range of the Headset. Headset Spkr Output Maximum Swing Parameter/Conditions Distortion ≤ 2% and 32 Ω, VSP input level = +3 dBm0 Distortion ≤ 2% and 32 Ω, I2S input level = +3 dBm0 Min 1.6 Typ 1.96 1.48 1.85 Maximum Capacitive Load Minimum resistive load at HSOL and HSOR: Zload Amplifier Gain HSOL/R amplifier Power supply rejection 1 kHz, 100 mVpp Amplifier State in Power Down Max Units VP-P 100 pF 32 Ω -5 50 dB dB High Z The left and right channels of the headset speaker output are a single ended output. An external audio amplifier should be used for loads of less than 32 Ω or if volume is inadequate. 5.7.20. Headset Output Common Mode (Pad M6) The left and right headset amplifiers provide the stereo signal on terminals HSOL and HSOR. A pseudo ground is provided on terminal HSOVMID to eliminate external capacitors. NOTE: In the audio reference design outlined above, this pin is left unconnected. It is recommended that a series zero ohm resistor be used if unsure of the levels required by the application. HSOVMID Maximum Capacitor Load DC Level GSM0408IG001 Parameter/Conditions Page 46 Min Typ Max 200 Units pF 1.2 1.35 1.5 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 5.7.21. Headset Detect (Pad H4) Headset Plug/Unplug detection. This pad is used to automatically switch to the headset audio path when enabled with AT$VSELECT=3. The device will default to handset when no Headset is detected. • 2 modes: Module already ON (Battery connected, VRIO ON) and plug event; Module OFF and plug event: the plug detection will be effective once VRIO is set ON • Plug and unplug detections are digitally debounced (debouncing time = 8 ms). • The jack plug detection feature is addressed through the HSDET pad. The integrated pull up, connected to the pad, forces a high level (VBAT) when the headset load is not connected. At jack insertion headset load connection (32 Ω) imposes a low level on that node (Headset left channel): as an example HSDET = 1 mV after jack plug for VBAT = 4 V. • Input comparator threshold voltages are defined as VTlow = VBAT/2 – 100 mV and VThigh = VBAT/2 + 100 mV, VBATmin = 3.2 V. The plug and unplug detection remains functional if there is no signal from HSOL amplifier output (stereo path is OFF) or if there is a signal from HSOL (stereo path is ON): maximum level on HSOL when the stereo path is ON is 1 Vp-p which stays far enough from the comparator threshold levels VBATmin/2 – 100 mV and VBATmin/2 + 100 mV. • Jack plug detection is functional if a plug event occurs before the power up of the module or if the plug event occurs after the power up of the module: analog detection part is always active if the battery is connected. Detection interrupts will be generated once the VRIO regulator is power up during the module power up sequence. • A level change on HSDET pad is sensed by a Schmitt trigger to provide a jack detection signal to the audio digital control. The audio digital control receives the detection signal and proceeds to a digital debouncing (time: 8 ms = 256 * 32 kHz clock periods) before sensing that a plug event happened on the jack connector. Headset Detect Low level input voltage VIL related to VBAT Parameter/Conditions High level input voltage VIH related to VBAT MIN TYP MAX 0.3 * VBAT 0.7 * VBAT Current with pull-up -40 UNIT -31 -15 μA 5.7.22. Remote Subscriber Identity Module (SIM) (Pads A7, A9, B7, B8, H5) The SIM, an integral part of any GSM terminal device, is a “smart card” that is programmed with subscriber information: • The user information consists of an International Mobile Subscriber Identity (IMSI) number, which is registered with the GSM provider, and an encryption Ki (pronounced "key"). This information consists of a microprocessor and memory installed on a plastic card. Note: The Enabler IIIG BGA module does not include an on-board SIM carrier, nor is a SIM provided with the module. The SIM must be obtained from the GSM service provider and must be provisioned by the operator for data and/or voice. Always take care to protect the SIM - the module will not operate properly without an attached SIM. GSM0408IG001 Page 47 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide The SIM provides the IMSI for authentication. To gain access to the GSM network, the network must recognize the IMSI number, and the terminal must be able to properly decrypt the data sent by the network. The SIM also serves as a buffer for SMS messages, storing the message for transmission until a radio link is available and buffering received messages until retrieved. The module supports the use of 1.8 V and 3 V SIM cards. All baud-rates defined in ISO 7816-3 standard are supported for high-speed transmission. As noted above, the Enabler IIIG BGA requires a remote SIM carrier/connector. When using a remote SIM, the following guidelines are provided: • To utilize a remote SIM, the integrator must provide a suitable SIM connector. • The maximum distance from the module to the remote SIM connector must not exceed 25.4 cm (10 inches). • It is recommended to have Zero resistance between the SIM connector and the module. • External ESD Protection is Required; 15 kV Air Discharge; 8 kV Contact Discharge; The transzorb must have a low junction capacitance (typically < 10 pf) such as the following part: Enfora PN: TRS-0000-5009 <25.4 cm (10 in) Enabler IIIG module Remote SIM SIM Interface SIM_VDD SIM_RST SIM_CLK SIM_DTC SIM_I/O Manufacturer: On Semi Manufacturer PN: NSQA6V8AW5T2G Figure 19 - Remote SIM Interface GSM0408IG001 Page 48 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Pad Name SIM_VDD SIM_CLK SIM_RST SIM_I/O SIMDTC Pad Number A8 B7 B8 A7 H5 Signal Direction I/O Description SIM VDD Card Reference Clock Card Reset Card I/O Data Card detect The module provides the regulated supply voltage for the SIM-card and the circuitry to detect the insertion or extraction of the SIM-Card in or from the mobile. The SIMDTC is disabled by default (see AT$SIMDTC in the EIII AT Command Manual for settings). When enabled, the SIMDTC pad has an internal pull up to Vcc and can be configured to detect a SIM insertion when the SIMDTC is either pulled to ground or left floating. It can configured to detect either just a SIM removal or both removal and insertion. When the module detects a SIM removal, it will de-register from the network. When the module is configured to and detects a SIM insertion, it will reset the module and re-register on the network. The SIM-card presence detection logic is active even when the system is in idle mode. USIM VDD Parameter/Conditions SIM VDD voltage VIH VIL VOH VOL II Iout PU PD Iz High level input voltage Low level input voltage High level output voltage, IO = 4 mA Low level output voltage, IO = 1 mA Input leakage current Output current PU resistance PD resistance Leakage current Debouncing time (SIM-card insertion) Debouncing time (SIM-card extraction) Pull-up resistor (resistor + resistive switch) Card Detect 5.7.22.1. Min 1.65 2.7 1.15 Typ 1.8 2.85 Max 1.95 2.95 0.5 15 Units μA mA kΩ kΩ μA mS mS 475 kΩ 0.61 Vdd-0.45 0.4 ±1 32 30 ± 30 Remote SIM Component Information Any compatible SIM carrier can be used in conjunction with the Enabler IIIG BGA module. For example: Lumberg P/N 8840_A_21. or Suyin P/N: 254016MA006G103ZL GSM0408IG001 Page 49 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 6. GSM/GPRS Modes of Operation GSM/GPRS supports many optional services and modes. The Enfora Enabler IIIG BGA module supports the following GSM/GPRS services: • Circuit-switched data • Short-Message Services (SMS) • Class B GPRS Functionality • Voice communication 6.1. Enabling the Transmission Modes for the GSM/GPRS Services Each of the GSM/GPRS services has two modes that can be enabled separately: • Mobile-originated (MO): allows the making of a service request (such as, making a telephone call or sending an SMS) • Mobile-terminated (MT): allows receiving a service request (such as receiving a telephone call or an SMS) Note: Contact your local GSM operator to ensure that the services and modes have been provisioned for the SIM. 6.2. Voice Communication The Enfora Enabler IIIG BGA module has full voice capabilities, provided the necessary connections have been made for the speaker and microphone pads. The Enfora Enabler-IIIG AT Command Set Reference - GSM0308AT001 has the entire list of commands that can be used to control the voice functionality. The quick start guide in this manual provides a basic command set that can be used to initialize and test the voice functionality. The module supports four vocoder compression algorithms for voice communication: Full-Rate (FR), Enhanced Full-Rate (EFR), Half-rate (HR) and Adaptive Multi-rate (AMR). 6.3. Circuit-Switched Data In this mode, the module supports both of the connection modes of transmission that are provided by GSM: • Non-Transparent mode delivers a constantly low error rate but with a non-guaranteed throughput or delay. The Non-Transparent service provides a performance that is closest to using a modem over a fixed Public Switched Telephone Network (PSTN) line. Note: All GSM service providers may not support transparent mode. In those cases, the module can be configured to switch automatically to Non-Transparent mode. This capability depends on the settings in the AT+CBST command. GSM0408IG001 Page 50 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 6.4. SMS: Short Message Services Short Message Services (SMS) is a feature-rich GSM service. The Enabler IIIG BGA module can perform the following tasks: • Sending and receiving binary messages of up to 160 characters (7-bit characters) • Sending and receiving text messages of up to 140 bytes (8-bit data) • Submitting a SMS Protocol Data Unit (PDU) to a SMSC (Short Message Service Center) and storing a copy of the PDU until either a report arrives from the network or a timer expires • Receiving a SMS PDU from a SMSC • Returning a delivery report to the network for a previously received message • Receiving a report from the network • Notifying the network when the module has sufficient memory capacity available to receive one or more SMS messages (after the module had previously rejected a message because its memory capacity was exceeded) GSM0408IG001 Page 51 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 7. SIM Operation 7.1. Provisioning the SIM The SIM can support optional features or services. Most operators typically configure the SIM to send/receive voice calls and to receive SMS; however, some may require an additional tariff to enable the SIM to send SMS. The transmission of circuit switched and GPRS data are also additional services that may be required to allow the service: • Mobile-originated (MO): allows making a service request (such as, making a call or sending an SMS) • Mobile-terminated (MT): allows receiving a service request (such as, receiving a phone call or an SMS) It is imperative for the Enabler IIIG BGA module that the SIM be configured for the optional services that are required for the application. 7.2. GSM Services Supported by the Enabler IIIG BGA Module The module supports four GSM services (modes of operation) that must be enabled by the operator: • Voice calls (MO and MT): requires a telephone number • SMS (MO and MT): uses the telephone number for Voice • Circuit-switched data calls (MO and MT): requires a telephone number • The GSM SIM can have multiple telephone numbers. 7.3. GPRS Services Supported by the Enabler IIIG BGA Module The module supports the following GPRS (modes of operation) that must be enabled by the operator: • GPRS Packet Connectivity (MO and MT) with Both Dynamic and Static IP option • GPRS SMS (MO and MT): uses the IP (Dynamic or Static) set by the operator • Multiple APN Setting • Quality of Service Options • Multi-slot 10 Class of Service 7.4. Selecting the GSM Modes of Operation When provisioning the SIM for the module, enable the following modes of operation: • Voice calls: configure the SIM for both MO and MT service (to send and receive) • SMS: configure the SIM either for MT alone (to receive) or for both MO and MT (to send and receive) • Circuit Switched Data: configure the SIM either for MO alone (to send) or for both MO and MT (to send and receive) GSM0408IG001 Page 52 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Voice MO/MT MO/MT MO/MT GSM0408IG001 SMS MT MO/MT MO/MT CS Data MO MO MO/MT GPRS Function Voice calls, receive SMS, make data calls Voice calls, receive / send SMS, make data calls Voice calls, receive / send SMS, make / receive data calls (requires an additional data telephone number) Page 53 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 8. Software Interface 8.1. Software Interface The application sends commands to the module via the UART interface pads. These commands use the Enfora AT Command Set and/or Enfora’s Packet API. The Enabler IIIG BGA module operates in one of the following modes: • Command mode: Used for configuring the module, for interrogating the GSM network, and for placing and receiving calls. It uses the AT command set via the serial port for communication. • On-line mode: Used after a circuit-switched data call has been established. Data is passed between the Enabler IIIG BGA module and the controlling application without command interpretation. The only AT command that is interpreted in On-line mode is the +++ command. (This command places the module in Command mode but does not terminate the circuit-switched data call.) • IP Packet /API Mode: Used to read/write modem parameters, interrogate network information, and place and receive calls in real-time, multi-tasking mode. The Packet API mode is facilitated over a PPP connection and the packets can be constructed according to the information provided in the Enfora GSM-GPRS Family API Reference GSM0308UG001. The AT command driver of the module never exits the Command state, that is, it never enters the Online mode. Although the host interface may not be able to access the AT command interpreter, it is always running and is available via the API Mode over a PPP connection and/or via the RF interface. • In the Command state, characters that are received from the Customer Premise Equipment (CPE) are treated as AT commands by the module. • In response to the commands received from the CPE, the module sends characters (AT commands) to the CPE. • Various events can also trigger the module to send characters (AT commands) to the CPE. Format for the AT Commands The general format of the command line is:AT See AT Command Manual 0X0D The prefix AT obtains synchronization, identifies the character parameters, and indicates that a command may be in the following characters. AT commands are not case sensitive: use either capital letters or lower-case letters for the AT command. Note: Some AT Command parameter values ARE case sensitive and are documented in the Enfora Enabler-IIIG AT Command Set Reference – GSM0308AT001. GSM0408IG001 Page 54 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 8.2. Enfora AT Command Set For a full description of the AT commands, refer to the Enfora GSM0308AT001 - Enabler-III AT Command Set. Note: A command description that includes an *asterisk denotes that the GSM service provider must enable supplementary services functionality before the command is available. 8.3. Enfora Packet Application Programming Interface 8.3.1. API Architecture For description and overview of the Enfora UDP and TCP-based API architecture please refer to the GSM0308UG001 - Enfora GSM-GPRS Family -API Reference. 8.4. Setup and Initialization 8.4.1. General Setup The GPRS modem is controlled through the Modem RS232 port on the development board. Connect a 9-pin straight through serial cable from the Modem RS232 connector to the serial port on the controlling computer. Hook up power supply, connect antenna, and install SIM into modem. 8.4.2. HyperTerminal Configuration for the Enabler IIIG BGA module The following provides an example for setting up a Windows HyperTerminal session that can be used to experiment with various configurations on the module for controlling computer: 1. Select the connection interface, Direct to Com 1 (or whatever port is the serial port). Figure 20 – Hyper Terminal Definition GSM0408IG001 Page 55 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 2. Configure the COM port as displayed below. Figure 21 - COM Port Settings 8.4.3. Initialization (AT Command Interface) In the GSM vocabulary, a call from GSM mobile to the PSTN is called a "mobile-originated call" or "outgoing call". A call from the fixed network to a GSM mobile is called a "mobile-terminated call" or "incoming call." In the following examples, “Entry” refers to the application. The following convention describes the direction of the data exchange: • The data exchange from the customer application to the module is designated as: Entry The data exchange from the module to the customer application is designated as: Response Note: With the exception of the +++ command (Online Escape Sequence), all commands must be preceded by the AT attention code (or command prefix) and terminated by pressing the character. In the following examples, the and are intentionally omitted for clarity and space. GSM0408IG001 Page 56 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 8.4.4. Initial Response to the AT Command After power is applied to the module, the module performs a power-up self-test. The self-test completes within one (1) second. When queried with the AT command, the module responds with one of the following result codes: • OK signifies that the module is ready, that it correctly interprets the AT command, and that it has executed the command. • ERROR signifies that the module does not understand the command or that the command is invalid. Entry Response AT OK Command valid: module is ready The module must be in AT Command mode (please refer to section 8.6 GPRS Packet Examples for packet mode initialization and setup) when any command is entered (with the exception of the online escape sequence). Commands entered when the module is in On-line mode are treated as data, and are transmitted as such to the receiving module. i.e. If the module is in PPP or SLIP mode, AT commands cannot be entered. 8.4.5. Sending an Initialization String to the Enabler IIIG BGA Module The following example provides the sample AT commands and responses for the following initialization tasks: • Reset the module to the factory defaults • Disable character echo • Transmit Result Codes • Set the module to Verbose mode (to display result codes as words) • Set the DCD to match the state of remote modem • Ignore the DTR Entry Response Entry Response GSM0408IG001 AT&FE0Q0V1&C1&d0 OK ATSO=1 OK Page 57 Initialization string Command is valid Auto answer on 1st ring Command is valid Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 8.4.6. Setting Up the Communication Mode for the Enabler IIIG BGA Module The following example sequence provides the AT command and response for setting the Enabler IIIG BGA module for full phone functionality, automated operator selection, 9600 baud, nontransparent mode. Entry Response Entry Response Entry Response 8.4.7. AT+CFUN=1 OK AT+COPS=0 OK AT+CBST=7,0,1 OK FULL phone functionality Command is valid Automatic operator selection Command is valid 9600 baud, non-transparent mode Command is valid Querying the Status of the Enabler IIIG BGA Module This topic is addressed in the Enfora Application Note GSM0000AN006 – Enabler-G Module Status Query. 8.4.8. Setting Module Reporting Parameters for GSM and GPRS This topic is addressed in the Enfora Application Note GSM0000AN007 - Enabler-G Status Reporting. 8.5. 8.5.1. GSM/SMS Examples Initialize the Enabler IIIG BGA Module to Send and Receive SMS Text Messages This topic is addressed in the Enfora Application Note GSM0000AN004 - Enabler-G SMS Configuration and Use. 8.5.2. Managing SMS Messages This topic is addressed in the Enfora Application Note GSM0000AN004 - Enabler-G SMS Configuration and Use. 8.5.3. Data Call Configuration This topic is addressed in the Enfora Application Note GSM0000AN003 - Enabler-G Data Circuit Switched Call Configuration and Use. 8.5.4. Voice Call Configuration This topic is addressed in the Enfora Application Note GSM0000AN003 - Enabler-G Data Circuit Switched Call Configuration and Use. 8.6. 8.6.1. GPRS Packet Examples GPRS ATTACH and ACTIVATE This topic is addressed in the Enfora Application Note GSM0000AN005 - Enabler-G Automated Network Connection Configuration and Use. GSM0408IG001 Page 58 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 8.6.2. Windows PPP Setup The Enabler IIIG BGA module can be used in a Windows operating system environment as a standard serial modem device. The required setup and configuration process is contained in Enfora Application Notes GSM0000AN001 - Enabler-G PPP Configuration for Windows 98 and GSM0000AN002 - Enabler-G PPP Configuration for Windows 2000. GSM0408IG001 Page 59 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 9. Integration and Testing The Enabler IIIG BGA module has been designed to minimize the amount of time required for integration and testing the application. By being fully certified by the appropriate bodies, the module provides seamless integration into the GSM network. The integration issues for the application can be narrowed to the utilization of the AT commands and the use of the GSM functionality. Coverage and signal quality may be evaluated by using the RSSI commands. Additional network information can be determined by using AT commands. Integration of the GPRS Packet capabilities is more complicated than using AT command sequences to initiate the connection and begin transferring data. The following Application Notes should be used to integrate the GPRS packet capabilities: GSM0000AN001 - Enabler-G PPP Configuration for Windows 98 GSM0000AN002 - Enabler-G PPP Configuration for Windows 2000 GSM0000AN008 - Enabler-G PPP Configuration for Windows XP GSM0000AN010 - Enabler-G PPP Configuration for PocketPC 2002 GSM0000AN005 - Enabler-G Automated Network Connection Configuration and Use 9.1. Integrating the Enfora Enabler IIIG BGA Module Note: Generally, all interfaces that are externally available to the end user need to be ESDconditioned and terminated in some way. Many of these interfaces should not be connected with power applied. At the highest level, this is done using some type of GSM test equipment (such as, Racal 6103E), a computer, and a serial interface tester. The GSM test equipment must be able to simulate a GSM call and measure the key parameters related to the module. Additionally, the serial interfaces and some minimal SIM functionality can be verified by sending AT commands to the module. All of these conditions need to be verified at ambient as well as extreme conditions. GSM0408IG001 Page 60 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide As part of integration, each of the following interfaces must be verified: Information SIM Recommendations The maximum line length of the SIM interface is 25.4 cm (10 inches). The module takes care of the signal conditioning As a minimum, an external application with a remote SIM will require a standard SIM carrier. Filter the SIM VCC signal with a 10 uf / 10 V capacitor to help with the line length. Primary and secondary serial Interfaces Reset Interface Audio/Microphone Interface The Enfora Enabler IIIG BGA module uses a 1.8V digital interface. The RS-232 signals must be level-shifted to get standard levels. These signals must be ESD-protected. Resets the module when tied low. The signal must be driven from an open collector/drain source. Preliminary balancing on the module. Maximum length TBD Testing the following parameters verifies the RF parameters that may be affected by such things as RF path loss, power supply noise, and external interference. Functionality Transmitter Receiver Parameters to be Tested Frequency Error Phase Error PA Ramp Modulation Spectrum RF Power Steps Timing Advance BER Based RX Tests (RXQUAL RXLEV) BER Based Sensitivity Testing the following GSM functionality verifies proper network communication. Functionality Transmitter Receiver Parameters to be Tested Frequency Error Phase Error PA Ramp Modulation Spectrum RF Power Steps Timing Advance BER Based RX Tests (RXQUAL RXLEV) BER Based Sensitivity Testing the following GSM functionality verifies proper network communication. Functionality Network Function GSM0408IG001 Parameters to be Tested Synchronization and registration Call set-up and call termination (both MT and MO calls) SMS and/or data calls Page 61 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 10. APPENDIX A - LIMITED WARRANTY 10.1. Scope Enfora warrants to the original purchaser of the product that, for a period of one (1) year from the date of product purchase, the product hardware, when used in conjunction with any associated software (including any firmware and applications) supplied by Enfora, will be free from defects in material or workmanship under normal operation. Enfora further warrants to such original purchaser that, for a period of ninety (90) days from the date of product purchase, any software associated with the product will perform substantially in accordance with the user documentation provided by Enfora, and any software media provided with the product will be free from defects in material or workmanship under normal operation. Enfora does not warrant that (a) the product hardware or any associated software will meet the purchaser’s requirements, (b) that the operation of the product hardware or software will be uninterrupted or error-free, or (c) the product, when integrated in, or combined with, other products or software not supplied by Enfora, will continue to perform substantially in accordance with the user documentation. This limited warranty is only for the benefit of the original purchaser and is not transferable. No other party may act on behalf of such purchaser for the purpose of claiming or exercising any rights or benefits under or in connection with this limited warranty except as may be provided in a written agreement between Enfora and such other party. 10.2. Hardware During the warranty period applicable to the product hardware, Enfora, at its expense and in its sole discretion, will repair or replace the product if it is determined to have a covered hardware defect, provided that the purchaser first notifies Enfora of any such defect, furnishes Enfora with a proof of purchase, requests and obtains a return merchandize authorization (RMA) number from Enfora, and returns the product, shipping charges prepaid, to Enfora under that RMA. If, upon reasonable examination of the returned product, Enfora does not substantiate the defect claimed by purchaser, or determines that the defect is not covered under this limited warranty, Enfora will not be required to repair or replace the product, but may instead reship the product to the purchaser, in which case purchaser shall be responsible for paying Enfora’s usual charges for unpacking, testing, and repacking the product for reshipment to purchaser. Purchaser shall bear the risk of loss or damage in transit to any product returned by purchaser to Enfora, or any returned product not found to be defective or covered under this warranty and reshipped by Enfora to purchaser. In the event Enfora repairs or replaces a defective product, the repaired or replacement product will be covered under this limited warranty for the remainder of the original warranty period on the defective product. If Enfora is unable to repair or replace a defective product, the purchaser’s exclusive remedy shall be a refund of the original purchase price. Any returned and replaced product, or any product for which Enfora has refunded the original purchase price, becomes the property of Enfora. 10.3. Software During the warranty period applicable to the software or its media, Enfora, at its expense, will replace any defective software or media if purchaser gives written notification of the defect to the technical support department at Enfora during the applicable warranty period. Enfora will ship or otherwise transmit the replacement software or media to purchaser, and purchaser shall be responsible for incorporating any replacement software in the product. Enfora shall not have any obligation to provide any software bug fixes, upgrades or new releases except as may be necessary to correct any covered defect of which purchaser notifies Enfora in writing during the applicable warranty period. Enfora, from time to time and in its sole discretion, may make available for download on its website (www.enfora.com) certain software bug fixes, upgrades or new releases for the product. The purchaser should periodically visit such website to determine whether any such bug fixes, upgrades or new releases have become available. Download and use of any such bug fixes, upgrades or new GSM0408IG001 Page 62 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide releases is subject to all of the applicable terms and conditions of Enfora’s technical support policy as posted and updated on its website. Exceptions and Disclaimers Enfora shall have no obligation under this limited warranty for (a) normal wear and tear, (b) the cost of procurement of substitute products or (c) any defect that is (i) discovered by purchaser during the warranty period but purchaser does not notify or request an RMA number from Enfora, as required above, until after the end of the warranty period, (ii) caused by any accident, misuse, abuse, improper installation, handling or testing, or unauthorized repair or modification of the product, (iii) caused by use of any software other than any software supplied by Enfora, or by use of the product other than in accordance with its documentation or (iv) the result of electrostatic discharge, electrical surge, fire, flood or similar causes. Unless otherwise provided in a written agreement between the purchaser and Enfora, the purchaser shall be solely responsible for the proper configuration, testing and verification of the product prior to deployment in the field. ENFORA’S SOLE RESPONSIBILITY AND PURCHASER’S SOLE REMEDY UNDER THIS LIMITED WARRANTY SHALL BE TO REPAIR OR REPLACE THE PRODUCT HARDWARE, SOFTWARE OR SOFTWARE MEDIA (OR IF REPAIR OR REPLACEMENT IS NOT POSSIBLE, OBTAIN A REFUND OF THE PURCHASE PRICE) AS PROVIDED ABOVE. ENFORA EXPRESSLY DISCLAIMS ALL OTHER WARRANTIES OF ANY KIND, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, SATISFACTORY PERFORMANCE AND FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ENFORA BE LIABLE FOR ANY INDIRECT, SPECIAL, EXEMPLARY, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOSS OR INTERRUPTION OF USE, DATA, REVENUES OR PROFITS) RESULTING FROM A BREACH OF THIS WARRANTY OR BASED ON ANY OTHER LEGAL THEORY, EVEN IF ENFORA HAS BEEN ADVISED OF THE POSSIBILITY OR LIKELIHOOD OF SUCH DAMAGES. 10.4. Other Considerations Some jurisdictions may require a longer warranty period than specified above and, accordingly, for products sold in those jurisdictions the applicable warranty period shall be extended as required under the laws of those jurisdictions. Furthermore, some jurisdictions may not allow the disclaimer of implied warranties or the exclusion or limitation of incidental or consequential damages, so the above disclaimer, limitation or exclusion may not apply to products sold in those jurisdictions. This limited warranty gives the purchaser specific legal rights and the purchaser may have other legal rights that vary from jurisdiction to jurisdiction. In some instances, certain aspects of the product warranty may also be covered in a separate written agreement between Enfora and the distributor or reseller, if any, from whom purchaser purchased the product. That agreement may provide, for example, a different product return procedure that may also be available to purchaser (e.g., the product may be returned to Enfora through that distributor or reseller). Governing Law This limited warranty shall be governed by the laws of the State of Texas, United States of America, without regard to conflict of laws principles. This limited warranty shall not be governed in any respect by the United Nations Convention on Contracts for the International Sale of Goods. GSM0408IG001 Page 63 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 11. APPENDIX B - Regulations and Compliance This section summarizes the responsibilities and actions required of manufacturers and integrators who incorporate OEM versions of the Enfora Enabler IIIG BGA module into their products. In certain situations and applications, these products will require additional FCC, CE, GCF, PTCRB or other regulatory approvals prior to sale or operation. Appropriate instructions, documentation and labels are required for all products. For more information concerning regulatory requirements, please contact Enfora. 11.1. GCF/PTCRB Approval (Formerly FTA) The Enfora Enabler IIIG BGA module is type approved in accordance with the requirements of and through the procedures set forth by the GSM industry association. The relevant conformance specification is 3GPP TS 51010-1. Any OEM changes in the SIM interface, antenna port, software or the physical makeup of the unit may require an incremental FTA to ensure continued compliance with the above-mentioned standard. For more information concerning type approval, please contact Enfora. 11.2. Electromagnetic Compatibility (EMC) and Safety Requirements The Enfora Enabler IIIG BGA module has been tested and approved for application in the United States of America (US) and the European Union (EU). The compliance details for each of these markets follow. For other markets, additional or alternative regulatory approvals may be required. Always ensure that all rules and regulations are complied with in every country that the OEM application is to be operated. Regardless of the country or market, the OEM must comply with all applicable regulatory requirements. 11.3. EMC/Safety Requirements for the USA Compliance to the US rules and regulations falls under two categories: • Radio approvals: Federal Communications Commission (FCC) • Transmitter: FCC Rules, Part 22 & 24 • Unintentional emission: FCC Rules, Part 15 Although the Enfora Enabler IIIG BGA module has been authorized by the FCC and listed as a component by an NRTL, products and applications that incorporate the module will require final verification of EM emission and product safety approval. Note: Particular attention should be made to the following statements regarding RF Exposure: GSM0408IG001 Page 64 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 11.4. Human Exposure Compliance Statement GSM0408 GSM/GPRS Module Enfora certifies that the Enabler IIIG BGA 850/900/1800/1900 MHz GSM Radio Module (FCC ID: MIVGSM0408) complies with the RF hazard requirements applicable to broadband PCS equipment operating under the authority of 47 CFR Part 24, Subpart E and Part 22 of the FCC Rules and Regulations. This certification is contingent upon installation, operation and use of the Enfora Enabler IIIG BGA module and its host product in accordance with all instructions provided to both the OEM and end user. When installed and operated in a manner consistent with the instructions provided, the Enfora Enabler IIIG BGA module meets the maximum permissible exposure (MPE) limits for general population / uncontrolled exposure at defined in Section 1.1310 of the FCC Rules and Regulations. Note: Installation and operation of this equipment must comply with all applicable FCC Rules and Regulations, including those that implement the National Environmental Policy Act of 1969 (Part 1, Subpart I), with specific regard to antenna sitting and human exposure to radio frequency radiation. For further guidance, consult the FCC Rules, a certified FCC test house, or Enfora. 11.5. Compliance with FCC Regulations The Federal Communications Commission (FCC) is the agency of the Federal Government that oversees all non-governmental radio frequency transmitters that operate within the United States. Unintentional emissions from digital devices are regulated by Part 15 of the FCC Rules and Regulations, which distinguishes between the environments in which these devices may operate. Intentional radiators operating as a GSM-1900 radio transmitter are regulated under Part 22 & 24, Subpart E—Broadband PCS of the FCC Rules and Regulations. 11.6. Unintentional Radiators, Part 15 Equipment designated as Class A is intended for use in a commercial, industrial or business environment. The Enfora Enabler IIIG BGA module has been tested and found to comply with the limits for a Class A digital device and can be integrated into equipment or applications intended for use in commercial, industrial or business environments. The following statement must be included in the user manual for such products: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. Equipment intended for use in a residential environment (not-withstanding use in commercial, industrial or business environments) is designated as Class B. The Enfora Enabler IIIG BGA module has been tested and found to comply with the limits for a Class B digital device and can be integrated into equipment or applications intended for use in residential environments. The following statement must be included in the user manual for such products: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection GSM0408IG001 Page 65 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures: 11.7. • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Intentional Radiators, Part 22 & 24 Products incorporating the Enfora Enabler IIIG BGA module operate as Personal Communications Services (PCS) devices under the authority of Part 22 & Part 24, Subpart E—Broadband PCS, of the FCC Rules and Regulations. All such transmitters must be authorized by the FCC through its Certification process, as detailed in Part 2, Subpart J - Equipment Authorization Procedures. Through the Certification process, the FCC verifies that the product complies with all applicable regulatory and technical requirements, including those that address human exposure to radio frequency radiation. In general, radio frequency transmitters cannot be sold or operated in the US prior to FCC approval. 11.8. Instructions to the Original Equipment Manufacturer (OEM) To comply with the requirements of the National Environmental Policy Act (NEPA) of 1969, operation of an FCC-regulated transmitter may not result in human exposure to radio frequency radiation in excess of the applicable health and safety guidelines established by the FCC. Further information on RF exposure issues may be found in the FCC's Office of Engineering and Technology (OET) Bulletin Number 65, "Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields" and Supplement C, "Additional Information for Evaluating Compliance of Mobile and Portable devices with FCC Limits for Human Exposure to Radio Frequency Emissions.” Both of these documents are available via the Internet at the OET web site: http://www.fcc.gov/oet The Enfora Enabler IIIG BGA modules are GSM radio transceivers, which operate under the authority of 47 CFR Part 24, Subpart E and Part 22 of the FCC Rules and Regulations. When installed and operated in accordance with the instructions provided in this manual, these devices comply with current FCC regulations regarding human exposure to radio frequency radiation. The following installation and operation restrictions apply to all Enfora Enabler IIIG BGA devices: • This device may only be used in fixed and mobile applications. • Portable applications, as defined by the FCC, are prohibited. • The use of this device for desktop and other applications where the antenna can easily be relocated are considered by the FCC to be mobile applications. • A separation distance of at least 20 cm (7.87 inches) between the antenna and the body of the user and other persons must be maintained at all times • In FIXED applications, antenna gain is limited to a maximum of 7 dBi, with a corresponding Equivalent Isotropic Radiated Power (EIRP) of 37 dBm / 5 W. • In MOBILE applications, antenna gain is limited to a maximum of 2 dBi, with a corresponding EIRP of 33 dBm / 2 W. GSM0408IG001 Page 66 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide • End products must provide instructions to ensure compliance with radio frequency radiation exposure requirements. • A warning label visible to all persons exposed to the antenna and identical to that described in this manual must be displayed on or next to the antenna. • Separate FCC approval for RF exposure compliance is required for end products that do not meet these conditions. Antenna gain is defined as gain in dBi (dB referenced to an isotropic radiator) minus cabling loss. Note: Additional care must be taken by the installer and/or user of the Enfora Enabler IIIG BGA module to ensure proper antenna selection and installation. Adherence to the above conditions is necessary to comply with FCC requirements for safe operation regarding exposure to RF radiation. Depending upon the application and type of product into which the Enfora Enabler IIIG BGA module has been incorporated, specific OEM actions and responsibilities required to meet these conditions vary. However, in all cases the primary concern is to ensure compliance with current FCC guidelines and regulations that limit human exposure to radio frequency radiation. Definitions For the purpose of determining compliance with current FCC rules addressing human exposure to radio frequency radiation, the FCC has established the following three categories of transmitting devices: • Portable Devices – devices where the antenna is located within 20 cm (7.87 inches) of any person, including the user, if applicable. Portable devices operating under the authority of Part 22 or 24 (broadband PCS) are limited to a maximum of 2 W EIRP. • Mobile Devices – devices designed to be used in other than fixed locations and generally such that the antenna is located at a minimum of 20 cm (7.87 inches) from any person, including the user, if applicable. Mobile devices operating under the authority of Part 22 or 24 (broadband PCS) are limited to a maximum of 2 W EIRP. • Fixed devices – devices in which the antenna, either integral to the product or remotely located, is physically secured at one location and is not able to be easily moved to another location. The antenna for a fixed device is mounted on an outdoor permanent structure with a minimum separation distance of 2 meters (79 inches) 11.8.1. OEM Responsibilities for All Products Containing the Enabler IIIG BGA module In addition to any other regulatory requirements, OEMs and integrators must include or provide the following information, instructions, warnings and labels with any device or product into which the Enfora Enabler IIIG BGA GSM1900 GSM transceiver has been incorporated: GSM0408IG001 Page 67 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide Information Detailed Operating Instructions for ensuring compliance with current FCC guidelines which limit human exposure to radio frequency radiation Antenna Avoidance Label Human Exposure Compliance Statement GSM0408IG001 Description The OEM must provide an operating/installation manual with the final product which clearly indicates that these operating conditions and restrictions must be observed at all times to ensure compliance with current FCC guidelines which limit human exposure to radio frequency radiation. 20 cm (7.87 inch) separation distance between the antenna and all persons must be maintained at all times for all fixed and mobile products and applications Portable devices and applications are prohibited unless such devices and products are specifically authorized by the FCC Maximum antenna gain is limited to 2 dBi* in mobile products and applications For fixed applications (2 meter separation) the antenna gain can be as much as 26 dBi. Modifications and/or additions to the Enfora Enabler IIIG BGA GSM transceiver, including use of antennas with higher gain than those authorized by the FCC, are prohibited *dBi = antenna gain in dB relative to an isotropic radiator Attach the following warning label directly to or displayed next to the WARNING antenna. Furthermore, this label must To comply with FCC RF exposure be visible to and easily readable by all requirements, a separation distance of 20 cm persons in the immediate vicinity of the (7.87”) or more must be maintained between antenna this antenna and all persons Include the following statement in the instruction / operation manual. Page 68 Enfora certifies that the Enfora Enabler IIIG BGA ™ GSM Radio Module (FCC ID: MIVGSM0408) complies with the RF hazard requirements applicable to broadband PCS equipment operating under the authority of 47 CFR Part 22 or Part 24, Subpart E of the FCC Rules and Regulations. This certification is contingent upon installation, operation and use of the Enfora Enabler IIIG BGA module and its host product in accordance with all instructions provided to both the OEM and end used. When installed and operated in a manner consistent with the instructions provided, the Enfora Enabler IIIG BGA module meets the maximum permissible exposure (MPE) limits for general population / uncontrolled exposure at defined in Section 1.1310 of the FCC Rules and Regulations. Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 11.8.2. Specific OEM Responsibilities for Portable Products and Applications Each device or product into which the Enfora Enabler IIIG BGA PCS-1900 GSM transceiver has been incorporated, and which is intended to be used in an application that meets the definition of "portable", MUST be separately authorized by the FCC for the purposes of determining compliance with current FCC guidelines limiting human exposure to radio frequency radiation. Portable devices must be evaluated for RF exposure based on Specific Absorption Rate (SAR) limits; further information on such evaluations are available from the FCC via the Internet. 11.8.3. Specific OEM Responsibilities for Mobile Products and Applications Separate or additional FCC approvals are NOT required for devices or products, into which the Enfora Enabler IIIG BGA PCS-1900 GSM transceiver has been incorporated, that are used in applications that meet the definition of "mobile." For all end products, the OEM or integrator must provide instructions, warnings and labels to ensure that the product complies with current FCC guidelines limiting human exposure to radio frequency radiation. Current FCC regulations limit the EIRP of mobile devices to 2 W. Because the nominal RF output power of the Enfora Enabler IIIG BGA GSM1900 GSM transceiver is 1.0 W (31 dBm), antenna gain for mobile products and applications cannot exceed 2 dBi. 11.8.4. Specific OEM Responsibilities for Fixed Products and Applications Separate or additional FCC approvals are not required for devices or products, into which the Enfora Enabler IIIG BGA GSM transceiver has been incorporated, that are used in applications that meet the definition of "fixed.” For all end products, the OEM or integrator must provide the instructions, warnings and labels to ensure that the product complies with current FCC guidelines limiting human exposure to radio frequency radiation. Separate or additional FCC approvals are required for devices or end products used in fixed applications where antenna gain in excess of 7dBi is desired. GSM0408IG001 Page 69 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 11.9. EMC/Safety Requirements for the Countries of the European Union (EU) The European Union (EU) is comprised of fifteen countries that follow a harmonized set of standards, utilizing the CE mark as a uniform mark of acceptance. The member countries are: • • • • • • • • • • • • • • • • • • • • • • • • Austria Belgium Cyprus Czech Republic Denmark Estonia Finland France Germany Greece Hungary Ireland Italy Latvia Lithuania Luxembourg The Netherlands Poland Portugal Slovakia Slovenia Spain Sweden United Kingdom 11.10. EMC/Safety Requirements for Other Countries In most other countries that have not been listed above there are similar rules and regulations that must be met for importing the Enfora Enabler IIIG BGA module. Each may require a different mark of approval (for example, the CB Scheme) as an acceptance requirement. For each of these cases the country should identified, and the appropriate steps should be taken to meet the requirements set forth in the intended market. GSM0408IG001 Page 70 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 12. APPENDIX C - Glossary and Acronyms AMR API App Application AT Command Set BER Bit Error Rate CMUX CPE Customer Premise Equipment CSD Circuit Switched Data dBi DCE Data Communications Equipment DCS Digital Cellular System DTE Data Terminal Equipment EFR Enhanced Full Rate EIR Equipment Identity Register EIRP Equivalent Isotropic Radiated Power EMC Electromagnetic Compatibility ESD Electrostatic Discharge EU European Union FTA Full Type Approval GPRS General Packet Radio Service GSM Global System for Mobile Communications GSM0408IG001 Adaptive Multi-Rate Application Programming Interface. Refers to the Application which sends or receives commands/responses from the Enfora Enabler IIIG BGA Module Commands issued by intelligent device to a modem to perform functions, such as to initiate call, to answer call, or to transmit data. Bit Error Rate Multiplexer protocol that operates between an MS and a TE and allows a number of simultaneous sessions over a normal serial asynchronous interface A terminal in fixed location on the customer’s premises. Data link from a terminal through the network allowing real-time, duplex connectivity at 9600 bytes/second. Decibels referenced to an isotropic radiator Data Communications Equipment A collection of services and capabilities providing flexibility of access and mobility through a combination of wireless and wireline networks, utilizing the 1800 MHz bandwidth. Data Terminal Equipment Voice (vocoder) compression algorithms which offer the highest quality voice communication. A database used to store International Mobile Equipment Identity (IMEI) of a locally issued terminal. In a given direction, the gain of a transmitting antenna multiplied by the net power accepted by the antenna from the connected transmitter. The ability of a device to function satisfactorily in its electromagnetic environment without inducing intolerable disturbance to that environment (or to other devices) Static electricity that can damage electronic equipment. An organization of 15 European states whose purpose is to organize relations between the Member States and between their peoples. GSM Full Type Approval Standard for packet communications utilizing Global Standard for Mobility (GSM) infrastructure. Standard for digital communications. Allows consistent communications in various parts of the world despite variations in RF spectrum allocations. Transferring the SIM (see below) permits users to roam by changing terminal equipment. Page 71 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide HLR Home Location Register Stores the identity and user data for all subscribers belonging to the area of the related MSC. IMEI International Mobile Equipment Identity IMSI International Mobile Subscriber Identification Ki A unique number for each GSM Terminal tracked by the GSM operators in their Equipment Identity Register (EIR) database. MO Mobile Originated MT Mobile Terminated MSC Mobile Switching Center Non-Transparent Mode NRTL Nationally Recognized Test Laboratory OEM PA Packet PCS PDA PDU PPP SIM SMS SMSC SUPL UDP GSM0408IG001 A unique number identifying the subscriber stored in the SIM card. Number is used in conjunction with the network for call routing. A secret code used in authentication and encryption by the terminal. Any GSM/GPRS service originated at the mobile terminal. Any GSM/GPRS service originated from or routed through the network and sent to the mobile terminal. The central switch of the GSM network. Performs call routing, collects call detail records for billing, and supervises system operations. Delivers a constantly low error rate but with a non-guaranteed throughput or delay. The Non-Transparent service provides a performance that is closest to using a modem over a fixed PSTN line. OSHA-approved Nationally Recognized Testing Laboratory Original Equipment Manufacturer. Power Amplifier. A collection of data transmitted over a digital network in a burst. Personal Communication Services. Personal Digital Assistant. Packet Data Unit. Point-To-Point Protocol. Subscriber Identity Module. Short Message Service. Short Message Service Center. Secure User Plane Location User Datagram Protocol. Page 72 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 13. APPENDIX D – Tables and Figures TABLES Table 1 - Enabler IIIG BGA Key Features .................................................................................................. 8 FIGURES Figure 1 – Example of placement and ground plane for the module host board ........................................ 14 Figure 2 – Example of solid flooding on layer 4 with via interconnect ........................................................ 14 Figure 3 – Example of thermal relief and Vbat feed ................................................................................... 15 Figure 4 - Example of Vbat Voltage Droop ................................................................................................. 16 Figure 5 – Example of layer 2 routing fanout .............................................................................................. 17 Figure 6 – Example of layer 3 UART and audio fanout .............................................................................. 17 Figure 7– Handset Audio Reference Schematic ......................................................................................... 18 Figure 8 – Headset Audio Reference Schematic ........................................................................................ 19 Figure 9 – Audio interface layout examples ................................................................................................ 19 Figure 10 - Enabler IIIG BGA Module Block Diagram ................................................................................ 21 Figure 11 - Module Dimensions .................................................................................................................. 24 Figure 12 - Host PCB Footprint ................................................................................................................... 25 Figure 13 – Power Control Switch .............................................................................................................. 35 Figure 14 – Typical connection of PWR_CTL to modem:........................................................................... 35 Figure 15 – Typical use controlling PWR_CTL from microcontroller: ......................................................... 35 Figure 16 - External Power Control Signal (no external processor) ........................................................... 36 Figure 17 - Power Control Signal (using external processor) ..................................................................... 36 Figure 18 - Ring Indicate Timing ................................................................................................................. 41 Figure 19 - Remote SIM Interface ............................................................................................................... 48 Figure 20 – Hyper Terminal Definition ........................................................................................................ 55 Figure 21 - COM Port Settings .................................................................................................................... 56 GSM0408IG001 Page 73 Rev. DRAFT – 03/10/2008 Enfora Enabler IIIG BGA Modem Integration Guide 14. APPENDIX E - Contacting Enfora For technical support and customer service dealing with the modem itself, contact the company where you purchased the product. If you purchased the product directly from Enfora, visit the SUPPORT page on the Enfora website: http://www.enfora.com/support_newissue.asp GSM0408IG001 Page 74 Rev. DRAFT – 03/10/2008
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