Panasonic FP (ABP8) User Manual To The E5a78807 C1a7 44b7 95e0 6ec98f54a496
User Manual: Panasonic FP (ABP8) to the manual
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plications p a w e n r o f t No ABP8 A PIERCED EARRING SIZE DETECTION SWITCH FP (ABP8) SWITCHES • Ultra-miniature size (3.4×3.4×2.4mm .134×.134×.094 inch) Meet the market requirements of FDD miniaturization • Low operating force Max. 0.3 N • SMD type available ORDERING INFORMATION Type Part No. Type I ABP811161P Type II ABP811261P Remarks: Standard packaging 1 reel: 2,000 pcs. 1 case: 5 reels (10,000 pcs.) TYPICAL APPLICATIONS • Floppy Disk Drivers • Optical Disk Drivers • CD-ROM Drivers • Notebook Personal Computers • Portable Handy Phones • VCR • Printers SPECIFICATIONS 1. Contact rating Standard rating Low-level circuit rating 0.1A 10V DC 0.01mA 5V DC 2. Characteristics Expected electrical life (Min. operations) 0.1A 10V DC resistive Min. 5×104 10mA 5V DC resistive Min. 105 Insulation resistance (by 100V DC insulation resistance meter) Min. 100MΩ Dielectric Strength 100Vrms for 1 min. Vibration resistance 14.7m/s2 8 to 500Hz (contact opening: Max. 10µsec.) Shock resistance Min. 294 m/s2 (contact opening: Max. 10µsec.) –25°C to +80°C –13°F to +176°F (not freezing below 0°C 32°F) Ambient temperature Max. 3Ω (by HP4328A) Initial contact resistance 3. Operating characteristics Type I Operating force Max. Free position Max. Type II 0.3 N mm inch 3.7 .146 4.9 .193 4.5±0.2 .177 ±.008 Operating position mm inch 3.3±0.2 .130 ±.008 Total travel position Max. mm inch 2.3 .091 Total stroke mm inch 3.5 .138 1.2 .047 140 01/2006 ABP8 DIMENSIONS mm inch Type II Type I 1.0 .039 Terminal #3 0.2 .008 3.4 .134 1.0 .039 Recommended PC board pattern (Top view) 0.2 .008 Terminal #3 Terminal #1 Terminal #1 3.4 .134 3.7 .146 1.1 .043 0.7 .028 1.1 .043 1.5 .059 0.3 .012 1.5 .059 Terminal #2 C L C L Terminal #2 1.3+0.2 −0 dia. hole .051+.008 dia. hole −0 0.8 dia. .031 dia. 0.8 dia. .031 dia. OP±0.2 3.3 ±.008 FP TTP .130 3.7 max. 2.3 max. .146 .091 Schematic 1.2 .047 2.3 .091 OP±0.2 4.5 ±.008 .177 FP TTP 4.9 max. 3.5 max. .193 .138 SPST-NO 2.9 2.3 .114 .091 Terminal #1 Terminal #3 Terminal #2 C0.1 0.25 0.15 max. .004 1.2±0.05 dia. .010 .006 ±.002 dia. .047 C0.1 .004 0.25 0.15 max. .006 ±0.05 1.2±.002 dia. .010 dia. .047 NOTES Temperature (°C °F) 1. Soldering operations 1) For manual soldering; By using 18W Max. (iron tip temperature: 320°C 608°F Max.) soldering should be completed within 3 seconds. 2) For reflow soldering; Perform soldering reflow at a peak surface temperature of the PC board not to exceed 245°C 473°F. See the below recommended temperature profile. 245 473 220 428 150 302 Recommended condition for reflow temperature profile with 30 sec. 3) During soldering, care should be taken not to apply excessive stress to the terminals as the resulting deformation may cause malfunction. Excessively high solder tab temperature and soldering iron wattage should also be avoided as these factors may harm switching performance. 2. Setting of the operation object In setting the operation object; keep the following distance between the switch bottom and the operation object at T.T.P. (Total Travel Position) migration, etc.). Use the type with the gold contacts in applications involving trains, aircraft, motor vehicles or medical equipment where the switch must satisfy safety and high reliability requirements. Please consult with us for the applications required high reliability. 3) Because the humidity range differs depending on the ambient temperature, the humidity range indicated below should be used. Continuous operation of the switch is possible within this range, but continuous use near the limit of the range should be avoided. • This humidity range does not guarantee permanent performance. ;;;;; ;;;;;;;;;; ;;;;;;;;;; ;;;;;;;;;; ;;;;;;;;;; ;;;;;;;;;; ;;;;;;;;;; ; ;;;;;;;; Preheating within 2 min. ABP811161P: 2.3 to 2.9mm .091 to .114 inch ABP811261P: 3.5 to 4.1mm .138 to .161 inch 3. Quality Check under Actual Loading Conditions To assure reliability, check the switch under actual loading conditions. Avoid any situation that may adversely affect switching performance. 4. Environment 1) These switches do not have a sealed construction. As such, the construction of the equipment in which the switches are to be installed should be given careful consideration when the switches are to be used in locations where corrosive gases, silicon or other substances which will adversely affect the contacts are used, where there is a high concentration of dust or where the switches may be exposed to condensation or water. Using switches in locations like these may cause malfunctioning. 2) Avoid using this switch in high-temperature, high-humidity or condensationforming environments and avoid allowing droplets of water to remain on the switch or come into contact with it. These conditions may interfere with the performance of the switch (resulting in short-circuiting, Humidity, %R.H. 85 Tolerance range (Avoid freezing when (Avoid used at temperatures condensation lower than 0°C 32°F) when used at temperatures higher than 0°C 32°F) 5 –25 –13 0 80 +32 176 Temperature, °C °F 141 01/2006
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.5 Linearized : No Page Mode : UseOutlines XMP Toolkit : 3.1-701 About : uuid:467ecb86-1298-408b-acea-a519bde1107a Producer : Acrobat Distiller 4.0 for Macintosh Create Date : 2004:03:23 18:45:48Z Modify Date : 2006:01:19 14:36:47+01:00 Metadata Date : 2006:01:19 14:36:47+01:00 Document ID : uuid:ec415676-d61b-4a39-8512-c1cffb2a96bf Instance ID : uuid:dc5aea26-eb15-4a67-9dec-8cd188a20e01 Format : application/pdf Has XFA : No Page Count : 2 Page Layout : SinglePageEXIF Metadata provided by EXIF.tools