210003_GPM_General_Purpose_Memory_Module_1977 210003 GPM General Purpose Memory Module 1977
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GENERAL PURPOSE MEMORY MODULE
GPM AND GPM - Sol
ASSEMBLY AND TEST INSTRUCTIONS
~Processor
I~TechiioIogy
Processor lec~'Corporation
6200HoIlisS~~T
Emeryville CA Sl4608
GENERAL PURPOSE MEMORY MODULE
GPM and GPM-Sol
ASSEMBLY and TEST INSTRUCTIONS
{
~--
Copyright ~1977, Processor Technology Corporation
First Printing, July, 1977
Manual No. 210,003
PROCESSOR TECHNOLOGY CORPORATION
Contents
GPM
1
INTRODUCTION and GENERAL INFORMATION
1.1
Introduction
1.2
General Information .
1.2.1
1.2.2
1.2.3
1.3
.
. . 1-1
· 1-1
Description . . .
. . . . . . 1-1
GPM and GPM-Sol Version~ . . . • . . . 1-2
GPM Voltage Requirements, Typical . . . 1-4
Warranty and Replacement Information
1.3.1
1.3.2
1.3.3
1.3.4
2
PAGE
TITLE
SECTION
Receiving Inspection . . . .
Warranty Information
Replacement Parts
. . . . .
Factory Service
. . .
· . 1-4
. . . . . 1-4
. •.
1-4
. . . . . 1-4
. . 1-5
ASSEMBLY
2.1
Parts and Components
· 2-1
2.2
Assembly Tips . . . .
• 2-1
2.3
Assembly Precautions
2.3.1
2.3.2
2.3.3
2.3.4
2.3.5
·
. 2-3
Handling MOS Integrated Circuits
·
Soldering **IMPORTANT** . . . . .
·
Installing and Removing GPM Module . ·
Installing and Removing Integrated
Circuits . . . . . . . . . . . .
.
Use of Clip Leads.
........
2-3
2-3
2-3
2-4
2-4
2.4
Required Tools, Equipment and Haterials . . . 2-4
2.5
Orientation .
2.6
Assembly-Test .
2.6.1
2.6.2
2.6.3
2.6.4
· 2-4
· . 2-4
Circuit Board Check . . . . . .
.
Assembly-Test Procedure . . . . . . .
ALS-8, and ALS-8 with SIM-l and TXT-2
Options . . . . . . . . . . . . . . •
Operation in Computers without
Sense Switches . • • . . . . • . • •
2-5
2-7
2-12
2-12
PROCESSOR TECHNOLOGY CORPORATION
GPM
Contents
SECTION
3
GPM OPTIONS
3.1
GPM Options
3.2
Switch Options
• . . 3-2
3.3
Read Only Memory Options
• . . 3-2
3.3.1
3.3.2
4
. 3-1
Replacing 9216Bs with 8316Es or
34000Ps . . . . . . . . . . . . • . . 3-2
Replacing 9216Bs with Two 2708 PROMS. 3-3
THEORY OF OPERATION
4.1
Overview
4.2
Circuit Description
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.2.7
5
PAGE
TITLE
. 4-1
. . 4-1
Address Decoding
......•..
Memory Allocation
. . . . ..
Read Operation . .
. . • . . .
Write Operation
. . . ..
.•
Phantom (Automatic) Start-up .
.•
Wait State Circuit . . . . .
. •.
Regulators . . . . . • • . . . . • . .
DRAWINGS
GPM Assembly Drawing
Schematic, GPM Module Drawing
APPENDICES
1
Statement of Warranty
2
8080 Operating Codes
3
Standard Color Code
4
Loading DIP Devices,
Soldering Tips and
Installing Augat Pins
5
IC Pin Configurations
4-1
4-2
4-3
4-3
4-4
4-4
4-4
PROCESSOR TECHNOLOGY CORPORATION
Tables/Figures
GPM
TITLE
TABLE
2-1
GPM Parts List
3-1
Switch Settings Necessary To Operate the GPM
Module . . . . . . . • . . . . . . .
PAGE
2-2
. . 3-1
3-2
Replacing 92l6B (lKx8) ROMs with 8316E or
34000P (2Kx8) RO~1s . . . .
. . . . • . . . . 3-3
3-3
Replacing 92l6B (2Kx8) with 2708 (lKx8) ROMs
4-1
Memory Allocation Table . .
FIGURE
TITLE
3-5
. . 4-2
PAGE
1-1
GPM and GPM-Sol Memory Maps
1-3
3-1
Locations For Trace Cuts and Jumpers
3-6
SECTION 1
INTRODUCTION AND GENERAL INFOR.MA.';Q~9J~
GPM (General Purpose Memory)
and GPM-Sor\;~M~IEmLES
PROCESSOR TECHNOLOGY CORPORATION
GPM
1.1
Section 1
INTRODUCTION
This manual provides all information necessary to assemble,
test, and use the General Purpose Memory (GPM) Module. Before
starting to assemble the kit, scan the entire manual, and be sure
that you have all the parts and components in Table 2-1, GPM
Parts List, page 2-2. All instructions are presented in the
order in which you must assemble the module.
1.2
1. 2.1
GENERAL INFORMATION
Description
. The GPM is an S-lOO bus compatible memory module available
in kit or assembled form for use in 8080-based computers including
the Processor Technology Sol, and models by several other manufacturers.
It has a capacity of 10,240 8-bit bytes of read-only-memory (ROM) for storing programs as "firmware", and 1024 bytes of
read-write-memory (RAM) which is normally used as a "scratch-pad"
memory. The user can store any frequently-used programs on the
GPM, or use the module to house a companion product, the ALS-8
program development system, a resident monitor-assembler system,
available in ROM. GPM ~ay be adapted for use with several types
of ROMs and PROMs including types 92l6B, 83l6E, 34000P, and
2708. A switch-selectable automatic start-up mode is included,
so that the system is "up" and ready to accept commands as soon
as power is applied. All signal lines are fully buffered.
The GPM memory is available separately or as a component
module in a system of five modules; "Subsystem BII, by Processor
Technology. Subsystem B includes CUTS, VDM-l, 3P+S, and a choice
of RAM memory boards, as well as the GPM. CUTS provides cassette
tape mass storage interface; VDM-l provides a powerful video display interface; 3P+S provides parallel and serial data channels
for keyboard, TTY, paper tape reader or other peripherals; the R~1
memory provides working systems storage area. GPM fits into this
system by providing the CUTER monitor program, and space for the
ALS-8 program development system or other "firmware". Overall, Subsystem B turns the mainframe computer offered by many manufacturers
into a powerful integrated computer system.
1. 2.2
GPM and GPM-Sol Versions
Two versions of the product are available; GPM-Sol, for
use in the Sol Terminal Computer by Processor Technology, and GPM,
for use in other S-lOO computers. The main differences between
these two versions is illustrated· in Figure 1-1, GPM and GPM-Sol
Memory Map, page 1-3~
This figure shows the full addressing capability, 0000 to FFFF (hex.), of the 8080 Central Processing Unit
used in S-lOO computers and how the subsections of the GPM and
the GPM-Sol may be addressed within this range. The right-hand
1-1
PROCESSOR TECHNOLOGY CORPORATION
GPM
Section 1
figure shows the GPM-Sol sections mapped within the Sol addressing
structure, and left-hand figure shows GPM mapped within other
manufacturer's addressing structures. The main differences between the two maps are:
1.
The GPM version contains 2K of ROM normally
addressed at locations C¢¢¢ to C8¢¢
(hexadecimal) contain CUTER (Computer User's
3ape ~ntry and Retrieval monitor program), a
version of the SOLOS monitor program used in
the Processor Technology Sol. The use of
this program is covered in the SOLOS/CUTER
User's Manual. Since the Sol already contains the SOLOS program, it is not included
in the GPM-Sol version.
2.
The GPM version includes lK of RAM addressed
C8¢¢ to CBFF which is used by CUTER as systems memory area. The GPM-Sol version does
not include the RAM, since this too is
included in the Sol. However, lK of RAM may
be added to the GPM-Sol, and addressed ~~~~ to
¢3FF (hex).
3.
The Sol includes a video display circuit
addressed CC¢¢ to D¢¢¢. To ensure compatibility,
it is recommended that the GPM version be used
in conjunction with the VDM-l Video Display
Module, which is similar to the video section of
the Sol, and is also addressed CC~~ to D~¢~.
4.
Both the GPM and GPM-Sol versions contain space
for BK of ROM addressed at E¢¢¢ to FFFF (hex).
This area may be used to store programs as "firmware" in ROM or PROM. A companion product, the
ALS-8 program development system is available in
three or four ROMs which plug into the GPM or GPMSol board, and are addressed at these locations.
This is shown on Figure 1-1 as the ~LS-8 area
within the dotted lines. An option is available with ALS-8: SIM-l, an 8080 simulator program,
and TXT-2, a text editor program. The ALS-8 kit
contains three ROMs with the ALS-8 program, an
optional fourth ROM with SIM-l and TXT-2, a software manual, and assembly instructions. A system
which includes all three programs is a powerful
program development system including an assembler,
1-2
Figure 1-1.
GPM and GPM-So1 Memory Maps
GPM Memory Map
GPM-Sol Memory Map
FFFF
h
Hex . ·r:::::::::·;·;·;~·;·;·;·;·;·;·;·;·;·;·"";)(f·;·;·~::~:r
I':';·:·:·S I M-I aT
- •....;.1
;.:.:.:.:•.••••.•.~.....;.~.~.~.~.;.:.:.:..:.:.:.:.:.:,:.:.:::.::~ I
I
I
I
I
I
I
I
I
ALS-8
Option
:
ALS-8
I
I
1
I
I_ _ _ _ _ _ _ _ _ _ J
I
ALS-8
Recom mended
for CUTER
I
I
I
L-- ______ ..Jv
)
~
Needed if
is used
> ALS-8
4K RAM
4K RAM
D¢rp¢
Dr/Jr/>¢
cCrD¢
CqD¢
j
Video Di splay Module
Video Display Module
IK RAM
On
GPM
module
ALS-8
Option
I
\
Needed if
ALS-8 is used <
)
I
( Already
IK RAM
ca¢¢
In
carpr/J
(
CUTER 2K ROM
c¢¢¢
User
Defined
Area
2K ROM
SOLOS
OR SOLED
)
included
a Sol
/
User
Defined
Are a
IK RAM
1-3
Can be added
with GMP-Sol
PROCESSOR TECHNOLOGY CORPORATION
Section 1
GPM
an 8080 simulator, a text editor, and support routines for file-handling, program
execution, and debugging. When ALS-8 is used
on either GPM or GPM-Sol, 4K of RAM must be
added at locations D000 to E000.
1. 2.3
GPM Voltage Requirements, Typical
The basic GPM board requires:
+7.5 to +10 V dc at 750 rna.,
+15 to +18 V dc at 50 rna., and
-15 to -18 V dc at 50 rna.
Each additional 2708 draws:
+7.5 to +10 V dc,
+15 to +18 V dc,
-15 to -18 V dc,
6 rna. ,
50 rna. , and
30 mao
Each additional 9216 draws:
+7.5 to +10 V dc,
+15 to +18 V dc,
15 mao , and
50 mao
1.3
WARRANTY AND REPLACEMENT INFORMATION
1.3.1
Receiving Inspection
When your kit arrives, examine the shipping container,
noting any conditions that might indicate damage to the contents
during transit. Then inspect the contents.
(We suggest you save
the shipping materials for use in returning the Kit to Processor
Technology if it is necessary. If your GPM is damaged, please
write us at once describing the condition of both the shipping
container and the contents, so that we can take appropriate
action.
1.3.2
Warranty Information
In brief, parts that fail because of defects in materials
or workmanship are replaced at no charge for 3 months for kits,
and one year for assembled products, following the date of purchase.
Also, products assembled by the buyer are warranted for a period of
3 months after the date of purchase; factory assembled units are
warranted for one year after the date of purchase. Refer to
Appendix I for the complete "Statement of Warranty".
1. 3.3
Replacement Parts
Order replacement parts by component nomenclature CDM8l3l
IC or lN2222 diode, for example) and/or a complete description
(680 ohm, 1/4 watt, 5% carbon resistor, for example).
1-4
PROCESSOR TECHNOLOGY CORPORATION
GPM
1.3.4
Section 1
Factory Service
In addition to in-warranty service, Processor Technology
also provides factory repair service on out-of warranty products.
Before returning the unit to Processor Technology, obtain
authorization to do so by writing us a letter describing the
problem. After you receive our authorization to return the unit,
proceed as follows:
1.
Write a description of the problem.
2.
Securely pack the unit and the description in a shipping container.
3.
Ship prepaid to Processor Technology
Corporation, 6200 Hollis Street,
Emeryville, CA. 94608
Your unit will be repaired as soon as possible after
receipt and returned to you prepaid.
(Factory service charges
will not exceed $20.00 without prior notification and your
approval).
1-5
SECTION 2
ASSEMBLY
GPM (General Purpose Memory) and GPM-Sol Modules
PROCESSOR TECHNOLOGY CORPORATION
GPM
2.1
Section 2
PARTS AND COMPONENTS
Check all parts and components against the "Parts List"
(Table 2-1 on Page 2-2). If you have difficulty in identifying any
parts by sight, refer to the Component Identification Illustrations,
following page 2-2.
2.2
ASSEMBLY TIPS
1.
Read Sections 2 and 3 before you start to assemble
your GPM.
2.
Assembly steps and component installations are preceded
by a set of parentheses. Check off each installation
and step as you complete them. This will minimize the
chances of omitting a step or component.
3.
When installing components, make use of the assembly aids
that are incorporated on the GPM PC board and the
assembly drawing.
(These aids are designed to assist
you in correctly installing the components.)
4.
In assembling your GPM, follow the step-by-step integrated
assembly-test procedure. FOLLOW THE INSTRUCTIONS IN
THE ORDER GIVEN. The circuit reference· (R3, CIO, and
U7, for example) for each component is silk screened on
the PC board near the location of its installation.
Both the circuit reference and value or nomenclature
(1.5k and 74LS08, for example) for each component are
included on the assembly drawing near the location of
its installation.
5.
To simplify reading resistor values after installation,
install resistors so that their color codes read from
left-to-right and top-to-bottom as appropriate (board
oriented as defined in Paragraph 2.5 on Page 2-6).
6.
Unless specified otherwise in the instructions, install
all components, especially disc capacitors, as close
to the board as possible.
7.
If you encounter any problem during the assembly, feel
free to calIon us for help.
Table 2-1. GPM Parts List
Quantity
GPM
Integrated
Circuits
GPM-So1
Pard
0
Designation(s)
Function
1
8
0
9216B (AMD)
91L02A (AMD)
1
2
2
1
4
1
2
2
1
4
74LS04
74LS74
74LS132
74LS138
74367
4
1
4
1
1
1
1
1
U23
U2O-U21
U19-U22
U31
U18,U28,U29,
U32
74LS367
U24-U27
82S129B(SIGNETICS) U30
(Specially
programmed)
7812
7805
2
2
(BOURNS)
4308R-101-222
R1,R2
6
2
1
6
2
1
1.5Im,1/4 WATT
470n, 1/4 WATT
10Im, 1/4 WATT
R3-R8
R10,Rll
R9
23
23
.04711F DISC
2
3
2
2
l11F TANT
15]lF TANT
C1-C12,C15,
C16,C20-C28
C13,C29
C17 ,C19, (C30)
5
18
9
14 PIN
16 PIN
24 PIN
1
206-8 (CTS)
SW1
8 POS DIP
1
2N2907
Q1
PNP TRANSISTOR
1
1
1
1
1
1
210-001
680-5220
4
4
4
4
4
4
6-32x~ SCREW
1/6 LOCKWASHER
6-32 NUT
U9
2Kx8 ROM
1Kx1 RAM
8097 or 8T97
HEX BUFFERS
256X4 PROM
8T97
3601 (INTEL)
+12V REG
+5V REG
8 PIN 2.2K
ARRAY
CaEacitors
DIP Sockets
DIP Switch
1
Transistors
1
Miscellaneous
P. C. BOARD
HEAT SINK
HEAT SINK
COMPOUND
2-2
2102L1PC or
21L02B
HEX INVERTER
DUAL FLIP-FLOP
QUAD NAND SCHMITT
DECODER
HEX BUFFERS
Resistors
5
18
9
Acceptable
Substitute
7474
PROCESSOR TECHNOLOGY CORPORATION
Section 2
GPM
COMPONENT IDENTIFICATION ILLUSTRATIONS
NOTE: Pin 1 may be indicated
by corner dot or cut-out
Dual Inline Package (DIP) IC
(8,14,16,24 or 40 pins)
DIP Switch
(+)
lead
Dipped Tantalum
Electrolytic Capacitor
pin
l~
pin 1 indicated by
DIP Socket
Carbon Film Resistor
5% (gold), l~~ (silver)
"
TO-220 Regulator IC
or Power Transistor
C
Transistor
TO-18 Package (Metal Can)
Star Lockwasher
Disc Ceramic
Capacitor
f
Resistor Network
PROCESSOR TECHNOLOGY CORPORATION
Section 2
GPM
2.3
ASSEMBLY PRECAUTIONS
2.3.1
Handling MOS Integrated Circuits
Many of the ICs used in the GPM are MOS devices. They can
be damaged by static electricity discharge. Always handle MOS ICs
so that no discharge will flow through the IC. Also, avoid unnecessary
handling, and wear cotton--NOT synthetic--clothing when handling
these ICs.
2.3.2
2.3.3
Soldering **IMPORTANT**
1.
Use a fine tip, low-wattage iron, 25 watts maximum.
2.
DO NOT use excessive amounts of solder.
neatly and as quickly as possible.
3.
Use only 60-40 rosin-core solder. NEVER use acid-core
solder or externally applied fluxes.
4.
To prevent solder bridges, position iron tip so that
it does not touch adjacent pins and/or traces
simultaneously.
5·.
DO NOT rest tip of iron on pad or trace. To do so can
cause the pad or trace to "lift" off the board and
permanently damage it.
6.
The GPM circuit board has plated-through holes. Solder
flow through the component (front) side of the board
can produce solder bridges. Check for such bridges
after you install each component.
7.
The GPM circuit board has an integral solder mask
(a lacquer coating) that shields selected areas on the
board. This mask minimizes the chances of creating
solder bridges during the assembly.
DO, however,
check all solder joints for possible bridges.
8.
Additional pointers on soldering are provided in
Appendix 3 of this manual.
DO solder as
Installing and removing GPM Module.
NEVER install the GPM in, or remove it from the computer,
with the power on. To do so can damage the module.
2-3
PROCESSOR TECHNOLOGY CORPORATION
Section 2
GPM
2.3.4
Installing and Removing Integrated Circuits.
NEVER install or remove integrated circuits while power
is applied to the GPM. To do so can damage the IC.
2.3.5
Use of Clip Leads
NEVER attach clip leads to the top edge of the GPM circuit
board. Clip leads so attached are apt to short the +8, +16, -16 V dc,
and ground buses.
2.4
REQUIRED TOOLS, EQUIPMENT AND MATERIALS
The following tools, equipment, and materials are recommended
for assembling and testing the GPM Module:
2.5
1.
Needle nose pliers
2.
Diagonal cutters
3.
Screwdriver
4.
Sharp knife
5.
Controlled heat fine tip soldering iron, 25 watts
6.
60-40 rosin-core solder (supplied)
7.
Volt-ohm meter
ORIENTATION
The heat sink area (large foil area) will be located in
the upper right hand corner of the board when the 100-pin edge
connector is at the bottom. In this position the component (front)
side of the board"is facing up and the solder (back) side is facing
down. Also, the IC legends (Ul through U9, UIO through U18, etc.)
will read from left to right. The assembly drawing in Section 5
reflects this position. Subsequent position references in the
instructions assume this orientation.
2.6
ASSEMBLY-TEST
Refer to the GPM assembly drawing, Figure 5-1, in Section 5.
Note that the assembly drawing shows values, e.g. 1.5K, as well as
circuit references, e.g. R3.
2-4
PROCESSOR TECHNOLOGY CORPORATION
Section 2
GPM
NOTE
Instructions preceded with an asterisk (*)
do not apply to the GPM-Sol.
CAUTION
THIS DEVICE USES MOS MEMORY INTEGRATED CIRCUITS WHICH
CAN BE DAMAGED BY STATIC ELECTRICITY DISCHARGES. HANDLE
THESE ICs SO THAT NO DISCHARGE FLOWS THROUGH THE IC.
AVOID UNNECESSARY HANDLING AND WEAR COTTON RATHER THAN
SYNTHETIC CLOTHING WHEN HANDLING THESE ICs.
(STATIC
DISCHARGE PROBLEMS ARE MUCH WORSE IN LOW HUMIDITY
ENVIRONMENTS. )
2.6.1 / / Circuit Board Check
.vI)
Visually check GPM circuit board for solder bridges (shorts)
between traces, broken traces, and similar defects.
()
Check board to ensure that the +8, +16, -16, +12, +5,
-5 volt buses are not shorted to one another or to ground.
Using an ohmmeter, make the following measurements (refer
to GPM assembly drawing in Section 5). You should measure
no continuity in any of these measurements.
(
j
+8-volt Bus Test. Measure between edge connector pin 1 or
51 (left end of connector) and pin 50 or 100 (right end of
. connector).
(~(
+16-volt Bus Test. Measure between edge connector pin 2
(second top, or front, pin from left end of connector)
and pin 50 or 100.
-16-volt Bus Test. Measure between edge connector pin 52
(second bottom, or back, pin from left end of connector)
and pin 50 or 100.
,.(/)
+5-vol t Bus Test. Measure between positive (+) mounting
pad for C13 and edge connector pin 50 or 100.
i
(.')
I
(i
-{
/
+12-volt Bus Test. Measure between positive (+) mounting
,pad for C29 and edge connector pin 50 or 100.
-5-volt Bus Test. Measure between negative (-) mounting
pad for C14 and edge connector pin 50 or 100.
2-5
PROCESSOR TECHNOLOGY CORPORATION
Section 2
GPM
(
)
8/16/(-16)/5/(-5)/12 Volt Bus Test.
A.
Measure between:
Edge ,Connector pins 1 or 51 and-/
~/) ,Edge connector pin 2
(.\ ) ,-Edge connector pin 52
V) positive (+) pad for C13
)
positive ( +) pad for C29
(
B.
Negative (- ) pad for C14
Edge Connector pin 2 and-( )
Edge Connector pin 52
t/~Positive
( +)
pad for C13
Negative (-) pad for C14
Positive ( +) pad for C29
j(
C.
Edge connector pin 52 and-(
/'
D.
/) Positive
pad for C13
.(
Negative (-) pad for C14
:<
positive ( +) pad for C29
Positive ( +) pad for C13 and-1(/) Negative
(,
E.
( +)
)
(-) pad for C14
Positive (+) pad for C29
Negq,ti ve (-) pad for C14 and--
v( Positive
( +)
pad for C29
If you measure continuity in any of the preceding tests, recheck
the measurement(s). If you still measure continuity, the board is
defective. Return it to Processor Technology for replacement. If
none of the measurements show continuity, go on to the next paragraph.
2-6
PROCESSOR TECHNOLOGY CORPORATION
Section 2
GPM
2.6.2
~/~ssemblY-Test Procedure
.~
Step 1. Install heat sink. Position the large, black
heat sink (flat side to board) over the square foil area
in the upper right corner. Orient the sink so that the
two triangles of mounting holes in the board are under the
two triangular cutouts in the sink. Using two 6-32 screws,
lockwashers and nuts, attach heat sink to board. Insert
the screws from back (solder) side of board.
Step 2. Install U34 (7805). Position U34 over left hand
cutout in heat sink and observe how the leads must be bent
to fit the mounting pads. Note that the center lead (3)
must be bent down at a point approximately 0.2 inches
further from the body than the other two leads. Bend leads
so that no contact is made with the heat sink when U34
is flat against the sink and its mounting hole is aligned
with the hole in the sink. Coat both the bottom surface of
U34 and the heat sink area to which U34 mates with a thin
film of heat sInk compound. Insert leads and fasten U34
to sink with a 6-32 screw, #6 lockwasher and nut.
Insert
screw from solder (back) side of board, place washer on
screw and drive nut. Solder and trim leads.
NOTE
i
()
/
U35, the negative supply regulator, is not- supplied
with standard GPM modules.
It is needed only when
2708 ROMs are used.
(Refer to Section 3).
Step 3. Install U33 (7812). position U33 in the upper
right hand corner of the board with the leads facing left.
Observe how the leads must be bent down to fit the mounting
pads and bend accordingly. U33 should lie flat against
the board with its mounting hole aligned with the hole in
the circuit board. Insert leads and fasten U33 to board
with a 6-32 screw, #6 lockwasher and nut. Insert screw
from solder (back) of board, place washer on screw and
drive nut. Solder and trim leads.
Step 4. Install DIP switch in location SWI. Position
switch so Switch No. 1 (SWl-l) is at the left.
(Refer to
"Loading DIP Devices" in Appendix 4.)
2-7
PROCESSOR TECHNOLOGY CORPORATION
GPM
Section 2
()
Step 5. Install all resistors in numerical order in the
following locations. Bend leads down to fit distance
between mounting holes, insert leads, pull down snug to
board, bend leads outward on solder (back) side of board,
solder and trim.
LOCATION
R3
R4
R5
R6
R7
R8
R9
R10
Rll
VALUE (ohms)
COLOR CODE
1.5k
1.5k
1.5k
1.5k
1. 5k
1.5k
10K
470
470
brown-green-red
brown-green-red
brown-green-red
brown-green-red
brown-green-red
brown-green-red
brown-black-orange
yellow-violet-brown
yellow-violet-brown
Step 6. Install resistor networks Rl and R2 (2.2k ohms)
in their respective locations. Position Rl and R2 so
that the dot on their packages is at the bottom right.
Insert leads, solder and trim.
CAUTION
RESISTOR NETWORKS ARE DELICATE.
()
Step 7. Install the five tantalum capacitors in the
following locations. Take care to observe the proper value
and orientation for each installation.
LOCATION
~)
03
C14 (not used)
----'-1
C17
C18 (not used)
~7f
C19
r}- C29
~J~. t, C30
~*
HANDLE WITH CARE.
VALUE (ufd)
ORIENTATION
1
n+n
lead right
15
n+n
lead bottom right
15
n+n
n+n
n+n
lead right
lead right
lead down
1
15
C30 is not marked on the board.
the right of IC socket U20.
-
It is the unmarked capacitor to.
NOTE
C14 and C18 are not supplied with standard GPM
modules.
They are needed only when ROMs that
require -5 V dc are used.
(Refer to Section 3.3.2,
steps 2 and 3.)
2-8
PROCESSOR TECHNOLOGY CORPORATION
GPM
Section 2
()
Step 8.
Install all disc capacitors in numerical order
in the following locations. Insert leads, pull down
snug to board, bend leads outward on solder (back) side
of board, solder and trim.
NOTE
Disc capacitor leads are usually coated with wax
during the manufacturing process. After inserting
leads through mounting holes, remove capacitor
and clear the holes of any wax. Re-insert and
install.
LOCATION
CI
C2
( )
C3
( )
C4
( )
CS
( )
C6
( )
C7
( )
C8
( )
C9
( )
CIO
( )
CII
_LJ_CI_2_
, ()
CIS.
_.LJ____.cL6----.
( )
C20
( )
C21
( )
C22
( )
C23
( )
C24
( )
C2S
( )
C26
( )
C27
( )
C28
( )
( )
VALUE (ufd)
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
.047
TYPE
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Disc
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Step 9. Install DIP sockets. Install each socket in the
indicated location with its end notch at the bottom.
(Note
that pin I is in the lower right corner of each location.)
Take care not to create solder bridges between the pins and/or
traces.
2-9
PROCESSOR TECHNOLOGY CORPORATION.
Section 2
GPM
INSTALLATION TIP
Insert socket pins into mounting pads of
appropriate location. On back (solder) side of
board, bend pins at opposite corners of socket
(e.g. pins 1 and 9 on a 16-pin socket) outward
until they are at a 45° angle to the board surface.
This secures the socket until it is soldered.
Repeat this procedure with each socket until all
are secured to the board. Solder the unbent pins
on all sockets. Then straighten the bent pins to
their original position and solder.
NOTE
If you intend to use eight lK ROMs instead of four
2K ROMs, 24-pin sockets should be installed in these
four locations.
SOCKET TYPE
LOCATION
I"'~;'
/!
Ul through "Q9
UIO through U18
U19 through U23
U24 through U32
()
24
16
14
16
pin
pin
pin
pin
Step 10. Check regulator operation. This check is made
to prevent potential damage to the ICs from incorrect
voltages.
( ) Using an ohmmeter, make the following measurements:
SUPPLY
+5 V de
+12 V de
l-fEASUREMENT POINTS
Positive (+) and negative (-) leads of C13
Positive (+) and negative (-) leads of C29
You should measure some resistance in both measurements.
Zero resistance indicates a short.
If required, find
and correct the problem before proceeding. Especially
check for solder bridges.
()
Install GPM in computer.
(The use of a Processor Technology
EXB Extender Board is recommended.)
2-10
PROCESSOR TECHNOLOGY CORPORATION
Section 2
GPM
CAUTION
NEVER INSTALL OR REMOVE GPM WITH POWER ON.
()
Turn power on and make the following voltage measurements:
MEASUREMENT POINTS
VOLTAGE (±5 %)
Across C13
Across C29
+5 V dc
+12 V dc
If either voltage is incorrect, determine and correct the
cause before proceeding. If voltages are correct, turn
power off, remove GPM from computer and go on to step 11.
()
step 11. Install the following ICs in the indicated
locations. Pay careful attention to the proper
orientation.
NOTE
Pin 1 is positioned in the lower right corner of
each IC location, and is indicated by a dot on the
assembly drawing.
*( )
*( )
(~
.~
~
«(---)
N
l(~-+
f.i.r
( )
( )
(...4--
IC NO.
TYPE
U9#
UIO
U18
U19
U20
U22
U23
U24
U28
U30
U31
U32
9216# (CUTER ROM)
91L02A, 2102LIPC or 21L02B#
74367, 8097 or 8T97
74LS132 or 74132
74LS74 or 7474
74LS132 or 74132
74LS04 or 7404
74LS367 or 8T97
74367, 8097, or 8T97
82S129 or 3601
74LS138 or 74158
74367, 8097, or 8T97
*
through 17#
& 21
through 21')
& 29
#MOS devices.
Refer to CAUTION on Page 2-8.
Assembly and test of the GPM General Purpose Memory or GPM-Sol is
now complete and ready for use with appropriately programmed ROMs.
2-11
PROCESSOR TECHNOLOGY CORPORATION
GPM
Section 2
As presently assembled, the GPM is configured to operate
with 92l6B ROMs in locations U2, U4, U6, U8, and U9. Other 2K ROMs
(34000 and 83l6E) can also be used in these locations by reconfiguring the board via trace cutting and jumper options. In a
similar manner the GPM can be reconfigured to use lK ROMs (e.g. 2708)
in locations Ul through U8.
Instructions for making the required
changes are given in Section 3.
()
Step 12. Install transistor 2N2907 according to the
following instructions. Place the middle lead of the
transistor in the hole labeled B (right below and to the
left of R4 on the component side). The small metal tab
should point to the left; then the other two leads will
fit into the appropriate holes.
Install the transistor
as close to the board as possible. Turn the board over,
solder ·the leads and trim.
2.6.3
ALS-8, and ALS-8 with SIM-l and TXT-2 Options
If you have purchased either the ALS-8 option alone, or
the ALS-8 plus SIM-l and TXT-2 option, and your GPM or GPM-Sol board
is functioning correctly, you may proceed to install these ROMs
according to the instructions enclosed with them.
2.6.4
Operation in Computers without Sense Switches
At start-up, after examining location C~~~, the CUTER program
inputs the sense switch data from port FF (hexadecimal) to determine
the input and output pseudoports to be used during command mode. If
the system has no sense switches, data from port .FF will be input as
FF which indicates that at locations C8~~ and C8~2 the program will
find the addresses of user-defined input and output routines. By
putting the addresses of pre-written CUTER routines in these two
locations, the desired command mode input and output routines are
selected without sense switches. By entering the data in the table
below before examining C~~~ and running, the desired input and output routines may be chosen. Entering these addresses is known as
patching.
1.
INPUT PATCH:
at
2.
C8~~
patch in:
OUTPUT PATCH:
at C8~2 patch in
35C~
3EC~
5~C~
77C~
46C~
59C~
for keyboard input
for serial input
for parallel input
for video display output"
for serial output
for parallel output
2-12
SECTION 3
GPM OPTIONS
GPM (General Purpose Memory) and GPM-Sol:tViODULES
PROCESSOR TECHNOLOGY CORPORATION
Section 3
GPM
GPM OPTIONS
3.1
The eight-position DIP switch (SW1) located in the upper
right corner of the PC board is used to configure the GPM for the
various operating options.
These include:
the automatic start-up
option; wait-state generation; and the ability to place portions
of memory at different addresses.
Jumper arrangements are provided to permit accomodation of
various types of ROM chips.
TABLE 3-1.
SWITCH SETTINGS NECESSARY TO OPERATE THE GPM MODULE
DESCRIPTION
SWITCH
ON
OFF
Sol
ALTAIR
IMSAI
51-1
Disables E~~~-FFFF E~~~-FFFF is enaduring phantom
',bled during auto
start-up
:start
ON
ON if used with au- ON if used with au
to start at C~~~
to start at C~~
used with au- OFF if used with
-OFF if
to start at E~~~
auto start at
51-2
Imposes 1 wait
state
No wait state im-"
posed
OFF (normal operation)
ON if slow PROMs
are used
OFF (normal operation)
ON if slow PROMs
are used
51-3
Disables C~~~-C7FF
during phantom
start-up
C~~~-C7FF
Not used
OFF for auto start
OFF for auto start
to C~~~ (normal
to C~~~ (noroperation)
mal operation)
ON for no auto start ON for no auto
or auto start to
start or auto
E~~~
start to E~~~
51-4
Disables RAM at
RAM is enabled @
ON if Sol already
OFF (IK RAM will
~~~~-~3FF when usee ~~~~-~3FF (provided
has memory @
appear at C8~~)
in a Sol '(i.e. i f
51-7 is closed)
~~~~-~3FF
51-7 is' closed)
OFF if Sol does not
already have
memory @ ~~~~
E~~~
.--~
..
"
is enabled during auto
start
OFF, (normal operation)
ON if slow PROMs
are used.
OFF, (IK RAM will
-'appear @ C8~~)
~3FF
I
Disconnects GPM
from PRESET, Bus
Pin 75
OFF
ON (for auto start)
OFF (for non-auto
start)
OFF
Enables on-card
phalltonl
\Disables on-card
iphantom
OFF
ON for auto start
with GPM
OFF for non-auto
start
ON for auto start
with GPM
OFF for non-auto
start
For Sol (disables
PROM 9 & puts lK
RAM at ~~~~
,For ALTAIR, IMSAI,
ON
OFF
OFF
51-5
Permits ,auto start
in ALTAIRs only
51-,6
\
51-7
,
51-8
(puts PROM 9 at
\ CfJJ'~-C7FF
&
'.-
lK RAM:
"
,at,C8~~-CBFF)
'Allows control from Disconnects GPM
external phantom \ from pin 67 on bus
OFF
OFF
3-1
PROCESSOR TECHNOLOGY CORPORATION
GPM
3.2
Section 3
SWITCH OPTIONS
Table 3-1 "Switch Settings Necessary to Operate the GPM
Module" summarizes the function of the different switchs in each
of the three main types of computers: the Sol, the ALTAIR 8800,
and the IMSAI 8080, in which the GPM is expected to be used. In
each case, the first setting shown is the one that would normally be used and the second setting is the exception (i.e. Sl-2
is normally OFF but should be switched to ON if slow memory chips
are used) •
If the GPM is to be used in any other computer, the switch
functions should be studied and set according to the requirements
of that computer.
3.3
READ ONLY MEMORY OPTIONS
When assembled according to the instructions in Section 2,
your GPM is configured for use with 9216B (2Kx8) ROMs in locations
U2, U4, U6, U8, and U9 and no memory chips in locations Ul, U3,
US, and U7. By cutting specific traces and installing specific
jumpers, you can configure your board to:
3.3.1
1.
Replace any 9216B (2Kx8) ROM (U2, U4, U6, U8, and U9)
with an 8316E or a 34000P ROM.
2.
Replace any 9216B (2Kx8) ROM in locations U2, U4, U6,
and U8 with two 2708 (lKx8) PROMs (two 2708s in Ul and
U2 to replace the 9216B in U2, two 2708s in U3 and U4
to replace the 9216B in U4, two 2708s in US and U6 to
replace the 9216B in U6, or two 2708s in U7 and U8 to
replace the 9216B in U8). In order to use 2708 PROMs,
you must also add the -5 V dc regulator circuit.
Replacing 9216Bs
W~th
83l6Es or 34000Ps
A summary of traces to be cut and jumpers to be added to replace 9216B ROMs with 8316E or 34000P ROMs are given in Table 3-2.
Figure 3-1 shows the locations of the traces to be cut and the jumpers to be installed.
3-2
PROCESSOR TECHNOLOGY CORPORATION
GPM
Section 3
Table 3-2.
CHIP
LOCATION
Replacing 92l6B (2Kx8) ROMs With 83l6E Or
34000P (2Kx8) ROMs
INSTALL JUMPER
BETWEEN*
CUT TRACE
U2
M-P (component side)
jj-kk (solder side)
M and GND
kk and P
U4
Q-S (solder side)
gg-hh (solder side)
Q and GND
hh and S
U6
T-W (solder side)
ee-ff (solder side)
T and GND
ff and W
U8
x-z
(solder side)
cc-dd (solder side)
X and GND
dd and Z
U9
J-L (component side)
aa-bb (solder side)
J and GND
bb and L
*Install all jumpers on component side of board
using #24 bare wire.
Your GPM is now configured to operate with 83l6E or 34000P
(2Kx8) ROMs. Return to Section II to complete assembly of your GPM
module.
3.3.2
Replacing 92l6Bs With Two 2708 PROMs
If 2708 PROMs are used on the GPM module, you must install a
-5 V dc regulator circuit (U35, C14, and C18). You need the following components and hardware. This equipment can usually be purchased at any local electronics store.
1
1
1
1
1
1
1
1
7905 regulator (U35)
1 ufd tantalum dipped capacitor (C14)
15 ufd tantalum dipped capacitor (C18)
6-32 x ~ screw, Nylon
#6 lockwasher
6-32 hex nut
Insulator, mica
Heat sink compound
To add this circuit, proceed as follows:
in Section 5, Page 5-1.1
3-3
(See assembly drawing
PROCESSOR TECHNOLOGY CORPORATION
Section 3
GPM
( ) Step 1. Install U35 (7905). Position U35 over right
hand cutout in heat sink and determine how the leads
must be bent to fit the mounting holes. Note that the
center lead (3) must be bent down at a point approximately 0.2 inches further from the body than the other
two leads. Bend leads so that no contact is made with
the sink when U35 is flat against the sink and its
mounting hole is aligned with the hole in the sink.
Coat both sides of the mica insulator and the mating
surfaces on the sink and the bottom of U35 with a thin
film of heat sink compound. Insert Nylon 6-32 x ~ screw
from back (solder) side of board, place insulator over
screw on front (component) side, lower U35 over screw
and insert leads, place #6 lockwasher on screw and drive
hex nut. Solder and trim leads.
( ) Step 2. Install C14 (1 ufd tantalum dipped capacitor) in
its location below the heat sink, position C14 with its
positive (+) lead to the left, insert leads, solder and
trim.
( ) Step 3. Install C18 (15 ufd tantalum dipped capacitor)
in its location in lower left corner of board (below U9) .
Position C18 with its positive (+) lead at the top, insert leads, solder and trim.
( ) Step 4. Check regulator operation. This check is made
to prevent potential damage to the ICs from an incorrect
voltage. Using an ohmmeter, measure between positive
(+) and negative (-) leads of C14. You should measure
some resistance.
Zero resistance indicates a short. If
required, find and correct the problem before proceeding.
Especially check for solder bridges.
( ) Install the GPM in computer.
(The use of a Processor
Technology EXB Extender Board is recommended.)
CAUTION
NEVER INSTALL OR REMOVE GPM
WITH POWER ON.
( ) Turn power on and measure the voltage across C14 (positive lead is ground). You should measure -5 V dc ± 5%.
If the voltage is incorrect, determine and correct the
cause before proceeding. If the voltage is correct,
turn power off, remove GPM from computer and configure
the GPM for 2708 PROMs as subsequently described.
3-4
PROCESSOR TECHNOLOGY CORPORATION
GPM
Section 3
A summary of traces to be cut and jumpers to be added to
replace a 92l6B (2Kx8) ROM (U2, U4, U6, and U8) with two 2708
(lKx8) PROMs are given in Table 3-3. Figure 3-1 shows the locations of the traces to be cut and the jumpers to be installed.
These locations are also printed on the circuit board legend.
Table 3-3.
CHIP
LOCATION
Replacing 92l6B (2Kx8) ROMs With 2708
(lKx8) ROMs
INSTALL JUMPER
BETWEEN*
CUT TRACE
Ul, U2
M-P (component side)
G-H (component side)
M and N
U3, U4
Q-S (solder side)
E-F (component side)
Q and R
U5, U6
T-W (solder side)
C-D (component side)
T and V
U7, U8
x-z (solder side)
A-B (component side)
X and Y
*Install all jumpers on component side of board
using #24 bare wire.
Your GPM is now configured to operate with 2708(lKx8)
EPROMs. Return to Section 2 to complete assembly of your GPM
module.
3-5
Component
UI
U2
U4
U3
U5
U6
(front)
U7
Sid e
us
U9
So Ide r (b a c k) Si de
us
U9
0
I
r jO
I~ I
j:
U7
t
U6
t
U5
~t
(t
U4
U3
U2
~ w
UI
ITj
1-'I.Q
C
Ii
CD
w
I
.
I-'
v
!iii!
!iii!
0
0
t'i
0
0
PI
rt
1-'-
0
='rn
HI
0
Ii
8
Ii
PI
CiI
\)J1--
Iii
G - .. "'111111
I~IJ~
ll'IIIJ
0
CD
()
c
rt
rn
PI
-;:s
Po
Col
~CD
Ii
rn
SECTION 4
THEORY OF OPERATION
GPM (General Purpose Memory) and GPM-Sol MODULES
PROCESSOR TECHNOLOGY CORPORATION
GPM
4.1
Section 4
OVERVIEW
The GPM consists of up to 10K of ROM, lK of RAM, an address
decoder, a phantom (automatic) start-up circuit, a wait state circuit, and on-board voltage regulator circuits. While reading the
circuit description, pullout the schematic in Section V, Figure 5-2.
Also refer to the GPM and GPM-Sol Memory Map in Section 1, Figure 1-1.
4.2
CIRCUIT DESCRIPTION
4.2.1
Address Decoding
Address lines AO through A9 are buffered from the bus through
U25 and U26 to the 10 address pins on each RAM chip (UIO through U17)
and ROM/PROM chip (Ul through U9). AIO, buffered through U24, is applied to the AIO input to U2, U4, U6, and U8. AIO also appears on
pin 21 of U9, and AO input to U30 and the A input to U31. In addition,
AIO provides the enables for ROM chip select drivers U18 and PROM chip
enable drivers U29.
The address decoding is done with an 82S129 256x4 PROM (U30),
and a small amount of support circuitry. The four outputs of the
82S129 are CARD SELECT, ROM C, ROM EF, and RAM. Any time the 82S129
gets an address that one of the memories on the card should respond to,
both CARD SELECT and the appropriate memory line (ROM C, ROM EF, or
RAM) are activated.
Whenever CARD SELECT is activated (active low),
the buffers from both the wait state circuitry (which outputs to the
PRDY line and will be discussed below) and from pin 11 of U22 are
activated. Since the inputs to this NAND gate are PDBIN and SMEMR,
output 11 will go low whenever the processor is requesting data from
memory. Thus, when CARD SELECT is low pin 13 of U32 will go low whenever the processor is requesting data. This signal goes to both U20
(the phantom start-up circuitry which will be discussed later) and to
enable the data bus drivers, U28 and U29. So, whenever data is requested from one of the memories on the GPM, the appropriate memory
line (ROM C, ROM EF, or RAM) is activated as well as CARD SELECT
which in turn activates both the wait state output driver and the data
bus drivers.
The question that arises here is: which addresses does each
memory respond to? The answer is that it depends on whether or not
it is during phantom start-up (pin 15 of the 82S129 is pulled low
thru either Sl-6 or Sl-8) and whether or not the GPM is being used
in a Sol (pin 1 of the 82Sl29 is pulled low thru Sl-7). The following
table summarizes the address to which each memory will respond under
the four basic conditions:
4-1
PROCESSOR TECHNOLOGY CORPORATION
GPM
Section 4
Table 4-1. Memory Allocation Table
Sol (Sl-7 is ON)
Memory
Line
PHANTOM
NORMAL
OPERATION
PHANTOM
NORMAL
OPERATION
None
None
~~~~-~3FF
C~~~-C7FF
\
ROM C
Non-Sol
(if Sl':"3
is open)
ROIVI EF
E~~~-EFFF
None
~~~~-~3FF
EIdIdId-FFFF
(if Sl-l
is open)
RAM
4.2.2
~Id~~-~3FF
None
C8~Id-CBFF
None
Memory Allocation
The memory block EIdIdId to FFFF consists of either four 2K ROMs
(U2, U4, U6, and U8) or eight lK PROMs (Ul through U8). Memory allocations for this block are as follows:
ROM CONFIGURATION
SOCKET
4-2K CHIPS
Ul
U2
U3
U4
US
U6
U7
U8
.t---------------------~~~~
>-;- ...
I
UlJl
-17V
~:~,,~--------------------_+--------r_--------.
'f1p.;,---------------------,
'15>:>J
""13.
~+5V
r----------+------~~------+_----~--------_+------._------~------_+--,--------~----._--------_+----~~---------+----~
1':1
AI" ~
3
U~ l ~!SOO'::'4-0G----. ~_/~
,9--+__+-------
~~ ~~
H
7
~ _I_------------~-;-V. +-:--_+-------8-7-7-'7-U-~-~--.-~--_+-----.
*___
_b
__,
kKr~
____ _ _
!':'z.
z.
p:z.
!':'z.
f(z.
e
z.
E
1":2-
I': I
11:2-
5 4 - A -
~.:_.
;--+------------i-u-~-~-/_.,,"~..__.+------------8"-'-7~-':--U~':
____
__
.,.tz.v
hh~5_' ~~--------C--~O~----~----------f-f-r~·~-~-~--_~-------n----B----------~------~t~~~J~dG
__
p
'-'''''----'' . f--... - .
.-------;-----rr--~----------------+~-------+---.----1~--~~~r+~----------r_~~.~---r__- ·r-~++~----------~_rr+~----r-'--rr--~·+1~--------~--r~+-~-----+_--
----j-
..
~_j~---··-···--__j-_+_++_._--_+---H_+~_+_
.---;-----++--++;-~----------r__++;~~--;_--_++___j_+r+~--------_+--+;_r~----~.--,,--_+_++;_~--------+_--j_rr+~--_+----++--_+r+~------.----.+_~~~~--~----_r+1~~
A!? ~>,-tl+---,
t.::..:/uzs~
A4~1'-""""uzs~
Y+-H-+-H--j-+......- - -...~++-++H·-H-1-·,,,----,, . ·
.-- .....
L.t:j~+I:t=t+~:;:::==~~+tI+ttt:1~==~:i:ti+ttti+h:--'---l~++--I~++-I-4""
.--.-'-t--I-++t-++-H-~.------
.
~-·----~-++_H-I-H~~----~~_I_+-+_++1_+~--------~-HH_I_H-H~------~
r------+-·+-+-+-H-H-+,· ~...-----.__
...+1_t_if_HI_t_H_.__----_+_+_+_H_l_+_H_H_----
-++-Jf-+++++
aLIAIID.
CHKQD,
Figure 5-2
C
ltV.
2.100.02.
OIIAWINIl NO.
Ir-_KM_'_'___"O_"_~______--jl
1 -,
I
..
I
D
10..
APPENDICES
1
Statement .of Warranty
2
8080 Operating Codes
3
Standard Color Code
4
Loading DIP Devices,
Soldering Tips and
Installing Augat Pins
},It Pin Configurations
PROCESSOR TECHNOLOGY CORPORATION
Appendix 1
GPM
PROCESSOR TECHNOLOGY CORPORATION, in recognition of its
responsibility to provide quality components and adequate instruction for their
proper assembly, warrants its products as follows:
All components sold by Processor Technology Corporation are purchased
through normal factory distribution and any part which fails because of defects
in workmanship or material will be replaced at no charge for a period of 3 months
for kits, and one year for assembled modules, following the date of purchase.
The defective part must be returned postpaid to Processor Technology Corporation
within the warranty period.
Any malfunctioning module, purchased as a kit directly from Processor
Technology and returned to the factory within the three-month warranty period,
which in the judgement of PTC has been assembled with care and not subjected
to electrical or mechanical abuse, will be restored to proper operating condition
and returned, regardless of cause of malfunction, without charge. Kits purchased
from authorized PTC dealers should be returned to the selling dealer for the
same warranty service.
Any modules purchased as a kit and returned to PTC, which in the
judgement of PTC are not covered by the above conditions, will be repaired
and returned at a cost commensurate with the work required. In any case,
this charge will not exceed $20.00 without prior notification and approval of
the owner.
Any modules, purchased as assembled units are guaranteed to meet
specifications in effect at the time of manufacture for a period of at least one
year following purchase. These modules are additionally guaranteed against
defects in materials or workmanship for the same one year period. All warranted
factory assembled units returned to PTCO postpaid will be repaired and returned
without charge.
This warranty is made in lieu of all other warranties expressed or implied
and is limited in any case to the repair or replacement of the module involved.
Al-l
JUMP
CALL
RETURN
RESTART
C3
C2
CA
02
OA
E2
EA
F2
FA
E9
CD
C4
CC
04
DC
E4
EC
F4
FC
C9
CO
C8
DO
08
EO
E8
FO
F8
C7
CF
07
OF
E7
EF
F7
FF
JMP
JNZ
JZ
.JNC
JC
JPO
JPE
JP
JM
PCHL
Adr
CALL
CNZ
CZ
CNC
CC
CPO
CPE
CP
CM
RST
RST
RST
RST
RST
RST
RST
RST
0
1
2
3
4
5
6
7
MOVE (cont)
ACCUMULATOR*
07
OF
17
IF
58
59
5A
5B
5C
5D
5E
5F
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
E,B
E,C
E,D
E,E
E,H
E,L
E,M
E,A
80
81
82
83
84
85
86
87
ADD
ADD
ADD
ADD
ADD
ADD
ADD
ADD
B
C
D
E
H
L
M
A
A8
A9
AA
AB
AC
AD
AE
AF
XRA
XRA
XRA
XRA
XRA
XRA
XRA
XRA
B
C
D
E
H
L
M
A
60
61
62
63
64
65
66
67
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
H,B
H,C
H,D
H,E
H,H
H,L
H,M
H,A
88
89
8A
8B
8C
80
8E
8F
ADC
ADC
ADC
ADC
ADC
ADC
ADC
ADC
B
C
D
E
H
L
M
A
BO
Bl
B2
B3
B4
B5
B6
B7
ORA
ORA
ORA
ORA
ORA
ORA
ORA
ORA
B
C
0
E
H
L
M
A
Acc
06
OE
16
1E
26
2E
36
3E
C6
CE
06
DE
E6
ADI
ACI
SUI
SBI
ANI
EE
F6
FE
XRI
ORI
CPI
IMMEDIATE*
B.
C.
O.
E.
H.
08
L.
M.
A.
LOAD
IMMEDIATE
01
11
21
31
LXI
LXI
LXI
LXI
B8
B9
BA
BB
BC
BD
BE
BF
CMP
CMP
CMP
CMP
CMP
CMP
CMP
CMP
B
C
0
E
H
L
M
A
DECREMENT**
04
OC
14
lC
?4
2C
34
3C
INR
INR
INR
INR
INR
INR
INR
INR
B
C
0
05
00
15
E
10
H
L
M
A
03
13
23
33
INX
INX
INX
INX
B
0
H
SP
08
constant, or loglcatarlthmetic expression that evaluates
to an 8 bit data quantity.
25
20
35
3D
OB
1B
2B
3B
OCX
OCX
OCX
OCX
all Flags (C.Z,S.P) affected
B
0
H
PSW
C1
01
El
F1
POP
POP
POP
POP
B
0
H
PSW'
E3
F9
XTHL
SPHL
08
INCREMENT**
OCR
OCR
OCR
OCR
DCR
OCR
OCR
OCR
F5
PUSH
PUSH
PUSH
PUSH
C5
DOUBLE ADDT
DAD B
09
19 DAD 0
29
DAD H
39
DAD SP
B
SPECIALS
C
0
E
LOAD/STORE
H
L
M
A
OA
1A
2A
3A
LDAX
LDAX
LHLD
LOA
B
0
Adr
Adr
B
0
H
SP
02
12
22
32
STAX
STAX
SHLD
STA
B
0
Adr
Adr
NOP
HLT
01
EI
STACK OPS
S'j
~: D16~;
SP,
RLC
RRC
RAL
RAR
CONTROL
00
76
F3
FB
MOVE
IMMEDIATE
MVI
MVI
MVI
MVI
MVI
MVI
MVI
MVI
Adr
RET
RNZ
RZ
RNC
RC
RPO
RPE
RP
RM
ROTATEt
EB
27
2F
37
3F
XCHG
OAA'
CMA
STCt
CMC+
INPUT/OUTPUT
03
DB
OUT
IN
016
~
t =
08
08
MOVE
40
41
42
43
44
45
46
47
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
B,B
B,C
B,D
B,E
B,H
B,L
B,M
B,A
68
69
6A
6B
6C
6D
6E
6F
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
L,B
L,C
L,O
L,E
L,H
L,L
L,M
L,A
90
91
92
93
94
95
96
97
SUB
SUB
SUB
SUB
SUB
SUB
SUB
SUB
B
C
D
E
H
L
M
A
48
49
4A
4B
4C
40
4E
4F
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
C,B
C.C
C,D
C.E
C.H
C,L
C,M
C,A
70
71
72
73
74
75
MOV
MOV
MOV
MOV
MOV
MOV
M,B
M,C
M,D
M,E
M,H
M,L
77
MOV
M,A
98
99
9A
9B
9C
9D
9E
9F
SBB
SBB
SBB
SBB
SBB
SBB
SBB
SBB
B
C
0
E
H
L
M
A
50
51
52
53
54
55
56
57
MOV
MOV
MOV
MCV
MOV
MOV
MOV
MOV
D,B
D.C
D,D
D,E
D,H
D,L
D,M
D,A
78
79
7A
7B
7C
70
7E
7F
MOV A,B
MOV A.C
MOV A,O
MOV A,E
MOV A,H
MOV A,L
MOV A,M
MOV A,A
AO
Al
A2
A3
A4
A5
A6
A7
ANA
ANA
ANA
ANA
ANA
ANA
ANA
ANA
B
C
D
E
H
L
M
A
constant, or 10gicaVarithmetic expression that evaluates
to a 16 bit data quantity.
only CARRY affected
OBDH
lAH
lr Hex
lr .
105D
105 DeCimal
720 }
720 Octal
11011B} .
ool10B BInary
'TEST' }
'A' 'B' ASCII
OPERATORS
+ -
PSEUDO
INSTRUCTION
STANDARD
SETS
ORG
END
EOU
D16
OS
DB
DW
D16
D8
016
A
SET
B
SE.
C
SET
D
SET
SET
E
SET
H
L
SET
M
SET
SP SET
PSWSET
Adr
II
II
7
a
1
2
3
4
5
6
6
6
Adr = 16 bit address
•• = all Flags except CARRY affected;
(exception: INX & DCX affect no Flags)
APPENDIX II
\
CONSTANT
DEFINITION
\
© Processor Technology Corp.
PROCESSOR TECHNOLOGY CORPORATION
GPM
Appendix 3
The electrical value of many types of resistors and capacitors is
printed on the component. Other types, however, are identified by
color coding which gives all the information needed to correctly
identify the component.
In most cases color coding conforms with the
EIA (Electronic Industries Association) Standard Color Code. In other
cases a manufacturer will adapt the standard to fit his particular
requirement. Both the Standard Color Code and a code used to identify tantalum dipped capacitors are provided below.
STANDARD COLOR CODE FOR RESISTORS AND CAPACITORS
COLOR
1st
2nd
FIGURE FIGURE
Black
Brown
Red
Orange
Yellow
Green
Blue
Violet
Gray
White
Gold
Silver
None
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
-
-
-
-
-
TOLERANCE VOLTAGE
('Yo)
RATING*
MULTIPLIER
1
10
100
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
1,000,000,000
0.1
0.01
---
--
5
10
20
100
200
300
400
500
600
700
800
900
1000
2000
500
Tolerance
MUltir)
-i~~~~
i'"
r
1st and 2nd
Significant
Figures
*Applies only to capacitors.
RATED
VOLTAGE
VDC 25°C
3-4
3-6
3 .... 10
3-15
3-20
3-25
3-35
3-50
-3
CAPACITANCE
IN PICOFARADS
COLOR
Black
Brown
Red
Orange
Yellow
Green
Blue
Violet
Gray
White
1st
Fiqure
2nd
Fiqure
Multiplier
(uuF)
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
1
10
100
1,000
10,000
100,000
1,000,000
10,000,000
----A3-1
Polarity &
Voltage
[
1st Figure
~ 2nd Figure
~-Mul tiplier
+
PROCESSOR TECHNOLOGY CORPORATION
Appendix 4
GPM
LOADING DIP (DUAL IN-LINE PACKAGE) DEVICES
(1)
Sockets.
DIP sockets are marked to indicate the correct
orientation for the IC which will be inserted.
This mark
may be a notch at the end of the socket, or a filled-in
corner on the inside of the socket as shown in the Component Ientification Illustrations in Section II.
Orient the socket so that pin 1 lines up with the indication
for pin 1 printed on the printed circuit board legend, which
may be a white dot.
Insert the socket into the board, and
while pressing the socket into place to ensure that i t is
fully seated, bend two diagonally opposite pins to retain
the socket in its fully seated position while soldering.
(2)
ICs. Many DIP devices have their leads spread so that they
may not be inserted directly into their sockets.
They must
be "walked in" using the following procedure.
Orient pin 1 of the device so that i t lines up with pin 1
on the socket and the printed circuit board legend.
Insert
the pins from one row only into the socket until they
barely engage. Push the device using both hands with even
pressure to bend this first row of pins until the second
row of pins lines up with the holes in the socket r then
push the second row of pins into the socket.
After all ICs
are inserted, examine each to make sure that no pins are
bend out or under. Careful examination might prevent hours
of unnecessary troubleshooting later.
\,
SOLDERING TIPS
(1)
Use a low-wattage iron--25 watts is good.
Larger irons run
the risk of burning the printed-circuit board.
Don't try to
use a soldering gun, they are too hot.
(2)
Use a small pointed tip and keep it clean. Keep a damp piece
of sponge by the iron and wipe the tip on i t after each use.
(3)
Use 60-40 rosin-core solder ONLY. DO NOT use acid-core solder
or externally applied fluxes.
Use the smallest diameter
solder you can get.
NOTE:
(4)
DO NOT press the top of the iron on the pad or
trace.
This will cause the trace to "lift" off
of the board which will result in permanent damage.
In soldering, wipe the tip, apply a light coating of new
solder to it, and apply the tip to both parts of the joint,
that is, both the component lead and the printed-circuit, pad.
Apply the solder against the lead and pad being heated, but
not directly to the tip of the iron.
Thus, when the solder
A4-1
PROCESSOR TECHNOLOGY CORPORATION
Append,ix 4
GPM
melts the rest of the joint will be hot enough for the solder
to II take II , (i.e., form a capillary film).
(5) Apply solder for a second or two, then remove the solder and
keep the iron tip on the joint. The rosin will bubble out.
Allow about three or four bubbles, but donlt keep the tip
applied for more than ten seconds.
(6) Solder should follow the contours of the original joint. A
blob or lump may well be a solder bridge, where enough solder
has been built upon one conductor to overflow and IItake ll on
the adjacent conductor. Due to capillary action, these solder bridges look very neat, but they are a constant source of
trouble when boards of a high trace density are being soldered.
Inspect each integrated circuit and component after
soldering for bridges.
(7) To remove solder bridges, it is best to use a vacuum "solder
puller" if one is available.
If not, the bridge can be reheated with the iron and the excess solder IIpulled" with the
tip along the printed circuit traces until the lump of solder
becomes thin enough to break the bridge. Braid-type solder
remover, which causes the solder to "wick up" away from the
joint when applied to melted solder, may also be used.
A4-2
PROCESSOR TECHNOLOGY CORPORATION
Appendix 5
GPM
',~
82S129B
74LS138
91L02A (M'lD)
7805, 7812
A.
A,
A5
A.
wE:
A.
A,
CE
A,
Dour
A3
D'N
A,
Vee
TO-22D IT)
~.-
OUHUT III
fij?"'"
GNOlll
:"o~I"'UTnl
TOP VI'"
AO
GND
74367, 74LS367
a,
lAo
lV
2A
A5-1
2V
JA
3Y
GNO
PROCESSOR TECHNOLOGY CORPORATION
Appendix S
GPM
34000P, 8316E
A7
I
As
2
2708
24 Vec
23 Aa
A4
4
22 Ag
21CS3/CS3 NC·
A3
5
20CSII~
Az
6
19
AI
7
AIO
18 CS2/CS2 NC·
Ao
8
17
Oe
01
9
16
07
Oz
10
15
06
"
14
05
04
3
As
0 3
GND
12
13
.__
.-
----_ ... --
NC·
A,
Vee
A.
A.
A.
A.IMSB)
A4
'liB
CSIWE
A,
A,
lobo
M2708
PROGRAM
Al
071MSBI
D.
0;
01
10
02
11
D.
\ts
12
0,
*Proll' .1.nn.dLIl Chip Sci", b
74LS74
9216B (AMD)
ADORf";S;
2.
ADDRESS 6
ADDRESS 5
VCCI*SVI
2'
AdDRESS B
22
ADDRESS 9
ADDRESS 4
21
ADDRESS 10
ADOR!;<;S J
20
CS1ICS 1
ADDR,ESS 2
Am9716
'.
1
CLEAR
CLEAR
1
CLOCK
VOoIH2V\
2
CLOCK
PRESET
ADDRESS!
18
C52;Cs:1
ADDRESS 0
'7
I.
I.
OUPTUT 8
PRESET
OUTPUT 7
20
15
OUTPUT 6
2
OUTPu'" J
OUTPUT ']
\0
OUTPUT)
11
rGND!V~
" -.--------13
oUn'ur 5
OUTPUT 4
74LS04
74LS132
Positive logic:
YeA
~.)( .:~·"e
AS-2
logic.: Y
AS
GPM Manual
ALS-8 Manual
iChange Notice #IA
A set of three or four ROMs containing the ALS-8 program
development system may be used on the GPM and GPM-So1 boards.
Alternative procedures are given below for entering the ALS-8
program from the SOLOS monitor program in the Sol Terminal Computer with GPM-So1, and from the CUTER monitor program in ROM
on GPM. The procedure differs also depending on whether serial
data input is used, as from a teletype or CRT terminal, or parallel data input is used, as from a keyboard. The procedures
assume that a VDM-1 video display module is in use.
1) Serial Data Input
a) From the CUTER command mode, type EXEC
Return) •
E~24
(Carriage
b) Type Contro1-Z (CR) , i.e., depress Z and CTRL key simultaneously. This initializes the ALS-8 video display driver,
clearing parameters.
c) Next type Contro1-S.
SPEED?
The ALS-8 program will respond:
d) Lastly, type one key from 1 to 9 (CR) to set the rate at
which new characters are added to the video display. Normally type 1 for the fastest speed. ALS-8 is now ready to
use.
e) To exit to CUTER from ALS-8, type EXEC
C~~3
(CR).
2) Parallel Data Input
a) From the SOLOS/CUTER command mode, type EXEC E~24 (CR).
This moves the ALS-8 input and output driver from ROM into
RAM, where they may be modified.
b) In a Sol, with GPM-So1, Press Upper Case and Repeat keys
simultaneously. In other computers, first stop the computer
from running, then start up CUTER again, at location C~~~.
The video display will respond with a prompt.
c) Enter the data shown below. The underline indicates
characters which are responses from SOLOS/CUTER:
PROCESSOR TECHNOlOGY CORPORATION
CN#l Rev A page 1
7/77
6200 HOlLIS STREET EMERYVILLE CA 94608
(415) 652-8080
'-
ENTRIES FOR CUTER
ENTR D1J9F (CR)
ENTRIES FOR SOLOS
ENTR D1J9F (CR)
-·
-:
03 (CR)
(CR) ,
-· FC
D1JA6: 2F E6 1Jl C9 (CR)
-·
D1JAS: FA 2P'" E6 1Jl C9 (CR)
-:
D1JD1J: 77 FE (CR)
-:
D1JD1J: '77 FE (CR)
-·
D1J96: 77 FE /
-: D1J96: 77 FE / (CR)
(CR)
SOLOS/CUTER should again respond with a prompt: ) . The above
entries modify the standard input and output drivers, which are
written for a serial console interface, to work with a parallel
console interface, as for a keyboard. You may want to record
these entries on tape for later use.
'
e) Type EXEC E1J61J to transfer control to the ALS-S. Do not try to
start the ALS-S at E1J24 as this will reinitialize the drivers,
erasing the entries just made.
.
f) Do steps b, c, and d from Serial Data Input procedure above.
g) To exit to SOLOS/CUTER from ALS-S, type EXEC C1J1J3 (CR).
)
CN#l Rev A page 2
7/77
Processor
GPM Manual
I ~Technology
Change Notice #2
1) Refer to Section 2, page 2-7, Step 3.
This step calls for the installation of U33, a 7812 voltage
regulator IC. Please note that this regulator does not
go on the heat sink. It goes on the top the board above
the~eat sink, with the leads facing to the
left, as
described in this assembly step. Only U34, a 7805 goes
on the heat sink. The heat sink is designed for two
parts, and there are pads for an additional regulator on
the heat sink, but these are for the optional regulator
U35, which is not supplied with this kit. U35, a negative
regulator, is only used if the GPM is later set up for 2708
ROMs.
Two other parts, C14 and CIS, are not included in
the kit and are only needed if U35 is installed. Mark
Step 3 to refer you to this page, so that when you come to
this point in the assembly procedures, you will be reminded
to reread this information.
2) Refer to Section 3, page 3-4, Step 4.
It is recommended that the check procedure in this step
be repeated for CIS, to ensure there is no short accross
the -17 volt supply. Note this step is only necessary if
the optional negative regulator U35 is installed. Make
a note below step 4 containing this information.
3) Refer to Section 3, page 3-4, Step 3.
In the second line of this step, change
read, "(below U19)1I.
CN #2
II
(below U9)1I to
6/77
PROCESSOR TECHNOLOGY CORPORATION
6200 HOLLIS STREET EMERYVILLE CA 94608
(415) 652~8080
~WD
I F I CAT ION OR
GP~'l
8 OA R D
E.
ELI Z ONDO
Pag e 1
Users of Processor Technology's General Purpose Memory Module
(GPr·~>
board,
part of the widel y advertised Subsystem B, wi I I
find that they can not load or use the cassette
tape
version
of the ALS-8 Assembler without first modifying the GPr~ board.
The problem is caused by the fact that the GPM board
responds
to memory addresses in the range of EOOOH to fFFFH, whether or
not any Ror~ chips are installed on the board.
Th e foil 0 win g mod i f i cat ion t o t h e boa r d dis a b I est his res p 0 n s e
and a I lows I 0 cat i n gas tan dar d 8i< RAM boa r d i n
t his
add res s
space, so that the ALS-g tape can be loaded.
The modification
does not affect operation of
the
CUTER
monitor
or
of
the
PHANTOM startup feature to th,e CUTER mon itor.
IN
THE
FOLLO~~ ING
INSTRUCTIONS,
ALL
LOCATION
DESCRIPTIONS
ASSUME THE BOARD TO BE HELD WITH THE COMPONENT SIDE FACING YOU
AND THE EDGE CONNECTOR DOWN
AS
SHOWN
IN
THE
CARD
OUTLINE
DRAV/ING (f IG 5-1) IN THE GPt··1 MANUAL
1> On the front (component side of the board), cut
the
thin
trace
connecting
the pad located near the top end of U30 and
the pad located under the body of R8.
NO TE1:
T his i 5 the fir 5 t t h i n t r ace jus tab 0 vet he top end
o f U 31. Th i s t r ace car r i est h e car d se I e c t s i 9 n a I fro m pin
12
of
U30
to pin 15 of U32.
By cutting the trace between these
pad s, the boa r d can e a 5 i I Y b ere t urn e d to its
0 rig ina I
st ate
should you ever instal I ROM chips for the ALS-8.
2 ) On the rear
fol lowing seven
pin
pin
pin
to p
pin
pin
pin
( co pper
sid e
wi re j um per s :
FROM
10 of U 30
2 of U23
10 of U19
end of R3
12 of U30
10 of Un
g of U19
of
the
board) ,
TO
pin
1 of U21
p n 12 of U19
p n 11 of U19
p n 13 of U19
p n 11 of U23
p n
9 of U19
n
p
15 of UT
r.
connect
NOTE
2
NOTE
NOTE
Ii
NOTE
5
the
3
NOTE 2: Pin 10 of U30 is available at a pad
below
U30.
This
pad may bel 0 cat e d b Y f 0 I I 0 'II i n 9 th e t h i n t r ace, 0 nth ere a r 0 f
the board, from this pin down to the pad adjacent to
the
"1"
M00 I Fie AT ION OF
GPi'4 BOA R 0
dig it
of
the
connector.
number
E.
"-tOO"
ELI Z ONOO
located
near
Page
the
bottom
2
edge
NOTE 3: The PHANTOM signal is available at
several
on
the
board.
The
most
convenient
one
from
st and po i n t see In s to be at the top end 0 f R].
locations
a
wiring
NOTE
Y: Pin 12 of
ref ere d to ins t e p 1.
above
NOTE
of RB,
5:
Pin
refered
Th e
0 v er a I I
diagram
15
to
U]O
is
available at th,e pad
of U32 is available at the pad
instep 1.
c i r cui t
wi I I
look
as
in
the
U]O
under the body
attached
logic
E.
GPM MANUAL ERRORS
ELI Z ONOO
Pag e
The
following GP~~ manual errors, discovered during
of the above design, may al so be of interest:
1
the course
Table
1-1 The S1-8 description shoul d read "allows phantom
si g na I s from auto start
(on
GPM)
to
S-100 bus".
S\'I itch
settings
should
sho'il
S1-8 "ONtI for an 11'~S,l\ I, i f auto start
from the GPM is des ired.
Figure
5-1 (card outl ins drawing) and Figure 5-2 (schematic)
both identify U9 as a Prom B, a 2l08.
U9 is real I y ROtA C, the
CUTER ROM, a 921bB.
Figure
5-2
(schematic)
has several
The
signal
active low.
at
U30
The
hi g h •
at
U]O pin
signal
pin
12
9
other errors:
(CARD SELECT)
(ROM C)
should be shown
should be shown
as active
The unlabeled dual input gate shown connected to bus pin
i s rea I I Y ani n v er t e r (U 21) wit h pin 9 as i n put and pin
8
output.
f: d f: I i zondo
C Ypre s s Co ur t
Ea s t vJi n d so r, N. J.
b
21
April
1918
08 520
as
16,
as
-
fF
iF
l
..
(
VI,
11._-.
au
~------,
F/(ol1 () ~o-' 2..
,en)
GPM
10
cs
/
00
01
02
03
04
05
06
07
08
09
OA
OB
OC
OD
OE
OF
10
11
12
13
14
15
16
17
18
19
NOP
LXI
STAX
INX
INR
OCR
MVI
RLC
DAD
LOAX
OCX
INA
DCA
MVI
ARC
LXI
STAX
INX
INR
DCR
MVI
B.016
B
B
B
B
B.08
B
B
B
C
C
C.D8
0.016
D
D
0
D
D.D8
MAL
DAD
0
1A
LDAX D
1B
1C
10
1E
DCX
INR
DCR
MVI
RAR
'F
20
21
LXI
22 SHLO
23 - INX
24
INR
25
OCR
26
MVI
27
OAA
D
E
E
E.D8
H.016
Adr
H
H
H
H.08
28
29
2A
2B
2C
20
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
DAD
LHLO
OCX
INR
OCR
MVI
CMA
H
Adr
H
L
L
L.08
LXI
STA
INX
INR
DCR
MVI
STC
SP.016
Adr
SP
M
M
M,08
DAD
LOA
DCX
INR
DCR
Mlfl
CMC
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
SF
Adr
SP
A
A
A.D8
50
51
52
53
54
55
56
57
58
59
SA
5B
5C
50
SE
516C
B.B
B,C
B.D
B.E
B.H
B.L
B.M
B.A
C.B
C.C
C.D
C.E
C.H
C.L
C.M
C.A
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV.
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
HLT
MOV
O.B
O.C
0.0
O.E
O.H
O.L
O.M
O.A
E.B
E.C
E.O
E.E
E.H
E.L
E.M
E.A
H.B
H.C
H.D
H.E
H.H
H.L
H.M
H.A
L.B
L.C
L.O
L.E
L.H
L.L
L.M
L.A
M.B
M.C
M.D
M.E
M.H
M.L
M,A
D8 = constant. or logical/arithmetic expression that evaluates
to an 8 bit data quantity.
78
79
7A
7B
7C
70
7E
7F
80
81
82
83
84
85
86
87
88
89
8A
8B
BC
80
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
90
9E
9F
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
ADD
ADD
ADD
ADD
ADD
ADD
ADD
ADD
ADC
ADC
ADC
ADC
ADC
ADC
ADC
ADC
SUB
SUB
SUB
SUB
SUB
SUB
SUB
SUB
SBB
SBB
SBB
SBB
SBB
SBB
SBB
SBB
I
A.B
A.C
A.O
A.E
A.H
A.L
A.M
A.A
B
C
0
E
H
L
M
A
B
C
D
E
H
L
M
A
B
C
D
E
H
L
M
A
B
C
0
E
H
L
M
·A
AO
Al
A2
A3
A4
AS
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
BO
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
CO
C1
C2
C3
C4
C5
C6
C7
ANA
ANA
ANA
ANA
ANA
ANA
ANA
ANA
XRA
XRA
XRA
XRA
XRA
XRA
XRA
XRA
ORA
ORA
ORA
ORA
ORA
ORA
ORA
ORA
CMP
CMP
CMP
CMP
CMP
CMP
CMP
CMP
RNZ
POP
JNZ
JMP
CNZ
PUSH
ADI
RST
B
C
D
E
H
L
M
A
B
C
D
E
H
L
M
A
B
C
D
E
H
L
M
A
B
C
D
E
H
L
M
A
B
Adr
Adr
Adr
B
D8
0
C8
C9
CA
CB
CC
CD
CE
CF
DO
D1
02
D3
04
05
D6
D7
D8
09
DA
DB
DC
OD
DE
DF
EO
El
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
RZ
RET
JZ
CZ
Adr
CALL
Adr
ACI
D8
RST
RNC
POP D
JNC
Adr
OUT
08
CNC
Adr
PUSH D
SUI
D8
RST 2
RC
JC
IN
CC
SBI
RST
RPO
POP
JPO
XTHL
CPO
PUSH
ANI
RST
RPE
PCHL
JPE
XCHG
CPE
XRI
RST
APPENDIX II
RP
pOP PSW
JP
Adr
01
CP
Adr
PUSH PSW
ORI
08
RST 6
RM
SPHL
JM
Adr
EI
CM
Adr
CPI
RST
08
7
Adr
08
.Adr
DB
HEX-ASCII TABLE
3
Non-Printing
H
Adr
Adr
H
08
4
Adr
Adr
D8
5
D16 = constant, or logical/arithmetic expression that evaluates
to a 16 bit data quantity.
Processor Technology Corp.
FO
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
00
07
09
OA
OB
OC
00
11
12
13
14
lB
70
7F
Adr
NULL
BELL
TAB
LF
VT
FORM
CR
X-ON
TAPE
X-OFF
ESC
ALT MODE
RUB OUT
= 16 bit address
HEX-ASCII TABLE
Printing
30
0
31
1
32
2
33
3
34
35
36
37
38
39
4
5
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
SA
6
7
8
9
A
B
C
D
E
F
G
H
I
J
K
L
M
N
0
P
Q
R
S
T
U
V
W
X
Y
Z
Characters
40
@
20
space
21
!
22
#
23
$
24
25
26
&
27
28
29
2A
2B
+
2C
2D
2E
2F
3A
3B
3C
<
3D
:>
3E
3F
?
5B
[
5C
,
5D
)
5E
1 _ (".)
SF
(-)
Source Exif Data:
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