Tiva C Series TM4C123G LaunchPad Evaluation Kit User's Manual TM4C123 Launch Pad Users

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Tiva™C Series TM4C123G LaunchPad

Evaluation Board

User's Guide

Literature Number: SPMU296

April 2013

Contents

1 Board Overview .................................................................................................................. 4

1.1 Kit Contents .................................................................................................................. 5

1.2 Using the Tiva C Series LaunchPad ..................................................................................... 5

1.3 Features ...................................................................................................................... 5

1.4 BoosterPacks ................................................................................................................ 6

1.5 Specifications ................................................................................................................ 6

2 Hardware Description .......................................................................................................... 7

2.1 Functional Description ...................................................................................................... 7

2.1.1 Microcontroller ...................................................................................................... 7

2.1.2 USB Connectivity .................................................................................................. 8

2.1.3 Motion Control ...................................................................................................... 8

2.1.4 User Switches and RGB User LED .............................................................................. 9

2.1.5 Headers and BoosterPacks ....................................................................................... 9

2.2 Power Management ....................................................................................................... 11

2.2.1 Power Supplies ................................................................................................... 11

2.2.2 Hibernate .......................................................................................................... 11

2.2.3 Clocking ............................................................................................................ 12

2.2.4 Reset ............................................................................................................... 12

2.3 In-Circuit Debug Interface (ICDI) ........................................................................................ 12

2.3.1 Virtual COM Port ................................................................................................. 12

3 Software Development ....................................................................................................... 13

3.1 Software Description ...................................................................................................... 13

3.2 Source Code ............................................................................................................... 13

3.3 Tool Options ................................................................................................................ 13

3.4 Programming the Tiva C Series LaunchPad Evaluation Board ..................................................... 14

4 References, PCB Layout, and Bill of Materials ...................................................................... 15

4.1 References ................................................................................................................. 15

4.2 Component Locations ..................................................................................................... 16

4.3 Bill of Materials (BOM) .................................................................................................... 17

A Schematics ....................................................................................................................... 19

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List of Figures

1-1. Tiva C Series TM4C123G LaunchPad Evaluation Board.............................................................. 4

2-1. Tiva C Series LaunchPad Evaluation Board Block Diagram.......................................................... 7

4-1. Tiva C Series LaunchPad Component Locations (Top View) ....................................................... 16

4-2. Tiva C Series LaunchPad Dimensions ................................................................................. 17

List of Tables

1-1. EK-TM4C123GXL Specifications ......................................................................................... 6

2-1. USB Device Signals ........................................................................................................ 8

2-2. User Switches and RGB LED Signals ................................................................................... 9

2-3. J1 Connector ................................................................................................................ 9

2-4. J2 Connector............................................................................................................... 10

2-5. J3 Connector............................................................................................................... 10

2-6. J4 Connector............................................................................................................... 11

2-7. In-Circuit Debug Interface (ICDI) Signals .............................................................................. 12

2-8. Virtual COM Port Signals................................................................................................. 12

4-1. EK-TM4C123GXL Bill of Materials ..................................................................................... 17

SPMU296–April 2013 List of Figures

Power Select

Switch Green Power LED

USB Connector

(Power/ICDI)

Reset Switch

RGB User LED

User Switch 2User Switch 1

USB Micro-A/-B

Connector

(Device)

Tiva C Series

LaunchPad

BoosterPack XL

Interface (J1, J2, J3,

and J4 Connectors)

Tiva C Series

LaunchPad

BoosterPack XL

Interface (J1, J2, J3,

and J4 Connectors)

MSP430

LaunchPad-Compatible

BoosterPack Interface

MSP430

LaunchPad-Compatible

BoosterPack Interface

Tiva

TM4C123GH6PMI

Microcontroller

Tiva

TM4C123GH6PMI

Microcontroller

Chapter 1

SPMU296–April 2013

Board Overview

The Tiva™ C Series TM4C123G LaunchPad Evaluation Board (EK-TM4C123GXL) is a low-cost

evaluation platform for ARM®Cortex™-M4F-based microcontrollers. The Tiva C Series LaunchPad design

highlights the TM4C123GH6PMI microcontroller USB 2.0 device interface, hibernation module, and motion

control pulse-width modulator (MC PWM) module. The Tiva C Series LaunchPad also features

programmable user buttons and an RGB LED for custom applications. The stackable headers of the Tiva

C Series TM4C123G LaunchPad BoosterPack XL interface demonstrate how easy it is to expand the

functionality of the Tiva C Series LaunchPad when interfacing to other peripherals on many existing

BoosterPack add-on boards as well as future products. Figure 1-1 shows a photo of the Tiva C Series

LaunchPad.

Figure 1-1. Tiva C Series TM4C123G LaunchPad Evaluation Board

Tiva, MSP430, Code Composer Studio are trademarks of Texas Instruments.

Cortex is a trademark of ARM Limited.

ARM, RealView are registered trademarks of ARM Limited.

Microsoft, Windows are registered trademarks of Microsoft Corporation.

All other trademarks are the property of their respective owners.

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Kit Contents

1.1 Kit Contents

The Tiva C Series TM4C123G LaunchPad Evaluation Kit contains the following items:

• Tiva C Series LaunchPad Evaluation Board (EK-TM4C123GXL)

• On-board In-Circuit Debug Interface (ICDI)

• USB micro-B plug to USB-A plug cable

•README First document

1.2 Using the Tiva C Series LaunchPad

The recommended steps for using the Tiva C Series TM4C123G LaunchPad Evaluation Kit are:

1. Follow the README First document included in the kit. The README First document will help you

get the Tiva C Series LaunchPad up and running in minutes. See the Tiva C Series LaunchPad web

page for additional information to help you get started.

2. Experiment with LaunchPad BoosterPacks. A selection of Tiva C Series BoosterPacks and

compatible MSP430™ BoosterPacks can be found at the TI MCU LaunchPad web page.

3. Take your first step toward developing an application with Project 0 using your preferred ARM

tool-chain and the Tiva C Series TivaWare Peripheral Driver Library. Software applications are

loaded using the on-board In-Circuit Debug Interface (ICDI). See Chapter 3,Software Development,

for the programming procedure. The TivaWare for C Series Peripheral Driver Library Software

Reference Manual contains specific information on software structure and function. For more

information on Project 0, go to the Tiva C Series LaunchPad wiki page.

4. Customize and integrate the hardware to suit an end application. This user's manual is an

important reference for understanding circuit operation and completing hardware modification.

You can also view and download almost six hours of training material on configuring and using the

LaunchPad. Visit the Tiva C Series LaunchPad Workshop for more information and tutorials.

1.3 Features

Your Tiva C Series LaunchPad includes the following features:

• Tiva TM4C123GH6PMI microcontroller

• Motion control PWM

• USB micro-A and micro-B connector for USB device, host, and on-the-go (OTG) connectivity

• RGB user LED

• Two user switches (application/wake)

• Available I/O brought out to headers on a 0.1-in (2.54-mm) grid

• On-board ICDI

• Switch-selectable power sources:

– ICDI

– USB device

• Reset switch

• Preloaded RGB quickstart application

• Supported by TivaWare for C Series software including the USB library and the peripheral driver library

• Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface, which features stackable headers to

expand the capabilities of the Tiva C Series LaunchPad development platform

– For a complete list of available BoosterPacks that can be used with the Tiva C Series LaunchPad,

see the LaunchPad web page.

SPMU296–April 2013 Board Overview

BoosterPacks

www.ti.com

1.4 BoosterPacks

The Tiva C Series LaunchPad provides an easy and inexpensive way to develop applications with the

TM4C123GH6PM microcontroller. Tiva C Series BoosterPacks and MSP430 BoosterPacks expand the

available peripherals and potential applications of the Tiva C Series LaunchPad. BoosterPacks can be

used with the Tiva C Series LaunchPad or you can simply use the on-board TM4C123GH6PM

microcontroller as its processor. See Chapter 2 for more information.

Build your own BoosterPack and take advantage of Texas Instruments’ website to help promote it! From

sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers

a variety of avenues for you to reach potential customers with your solutions.

1.5 Specifications

Table 1-1 summarizes the specifications for the Tiva C Series LaunchPad.

Table 1-1. EK-TM4C123GXL Specifications

Parameter Value

4.75 VDC to 5.25 VDC from one of the following sources:

• Debugger (ICDI) USB Micro-B cable (connected to a

Board supply voltage PC)

• USB Device Micro-B cable (connected to a PC)

2.0 in x 2.25 in x 0.425 in (5.0 cm x 5.715 cm x 10.795

Dimensions mm) (L x W x H)

• 3.3 VDC (300 mA max)

Break-out power output • 5.0 VDC (depends on 3.3 VDC usage, 23 mA to 323

mA)

RoHS status Compliant

6Board Overview SPMU296–April 2013

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TM4C123GH6PMI

Debug Breakout Pads

ICDI

USB Debug

Connector

USB Device

Connector

Power Select

Switch

ICDI

USB

VDD

JTAG/SWD

UART0

GPIO

I/O

Device

Power

Management

Breakout Pads

HIB WAKE

User

Switches

RGB LED

Tiva C Series

LaunchPad-Specific

BoosterPackXL

Expansion Headers

MSP430

LaunchPad-Compatible

Expansion Headers

Chapter 2

SPMU296–April 2013

Hardware Description

The Tiva C Series LaunchPad includes a TM4C123GH6PM microcontroller and an integrated ICDI as well

as a range of useful peripheral features (as the block diagram in Figure 2-1 shows). This chapter

describes how these peripherals operate and interface to the microcontroller.

Figure 2-1. Tiva C Series LaunchPad Evaluation Board Block Diagram

2.1 Functional Description

2.1.1 Microcontroller

The TM4C123GH6PM is a 32-bit ARM Cortex-M4-based microcontroller with 256-kB Flash memory, 32-

kB SRAM, and 80-MHz operation; USB host, device, and OTG connectivity; a Hibernation module and

PWM; and a wide range of other peripherals. See the TM4C123GH6PM microcontroller data sheet

(literature number SPMS376) for complete device details.

SPMU296–April 2013 Hardware Description

Functional Description

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Most of the microcontroller signals are routed to 0.1-in (2.54-mm) pitch headers. An internal multiplexer

allows different peripheral functions to be assigned to each of these GPIO pads. When adding external

circuitry, consider the additional load on the evaluation board power rails.

The TM4C123GH6PM microcontroller is factory-programmed with a quickstart demo program. The

quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the

quickstart application has been replaced with a user program.

2.1.2 USB Connectivity

The EK-TM4C123GXL is designed and functions as a USB device without hardware modification. The

USB device signals are dedicated to USB functionality and are not shared with the BoosterPack headers.

The USB device signals are listed in Table 2-1.

Table 2-1. USB Device Signals

GPIO Pin Pin Function USB Device

PD4 USB0DM D–

PD5 USB0DP D+

The TM4C123GH6PM target device is also capable of USB embedded host and on-the-go (OTG)

functions. OTG functionality can be enabled by populating R25 and R29 with 0-Ωresistors. These

resistors connect the USB ID and USB VBUS signals to PB0 and PB1. When these resistors are populated,

PB0 and PB1 must remain in the respective USB pin mode configurations to prevent device damage. PB0

and PB1 are also present on the J1 BoosterPack header. Therefore, if R25 or R29 are populated, care

must be taken not to conflict these signals with BoosterPack signals.

USB embedded host operation can be enabled in the same way for USB devices that are self-powered.

Providing power when acting as a USB host requires a BoosterPack with power switching and appropriate

connectors. All USB host signals are available on the BoosterPack interface except D+ and D–, which are

only available on the USB micro-A/-B connector and the two adjacent test points.

When connected as a USB device, the evaluation board can be powered from either the ICDI or the USB

Device connectors. The user can select the power source by moving the POWER SELECT switch (SW3)

to the Device position. See the Power Management schematic (appended to this document).

2.1.3 Motion Control

The EK-TM4C123GXL includes the Tiva C-Series Motion Control PWM technology, featuring two PWM

modules capable of generating 16 PWM outputs. Each PWM module provides a great deal of flexibility

and can generate simple PWM signals—for example, those required by a simple charge pump—as well

as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three

generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter

bridge.

Two quadrature encoder interfaces (QEI) are also available to provide motion control feedback. See the

Headers and BoosterPacks section of this document for details about the availability of these signals on

the BoosterPack interface.

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Functional Description

2.1.4 User Switches and RGB User LED

The Tiva C Series LaunchPad comes with an RGB LED. This LED is used in the preloaded RGB

quickstart application and can be configured for use in custom applications.

Two user buttons are included on the board. The user buttons are both used in the preloaded quickstart

application to adjust the light spectrum of the RGB LED as well as go into and out of hibernation. The user

buttons can be used for other purposes in the user’s custom application.

The evaluation board also has a green power LED. Table 2-2 shows how these features are connected to

the pins on the microcontroller.

Table 2-2. User Switches and RGB LED Signals

GPIO Pin Pin Function USB Device

PF4 GPIO SW1

PF0 GPIO SW2

PF1 GPIO RGB LED (Red)

PF2 GPIO RGB LED (Blue)

PF3 GPIO RGD LED (Green)

2.1.5 Headers and BoosterPacks

The two double rows of stackable headers are mapped to most of the GPIO pins of the TM4C123GH6PM

microcontroller. These rows are labeled as connectors J1, J2, J3, and J4. Connectors J3 and J4 are

located 0.1 in (2.54 mm) inside of the J1 and J2 connectors. All 40 header pins of the J1, J2, J3, and J4

connectors make up the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface. Table 2-3

through Table 2-6 show how these header pins are connected to the microcontroller pins and which GPIO

functions can be selected.

NOTE: To configure the device peripherals easily and intuitively using a graphical user interface

(GUI), see the Tiva C Series Pinmux Utility found at www.ti.com/tool/lm4f_pinmux. This easy-

to-use interface makes setting up alternate functions for GPIOs simple and error-free.

Table 2-3. J1 Connector(1)

Analog Tiva C GPIOPCTL Register Setting

On-

Function Series

J1 Pin GPIO board MCU

GPIO Function 1 2 3 4 5 6 7 8 9 14 15

AMSEL

1.01 3.3 V

1.02 PB5 AIN11 – 57 – SSI2Fss – M0PWM3 – – T1CCP1 CAN0Tx – – –

1.03 PB0 USB0ID – 45 U1Rx – – – – – T2CCP0 – – – –

1.04 PB1 USB0VBUS – 46 U1Tx – – – – – T2CCP1 – – – –

1.05 PE4 AIN9 – 59 U5Rx – I2C2SCL M0PWM4 M1PWM2 – – CAN0Rx – – –

1.06 PE5 AIN8 – 60 U5Tx – I2C2SDA M0PWM5 M1PWM3 – – CAN0Tx – – –

1.07 PB4 AIN10 – 58 – SSI2Clk – M0PWM2 – – T1CCP0 CAN0Rx – – –

1.08 PA5 – – 22 – SSI0Tx – – – – – – – – –

1.09 PA6 – – 23 – – I2C1SCL – M1PWM2 – – – – – –

1.10 PA7 – – 24 – – I2C1SDA – M1PWM3 – – – – – –

(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

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Table 2-4. J2 Connector(1)

Analog Tiva C GPIOPCTL Register Setting

Function

J2 On-board Series

GPIO

Pin Function MCU

GPIO 1 2 3 4 5 6 7 8 9 14 15

AMSEL

2.01 GND

2.02 PB2 – – 47 – – I2C0SCL – – – T3CCP0 – – – –

2.03 PE0 AIN3 – 9 U7Rx – – – – – – – – – –

2.04 PF0 – USR_SW2/ 28 U1RTS SSI1Rx CAN0Rx – M1PWM4 PhA0 T0CCP0 NMI C0o – –

WAKE (R1)

2.05 RESET

PB7 – – 4 – SSI2Tx – M0PWM1 – – T0CCP1 – – – –

PD1 AIN6 Connected 62 SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1 – WT2CCP1 – – – –

2.06 for MSP430

Compatibility

(R10)

PB6 – – 1 – SSI2Rx – M0PWM0 – – T0CCP0 – – – –

PD0 AIN7 Connected 61 SSI3Clk SSI1Clk I2C3SCL M0PWM6 M1PWM0 – WT2CCP0 – – – –

2.07 for MSP430

Compatibility

(R9)

2.08 PA4 – – 21 – SSI0Rx – – – – – – – – –

2.09 PA3 – – 20 – SSI0Fss – – – – – – – – –

2.10 PA2 – – 19 – SSI0Clk – – – – – – – – –

(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

Table 2-5. J3 Connector(1)

Analog Tiva C GPIOPCTL Register Setting

Function

J3 On-board Series

GPIO

Pin Function MCU

GPIO 1 2 3 4 5 6 7 8 9 14 15

AMSEL

3.01 5.0 V

3.02 GND

PD0 AIN7 – 61 SSI3Clk SSI1Clk I2C3SCL M0PWM6 M1PWM0 – WT2CCP0 – – – –

PB6 – Connected 1 – SSI2Rx – M0PWM0 – T0CCP0 – – – –

3.03 for MSP430

Compatibilit

y (R9)

PD1 AIN6 – 92 SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1 – WT2CCP1 – – – –

PB7 – Connected 4 – SSI2Tx – M0PWM1 – – T0CCP1 – – – –

3.04 for MSP430

Compatibilit

y (R10)

3.05 PD2 AIN5 63 SSI3Rx SSI1Rx – M0FAULT0 – – WT3CCP0 USB0EPE

3.06 PD3 AIN4 – 64 SSI3Tx SSI1Tx – – – – WT3CCP1 USB0PFLT – – –

3.07 PE1 AIN2 – 8 U7Tx – – – – – – – – –

3.08 PE2 AIN1 – 7 – – – – – – – – – – –

3.09 PE3 AIN0 – 6 – – – – – – – – – – –

3.10 PF1 – – 29 U1CTS SSI1Tx – – M1PWM5 – T0CCP1 – C1o TRD1 –

(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.

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Power Management

Table 2-6. J4 Connector

Analog Tiva C GPIOPCTL Register Setting

On-

Function

J4 Series

GPIO board

Pin MCU

GPIO Function 1 2 3 4 5 6 7 8 9 14 15

AMSEL

4.01 PF2 – Blue LED 30 – SSI1Clk – M0FAULT0 M1PWM6 – T1CCP0 – – – TRD0

(R11)

4.02 PF3 – Green 31 – SSI1Fss CAN0Tx – M1PWM7 – T1CCP1 – – – TRCLK

LED

(R12)

4.03 PB3 – – 48 – – I2C0SDA – – – T3CCP1 – – – –

4.04 PC4 C1– – 16 U4Rx U1Rx – M0PWM6 – IDX1 WT0CCP0 U1RTS – – –

4.05 PC5 C1+ – 15 U4Tx U1Tx – M0PWM7 – PhA1 WT0CCP1 U1CTS – – –

4.06 PC6 C0+ – 14 U3Rx – – – – PhB1 WT1CCP0 USB0EPE – – –

4.07 PC7 C0– – 13 U3Tx – – – – – WT1CCP1 USB0PFLT – – –

4.08 PD6 – – 53 U2Rx – – – – PhA0 WT5CCP0 – – – –

4.09 PD7 – – 10 U2Tx – – – – PhB0 WT5CCP1 NMI – – –

4.10 PF4 – USR_SW 5 – – – – M1FAULT0 IDX0 T2CCP0 USB0EPE – – –

1 (R13) N

Connectors J1 and J2 of the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface provide

compatibility with MSP430 LaunchPad BoosterPacks. Highlighted functions (shaded cells) in Table 2-3

through Table 2-5 indicate configuration for compatibility with the MSP430 LaunchPad.

A complete list of Tiva C Series BoosterPacks and Tiva C Series LaunchPad-compatible MSP430

BoosterPacks is available at www.ti.com/tm4c123g-launchpad.

2.2 Power Management

2.2.1 Power Supplies

The Tiva C Series LaunchPad can be powered from one of two power sources:

• On-board ICDI USB cable (Debug, Default)

• USB device cable (Device)

The POWER SELECT switch (SW3) is used to select one of the two power sources. Select only one

source at a time.

2.2.2 Hibernate

The Tiva C Series LaunchPad provides an external 32.768-kHz crystal (Y1) as the clock source for the

TM4C123GH6PM Hibernation module clock source. The current draw while in Hibernate mode can be

measured by making some minor adjustments to the Tiva C Series LaunchPad. This procedure is

explained in more detail later in this section.

The conditions that can generate a wake signal to the Hibernate module on the Tiva C Series LaunchPad

are waking on a Real-time Clock (RTC) match and/or waking on assertion of the WAKE pin. (1) The second

user switch (SW2) is connected to the WAKE pin on the microcontroller. The WAKE pin, as well as the

VDD and HIB pins, are easily accessible through breakout pads on the Tiva C Series LaunchPad. See the

appended schematics for details.

spacer

(1) If the board does not turn on when you connect it to a power source, the microcontroller might be in Hibernate mode (depending on the

programmed application). You must satisfy one of the programmed wake conditions and connect the power to bring the microcontroller

out of Hibernate mode and turn on the board.

SPMU296–April 2013 Hardware Description

In-Circuit Debug Interface (ICDI)

www.ti.com

There is no external battery source on the Tiva C Series LaunchPad Hibernation module, which means

the VDD3ON power control mechanism should be used. This mechanism uses internal switches to

remove power from the Cortex-M4 processor as well as to most analog and digital functions while

retaining I/O pin power.

To measure the Hibernation mode current or the Run mode current, the VDD jumper that connects the 3.3

V pin and the MCU_PWR pin must be removed. See the complete schematics (appended to this

document) for details on these pins and component locations. An ammeter should then be placed

between the 3.3 V pin and the MCU_PWR pin to measure IDD (or IHIB_VDD3ON). The TM4C123GH6PM

microcontroller uses VDD as its power source during VDD3ON Hibernation mode, so IDD is the Hibernation

mode (VDD3ON mode) current. This measurement can also be taken during Run mode, which measures

IDD the microcontroller running current.

2.2.3 Clocking

The Tiva C Series LaunchPad uses a 16.0-MHz crystal (Y2) to complete the TM4C123GH6PM

microcontroller main internal clock circuit. An internal PLL, configured in software, multiples this clock to

higher frequencies for core and peripheral timing.

The Hibernation module is clocked from an external 32.768-KHz crystal (Y1).

2.2.4 Reset

The RESET signal into the TM4C123GH6PM microcontroller connects to the RESET switch and to the

ICDI circuit for a debugger-controlled reset.

External reset is asserted (active low) under any of three conditions:

• Power-on reset (filtered by an R-C network)

• RESET switch held down

• By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be

supported by all debuggers)

2.3 In-Circuit Debug Interface (ICDI)

The Tiva C Series LaunchPad evaluation board comes with an on-board In-Circuit Debug Interface (ICDI).

The ICDI allows for the programming and debug of the TM4C123GH6PM using the LM Flash Programmer

and/or any of the supported tool chains. Note that the ICDI supports only JTAG debugging. An external

debug interface can be connected for Serial Wire Debug (SWD) and SWO (trace).

Table 2-7 shows the pins used for JTAG and SWD. These signals are also mapped out to easily

accessible breakout pads and headers on the board.

Table 2-7. In-Circuit Debug Interface (ICDI) Signals

GPIO Pin Pin Function

PC0 TCK/SWCLK

PC1 TMS/SWDIO

PC2 TDI

PC3 TDO/SWO

2.3.1 Virtual COM Port

When plugged in to a PC, the device enumerates as a debugger and a virtual COM port. Table 2-8 shows

the connections for the COM port to the pins on the microcontroller.

Table 2-8. Virtual COM Port Signals

GPIO Pin Pin Function

PA0 U0RX

PA1 U0TX

12 Hardware Description SPMU296–April 2013

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Chapter 3

SPMU296–April 2013

Software Development

This chapter provides general information on software development as well as instructions for Flash

memory programming.

3.1 Software Description

The TivaWare software provided with the Tiva C Series LaunchPad provides access to all of the

peripheral devices supplied in the design. The Tiva C Series Peripheral Driver Library is used to operate

the on-chip peripherals as part of TivaWare.

TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These

applications demonstrate the capabilities of the TM4C123GH6PM microcontroller, as well as provide a

starting point for the development of the final application for use on the Tiva C Series LaunchPad

evaluation board.

3.2 Source Code

The complete source code including the source code installation instructions are provided at

www.ti.com/tm4c123g-launchpad. The source code and binary files are installed in the DriverLib tree.

3.3 Tool Options

The source code installation includes directories containing projects and/or makefiles for the following tool-

chains:

• Keil ARM RealView®Microcontroller Development System

• IAR Embedded Workbench for ARM

• Sourcery CodeBench

• Texas Instruments' Code Composer Studio™ IDE

Download evaluation versions of these tools from the TI website. Due to code size restrictions, the

evaluation tools may not build all example programs. A full license is necessary to re-build or debug all

examples.

Instructions on installing and using each of the evaluation tools can be found in the Quickstart guides (for

example, Quickstart-Keil, Quickstart-IAR) which are available for download from the evaluation kit section

of the TI website at www.ti.com/tiva-c.

For detailed information on using the tools, see the documentation included in the tool chain installation or

visit the respective web site of the tool supplier.

SPMU296–April 2013 Software Development

Programming the Tiva C Series LaunchPad Evaluation Board

www.ti.com

3.4 Programming the Tiva C Series LaunchPad Evaluation Board

The Tiva C Series LaunchPad software package includes pre-built binaries for each of the example

applications. If you have installed TivaWare to the default installation path of

C:\ti\TivaWare_C_Series_<version>, you can find the example applications in

C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c123gxl . The on-board ICDI is used with the

LM Flash Programmer tool to program applications on the Tiva C Series LaunchPad.

Follow these steps to program example applications into the Tiva C Series LaunchPad evaluation board

using the ICDI:

1. Install LM Flash Programmer on a PC running Microsoft®Windows®.

2. Switch the POWER SELECT switch to the right for Debug mode.

3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB

port on the board.

4. Verify that the POWER LED D4 on the board is lit.

5. Run the LM Flash Programmer.

6. In the Configuration tab, use the Quick Set control to select the EK-TM4C123GXL evaluation board.

7. Move to the Program tab and click the Browse button. Navigate to the example applications directory

(the default location is C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c123gxl ).

8. Each example application has its own directory. Navigate to the example directory that you want to

load and then into the directory which contains the binary (*.bin) files. Select the binary file and click

Open.

9. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check

Reset MCU After Program.

Program execution starts once the Verify process is complete.

14 Software Development SPMU296–April 2013

Submit Documentation Feedback

Chapter 4

SPMU296–April 2013

References, PCB Layout, and Bill of Materials

4.1 References

In addition to this document, the following references are available for download at www.ti.com:

• Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376).

• LM Flash Programmer tool. Available for download at www.ti.com/tool/lmflashprogrammer.

• TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl.

• TivaWare for C Series Driver Library User’s Manual (literature number SPMU298).

• TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number

SBVS038)

• Texas Instruments’ Code Composer Studio IDE website: www.ti.com/ccs

Additional support:

• RealView MDK (www.keil.com/arm/rvmdkkit.asp)

• IAR Embedded Workbench (www.iar.com).

• Sourcery CodeBench development tools (www.codesourcery.com/gnu_toolchains/arm).

SPMU296–April 2013 References, PCB Layout, and Bill of Materials

Component Locations

www.ti.com

4.2 Component Locations

Plots of the top-side component locations are shown in Figure 4-1 and the board dimensions are shown in

Figure 4-2.

Figure 4-1. Tiva C Series LaunchPad Component Locations (Top View)

16 References, PCB Layout, and Bill of Materials SPMU296–April 2013

Submit Documentation Feedback

www.ti.com

Bill of Materials (BOM)

Figure 4-2. Tiva C Series LaunchPad Dimensions

NOTE: Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).

4.3 Bill of Materials (BOM)

Table 4-1 shows the bill of materials for the EK-TM4C123GXL evaluation board.

Table 4-1. EK-TM4C123GXL Bill of Materials

Item Ref Des Qty Description Manufacturer Manufacturer Part No

1 C1-2, C7, C12, C14 5 Capacitor, 0402, X5R, 10 V, Low Johanson Dielectrics 100R07X105KV4T

ESR Inc

2 C25-26, C31-32 4 Capacitor, 10 pF, 50 V, 5%, Murata GRM1555C1H100JZ01D

NPO/COG, 0402

3 C28-29 2 Capacitor, 24 pF, 50 V, 5%, TDK C1005C0G1H240J

NPO/COG, 0402

4 C3, C5, C8, C15, 7 Capacitor, 0.01 μF 25 V, 10% Taiyo Yuden TMK105B7103KV-F

C18-19, C21 0402 X7R

5 C4, C6, C10-11, C17, 8 Capacitor, 0.1 μF 16 V, 10% 0402 Taiyo Yuden EMK105B7104KV-F

C20, C23-24 X7R

6 C9, C22 2 Capacitor, 2.2 μF, 16 V, 10%, Murata GRM188R61C225KE15D

0603, X5R

7 D1 1 LED, Tri-Color RGB, 0404 SMD Everlight 18-038/RSGHBHC1-S02/2T

Common Anode

8 D4 1 LED, Green 565 nm, Clear 0805 Lite-On LTST-C171GKT

SMD

9 H24 1 Header, 1x2, 0.100, T-Hole, 3M 961102-6404-AR

Vertical Unshrouded, 0.220 Mate FCI 68001-102HLF

10 H25 1 Jumper, 0.100, Gold, Black, Sullins SPC02SYAN

Closed

11 J1, J3 2 Header, 2x10, T-Hole Vertical Samtec SSW-110-23-S-D

unshrouded stacking

SPMU296–April 2013 References, PCB Layout, and Bill of Materials

Bill of Materials (BOM)

www.ti.com

Table 4-1. EK-TM4C123GXL Bill of Materials (continued)

Item Ref Des Qty Description Manufacturer Manufacturer Part No

12 J11 1 USB Connector, Micro B Recept Hirose ZX62-B-5PA

RA SMT BTTM MNT

13 J2, J4 2 Header, 1x2, 0.100, SMT, Samtec TSM-110-01-S-DH-A-P-TR

Horizontal Unshrouded, 0.230 4UCON 10995

Mate Major League TSHSM-110-D-02-T-H-AP-

Electronics TR-P-LF

14 J9 1 USB Connector, Micro A/B Hirose ZX62-AB-5PA

Receptacle SMD

15 Q1-3 3 NPN SC70 pre-biased Diodes Inc DTC114EET1G

16 R1-2, R9-16, R20, 12 Resistor, 0 Ω1/10W 0603 SMD Panasonic ERJ-3GEY0R00V

R26

17 R18-19, R21-23, R28 6 Resistor, 10 kΩ, 1/10W, 5%, 0402 Yageo RC0402FR-0710KL

Thick Film

18 R3-5, R8, R27 5 Resistor, 330 Ω, 1/10W, 5%, 0402 Yageo RC0402FR-07330RL

19 R31 1 Resistor, 1 MΩ1/10W, 5%, 0402 Rohm MCR01MRTF1004

20 RESET SW1, SW2 3 Switch, Tact 6 mm SMT, 160gf Omron B3S-1000

21 SW3 1 Switch, DPDT, SMT 300 mA × 2 at C K Components JS202011SCQN

6 V

22 U1, U2 2 Tiva C Series MCU Texas Instruments TM4C123GH6PMI

TM4C123GH6PM

23 U8 1 Regulator, 3.3 V, 400 mA, LDO Texas Instruments TPS73633DRBT

24 Y1 1 Crystal, 32.768 kHz Radial Can Abracon AB26TRB-32.768KHZ- T

25 Y2, Y5 2 Crystal, 16.00 MHz 5.0x3.2mm NDK NX5032GA-16.000000 MHz

SMT Abracon ABM3-16.000 MHz-B2- T

PCB Do Not Populate List

(Shown for information only)

26 C31, C34 2 Capacitor, 0.1 μF 16 V, 10% 0402 Taiyo Yuden EMK105B7104KV-F

X7R

27 D2 1 Diode, Dual Schottky, SC70, Diodes Inc BAS70W-05-7-F

BAS70 Common Cathode

28 R17 1 Resistor, 10 kΩ1/10W 5%, 0402 Yageo RC0402FR-0710KL

Thick Film

29 R24 1 Resistor, 330 Ω, 1/10W, 5%, 0402 Yageo RC0402FR-07330RL

30 R25, R29-30 3 Resistor, 0 Ω, 1/10W 0603 Panasonic ERJ-3GEY0R00V

31 U4 1 IC, Single Voltage Supervisor, 5V, Texas Instruments TLV803MDBZR

DBV

18 References, PCB Layout, and Bill of Materials SPMU296–April 2013

Submit Documentation Feedback

Appendix A

SPMU296–April 2013

Schematics

This section contains the complete schematics for the Tiva C Series LaunchPad board.

• Microcontroller, USB, Expansion, Buttons, and LED

• Power Management

• In-Circuit Debug Interface

SPMU296–April 2013 Schematics

www.ti.com



108 WILD BASIN ROAD, SUITE 350



AUSTIN TX, 78746



TIVA MICROCONTROLLERS



TEXAS INSTRUMENTS



0.3



EK-TM4C123GXL



Tiva TM4C123G LaunchPad



Microcontroller, USB, Expansion, Buttons and LED



DGT



2/20/2013



EK-TM4C123GXL Rev A.sch



SHEET



PART NO.



DATE



REVISION



DESIGNER



FILENAME



DESCRIPTION



PROJECT



J1 and J2 provide compatability with



Booster Packs designed for MSP430 Launchpad



J3 and J4 sit 100 mils inside J1 and J2 to provide



extended functions specific to this board.



See the board user manual for complete table of pin mux functions



D-



D+



CON-USB-MICROAB



CON_110_100



CON_110_100



SW1



SW2



330



CON_110_100



CON_110_100



PB6



PB7



PF4



PE3



PE2



PE1



PE0



PD7



PC7



PC6



PC5



PC4



PA0



PA1



PA2



PA3



PA4



PA5



PA6



PA7



PF0



PF1



PF2



PF3



PD4



PD5



PB0



PB1



PB2



PB3



PC3



PC2



PC1



PC0



PD6



PB4



PB5



PE4



PE5



PD0



PD1



PD2



PD3



U1-A



TM4C123G



RGB_LED_0404_COMA



R10



R11



R12



R13



R14



330



DTC114EET1G



330



DTC114EET1G



330



DTC114EET1G



R25



R29



USB_DM



USB_DP



DEBUG/VCOM



GPIO



GPIO



PA2



PA3



PA4



PA5



PA6



PA7



PB0



PB1



PB2



PB3



PB4



PB5



PB6



PB7



PC4



PC5



PC6



PC7



PD0



PD1



PD2



PD3



PD6



PD7



PE0



PE1



PE2



PE3



PE4



PE5



PA0/U0RX_VCP_TXD



PA1/U0TX_VCP_RXD



DEBUG_PC0/TCK/SWCLK



DEBUG_PC1/TMS/SWDIO



DEBUG_PC2/TDI



DEBUG_PC3/TDO/SWO



USB_DM



USB_DP



USR_SW2



USR_SW1



GPIO



PB0



PB1



PB4



PB7



PB6



+3.3V



USR_SW2



USR_SW1



+USB_VBUS



WAKE



PB6



PB7



TARGETRST



PF4



PF3



PF2



PF1



PF0



PF4



PD7



+VBUS



PF2



PF3



PB2



+VBUS



LED_B



PB5



PE4



PE5



PA6



PA2



PA3



PA4



PF0



PE0



PF1



PB3



PC4



PC5



PC6



PC7



PD6



PA5



PA7



PD0



PD1



PD2



PD3



PE1



PE2



PE3



PD0



PD1



LED_G



LED_R



LED_R



LED_B



LED_G



PB1



PB0



TIVA MICROCONTROLLERS



www.ti.com



EK-TM4C123GXL



Tiva Launchpad



0.3



Power Management



DGT



AUSTIN TX, 78746



108 WILD BASIN ROAD, SUITE 350



TEXAS INSTRUMENTS



2/20/2013



EK-TM4C123GXL Rev A.sch



SHEET



PART NO.



DATE



REVISION



DESIGNER



FILENAME



DESCRIPTION



PROJECT



+3.3V 400mA Regulator



Power Select



RESET



H24 and H25 installed as a single 1x2



header on 100 mil center with jumper



OMIT this SVS Section for Tiva. Errata Fixed



OUT



GND



PAD



TPS73633DRB



C18



0.01uF



Green



R27



330



0.01uF



0.1uF



0.01uF



0.1uF



0.01uF



C10



0.1uF



C11



0.1uF



R31



C31



10pF



C32



10pF



16MHz



C29



24pF



C28



24pF



R28



10k



RESET



C13



0.1uF



OMIT



C22



2.2uF



H17



H18



H19



H20



H21



VDDA



GNDA



VDD



GND



VDDC



VDD



GND



WAKE



HIB



XOSC0



GNDX



XOSC1



VBAT



RESET



GND



OSC0



OSC1



VDD



VDD



GND



VDDC



U1-B



TM4C123G



32.768Khz



SW3



H22



H23



R26



R30



OMIT



H11



H12



H10



H13



H24



H25



R17



10k



GND



RESET



VDD



TLV803



1.0uF



C12



1.0uF



C14



1.0uF



+3.3V



+VBUS



WAKE



TARGETRST



+USB_VBUS



+ICDI_VBUS



+VBUS



+MCU_VDDC



+MCU_PWR



+3.3V



HIB



TARGETRST



ICDI_RST



+3.3V



+VBUS



+MCU_PWR



TIVA MICROCONTROLLERS



www.ti.com



EK-TM4C123GXL



In Circuit Debug Interface



Tiva TM4C123G LaunchPad



0.3



2/20/2013



DGT



AUSTIN TX, 78746



108 WILD BASIN ROAD, SUITE 350



TEXAS INSTRUMENTS



EK-TM4C123GXL Rev A.sch



SHEET



PART NO.



DATE



REVISION



DESIGNER



FILENAME



DESCRIPTION



PROJECT



ICDI JTAG



In-Circuit Debug Interface (ICDI)



TC2050-IDC-NL



C15



0.01uF



C17



0.1uF



C19



0.01uF



C20



0.1uF



C21



0.01uF



C23



0.1uF



C24



0.1uF



C25



10pF



C26



10pF



16MHz



R19



10k



C34



0.1uF



OMIT



R21



10k



R22



10k



2.2uF



R18



10k



R23



10k



H14



D-



D+



J11



CON-USB-MICROB



R24



330



H15



PB6



PB7



PF4



PE3



PE2



PE1



PE0



PD7



PC7



PC6



PC5



PC4



PA0



PA1



PA2



PA3



PA4



PA5



PA6



PA7



PF0



PF1



PF2



PF3



PD4



PD5



PB0



PB1



PB2



PB3



PC3



PC2



PC1



PC0



PD6



PB4



PB5



PE4



PE5



PD0



PD1



PD2



PD3



U2-A



TM4C123G



VDDA



GNDA



VDD



GND



VDDC



VDD



GND



WAKE



HIB



XOSC0



GNDX



XOSC1



VBAT



RESET



GND



OSC0



OSC1



VDD



VDD



GND



VDDC



U2-B



TM4C123G



R16



1.0uF



1.0uF



R20



ICDI_TMS



ICDI_TCK



ICDI_TDO



ICDI_TDI



ICDI_RST



+3.3V



+3.3V



+3.3V



ICDI_TCK



ICDI_TMS



ICDI_TDI



ICDI_TDO



ICDI_RST



+3.3V



DEBUG/VCOM



PA1/U0TX_VCP_RXD



PA0/U0RX_VCP_TXD



DEBUG_PC0/TCK/SWCLK



DEBUG_PC1/TMS/SWDIO



DEBUG_PC3/TDO/SWO



DEBUG_PC2/TDI



TARGETRST



EXTDBG



DEBUG_PC3/TDO/SWO



DEBUG_PC1/TMS/SWDIO



DEBUG_PC0/TCK/SWCLK



+3.3V



+ICDI_VBUS



+MCU_PWR



EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS

Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims

arising from the handling or use of the goods.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from

the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO

BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF

MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH

ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL

DAMAGES.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This

notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety

programs, please visit www.ti.com/esh or contact TI.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or

combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and

therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,

software performance, or infringement of patents or services described herein.

REGULATORY COMPLIANCE INFORMATION

As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal

Communications Commission (FCC) and Industry Canada (IC) rules.

For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,

DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer

use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing

devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency

interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will

be required to take whatever measures may be required to correct this interference.

General Statement for EVMs including a radio

User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and

power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local

laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this

radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and

unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory

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For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant

Caution

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause

harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the

equipment.

FCC Interference Statement for Class A EVM devices

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial

environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the

instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to

cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.

These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment

generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If

this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and

on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the

equipment.

Concerning EVMs including radio transmitters

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this

device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired

operation of the device.

Concerning EVMs including detachable antennas

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain

approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should

be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum

permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain

greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de

l'utilisateur pour actionner l'équipement.

Concernant les EVMs avec appareils radio

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est

autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout

brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain

maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à

l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente

(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel

d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans

cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

SPACER

【【Important Notice for Users of this Product in Japan】】

This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and

Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of

Japan,

2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this

product, or

3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with

respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note

that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited

(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

http://www.tij.co.jp

【ご使用にあたっての注】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。

2. 実験局の免許を取得後ご使用いただく。

3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。

日本テキサス・インスツルメンツ株式会社

東京都新宿区西新宿６丁目２４番１号

西新宿三井ビル

http://www.tij.co.jp

SPACER

EVALUATION BOARD/KIT/MODULE (EVM)

WARNINGS, RESTRICTIONS AND DISCLAIMERS

For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished

electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in

laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks

associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end

product.

Your Sole Responsibility and Risk. You acknowledge, represent and agree that:

1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug

Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,

affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.

2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable

regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,

contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)

between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to

minimize the risk of electrical shock hazard.

3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even

if the EVM should fail to perform as described or expected.

4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.

Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the

user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and

environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact

a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the

specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or

interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the

load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures

greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include

but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the

EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please

be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable

in electronic measurement and diagnostics normally found in development environments should use these EVMs.

Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives

harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in

connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims

arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.

Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such

as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices

which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate

Assurance and Indemnity Agreement.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

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which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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