Powerwave Technologies 5JS0050 G3L-800-60-004 User Manual I GENERAL DESCRIPTION
Powerwave Technologies Inc G3L-800-60-004 I GENERAL DESCRIPTION
manual
Booster Amplifier Subrack System Integration Manual System Integration Manual Booster Amplifier Subrack (BAS) System 869-894 MHz, 91 Watts Maximum 044-05075 Rev. A Booster Amplifier Subrack System Intergration Manual ® © 2000 Powerwave Technologies Incorporated. All rights reserved. Powerwave Technologies, and the Powerwave logo are registered trademarks Powerwave Technologies, Inc. reserves the right to make changes to the documentation and equipment, including but not limited to component substitution and circuitry changes. Changes that impact this manual may subsequently be incorporated in a later revision of this manual. November 2000 Powerwave Technologies, Inc. 2026 McGaw Avenue Irvine, CA 92614 044-05078 Rev. A Tel: (949) 809-1100 Fax: (949) 757-0941 Web Site: www.powerwave.com ii Table Of Contents Par. No. 1-1 1-2 1-3 1-3.1 1-3.2 1-4 1-5 Section 1 General Description Page No. Introduction.................................................................................................. 1-1 General Description ..................................................................................... 1-1 Functional And Physical Specifications .......................................................... 1-2 MCR20830-1 Subrack Specifications ............................................................. 1-3 G3L-800 Series Amplifier Specifications......................................................... 1-5 Booster Amplifier Subrack Major Components ............................................... 1-8 Equipment Changes...................................................................................... 1-8 Section 2 Installation 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 Introduction.................................................................................................. 2-1 Site Survey ................................................................................................... 2-1 Electrical Service Recommendations .............................................................. 2-1 Air Conditioning............................................................................................ 2-1 Unpacking and Inspection............................................................................. 2-2 Installation Instructions ................................................................................ 2-3 Amplifier Module Power, Alarm, Control, and RF Connector ........................... 2-4 Remote Control and Status ........................................................................... 2-5 Section 3 Operating Instructions 3-1 3-2 Introduction.................................................................................................. 3-1 Initial Start-Up and Operating Procedures ..................................................... 3-1 Section 4 Principles of Operation 4-1 4-2 4-3 4-4 4-5 4-5.1 4-5.2 4-5.3 4-5.4 4-5.5 4-6 4-7 Introduction.................................................................................................. 4-1 RF Input Signal............................................................................................. 4-1 RF Output Load ............................................................................................ 4-1 System Functional Description ...................................................................... 4-1 Multi-Carrier Power Amplfier Functional Description ..................................... 4-2 Predriver Amplifier ........................................................................................ 4-3 Three Stage Driver Amplifier.......................................................................... 4-3 Main Amplifier .............................................................................................. 4-3 Alarm Monitoring and Control ....................................................................... 4-3 Loop Control Circuit...................................................................................... 4-3 Amplifier Module Cooling............................................................................... 4-4 Power Distribution ........................................................................................ 4-4 044-05078 Rev. A iii Table Of Contents (Continued) Par. No. Section 5 Maintenance Page No. 5-1 Introduction.................................................................................................. 5-1 5-2 Periodic Maintenance .................................................................................... 5-1 5-3 Test Equipment Required For Test................................................................. 5-1 5-4 Performance Test .......................................................................................... 5-2 5-4.1 Amplifier Performance Test............................................................................ 5-2 5-4.1.1 Amplifier Spurious Emissions Test ................................................................ 5-2 5-4.1.2 Gain Test ...................................................................................................... 5-2 5-4.1.3 Input Return Loss ......................................................................................... 5-2 5-5 Field Replacement of the Module ................................................................... 5-5 Section 6 Troubleshooting 6-1 6-2 6-3 6-3.1 6-3.2 Introduction.................................................................................................. 6-1 Troubleshooting ............................................................................................ 6-1 Return for Service Procedures ....................................................................... 6-1 Obtaining an RMA......................................................................................... 6-1 Repackaging for Shipment............................................................................. 6-1 List Of Appendices Page No. Appendix Booster Amplifier Subrack Backplane Wiring Diagram ...................................A-1 Disrtibution Printed Circuit Board Pinout Location ........................................B-1 Power Setting Procedure................................................................................C-1 List Of Illustrations Figure No. 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 Page No. VVA, Voltage Regulator and Dip Switch Pin Configuration.............................. 1-2 Booster Amplifier Subrack System-Top View .................................................. 1-9 Booster Amplifier Subrack Sysytem-Front View............................................ 1-10 Booster Amplifier Subrack System-Side View (Front Door Open)................... 1-11 Booster Amplifier Subrack System-Side View with Fans Removed................. 1-11 Booster Amplifier Subrack-Backplane.......................................................... 1-12 G3L-800 Series Amplifier............................................................................. 1-13 G3L-800 Series Amplifier – Rear, Top, Front Views....................................... 1-14 044-05078 Rev. A iv Table Of Contents (Continued) List Of Illustrations (Continued) 2-1 2-7 4-1 4-2 5-1 J5 Alarm Connector ...................................................................................... 2-4 Front Panel POWER IN Connector ................................................................. 2-5 System Block Diagram .................................................................................. 4-1 G3L-800-60 Multi-Carrier Power Amplifier Functional Block Diagram ............ 4-2 G3L-800-60 Amplifier Test Setup Diagram..................................................... 5-3 List Of Tables Table No. 1-1 1-2 1-3 1-4 1-5 1-4 1-7 1-8 2-1 2-2 2-3 5-1 5-2 5-3 6-1 Page No. Truth Table (Variable Attenuator) .................................................................. 1-2 Booster Amplifier Subrack System Specifications ........................................... 1-3 2-Way Splitter Electrical Specifications .......................................................... 1-4 2-Way Combiner Specifications ..................................................................... 1-4 G3L-800-Series Ampifier Electrical Specifications .......................................... 1-5 G3L-800-Series Amplifier Mechnaical Specifications....................................... 1-6 G3L-800 Series Amplifier Environmental Specifications ................................. 1-7 Major BAR System Components .................................................................... 1-8 Remote Control and Status Specifications...................................................... 2-5 J5 Alarm Connector Pin Designation ............................................................. 2-4 Front Panel POWER IN Connector Pin Designations ....................................... 2-5 Periodic Maintenance .................................................................................... 5-1 Test Equipment Required .............................................................................. 5-1 Multichannel Power Amplifier Test Data Sheet ............................................... 5-4 Troubleshooting ............................................................................................ 6-1 044-05078 Rev. A â Booster Amplifier Subrack System Integration Manual Section 1. General Description 1-1 Introduction This manual contains information and procedures for the installation, operation, and maintenance of Powerwave Technologies, Inc.’s (Powerwave’s) Booster Amplifier Subrack (BAS) system. This manual is organized into the following sections: Section 1. General Description Section 2. Installation Section 3. Operating Instructions Section 4. Principles of Operation Section 5. Maintenance Section 6: Troubleshooting Appendix A: Backplane Wiring Diagram Appendix B: Distribution PCB Pinout Location Appendix C: Power Setting Procedure 1-2 General Description Engineered to operate in a 2-way transceiver paging base station, the BAS system is a linear, Multi-Carrier Power Amplifier (MCPA) system that operates in the 5 MHz frequency band from 869 MHz to 894 MHz. The system integrates the model MCR20830-1Booster Amplifier Subrack (BAS) with two 60 Watt (model G3L-800-60) MCPAs to deliver a composite RF output of up to 100 Watts, after combined losses Designed to function as a subrack (see Figures 1-2 thru 1-6) in the host base station, the enclosure has a one inch (right and left side) flanged front panel and eight mounting holes (four on each side) to secure the Subrack into place (refer to Figure 1-3 for mounting hole locations). To aid in maintaining the system’s operating temperature, the BAS is equipped with two cooling fans mounted on the front access door (see Figures 1-3 and 1-4). Each 60W amplifier displaces approximately 1,900 BTUs of heat at full power. The composite input signal is applied to a 30dB 10W input attenuator, followed by a voltage variable attenuator that is controlled via dip switches on the front panel (refer to Table 1-1 and Figure 4-1). The maximum composite input signal may not exceed +31dBm. The composite signal is then fed to a two-way power splitter. The signals are applied to the amplifiers, and the amplifier outputs are combined again (refer to Tables 1-2 through 1-7 for specifications). With both amplifiers installed, the system provides 20dB of gain. The BAS also houses a distribution printed circuit board (PCB) for internal power and alarm distribution (refer to Appendix B). Accessible from the front panel is the DB9 external ALARM connector, the RF IN and RF OUT type N connectors. Additionally, the front panel provides access to the +27 Vdc POWER IN connector, visibility of the two MCPA’s fault alarm LED indicators and the GAIN CTRL dip switch. Refer to Table 1-1 for the dip switch truth table and Fiqure 1-1 for pin designations. With the access door open, the two amplifier modules are visible. All solid-state, the MCPAs are designed for parallel operation for high peak power output. Their modular construction and unique and highly effective LED-based operational status and fault indicators help minimize downtime. The turn-on and turn-off sequence of voltages are fully automatic, as is overload protection and recycling. Inadvertent operator damage from front panel manipulation is virtually impossible. Refer to Figures 1-7 and 1-8 for drawing views of the amplifier module. 044-05078 Rev. A 1-1 November 2000 Booster Amplifier Subrack System Integration Manual â Table 1-1 Truth Table Input Variable Attenuator Pin 1 Pin 2 Pin 3 Pin 4 Attenuation +5Vdc +5Vdc +5Vdc +5Vdc 0dB +5Vdc +5Vdc +5Vdc 0Vdc 1dB +5Vdc +5Vdc 0Vdc +5Vdc 2dB +5Vdc +0Vdc +5Vdc +5Vdc 4dB +5Vdc +5Vdc +5Vdc 0Vdc 8dB 0Vdc 0Vdc 0Vdc 0Vdc 15dB DIP SWITCH SOCKET VOLTAGE REGULATOR VARIABLE ATTENUATOR OUTPUT +5Vdc Vout GND GND GND GND NC GND NC GND GND 10 INPUT GND +27Vdc (Vin) Figure 1-1 Variable Attenuator, Voltage Regulator and Dip Switch Socket Pin Configuration 1-3 Functional and Physical Specifications The BAS system’s functional and physical specifications are listed in Table 1-2. A functional block diagram is provided in Section 4 of this manual to illustrate the system’s operational layout. 044-05078 Rev. A 1-2 November 2000 â Booster Amplifier Subrack System Integration Manual 1-3.1 MCR20830-1 Subrack Specifications Table 1-2 MCR20830-1 Booster Amplifier Subrack System Specifications Frequency 869 – 894 MHz Gain +20 dBm, ± 0.2 dBm RF Input Power +31 dBm composite w/variable attenuator set to 0dB attenuation. +46 dBm composite w/variable attenuator set to 15 dB attenuation. RF Output Power: 60W modules 52.3 Watts (+47.18 dBm) 1 module 91.0 Watts (+49.59 dBm) 2 modules Phase Variation ± 5° Alarms +5 Vdc TTL D.C. Power + 27 Vdc, 55 Amps max Total System Return Loss -19 dBm Channel Spacing 12.5 KHz Operating Temperature 0 to 50 degrees C Subrack Dimensions 12.22(H)x*17(W)x24.5(D) inches Weight (Fully assembled) Approximately 80 Pounds (36.28 kilograms) *Note: Does not include 1-inch right and left side mounting flanges. 044-05078 Rev. A 1-3 November 2000 Booster Amplifier Subrack System Integration Manual â Table 1-3 Electrical Specifications for 2-Way Splitter Insertion Loss -33dB Min. (TBD on actual part) -48dB Max. Amplitude Balance ±0.2dB Max. Insertion Loss Flatness Over Frequency ±0.3dB Max. Input/Output Return Loss -20dB Min. Port to Port Phase Delta ±5 Degrees Max. Port to Port Isolation -20.0dB Min. IP3 (Input Power = 5dBm) -90dBc Min. Power Handling (Fixed Attenuator) 20 Watts Max. Power Handling (Variable Attenuator) 3.16 Milliwatts Max. Table 1-4 Electrical Specifications for 2-Way Combiner Insertion Loss -0.6 dB (TBD on actual parts) Amplitude Balance ±0.2dB Max. Insertion Loss Flatness Over Frequency ±0.3dB Max. Input/Output Coupled Port Return Loss -18.0 dB Min. Port to Port Phase Delta ±5 Degrees Max. Port to Port Isolation -20.0dB Min.. Power Handling 120 Watts Sampling Coupler -25dB ±1dB Sampling Coupler Directivity -18.0 dB Min. IP3 (Input Power = TBD) -100 dBc Min 044-05078 Rev. A 1-4 November 2000 Booster Amplifier Subrack System Integration Manual â 1-3.2 GL3-800 Series Amplifier Sprecifications Table 1-5 G3L-800 Series Amplifier’s Electrical Specifications Frequency Range 869-894 MHz Channel Spacing 12.5 KHz Output Power: GL3-900-60 +47.8 dBm (60 Watts) Input Power -10.0 dBm max. RF Gain GL3-900-60-001, -006 +57.8 dB ±1.0 dB @ +27Vdc, 25 C G3L-800-60-002, -004 +62 dB ±1.0 dB @ +27Vdc, 25 C G3L-800-60-003 +65 dB ±0.7 dB @ +27Vdc, 25 C RF Gain Flatness over the operating frequency range ±0.1 dB over any 1.25 MHz (over the frequency range). Gain Flatness: ±0.5 dB (935 MHz – 942 MHz) Normal Operating Voltage +27 Vdc ±1V Nominal (±5%) 1Vpp ripple (100-120 Hz) max. Current Consumption: GL3-900-60 27 Amps @ 27 Vdc, 25 °C, Prf = 50 Watts average Abnormal Operating Voltage +21 Vdc to below +26 Vdc. Above +28 Vdc to +29 Vdc. RF Gain variation by Temp & Voltage TBD Gain Variation Over Dynamic Range ±0.1 dB max./20 dB for 0 to –20 dB rated power output Intermodulation Distortion -65 dBc min. (Main signal power to Spurious @ (12.5 kHz) In-Band Spurious -55 dBc min @ +23 to +24 Vdc Input/Output VSWR. 1.5: 1 max @ 65 ± ºC. Load Stability Infinite VSWR. all phases Output Isolation 20 dB min. (shall incorporate an output isolator) 044-05078 Rev. A 1-5 November 2000 Booster Amplifier Subrack System Integration Manual â Table 1-6 G3L-800 Series Amplifier’s Mechanical Specifications Items Specifications Physical Dimension of MCPA Front panel: 342.5mm(W) x 99mm(H) x 3mm(D) Body: 288.8mm(W) x 95.3mm(H) x 446mm(D) Weight Approximately 28.6 pounds (13 killograms) Connector Type D-sub, Hybrid, Plug-in Type RF connector: PKZ 26-0020 series straight plug type (Phoenix Co.) refers to attached drawing. MCPA Front Panel Switch CKT Breaker. +27 Vdc Power Indicator Connector Description Pin Outs A1 RF Output (Coaxial Contact) A2 Ground (Power Contact) A3 +27 Vdc (Power Contact) A4 RF Input (Coaxial Contact) TX H 10 +27 V TX L 11 COM SV GND 12 AMP AO RX H 13 AMP A1 RX L 14 AMP A2 GND 15 AMP A3 HERE LPA 16 NC FF LPA 17 NC RESERVED Markings TBD Front Panel LED Display LED type: SMD RUN GREEN (When MCPA is enabled) ALM Red (When any alarm occurred, LED is on) DC Green (When DC Power is ON, LED is on) MCPA Captive fastener TBD Front Panel color & silk TBD 044-05078 Rev. A 1-6 November 2000 Booster Amplifier Subrack System Integration Manual â Table 1-7 Environmental Specifications for G3L-800 Series Amplifiers Items Specifications Operating Temperature 0 to + 50 C Storage Temperature -40 to + 85 C Relative Humidity 5 to 90% RH (non-condensing) Operating Air Pressure 860 to 1060 mbar Shock 40 m/s s* @ 22 ms half sinusoid shock Pressure Integral forced air cooling must operate correctly at up to 0.3 inches back. Vibration Bellcore TR-NWT-000063 (1 m/s*s0.1∼200Hz) Corrosion Resistance/ Salt Fog The MCPAs shall comply with the requirements of Bellcore Technical Reference TA-NWT-000487, Issue 2, Section 4.12 Altitude All specifications shall be met at an altitude up to 15,000 feet where the maximum external ambient temperature is decreased by 0.5 C/ 1000 feet above sea level. The MCPAs shall not sustain damage when being transported at altitude up to 40,000 feet or uniformly applied pressure to 30 PSIA. 044-05078 Rev. A 1-7 November 2000 â 1-4 Booster Amplifier Subrack System Integration Manual Booster Amplifier Subrack (BAS) System Major Components Table 1-8 lists the model numbers and descriptions of the major components that comprise the BAS system and the document number (if available) of the manual related to each component. Table 1-8 Major BAS System Components Qty Per Expandable To Model/PN Description 800-01292-001 Top Assembly, BAS II w/o Combiner Backplane 800-01294-001 Front Panel Assy 700-00901-001 Cable Assy, Power In 700-00902-001 Cable Assy, Amp Power 700-00903-001 Cable Assy, Amp Power 700-00904-001 Cable Assy, Fan 700-00905-001 Cable Assy, Amplifier 800-001296-001 Fan Assy 800-01297-001 Tray Assy 500-01425-001 PCB Assy, Power Distribution MCR20830-1 Booster Amplifier Subrack GL3-900-60-005 60-Watt Amplifier System 1-5 Equipment Changes Powerwave Technologies, Inc. reserves the right to make minor changes to the equipment, including but not limited to component substitution and circuitry changes. Changes that impact this manual may be incorporated in a later revision of the manual. 044-05078 Rev. A 1-8 November 2000 â Booster Amplifier Subrack System Integration Manual Figure 1-2 Booster Amplifier Subrack System – Top View 044-05078 Rev. A 1-9 November 2000 â Booster Amplifier Subrack System Integration Manual Figure 1-3 Booster Amplifier Subrack System – Front View. 044-05078 Rev. A 1-10 November 2000 â Booster Amplifier Subrack System Integration Manual Figure 1-4 Booster Amplifier Subrack System – Side View (Front Door Open) Figure 1-5 Booster Amplifier Subrack System – Side View with Fans Removed 044-05078 Rev. A 1-11 November 2000 â Booster Amplifier Subrack System Integration Manual Figure 1-6 BAS Backplane 044-05078 Rev. A 1-12 November 2000 â Booster Amplifier Subrack System Integration Manual Figure 1-7 Model GL3-800 Series Amplifier 044-05078 Rev. A 1-13 November 2000 â Booster Amplifier Subrack System Integration Manual Figure 1-8 Model GL3-800 Series Amplifier - Rear, Top and Front Views 044-05078 Rev. A 1-14 November 2000 â Booster Amplifier Subrack System Integration Manual Section 2. Installation 2-1 Introduction This section contains unpacking, inspection, installation instructions and recommendations for the Booster Amplifier Subrack (BAS) System. It is important that the licensee perform the following tasks correctly and in good faith: 1. Carefully read all material in this section prior to equipment unpacking or installation. 2. Also, read and review the operating procedures in Section 3 prior to installing the equipment. 3. If applicable, carefully review the Federal Communications Commission (FCC) rules as they apply to your installation. DON'T TAKE CHANCES WITH YOUR LICENSE. 2-2 Site Survey Powerwave Technologies recommends that site surveys be performed by qualified individuals or firms prior to equipment ordering or installation. Performing a detailed site survey will reduce or eliminate installation and turn-up delays caused by oversights. Pay particular attention to power plant capacity, air conditioning needs, and RF/DC cabling/breaker requirements. 2-3 Electrical Service Recommendations Powerwave recommends that: § Proper AC line conditioning and surge suppression be provided on the primary AC input to the +27 Vdc power source. § All electrical service should be installed in accordance with the National Electrical Code, any applicable state or local codes, and good engineering practice. § Straight, short ground runs be used. § The electrical service must be well grounded. Circuit breakers should be thermal type, capable of handling the anticipated inrush current, in a load center with a master switch. 2-4 Air Conditioning Each GL3-900-60-005 amplifier generates 1900 BTUs of heat at full power. A fully populated MCR20830-1 Booster Amplifier Subrack system operating at full power will generate 3800 BTUs (using two GL3-900-60) amplifiers. At least a 1/3-ton air conditioner is needed to cool this Powerwave equipment. 044-05078 Rev A 2-1 November 2000 â Booster Amplifier Subrack System Integration Manual Unpacking And Inspection This equipment (as applicable) has been operated, tested and calibrated at the factory. Carefully open and remove the MCPAs and model MCR20830-1 Booster Amplifier Subrack (BAS) from their respective containers. Retain all packing material that can be reassembled in the event that the unit must be returned to the factory. Please perform the following steps: CAUTION Exercise care in handling equipment during inspection to prevent damage caused by rough or careless handling. 1. Visually inspect the MCPAs and the BAS for damage that may have occurred during shipment. 2. Check for evidence of water damage, bent or warped chassis, loose screws or nuts, or extraneous packing material in the connector(s). CAUTION Before applying power, make sure that all connectors to the BAS components are secure. Make sure that the input and output of the BAS are properly terminated at 50 ohms. Do not operate the system without a load attached. Refer to Section 1, Table 1-2 for input power requirements. Excessive input power may damage the equipment. If possible, inspect the equipment in the presence of the delivery person. If the equipment is damaged: § The carrier is your first area of recourse. § A claim should be filed with the carrier once the extent of any damage is assessed. We cannot stress too strongly the importance of IMMEDIATE careful inspection of the equipment and the subsequent IMMEDIATE filing of the necessary claims against the carrier if necessary. If the equipment is damaged and must be returned to the factory: § Please write or phone for return authorization. Refer to section 6-3.1 of this manual for instructions. § Powerwave may not accept returns without a return authorization. Claims for loss or damage may not be withheld from any payment to Powerwave nor may any payment due be withheld pending the outcome thereof. WE CANNOT GUARANTEE THE FREIGHT CARRIER'S PERFORMANCE 044-05078 Rev A 2-2 November 2000 â Booster Amplifier Subrack System Integration Manual 2-5 Installation Instructions The model MCR20830-1 Booster Amplifier Subrack (BAS) is designed for use in a 2-way transceiver paging base station. The host enclosure must permit access to the subrack for; DC power, RF and monitor cables. As well as, proper ventilation. The BAS system is designed for an enclosure with at least 36 inches of depth. Please proceed with installation as follows: WARNING Verify that all circuit breaker switches on the subrack are in the OFF position. Turn off external primary DC power before connecting DC power cables. 1. Install the subrack into the host base station and secure it into place using #10 32x1/2 Phillips screws and #10 flat washers. 2. Connect POWER IN (+27 Vdc) to the subrack. Refer to Figure 2-1 for pin locations and Table 2-2 for pin designations. 3. Connect RF IN cable to the subrack. 4. Connect RF OUT cable to the subrack. 5. Connect external ALARM interface to external summary board. Refer to Figure 2-2 for pin locations and Table 2-4 for pin designation. 6. Loosen thumbscrews to the front access door and open the door. 7. Before installing the MPCA into the subrack, inspect the 21-pin D-sub male combo connector on the rear of each amplifier. Verify that all pins are straight, no pins are recessed, and that the alignment shield is not bent. 8. Place power ON/OFF switch on the MCPA’s front panel in the “off” (far-left) position. WARNING Do not slam amplifiers into the subrack. Forcing the amplifier into the surack at too fast a rate may cause the pins on the 21-D-sub conector of the amplifier to become recessed or broken. 9. Insert a plug-in MCPA into the subrack. Tighten thumbscrews. 10. Repeat steps 7, 8 and 9 for the second MCPA. WARNING Check your work before applying DC voltage to the system. Make certain all connections are tight and correct. 11. Measure primary DC input voltage. DC input voltage should be +27 Vdc ±1.0 Vdc. If the DC input voltage is above or below the limits, call and consult Powerwave before you turn on your amplifier system. 12. Refer to Section 3 for initial turn-on and checkout procedures. 044-05078 Rev A 2-3 November 2000 â Booster Amplifier Subrack System Integration Manual 2-6 Amplifier Module Power, Alarm, Control, and RF Connector The power, alarm, control, and RF connections on the amplifier are made through a 21WA4 male connector and are listed and described in Table 2-1 below and in Section 1, Table 1-4. Table 2-1 MCPA Alarms & Controls Items Alarms & Controls Specifications TTL Level; +5 Volts Buffer: 74ABT244 (5V) - recommended When unit does not exist (HEAR_PAU) Equipped: GND Deletion OPEN When unit does not exist (HEAR_PAU) Normal: High Abnormal GND 3:1 (6dB ± 1dB) @ 35dBm-48dBm Output Power. PAU remains normal operation when this alarm condition disappears (NOT shutdown) This alarm only at +75ºC. +5 ºC//-0 ºC @output power is greater than +48.5 dBm ±0.5dB. MCPA will recover when the alarm condition disappears. (NOT shutdown). @ +20.5 Vdc ± 0.5V or +29 Vdc ± 0.5V. When this alarm occurs the MCPA shall shut-down When an alarm occurs on the feed forward path. Reserved Deletion Alarm Function Fail Alarm VSWR Alarm High Temp. Alarm Over Power Output Alarm DC Fail Alarm Loop Fail Alarm EN/DISABLE Remarks D-Line D-Line RS-485 RS-485 RS-485 RS-485 RS-485 RS-485 The Alarm Interface connector on the front panel of the MCR20830-1 Booster Amplifier Subrack is a 9-pin female D-sub connector that permits serial interface with the external alarm monitor. Refer to Figure 2-1 and Table 2-3 for connector definition. Figure 2-1 J5 Alarm Connector Table 2-2 J5 Alarm Connector Pin Designation Pin 044-05078 Rev A Description HERE_PAU-1 FF_PAU-1 DC_ON/OFF_1 PAU_RST_1 HERE_PAU_2 FF_PAU_2 DC_ON/OFF_2 2-4 November 2000 â Booster Amplifier Subrack System Integration Manual PAU_RST_2 No Connection (NC) 2-7 Remote Control and Status Refer to Table 2-3 for a description and list of remote control and status specifications for the MCPA. Figure 2-2 Front Panel POWER IN Connector Table 2-3 Front Panel POWER IN Connector Pin Designations Pin 044-05078 Rev A Description +27Vdc Ground +27Vdc NC +27Vdc Ground Ground 2-5 November 2000 Booster Amplifier Subrack System Integration Manual â Table 2-4 Remote Control and Status Items RS-485 Physical Layer Asynchronous Packet Protocol Address Specifcations Each MCPA shall support an RS-485 multi-drop differential serial asynchronous communications link operation at 9600 baud, 1 bit start, 8 bit data, 1 bit parity, 1 bit stop bit. The host shall terminate the RS-485 differential receive and transmit lines with 120 ohms. Because this communications bus is also shared with other system resources. The MCPA is required to support the following asynchronous packet format communications protocol. Packet format used for both commands and responses. Byte Field Description Source ID Address of Source Destination ID Address of Destination CMND/ ECHO Command/ Echo field Each MCPA shall receive but IGNORE any data packet NOT ADDRESSED to itself. The receiver must reset its state machines and ready itself to Receive the start of the next packet if it observes no activity on its RS-485 receive lines in 50 ms. The CMND/ ECHO byte is used to send commands from host to MCPA as follows: Byte Field Description Source ID Address of Source Destination ID Address of Destination -b(7): 0 -b(4:6): PAS ID -b(0:3): PAU slot ID CMND 00H 01H-ffH Response from PAU MCPA responses always echo the received CMND bytes as an ECHO byte of the response packet. Byte 044-05078 Rev A Command Field CMND/ ECHO= Report status Reserved Field Source ID Destination ID Report Data Description -b(7): 0 -b(4:6): PAS ID -b(0:3): PAU slot ID Address of Source -b0: 1= High VSWR condition/ 0=normal -b1: 1=High Temperature condition/ 0=normal -b2: 1=Over Power condition/ 0=normal -b3: 1=DC fail condition/ 0=normal -b4: 1=Loop alarm condition/ 0=normal -b5: 1=PAUenable Condition/ 0=normal -b6: reserved (0) -b7: reserved (0) 2-6 November 2000 â Booster Amplifier Subrack System Integration Manual Section 3. Operating Instructions 3-1 Introduction This section contains operating instructions for Powerwave’s Booster Amplifier Subrack (BAS) system. 3-2 Initial Start-Up and Operating Procedures To perform the initial start-up, proceed as follows: 1. Double check to ensure that all input and output cables are properly connected. CAUTION Before applying power, make sure that the input and output of the amplifier are properly terminated at 50 ohms. Do not operate the amplifier without a load attached. Refer to Table 1-1 for input power requirements. Excessive input power may damage the MCPA NOTE The output coaxial cable between the amplifier and the antenna must be 50 ohm coaxial cable. Use of any other cable will distort the output. 2. Turn on the supply that provides +27 Vdc to the amplifier system. 3. Place the power ON/OFF switch on the amplifier front panel in the “ON” (middle) position. 4. Close the front access door. Tighten the thumbscrews. 5. Ensure that the GAIN CTRL dip switch is set at minimum gain (maximum attenuation). Refer to Section 1, Table 1-1 for the dip switch’s truth table. 6. Allow the amplifiers to warm up for at least 5 minutes before taking power readings. 7. Refer to Appendix C for the power setting procedure. 044-05078 Rev. A 3-1 November 2000 Booster Amplifier Subrack System Integration Manual â Section 4. Principles of Operation 4-1 Introduction This section contains a functional description of Powerwave Technologies Inc.’s, Booster Amplifier Subrack (BAS) system. Refer to Figure 4-1 for the system’s functional block diagram. 4-2 RF Input Signal The maximum input power for all carrier frequencies to the system should not exceed the limits specified in Section 1, Table 1-2. 4-3 RF Output Load The load impedance should be as good as possible (VSWR of 1.5:1 or better) in the working band for good power transfer to the load. If the amplifier is operated into a filter, it will maintain its distortion characteristics outside the signal band even if the VSWR is infinite, provided the reflected power does not exceed one Watt. A parasitic signal of less than one-Watt incident on the output will not cause distortion at a higher level than the normal forward distortion (i.e. –65 dBc). MCR 20830-1 GAIN CTRL GL3-800-60 Splitter 60w 30 dB VVA RF Input RS-485 Alarm Interface DB9 ISO 2x Ground Alarm Ctrl 60w ISO 2x +27VDC MCR 20830-1 Distribution Circuit Board (DC,Fans, Alarms) Alarm -25dB Sample RF Output Figure 4-1 System Block Diagram 4-4 System Functional Discription Designed as a subrack for installation in a 2-way transceiver paging base station, the BAS system is comprised of a MCR20830-1 Booster Amplifier Subrack (BAS) and two G3L-900-60 plug-in multi-carrier power amplifiers (MPCAs). Additionally, the BAS houses a two-way power splitter/combiner and a distribution printed circuit board (PCB). Refer to Appendix A for pinout locations. The RF IN, RF OUT, +27 Vdc and the ALARM summary connector, interface with the host system via front panel cabling. The RF input signal is split equally and applied to the plug-in amplifiers. The output from each amplifier is an amplified composite signal of approximately 60 Watts before combiner losses. All phase and gain corrections are performed on the signal(s) in the individual amplifier. The amplifier outputs are fed to a power combiner and combined to form a composite RF output of up to 91 Watts after combiner losses. Refer to Figure 4-1 for the System Functional Block Diagram. 044-05078 Rev. A 4-1 November 2000 â Booster Amplifier Subrack System Integration Manual The distribution printed circuit board (PCB) assembly is used to distribute power to the BAS system’s internal components. The PCB circuit is a DC/DC converter designed to convert the +27 Vdc input to +12 Vdc and +15 Vdc. Refer to Appendix B for pinout location. 4-5 Multi-Carrier Power Amplifier (MCPA) Functional Description The MCPA is a linear, feed-forward multi-carrier power amplifier that operates in the 5 MHz frequency band from 869 MHz to 894 MHz at an output power 60 Watts. Each amplifier is a selfcontained module and is functionally independent of the other MCPA in the system. The amplifiers are designed for parallel operation to achieve high peak power output (refer to Table 1-2 for MPCA power specifications). Each MCPA has an alarm board that monitors the amplifier performance. If a failure or fault occurs in an MCPA, it is transmitted to the host system via the Dsubminiature 21WA4 connector at the rear of the module. A warning light (LED), which is routed from the amplifier via the J7 connector on the PCB to the front panel of the BAS, will illuminate. The indicator LEDs are identified as Alarm 1 and Alarm 2 which corresponds to their respective amplifier.. The amplifier is compliant to the requirements of FCC Part 22 with respect to spurious emissions. Constant gain is maintained by continuously comparing active paths with passive references, and correcting for small variations through the RF feedback controls. All gain variations, for example those due to temperature, are reduced to the passive reference variations. The amplifier is comprised of: A preamp A driver amplifier A main amplifier An error and pre-error amplifier Alarm monitoring and control -40dB 1st Loop Phase & Gain Pre Main FWD PWR Pre Amp RF Out Main Amp 2nd Loop Phase & Gain Delay Delay -30dB -10dB RFL PWR Error Amp Feed Forward Loop control +15 +5 -5 +27VDC Power Supply Alarms & Display Front Panel Smart Rack Figure 4-2 Multi-Carrier Power Amplifier Functional Block Diagram 4-5.1 Pre-driver Amplifier 044-05078 Rev. A 4-2 November 2000 â Booster Amplifier Subrack System Integration Manual The input of the amplifier uses two stages of class AB amplification which provide approximately 13.5 dB of gain in the 5 MHz frequency band from 869 MHz to 894 MHz. The amplifier operates on +27 Vdc. 4-5.2 Three-Stage Driver Amplifier The input of the amplifier uses three stages of class AB amplification which provide approximately 32 dB of gain in the 5 MHz frequency band from 869 MHz to 894 MHz. The amplifier operates on +27 Vdc, and a bias voltage of +5 Vdc. The logic controls the +5 Vdc bias voltage that shuts down the amplifier. 4-5.3 Main Amplifier The signal provides approximately 11 dB of gain in the 869 to 894 MHz frequency band. The output from the main amplifier is typically 60 Watts. The main amplifier operates on +27 Vdc, and a bias voltage of +5 Vdc. The alarm logic controls the +5 Vdc bias voltage that shuts down the amplifier. The main amplifier employs class AB amplification for maximum efficiency. The error amplifier and feed forward loops are used to correct signal non linearities introduced by the class AB main amplifier. The error amplifier operates in class A mode. The RF input signals are amplified by a preamp and coupled to an attenuator and phase shifter in the first feed-forward loop. The main signal is phase shifted by 180 degrees and amplified in the premain amplifier. The output from the premain amplifier is fed to the class AB main amplifier. The signal output from the main amplifier is sampled using a coupler, and the sample signal is combined with the main input signal and input to the second feed-forward loop. The error signal is attenuated, phase shifted 180 degrees, then fed to the error amplifier where it is amplified to a level identical to the sample output from the main amplifier. The output from the error amplifier is then coupled back and added to the output from the main amplifier. The control loops continuously make adjustments to cancel out any distortion in the final output signals. 4-5.4 Alarm Monitoring and Control During routine operation, all normal variations are automatically compensated for by the feedforward loop control. However, when large variations occur beyond the adjustment range of the loop control, a loop fault will occur. When this happens, the ALARM LED is illuminated on the front panel of the subrack. The fault is transmitted back to an external summary module via the external ALARM interface connection on the front panel of the subrack. 4-5.5 Loop Control Circuit The primary function of the first loop is to provide an error signal for the second loop. The primary function of the second loop is to amplify the error signal to cancel out spurious products developed in the main amplifier. The input signal is amplified by a preamplifier and fed to a coupler and delay line. The signal from the coupler is fed to the attenuator and phase shifter in the first loop. The first loop control section phase shifts the main input signals by 180 degrees and constantly monitors the output for correct phase and gain. The second loop control section obtains a sample of the distortion added to the output signals by the main amplifiers. The signal is phase shifted 180 degrees, then fed to the error amplifier where it is amplified to the same power level as the input sample. The signal is then coupled to the error signal on to the main output signal. The final output is monitored by the second loop and adjusted to ensure that the signal distortion and intermodulation distortion (IMD) on the final output is cancelled out. 4-6 Amplifier Module Cooling 044-05078 Rev. A 4-3 November 2000 â Booster Amplifier Subrack System Integration Manual Although each amplifier contains it own heat sink, it is cooled by forced air. Two fans mounted on the front of the subrack are used for forced air cooling and redundancy. The fans draw air through the front of the system and exhaust hot air out the back. The fans are field replaceable. Each amplifier, when properly cooled, will provide sufficient cooling to maintain the amplifier within the specified operating temperature range. Six inches of free space are required at both the front and rear panels of the subrack to allow adequate air volume to circulate over the heat sinks. 4-7 Power Distribution Primary DC power for the amplifier is provided by the host system. The amplifier module has a DC/DC converter and voltage regulator that converts the +27 Vdc to +15 Vdc, +5 Vdc, and +8 Vdc for internal use. 044-05078 Rev. A 4-4 November 2000 â Booster Amplifier Subrack System Integration Manual Section 5. Maintenance 5-1 Introduction This section contains periodic maintenance and performance test procedures for Powerwave’s Booster Amplifier Subrack (BAS) system. NOTE Check your sales order and equipment warranty before attempting to service or repair the unit. Do not break the seals on equipment under warranty or the warranty will be null and void. Do not return equipment for warranty or repair service until proper shipping instructions are received from the factory. 5-2 Periodic Maintenance Periodic maintenance requirements are listed in Table 5-1. Table 5-1 also lists the intervals at which the tasks should be performed. Table 5-1. Periodic Maintenance Task Inspection Cables and Connectors Interval Action 12 Months Performance Tests Clean Fans/Heat Sinks 12 Months 3 Months Inspect signal and power cables for frayed insulation. Check RF connectors to be sure that they are tight. Perform annual test per paragraph 5-5. Inspect for debri. Remove dust with a soft cloth/brush or vacuum cleaner. 5-3 Test Equipment Required For Test Test equipment required to test the amplifier is listed in Table 5-2. Equivalent test equipment may be substituted for any item, keeping in mind that a thermistor type power meter is required. NOTE All RF test equipment required must be calibrated to 0.05 dB resolution. Any deviation from the nominal attenuation must be accounted for and factored into all output readings. Table 5-2. Test Equipment Required Nomenclature Signal Generator 20 dB Attenuator, 250 Watt 20 dB Attenuator, 20 Watt (2 each) Spectrum Analyzer Coax Directional Coupler Power Meter / Sensor Arbitrary Waveform Generator Network Analyzer Source Diskette 044-05078 Rev. A Manufacturer H.P. Bird Bird H.P. H.P. H.P. Sony H.P. Powerwave 5-1 Model 8656B Tenuline Tenuline 8560E 778D 437B / 8481A AWG2021 8753C November 2000 â Booster Amplifier Subrack System Integration Manual 5-4 Performance Test Performance testing should be conducted every 12 months to ensure that the amplifier system meets the operational specifications listed in Table 5-3. Also verify system performance after any amplifier module is replaced in the field. The test equipment required to perform the testing is listed in Table 5-2, and the test setup is shown in Figure 5-1. NOTE The frequencies used in this test are typical for an amplifier with a 5 MHz band from 869 MHz to 894 MHz. Select evenly spaced F1, F2, F3, and F4 frequencies that cover the instantaneous bandwidth of your system. 5-4.1 Amplifier Performance Test To perform this test, proceed as follows: Connect test equipment as shown in Figure 5-1. WARNING Do not apply any RF signals at this time. 5-4.1.1 Amplifier Spurious Emissions Test: With the RF input signal to the amplifier set to be as shown in Figure 5-1, use the spectrum analyzer to measure the spurious emissions performance. Record test data in Table 5-3. Verify that it is within the specifications shown in Table 1-2. Switch tested amplifier to OFF. 5-4.1.2 Gain Test: 1. Disconnect spectrum analyzer from test setup, and connect the network analyzer. 2. Set network analyzer as follows: 3. A. Power output to -13 dBm. B. Frequency start to 869 MHz. C. Frequency stop to 894 MHz. D. Normalize the network analyzer for gain and return loss. Check the amplifier gain across the band from 869 MHz to 894 MHz. Gain should be as specified in Table 1-2. Record test data in Table 5-3. 5-4.1.3 Input Return Loss: Read and record the S11 return loss measurement on network analyzer. Record test data in Table 5-3. 044-05078 Rev. A 5-2 November 2000 â Booster Amplifier Subrack System Integration Manual Figure 5-1 Amplifier Test Setup Diagram 044-05078 Rev. A 5-3 November 2000 Booster Amplifier Subrack System Integration Manual â Table 5-3. Multi-Carrier Power Amplifier Test Data Sheet DATE _________________________________ MODULE S/N ___________________________ TEST CONDITIONS: Load and Source Impedance: 50 Ohms VSWR: < 1.2:1 Supply Voltage: +27 Vdc ±0.1 Vdc TEST RF Gain Spurious Emissions Gain Flatness Input Return Loss PASS SPECIFICATION Vcc = 27 Vdc PO = 50 W Freq. = 869 – 894 MHz Vcc = 27 Vdc PO =50 W 869 - 894 MHz Band Vcc = 27 Vdc PO =50 W 869 - 894 MHz Band Vcc = 27 Vdc PO = 50 W 869 - 894 MHz Band MIN Table 1-2 -0.5 dB MAX Table 1-2 +0.5 dB DATA -65 dBc ±0.5 dB -12 dB FAIL Tested by 044-05078 Rev. A 5-4 November 2000 â Booster Amplifier Subrack System Integration Manual 5-5 Field Replacement of the Module The GL3-900-60 multi-carrier power amplifier module can be replaced in the field on site by a qualified technician with experience maintaining RF power amplifiers and similar equipment: To replace a power amplifier module, proceed as follows: 1. Set on/off switch on the front panel of the amplifier module to OFF (down). 2. Loosen two thumbscrews that secure amplifier module to subrack. CAUTION When removing the amplifier from the subrack, it is very important to support the amplifier such that the rear of the module does not suddenly drop when the guide rail disengages from the track. A drop such as this could damage the rear 21WA4 multipin connector. 3. With steady even pressure, use handle on front of amplifier to pull module out of subrack. 4. Install replacement in reverse order of steps 1 through 3 above. 044-05078 Rev. A 5-5 November 2000 â Booster Amplifier Subrack System Integration Manual Section 6. Troubleshooting 6-1 Introduction This section contains a list of problems which users have encountered and a few suggested actions that may correct the problem. If the suggested corrective action does not eliminate the problem, please contact your Powerwave field representative or the factory for further instructions. NOTE Check your sales order and equipment warranty before attempting to service or repair the unit. Do not break the seals on equipment under warranty or the warranty will be null and void. Do not return equipment for warranty or repair service until proper shipping instructions are received from the factory. 6-2 Troubleshooting Refer to Table 6-1 for troubleshooting suggestions. Table 6-1. Troubleshooting. Symptom Inoperative MCR20830-1 Fan Noise GL3-900-60-001, -002, -003, -004, -006 Inoperative Suggested Action 1. 2. 3. 1. 2. 3. 1. 2. 3. Check for proper power supply voltages. Verify all RF connections. Contact your field representative. Locate noisy fan. Check for damage Replace noisy or damaged fan Check for proper power supply voltage. Verify all RF connections. Verify that unit does not have a major fault (red LED on front panel). Recycle power. 6-3 Return For Service Procedures When returning products to Powerwave, the following procedures will ensure optimum response. 6-3.1 Obtaining An RMA A Return Material Authorization (RMA) number must be obtained prior to returning equipment to the factory for service. Please contact our Repair Department at (949) 809-1100 to obtain this number, or FAX your request to (949) 757-6676. Failure to obtain this RMA number may result in delays in receiving repair service. 6-3.2 Repackaging For Shipment To ensure safe shipment of the amplifier, it is recommended that the package designed for the amplifier be used. The original packaging material is reusable. If it is not available, contact Powerwave’s Customer Service Department for packing materials and information. 044-05078 Rev. A 6-1 November 2000 â Booster Amplifier Subrack System Integration Manual Appendix A. Booster Amplifier Subrack Backplane Wiring Diagram AMP_1 A1 P2 A2 (TX_H) (TX_L) GND (RX_H) (RX_L) GND 22 23 (HERE_PAU) (FF_PAU) (DC_ONNOFF) (PAU_RST) 10 24 (DIV_SW) 11 (COM_SW) 12 A1 (AMP_A0) 13 A2 (AMP_A1) 14 15 16 25 26 (AMP_A2) LED_GRN ANODE 27 28 RF IN 20 21 +27Vdc RF INPUT LED_RED ANODE 17 GND A3 NC A4 RF OUTPUT AMP_2 A1 A2 10 29 11 30 12 31 (TX_H)_2 GND_2 (RX_H)_2 (RX_L)_2 (FF_PAU)_2 17 A3 A4 10 (DIV_SW)_2 11 (COM_SW)_2 12 (AMP_A0)_2 13 (AMP_A1)_2 14 35 36 16 (PAU_RST)_2 17 15 33 16 14 14 34 13 (DC_ONNOFF)_2 1- 12 GND_2 11 (HERE_PAU)_2 15 +27Vdc (TX_L)_2 13 32 RF INPUT (AMP_A2)_2 15 LED_GRN ANODE_2 16 LED_RED ANODE_2 17 18 GND 37 A3 NC A4 044-05078 Rev. A A-1 RF OUTPUT RF OUT November 2000 â Booster Amplifier Subrack System Integration Manual Appendix B. Distribution Printed Circuit Board Pinout Location DB37 PINOUT 20 P4 J4 21 22 TX_H TX_L RX_H RX_L RS485 23 24 25 26 27 HERE_PAU_1 FF_PAU_1 DC_ON/OFF_1 10 PAU_RST_1 11 DIV_SW_1 12 COM_SW_1 13 14 O TP1 (AMP_A0_1) AMP_A1_1 15 AMP_A2_1 16 28 29 17 11 12 31 NC N/C TX_H 19 J6 TX_L 21 22 RX_H 23 RX_L 24 13 32 14 33 15 34 16 35 SPLITTER/COMBINER HERE_PAU_2 25 26 FF_PAU_2 27 DC_ON/OFF_2 28 PAU_RST_2 29 DIV_SW_2 30 COM_SW_2 31 AMP_A0_2 J7 32 17 36 37 19 044-05078 Rev. A TP2 33 LED_GRN_2 34 18 ALARM LED_ RED_1 20 30 LED_GRN_1 18 10 J5 35 LED_RED_2 36 N/C 37 N/C 38 N/C 39 N/C 40 N/C LED B-1 November 2000 Booster Amplifier Subrack System Integration Manual â Appendix C Power Setting Procedure C-1 Power Setting Calculations: 1. Ensure the composite input power to the Powerwave MCR20930-1 is < 0 dBm. 2. Determine the required output level at the hatch plate per carrier (Analog, Digital, CDPD, and Setup Channels). Follow the example after step 5 below. 3. Determine the amount of loss between the subrack output and the hatch plate. A. Either the calculated value (Lucent uses 1.7dB for the Series II), or B. Measure the loss 1. Key one radio and make a measurement in dBm at the front of the subrack with an HP EPM-441A or equivalent power meter. Write the value down: _____ dBm. 2. Disconnect the radio and move the power meter to the hatch plate. 3. Key the same radio and make a measurement in dBm, and write it down: _____ dBm. The difference between the two measurements is the loss. 4. Determine the amount of power output at the rear of the subrack per carrier. 5. Multiply the number of carriers times the output power level per carrier at the front of the subrack. Three blank tables are provided on page 3 of this appendix for you to record your desired power levels. Hatch Power (w) Convert Hatch Power Loss from Hatch to Powerwave Subrack (dB) Power @ Powerwave Subrack (dBm) b=10*LOG(a / 0.001) d=b+c Analog 6.3 10*Log(6.3/0.001)=37.9934 1.7 CDMA* 21* 10*Log(21/0.001)=43.2222 CDPD 6.3 Setup Inner Tier Formula to dBm Convert Powerwave Subrack No. of Power to watts Carriers Total Power per Signal (watts) e=x10(d/10)*0.001 g=ef 37.9934 + 1.7 = 39.6934 x10(39.9934/10)*0.001=9.318 10 93.1838 1.7 43.2222 + 1.7 = 44.9222 x10(44.9222/10)*0.001=31.06 13 62.1226 10*Log(6.3/0.001)=37.9934 1.7 37.9934 + 1.7 = 39.6934 x10(39.9934/10)*0.001=9.318 9.3184 6.3 10*Log(6.3/0.001)=37.9934 1.7 37.9934 + 1.7 = 39.6934 x10(39.9934/10)*0.001=9.318 9.3184 2.5 10*Log(2.5/0.001)=33.9794 1.7 33.9794 + 1.7 = 35.6794 x10(35.6794/10)*0.001=3.697 14.7911 Total Power 188.7342 Example *Some RF Engineers will give the power for Pilot Page and Sync (on the order of 2 to 5W). Powerwave normally multiplies this value by 7 for the purpose of roughly calculating the CDMA channel with full traffic load. If the total output power level at the front of the Powerwave subrack exceeds the subrack’s specified capability with the number of populated amplifiers: Ø Reduce the number of input radios until the subrack power rating is met. 044-05078 Rev. A C-1 November 2000 Booster Amplifier Subrack System Integration Manual â C-2 Power Setting Procedure: Splitter Example: Single Analog Ch Composite ~-1.7dB 5 to 20dB Gain Avail. MCPA 58.8dBg Comb. 111mW 20.45dBm 29.59dBm 910mW DC 11.09W 40.45dBm 7.5W 38.75dBm 49.59dBm 91W 47.89dBm 61.52W Values in Boxes are given or known. The remaining values are calculated based on the given values. Maximum composite input level if gain is set to maximum (20dB) Figure C-1 Gain Block Example 1. Set all transceiver levels to midrange output levels if this is a new base station installation. For existing base stations, the levels may be left as they currently are set. NOTE The composite input level should not exceed -20dBm most applicatons. Higher input levels may result in over-driving the MCR20830-1 amplifier subrack. Refer to Section 1 for individual model power specifications. 2. Ensure all radios are not transmitting, including CDPD. 3. Connect the power meter, with appropriate attenuators as necessary, to the transmit filter output feed at the hatch plate. 4. Set the GAIN CTRL to minimum gain (maximum attenuation). Refer to Section 1, Table 1-1 for the dip switch truth table. 5. Key one radio (usually this is the primary setup channel). 6. Set the output level using the GAIN CTRL on the Powerwave subrack and transmitter gain adjustment for this single channel. Normally, the CDMA channel has the most limiting range, so this is the best channel to start with, although most technicians normally start with the setup channel. Try to keep the adjustments in the middle of the available range adjustments. 7. Verify the power level is still correct. 8. Unkey the radio. 9. Key one radio at a time and set the power level of each individual radio at the hatch plate according to the calculations made in the first section above. Do not readjust the GAIN CTRL level. 10. Unkey all radios. C-2.1 Overpower Verification 11. Connect the power meter, with appropriate attenuators as necessary, to the RF output of the Powerwave subrack. 12. Reconnect the transmit filter output cable to the antenna. 044-05078 Rev. A C-2 November 2000 Booster Amplifier Subrack System Integration Manual â 13. Key all the radios and measure the total maximum power. This power level should not exceed the rating for the MCR20830-1. If the power rating for the MCR20830-1 is exceeded, the intermodulation distortion performance of the amplifiers will suffer and the software-overpower protection feature will activate. NOTE: Each amplifier will go into overdrive alarm when they are being driven 3 dB over the rated power for that amplifier. Each amplifier will shut down at 3 dB over the rated power, and possibly cause the entire sector to be disabled. Table C-1 Amplifier and Amplifier Subrack ratings Amplifier 1 Module 2 Modules 60 Watt 47.8 dBm 52.3 W 47.18 dBm 91 W 49.52 dBm *All measurements should be made with a calibrated power meter accurate within +2% (HP EPM-441A or equivalent) 14. Disconnect all the radios. 15. Reconnect the RF output coax cable to the Powerwave subrack. 044-05078 Rev. A C-3 November 2000 â Hatch Power (w) Formula Booster Amplifier Subrack System Integration Manual Convert Hatch Power Loss from Hatch Power @ Powerwave Convert Powerwave No. of to Powerwave Subrack (dBm) Subrack Power to Carriers to dBm Subrack (dB) watts b=10*LOG(a / 0.001) d=b+c 10 e=x (d/10)*0.001 Total Power per Signal (watts) g=ef Sector: Total Power Hatch Power (w) Formula Convert Hatch Power Loss from Hatch Power @ Powerwave Convert Powerwave No. of to Powerwave Subrack (dBm) Subrack Power to Carriers to dBm Subrack (dB) watts b=10*LOG(a / 0.001) d=b+c 10 e=x (d/10)*0.001 Total Power per Signal (watts) g=ef Sector: Total Power Hatch Power (w) Formula Convert Hatch Power Loss from Hatch Power @ Powerwave Convert Powerwave No. of to Powerwave Subrack (dBm) Subrack Power to Carriers to dBm Subrack (dB) watts b=10*LOG(a / 0.001) d=b+c 10 e=x (d/10)*0.001 Total Power per Signal Sector: Total Power 044-05078 Rev. A C-4 November 2000 (watts)l g=ef
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