Quectel Wireless Solutions 201607EC25V LTE Module User Manual

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EC25-V
User Manual
LTE Module Series
Rev. EC25-V_User_Manual_V1.0
Date: 2016-03-28
www.quectel.com
LTE Module Series
EC25-V User Manual
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
Mail: info@quectel.com
Or our local office, for more information, please visit:
http://www.quectel.com/support/salesupport.aspx
For technical support, to report documentation errors, please visit:
http://www.quectel.com/support/techsupport.aspx
Or Email: Support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. THE INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THIS INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL CO., LTD. TRANSMITTABLE, REPRODUCTION, DISSEMINATION AND EDITING OF THIS
DOCUMENT AS WELL AS UTILIZATION OF THIS CONTENTS ARE FORBIDDEN WITHOUT
PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS
ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL
OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2016. All rights reserved.
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LTE Module Series
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About the Document
History
Revision
Date
Author
Description
V1.0
2016-03-28
Woody WU
Initial
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 5
Figure Index ................................................................................................................................................. 6
Introduction .......................................................................................................................................... 7
1.1.
Safety Information...................................................................................................................... 7
Product Concept .................................................................................................................................. 9
2.1.
General Description ................................................................................................................... 9
Directives and Standards ........................................................................................................ 10
2.2.
2.2.1. FCC Statement .............................................................................................................. 10
Key Features ........................................................................................................................... 10
2.3.
2.4.
Functional Diagram ................................................................................................................. 12
Evaluation Board ..................................................................................................................... 13
2.5.
Application Interface ......................................................................................................................... 14
3.1.
General Description ................................................................................................................. 14
3.2.
Pin Assignment ........................................................................................................................ 14
3.3.
Pin Description......................................................................................................................... 16
3.4.
Operating Modes ..................................................................................................................... 21
Power Saving........................................................................................................................... 22
3.5.
3.5.1. Sleep Mode .................................................................................................................... 22
3.5.1.1. UART Application ................................................................................................. 22
3.5.1.2. USB Application with USB Remote Wakeup Function ........................................ 23
3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 23
3.5.1.4. USB Application without USB Suspend Function ................................................ 24
3.5.2. Airplane Mode ................................................................................................................ 25
Power Supply........................................................................................................................... 25
3.6.
3.6.1. Power Supply Pins ......................................................................................................... 25
3.6.2. Decrease Voltage Drop .................................................................................................. 26
3.6.3. Reference Design for Power Supply.............................................................................. 27
3.6.4. Monitor the Power Supply .............................................................................................. 28
3.7.
Turn on and off Scenarios ....................................................................................................... 28
3.7.1. Turn on Module Using the PWRKEY ............................................................................. 28
3.7.2. Turn off Module .............................................................................................................. 30
3.7.2.1. Turn off Module Using the PWRKEY Pin............................................................. 30
3.7.2.2. Turn off Module Using AT Command ................................................................... 30
3.8.
Reset the Module..................................................................................................................... 30
3.9.
USIM Card Interface ................................................................................................................ 32
3.10. USB Interface .......................................................................................................................... 34
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3.11.
3.12.
3.13.
3.14.
3.15.
3.16.
UART Interface ........................................................................................................................ 36
PCM and I2C Interface ............................................................................................................ 38
ADC Function .......................................................................................................................... 41
Network Status Indication ........................................................................................................ 41
STATUS ................................................................................................................................... 42
Behavior of the RI .................................................................................................................... 43
GNSS Receiver ................................................................................................................................... 45
4.1.
General Description ................................................................................................................. 45
GNSS Performance ................................................................................................................. 45
4.2.
4.3.
Layout Guideline ...................................................................................................................... 46
Antenna Interface ............................................................................................................................... 47
5.1.
Main/Rx-diversity Antenna Interface........................................................................................ 47
5.1.1. Pin Definition .................................................................................................................. 47
5.1.2. Operating Frequency ..................................................................................................... 47
5.1.3. Reference Design .......................................................................................................... 47
GNSS Antenna Interface ......................................................................................................... 48
5.2.
Antenna Installation ................................................................................................................. 49
5.3.
5.3.1. Antenna Requirement .................................................................................................... 49
5.3.2. Install the Antenna with RF Connector .......................................................................... 50
Electrical, Reliability and Radio Characteristics ............................................................................ 53
6.1.
Absolute Maximum Ratings ..................................................................................................... 53
Power Supply Ratings ............................................................................................................. 53
6.2.
6.3.
Operating Temperature ............................................................................................................ 54
Current Consumption .............................................................................................................. 54
6.4.
6.5.
RF Output Power ..................................................................................................................... 54
6.6.
RF Receiving Sensitivity .......................................................................................................... 55
Electrostatic Discharge ............................................................................................................ 55
6.7.
Mechanical Dimensions .................................................................................................................... 56
7.1.
Mechanical Dimensions of the Module.................................................................................... 56
7.2.
Footprint of Recommendation ................................................................................................. 58
Top View of the Module ........................................................................................................... 59
7.3.
7.4.
Bottom View of the Module...................................................................................................... 59
Storage and Manufacturing .............................................................................................................. 60
8.1.
Storage .................................................................................................................................... 60
8.2.
Manufacturing and Welding ..................................................................................................... 60
8.3.
Packaging ................................................................................................................................ 61
Appendix A Reference....................................................................................................................... 63
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Table Index
TABLE 1: EC25 SERIES FREQUENCY BANDS ................................................................................................ 9
TABLE 2: EC25 KEY FEATURES ..................................................................................................................... 10
TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 16
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 16
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 21
TABLE 6: VBAT AND GND PINS....................................................................................................................... 26
TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... 28
TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 31
TABLE 9: PIN DEFINITION OF THE USIM INTERFACE ................................................................................. 32
TABLE 10: USB PIN DESCRIPTION ................................................................................................................ 34
TABLE 11: PIN DEFINITION OF THE MAIN UART INTERFACE ..................................................................... 36
TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE ................................................................. 36
TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 37
TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACE.......................................................................... 39
TABLE 15: PIN DEFINITION OF THE ADC ...................................................................................................... 41
TABLE 16: CHARACTERISTIC OF THE ADC .................................................................................................. 41
TABLE 17: PIN DEFINITION OF NETWORK INDICATOR ............................................................................... 41
TABLE 18: WORKING STATE OF THE NETWORK INDICATOR..................................................................... 42
TABLE 19: PIN DEFINITION OF STATUS ........................................................................................................ 43
TABLE 20: BEHAVIOR OF THE RI ................................................................................................................... 44
TABLE 21: GNSS PERFORMANCE ................................................................................................................. 45
TABLE 22: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 47
TABLE 23: THE MODULE OPERATING FREQUENCIES ................................................................................ 47
TABLE 24: PIN DEFINITION OF GNSS ANTENNA .......................................................................................... 48
TABLE 25: GNSS FREQUENCY ....................................................................................................................... 49
TABLE 26: ANTENNA REQUIREMENTS.......................................................................................................... 49
TABLE 27: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 53
TABLE 28: THE MODULE POWER SUPPLY RATINGS .................................................................................. 53
TABLE 29: OPERATING TEMPERATURE........................................................................................................ 54
TABLE 30: CONDUCTED RF OUTPUT POWER ............................................................................................. 55
TABLE 31: ELECTROSTATICS DISCHARGE CHARACTERISTICS ............................................................... 55
TABLE 32: RELATED DOCUMENTS ................................................................................................................ 63
TABLE 33: TERMS AND ABBREVIATIONS ...................................................................................................... 63
TABLE 34: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 67
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ........................................................................................................ 12
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) ............................................................................................. 15
FIGURE 3: UART SLEEP APPLICATION .................................................................................................. 22
FIGURE 4: SLEEP APPLICATION WITH USB REMOTE WAKEUP ........................................................ 23
FIGURE 5: SLEEP APPLICATION WITH RI ............................................................................................. 24
FIGURE 6: SLEEP APPLICATION WITHOUT SUSPEND FUNCTION .................................................... 24
FIGURE 7: POWER SUPPLY LIMITS DURING TRANSMIT BURST ....................................................... 26
FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY .................................................................... 27
FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY ....................................................................... 27
FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ......................................................... 28
FIGURE 11: TURN ON THE MODULE USING KEYSTROKE .................................................................. 29
FIGURE 12: TIMING OF TURNING ON MODULE ................................................................................... 29
FIGURE 13: TIMING OF TURNING OFF MODULE .................................................................................. 30
FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT .............................. 31
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON .............................................. 31
FIGURE 16: TIMING OF RESETTING MODULE ...................................................................................... 32
FIGURE 17: REFERENCE CIRCUIT OF 8-PIN USIM CONNECTOR ...................................................... 33
FIGURE 18: REFERENCE CIRCUIT OF 6-PIN USIM CONNECTOR ...................................................... 33
FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ................................................................. 35
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP............................................................ 37
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT ...................................................... 38
FIGURE 22: PRIMARY MODE TIMING ..................................................................................................... 39
FIGURE 23: AUXILIARY MODE TIMING................................................................................................... 39
FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ............................ 40
FIGURE 25: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .................................................. 42
FIGURE 26: REFERENCE CIRCUIT OF THE STATUS............................................................................ 43
FIGURE 27: REFERENCE CIRCUIT OF ANTENNA INTERFACE ........................................................... 48
FIGURE 28: REFERENCE CIRCUIT OF GNSS ANTENNA ..................................................................... 49
FIGURE 29: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ........................................ 50
FIGURE 30: MECHANICALS OF UF.L-LP CONNECTORS ..................................................................... 51
FIGURE 31: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ................................................... 52
FIGURE 32: MODULE TOP AND SIDE DIMENSIONS ............................................................................. 56
FIGURE 33: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ......................................................... 57
FIGURE 34: RECOMMENDED FOOTPRINT (TOP VIEW) ...................................................................... 58
FIGURE 35: TOP VIEW OF THE MODULE .............................................................................................. 59
FIGURE 36: BOTTOM VIEW OF THE MODULE ...................................................................................... 59
FIGURE 37: LIQUIDS TEMPERATURE .................................................................................................... 61
FIGURE 38: CARRIER TAPE .................................................................................................................... 62
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LTE Module Series
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Introduction
This document defines the EC25 module and describes its air interface and hardware interface which are
connected with your application.
This document can help you quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EC25 module. Associated with application
notes and user guide, you can use EC25 module to design and set up mobile applications easily.
1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel and to incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the
customer’s failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. You must comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden, so as
to prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers a Airplane
Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals, clinics or other health care
facilities. These requests are desinged to prevent possible interference with
sentitive medical equipment.
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Cellular terminals or mobiles operating over radio frequency signal and cellular
network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid SIM card. While you are in this condition and need emergent
help, please remember using emergency call. In order to make or receive a call,
the cellular terminal or mobile must be switched on and in a service area with
adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON ,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potencially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potencially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
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Product Concept
2.1. General Description
EC25 contains four variants: EC25-E, EC25-A, EC25-V and EC25-AUT. You can choose the dedicated
type based on the region or operator. The following table shows the frequency bands of EC25 series
modules.
Table 1: EC25 Series Frequency Bands
EC25-V
FDD-LTE
(with Rx-diversity)
B4/B13
TDD-LTE
(with Rx-diversity)
Not supported
WCDMA
(with Rx-diversity)
Not supported
GSM
Not supported
GNSS
GPS,GLONASS,
BeiDou/Compass,Galileo,QZSS
NOTES
1.
2.
1)
GNSS function is optional.
EC25-V includes Data-only and Telematics versions. Data-only version does not support voice
function, while Telematics version supports it.
2)
With a tiny profile of 32.0mm × 29.0mm × 2.4mm, EC25 can meet almost all requirements for M2M
applications such as automotive, metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone and tablet PC, etc.
EC25 is an SMD type module which can be embedded in applications through its 144-pin pads, including
80 LCC signal pads and 64 other pads.
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2.2. Directives and Standards
2.2.1. FCC Statement
Any Changes or modifications not expressly approved by the party responsible for compliance could void
the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
2.3. Key Features
The following table describes the detailed features of EC25 module.
Table 2: EC25 Key Features
Feature
Details
Power Supply
Supply voltage: 3.3V~4.3V
Transmitting Power
Support up to non-CA CAT4
Support 1.4 to 20MHz RF bandwidth
FDD: Max 50Mbps (UL), 150Mbps (DL)
TDD: Max 35Mbps (UL), 130Mbps (DL)
LTE Features
Support 16-QAM, 64-QAM and QPSK modulation
Internet Protocol Features
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
SMS
Support USIM/SIM card: 1.8V, 3.0V
USIM Interface
Used for audio function with external codec
Support 8-bit A-law, μ-law and 16-bit linear data formats
Support long frame sync and short frame sync
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Support master and slave mode, but must be the master in long frame sync
Audio Features
PCM Interface
Compliant with USB 2.0 specification (slave only); the data transfer rate
can reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
output, software debug and firmware upgrade
USB Driver: Windows XP, Windows Vista, Windows 7, Windows 8/8.1,
Window CE 5.0/6.0/7.0, Linux 2.6 or later, Android 2.3/4.0/4.2/4.4/5.0
Main UART:
Used for AT command and data transmission
Baud rate reach up to 921600bps, 115200bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console, log output
115200bps baud rate
USB Interface
Support LTE Rx-diversity
UART Interface
Gen8C-Lite of Qualcomm
Protocol: NMEA 0183
GNSS Features
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
AT Commands
Including main antenna (ANT_MAIN), Rx-diversity antenna (ANT_DIV) and
GNSS antenna (ANT_GNSS)
Network Indication
Size: 32.0±0.15 × 29.0±0.15 × 2.4±0.2mm
Weight: approx. 4.9g
Antenna Interface
Normal operation: -35°C ~ +75°C
Restricted operation: -40°C ~ -35°C and +75°C ~ +85°C
Storage temperature: -45°C ~ +90°C
Physical Characteristics
USB interface
Temperature Range
All hardware components are fully compliant with EU RoHS directive
Firmware Upgrade
RoHS
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2.4. Functional Diagram
The following figure shows a block diagram of EC25 and illustrates the major functional parts.





Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interface
ANT_MAIN
ANT_GNSS
ANT_DIV
Switch
SAW
Switch
Duplex
LNA
SAW
VBAT_RF
APT
PA
PRx
DRx
Tx
NAND
DDR2
SDRAM
Transceiver
IQ
VBAT_BB
PMIC
PWRKEY
Control
Control
Baseband
RESET_N
ADCs
19.2M
XO
STATUS
VDD_EXT
USB
USIM
PCM
I2C
UART
GPIOs
Figure 1: Functional Diagram
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2.5. Evaluation Board
In order to help you to develop applications with EC25, Quectel supplies an evaluation board (EVB), USB
data cable, earphone, antenna and other peripherals to control or test the module.
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Application Interface
3.1. General Description
EC25 is equipped with an 80-pin SMT pad plus 64-pin ground pads and reserved pads that can be
connected to cellular application platform. Sub-interfaces included in these pads are described in detail in
the following chapters:







Power supply
USIM interface
USB interface
UART interface
PCM interface
ADC interface
Status indication
3.2. Pin Assignment
The following figure shows the pin assignment of the EC25 module.
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GND
135
123
136
124
137
125
USIM_PRESENCE
13
USIM_VDD
14
USIM_DATA
15
USIM_CLK
16
USIM_RST
17
RESERVED
18
138
139
140
103
99
85
90
95
104
109
100
86
91
96
GND
53
GND
52
GND
51
GND
50
GND
49
ANT_MAIN
48
GND
143 RESERVED
83 80 77 74
105
110
87
92
84 81 78 75
106
111
127
88
93
97
101
107
112
89
94
98
102
128
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
GND
RESET_N
PWRKEY
GND
RESERVED
PCM_IN※
PCM_OUT ※
PCM_SYNC ※
PCM_CLK ※
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
ANT_DIV
GND
Power Pins
54
144 RESERVED
82 79 76 73
126
115 RESERVED
12
116 RESERVED
DBG_TXD
55
122
11
108
119
134
DBG_RXD
RESERVED
118
10
56
117
GND
USIM_GND
GND
121
57
133
142
VBAT_RF
141
RESERVED
58
RESERVED
VBAT_RF
120
59
132
VBAT_BB
60
VDD_EXT
131
VBAT_BB
66
61
67
NET_STATUS
STATUS
DTR
68
62
TXD
69
NET_MODE
130
RI
RXD
70
63
USB_DP
71
W_DISABLE#
129
DCD
USB_DM
72
64
USB_VBUS
113
RESERVED
65
GND
RTS
RESERVED
114
AP_READY
CTS
RESERVED
WAKEUP_IN
GND Pins
Signal Pins
47
ANT_GNSS
46
GND
45
ADC0
44
ADC1
43
RESERVED
42
I2C_SDA
41
I2C_SCL
40
RESERVED
39
RESERVED
38
RESERVED
37
RESERVED
RESERVED Pins
Figure 2: Pin Assignment (Top View)
NOTES
1.
2.
3.
Keep all RESERVED pins and unused pins unconnected.
GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84
should not be designed in schematic and PCB decal.
※
“ ” means these interface functions are only supported on Telematics version.
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3.3. Pin Description
The following tables show the EC25’s pin definition.
Table 3: IO Parameters Definition
Type
Description
IO
Bidirectional input/output
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
Table 4: Pin Description
Power Supply
Pin Name
VBAT_BB
VBAT_RF
Pin No.
59, 60
57, 58
VDD_EXT
GND
8, 9, 19,
22, 36, 46,
48, 50~54,
56, 72,
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I/O
Description
DC Characteristics
Comment
PI
Power supply for
module baseband
part.
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 0.8A.
PI
Power supply for
module RF part.
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 1.8A in a
transmitting burst.
PO
Provide 1.8V for
external circuit.
Vnorm=1.8V
IOmax=50mA
Power supply for
external GPIO’s pull up
circuits.
Ground.
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85~112
Turn on/off
Pin Name
I/O
Description
DC Characteristics
DI
Turn on/off the
module.
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
DI
Reset the module.
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
I/O
Description
DC Characteristics
Comment
OD
Indicate the module
operating status.
The drive current
should be less than
0.9mA.
Require external
pull-up. If unused,
keep it open.
DO
Indicate the module
network registration
mode.
VOHmin=1.35V
VOLmax=0.45V
1.8V power domain.
If unused, keep it
open.
DO
Indicate the module
network activity
status.
VOHmin=1.35V
VOLmax=0.45V
1.8V power domain.
If unused, keep it
open.
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USB_VBUS
71
PI
USB detection.
Vnorm=5.0V
IO
USB differential data
bus.
Compliant with USB
2.0 standard
specification.
Require differential
impedance of 90ohm.
IO
USB differential data
bus.
Compliant with USB
2.0 standard
specification.
Require differential
impedance of 90ohm.
I/O
Description
DC Characteristics
Comment
For 1.8V USIM:
Vmax=1.9V
Vmin=1.7V
Either 1.8V or 3V is
supported by the
module automatically.
PWRKEY
RESET_N
Pin No.
21
20
Comment
Status Indication
Pin Name
STATUS
NET_MODE
NET_
STATUS
Pin No.
61
USB Interface
USB_DP
USB_DM
69
70
USIM Interface
Pin Name
Pin No.
USIM_GND
10
Specified ground for
USIM card.
14
Power supply for
USIM card.
USIM_VDD
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For 3.0V USIM:
Vmax=3.05V
Vmin=2.7V
IOmax=50mA
USIM_DATA
USIM_CLK
USIM_RST
USIM_
PRESENCE
15
16
17
13
IO
DO
DO
Data signal of USIM
card.
Clock signal of USIM
card.
Reset signal of
USIM card.
For 1.8V USIM:
VILmax=0.6V
VIHmin=1.2V
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VILmax=1.0V
VIHmin=1.95V
VOLmax=0.45V
VOHmin=2.55V
For 1.8V USIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
For 1.8V USIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
DI
USIM card insertion
detection.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
I/O
Description
DC Characteristics
Comment
DO
Ring indicator
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
DO
Data carrier
detection.
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
UART Interface
Pin Name
RI
DCD
Pin No.
62
63
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CTS
RTS
64
65
DO
DI
Clear to send.
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
Request to send.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
Pull-up by default.
Low level wakes up
the module.
If unused, keep it
open.
DTR
66
DI
Data terminal ready,
sleep mode control.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
TXD
67
DO
Transmit data.
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
DI
Receive data.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
I/O
Description
DC Characteristics
Comment
Transmit data.
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
RXD
68
Debug UART Interface
Pin Name
DBG_TXD
DBG_RXD
Pin No.
12
DO
11
DI
Receive data.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Pin No.
I/O
Description
DC Characteristics
Comment
AI
General purpose
analog to digital
converter.
Voltage range:
0.3V to VBAT_BB
If unused, keep it
open.
44
AI
General purpose
analog to digital
converter.
Voltage range:
0.3V to VBAT_BB
If unused, keep it
open.
Pin No.
I/O
Description
DC Characteristics
Comment
ADC Interface
Pin Name
ADC0
ADC1
45
PCM Interface
Pin Name
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PCM_IN
PCM_OUT
PCM_SYNC
24
25
26
DI
DO
IO
PCM data input.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
PCM data output.
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
PCM data frame
sync signal.
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
Comment
27
IO
PCM clock.
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Pin No.
I/O
Description
DC Characteristics
OD
I2C serial clock.
Used for external
codec.
External pull-up
resistor is required.
1.8V only. If unused,
keep it open.
42
OD
I2C serial data.
Used for external
codec.
External pull-up
resistor is required.
1.8V only. If unused,
keep it open.
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ANT_DIV
35
AI
Diversity antenna.
50ohm impedance.
If unused, keep it
open.
ANT_MAIN
49
IO
Main antenna.
50ohm impedance.
ANT_GNSS
47
AI
GNSS antenna.
50ohm impedance.
If unused, keep it
open.
I/O
Description
DC Characteristics
Comment
PCM_CLK
I2C Interface
Pin Name
I2C_SCL
I2C_SDA
41
RF Interface
GPIO Pins
Pin Name
Pin No.
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WAKEUP_IN
W_DISABLE#
AP_READY
Sleep mode control.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
Pull-up by default.
Low level wakes up
the module. If
unused, keep it open.
DI
Airplane mode
control.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
Pull-up by default.
In low voltage level,
module can enter into
airplane mode. If
unused, keep it open.
DI
Application
processor sleep
state detection.
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
I/O
Description
DC Characteristics
Comment
DI
RESERVED Pins
Pin Name
Pin No.
RESERVED
3, 18, 23,
28~34,
37~40, 43,
55, 73~84,
113~144
Reserved.
Keep these pins
unconnected.
3.4. Operating Modes
The table below briefly summarizes the various operating modes referred in the following chapters.
Table 5: Overview of Operating Modes
Mode
Normal
Operation
Details
Idle
Software is active. The module has registered to the network, and it is
ready to send and receive data.
Talk/Data
Network connection is ongoing. In this mode, the power consumption is
decided by network setting and data transfer rate.
Minimum
Functionality
Mode
AT+CFUN command can set the module entering into a minimum functionality mode
without removing the power supply. In this case, both RF function and USIM card will be
invalid.
Airplane
Mode
AT+CFUN command or W_DISABLE# pin can set the module entering into airplane
mode. In this case, RF function will be invalid.
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Sleep Mode
In this mode, the current consumption of the module will be reduced to the minimal level.
During this mode, the module can still receive paging message, SMS, voice call and
TCP/UDP data from the network normally.
Power Down
Mode
In this mode, the power management unit shuts down the power supply. Software is not
active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF
and VBAT_BB) remains applied.
3.5. Power Saving
3.5.1. Sleep Mode
EC25 is able to reduce its current consumption to a minimum value during the sleep mode. The following
section describes EC25’s power saving procedure.
3.5.1.1. UART Application
If host communicates with module via UART interface, the following preconditions can let the module
enter into the sleep mode.


Execute AT command AT+QSCLK=1 to enable the sleep mode.
Drive DTR to high level.
The following figure shows the connection between the module and the host.
Host
Module
RXD
TXD
TXD
RXD
RI
EINT
DTR
GPIO
AP_READY
GPIO
GND
GND
Figure 3: UART Sleep Application



Driving host DTR to low level will wake up the module.
When EC25 has URC to report, RI signal will wake up the host. Refer to Chapter 3.16 for details
about RI behavior.
AP_READY will detect the sleep state of host (can be configured to high level or low level detection).
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Refer to AT command AT+QCFG=“apready” for details.
3.5.1.2. USB Application with USB Remote Wakeup Function
If host supports USB suspend/resume and remote wakeup function, the following part will show the sleep
application.
There are three preconditions to let the module enter into the sleep mode.



Execute AT command AT+QSCLK=1 to enable the sleep mode.
Ensure the DTR is held in high level or keep it open.
The host’s USB bus, which is connected with the module’s USB interface, enters into suspended
state.
The following figure shows the connection between the module and the host.
Host
Module
USB_VBUS
VDD
USB_DP
USB_DP
USB_DM
USB_DM
AP_READY
GPIO
GND
GND
Figure 4: Sleep Application with USB Remote Wakeup


Sending data to EC25 through USB will wake up the module.
When EC25 has URC to report, the module will send remote wake-up signals to USB BUS so as to
wake up the host.
3.5.1.3. USB Application with USB Suspend/Resume and RI Function
If host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is
needed to wake up the host. The following part will show the sleep application.
There are three preconditions to let the module enter into the sleep mode.



Execute AT command AT+QSCLK=1 to enable the sleep mode.
Ensure the DTR is held in high level or keep it open.
The host’s USB bus, which is connected with the module’s USB interface, enters into suspended
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state.
The following figure shows the connection between the module and the host.
Module
Host
VDD
USB_VBUS
USB_DP
USB_DP
USB_DM
USB_DM
AP_READY
GPIO
RI
EINT
GND
GND
Figure 5: Sleep Application with RI


Sending data to EC25 through USB will wake up the module.
When EC25 has URC to report, RI signal will wake up the host.
3.5.1.4. USB Application without USB Suspend Function
If host does not support USB suspend function, you should disconnect USB_VBUS with additional control
circuit to let the module enter into sleep mode.



Execute AT command AT+QSCLK=1 to enable the sleep mode.
Ensure the DTR is held in high level or keep it open.
Disconnect USB_VBUS.
The following figure shows the connection between the module and the host.
Module
Host
GPIO
USB_VBUS
Power
Switch
VDD
USB_DP
USB_DP
USB_DM
USB_DM
RI
EINT
AP_READY
GPIO
GND
GND
Figure 6: Sleep Application without Suspend Function
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Opening power switch to supply power to USB_VBUS will wake up the module.
NOTE
You should pay attention to the level match shown in dotted line between module and host. Refer to
document [1] for more details about EC25 power management application.
3.5.2. Airplane Mode
When the module enters into airplane mode, the RF function does not work, and all AT commands
correlative with RF function will be inaccessible. This mode can be set with the following ways.
Hardware:
The W_DISABLE# pin is pulled up by default; driving it to low level will let the module enter into airplane
mode.
Software:
Command AT+CFUN provides the choice of the functionality level =0, 1, 4.
 AT+CFUN=0: Minimum functionality mode; both USIM and RF function are disabled.
 AT+CFUN=1: Full functionality mode (by default).
 AT+CFUN=4: Airplane mode. RF function is disabled.
NOTES
1.
The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT
command AT+QCFG=“airplanecontrol”. Refer to document [2] for details.
2. The execution of AT+CFUN command will not affect GNSS function.
3.6. Power Supply
3.6.1. Power Supply Pins
EC25 provides four VBAT pins dedicated to connect with the external power supply. There are two
separate voltage domains for VBAT.


VBAT_RF with two pins for module RF part.
VBAT_BB with two pins for module baseband part.
The following table shows the VBAT pins and ground pins.
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Table 6: VBAT and GND Pins
Pin Name
Pin No.
Description
Min.
Typ.
Max.
Unit
VBAT_RF
57, 58
Power supply for module RF
part.
3.3
3.8
4.3
VBAT_BB
59, 60
Power supply for module
baseband part.
3.3
3.8
4.3
GND
8, 9, 19, 22, 36,
46, 48, 50~54,
56, 72, 85~112
Ground.
3.6.2. Decrease Voltage Drop
The power supply range of the module is from 3.3V to 4.3V. Make sure the input voltage will never drop
below 3.3V. The following figure shows the voltage drop during transmitting burst in 4G network.
Transmit
burst
Transmit
burst
VBAT
Min.3.3V
Ripple
Drop
Figure 7: Power Supply Limits during Transmit Burst
To decrease voltage drop, a bypass capacitor of about 100µF with low ESR should be used. Multi-layer
ceramic chip (MLCC) capacitor can provide the best combination of low ESR. The main power supply
from an external application has to be a single voltage source and expanded to two sub paths with star
structure. The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace
should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be.
Three ceramic capacitors (100nF, 33pF, 10pF) are recommended to be applied to the VBAT pins. The
capacitors should be placed close to the VBAT pins. In addition, in order to get a stable power source, it is
suggested that you should use a zener diode of which reverse zener voltage is 5.1V and dissipation
power is more than 0.5W. The following figure shows the star structure of the power supply.
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VBAT
VBAT_RF
VBAT_BB
D1
5.1V
C1
100uF
C2
C3
C4
100nF
33pF
10pF
C5
100uF
C6
C7
C8
100nF
33pF
10pF
Module
Figure 8: Star Structure of the Power Supply
3.6.3. Reference Design for Power Supply
The power design for the module is very important, as the performance of the module largely depends on
the power source. The power supply is capable of providing sufficient current up to 2A at least. If the
voltage drop between the input and output is not too high, it is suggested that you should use a LDO to
supply power for module. If there is a big voltage difference between the input source and the desired
output (VBAT), a buck converter is preferred to be used as a power supply.
The following figure shows a reference design for +5V input power source. The designed output for the
power supply is about 3.8V and the maximum load current is 3A.
MIC29302WU
DC_IN
VBAT
470uF
ADJ
51K
OUT
GND
IN
EN
100K
1%
470R
4.7K
100nF
VBAT_EN
47K
47K
1%
470uF
100nF
Figure 9: Reference Circuit of Power Supply
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3.6.4. Monitor the Power Supply
You can use the AT+CBC command to monitor the VBAT_BB voltage value. For more details, please
refer to document [2].
3.7. Turn on and off Scenarios
3.7.1. Turn on Module Using the PWRKEY
The following table shows the pin definition of PWRKEY.
Table 7: PWRKEY Pin Description
Pin Name
PWRKEY
Pin No.
21
Description
DC Characteristics
Turn on/off the module.
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
Comment
When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a
low level for at least 100ms. It is recommended to use an open drain/collector driver to control the
PWRKEY. After STATUS pin (require external pull-up) outputting a low level, PWRKEY pin can be
released. A simple reference circuit is illustrated in the following figure.
PWRKEY
≥ 100ms
4.7K
Turn on pulse
47K
Figure 10: Turn on the Module Using Driving Circuit
The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be
placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate
from finger. A reference circuit is shown in the following figure.
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S1
PWRKEY
TVS
Close to S1
Figure 11: Turn on the Module Using Keystroke
The turn on scenario is illustrated in the following figure.
NOTE
VBAT
PWRKEY
≥ 100ms
VIH ≥ 1.3V
VIL ≤ 0.5V
RESET_N
TBD
STATUS
(OD)
TBD
UART
Inactive
Active
TBD
USB
Inactive
Active
Figure 12: Timing of Turning on Module
NOTE
Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than
30ms.
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3.7.2. Turn off Module
The following procedures can be used to turn off the module:


Normal power down procedure: Turn off the module using the PWRKEY pin.
Normal power down procedure: Turn off the module using command AT+QPOWD.
3.7.2.1. Turn off Module Using the PWRKEY Pin
Driving the PWRKEY to a low level voltage, the module will execute power-down procedure after the
PWRKEY is released. The power-down scenario is illustrated in the following figure.
VBAT
TBD
TBD
PWRKEY
STATUS
(OD)
Module
Status
Power-down procedure
RUNNING
OFF
Figure 13: Timing of Turning off Module
3.7.2.2. Turn off Module Using AT Command
It is also a safe way to use AT command AT+QPOWD to turn off the module, which is similar to turning off
the module via PWRKEY Pin.
Please refer to document [2] for details about the AT command of AT+QPOWD.
3.8. Reset the Module
The RESET_N can be used to reset the module. You can reset the module by driving the RESET_N to a
low level voltage for time between Treset_min and Treset_max.
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Table 8: RESET_N Pin Description
Pin Name
RESET_N
Pin No.
20
Description
DC Characteristics
Reset the module.
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
Comment
The recommended circuit is similar to the PWRKEY control circuit. You can use an open drain/collector
driver or button to control the RESET_N.
RESET_N
TBD
4.7K
Reset pulse
47K
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit
S2
RESET_N
TVS
Close to S2
Figure 15: Reference Circuit of RESET_N by Using Button
The reset scenario is illustrated in the following figure.
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VBAT
Treset_max
Treset_min
VIH ≥ 1.3V
RESET_N
Module
Status
VIL ≤ 0.5V
RUNNING
RESETTING RUNNING
Figure 16: Timing of Resetting Module
NOTES
1.
2.
Use the RESET_N only when turning off the module by the command AT+QPOWD and the
PWRKEY pin failed.
Ensure that there is no large capacitance on the PWRKEY and RESET_N pins.
3.9. USIM Card Interface
The USIM card interface circuitry meets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and
3.0V USIM cards are supported.
Table 9: Pin Definition of the USIM Interface
Pin Name
Pin No.
I/O
Description
Comment
Either 1.8V or 3.0V is supported
by the module automatically.
USIM_VDD
14
PO
Power supply for USIM card.
USIM_DATA
15
IO
Data signal of USIM card.
USIM_CLK
16
DO
Clock signal of USIM card.
USIM_RST
17
DO
Reset signal of USIM card.
USIM_
PRESENCE
13
DI
USIM card insertion detection.
USIM_GND
10
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EC25 supports USIM card hot-plug via the USIM_PRESENCE pin. It supports low level and high level
detections, which is disabled by default. For details, refer to document [2] about the command
AT+QSIMDET.
The following figure shows the reference design of the 8-pin USIM connector.
VDD_EXT
USIM_VDD
51K
15K
100nF
USIM_GND
Module
USIM_VDD
USIM_RST
22R
USIM_CLK
USIM_PRESENCE
22R
USIM_DATA
22R
USIM Connector
VCC
RST
CLK
33pF
GND
VPP
IO
GND
33pF 33pF
GND
GND
Figure 17: Reference Circuit of 8-Pin USIM Connector
If you do not need the USIM card detection function, keep USIM_PRESENCE unconnected. The
reference circuit for using a 6-pin USIM card connector is illustrated in the following figure.
USIM_VDD
USIM_GND
Module
USIM_VDD
USIM_RST
USIM_CLK
USIM_DATA
15K
100nF
VCC
RST
CLK
22R
22R
22R
33pF
USIM Connector
GND
VPP
IO
33pF 33pF
GND
GND
Figure 18: Reference Circuit of 6-Pin USIM Connector
In order to enhance the reliability and availability of the USIM card in your application, please follow the
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criteria below in the USIM circuit design:






Keep layout of USIM card as close as possible to the module. Assure the length of trace is less than
200mm.
Keep USIM card signal away from RF and VBAT alignment.
Assure the ground between the module and the USIM connector short and wide. Keep the width of
ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.
To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away with each other and
shield them with surrounded ground.
In order to offer good ESD protection, it is recommended to add TVS which parasitic capacitance
should not be more than 50pF. The 22ohm resistors should be added in series between the module
and the USIM card so as to suppress the EMI spurious transmission and enhance the ESD
protection. The 33pF capacitors are used for filtering interference of GSM900. Please note that the
USIM peripheral circuit should be close to the USIM connector.
The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
and sensitive occasion are applied, and should be placed close to the USIM connector.
3.10. USB Interface
EC25 contains one integrated Universal Serial Bus (USB) transceiver which complies with the USB 2.0
specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is
used for AT command, data transmission, GNSS NMEA sentences output, software debug and firmware
upgrade. The following table shows the pin definition of USB interface.
Table 10: USB Pin Description
Pin Name
Pin No.
I/O
Description
Comment
USB_DP
69
IO
USB differential data bus (positive).
Require differential
impedance of 90Ω.
USB_DM
70
IO
USB differential data bus (minus).
Require differential
impedance of 90Ω.
USB_VBUS
71
PI
Used for detecting the USB
connection.
Typical 5.0V
GND
72
Ground
More details about the USB 2.0 specifications, please visit http://www.usb.org/home.
The USB interface is recommended to be reserved for firmware upgrade in your design. The following
figure shows the reference circuit of USB interface.
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Test Points
Minimize this stub
Module
VDD
R3
NM_0R
R4
NM_0R
ESD Array
USB_VBUS
USB_DM
USB_DP
GND
MCU
R1
0R
R2
0R
Close to Module
USB_DM
USB_DP
GND
Figure 19: Reference Circuit of USB Application
In order to meet USB data line signal integrity, components R1, R2, R3 and R4 must be placed close to
the module, and then these resistors should be placed close to each other. The extra stubs of trace must
be as short as possible.
In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply
with the following principles.




It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90ohm.
Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding on not only upper
and lower layers but also right and left sides.
Pay attention to the influence of junction capacitance of ESD component on USB data lines. Typically,
the capacitance value should be less than 2pF.
Keep the ESD components as close as possible to the USB connector.
NOTE
EC25 module can only be used as a slave device.
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3.11. UART Interface
The module provides two UART interfaces: main UART interface and debug UART interface. The
following shows the different features.


Main UART interface supports 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600bps
baud rate, and the default is 115200bps. This interface can be used for data transmission and AT
communication.
Debug UART interface supports 115200bps baud rate. It can be used for Linux console and log
output.
The following tables show the pin definition.
Table 11: Pin Definition of the Main UART Interface
Pin Name
Pin No.
I/O
Description
Comment
RI
62
DO
Ring indicator
1.8V power domain
DCD
63
DO
Data carrier detection
1.8V power domain
CTS
64
DO
Clear to send
1.8V power domain
RTS
65
DI
Request to send
1.8V power domain
DTR
66
DI
Sleep mode control
1.8V power domain
TXD
67
DO
Transmit data
1.8V power domain
RXD
68
DI
Receive data
1.8V power domain
Table 12: Pin Definition of the Debug UART Interface
Pin Name
Pin No.
I/O
Description
Comment
DBG_TXD
12
DO
Transmit data
1.8V power domain
DBG_RXD
11
DI
Receive data
1.8V power domain
The logic levels are described in the following table.
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Table 13: Logic Levels of Digital I/O
Parameter
Min.
Max.
Unit
VIL
-0.3
0.6
VIH
1.2
2.0
VOL
0.45
VOH
1.35
1.8
The module provides 1.8V UART interface. A level translator should be used if your application is
equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrument is
recommended. The following figure shows the reference design.
VDD_EXT
VCCA
0.1uF
VCCB
OE
0.1uF
VDD_MCU
GND
RI
A1
B1
RI_MCU
DCD
A2
B2
DCD_MCU
CTS
A3
B3
CTS_MCU
RTS
A4
B4
RTS_MCU
DTR
A5
B5
DTR_MCU
TXD
A6
B6
TXD_MCU
A7
B7
A8
B8
RXD
51K
Translator
51K
RXD_MCU
Figure 20: Reference Circuit with Translator Chip
Please visit http://www.ti.com for more information.
Another example with transistor translation circuit is shown as below. The circuit of dotted line can refer to
the circuit of solid line. Please pay attention to the direction of connection. Input dotted line of the module
should refer to input solid line of the module. Output dotted line of the module should refer to output solid
line of the module.
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VDD_EXT
MCU/ARM
4.7K
1nF
VDD_EXT
10K
Module
/TXD
RXD
/RXD
TXD
1nF
10K
VCC_MCU
4.7K
VDD_EXT
/RTS
/CTS
GPIO
EINT
GPIO
GND
RTS
CTS
DTR
RI
DCD
GND
Figure 21: Reference Circuit with Transistor Circuit
NOTE
Transistor circuit solution is not suitable for high baud rates exceeding 460Kbps.
3.12. PCM and I2C Interface
EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the
following modes:


Primary mode (short sync, works as both master and slave)
Auxiliary mode (long sync, works as master only)
In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge; the PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports 128, 256, 512,
1024 and 2048kHz for different speech codecs.
In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge; while the PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a
128kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC only.
EC25 supports 8-bit A-law and μ-law, and also 16-bit linear data formats. The following figures show the
primary mode’s timing relationship with 8kHz PCM_SYNC and 2048kHz PCM_CLK, as well as auxiliary
mode’s timing relationship with 8kHz PCM_SYNC and 128kHz PCM_CLK.
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125us
PCM_CLK
255
256
PCM_SYNC
MSB
LSB
MSB
MSB
LSB
MSB
PCM_OUT
PCM_IN
Figure 22: Primary Mode Timing
125us
PCM_CLK
15
16
PCM_SYNC
MSB
LSB
MSB
LSB
PCM_OUT
PCM_IN
Figure 23: Auxiliary Mode Timing
The following table shows the pin definition of PCM and I2C interface which can be applied on audio
codec design.
Table 14: Pin Definition of PCM and I2C Interface
Pin Name
Pin No.
I/O
Description
Comment
PCM_IN
24
DI
PCM data input
1.8V power domain
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PCM_OUT
25
DO
PCM data output
1.8V power domain
PCM_SYNC
26
IO
PCM data frame sync signal
1.8V power domain
PCM_CLK
27
IO
PCM data bit clock
1.8V power domain
I2C_SCL
41
OD
I2C serial clock
Require external pull-up to 1.8V
I2C_SDA
42
OD
I2C serial data
Require external pull-up to 1.8V
Clock and mode can be configured by AT command, and the default configuration is master mode using
short sync data format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. Refer to document [2] about the
command AT+QDAI for details.
The following figure shows the reference design of PCM interface with external codec IC.
PCM_CLK
BCLK
PCM_SYNC
LRCK
DAC
PCM_IN
ADC
I2C_SCL
SCL
I2C_SDA
SDA
4.7K
Module
4.7K
PCM_OUT
INP
INN
BIAS
MICBIAS
LOUTP
LOUTN
Codec
1.8V
Figure 24: Reference Circuit of PCM Application with Audio Codec
NOTES
1.
2.
It is recommended to reserve RC (R=22ohm, C=22pF) circuit on the PCM lines, especially for
PCM_CLK.
EC25 works as a master device pertaining to I2C interface.
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3.13. ADC Function
The module provides two analog-to-digital converters (ADC). Using AT command AT+QADC=0 can read
the voltage value on ADC0 pin. Using AT command AT+QADC=1 can read the voltage value on ADC1
pin. For more details of these AT commands, please refer to document [2].
In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground.
Table 15: Pin Definition of the ADC
Pin Name
Pin No.
Description
ADC0
45
General purpose analog to digital converter
ADC1
44
General purpose analog to digital converter
The following table describes the characteristic of the ADC function.
Table 16: Characteristic of the ADC
Parameter
Min.
ADC0 Voltage Range
0.3
ADC1 Voltage Range
0.3
Typ.
Max.
Unit
VBAT_BB
VBAT_BB
ADC Resolution
15
bits
3.14. Network Status Indication
The network indication pins can be used to drive a network status indicator LED. The module provides
two pins which are NET_MODE and NET_STATUS. The following tables describe pin definition and logic
level changes in different network status.
Table 17: Pin Definition of Network Indicator
Pin Name
Pin No.
I/O
Description
Comment
NET_MODE
DO
Indicate the module network registration
1.8V power domain
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mode.
NET_STATUS
DO
Indicate the module network activity
status.
1.8V power domain
Table 18: Working State of the Network Indicator
Pin Name
NET_MODE
NET_STATUS
Status
Description
Always High
Registered in LTE network
Always Low
Others
Flicker slowly (200ms High/1800ms Low)
Network searching
Flicker slowly (1800ms High/200ms Low)
Idle
Flicker quickly (125ms High/125ms Low)
Data transfer is ongoing
Always High
Voice calling
A reference circuit is shown in the following figure.
VBAT
Module
2.2K
Network
Indicator
4.7K
47K
Figure 25: Reference Circuit of the Network Indicator
3.15. STATUS
The STATUS pin is an open drain output for indicating the module’s operation status. You can connect it
to a GPIO of DTE with pulled up, or as LED indication circuit as below. When the module is turned on
normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance
state.
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Table 19: Pin Definition of STATUS
Pin Name
STATUS
Pin No.
61
I/O
Description
Comment
OD
Indicate the module operation status
Require external pull-up
The following figure shows different design circuit of STATUS, you can choose either one according to
your application demands.
VBAT
VDD_MCU
10K
2.2K
STATUS
Module
STATUS
MCU_GPIO
Module
Figure 26: Reference Circuit of the STATUS
3.16. Behavior of the RI
You can use command AT+QCFG=“risignaltype”,“physical” to configure RI behavior.
No matter which port URC is presented on, URC will trigger the behavior on RI pin.
NOTE
URC can be output from UART port, USB AT port and USB modem port by command AT+QURCCFG.
The default port is USB AT port.
In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below.
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Table 20: Behavior of the RI
State
Response
Idle
RI keeps high level
URC
RI outputs 120ms low pulse when new URC returns
The RI behavior can be changed by command AT+QCFG=“urc/ri/ring”. Refer to document [2] for
details.
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GNSS Receiver
4.1. General Description
EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of
Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS).
EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences with 1Hz via USB interface
by default.
By default, EC25 GNSS engine is switched off. It has to be switched on with AT command. For more
details about GNSS engine technology and configurations, please refer to document [3].
4.2. GNSS Performance
The following table shows EC25 GNSS performance.
Table 21: GNSS Performance
Parameter
Sensitivity
(GNSS)
TTFF
(GNSS)
Description
Conditions
Typ.
Unit
Cold start
Autonomous
TBD
dBm
Reacquisition
Autonomous
TBD
dBm
Tracking
Autonomous
TBD
dBm
Autonomous
TBD
XTRA enabled
TBD
Autonomous
TBD
XTRA enabled
TBD
Cold start
@open sky
Warm start
@open sky
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Hot start
@open sky
Accuracy
(GNSS)
CEP-50
Autonomous
TBD
XTRA enabled
TBD
Autonomous
@open sky
TBD
NOTES
1.
2.
3.
Tracking sensitivity: the lowest GPS signal value at the antenna port for which the module can keep
on positioning for 3 minutes.
Reacquisition sensitivity: the lowest GPS signal value at the antenna port for which the module can
fix position again within 3 minutes after loss of lock.
Cold start sensitivity: the lowest GPS signal value at the antenna port for which the module fixes
position within 3 minutes after executing cold start command.
4.3. Layout Guideline
The following layout guideline should be taken into account in your design.




Maximize the distance between the GNSS antenna, the main antenna and the Rx-diversity antenna.
Digital circuits such as USIM card, USB interface, Camera module, Display connector and SD card
should be kept away from the antenna.
Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar
isolation and protection.
Keep 50ohm characteristic impedance for the ANT_GNSS trace.
Refer to Chapter 5 for GNSS reference design and antenna consideration.
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Antenna Interface
EC25 antenna interface includes a main antenna, an Rx-diversity antenna which is used to resist the fall
of signals caused by high speed movement and multipath effect, and a GNSS antenna. The antenna
interface has an impedance of 50ohm.
5.1. Main/Rx-diversity Antenna Interface
5.1.1. Pin Definition
The main antenna and Rx-diversity antenna pins definition are shown below.
Table 22: Pin Definition of the RF Antenna
Pin Name
Pin No.
I/O
Description
Comment
ANT_MAIN
49
IO
Main antenna
50ohm impedance
ANT_DIV
35
AI
Receive diversity antenna
50ohm impedance
5.1.2. Operating Frequency
Table 23: The Module Operating Frequencies
3GPP Band
Transmit
Receive
Unit
B4
1710 ~ 1755
2110 ~ 2155
MHz
B13
777 ~ 787
746 ~ 756
MHz
5.1.3. Reference Design
The reference design of ANT_MAIN and ANT_DIV antenna is shown as below. It should reserve a π-type
matching circuit for better RF performance. The capacitors are not mounted by default.
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Main
antenna
Module
R1
ANT_MAIN
0R
C1
C2
NM
NM
Diversity
antenna
R2
ANT_DIV
0R
C3
C4
NM
NM
Figure 27: Reference Circuit of Antenna Interface
NOTES
1.
2.
Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the
receiving sensitivity.
ANT_DIV function is enabled by default. Use the AT command AT+QCFG="diversity",0 can disable
receive diversity.
5.2. GNSS Antenna Interface
The following tables show the GNSS antenna pin definition and frequency specification.
Table 24: Pin Definition of GNSS Antenna
Pin Name
Pin No.
I/O
Description
Comment
ANT_GNSS
47
AI
GNSS antenna
50ohm impedance
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Table 25: GNSS Frequency
Type
Frequency
Unit
GPS/Galileo/QZSS
1575.42 ± 1.023
MHz
GLONASS
1597.5 ~ 1605.8
MHz
BeiDou
1561.098 ± 2.046
MHz
The reference design of GNSS antenna is shown as below.
VDD
GNSS
Antenna
10R
0.1uF
Module
47nH
100pF
ANT_GNSS
NM
NM
Figure 28: Reference Circuit of GNSS Antenna
NOTES
1.
2.
You can choose an external LDO to supply power according to the active antenna.
If you design the module with passive antenna, the VDD circuit is not needed.
5.3. Antenna Installation
5.3.1. Antenna Requirement
The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.
Table 26: Antenna Requirements
Type
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GNSS
Frequency range: 1561 - 1615MHz
Polarization: RHCP or linear
VSWR: < 2 (Typ.)
Passive antenna gain: > 0dBi
Active antenna noise figure: < 1.5dB
Active antenna gain: > -2dBi
Active antenna embedded LNA gain: 20dB (Typ.)
Active antenna total gain: > 18dBi (Typ.)
GSM/LTE
VSWR: ≤ 2
Gain (dBi): 1
Max Input Power (W): 50
Input Impedance (ohm): 50
Polarization Type: Vertical
Cable Insertion Loss: < 1dB
(LTE B13)
Cable Insertion Loss: < 1.5dB
(LTE B4)
5.3.2. Install the Antenna with RF Connector
The following figure is the antenna installation with RF connector provided by HIROSE. The
recommended RF connector is UF.L-R-SMT.
Figure 29: Dimensions of the UF.L-R-SMT Connector (Unit: mm)
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You can use U.FL-LP serial connector listed in the following figure to match the UF.L-R-SMT.
Figure 30: Mechanicals of UF.L-LP Connectors
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The following figure describes the space factor of mated connector.
Figure 31: Space Factor of Mated Connector (Unit: mm)
For more details, please visit http://www.hirose.com.
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Electrical, Reliability and Radio
Characteristics
6.1. Absolute Maximum Ratings
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are
listed in the following table.
Table 27: Absolute Maximum Ratings
Parameter
Min.
Max.
Unit
VBAT_RF/VBAT_BB
-0.3
4.7
USB_VBUS
-0.3
5.5
Peak Current of VBAT_BB
0.8
Peak Current of VBAT_RF
1.8
Voltage at Digital Pins
-0.3
2.3
Voltage at ADC0
VBAT_BB
Voltage at ADC1
VBAT_BB
6.2. Power Supply Ratings
Table 28: The Module Power Supply Ratings
Parameter
Description
Conditions
Min.
Typ.
Max.
Unit
VBAT
VBAT_BB and
Voltage must stay within the
3.3
3.8
4.3
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Parameter
Description
Conditions
Min.
VBAT_RF
min/max values, including
voltage drop, ripple and
spikes.
Voltage drop during
transmitting burst
Maximum power control
level on GSM900.
IVBAT
Peak supply current
(during transmission
slot)
Maximum power control
level on GSM900.
USB_VBUS
USB detection
3.0
Typ.
Max.
Unit
400
mV
1.8
2.0
5.0
5.25
6.3. Operating Temperature
The operating temperature is listed in the following table.
Table 29: Operating Temperature
Parameter
Min.
Typ.
Max.
Unit
Normal Temperature
-35
25
75
º
Restricted Operation
-40 ~ -35
75 ~ 85
º
Storage Temperature
-45
90
º
6.4. Current Consumption
This information will be added in future version of this document.
6.5. RF Output Power
The following table shows the RF output power of EC25 module.
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Table 30: Conducted RF Output Power
Frequency
Max.
LTE FDD B4/B13
Min.
23dBm±2dB
<-44dBm
6.6. RF Receiving Sensitivity
This information will be added in future version of this document.
6.7. Electrostatic Discharge
The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module electrostatics discharge characteristics.
Table 31: Electrostatics Discharge Characteristics
Tested Points
Contact Discharge
Air Discharge
Unit
VBAT, GND
±5
±10
kV
All Antenna Interfaces
±4
±8
kV
Other Interfaces
±0.5
±1
kV
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Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm.
7.1. Mechanical Dimensions of the Module
(32+/-0.15)
(29+/-0.15)
2.4+/-0.2
0.8
Figure 32: Module Top and Side Dimensions
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29.0
32.0
Figure 33: Module Bottom Dimensions (Bottom View)
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Keepout area
29.0
7.2. Footprint of Recommendation
32.0
Figure 34: Recommended Footprint (Top View)
NOTES
1.
2.
Pads 73~84 should not be designed.
In order to maintain the module, keep about 3mm between the module and other components in the
host PCB.
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7.3. Top View of the Module
Figure 35: Top View of the Module
7.4. Bottom View of the Module
Figure 36: Bottom View of the Module
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Storage and Manufacturing
8.1. Storage
EC25 is stored in a vacuum-sealed bag. The restrictions of storage condition are shown as below.
1. Shelf life in sealed bag is 12 months at < 40ºC/90%RH.
2. After this bag is opened, devices that will be subjected to reflow soldering or other high temperature
processes must be:
 Mounted within 72 hours at factory conditions of ≤ 30ºC/60%RH.
 Stored at <10% RH.
3. Devices require bake before mounting, if:
 Humidity indicator card is >10% when ambient temperature is 23ºC±5ºC.
 Mounted for more than 72 hours at factory conditions of ≤ 30ºC/60% RH.
4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.
NOTE
As plastic container cannot be subjected to high temperature, the module needs to be taken out from the
container for high temperature (125ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
8.2. Manufacturing and Welding
The squeegee should push the paste on the surface of stencil, so as to make the paste fill the stencil
openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a
clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at
the hole of the module pads should be 0.18mm. For details, please refer to document [4].
It is suggested that the peak reflow temperature is 235 ~ 245ºC (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 260ºC. To avoid damage to the module when it is repeatedly heated, it is
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suggested that the module should be mounted after the first panel has been reflowed. The following
picture is the actual diagram which we have operated.
ºC
Preheat
Heating
Cooling
250
Liquids Temperature
217
200 ºC
200
40s~60s
Temperature
160 ºC
150
70s~120s
100
Between 1~3 ºC/s
50
50
100
150
200
250
300
Time
Figure 37: Liquids Temperature
8.3. Packaging
EC25 is packaged in tap and reel carriers. One reel is 11.53m length and contains 250pcs modules. The
figure below shows the package details, measured in mm.
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1
0.
0.35± 0.05
30.3±0.15
0±
1.
29.3±0.15
44.00±0.3
20.20±0.15
44.00±0.1
2.00±0.1
4.00±0.1
30.3±0.15
1.75±0.1
LTE Module Series
EC25-V User Manual
4.2±0.15
3.1±0.15
32.5±0.15
33.5±0.15
32.5± 0.15
33.5± 0.15
48.5
Cover tape
13
100
Direction of feed
44.5+0.20
-0.00
Figure 38: Carrier Tape
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Appendix A Reference
Table 32: Related Documents
SN
Document Name
Remark
[1]
Quectel_EC25_Power_Management_Application_
Note
EC25 Power Management Application
Note
[2]
Quectel_EC25_AT_Commands_Manual
EC25 AT Commands Manual
[3]
Quectel_EC25_GNSS_AT_Commands_Manual
EC25 GNSS AT Commands Manual
[4]
Quectel_Module_Secondary_SMT_User_Guide
Module Secondary SMT User Guide
Table 33: Terms and Abbreviations
Abbreviation
Description
AMR
Adaptive Multi-rate
bps
Bits Per Second
CHAP
Challenge Handshake Authentication Protocol
CS
Coding Scheme
CSD
Circuit Switched Data
CTS
Clear To Send
DC-HSPA+
Dual-carrier High Speed Packet Access
DFOTA
Delta Firmware Upgrade Over The Air
DL
Downlink
DTR
Data Terminal Ready
DTX
Discontinuous Transmission
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EFR
Enhanced Full Rate
ESD
Electrostatic Discharge
FDD
Frequency Division Duplex
FR
Full Rate
GLONASS
GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global
Navigation Satellite System
GMSK
Gaussian Minimum Shift Keying
GNSS
Global Navigation Satellite System
GPS
Global Positioning System
GSM
Global System for Mobile Communications
HR
Half Rate
HSPA
High Speed Packet Access
HSDPA
High Speed Downlink Packet Access
HSUPA
High Speed Uplink Packet Access
I/O
Input/Output
Inorm
Normal Current
LED
Light Emitting Diode
LNA
Low Noise Amplifier
LTE
Long Term Evolution
MO
Mobile Originated
MS
Mobile Station (GSM engine)
MT
Mobile Terminated
PAP
Password Authentication Protocol
PCB
Printed Circuit Board
PDU
Protocol Data Unit
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PPP
Point-to-Point Protocol
QAM
Quadrature Amplitude Modulation
QPSK
Quadrature Phase Shift Keying
RF
Radio Frequency
RHCP
Right Hand Circularly Polarized
Rx
Receive
SIM
Subscriber Identification Module
SMS
Short Message Service
TDD
Time Division Duplexing
TDMA
Time Division Multiple Access
TD-SCDMA
Time Division-Synchronous Code Division Multiple Access
TX
Transmitting Direction
UL
Uplink
UMTS
Universal Mobile Telecommunications System
URC
Unsolicited Result Code
USIM
Universal Subscriber Identity Module
Vmax
Maximum Voltage Value
Vnorm
Normal Voltage Value
Vmin
Minimum Voltage Value
VIHmax
Maximum Input High Level Voltage Value
VIHmin
Minimum Input High Level Voltage Value
VILmax
Maximum Input Low Level Voltage Value
VILmin
Minimum Input Low Level Voltage Value
VImax
Absolute Maximum Input Voltage Value
VImin
Absolute Minimum Input Voltage Value
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VOHmax
Maximum Output High Level Voltage Value
VOHmin
Minimum Output High Level Voltage Value
VOLmax
Maximum Output Low Level Voltage Value
VOLmin
Minimum Output Low Level Voltage Value
VSWR
Voltage Standing Wave Ratio
Directives and Standards
The EC25-V module is designed to comply with the FCC statements. FCC ID: XMR201607EC25V,
The Host system using EC25-V, should have label indicated FCC ID: XMR201607EC25V.
FCC Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment .This equipment should be installed and operated with minimum distance 20 cm between
the radiator & your body.
If using a permanently affixed label, the modular transmitter must be labeled with its own FCC
identification number, and, if the FCC identification number is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must
also display a label referring to the enclosed module. This exterior label can use wording such as
the following:
“Contains Transmitter Module FCC ID: XMR201607EC25V” or “Contains FCC ID:
XMR201607EC25V”. Any similar wording that expresses the same meaning may be used. The
Grantee may either provide such a label, an example of which must be included in the application
for equipment authorization, or, must provide adequate instructions along with the module which
explain this requirement. In the latter case, a copy of these instructions must be included in the
application for equipment authorization.
This device is to be used in mobile or fixed applications only. Antenna gain including cable loss must
not exceed 10.71 dBi of frequency band 777-787 MHz, 6.5 dBi of frequency band 1710-1755 MHz,
for the purpose of satisfying the requirements of 2.1043 and 2.1091.
The antenna(s) used for this transmitter must be installed to provide a separation distance of at
least 20 cm from all persons and must not be co-located or operated in conjunction with any antenna or
transmitter not described under this FCC ID. The final product operating with this transmitter must
include operating instructions and antenna installation instructions, for end-users and installers to satisfy
RF exposure compliance requirements.
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