Quectel Wireless Solutions 201903EG61NA LTE Cat 1 Module User Manual

Quectel Wireless Solutions Company Limited LTE Cat 1 Module Users Manual

Users Manual

EG61-NAHardware Design LTEModule Series Rev. EG61-NA_Hardware_Design_V1.0 Date: 2019-01-04 Status: Preliminary www.quectel.com
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 1 / 77 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 2 / 77 About the Document History Revision Date Author Description 1.0 2019-01-04 Ward WANG/ Frank WANG Initial
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 3 / 77 Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ............................................................................................................................................... 5 Figure Index .............................................................................................................................................. 6 1 Introduction ....................................................................................................................................... 8 1.1. Safety Information ................................................................................................................... 9 2 Product Concept ............................................................................................................................. 14 2.1. General Description .............................................................................................................. 14 2.2. Key Features ......................................................................................................................... 14 2.3. Functional Diagram ............................................................................................................... 17 2.4. Evaluation Board ................................................................................................................... 17 3 Application Interfaces ..................................................................................................................... 18 3.1. General Description .............................................................................................................. 18 3.2. Pin Assignment ..................................................................................................................... 19 3.3. Pin Description ...................................................................................................................... 20 3.4. Operating Modes .................................................................................................................. 27 3.5. Power Saving ........................................................................................................................ 27 3.5.1. Sleep Mode.................................................................................................................. 27 3.5.1.1. UART Application ............................................................................................... 27 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 28 3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 29 3.5.1.4. USB Application without USB Suspend Function ............................................... 30 3.5.2. Airplane Mode .............................................................................................................. 30 3.6. Power Supply ........................................................................................................................ 31 3.6.1. Power Supply Pins ....................................................................................................... 31 3.6.2. Decrease Voltage Drop ................................................................................................ 32 3.6.3. Reference Design for Power Supply ............................................................................ 33 3.6.4. Monitor the Power Supply ............................................................................................ 33 3.7. Turn-on and off Scenarios ..................................................................................................... 33 3.7.1. Turn on Module Using the PWRKEY ........................................................................... 33 3.7.2. Turn off Module ............................................................................................................ 35 3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 36 3.7.2.2. Turn off Module Using AT Command ................................................................. 36 3.8. Reset the Module .................................................................................................................. 36 3.9. (U)SIM Interfaces .................................................................................................................. 38 3.10. USB Interface ........................................................................................................................ 41 3.11. UART Interfaces .................................................................................................................... 42 3.12. PCM and I2C Interfaces ........................................................................................................ 45 3.13. SPI Interface ......................................................................................................................... 47 3.14. Network Status Indication ..................................................................................................... 48
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 4 / 77 3.15. STATUS ................................................................................................................................ 49 3.16. Behaviors of RI ..................................................................................................................... 49 3.17. USB_BOOT Interface ............................................................................................................ 50 4 GNSS Receiver ................................................................................................................................ 52 4.1. General Description .............................................................................................................. 52 4.2. GNSS Performance .............................................................................................................. 52 4.3. Layout Guidelines ................................................................................................................. 53 5 Antenna Interfaces .......................................................................................................................... 54 5.1. Main/Rx-diversity Antenna Interfaces.................................................................................... 54 5.1.1. Pin Definition ................................................................................................................ 54 5.1.2. Operating Frequency ................................................................................................... 54 5.1.3. Reference Design of RF Antenna Interface ................................................................. 55 5.1.4. Reference Design of RF Layout ................................................................................... 55 5.2. GNSS Antenna Interface ....................................................................................................... 57 5.3. Antenna Installation .............................................................................................................. 58 5.3.1. Antenna Requirement .................................................................................................. 58 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 59 6 Electrical, Reliability and Radio Characteristics .......................................................................... 62 6.1. Absolute Maximum Ratings .................................................................................................. 62 6.2. Power Supply Ratings ........................................................................................................... 62 6.3. Operation and Storage Temperatures ................................................................................... 63 6.4. Current Consumption ............................................................................................................ 64 6.5. RF Output Power .................................................................................................................. 65 6.6. RF Receiving Sensitivity ....................................................................................................... 66 6.7. Electrostatic Discharge ......................................................................................................... 66 6.8. Thermal Consideration .......................................................................................................... 67 7 Mechanical Dimensions.................................................................................................................. 70 7.1. Mechanical Dimensions of the Module.................................................................................. 70 7.2. Recommended Footprint ....................................................................................................... 72 7.3. Design Effect Drawings of the Module .................................................................................. 73 8 Storage, Manufacturing and Packaging ........................................................................................ 74 8.1. Storage ................................................................................................................................. 74 8.2. Manufacturing and Soldering ................................................................................................ 75 8.3. Packaging ............................................................................................................................. 76 9 Appendix A References .................................................................................................................. 78
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 5 / 77 Table Index TABLE 1: FREQUENCY BANDS OF EG61-NA MODULE ................................................................................ 14 TABLE 2: KEY FEATURES OF EG61-NA MODULE ......................................................................................... 15 TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 20 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 20 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 27 TABLE 6: VBAT AND GND PINS ....................................................................................................................... 31 TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 34 TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 37 TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 38 TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 41 TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................. 43 TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 43 TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 43 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 46 TABLE 15: PIN DEFINITION OF SPI INTERFACE ........................................................................................... 47 TABLE 16: PIN DEFINITION OF NETWORK STATUS INDICATOR ................................................................ 48 TABLE 17: WORKING STATE OF THE NETWORK STATUS INDICATOR ...................................................... 48 TABLE 18: PIN DEFINITION OF STATUS ........................................................................................................ 49 TABLE 19: DEFAULT BEHAVIORS OF RI ........................................................................................................ 50 TABLE 20: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 50 TABLE 21: GNSS PERFORMANCE ................................................................................................................. 52 TABLE 22: PIN DEFINITION OF RF ANTENNA ............................................................................................... 54 TABLE 23: MODULE OPERATING FREQUENCIES ........................................................................................ 54 TABLE 24: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 57 TABLE 25: GNSS FREQUENCY ....................................................................................................................... 58 TABLE 26: ANTENNA REQUIREMENTS .......................................................................................................... 59 TABLE 27: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 62 TABLE 28: POWER SUPPLY RATINGS ........................................................................................................... 62 TABLE 29: OPERATION AND STORAGE TEMPERATURES .......................................................................... 63 TABLE 30: EG61-NA CURRENT CONSUMPTION ........................................................................................... 64 TABLE 31: GNSS CURRENT CONSUMPTION OF EG61-NA ......................................................................... 65 TABLE 32: RF OUTPUT POWER ..................................................................................................................... 65 TABLE 33: EG61-NA CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 66 TABLE 34: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 66 TABLE 35: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 75 TABLE 36: RELATED DOCUMENTS ................................................................................................................ 78 TABLE 37: TERMS AND ABBREVIATIONS ...................................................................................................... 78
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 6 / 77 Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 17 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 19 FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 28 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 29 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 29 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 30 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 32 FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 32 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 33 FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 34 FIGURE 11: TURN ON THE MODULE USING BUTTON ................................................................................. 34 FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 35 FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 36 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 37 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 37 FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 38 FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR ................................................................................................................................................................... 39 FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 40 FIGURE 19: REFERENCE CIRCUIT OF USB INTERFACE ............................................................................ 41 FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 44 FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 44 FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 45 FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 46 FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 47 FIGURE 25: REFERENCE CIRCUIT OF SPI INTERFACE WITH PERIPHERALS ......................................... 48 FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK STATUS INDICATOR ........................................... 49 FIGURE 27: REFERENCE CIRCUITS OF STATUS ......................................................................................... 49 FIGURE 28: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 51 FIGURE 29: TIMING SEQUENCE FOR ENTERING INTO EMERGENCY DOWNLOAD MODE .................... 51 FIGURE 30: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 55 FIGURE 31: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 56 FIGURE 32: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 56 FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND) .......................................................................................................................................................... 57 FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND) .......................................................................................................................................................... 57 FIGURE 35: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 58 FIGURE 36: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 60 FIGURE 37: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 60 FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 61
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 7 / 77 FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 68 FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BOTTOM OF CUSTOMERS’ PCB) . 68 FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 70 FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 71 FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 72 FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 73 FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 73 FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 75 FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 77 FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 77
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 8 / 77 1 Introduction This document defines the EG61-NAmodule and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical andmechanical details, as well as other related information of EG61-NA module. Associated with application note and user guide, customers can use EG61-NA module to design and set up mobile applications easily.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 9 / 77 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG61-NA module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 10 / 77 1.2. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201903EG61NA. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: ❒ WCDMA Band2/ LTE Band2:≤8dBi ❒ WCDMA Band4/ LTE Band4/66:≤5dBi ❒ WCDMA Band5/ LTE Band5:≤9.42dBi ❒ LTE Band12:≤8.73dBi ❒ LTE Band13:≤9.17dBi ❒ LTE Band71:≤8.55dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 11 / 77 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC ID: XMR201903EG61NA” or “Contains FCC ID: XMR201903EG61NA” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 12 / 77 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. 1.3. IC Statement IRSS-GEN "This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement." Déclaration sur l'exposition aux rayonnements RF The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter. L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 13 / 77 antenne ou un autre émetteur. To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: ❒ WCDMA Band2/ LTE Band2:≤8dBi ❒ WCDMA Band4/ LTE Band4/66:≤5dBi ❒ WCDMA Band5/ LTE Band5:≤6.1dBi ❒ LTE Band12:≤5.61dBi ❒ LTE Band13:≤5.93dBi ❒ LTE Band71:≤5.45dBi The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: “Contains IC: 10224A-20193EG61NA” or “where: 10224A-20193EG61NA is the module’s certification number”. Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte. L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la même signification, comme suit: "Contient IC: 10224A-20193EG61NA " ou "où: 10224A-20193EG61NA est le numéro de certification du module".
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 14 / 77 2 Product Concept 2.1. General Description EG61-NAmodule is an embedded 4G wireless communication module with receive diversity. It supportsLTE-FDD/WCDMA wireless communication, andprovides data connectivity on LTE-FDD,HSPA+, HSDPA, HSUPA, WCDMAnetworks. It can also provide voice functionality1)to meet customers’ specific application demands. The following table shows the frequency bands of EG61-NA module. Table 1: Frequency Bands of EG61-NA Module With a compact profile of 31.0mm ×25.0mm ×2.3mm, EG61-NA can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG61-NA is an SMD type module which can be embedded into applications through its 106 LGA pads. EG61-NA is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have been developed for customers to use these internet service protocols easily. 2.2. Key Features The following table describes the detailed features of EG61-NA module. Module LTE Bands (with Rx-diversity) WCDMA (with Rx-diversity) GSM GNSS EG61-NA FDD: B2/B4/B5/B12/B13/B66/B71 B2/B4/B5 Not supported GPS, GLONASS, BeiDou/Galileo, QZSS
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 15 / 77 Table 2: Key Features of EG61-NA Module Feature Details Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Transmitting Power Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands LTE Features Support up to non-CA Cat 1 FDD Support 1.4MHz~20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL)/5Mbps (UL) UMTS Features Support 3GPP R8 HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation HSDPA: Max 7.2Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/384Kbps (UL) Internet Protocol Features SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/CMUX*/HTTPS*/ SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default (U)SIMInterfaces Support 1.8V and 3.0V (U)SIM cards Audio Features Support one digital audio interface: PCM interface WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression PCM Interface Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave mode, but must be the master in long frame synchronization USB Interface Compliant with USB 2.0 specification (slave only);the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission,GNSS NMEA sentences output,software debugging, firmware upgrade and voice over USB* Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x, etc.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 16 / 77 UART Interface Main UART: Used for AT command communication and data transmission Baud rate reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART: Used for Linux console and log output 115200bps baud rate Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8C Lite of Qualcomm Protocol: NMEA 0183 AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Network Indication NETLIGHTpin for network activitystatusindication Antenna Interface Including main antenna interface (ANT_MAIN), Rx-diversity antenna (ANT_DIV) interface and GNSS antenna interface (ANT_GNSS) Physical Characteristics Size: (31.0±0.15)mm × (25.0±0.15)mm × (2.3±0.2)mm Package: LGA Weight: TBD Temperature Range Operation temperature range: -35°C ~ +75°C 1) Extended temperature range: -40°C ~ +85°C 2) Storage temperature range: -40°C ~ +90°C Firmware Upgrade USB interface and DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 3. “*” means under development. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 17 / 77 2.3. Functional Diagram The following figure shows a block diagram of EG61-NA and illustrates the major functional parts.  Power management  Baseband  DDR+NAND flash  Radio frequency  Peripheral interfaces BasebandPMICTransceiverNANDDDR2SDRAMPASWITCH SwitchANT_MAIN ANT_DIVVBAT_BBVBAT_RFPWRKEYVDD_EXT USB PCM UARTI2CRESET_N19.2MXOSTATUSGPIOsControlIQ ControlDuplexerSAWTxPRx DRx(U)SIM2 SPI(U)SIM1SAWLNAANT_GNSSSAWGPS Figure 1: Functional Diagram 2.4. Evaluation Board In order to help customers develop applications conveniently with EG61-NA, Quectel supplies anevaluation board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 18 / 77 3 Application Interfaces 3.1. General Description EG61-NAis equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters:  Power supply  (U)SIMinterfaces  USB interface  UART interfaces  PCMand I2C interfaces  SPI interface  Statusindication
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 19 / 77 3.2. Pin Assignment The following figure shows the pin assignment of EG61-NA module. NCPCM_SYNCPCM_CLKPCM_DINPCM_DOUTNCNCPWRKEY 1)NCRESET_NRESERVED123456711121314151617185051525354555859606162USB_DMAP_READYSTATUSNETLIGHTDBG_RXDDBG_TXDRESERVEDRESERVEDSPI_CLKSPI_MOSISPI_MISOVDD_EXTDTRGNDUSIM1_CLKUSIM1_DATAUSIM1_RSTUSIM1_VDDRIDCDCTSTXDRXDVBAT_BBVBAT_BBUSIM_GNDGND3130292827262322212019109USB_DPUSB_VBUSNCGNDNCNCRTSI2C_SCLI2C_SDA8494847464544434041423938373635343332245756GNDGNDANT_MAINGNDGNDNCVBAT_RFVBAT_RFGNDGNDNCGNDUSIM1_PRESENCE63646566676883848586878898979695949378777675747391 9289 9071 7269 7080 7982 81100 99102 101POWER USB UART (U)SIM OTHERSGND NCPCM ANT25USIM2_PRESENCEUSIM2_CLKUSIM2_RSTUSIM2_DATAUSIM2_VDDSPIUSB_BOOT103104 105106ANT_DIVANT_GNSSRESERVED Figure 2: Pin Assignment (Top View)
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 20 / 77 1. 1)PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 2. Keep all RESERVEDpins and unused pins unconnected. 3. GND pads should be connected to ground in the design. 3.3. Pin Description The following tables show the pin definition and description of EG61-NA. Table 3: IO Parameters Definition Type Description AI Analog input AO Analog output DI Digital input DO Digital output IO Bidirectional OD Open drain PI Power input PO Power output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI Power supply for module’s baseband part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be able to provide sufficient current up to 0.8A. VBAT_RF 52,53 PI Power supply for module’s RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be able to provide sufficient current up to 1.8A in a transmitting burst. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 21 / 77 VDD_EXT 29 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA Power supply for external GPIO’s pull up circuits. GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 Ground Turn on/off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turnon/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. RESET_N 17 DI Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V Pull-up to 1.8V internally. Activelow. If unused,keep it open. Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 20 DO Indicate the module operation status VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. NETLIGHT 21 DO Indicate the module’s network activity status VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 8 PI USB detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V Typical:5.0V If unused, keep it open. USB_DP 9 IO USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. USB_DM 10 IO USB differential data bus (-) Compliant with USB 2.0 standard Require differential impedance of 90Ω.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 22 / 77 specification. (U)SIMInterfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 47 Specified ground for (U)SIM card Connect to ground of (U)SIM card connector. USIM1_VDD 43 PO Power supply for (U)SIMcard For 1.8V(U)SIM: Vmax=1.9V Vmin=1.7V For 3.0V(U)SIM: Vmax=3.05V Vmin=2.7V IOmax=50mA Either 1.8V or 3.0V is supported by the module automatically. USIM1_DATA 45 IO Data signal of (U)SIMcard For 1.8V (U)SIM: VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V USIM1_CLK 46 DO Clock signal of (U)SIMcard For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V USIM1_RST 44 DO Reset signal of (U)SIMcard For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 23 / 77 USIM1_ PRESENCE 42 DI (U)SIMcard insertion detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. USIM2_VDD 87 PO Power supply for (U)SIMcard For 1.8V(U)SIM: Vmax=1.9V Vmin=1.7V For 3.0V(U)SIM: Vmax=3.05V Vmin=2.7V IOmax=50mA Either 1.8V or 3.0V is supported by the module automatically. USIM2_DATA 86 IO Data signal of (U)SIMcard For 1.8V (U)SIM: VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V USIM2_CLK 84 DO Clock signal of (U)SIMcard For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V USIM2_RST 85 DO Reset signal of (U)SIMcard For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V USIM2_ PRESENCE 83 DI (U)SIMcard insertion detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Main UART Interface
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 24 / 77 Pin Name Pin No. I/O Description DC Characteristics Comment RI 39 DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DCD 38 DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. CTS 36 DO Clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. RTS 37 DI Request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. DTR 30 DI Data terminal ready. Sleep mode control. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Pull-up by default. Low level wakes up the module. If unused, keep it open. TXD 35 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. RXD 34 DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 23 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DBG_RXD 22 DI Receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_DIN 6 DI PCM data input VILmin=-0.3V 1.8V power domain.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 25 / 77 VILmax=0.6V VIHmin=1.2V VIHmax=2.0V If unused, keep it open. PCM_DOUT 7 DO PCM data output VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. PCM_SYNC 5 IO PCM data frame synchronization signal VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. PCM_CLK 4 IO PCM clock VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C serial clock. Used for external codec An external pull-up resistor is required. 1.8V only. If unused, keep it open. I2C_SDA 41 OD I2C serial data. Used for external codec An external pull-up resistor is required. 1.8V only. If unused, keep it open. SPI Interface Pin Name Pin No. I/O Description DC Characteristics Comment SPI_CLK 26 DO Clock signal of SPI interface VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. SPI_MOSI 27 DO Master output slave input of SPI interface VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 26 / 77 SPI_MISO 28 DI Master input slave output of SPI interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment ANT_GNSS 49 AI GNSS antenna pad 50Ω impedance. If unused, keep it open. ANT_DIV 56 AI Receive diversity antenna pad 50Ω impedance. If unused, keep it open. ANT_MAIN 60 IO Main antenna pad 50Ω impedance. If unused, keep it open. Other Pins Pin Name Pin No. I/O Description DC Characteristics Comment AP_READY 19 DI Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. USB_BOOT 75 DI Force the module to enter into emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. RESERVED Pins Pin Name Pin No. I/O Description DC Characteristics Comment NC 1, 2, 11~14, 16, 51,57, 63~66, 78, 88, 92~99 NC Keep these pins unconnected. RESERVED 18, 24,25 76, 77 Reserved Keep these pins unconnected.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 27 / 77 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module hasregistered on network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network settingand data transfer rate. Minimum Functionality Mode AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. Power Down Mode In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. 3.5. Power Saving 3.5.1. Sleep Mode EG61-NA is able to reduce its current consumption to a minimum value during the sleep mode. The following sectionsdescribe the power saving procedures of EG61-NA module. 3.5.1.1. UART Application If the host communicates with the module via UART interface, the following preconditions can let the module enter into sleep mode.  Execute AT+QSCLK=1commandto enable sleep mode.  Drive DTR to high level. The following figure shows the connection between the module and the host.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 28 / 77 RXDTXDRIDTRAP_READYTXDRXDEINTGPIOGPIOModule HostGND GND Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module.  When EG61-NA has a URC to report, RI signal will wake up the host. Refer to Chapter 3.16 for details about RI behavior.  AP_READY will detect the sleep state of host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready"*commandfor details. “*” means under development. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter into sleep mode.  Execute AT+QSCLK=1commandto enable the sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state. The following figure shows the connection between the module and the host. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 29 / 77 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModule HostGND GND Figure 4: Sleep Mode Application with USB Remote Wakeup  Sending data to EG61-NAthrough USB will wake up the module.  When EG61-NAhas a URC to report, the module will send remote wake-up signals via USB busso as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are threepreconditions to let the module enter into the sleep mode.  Execute AT+QSCLK=1commandto enable sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state. The following figure shows the connection between the module and the host. USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModule HostGND GNDRI EINT Figure 5: Sleep Mode Application with RI
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 30 / 77  Sending data to EG61-NAthrough USB will wake up the module.  When EG61-NAhas a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected with an externalcontrol circuit to let the module enter into sleep mode.  Execute AT+QSCLK=1commandto enable the sleep mode.  Ensure the DTR is held at high level or keep it open.  Disconnect USB_VBUS. The following figure shows the connection between the module and the host. USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModule HostRI EINTPower SwitchGPIOGND GND Figure 6: Sleep Mode Application without Suspend Function Switching onthe power switch tosupply power to USB_VBUS will wake up the module. Please pay attention to the level match shown in dotted line between the module and the host.Refer to document [1] for more details about EG61-NA power management application. 3.5.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set viathe following ways. Hardware: The W_DISABLE# pin is pulled up by default.Driving it to low level will let the module enter into airplane mode. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 31 / 77 Software: AT+CFUNcommandprovides the choice of functionality levels as shown below:  AT+CFUN=0: Minimum functionality mode.Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. 1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG61-NA provides four VBAT pins for connection with anexternal power supply. There are two separate voltage domains for VBAT.  Two VBAT_RF pins for module’sRF part.  Two VBAT_BB pins for module’s baseband part. The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52,53 Power supply for module’s RF part. 3.3 3.8 4.3 V VBAT_BB 32,33 Power supply for module’s baseband part. 3.3 3.8 4.3 V GND 3, 31, 48,50, 54, 55,58, 59, 61,62, 67~74, 79~82,89~91, 100~106 Ground - 0 - V NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 32 / 77 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3Vto4.3V. Please make sure thatthe input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network.The voltage drop will be less in 3G and 4G networks. VBATMin.3.3VRippleDropBurst TransmissionBurst Transmission Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100µF with low ESR(ESR=0.7Ω) should be used, and amulti-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to usethree ceramic capacitors (100nF, 33pF, 10pF)for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm, andthe width of VBAT_RF trace should be no less than 2mm.In principle, the longerthe VBAT trace is, the wider it will be. In addition, in order to get a stable power source,it is recommended to use a TVS diode of Model WS4.5D3HV. The following figure shows the star structure of the power supply. ModuleVBAT_RFVBAT_BBVBATC1100uFC6100nFC733pFC810pF++C2100nFC5100uFC333pFC410pFD1 Figure 8: Star Structure of the Power Supply
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 33 / 77 3.6.3. Reference Design for Power Supply Power design for the module is very important, asthe performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be usedto supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source. The typicaloutput ofthe power supply is about 3.8V and the maximum load current is 3A. DC_INMIC29302WUIN OUTENGNDADJ2 4135VBAT 100nF 470uF 100nF100K47K470uF470R51K 1%1%4.7K47KVBAT_EN Figure 9: Reference Circuit of Power Supply In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shutdown by PWRKEY or AT command, the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Turn-on and off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definitionof PWRKEY. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 34 / 77 Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description DC Characteristics Comment PWRKEY 15 Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EG61-NA is in powerdownmode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY.After STATUS pin outputting a high level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Turn on pulsePWRKEY4.7K47K≥ 500ms10nF Figure 10: Turn on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from the finger. Therefore, aTVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shownin the following figure. PWRKEYS1Close to S1TVS Figure 11: Turn on the Module Using Button The turn on scenario is illustrated in the following figure.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 35 / 77 VIL≤0.5VVIH≥1.3VVBATPWRKEY≥500msRESET_NSTATUS(OD)InactiveActiveUARTNOTEInactiveActiveUSB≥2.5s≥12s≥13sVDD_EXTAbout 100msBOOT_CONFIG & USB_BOOT PINS≥100ms, after this time, the BOOT_CONFIG pins can be set high level by external circuit Figure 12: Timing of Turning on Module 1. Please make sure that VBAT is stable before pulling down PWRKEY pin, and the time between them is no less than 30ms. 2. The recommended pull-up level range is 1.3V~2.1V if a pull-up circuit is added on PWRKEY pin. 3.7.2. Turn off Module Either of the following methodscan be used to turn off the module:  Normal power down procedure: Turn off the module using the PWRKEY pin.  Normal power down procedure: Turn off the module using AT+QPOWDcommand. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 36 / 77 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-down procedure after the PWRKEY is released. The power-down scenario is illustrated inthe following figure. VBATPWRKEY≥ 30s≥ 650msRUNNING Power-down procedure OFFModuleStatusSTATUS Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWDcommandto turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer todocument [2] for details about the AT+QPOWDcommand. 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successful turn-off. 3.8. Reset the Module The RESET_N pin can be used to reset the module.The module can be reset by driving RESET_N to a low level voltage for 150ms~460ms. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 37 / 77 Table 8: Pin Definition of RESET_N Pin Name Pin No. Description DC Characteristics Comment RESET_N 17 Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Reset pulseRESET_N4.7K47K150ms~460ms Figure 14: Reference Circuit of RESET_N by Using Driving Circuit RESET_NS2Close to S2TVS Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated inthe following figure.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 38 / 77 VIL ≤ 0.5VVIH ≥ 1.3VVBAT≥ 150msResettingModule StatusRunningRESET_NRestart≤ 460ms Figure 16: Timing of Resetting Module 1. RESET_N is only used when the module fails to be shut down via AT+QPOWD command and the PWRKEY pin. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interfaces EG61-NAprovides two (U)SIMinterfaces, andonly one (U)SIMcard can work at a time.The (U)SIM1 and (U)SIM2cardscan be switched by AT+QDSIM*command.For more details, please refer to document [2]. The(U)SIMinterfacescircuitrymeet ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIMcards are supported. Table 9: Pin Definition of (U)SIMInterfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 43 PO Power supply for (U)SIM1 card Either 1.8V or 3.0V is supported by the module automatically. USIM1_DATA 45 IO Data signal of (U)SIM1 card USIM1_CLK 46 DO Clock signal of (U)SIM1card USIM1_RST 44 DO Reset signal of (U)SIM1 card USIM1_ PRESENCE 42 DI (U)SIM1 card insertion detection NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 39 / 77 USIM_GND 47 Specified ground for (U)SIMcard USIM2_VDD 87 PO Power supply for (U)SIM2 card Either 1.8V or 3.0V is supported by the module automatically. USIM2_DATA 86 IO Data signal of (U)SIM2 card USIM2_CLK 84 DO Clock signal of (U)SIM2 card USIM2_RST 85 DO Reset signal of (U)SIM2 card USIM2_ PRESENCE 83 DI (U)SIM2 card insertion detection EG61-NA supports (U)SIMcard hot-plug via the USIM_PRESENCE (USIM1_PRESENCE/USIM2_PRESENCE) pin. The functionsupports low level and high level detections, andis disabled by default. Pleaserefer to document [2] about AT+QSIMDETcommand for details. The following figure shows a reference design for (U)SIM interface with an8-pin (U)SIMcard connector. ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_PRESENCE0R0R0RVDD_EXT51K100nFGNDGND33pF 33pF 33pFVCCRSTCLK IOVPPGNDGNDUSIM_VDD15K(U)SIM Card Connector Figure 17: Reference Circuitof (U)SIMInterface with an 8-Pin (U)SIMCard Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. Areference circuit of (U)SIM interface with a 6-pin (U)SIMcard connector is illustrated inthe following figure.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 40 / 77 ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATA 0R0R0R100nFGND33pF 33pF 33pFVCCRSTCLK IOVPPGNDGND15KUSIM_VDD(U)SIM Card Connector Figure 18: Reference Circuitof (U)SIM Interface with a 6-Pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in the (U)SIM circuit design:  Keep placement of (U)SIM card connector as close to the module as possible. Keep the trace length as less than 200mm as possible.  Keep (U)SIM card signals away from RF and VBAT traces.  Assure the ground trace between the module and the (U)SIMcard connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible.If the ground is complete on customers’ PCB, USIM_GND can be connected to PCB ground directly.  To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground.  In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15pF. The 0Ω resistors should be added in series between the module and the (U)SIM card to facilitatedebugging. The 33pF capacitors are used for filtering interference of GSM900MHz.Please note that the (U)SIM peripheral circuit should be close to the (U)SIMcard connector.  The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector.  “*” means under development. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 41 / 77 3.10. USB Interface EG61-NA contains one integrated Universal Serial Bus (USB) interfacewhich complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output,software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DP 9 IO USB differential data bus (+) Require differential impedance of 90Ω. USB_DM 10 IO USB differential data bus (-) Require differential impedance of 90Ω. USB_VBUS 8 PI USB detection Typically 5.0V GND 3 Ground More details about the USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers’ design. The following figure shows areference circuit of USB interface. USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR3R4Test PointsESD ArrayNM_0RNM_0RMinimize these stubsModule MCUUSB_VBUSVDD Figure 19: Reference Circuit of USB Interface
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 42 / 77 A common mode choke L1 is recommended to be added in series between the module and customer’sMCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should beadded in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. Theextra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification.  It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90Ω.  Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding onnot only upper and lower layers but also right and left sides.  Pay attention to the influence of junction capacitance of ESD protection component on USB data lines. Typically, the capacitance value should be less than 2pF.  Keep the ESD protection components to the USB connector as close as possible. 1. EG61-NA module can only be used as a slave device. 2. “*” means under development. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and thedebug UART interface. The following shows their features.  The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps and 921600bpsbaud rates, and the default is 115200bps. The interface can be used for data transmission and AT command communication.  The debug UART interface supports 115200bpsbaud rate. It is used forLinux console and log output. The following tables show the pin definition of the two UART interfaces. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 43 / 77 Table 11: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment RI 39 DO Ring indicator 1.8V power domain DCD 38 DO Data carrier detection CTS 36 DO Clear to send RTS 37 DI Request to send DTR 30 DI Sleep mode control TXD 35 DO Transmit data RXD 34 DI Receive data Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_TXD 23 DO Transmit data 1.8V power domain DBG_RXD 22 DI Receive data 1.8V power domain The logic levels are described in the following table. Table 13:Logic Levels of Digital I/O Parameter Min. Max. Unit VIL -0.3 0.6 V VIH 1.2 2.0 V VOL 0 0.45 V VOH 1.35 1.8 V The module provides 1.8V UART interface. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows areference design.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 44 / 77 VCCA VCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTRIDCDRTSRXDDTRCTSTXD51K 51K0.1uF 0.1uFRI_MCUDCD_MCURTS_MCURXD_MCUDTR_MCUCTS_MCUTXD_MCUVDD_MCUTranslator Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com formore information. Another example with transistor translation circuit is shown as below. Thecircuitdesign of dotted line section can refer to the circuitdesign of solid linesection, in terms of both module input and output circuit design. Please pay attention to the direction of connection. MCU/ARMTXDRXDVDD_EXT10KVCC_MCU4.7K10KVDD_EXTTXDRXDRTSCTSDTRRIRTSCTSGNDGPIO DCDModuleGPIOEINTVDD_EXT4.7KGND1nF1nF Figure 21: Reference Circuit with Transistor Circuit Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 45 / 77 3.12. PCM and I2C Interfaces EG61-NA provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:  Primary mode (short frame synchronization, works as both master and slave)  Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC. EG61-NA supports 16-bit linear data format. The following figures show theprimary mode’s timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well asthe auxiliary mode’s timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. PCM_CLKPCM_SYNCPCM_DOUTMSB LSB MSB125us1 2 256255PCM_DINMSBLSBMSB Figure 22: Primary Mode Timing
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 46 / 77 PCM_CLKPCM_SYNCPCM_DOUTMSB LSBPCM_DIN125usMSB1 2 3231LSB Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 6 DI PCM data input 1.8V power domain PCM_DOUT 7 DO PCM data output 1.8V power domain PCM_SYNC 5 IO PCM data frame synchronization signal 1.8V power domain PCM_CLK 4 IO PCM data bit clock 1.8V power domain I2C_SCL 40 OD I2C serial clock Require an external pull-up to 1.8V I2C_SDA 41 OD I2C serial data Require an external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronizationformat with 2048KHzPCM_CLK and 8KHz PCM_SYNC.Please refer to document [2] aboutAT+QDAIcommand for details. The following figure shows areference design of PCM interface with external codec IC.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 47 / 77 PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec Figure 24: Reference Circuit of PCM Application with Audio Codec 1. It is recommended to reserve RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for PCM_CLK. 2. EG61-NA works as a master device pertaining to I2C interface. 3.13. SPI Interface SPI interface of EG61-NAacts asthe master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It isdedicated to one-to-one connection, withoutchip select.Its operation voltage is 1.8V with clock rates up to 50MHz. The following table shows the pin definition of SPI interface. Table 15: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment SPI_CLK 26 DO Clock signal of SPI interface 1.8V power domain SPI_MOSI 27 DO Master output slave input of SPI interface 1.8V power domain SPI_MISO 28 DI Master input slave output of SPI interface 1.8V power domain The following figure shows areference design of SPI interface with peripherals. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 48 / 77 SPI_MISOSPI_MOSISPI_CLKModuleSPI_CLKSPI_MISOSPI_MOSI Peripherals Figure 25: Reference Circuit of SPI Interface with Peripherals 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network status. Table 16: Pin Definition of Network StatusIndicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the module’snetwork activity status 1.8V power domain Table 17: Working State of the Network Status Indicator Pin Name Logic Level Changes Network Status NETLIGHT Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 49 / 77 4.7K47KVBAT2.2KModuleNETLIGHT Figure 26: Reference Circuit of the Network Status Indicator 3.15. STATUS The STATUS pin is set as the module’s operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. Table 18: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicate the module’s operation status 1.8V power domain A reference circuit is shown as below. 4.7K47KVBAT2.2KModule STATUS Figure 27: Reference Circuits of STATUS 3.16. Behaviors of RI AT+QCFG="risignaltype","physical"command can be used to configure RI behavior.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 50 / 77 No matter on which port URC is presented, URC will trigger the behavior ofRI pin. URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI are shown as below. Table 19: Default Behaviors of RI State Response Idle RI keeps athigh level URC RI outputs 120ms low pulse when a new URC returns The default RI behaviorscan be changed by AT+QCFG="urc/ri/ring"command.Please refer to document [2] for details. 3.17. USB_BOOT Interface EC61-NA provides a USB_BOOT pin. Customers can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter into emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 20: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Force the module to enter into emergency download mode 1.8V power domain. Active high. It is recommended to reserve the pin as test point. The following figures show the reference circuit of USB_BOOT interface and timing sequence of Entering into emergency download mode. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 51 / 77 ModuleUSB_BOOTVDD_EXT4.7KTest pointTVSClose to test point Figure 28: Reference Circuit of USB_BOOT Interface VIL≤0.5VVIH≥1.3VVBATPWRKEY≥500msRESET_NNOTEVDD_EXTAbout 100msUSB_BOOTSetting USB_BOOT to high level between VBAT rising on and VDD_EXT rising on can let the module enter into emergency download mode Figure 29: Timing Sequence for Entering into Emergency Download Mode 1. Please make sure that VBAT is stable before pulling down PWRKEY pin, and the time between themis no less than 30ms. 2. The recommended pull-up level range is 1.3V~2.1V if a pull-up circuit is added on PWRKEY pin. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 52 / 77 4 GNSS Receiver 4.1. General Description EG61-NA includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG61-NA supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EG61-NA GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows GNSS performance of EG61-NA. Table 21: GNSS Performance Parameter Description Conditions Typ. Unit Sensitivity (GNSS) Cold start Autonomous -145 dBm Reacquisition Autonomous -157 dBm Tracking Autonomous -157 dBm TTFF (GNSS) Cold start @open sky Autonomous 34.4 s XTRA enabled 15.6 s Warm start @open sky Autonomous 28.6 s XTRA enabled 2.2 s Hot start Autonomous 2.3 s
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 53 / 77 @open sky XTRA enabled 2.1 s Accuracy (GNSS) CEP-50 Autonomous @open sky 4 m 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers’ design.  Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna.  Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be kept away from the antennas.  Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection.  Keep the characteristic impedance for ANT_GNSS trace as 50Ω. Please refer to Chapter 5 for GNSS reference design and antenna installation information. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 54 / 77 5 Antenna Interfaces EG61-NA antenna interfaces include a main antenna interface andanRx-diversity antennainterface which is used toresist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG61-NA.The impedance of the antenna port is 50Ω. 5.1. Main/Rx-diversityAntenna Interfaces 5.1.1. Pin Definition The pin definitionof main antenna and Rx-diversityantenna interfaces is shown below. Table 22: Pin Definition of RF Antenna Pin Name Pin No. I/O Description Comment ANT_MAIN 60 IO Main antenna pad 50Ωimpedance ANT_DIV 49 AI Receive diversityantenna pad 50Ωimpedance ANT_DIV 56 AI Receive diversity antenna pad 50Ω impedance 5.1.2. Operating Frequency Table 23: Module Operating Frequencies 3GPP Band Transmit Receive Unit WCDMA B2 1850~1910 1930~1990 MHz WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz LTE FDD B2 1850~1910 1930~1990 MHz LTE FDD B4 1710~1755 2110~2155 MHz
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 55 / 77 LTE FDD B5 824~849 869~894 MHz LTE FDD B12 699~716 729~746 MHz LTE FDD B13 777~787 746~756 MHz LTE-FDDB66 1710~1780 2100~2200 MHz LTE-FDD B71 663~698 617~652 MHz 5.1.3. Reference Design of RF Antenna Interface Areference design of ANT_MAIN and ANT_DIVantenna pads is shown as below. Aπ-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. ANT_MAINR1 0RC1ModuleMainantennaNMC2NMR2 0RC3Diversity antennaNMC4NMANT_DIV Figure 30: Reference Circuit of RF Antenna Interface 1. Keep a proper distance between the main antenna and theRx-diversityantenna to improve the receiving sensitivity. 2. ANT_DIV function is enabledby default.AT+QCFG="diversity",0command can be used to disable receive diversity. 3. Place the π-type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 56 / 77 impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the distance between signal layer and reference ground (H), and the clearance between RF trace and ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic impedance control. The following are reference designs of microstrip line or coplanar waveguide line with different PCB structures. . Figure 31: Microstrip Line Design on a 2-layer PCB Figure 32: Coplanar Waveguide Line Design on a 2-layer PCB
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 57 / 77 Figure 33: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:  Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50Ω.  The GND pins adjacent to RF pins should not bedesigned as thermal relief pads, and should be fully connected to ground.  The distance between the RF pinsand the RFconnector should be as short as possible, and all the right angle traces should be changed to curved ones.  There should be clearance area under the signal pin of the antenna connector or solder joint.  The reference ground of RF traces should be complete. Meanwhile, adding some ground viasaround RF traces and the reference ground could help to improve RF performance. The distance between the ground viasand RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [4]. 5.2. GNSS Antenna Interface The GNSS antenna interface is only supported on EG61-NA.The following tables show pin definition and frequency specification of GNSS antenna interface. Table 24: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 49 AI GNSS antenna 50Ωimpedance
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 58 / 77 Table 25: GNSS Frequency Type Frequency Unit GPS 1575.42±1.023 MHz GLONASS 1597.5~1605.8 MHz Galileo 1575.42±2.046 MHz BeiDou 1561.098±2.046 MHz QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below. GNSS AntennaVDDModuleANT_GNSS47nH10R0.1uF0RNM NM100pF Figure 35: Reference Circuit of GNSS Antenna 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 59 / 77 Table 26: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB WCDMA/LTE VSWR: ≤2 Efficiency: > 30% Max Input Power: 50 W Input Impedance: 50Ω Cable insertion loss: <1dB (WCDMA B5 LTE B5/B12/B13/B71) Cable Insertion Loss: <1.5dB (WCDMAB2/B4, LTE B2/B4/B66) 1) It is recommended to use a passive GNSS antenna when LTE B13 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 60 / 77 Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37:Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 61 / 77 Figure 38:Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 62 / 77 6 Electrical, Reliability and RadioCharacteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 27: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 TBD A Voltage at Digital Pins -0.3 2.3 V 6.2. Power Supply Ratings Table 28: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.3 3.8 4.3 V
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 63 / 77 Voltage drop during burst transmission Maximum power control level on LTE 400 mV IVBAT Peak supply current (during transmissionslot) Maximum power control level on LTE A USB_VBUS USB connection detection 3.0 5.0 5.25 V 6.3. Operation and Storage Temperatures The operation and storage temperaturesare listed in the following table. Table 29: Operation and Storage Temperatures Parameter Min. Typ. Max. Unit Operation Temperature Range1) -35 +25 +75 ºC ExtendedTemperatureRange2) -40 +85 ºC Storage Temperature Range -40 +90 ºC 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operation temperature levels, the module will meet 3GPP specifications again. NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 64 / 77 6.4. Current Consumption The values of current consumption are shown below. Table 30: EG61-NA Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down 12 uA Sleep state AT+CFUN=0 (USB disconnected) 0.646 mA WCDMA PF=64 (USB disconnected) 1.483 mA WCDMA PF=64 (USB suspend) 1.844 mA WCDMA PF=512 (USB disconnected) 0.912 mA LTE-FDD PF=64 (USB disconnected) 1.96 mA LTE-FDD PF=64 (USB suspend) 2.152 mA LTE-FDD PF=256 (USB disconnected) 1.219 mA Idle state WCDMA PF=64 (USB disconnected) 17.225 mA WCDMA PF=64 (USB connected) 27.656 mA LTE-FDDPF=64 (USB disconnected) 18.09 mA LTE-FDDPF=64 (USB connected) 28.768 mA WCDMA datatransfer WCDMA B2 HSDPA@21.69dBm 592.0 mA WCDMA B2 HSUPA@21.76dBm 606.0 mA WCDMA B4 HSDPA@23.22dBm 604.0 mA WCDMA B4 HSUPA@22.49dBm 606.0 mA WCDMA B5 HSDPA@23.22dBm 551.0 mA WCDMA B5 HSUPA@22.46dBm 546.0 mA LTE datatransfer LTE-FDD B2 @22.89dBm 705.0 mA LTE-FDD B4 @22.91dBm 754.0 mA
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 65 / 77 LTE-FDD B5 @23.2dBm 602.0 mA LTE-FDD B12 @23.0dBm 714.0 mA LTE-FDD B13 @23.16dBm 663.0 mA LTE-FDD B66 @22.90dBm 746.3 mA LTE-FDD B71 @22.93dBm 718.0 mA WCDMA voice call WCDMA B2 @22.96dBm 647.0 mA WCDMA B4 @23.35dBm 607.0 mA WCDMA B5 @23.36dBm 550.0 mA Table 31: GNSS Current Consumption of EG61-NA 6.5. RF Output Power The following table shows the RF output power of EG61-NA module. Table 32: RF Output Power Frequency Max. Min. WCDMA B2/B4/B5 24dBm+1/-3dB <-49dBm LTE-FDD B2/B4/B5/B12/B13 B66/B71 23dBm±2dB <-39dBm Parameter Description Conditions Typ. Unit IVBAT (GNSS) Searching (AT+CFUN=0) Cold start @Passive Antenna 52.765 mA Lost state @Passive Antenna 52.306 mA Tracking (AT+CFUN=0) Instrument Environment 34.547 mA Open Sky @Passive Antenna TBD mA Open Sky @Active Antenna TBD mA
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 66 / 77 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG61-NA module. Table 33: EG61-NA Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2 -109dBm -110dBm / -104.7dBm WCDMA B4 -109dBm -110dBm / -106.7dBm WCDMA B5 -110.5dBm -110.5dBm / -104.7dBm LTE-FDD B2 (10M) -97.7 -98.7 -101.7 -94.3dBm LTE-FDD B4 (10M) -97.7 -98.2 -100.2 -96.3dBm LTE-FDD B5 (10M) -99.7 -99.4 -102.7 -94.3dBm LTE-FDD B12 (10M) -98.7 -99.2 -101.7 -93.3dBm LTE-FDD B13 (10M) -98.7 -98.9 -102.2 -93.3dBm LTE-FDD B66 (10M) -97.7 -98.3 -101.2 -95.8dBm LTE-FDD B71 (10M) -99.2 -99 -102.2 -93.5dBm 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module’s electrostatic discharge characteristics. Table 34: Electrostatic Discharge Characteristics Test Points Contact Discharge Air Discharge Unit VBAT, GND ±8 ±12 KV
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 67 / 77 ANT_MAIN,ANT_DIV ±8 ±12 KV ANT_GNSS ±6 ±10 KV Other Interfaces TBD TBD KV 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:  On customers’ PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc.  Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary.  Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance.  The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation.  Make sure the ground pads of the module and PCB are fully connected.  According to customers’ application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them.  The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or bothof them according to their application structure.
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 68 / 77 HeatsinkEG61-NA ModuleApplication Board Application BoardHeatsinkThermal PadShielding Cover Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) Thermal PadHeatsinkApplication Board Application BoardHeatsinkThermal PadEG61-NA ModuleShielding Cover Figure 40: Referenced Heatsink Design (Heatsink at the Bottom of Customers’ PCB) 1. The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115°C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105°C. Customers can execute AT+QTEMP command and get the NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 69 / 77 maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [5].
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 70 / 77 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 7.1. Mechanical Dimensions of the Module 25±0.1531±0.15 2.45±0.2 Figure 41: Module Top and Side Dimensions
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 71 / 77 1.001.700.700.550.851.001.701.7062x0.740x1.040x1.025±0.1531±0.153.902.752.753.901.151.157.45 7.150.85 8.505.100.201.101.901.101.951.001.10 1.1062x1.151.501.701.700.401.701.700.400.501.504.851.580.332.931.635.954.250.501.70 Figure 42: Module Bottom Dimensions (TopView)
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 72 / 77 7.2. Recommended Footprint 1.001.700.700.550.851.001.701.7062x0.740x1.040x1.025±0.1531±0.153.902.752.753.901.151.157.45 7.150.85 8.505.100.201.101.901.101.951.001.10 1.1062x1.151.501.701.700.401.70 1.700.400.501.505.954.250.501.70 Figure 43: Recommended Footprint (Top View) For easymaintenance of the module, please keep about 3mm between the module and other components in thehost PCB. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 73 / 77 7.3. Design Effect Drawings of the Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module These are design effect drawings of EG61-NA module. For more accurate pictures, please refer to the module that you get from Quectel. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 74 / 77 8 Storage, Manufacturing and Packaging 8.1. Storage EG61-NAis stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:  Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.  Stored at <10% RH. 3. Devices require bake before mounting, if any circumstances below occurs:  When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity is >10% before opening the vacuum-sealed bag.  Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH. 4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC. As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (120ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. NOTE
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 75 / 77 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, thethickness of stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please refer todocument [3]. It is suggested that the peak reflow temperature is 240ºC ~245ºC, and the absolute maximum reflow temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (°C)Reflow ZoneSoak Zone245200220240CDBA150100 Max slope: 1~3°C/sec Cooling down slope: 1~4°C/sec Max slope: 2~3°C/sec Figure 46: Reflow Soldering Thermal Profile Table 35: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1 to 3°C/sec Soak time (between A and B: 150°C and 200°C) 60 to 120 sec Reflow Zone
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 76 / 77 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the 2Dbarcode is still readable, although white rust may be found. 8.3. Packaging EG61-NAis packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the packaging details, measured in mm. Max slope 2 to 3°C/sec Reflow time (D: over 220°C) 40 to 60 sec Max temperature 240°C ~ 245°C Cooling down slope 1 to 4°C/sec Reflow Cycle Max reflow cycle 1 NOTES
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 77 / 77 Figure 47: Tape Dimensions Direction of feedCover tape1310044.5+0.20-0.0048.5 Figure 48: Reel Dimensions
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 78 / 77 9 Appendix A References Table 36: Related Documents SN Document Name Remark [1] Quectel_EC2x&EG9x&EM05_Power_Management_Application_Note Power Management Application Note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG61-NA, EG91 and EM05 [2] Quectel_EG61-NA_AT_Commands_Manual AT Commands Manual for EG61-NA [3] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide [4] Quectel_RF_Layout_Application_Note RF Layout Application Note [5] Quectel_LTE_Module_Thermal_Design_Guide Thermal design guide for LTE modules including EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95, EG25-G, EP06, EG06, EM06 and AG35. Table 37: Terms and Abbreviations Abbreviation Description AMR Adaptive Multi-rate bps Bits Per Second CHAP Challenge Handshake Authentication Protocol CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send HSPA+ High Speed Packet Access+ DFOTA Delta Firmware Upgrade Over The Air DL Downlink
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 79 / 77 DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate ESD Electrostatic Discharge FDD Frequency Division Duplex FR Full Rate GSM Global System For Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access I/O Input/Output Inorm Normal Current LED Light Emitting Diode LNA Low Noise Amplifier LTE Long Term Evolution MIMO Multiple Input Multiple Output MO Mobile Originated MSB Most Significant Bit MSL Moisture Sensitivity Level MT Mobile Terminated PAP Password Authentication Protocol PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 80 / 77 QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SMS Short Message Service TDD Time Division Duplexing TX Transmitting Direction UL Uplink UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code (U)SIM (Universal) Subscriber Identity Module Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOax Maximum Output High Level Voltage Value VOin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value
LTE Module Series EG61-NA Hardware Design EG61-NA_Hardware_Design 81 / 77 VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access

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