Quintic 9321-0 Bluetooth 4.0 Low Energy Module User Manual Format of Word 0 SYSTEM1

Quintic(Beijing) Microelectronics Co.,Ltd. Bluetooth 4.0 Low Energy Module Format of Word 0 SYSTEM1

QS9321-PLCS_Module User Manual6.3_2AB359321-0

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Document ID2300715
Application IDXGxaOvxo8zLQ6TZqOBklEQ==
Document DescriptionQS9321-PLCS_Module User Manual6.3_2AB359321-0
Short Term ConfidentialNo
Permanent ConfidentialNo
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Document TypeUser Manual
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Filesize56.98kB (712251 bits)
Date Submitted2014-06-19 00:00:00
Date Available2014-06-27 00:00:00
Creation Date2014-05-29 14:53:36
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Document TitleFormat of Word 0: SYSTEM1
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Document Author: Software

QS9321 Bluetooth 4.0 Low Energy Module
User Manual
Version 1.4
Rev1.4 (4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
VERSION HISTORY
Version
Comment
0.1
0.9
First draft
Update pin out description
1.0
1.1
1.2
First release
Add the photo of QS9321 with shielding box
Change transparent transfer baud rate to 115200. Connect Pin19 to Vin in figure 1 and 7
1.3
Add CE note
1.4
Add model definition, Layout Guide instruction and Soldering Recommendations
Rev1.4 (4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Table of Contents
Key Features ............................................................................................................................................... 1
Description .................................................................................................................................................. 3
2.1 Model Definition ................................................................................................................................. 3
2.2 Module description .............................................................................................................................. 3
Pin out ......................................................................................................................................................... 4
Electrical Characteristics ............................................................................................................................ 6
Layout and Physical Dimensions ................................................................................................................ 7
5.1 Physical dimensions ............................................................................................................................ 7
5.2 Layout guide ........................................................................................................................................ 7
Soldering Recommendations ...................................................................................................................... 9
Application Reference .............................................................................................................................. 10
7.1 Reference circuit schematic ............................................................................................................... 10
7.2 Feature ............................................................................................................................................... 10
7.3 Software ............................................................................................................................................. 10
Rev1.4 (4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
1 Key Features
 Bluetooth® 4.0 Low Energy wireless module






Frequency bands: 2400MHz to 2483.5MHhz
1Mbps on air data rate
Slave and Master mode operation
Support up to 8 simultaneous links in master mode
128-bit AES coprocessor
Complete BLE protocol stack and application profiles
 Integrated 32-bit Cortex-M0 MCU with


64KB system memory
128KB flash
 Ultra Low Power Consumption






2uA deep sleep mode
3uA sleep mode (32kHz RC OSC on)
DC-DC mode
 9.25mA RX current at 3V
 8.8mA TX current @0dBm Tx power at 3V
Non DC-DC mode
 13.6mA RX current at 3V
 13.3mA TX current @0dBm Tx power at 3V
Integrated DC-DC converter and LDO
Regulated 3V DC power supply or DC 3V coin cell
 High Performance




-95dBm RX sensitivity (Non DC-DC mode)
-93dBm RX sensitivity (DC-DC mode)
Tx power from -20dBm to 4dBm
Excellent link budget up to 99dB
 Complete Protocol Stack and Profile






Bluetooth® v4.0
Bluetooth® v4.0 host stack including L2CAP , SMP, ATT, GATT, GAP
Qualified application profiles and services
Controller subsystem QDID: B021031
Host stack subsystem QDID: B021098
Profile subsystem QDID: B021946
Rev1.4 (4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 1 of 13
 Ease of Design



Small form factor: QS93221-PLCS, 12x18x2.4mm; QS9321-PLCM, 12x18x1.8mm
Easy to use command set over UART/SPI to communicate with App MCU
PCB antenna with impedance matching
 Application








Sports & Fitness
Healthcare & Wellness
Remote Control
PC Peripherals (mouse, keyboard)
Mobile Phone Accessories
Home/building Automation
Industrial automation
Wireless Sensor Networks
Rev1.4(4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 2 of 13
2 Description
2.1 Model Definition
Explain: 1. QS9321-PLCM, without shielding box, FCC ID: 2AB359321-1.
2. QS9321-PLCS, with shielding box, the circuit design is the same as QS9321-PLCM,
FCC ID: 2AB359321-0.
2.2 Module description
QS9321 is a compact, surface mount Bluetooth 4.0 Low Energy (BLE) compliant wireless module. It
integrates an advanced single-chip BLE SoC chip – QN9021 with RF circuit and PCB antenna in a compact
module. Embedded 16 MHz and 32.678 kHz crystals are used for clock generation. Impedance matching
provides optimal radio performance with extremely low spurious emissions. QS9321 can be used directly
with a 3V coin cell battery or 3V DC power supply.
Small size gives good radiation efficiency with low price even when the module is used in layouts with
very limited space and easy modular handling.
QS9321 offers all Bluetooth low energy features: radio, stack, profiles and application space for
customer applications, so no external processor is needed. QS9321 can also be used to transfer raw data
between each other through the factory built-in application.
The pre-qualified module enables users to add Bluetooth Low Energy to traditional products within the
shortest time. QS9321 is leading the way for the new generation of Bluetooth low energy modules.
Rev1.4(4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 3 of 13
3 Pin out
U4
25
24
23
22
P3.1_ADC+
P3.0_ADCVDD_IDC
GND
GND
/RSTN
P2.3_I2C-SDA
P2.4_I2C-SCL
P1.0_SPI1-MISO
P1.1_SPI1-MOSI
P1.2_SPI1-CS
P1.3_SPI1-CLK
GND
17
16
15
14
13
12
11
10
EXT_VCC
SWCLK
SWDIO
XTAL_32K_IN
XTAL_32K_OUT
P0.3_INT0
P0.0_UART0-TX
P1.7_UART0-RX
21
20
19
18
GND
GND
GND
GND
Figure 1
PCB Antenna pin out
Table 1 Pin out description
PIN
NAME
FUNCTION
DESCRIPTION
GND
/RSTN
P2.3/SDA
Ground
Digital Input
Digital in/out
Should be connected to ground plane on application PCB
Hardware reset, active low.
GPIO / I2C data with pull-up
P2.4/SCL
Digital in/out
GPIO / I2C clock
P1.0/SPI_MISO
P1.1/SPI_MOSI
Digital in/out
Digital in/out
GPIO / SPI data master in/slave out
GPIO / SPI data master out/slave in
P1.2/SPI_CS
P1.3/SPI_CLK
GND
Digital in/out
Digital in/out
Ground
GPIO / SPI chip select
GPIO / SPI clock
Should be connected to ground plane on application PCB
10
11
P1.7/UART_RX
P0.0/UART_TX
Digital input
Digital output
GPIO / UART RX data input
GPIO / UART TX data output
12
P0.3/INT0
Digital in
GPIO / Interrupt
13
14
32K_CLOCK1
32K_CLOCK2
Analog in
Analog out
Not connected
Not connected
15
SWDIO
Digital in/out
SWD data with pull-up
16
SWCLK
Digital in
SWD clock input with pull-up
17
18
VCC
GND
Power
Ground
Power supply (2.4~3.6V)
Should be connected to ground plane on application PCB
19
VDD_IDC
Power
Not connected
Rev1.4(4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 4 of 13
20
21
P3.0/ADCP3.1/ADC+
Analog in
Analog in
GPIO / ADCGPIO / ADC+
22
GND
Ground
Should be connected to ground plane on application PCB
23
24
GND
GND
Ground
Ground
Should be connected to ground plane on application PCB
Should be connected to ground plane on application PCB
25
GND
Ground
Should be connected to ground plane on application PCB
Rev1.4(4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 5 of 13
4 Electrical Characteristics
Table 2 Recommended Operating Conditions
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
VCC
Power supply
Relative to GND
2.4
3.0
3.6
TA
Operating temperature
-40
+25
+85
℃
MIN
TYP
MAX
UNIT
Table 3 Current Consumption
SYMBOL
CONDITIONS
Icc
Deep sleep mode
uA
Sleep mode
uA
Idle mode (w/o DC-DC)
0.84
mA
MCU @8MHz (w/o DC-DC)
1.35
mA
RX mode(w/o DC-DC)
13.6
mA
RX mode (w/t DC-DC)
9.25
mA
TX mode @0dBm Txpower (w/o DC-DC)
13.3
mA
TX mode @0dBm Txpower ( w/t DC-DC)
8.8
mA
(Typical values are TA = 25℃ and VCC =3V)
Notes:
1. Current Consumption includes analog and digital.
2. Depend on IO conditions.
3. Deep sleep mode: digital regulator off, no clocks, POR, RAM/register content retained
4. Sleep mode: digital regulator off, 32k RC OSC on, POR, sleep timer on, and RAM/register content retained
5. Idle: 16MHz OSC on, no radio or peripherals, 8 MHz system clock and MCU idle (no code execution)
6. MCU@8 MHz: MCU running at 8 MkHz RC OSC clock, no radio or peripherals
7. RX sensitivity is -95dBm sensitivity when DC-DC is disabled.
8. RX sensitivity is -93dBm sensitivity when DC-DC is enabled.
Rev1.4(4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 6 of 13
5 Layout and Physical Dimensions
5.1 Physical dimensions
Figure 2
Physical dimensions and pinout (mm)
5.2 Layout guide
For optimal performance of the antenna place the module at the position of the PCB as shown in the
following figures. Do not place any metal (traces, components, battery etc.) within the clearance area of
the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND
pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply
voltage lines.
Place nothing around the antenna for the high antenna performance as shown in Figure 3. If can’t
layout as aforesaid, avoid placing GND plane closer than 5 mm as shown in Figure 4 and any other dielectric
material closer than 1 mm from the antenna as shown in Figure 5. Anything closer than this distance from
the antenna will detune the antenna to lower frequencies and reduce the RF power.
Rev1.4(4/23)
Confidential A
Figure 3
Layout for high performance
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 7 of 13
Figure 4
Figure 5
Rev1.4(4/23)
Confidential A
Layout when GND plane around antenna
Layout when any dielectric material around antenna
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 8 of 13
6 Soldering Recommendations
QS9321 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used
is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and
particular type of solder paste used. Consult the datasheet of particular solder paste for profile
configurations.. Since the profile used is process and layout dependent, the optimum profile should be
studied case by case. Thus following recommendation should be taken as a starting point guide.
- Refer to technical documentations of particular solder paste for profile configurations
- Avoid using more than one flow.
- Aperture size of the stencil should be 1:1 with the pad size.
Rev1.4(4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 9 of 13
7 Application Reference
QS9321 integrates BLE SoC chip – QN9021 with RF circuit and PCB antenna in a compact module. It can
be used directly with a 3 V coin cell battery or 3V DC regulated power supply.
When QS9321 is used as a MCU with BLE feature, program flow can refer to the QN9021’s user manual.
When QS9321 is used as only a RF module for transfer raw data though BLE 4.0 wireless system by the
built-in application, the reference circuit schematic and programming guide see the following section.
7.1 Reference circuit schematic
Figure 6
Reference circuit schematic
7.2 Feature


UART Baud Rate : 115200
Length of frame: <=120byte
7.3 Software
(a) State indicate
P23(output)
Rev1.4(4/23)
Confidential A
P24(output)
STATE
Sleep
Advertise
Connect Empty
Connect Full
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 10 of 13
(b) State change:
GPIO
Function
timer cycle
P03
State change
t1
Remark
t1>=1ms ;Falling edge
State Change
Init
10s Time out
Sleep
Advertising
Wait Master connect
State Change
Figure 7
Connect
State Change
state change
(c) Data transmit
GPIO
Function
timer cycle
P12
RX Wakeup
Remark
Falling edge
P23
P24
P12
Data 1 Data 2
UART_RX
Data n
t2
Figure 8
Waveform of module receiving UART data
NOTE: (1) T2>=1ms.
(2) RX Wakeup pin should keep low until one frame sent completed.
Rev1.4(4/23)
Confidential A
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Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 11 of 13
connected
Set P12=0;
Delay(1ms);
If(P24==0);
fault
ture
Uart_tx_frame(num);
Tx_num -=num;
Note:1frame<=20byte
If tx_num!=0
ture
fault
Set P12=1;
Figure 9
Rev1.4(4/23)
Confidential A
Flow chart of control
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 12 of 13
Note:
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference.
(2) this device must accept any interference received, including interference that may cause undesired operation.
changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
Please notice that if the FCC identification number is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label referring to the enclosed
module. This exterior label can use wording such as the following: “Contains FCC ID:2AB359321-1 or FCC ID:
2AB359321-0” any similar wording that expresses the same meaning may be used.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with a minimum distance of 5mm between the radiator & your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Rev1.4(4/23)
Confidential A
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
Page 13 of 13

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