RF Link Technology UM01C 2.4GHz 1T1R USB Module User Manual
Shenzhen RF-Link Technology Co.,Ltd 2.4GHz 1T1R USB Module
User manual
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SPECIFICATIONS
IEEE 802.11 b/g/n 2.4GHz 1T1R
Wi-Fi 1T1R Module
WL-UM01C-7601 (USB module)
Version 1.0
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Contents
1. Change History of Revision.....................................................................................................3
2. Overview...........................................................................................................................................4
3. Features...........................................................................................................................................4
4. Applications........................................................................................................................................5
5. General Specification..........................................................................................................................5
6. Block Diagram...............................................................................................................................6
7. Electrical Specifications.......................................................................................................................6
8. Pin Definition........................................................................................................................8
9. Size reference.............................................................................................................................9
10. USB interface electrical characteristics.....................................................................................10
11. WIFI AN...........................................................................................................................................10
12. Recommended Reflow Profile...............................................................................11
13. RoHS compliance................................................................................................................11
14. Wireless module before the SMT note...............................................................................12
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Change History of Revision
Revisio Date Contents of Revision Change Remark
1.0 2013/01/02 首次发布产品规格书 2013/01/02
1.0 2014/04/12 添加b/g/g的RX参数 2014/04/12
1.0 2014/06/27
更新模块图片（底层改为铺白油），修改
第四部分的操作温度 2014/06/27
1.0 2016/05/27
更改页眉页脚的公司logo和网址，更改模
块储存温度，添加模块贴片注意事项和包
装说明
2016/05/27
1.0 2017/03/14
1.更改公司名称
2.新增加目录及12部分RoHS compliance 2017/03/14
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1. Overview
The UM01C-7601 is a highly integrated Wi-Fi module which supports
150 Mbps PHY rate. It fully complies with IEEE 802.11n and IEEE
802.11 b/g standards, offering feature-rich wireless connectivity.At high
standards,and delivering eliable,cost-effective throughput om an extended
distance.Optimized RF architecture and baseband algorithms provide
superb performance and low power consumption. Intelligent MAC design
deploys a high efficient DMA engine and hardware data processing
accelerators which offloads the host processor.The MT7601 is designed
to support standard based features in the areas of security, quality of
service and international regulations,giving end users the greatest
performance any time and in any circumstance.
2. Features
IEEE 802.11 b/g/n client
Embedded high-performance 32-bit RISC microprocessor
Highly integrated RF with 55nm CMOS technology
1T1R mode with support of 150Mbps PHY rate
Integrate high efficiency switching regulator
Best-in-class power consumption performance
Compact 5mm x 5mm QFN40L package
1/2/3/4-wire PTA Wi-Fi / Bluetooth coexistence support
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802.11 d/h/k compliant
Security support for WFA WPA/WPA2 personal, WPS2.0, WAPI
Supports 802.11w protected managed frames
QoS support of WFA WMM, WMM PS
Supports Wi-Fi Direct
Fully compliance with USB v2.0 High-speed mode
Per packet transmit power control
Antenna diversity
Auto-calibration
3. Applications
Desk-Top PC
Note-book（*）
TV
Blue-ray Disk
Tablet PC （*）
Set-top box
4. General Specification
Model WL-UM01C-7601-V1.0
Product Name WLAN 11n USB module
Major Chipset MTK 7601
Standard 802.11b/g/n
Data Transfer
Rate
1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and
maximum of 150Mbps
（*）：Host should apply C2PC for SAR test ，etc first before sell
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Modulation
Method BPSK/ QPSK/ 16-QAM/ 64-QAM
Frequency Band 2.412-2.462 GHz ISM Band
Spread Spectrum
IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11g/n:OFDM (Orthogonal Frequency Division
Multiplexing)
Operation Mode Ad hoc, Infrastructure
Operation Range Up to 180 meters in open space
LED
OS Support Windows 2000,XP32-64,Vista 32/64,Win7
32/64,Linux,Mac, Android, WIN CE
Security WEP, TKIP, AES, WPA, WPA2
Interface USB 2.0
Power
Consumption DC 3.3V
Operating
Temperature 0 ~ +70° C ambient temperature
Storage
Temperature -10 ~ 80°C ambient temperature
Humidity 5 to 90 % maximum (non-condensing)
Dimension 12.9032 x 12.192 x 1.6mm (LxWxH) +-0.2MM
5. Block Diagram
6. Electrical Specifications
1) DC Characteristics
Current Consumption Min. Typ. Max. Unit
TX Mode - 110 - mA
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2) RF Characteristics for IEEE802.11b ( 11Mbps mode unless otherwise specified)
Items Contents
Specification IEEE802.11b
Mode CCK
Channel frequency 2412-2462 MHz
Data rate 1,2,5.5,11Mbps
RX (per≤85 dBm@8%) -85 dBm
TX Characteristics Min. Typ. Max. Unit
Power Level (18±1dBm) 18 dBm
EVM (≤-18) -18 dB
3) RF Characteristics for IEEE802.11g ( 54Mbps mode unless otherwise specified)
Items Contents
Specification IEEE802.11g
Mode OFDM
Channel frequency 2412-2462 MHz
Data rate 6,9,12,18,24,36,48,54Mbps
RX (per≤70 dBm@10%) -70 dBm
TX Characteristics Min. Typ. Max. Unit
Power Level (18±1dBm) 18 dbm
EVM (≤-28) -28 dm
4) RF Characteristics for IEEE802.11n (BW20_MCS7)
Items Contents
Specification IEEE802.11n
Mode BW20_MCS7 65 Mbps
Channel frequency 2412-2462MHz
RX (per≤65 dBm@10%) -65 dBm
TX Characteristics Min Typ Max Unit
Power Level (16±1dBm) 16 dbm
EVM (≤-28) -28 dm
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5) RF Characteristics for IEEE802.11n (BW40_MCS7)
Items Contents
Specification IEEE802.11n
Mode BW40_MCS7 135 Mbps
Channel frequency 2422-2452 MHz
RX (per≤65 dBm@10%) -65 dBm
TX Characteristics Min. Typ. Max. Unit
Power Level (16±1 dBm) 16 dBm
EVM (≤-28) -28 dB
7. Pin Definition
Pin Definition I/O Power Description
1 3.3V VDD3.3V±0.1V
2 D- USB D-
3 D+ USB D+
4 GND Ground
5 GND Ground
6 ANT WIFI ANT OUTPUT
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The picture of top The picture of bottom
8.Size reference
Dimensions
(mm)
Length Width Height
12.9032 12.192 1.6
(Tolerance:±0.2mm) (Tolerance:±0.2mm) (Tolerance:±0.2mm)
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9.USB interface electrical characteristics
10.WIFI ANT
1. Above the dotted box part of the antenna matching is needed, the actual
antenna matching electronic parameters shall prevail.
2.For RF part layout to do 50 ohm impedance. can't go on 90°of layout .The line length
can't more than 20 mm.
注明：请一定要在焊天线端加一个 TVS 管，防止 ESD 静电打坏 WIFI 模组（如上图参考电路）.
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11.Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
ENVIRONMENTAL
Operating
Operating Temperature: 0°C to +70 °C
Relative Humidity: 5-90% (non-condensing)
Storage
Temperature: -10°C to +80°C (non-operating)
Relevant Humidity: 5-95% (non-condensing)
12. RoHS compliance.
This product is RoHS compliance.
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13.Wireless module before the SMT note:
1.When customers Open stencil must be sure the
hole bigger to the Wireless module plate, please
press 1 to 1 and 0.7 mm is widened to open outward,
the thickness of 0.12 mm.
2.Can't get the wifi module bare hands when
needs,must we wear the gloves and static ring.
3.The furnace temperature according to the size of
the customer the mainboard ,generally like to stick on
a tablet standard temperature of 250 + - 5,can do 260
+ - 5.
Storage and use Wifi module control should pay
attention to the following matters:
Module of the storage life of vacuum
packaging：
1-1.Storage life ：12 months. Storage
conditions:<40 . Relative humidity:<90%R.H.℃
1-2.After this bag is opened , devices that will be
subjected to infrared reflow, vapor-phase reflow, or
equivalent processing must be :
1-3.Check the humidity card :stored at
≦20%RH.If :30%~40%(pink)or greater than
40%(red).Labeling module has moisture absorption.
① Mounthed within 168 hours at factory
≦℃
conditions of: t 30% ，≦60%R.H.
② Once opened, the workshop the
preservation of life for 168 hours.
1-4.If baking is required,devices may be baked for:
① Modules must be to remove module
moisture problem.
② Baking temperature: 125 , 8 hours.℃
③ After baking, put proper amount of
desiccant to seal packages.
1-5. The actual number of module vacuum packing
which is based on the actual number of packages to
the customer requirements, vacuum packing of
picture<1>
2.Module reel packaging items as follows.
2-1.Storage life ：12 months. Storage
conditions:<40 . Relative humidity:<90%R.H.℃
2-2.Module apart packing after 168 hours，To launch
13.Wifi
模块贴片装机前注意事项：
1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大，请按 1
比1再向外扩大 0.7mm 比例开钢网，厚度按 0.12mm.
2.有需要拿 wifi 模块时不可以光手去拿，一定要戴上手套以
及静电环.
3.过炉温度要根据客户主板的大小而定，一般像平板电脑上
的标准温度为250+-5°，也可以做到260+-5°
Wifi
模块储存及使用管制应注意事项如下：
1.模块的真空包装之储存期限：
1-1.保存期限：12个月，储存环境条件：温度在：<40℃，相
对湿度：<90%R.H.
1-2.模块包装被拆后，SMT 组装之时限：
1-3. 检查湿度卡：显示值应小于30% （蓝色），如：
30%~40%(粉红色）或者大于40%（红色）表示模块已吸湿
气.
① 工厂环境温度湿度管制：≦℃
30% ，≦60%R.H。
② 拆封后，车间的保存寿命为 168 小时.
1-4.如在拆封后的 168 个小时内未使用完，需要烘烤，烘烤
条件如下：
① 模块须重新烘烤，以除去模块吸湿问题.
② 烘烤温度条件：125℃，8小时.
③ 烘烤后，放入适量的干燥剂再密封包装.
1-5. 模块真空包装数量以客户要求的实际包装数量为准，真
空包装图片<1>
2.模块卷盘包装事项如下：
2-1.保存期限：12个月，储存环境条件：温度在：<40℃，相
对湿度：<90%R.H.
2-2.模块拆开包装168小时后，如要上线贴片需要重新烘烤，
以除去模块吸湿问题，烘烤温度条件：125℃，8小时。
2-3. 模块卷盘包装以客户要求的实际包装数量为准,卷盘包
装图片<2>
3.模块托盘包装事项如下：
3-1.保存期限：3个月，储存环境条件：温度在：<40℃，相
对湿度：<90%R.H.
3-2.模块如在 48 小时内未使用，在上线之前需要进行烘烤，
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patch need to bake, to remove the module
hygroscopic, baking temperature conditions：125℃，
8hours.
2-3. The actual number of module reel packing
which is based on the actual number of packages to
the customer requirements, Reel packing of
picture<2>
3.Module pallet packaging items as follows：
3-1.Storage life：3 months. Storage conditions:<40 . ℃
Relative humidity:<90%R.H.
3-2.Module if not used within 48 hours, before launch
the need for baking, baking temperature: 125 , 8 ℃
hours.
3-3. Pallet packaging each plate is 100 PCS.The
actual number of module pallet packing which is
based on the actual number of packages to the
customer requirements.
烘烤温度条件：125℃，8小时。
3-3. 托盘包装每盘为 100pcs，模块托盘包装以客户要求的
实际包装数量为准.
注：以上包装方式根据客户要求而定，包装以实际出货为准。
FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment.
The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in
any portable device .
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
This modular must be installed and operated with a minimum distance of 20 cm between the radiator and
user body.
If the FCC identification number is not visible when the module is installed inside another device, then the
outside of the device into which the module is installed must also display a label referring to the enclosed
module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID:
2AGQ3UM01C Or Contains FCC ID: 2AGQ3UM01C”
When the module is installed inside another device, the user manual of the host must contain below warning
statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired
operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described
in the user documentation that comes with the product.
Any company of the host device which install this modular with limit modular approval should perform the
test of radiated emission and spurious emission according to FCC part 15C : 15.247 and 15.209 requirement,
Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirement，then the host can be sold
legally.