Raytac MDBT42V BT 4.2 Module User Manual MDBT42V MDBT42V P

Raytac Corp. BT 4.2 Module MDBT42V MDBT42V P

Users Manual

Version: AIssued Date: 2017/08/07Approval Sheet (產品承認書)產品名稱 (Product): BT 4.2 Module (nRF52832)產品型號 (Model No.): MDBT42V & MDBT42V-P Series
Index1. Overall Introduction ...................................................................................................... 3 1.1. Application ............................................................................................................ 3 1.2. Features ............................................................................................................... 4 1.3. Profile & Service Information ................................................................................ 5 2. Product Dimension ....................................................................................................... 6 2.1. PCB Dimensions & Pin Indication ......................................................................... 6 2.2. Recommended Layout of Solder Pad ................................................................... 8 2.3. RF Layout Suggestion (aka Keep-Out Area) ........................................................ 9 2.4. Footprint & Design Guide ..................................................................................... 9 2.5. Pin Assignment ................................................................................................... 10 2.6. GPIO Located Near the Radio ............................................................................ 12 3. Main Chip Solution ...................................................................................................... 12 4. Specification ................................................................................................................ 13 4.1. Absolute Maximum Ratings ................................................................................ 13 4.2. Operation Conditions .......................................................................................... 13 4.3. Electrical Specifications ...................................................................................... 14 5. FCC Compliance .......................................................................................................... 19 6. IC Caution .................................................................................................................... 21 7. NCC 警語 ...................................................................................................................... 22
3 1. Overall IntroductionRaytac’s MDBT42V & MDBT42V-P is a BT 4.0, BT 4.1 and BT 4.2 stack (Bluetooth low energy or BLE) module designed based on Nordic nRF52832 SoC solution, which incorporates: GPIO, SPI, UART, I2C, I2S, PWM and ADC interfaces for connecting peripherals and sensors.Features of the module:1. Dual Transmission mode of BLE & 2.4Ghz RF upon customer preference.2. Compact size with (L) 8.4 x (W) 6.4 x (H) 1.75 or 1.5 mm.3. Low power requirements, ultra-low peak, average and idle mode power consumption.4. Be compatible with a large installed base of mobile phones, tablets and computers.5. Fully coverage of BLE software stack. See 1.3 Profile & Service Information.6. BLE & RF transmission switching helps products fit all operation system and mosthardware.1.1. Application‧IoT‧Home automation‧Sensor networks‧Building automation‧Personal Area Networks‧Health / fitness sensor and monitor device‧Medical devices‧Key-fobs and wrist watches‧Interactive entertainment devices‧Remote control‧Gaming controller‧Beacons‧A4WP wireless chargers and devices‧Remote control toys‧Computer peripherals and I/O devices‧Mouse‧Keyboard‧Multi-touch trackpad
4 1.2. Features‧Multi-protocol 2.4GHz radio‧ARM® Cortex® -M4 32-bit processor with FPU, 64 MHz‧512KB flash programmed memory and 64KB RAM‧Software stacks available as downloads‧Application development independent from protocol stack‧On-air compatible with nRF51, nRF24AP and nRF24L series‧Programmable TX output power from -20dBm to +4dBm in 4dB steps‧RSSI‧RAM mapped FIFOs using EasyDMA‧Dynamic on-air payload length up to 256 bytes‧Flexible and configurable 20 pin GPIO‧Programmable peripheral interface - PPI‧Simple ON / OFF global power mode‧Full set of digital interface all with Easy DMA including:‧3 x Hardware SPI master ; 3 x Hardware SPI slave‧2 x two-wire master ; 2 x two-wire slave‧1 x UART (CTS / RTS)‧PDM for digital microphone‧I2S for audio‧Quadrature demodulator‧12-bit / 200KSPS ADC‧128-bit AES ECB / CCM / AAR co-processor‧Lowe cost external crystal 32MHz ± 40ppm for Bluetooth ; ± 50ppm for ANT Plus‧Lowe power 32MHz crystal and RC oscillators‧Wide supply voltage range 1.7V to 3.6V‧On-chip DC/DC buck converter‧Individual power management for all peripherals‧Timer counter‧5 x 32-bit‧3 x 24-bit RTC‧NFC-A tag interface for OOB pairing‧3x 4-channel pulse width modulator (PWM) units with EasyDMA
5 1.3. Profile & Service InformationProfile & Service are supported by MDBT42V & MDBT42V-P as below:Profile Description Service Description Alert Notification Profile Alert Notification Service Blood Pressure Profile Blood Pressure Service Device Information Service Cycling Speed & Cadence Profile Cycling Speed & Cadence Service Device Information Service Glucose Profile Glucose Service Device Information Service Health Thermometer Profile Health Thermometer Service Device Information Service Heart Rate Profile Heart Rate Service Device Information Service HID over GATT Profile HID Service Battery Service Proximity Profile Link Loss Service Immediate Alert Service TX Power Service Running Speed & Cadence Profile Running Speed & Cadence Service Device Information Service Time Profile Time Profile Service
6 2. Product Dimension2.1. PCB Dimensions & Pin Indication‧MDBT42VPCB SIZE: (L) 8.4 x (W) 6.4 x (H) 1.75 mm
7 ‧MDBT42V-PPCB SIZE: (L) 8.4 x (W) 6.4 x (H) 1.5 mm
8 2.2. Recommended Layout of Solder PadGraphs are all in Top View, Unit in mm.
9 2.3. RF Layout Suggestion (aka Keep-Out Area)Layout is suggested following below instruction to have better wireless performance. When design is not allowed to leave such space, please make sure to keep the “No-Ground-Pad” as wider as it can.2.4. Footprint & Design GuideClick to download.
10 2.5. Pin AssignmentPin No. Name Pin function Description (1) GND Ground The pad must be connected to a solid ground plane (2) SWCLK Digital input Serial Wire debug clock input for debug and programming (3) P0.21 Digital I/O General-purpose digital I/O RESET Configurable as system RESET pin (4) SWDIO Digital I/O Serial Wire debug I/O for debug and programming (5) P0.20 Digital I/O General-purpose digital I/O TraceCLK Trace port clock output (6) P0.16 Digital I/O General-purpose digital I/O TraceData(1) Trace port output (7) P0.15 Digital I/O General-purpose digital I/O TraceData(2) Trace port output (8) P0.14 Digital I/O General-purpose digital I/O TraceData(3) Trace port output (9) P0.12 Digital I/O General-purpose digital I/O (10) GND Ground The pad must be connected to a solid ground plane (11) P0.09 Digital I/O General-purpose digital I/O NFC1 NFC input NFC antenna connection (12) P0.08 Digital I/O General-purpose digital I/O (13) P0.10 Digital I/O General-purpose digital I/O NFC2 NFC input NFC antenna connection (14) P0.06 Digital I/O General-purpose digital I/O (15) P0.01 Digital I/O General-purpose digital I/O XL2 Analog input Connection to 32.768khz crystal (LFXO) (16) P0.00 Digital I/O General-purpose digital I/O XL1 Analog input Connection to 32.768khz crystal (LFXO) (17) P0.04 Digital I/O General-purpose digital I/O AIN2 Analog input SAADC/COMP/LPCOMP input (18) GND Ground The pad must be connected to a solid ground plane (19) P0.30 Digital I/O General-purpose digital I/O AIN6 Analog input SAADC/COMP/LPCOMP input (20) VDD Power Power-supply pin (21) DEC4 Power 1V3 regulator supply decoupling. Input from DC/DC converter. Output from 1V3 LDO . (22) DCC Power DC/DC converter output pin
11 Pin No. Name Pin function Description (23) P0.29 Digital I/O General-purpose digital I/O AIN5 Analog input SAADC/COMP/LPCOMP input (24) P0.28 Digital I/O General-purpose digital I/O AIN4 Analog input SAADC/COMP/LPCOMP input (25) P0.25 Digital I/O General-purpose digital I/O (26) P0.02 Digital I/O General-purpose digital I/O AIN0 Analog input SAADC/COMP/LPCOMP input (27) P0.03 Digital I/O General-purpose digital I/O AIN1 Analog input SAADC/COMP/LPCOMP input (28) P0.11 Digital I/O General-purpose digital I/O (29) GND Ground The pad must be connected to a solid ground plane
12 2.6. GPIO Located Near the RadioBelow remarks are extracted from Nordic’s nRF52832 Spec. Any updates shall refer to Nordic’s official release as final reference.3. Main Chip SolutionRF IC Crystal Frequency Nordic NRF52832 32MHZ
13 4. SpecificationAny technical spec shall refer to Nordic’s official documents as final reference.4.1. Absolute Maximum Ratings4.2. Operation Conditions
14 4.3. Electrical Specifications4.3.1. General Radio Characteristics4.3.2. Radio Current Consumption (Transmitter)
15 4.3.3. Radio Current Consumption (Receiver)4.3.4. Transmitter Specification4.3.5. Receiver Operation
16 4.3.6. RX Selectivity4.3.7. RX Intermodulation
17 4.3.8. Radio Timing Parameters4.3.9. RSSI Specifications
18 4.3.10. CPU4.3.11. Power Management
19 5. FCC ComplianceThis equipment has been tested and found to comply with the limits for a Class digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to the radio communications. However, there are no guarantees that interference will not occur in a particular installation. Troubleshooting If this equipment does cause harmful interference to radio reception, which can be determined by turning the equipment off and on, the user is encouraged to correct the interference by one or more of the following instructions. ．Reorient or relocate the receiving antenna. ．Increase the separation between the equipment and receiver. ．Consult dealer or an experienced radio technician.Conditions Operation is subject to the following conditions ．This device may not cause harmful interference. ．This device must accept any interference received, including interference that maycause undesired operation.FCC Caution This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.Any changes or modifications not expressly approved by the party responsible for compliance could void the authority to operate equipment.RF Exposure For body worn operation, this device has been tested and meets FCC RF exposure guidelines when used with an accessory that contains no metal and that positions the handset a minimum of 5mm from the body. Use of other accessories may not ensure compliance with FCC RF exposure guidelines.End Product Labeling This transmitter module is authorized only for use in device where the antenna may be
20 installed such that 5mm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following:Contains FCC ID: SH6MDBT42VManual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warming as shown in this manual.
21 6. IC CautionThis device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: ．This device may not cause interference ．This device must accept any interference, including interference that may cause undesired operation of the deviceRF exposure To comply with the FCC RF exposure compliance requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.L'exploitation est autorisée aux deux conditions suivantes: ．l'appareil ne doit pas produire de brouillage, et ．l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas être co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur.End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 5mm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following:Contains IC ID: 8017A-MDBT42VInstructions to OEM Integrators A User manual provided to the end user must indicate the operating requirements and conditions that must be observed to ensure compliance with the above-mentioned IC RF Exposure guideline. If this module is intended for use in a portable device, integrators are responsible for separate evaluation and/or approval to satisfy IC RF Exposure requirements.The antenna used this module is as follows;Antenna Type: Chip Antenna, PCB antenna Antenna Gain: -1.12dBi, -3.81dBi
22 7. NCC 警語根據 NCC 低功率電波輻射性電機管理辦法規定第十二條：經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性及功能。第十四條：低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。前項合法通信，指依電信法規定作業之無線電通信。低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。此模組於取得認證後將依規定於模組本體標示審驗合格標籤，並要求平台廠商於平台上標示。「本產品內含射頻模組：ID 編號 XXXXX」字樣

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