SOLiD 850C RDU MODULE(850C) User Manual 1

SOLiD, Inc. RDU MODULE(850C) Users Manual 1

Users Manual 1

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SMDR-NH124
Installation and Operation Manual
Document Reference:
Version:
V1.0
Document Status:
Release 1
Issue Date:
Jan. 02, 2009
Author:
K,E,HAN
Department:
SOLiD Technology
Authorizing Manager:
Youngshin Yeo
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REVISION HISTORY
Version
Issue Date
V 1.0
Jan. 02, 2009
No. of
Pages
Initials
Details of Revision Changes
Original
Technical Support
SOLiD serial numbers must be available to authorize technical support and/or to establish a
return authorization for defective units. The serial numbers are located on the back of the unit,
as well as on the box in which they were delivered. Additional support information may be
obtained by accessing the SOLiD Tehcnology, Inc. website at www.st.com or send email at
sjkim@st.co.kr.
This manual is produced by Global Business Division Business Team 1. Printed in Korea.
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Contents
Section1
Safety & Certification Notice................................................................... 8
Section2
System Overview ................................................................................... 10
2.1 General overview ......................................................................................... 11
2.2 System overview.......................................................................................... 12
Section3
System Specifications........................................................................... 14
3.1 System specifications ................................................................................. 15
3.1.1
Physical Specifications ......................................................................... 15
3.1.2
Optic wavelength and Laser power...................................................... 16
3.1.3
Environmental specifications ............................................................... 16
3.1.4
Operating Frequencies range ............................................................... 16
3.1.5
Specifications Per band ........................................................................ 17
Section4
System Configuration and Functions .................................................. 20
4.1 BIU (BTS Interface Unit) .............................................................................. 21
4.1.1
Specifications of BIU ............................................................................. 21
4.1.2
Block diagram of BIU............................................................................. 22
4.1.3
BIU parts ................................................................................................. 22
4.1.4
Function by unit ..................................................................................... 23
4.1.5
Front/rear panels of BIU ........................................................................ 27
4.2 ODU (Optic distribution Unit)...................................................................... 29
4.2.1
Specifications of ODU ........................................................................... 29
4.2.2
Block Diagram of ODU .......................................................................... 30
4.2.3
ODU parts ............................................................................................... 30
4.2.4
Function by unit ..................................................................................... 30
4.2.5
Front/rear panels of MHU ...................................................................... 30
4.2.6
Interface with BIU .................................................................................. 30
4.3 OEU (Optic Expansion Unit)........................................................................ 30
4.3.1
Specifications of OEU ........................................................................... 30
4.3.2
Block Diagram of OEU........................................................................... 30
4.3.3
OEU parts ............................................................................................... 30
4.3.4
Function by unit ..................................................................................... 30
4.3.5
Front/rear panels of OEU ...................................................................... 30
4.4 ROU (Remote Optic Unit) ............................................................................ 30
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4.4.1
Specifications of ROU ........................................................................... 30
4.4.2
Block Diagram of ROU .......................................................................... 30
4.4.3
ROU parts ............................................................................................... 30
4.4.4
Function by unit ..................................................................................... 30
4.4.5
Bottom of ROU ....................................................................................... 30
Section5
System Installation & Operation........................................................... 30
5.1 BIU Installation ............................................................................................. 30
5.1.1
BIU Shelf Installation ............................................................................. 30
5.1.2
BIU Power Cabling................................................................................. 30
5.1.3
RF Interface at BIU................................................................................. 30
5.1.4
MDBU insertion ...................................................................................... 30
5.1.5
ODU Interface ......................................................................................... 30
5.1.6
Consumption Power of BIU .................................................................. 30
5.2 ODU Installation ........................................................................................... 30
5.2.1
ODU Shelf Installation ........................................................................... 30
5.2.2
ODU Power Cabling ............................................................................... 30
5.2.3
ODU Optic Cabling................................................................................. 30
5.2.4
Insert DOU to ODU................................................................................. 30
5.2.5
Consumption Power of ODU................................................................. 30
5.3 ROU Installation ........................................................................................... 30
5.3.1
ROU Enclosure installation................................................................... 30
5.3.2
ROU Power Cabling ............................................................................... 30
5.3.3
Optical Cabling ...................................................................................... 30
5.3.4
Insertion of RDU..................................................................................... 30
5.3.5
Consumption of RDU............................................................................. 30
5.4 OEU Installation ........................................................................................... 30
5.4.1
OEU Shelf installation ........................................................................... 30
5.4.2
OEU Power Cabling ............................................................................... 30
5.4.3
OEU Optic Cabling................................................................................. 30
5.4.4
Insert DOU to OEU ................................................................................. 30
5.4.5
Consumption Power of OEU................................................................. 30
5.5 System Operation and Alarm Status .......................................................... 30
5.5.1
System setting and operation............................................................... 30
5.5.2
BIU Alarms.............................................................................................. 30
5.5.3
ODU Alarms............................................................................................ 30
5.5.4
OEU Alarms ............................................................................................ 30
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5.5.5
ROU Alarms............................................................................................ 30
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Contents of Figure
Figure 2.1 – Basic system topology ........................................................... 12
Figure 2.2 – Expansion system topology................................................... 13
Figure 4.1 – BIU outer view ......................................................................... 21
Figure 4.2 – BIU mounting diagram............................................................ 22
Figure 4.3 – MDBU Outer Look ................................................................... 25
Figure 4.4 – MDBU Outer Look ................................................................... 25
Figure 4.5 – MCCU Outer Look ................................................................... 26
Figure 4.6 – MPSU Outer Look.................................................................... 27
Figure 4.7 – BIU front panel Outer Look..................................................... 27
Figure 4.8 – Rear panel Outer Look ............................................................ 28
Figure 4.9 – ODU Outer Look ...................................................................... 29
Figure 4.10 – ODU Inner Look ..................................................................... 30
Figure 4.11 – MDBU Outer Look.................................................................. 30
Figure 4.12 – 2Way Divider Outer Look...................................................... 30
Figure 4.13 – BIU front panel Outer Look................................................... 30
Figure 4.14 – Rear panel Outer Look .......................................................... 30
Figure 4.15 – Interface between MHU and ODU ........................................ 30
Figure 4.16 – OEU Outer Look .................................................................... 30
Figure 4.17 – OEU Inner Look ..................................................................... 30
Figure 4.18 – MDBU Outer Look ................................................................. 30
Figure 4.19 – EWDM Outer Look................................................................. 30
Figure 4.20 – ECPU Outer Look .................................................................. 30
Figure 4.21 – ERFM Outer Look .................................................................. 30
Figure 4.22 – ERFM Outer Look .................................................................. 30
Figure 4.23 – OEU front panel Outer Look ................................................. 30
Figure 4.24 – Rear panel Outer Look .......................................................... 30
Figure 4.25 – ROU Outer Look .................................................................... 30
Figure 4.26 – ROU Inner Look ..................................................................... 30
Figure 4.27 – RDU Outer Look .................................................................... 30
Figure 4.28 – R OPTIC Outer Look.............................................................. 30
Figure 4.29 – RCPU Outer Look .................................................................. 30
Figure 4.30 – Multiplexer Outer Look ......................................................... 30
Figure 4.31 – RU Bottom Look .................................................................... 30
Figure 5.1 – RACK Installation .................................................................... 30
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Figure 5.2 – 800PS BDA Interface using Circulator .................................. 30
Figure 5.3 – 800PS BDA Interface using Duplexer .................................... 30
Figure 5.4 – Optical cable of SC/ACP Type ................................................ 30
Figure 5.5 – How to install ROU .................................................................. 30
Figure 5.6 – Dimension used to install ROU on the WALL ....................... 30
Figure 5.7 – Optical cable of SC/ACP Type ................................................ 30
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Section1
Safety & Certification Notice
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“Only qualified personnel are allowed to handle this unit. Read and obey all the
warning labels attached in this user manual”
Any personnel involved in installation, operation or service of the SOLiD Technology
repeaters must understand and obey the following:
- Obey all general and regional installation and safety regulations relating to work on high
voltage installations, as well as regulations covering correct use of tools and personal
protective equipment.
- The power supply unit in repeaters contains dangerous voltage level, which can cause electric
shock. Switch the mains off prior to any work in such a repeater. Any local regulations are to
be followed when servicing repeaters.
- The repeater cover should be (door) securely fastened in open position, e.g. by tying it up, at
outdoor work in order to prevent door from slamming due to wind causing bodily harm or
damage.
- Use this unit only for the purpose specified by the manufacturer. Do not carry out any
modifications or fit any spare parts which are not sold or recommended by the manufacturer.
This could cause fires, electric shock or other injuries.
- Any repeater, including this repeater, will generate radio signals and thereby give rise to
electromagnetic fields that may be hazardous to the health of any person who is extensively
exposed to the signals at the immediate proximity of the repeater and the repeater antennas.
- Due to power dissipation, repeater may reach a very high temperature. Do not operate this
unit on or close to flammable materials.
- Do not use any solvents, chemicals, or cleaning solutions containing alcohol, ammonia, or
abrasives.
- Certification
z FCC : This equipment complies with the applicable sections of Title 47 CFR Parts
15,22,24 and 90
- Any changes or modifications not expressly approved by the manufacturer
could void the user’s authority to operate the equipment.
UL/CUL : This equipment complies with UL and CUL 1950-1 Standard for safety for
information technology equipment,including electrical business equipment
FDA/CDRH : This equipment uses a Class 1 LASER according to FDA/CDRH Rules.This
product conforms to all applicable standards of 21 CFR Chapter 1, Subchaper J, Part
1040
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Section2
System Overview
2.1 General overview
2.2 System overview
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2.1 General overview
SMDR-NH124 is a coverage system for in-building services delivering voice and data in high
quality and for seamlessly.
As a distributed antenna system, it provides analog and digital phone systems that are served in
multiple bands through one antenna.
The system covers general public institutions and private facilities.
Shopping malls
Hotels
Campus areas
Airports
Clinics
Subways
Multi-use stadiums, convention centers, etc.
The system helps improve in-building radio environments in poor condition and make better
poor RSSI and Ec/Io. By providing communication services at every corner of buildings, the
system enables users to make a call at any site of buildings.
The system uses both analog (AMPS) and digital (TDMA, CDMA and WCDMA) methods.
The SMDR-NH124 system supports communication standards and public interface protocols in
worldwide use.
Frequencies: VHF,UHF, 700MHz, 800MHz,850MHz 900MHz,1900MHz,2100MHz, etc.
Voice protocols: AMPS,TDMA, CDMA,GSM,IDEN, etc.
Data protocols: EDGE,GPRS,WCDMA,CDMA2000,Paging, etc.
SMDR-NH124 is in modular structure per frequency. To provide desired frequency in a building,
all you need to do is to insert a corresponding frequency module into each unit. As it delivers
multiple signals with one optical cable, the system, in one-body type, does not require additional
facilities whenever new frequency is added.
The system is featured with the following:
Flexibiltiy & Scalabiltiy
„
Support fiber-optic ports up to 39
„
Clustering multiple-buildings (campus) as one coverage
Modular structures
„
„
Modular frequency upgrade
Plug-in type module
Multi-Band, Multi Operator
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z
„
Signals with a plurality of service provider transmit simultaneously
„
Support multi-operator in a band
Low OPEX / CAPEX
„
Compact design
„
Upgradable design
„
Easy installation and maintenance
„
Web Based SNMP or GSM Modem or UDP support (Optional)
2.2 System overview
SMDR-NH124 is composed of devices given below.
Basically, the system consists of BIU (BTS Interfcace Unit), ODU (Optic distribution Unit) and
ROU (Remote Optic Unit). For addition of more ROUs, it has OEU (Optic Expansion Unit).
Figure 2.1 – Basic system topology
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Figure 2.2 – Expansion system topology
Table 3.1 – System topology Charts
System elements
Optical Loss [dBo]
Max. RUs
BIU – ODU(DOUx1) – ROU
1~5dBo
BIU – ODU(DOUx2) – ROU
1~5dBo
BIU – 4ODU(DOUx2) – ROU
1~5dBo
32
BIU – 4ODU(DOUx2)-OEU(DOUx2) – ROU
1~5dBo
39
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Section3
System Specifications
3.1 System specifications
3.1.1
Physical Specifications
3.1.2
Optic wavelength and Laser power
3.1.3
Environmental specifications
3.1.4
Operating Frequencies range
3.1.5
Specifications Per band
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3.1 System specifications
3.1.1
Physical Specifications
Parameter
RF Connectors
External
BIU
4 SMA type, female
ODU
OEU
2 SMA type, female
ROU
1N-type,female
1 RS-232 9-pin D-sub,
1 RS-232 9-pin
1 RS-232 9-pin
male
D-sub, male
(Per MDBU)
Alarm
connector
Terminal block,3pcs
(Dry contacts)
Serial
Interface
connector
Fiber connector
8pcs, SC/APC for
1 SC/APC for ODU
ROU
8 SC/APC for ROU
D-sub, male
1 SC/APC for ODU
EWDM Status
MDBU Status
Power On status
ALM status
MCPU
LED Alarm and
Status Indicator
Power On status
TX
Communication
RX
Communication
ALM status
LD status
PD1/2/3/4
DOU2 Status
LD status
PD1/2/3/4
Power On status
DC ALM status
LD status
PD1/2/3/4 status
LD status
PD1/2/3/4 status
System status
status
MPSU
PD status
DOU2 Status
status
LD status
DOU1 Status
DOU1 Status
Power on status
TX
Communication
System status
Power on status
TX1
Communication
RX1
Communication
TX2
Communication
RX2
Communication
ALM status
RX
Communication
Normal
AC Power
Range
120VAC 50/60Hz
Operating range
108~132VAC,50/60Hz
Normal range: -48 VDC
DC Power
Operating range:
Normal : -48 VDC
Operating range:
-40.8 ~ -57.6VDC
-40.8 ~ -57.6VDC
Power
168W
consumption
(Including ODU 4EA)
Enclosure
482.6(19”) x 221.5(5U)
482.6(19”)
Dimensions
x 450
43.6(1U) x 450
Weight[Full Load]
22.25Kg
5.7Kg
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48W
265W
(Including DOU2EA)
(Including RDU 3EA)
482.6(19”)
x 88.1(2U) x 450
9.3Kg
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420 x 530 x 258
35.45Kg
3.1.2
Optic wavelength and Laser power
Parameter
ODU
OEU
ROU
West optic
TX: 1550nm
TX: 1310nm
RX: 1310nm
TX: 1550nm
RX: 1550nm
East optic
RX: 1310nm
Wavelength
TX: 1310nm
RX: 1550nm
3dBm±1dBm to ROU
Output power
3dBm±1dBm to ROU,OEU
7dBm±1dBm to ODU
7dBm±1dBm to ODU
3.1.3
Environmental specifications
Parameter
BIU, ODU, OEU
Operating Temperature
-10
Operating Humidity, non condensing
3.1.4
to
+50°C
ROU
-10 to +50°C
5% to 90%
Operating Frequencies range
Standard
Unit naming
Description
Frequency range
TX(MHz)
RX(MHz)
iDEN
700P
Public safety
764 to 776
794 to 806
iDEN
800P
Public safety
851 to 869
806 to 824
Cellular
850C
Cellular
869 to 894
824 to 849
Iden
900I
SMR
929 to 940
896 to 902
Paging
900 PA
Paging
929 to 930
896 to 902
PCS
1900P
PCS
1930 to 1995
1850 to 1915
AWS-1
AWS-1
AWS-1
2110 to 2155
1710 to 1755
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3.1.5
Specifications Per band
700MHz Public safety
Typical
Parameters
TX
Remarks
RX
Bandwidth
12MHz
12MHz
System ripple
≤4dB
≤4dB
Input Power level
-20 to +10dBm
≤-50dBm
Output power
+23dBm
+0dBm
System Gain
43dB
50dB
Gain Control range
18 to 43dB
30 to 50dB
IMD
50dBc
IP3
+25dBm
Noise figure
15dB
Total
1ROU
800MHz Public safety
Typical
Parameters
TX
Remarks
RX
Bandwidth
18MHz
18MHz
System ripple
≤4dB
≤4dB
Input Power level
-20 to +10dBm
≤-50dBm
Output power
+23dBm
+0dBm
System Gain
43dB
50dB
Gain Control range
18 to 43dB
30 to 50dB
IMD
50dBc
IP3
+25dBm
Noise figure
15dB
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Total
1ROU
850MHz Cellular
Typical
Parameters
TX
Remarks
RX
Bandwidth
25MHz
25MHz
System ripple
≤4dB
≤4dB
Input Power level
-20 to +10dBm
≤-50dBm
Output power
+23dBm
+0dBm
System Gain
43dB
50dB
Gain Control range
18 to 43dB
30 to 50dB
IMD
50dBc
IP3
+25dBm
Noise figure
15dB
Total
1ROU
900MHz iDEN & Paging
Typical
Parameters
TX
Remarks
RX
Bandwidth
12MHz
6MHz
System ripple
≤4dB
≤4dB
Input Power level
-20 to +10dBm
≤-50dBm
Output power
+23dBm
+0dBm
System Gain
43dB
50dB
Gain Control range
18 to 43dB
30 to 50dB
IMD
50dBc
IP3
+25dBm
Noise figure
15dB
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Total
1ROU
1900MHz PCS
Typical
Parameters
TX
Remarks
RX
Bandwidth
65MHz
65MHz
System ripple
≤5dB
≤5dB
Input Power level
-20 to +10dBm
≤-50dBm
Output power
+26dBm
+0dBm
System Gain
46dB
50dB
Gain Control range
21 to 46dB
30 to 50dB
IMD
50dBc
IP3
+25dBm
Noise figure
15dB
Total
1ROU
1700MHz&2100MHz AWS-1
Typical
Parameters
TX
Remarks
RX
Bandwidth
45MHz
45MHz
System ripple
≤5dB
≤5dB
Input Power level
-20 to +10dBm
≤-50dBm
Output power
+26dBm
+0dBm
System Gain
46dB
50dB
Gain Control range
21 to 46dB
30 to 50dB
IMD
50dBc
IP3
+25dBm
Noise figure
15dB
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Total
1ROU
Section4
System Configuration and Functions
4.1 BIU (BTS Interface Unit)
4.2 ODU (Optic distribution Unit)
4.3 OEU (Optic Expansion Unit
4.4 ROU (Remote Optic Unit)
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4.1 BIU (BTS Interface Unit)
BIU provides TX signals from BTS or BDA for four ODUs (Optic Distribution Unit). This
unit separates RX signals given from ODUs from each other per frequency band.
Figure 4.1 – BIU outer view
4.1.1
Specifications of BIU
Item
Spec.
Remark
Size
482.6(19”) x 221.5(5U) x 450
mm
Weight
22.35 Kg
Power consumption
168 W
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Full Load
4.1.2
Block diagram of BIU
4.1.3
BIU parts
Figure 4.2 – BIU mounting diagram
No.
Unit
Description
Remark
Main Drive BTS Unit
MDBU
Amplify & adjust downlink RF signal
Amplify & adjust uplink RF signal
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Max 4EA
Main Com/Div Unit
MCDU
Combine 4EA downlink signal and divide 4EA signal to ODU
Combine 4EA uplink signal and divide 4EA signal to MDBU
Support VHF/UHF interface port
Main Central Processor Unit
Control and monitoring system status
MCPU
Control and monitoring with RS232
Have an access to upper-level network through GSM or
Ethernet
MPSU
Main Power Supply Unit
Input power: DC -48V, Output power: 9V, 6V
Mother Board
M/B
Provide signal interface and power for each unit
Provide three ports for dry contact
Shelf
4.1.4
19 inch, 5U
Function by unit
1) Main Drive BTS Unit (MDBU)
MDBU delivers TX signals of BTS or BDA to related devices and then delivers RX signals of the
devices to BTS or BDA. This unit can monitor TX input level. Using input AGC function, it
automatically adjusts input ATT. It also has ATT to adjust RX gain. MDBU is varied per
frequency band including the following:
No
Unit naming
In/out RF Port
Description
TX
RX
800PS
Single Band
2 Port
2 Port
850C
Single Band
2 Port
2 Port
1900P
Single Band
4 Port
4 Port
AWS-1
Single Band
4 Port
4 Port
800PS+900I+PA
Dual Band
4 Port
4 Port
850C+700PS
Dual Band
4 Port
4 Port
TBD
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800PS
800PS+900I+Paging
1900PCS
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850C
850C+700PS
Figure 4.3 – MDBU Outer Look
2) Main Com/Div Unit (MCDU)
MCDU combines TX signals that are delivered from MDBU per frequency band and delivers the
signals to four ODUs. This unit adds signals of FSK modem to the TX signals before sending
them to ROU. It also combines RX signals from up to four ODUs and sends them to up to four
MDBUs. In this case, the unit extracts signals of FSK modems, which are sent in a combined
form with RX signals, and then delivers the signals to MCU.
The unit has a port to interface with VHF&UHF signals. It has ATT for input monitoring and input
control.
Figure 4.4 – MDBU Outer Look
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3) Main Central Processor Unit (MCPU)
MCPU can inquire and control state of modules that are installed in BIU.
This unit can inquire and control state of four ODUs in total. Through communication, it also can
inquire and control ROU that is connected with lower parts.
In addition, the unit has RS-232C port for serial communication so that it can inquire and control
state of devices through PC. On the front panel, it has communication LED indicator to check
communication state with ROU. It also has ALM LED indicator to show whether a device gets
faulty.
For access to upper network, it has a port to insert Ethernet port and GSM modem in it.
Figure 4.5 – MCCU Outer Look
In the Main Central Processor Unit, a lithium battery is installed for RTC (Real Time Control)
function.
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE
DIPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS
[INSTRUCTION]
The equipment and accessories including inner lithium battery are to be disposed of safely after
the life span of them and national regulation must be observed. Do not attempt to replace the
lithium battery unless service personnel confirmation has first been obtained, to avoid any risk
of explosion.
4) Main Power Supply Unit (MPSU)
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MPSU receives -48V of input and outputs +6V and +9V of DC power.
On the front panel, this unit has an output test port and it also has DC ALM LED Indicator to
show whether output gets faulty.
Figure 4.6 – MPSU Outer Look
4.1.5
Front/rear panels of BIU
1) Front panel
Figure 4.7 – BIU front panel Outer Look
Item
1. MDBU LED
Description
LED to show whether MDBU is installed and gets faulty
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2. RF Monitor Port
3. Alarm LED & Reset
4. NMS(RS-232C port)
20dB Coupling compared with TX Input Level
20dB Coupling compared with RX Output Level
Communication state with devices, alarm status of the system and reset
switch
RS-232C port for communication and diagnosis of devices through
PC/laptop
Ethernet port for upper network
5. NMS(Ethernet port)
This equipment is indoor use and all the communication wirings are
limited to inside of the building
6. Pwr Test Port & ALM
Output DC power test port and ALM LED to show abnormal state, if any
7. Power switch
Power ON/OFF switch
2) Rear panel
Figure 4.8 – Rear panel Outer Look
Item
Description
1. External ALM Port
Input/output terminal for dry contact
2. GSM Modem Port
GSM Modem terminal for upper network (Optional)
3. V/UHF I/O Port
RF signal interface terminal of VHF&UHF
4. ODU I/O Port
RF signal interface terminal for ODU
5. ODU signal Port
Power and signal interface terminal for ODU
6. BTS/BDA I/O Port
Input/output interface terminal of BTS/BDA
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7. GND Port
System ground terminal
8. DC Input Port
Input terminal for DC -48V
4.2 ODU (Optic distribution Unit)
ODU receives TX RF signals from upper BIU and converts them into optical signals. The optical
signals are sent to ROU through optical cables. This unit converts optical signals from ROU into
RF signals and sends the converted signals to BIU.
For each shelf of the ODU, up to two DOUs (Donor Optic Unit) can be installed in it.
One DOU is supported with four optical ports. Therefore, one ODU can be connected with eight
ROUs.
Up to four ODUs can be connected with BIU.
Figure 4.9 – ODU Outer Look
4.2.1
Specifications of ODU
Item
Spec.
Remark
Size
482.6(19”) x 43.6(1U) x 450
mm
Weight
5.7 Kg
Power consumption
27 W
Confidential & Proprietary
29/87
Full Load
4.2.2
Block Diagram of ODU
4.2.3
ODU parts
Figure 4.10 – ODU Inner Look
Confidential & Proprietary
30/87

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