ST Microelectronics S R L ZB250A ZigBee Module User Manual SPZB250
ST Microelectronics S.R.L. ZigBee Module SPZB250
Users Manual
SPZB250 ZigBee module Features ■ Integrated 2.4GHz ,IEEE 802,15,4-compliant transceiver – 0 dBm nominal TX output power – -92 dBm RX sensitivity – + 2 dBm in boost mode – RX filtering for co-existence with IEEE 802.11g and Bluetooth devices – Integrated VCO and loop filter ■ Integrated IEEE 802.15.4 PHY and MAC 128kB Embedded flash and 5kB integrated RAM for program and data storage 17 GPIO with alternate functions: – GPIOs – UART – I 2C – SPI – ADC 2 16-bit general purpose timers; one 16-bit sleep timer ADC , sigma-delta converter with 12 bit resolution On board 24 MHz stable Xtal Selectable integrated RC oscillator ( typ 10KHz) or 32.768kHz Xtal for low power operation 1 µA power consumption in deep sleep mode Watchdog timer and power on reset Pins available for Non-intrusive debug interface (SIF) Single supply voltage 2.1 to 3.6 Vdc CE compliant FCC compliant ( FCC ID:S9NZB250A ) ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Applications ■ ■ ■ ■ ■ ■ Industrial controls Sensor networking Monitoring of remote systems Home applications Security systems Lighting controls September 2007 Description SPZB250 is a low power consumption ZigBee module based on SN250 ZigBee Network Processor which integrates a 2.4GHz, IEEE 802.15.4-compliant transceiver as well as IEEE 802.15.4 PHY and MAC. It enables OEMs to easily add wireless networking capability to any electronic device. Such a module is a very comprehensive solution to build sensors with meshing and self healing capability as required in a WSN scenario. 24 MHz high stability Xtal is available aboard the module to perform the timing requirements as per ZigBee specifications. An additional 32.768 kHz Xtal is provided for low power operation. A single supply voltage is requested to power the module. An integrated 2.5 GHz specific Murata antenna is aboard. The voltage supply also determines the I/O ports level allowing an easy interface with the host system. 128k flash and 5kbytes of static RAM are available for data and program storage. To support user defined applications, a number of peripherals such as GPIO,UART,I2C, ADC and general purpose timers are available and user selectable. The deep sleep mode with power consumption of less than 1 uA allows applications where the battery life is a key point. ( for other information and details, please refer to SN250 Datasheet available at www.st.com ) Rev 1 1/16 www.st.com 16 Contents SPZB250 Contents Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.3 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Appendix A FCC statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/16 A.1 Label instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 A.2 Special requirement for Modular application . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 SPZB250 Block diagram Block diagram Figure 1. Block diagram Vdd 32.768 kHz Xtal SIF GPIO RF antenna 24 MHz Xtal SN 250 Tranceiver Balun Filter CONTR SIGN Pin settings 2.1 Pin connections Figure 2. Pin connection diagram 3/16 Pin settings 2.2 SPZB250 Pin description Table 1. Pin n Pin description Pin name Direction GPIO6 I/O ADC2 Analog Description Digital I/O ADC input 2 TMR2CLK External clock input of timer 2 TMR1ENMSK External enable mask of timer1 GPIO5 I/O ADC1 Analog Digital I/O ADC Input 1 PTI_DATA Frame signal of PTI (Packet Trace Interface) GPIO4 I/O Digital I/O ADC0 Analog ADC Input 0 PTI_EN Frame signal of PTI (Packet Trace Interface) GPIO3 I/O Digital I/O SSEL SPI Master clock of Serial Controller SC2 TMR2IB.1 Capture of Input B of timer 1 RSTB Active low reset ( an internal pull-up of 30 kohm typ is provided) GPIO11 I/O Digital I/O CTS UART CTS handshake of serial controller SC1 MCLK SPI master clock of serial controller SC1 TMR2IA.1 Capture of Input A of timer 2 GPIO12 I/O Digital I/O RTS UART RTS handshake of serial controller SC1 TMR2IB.1 Capture of Input B of timer 2 GPIO0 I/O Digital I/O MOSI SPI master data out of serial controller SC2 MOSI SPI slave data in of serial controller SC2 TMR1IA.1 Capture of input A of timer 1 GPIO1 I/O MISO SPI master data in of serial controller SC2 MISO SPI slave data out of serial controller SC2 SDA I/O I2C data of serial controller SC2 TMR2IA.2 4/16 Digital I/O Capture of input A of timer 2 SPZB250 Pin settings Table 1. Pin n 10 Pin description (continued) Pin name Direction Description GPIO2 I/O Digital I/O MSCLK SPI master clock of serial controller SC2 MSCLK SPI slave clock of serial controller SC2 SCL I/O I2C clock of serial controller SC2 TMR2IA.2 Capture of Input B of timer 2 11 GND -- Ground 12 VDD Power 13 GPIO7 I/O ADC3 Analog 15 ADC Input 3 External regulator open collector output GPIO8 I/O Digital I/O Analog ADC reference output TMR1CLK External clock input of timer 1 TMR2ENMSK External enable mask of timer 2 IRQA External interrupt source A GPIO9 I/O Digital I/O TXD UART transmit data of serial controller SC1 MO SPI master data out of serial controller SC1 MSDA I/O I2C data of serial controller SC1 TMR1IA.2 GPIO10 16 Digital I/O REG_EN VREF_OUT 14 Input power supply I/O Capture of input A of timer 2 Digital I/O RXD UART receive data of serial controller SC1 MI SPI master data in of serial controller SC1 MSCL I/O I2C clock of serial controller SC1 TMR1IB.2 Capture of Input B of timer 2 17 SIF_CLK Non-intrusive debug Interface Serial interface clock signal ( internal pulldown) 18 SIF_MISO Non-intrusive debug Interface Serial interface master IN/ Slave Out Non-intrusive debug Interface Serial interface master Out/ Slave In To guarantee a proper signal level when in deep sleep mode connect a 10kΩ resistor to GND 19 SIF_MOSI 20 SIF_LOADB I/O Non-intrusive debug Interface Serial interface load strobe ( Open collector with internal pull-up) To improve noise immunity connect a 10kΩ resistor to VDD 5/16 Pin settings SPZB250 Table 1. Pin n Pin description (continued) Pin name Direction Description GPIO16 I/O Digital I/O TMR1OB Waveform output B of timer 1 TMR2IB.3 Capture of Input B of timer 2 IRQD External interrupt source D 21 GPIO15 I/O Digital I/O TMR1OA Waveform output A of timer 1 TMR2IA.3 Capture of Input A of timer 2 IRQC External interrupt source C 22 GPIO14 I/O Digital I/O TMR2OB Waveform output B of timer 2 TMR1IB.3 Capture of Input B of timer 1 IRQB External interrupt source B 23 24 6/16 GPIO13 I/O Digital I/O TMR2OA Waveform output A of timer 2 TMR1IA.3 Capture of Input A of timer 1 SPZB250 Maximum ratings Maximum ratings 3.1 Absolute maximum ratings Table 2. Absolute maximum ratings Values Symbol 3.2 Parameter Unit Min Max VDD Module supply voltage -0.3 3.6 VIN Input voltage on any digital pin -0.3 Vdd+0.3 Tstg Storage temperature -40 +85 °C Tsold Soldering temperature < 10s 240 Operating ranges Table 3. Operating ranges Values Symbol Parameter VDD Module supply voltage Tstg Operating ambient temperature Conditions - 20°C < T < 70 °C Unit Min Typ Max 3.1 3.3 3.6 +70 °C -20 7/16 Electrical characteristics SPZB250 Electrical characteristics 4.1 DC electrical characteristics Table 4. DC electrical characteristics Values Symbol Parameter Conditions Unit Min Typ Max IRX RX current ( boost mode) Vdd = 3.0 V, T = 25 °C 38 mA IRX RX current ( normal mode) Vdd = 3.0 V, T = 25 °C 36 mA ITX TX current ( boost mode) Vdd = 3.0 V, T = 25 °C 42 mA ITX TX current (normal mode) Vdd = 3.0 V, T = 25 °C 36 mA IDS Deep sleep current (RC oscillator) 2.1 < Vdd < 3.6 V T = 25°C µA IDS Deep sleep current (32.768kHz oscillator) 2.1 < Vdd < 3.6 V T = 25°C 4.5 µA 4.2 DC I/O specification Table 5. DC Input / Output specification Values Symbol Parameter Conditions Unit Min VIL Low Level Input Voltage 2.1 < Vdd < 3.6 V VIH High level input voltage Iil Iih Typ Max 0.2 x Vdd 2.1 < Vdd < 3.6 V 0.8 x Vdd Vdd Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mA Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mA Ripu Input pull-up resistor 30 kW Ripd Input pull-down resistor 30 kW VOL Low level output voltage 0.18 x Vdd VOH High level output voltage 0.82 x Vdd Vdd IOHS Output source current (GPIO 12 : 0 ) mA IOLS Output sink current (GPIO 12 : 0 ) mA IOHH Output source current (GPIO 16 : 13 ) mA IOLH Output sink current (GPIO 16 : 13 ) mA IOTot Total output current for I/O 40 mA 8/16 SPZB250 4.3 Electrical characteristics RF electrical characteristics Table 6. RF electrical characteristics Values Symbol Parameter Conditions Unit Min Frequency range 2.1 < Vdd < 3.6 V Typ 2405 2480 TX Output power RX Sensitivity Vdd = 3.0V, 1% PER Carrier frequency error Vdd=3.0V -20 / + 70 °C Error Vector magnitude Normal / boost mode 15 Adjacent channel rejection +/- 5 MHz +/- 10 MHZ 35 40 CFE Max MHz dBm -92 dBm -40 40 ppm 25 dBm 9/16 Mechanical dimensions SPZB250 Mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 3. 10/16 Mechanical dimensions SPZB250 Mechanical dimensions Figure 4. Solder pad layout 11/16 FCC statement SPZB250 Appendix A FCC statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ● Reorient or relocate the receiving antenna ● Increase the separation between the equipment and receiver ● Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help. Antenna Our module type SPZB250 is for OEM integrations only. The end-user product will be professionally installed in such a manner that only the authorized antennas are used. Caution Any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment. 12/16 SPZB250 A.1 FCC statement Label instruction Instruction manual for FCC ID labeling Module type: ZigBee module FCC-ID: S9NZB250A SPZB250 This intends to inform you how to specify the FCC ID of our ZigBee module SPZB250 on your final product. Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as “Contains Transmitter module FCC ID: S9NZB250A or “Contains FCC ID: S9NZB250A , any similar wording that expressed the same meaning may be use. It shows an example below Contains FCC ID: S9NZB250A A.2 Special requirement for Modular application The following requirements are fulfilled: 1. The modular transmitter must have its own RF shielding: The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding. 2. The modular transmitter must have buffered modulation/data inputs: The module has a memory management unit inside of the IC. The processor interfacing with the external application by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module exchanging data and command with it. Inside the processor a flash memory is available to download the customer application and the ZigBee profiles. 3. The modular transmitter must have its own power supply regulation: The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by temperature changes or other effects), the internal voltage will be stabilized. 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204: The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be professionally installed in such a manner that only the authorized antenna is used. 5. The modular transmitter must be tested in a stand-alone configuration: The RF module was tested in a stand-alone configuration. 6. The modular transmitter must be labelled with its own FCC ID number: The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product, the label is not visible. The OEM manufacturer is instructed how to apply the exterior label. 13/16 FCC statement SPZB250 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements: The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide. 8. The modular transmitter must comply with any applicable RF exposure requirements. ● Maximum measured power output: 3,08 mW ● Maximum antenna gain: 0,6 dBi = numeric gain 1,148 (see also FCC test report) Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm². The RF module operates at low power level so it does not exceed the Commission’s RF exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from routine environmental evaluation. 14/16 SPZB250 Revision history Revision history Table 7. Document revision history Date Revision 21-Sep-2007 Changes First release 15/16 SPZB250 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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