Samsung Electronics Co CWAM210S IOT Module User Manual Samsung ARTIK ation

Samsung Electronics Co Ltd IOT Module Samsung ARTIK ation

Installation Manual

Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 2 Samsung’s ARTIK™ Module is a highly integrated module for secure Internet of Things (IoT) devices that require Wi-Fi. It is based on an ARM® Cortex® R4 core with on-chip memories, an ARM® Cortex® M0+ core, a complete 2.4GHz Wi-Fi Phy, MAC layer processing, a large complement of standard digital buses including audio (I2S), and power management. The module is packaged with additional external Flash memory, a hardware Secure Element and a single integrated 2.4GHz structural antenna. The application processor is fully available for applications since the Wi-Fi stack, through the MAC layer, is handled by a co-processor. Aimed especially at power-sensitive devices needing Wi-Fi, the CWAM210S Module provides excellent performance in a variety of environments, with a feature set tailored specifically for IoT end nodes. Top View (Image is preliminary and will change) CWAM210S Module Block Diagram Processor CPU ARM® Cortex® R4, 32-bit with 32KB I-Cache and 32KB D-Cache @ 320MHz WLAN CPU ARM Cortex M0+ @ 320MHz Memory Embedded ROM 64KB User Embedded RAM 1.25MB 128KB (Shared) FLASH 8MB SPI FLASH on Module Security Secure Element Secure point to point authentication and data transfer Radio WLAN IEEE802.11™ b/g/n 2.4GHz radio Power Management Single Supply Provides all power of the CWAM210S Module using on board bucks and LDO’s Interfaces Digital I/O UART, I2C, I2S, SPI, PWM and GPIO SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other-wise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ARTIK 051 MODULERADIOSECURITYPROCESSORPOWER MGT. MEMORYINTERFACES
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 3 TABLE OF CONTENTS Table of Contents ................................................................................................................................................................... 3 List of Figures .......................................................................................................................................................................... 4 List of Tables ........................................................................................................................................................................... 4 Version History ...................................................................................................................................................................................... 5 CWAM210S Module Block Diagram and Component Placement .................................................................................... 6 CWAM210S Module Wi-Fi Interface..................................................................................................................................................... 6 CWAM210S Module Memory ............................................................................................................................................................... 6 CWAM210S Module Power Management Unit .................................................................................................................................. 7 CWAM210S Module Security Subsystem ............................................................................................................................................ 7 CWAM210S Module ADC Interface ...................................................................................................................................................... 7 CWAM210S Module UART Interface .................................................................................................................................................... 8 CWAM210S Module GPIO Interface .................................................................................................................................................... 8 CWAM210S INT Interface ..................................................................................................................................................................... 8 CWAM210S Module I2C Interface ........................................................................................................................................................ 9 CWAM210S Module SPI Interface ........................................................................................................................................................ 9 CWAM210S Module PWM Interface .................................................................................................................................................... 9 CWAM210S Module I2S Interface ........................................................................................................................................................ 9 CWAM210S Module Processor System ............................................................................................................................................... 9 CWAM210S Module Edge Connector ................................................................................................................................ 10 CWAM210S Functional Interfaces ...................................................................................................................................... 13 ADC Interface ....................................................................................................................................................................................... 13 Debug Interface ................................................................................................................................................................................... 13 GPIO Interface ..................................................................................................................................................................................... 13 I2C Interface ......................................................................................................................................................................................... 14 INT Interface ........................................................................................................................................................................................ 14 Power Interface ................................................................................................................................................................................... 14 PWM Interface ..................................................................................................................................................................................... 14 Reset Interface ..................................................................................................................................................................................... 14 SPI Interface ........................................................................................................................................................................................ 15 Level Shifter ......................................................................................................................................................................................... 15 UART Interface ..................................................................................................................................................................................... 15 CWAM210S Module GPIO Alternate Functions ................................................................................................................ 16 CWAM210S Module Booting Sequence ............................................................................................................................ 18 CWAM210S Module Wi-Fi Antenna structure ................................................................................................................... 19 CWAM210S Module Electrical Specifications .................................................................................................................... 20 Absolute Maximum Rating ................................................................................................................................................................. 20 DC Electrical Characteristics .............................................................................................................................................................. 20 DC Module Use Case Characteristics ................................................................................................................................................ 21 Power Supply Requirements .............................................................................................................................................................. 21 ESD Ratings .......................................................................................................................................................................................... 21 AC Electrical Characteristics .............................................................................................................................................................. 21 RF Electrical Characteristics ............................................................................................................................................................... 21 CWAM210S Module Mechanical Specifications ............................................................................................................... 23 CWAM210S Module FCC Certification ............................................................................................................................... 24 CWAM210S Module Ordering Information ....................................................................................................................... 25 Legal Information ................................................................................................................................................................. 26
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 4 LIST OF FIGURES Figure 1. CWAM210S Module Block Diagram ....................................................................................................................... 6 Figure 2. ADC LSB behavior .................................................................................................................................................... 8 Figure 3. CWAM210S Module Edge Connector ................................................................................................................. 10 Figure 4. Booting and Reset Timing Relations ................................................................................................................... 18 Figure 5. RF Connector for Wi-Fi Antenna .......................................................................................................................... 19 Figure 6. CWAM210S Module Mechanical Dimensions.................................................................................................... 23 LIST OF TABLES Table 1. CWAM210S Module Edge Connector Table Signal Descriptions...................................................................... 10 Table 2. ADC Interface .......................................................................................................................................................... 13 Table 3. Debug Interface ...................................................................................................................................................... 13 Table 4. GPIO Interface ......................................................................................................................................................... 13 Table 5. I2C Interface ............................................................................................................................................................. 14 Table 6. Interrupt Interface .................................................................................................................................................. 14 Table 7. PWM Interface......................................................................................................................................................... 14 Table 8. Reset Interface ........................................................................................................................................................ 14 Table 9. SPI Interface ............................................................................................................................................................ 15 Table 10. Level Shifter........................................................................................................................................................... 15 Table 11. UART Interface ...................................................................................................................................................... 15 Table 12. Alternate functions of the CWAM210S Module ............................................................................................... 16 Table 13. Absolute Maximum Ratings ................................................................................................................................ 20 Table 14. I/O DC Electrical Characteristics (PAD:[2-13,18,19],[21-26],[28-31],[33-45],[48-75], I/O) ............................ 20 Table 15. I/O DC Electrical Characteristics (PAD:[14-17], ADC) ........................................................................................ 20 Table 16. Recommended Operating Conditions ............................................................................................................... 21 Table 17. I/O Drive Strength ................................................................................................................................................ 21 Table 18. ESD Ratings ........................................................................................................................................................... 21 Table 19.Level Shifter AC Electrical Characteristics .......................................................................................................... 21
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 5 VERSION HISTORY Revision Date Description Maturity V0.1 11/29/2016 First Draft CWAM210S Module Datasheet Pre Alpha V0.11 12/14/2016 Updated CWAM210S Module Block Diagram, Created Module Memory section. Created Power Management Unit section. Pre Alpha V0.12 12/27/2016 Updated Figure 2. Updated Table 1. Created Level Shifter Table. Updated Table 4, 5, 6, 7, 8, 9, 10, 11, 12. Updated Table 13. Created Absolute Maximum Rating section. Created ESD section. Updated DC Electrical specifications section. Pre Alpha V0.13 12/29/2016 Created Booting section. Updated Figure 4. Created Table 19. Pre Alpha V0.14 1/3/2016 Updated Figure 3. Updated Figure 5. Updated Figure 2. Pre Alpha V0.15 1/5/2016 Created ADC Dynamic behavior graph Pre Alpha
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 6 CWAM210S MODULE BLOCK DIAGRAM AND COMPONENT PLACEMENT Figure 1 shows the functional Block Diagram of the CWAM210S Module. Figure 1. CWAM210S Module Block Diagram CWAM210S MODULE WI-FI INTERFACE The CWAM210S Module has an 802.11b/g/n Wi-Fi subsystem. The most important hardware features of the Wi-Fi system are:  802.11b/g/n support @ 2.4GHz  20MHz SISI (802.11n)  UDP throughput up to 50Mbps  WPA/WPA2/WAPI with WEP/TKIP implemented in software  Dedicated Wi-Fi Processor Sub System o ARM® Cortex® R4 Processor @ 480 MHz o Operating frequency of 320MHz o 32KB I-Cache o 16KB D-Cache o Tightly Coupled Memory (32KB Code Memory/32KB Data Memory) o SRAM 96KB CWAM210S MODULE MEMORY The CWAM210S Module has a memory subsystem with the following hardware features:  Internal RAM for secure boot, secure OS and general purpose operations. o 1280KB dedicated RAM o 128KB shared RAM User DomainUARTPWMSPIGPIODEBUGI2SPROCESSORCORTEX R432KB I$32KB D$BRIDGECRYPTOACCELERATORDMATCMRAM/ ROM32KB/ 32KBBRIDGEWLAN CO-PROCESSOR32KB I-Cache, 16KB D-Cache96KB SRAM80 2.11 MACWLAN DOMAIN2.4GHz RADIORTCPMUPLLLDO BRIDGE80 2.11 PHYI2C1.25MB SRAM128KB SRAM64KB ROMUART <-> USBPMIC
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 7  Internal ROM for secure boot and secure OS operations. o 64KB dedicated ROM CWAM210S MODULE POWER MANAGEMENT UNIT The CWAM210S Module has one universal power management unit that controls the state of power on the CWAM210S Module. The most important features of the PMU are:  Fine granular power control o Through the use of power domains  System level power control o Deep stop mode o Sleep power mode  Power savings techniques o Frequency scaling o Clock gating o Power gating CWAM210S MODULE SECURITY SUBSYSTEM The CWAM210S Module has a dedicated security subsystem to ensure a secure end to end operation in any IoT environment. The most important features of the CWAM210S Module security subsystem are:  Isolated Execution Environment o Isolated Cortex-M0 processor o 8KB ROM for secure booting o 32KB secure SRAM o Dedicated secure DMA channel for secure backup/restore of SRAM content o Secure Mailbox (68x32b wide) for secure communication o Isolated key support  Backup encryption key 256-bits  SSS root private key 521-bits  Storage key 256-bits  Symmetric key engines o Secure AES o Secure DES/Triple-DES  Stream cipher engine o ARC4 engine  Various Hash engines o SHA-1/SHA2-256/ SHA2-384/ SHA2-512/MD5 HMAC  Asymmetric key engines o PKA (Public Key Accelerator) engine  PRNG (Pseudo Random Number Generator)  DTRNG (Digital True RNG)  Secure timer  Secure key manager  DMA Support, Descriptor DMA  Block ciphers + hashing  Retention reset scheme CWAM210S MODULE ADC INTERFACE The CWAM210S Module has one 4-channel selectable analog to digital converter. The most important hardware features of the A/D interface are:  Programmable 4-channel selection  Main ADC clock at 6.5MHz
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 8  Conversion clock ADC at 1.08MHz  Support for selectable conversion mode: 1, 2, 4, 8, 16, 32, 64  Differential non-linearity error ±2 LSB  Integral non-linearity error ±6 LSB  Top offset error ±10 LSB  Bottom offset error ±10 LSB Figure 2 depicts the dynamic behavior between input voltage on the ADC and resulted LSB value in the ADC register. Figure 2. ADC LSB behavior CWAM210S MODULE UART INTERFACE By default the CWAM210S Module has three, 2-pin UART interfaces. Using GPIOs that are currently used for other functionality you can potentially create two 4-pin UART interfaces. The most important hardware features of the UART interface is:  The UART can be operated in DMA or interrupt-based mode  Support for 5-bit, 6-bit, 7-bit or 8-bit serial data transmit and receive  Programmable baud rate  One or two stop bit insertion CWAM210S MODULE GPIO INTERFACE The CWAM210S Module has an extensive general purpose Input/Output interface. The most important features of the CWAM210S Module GPIO interface are:  Support for 63 multi-function input output ports.  Support for 28 dedicated GPIO ports  Control of 16 external interrupts CWAM210S INT INTERFACE The CWAM210S Module is equipped with an interrupt controller. The most important features of the CWAM210S Module Interrupt Interface are:  Enable, disable and generate interrupts from peripheral sources  Software generated interrupts  Interrupt masking and prioritization  Wake-up events for power management Result (LSB)Analog in (V)Top offsetBottom offsetReal valueIdeal valueIdeal value with offset
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 9  Control of 3 external wakeup interrupts CWAM210S MODULE I2C INTERFACE By default the CWAM210S Module has two high speed multi-master I2C interfaces available with speeds up to 3.4Mbps. Using GPIOs that are currently used for other functionality you can potentially create four I2C interfaces. CWAM210S MODULE SPI INTERFACE By default the CWAM210S Module has two dedicated SPI interfaces. Using GPIOs that are currently used for other functionality you can potentially create four SPI interfaces. The most important hardware features of the SPI interfaces are:  Full duplex communication  8, 16 or 32-bit shift registers and bus interface  Motorola SPI protocol and National Semiconductor Microwire protocol  Master and slave mode operation  Two independent 32-bit wide transmit/receive FIFOs  Transmit and receive speeds up to 50MHz CWAM210S MODULE PWM INTERFACE By default the CWAM210S Module has seven PWM timers available. The most important features of the PWM interfaces are:  32-bit size timers on each PWM signal  Two 8-bit pre-scalers (first level of division) and 5 clock-dividers/multiplexers for second level division  Static configuration option  Dynamic configuration option  Auto-reload and One-shot pulse mode  Dead zone generator  Level interrupt generation CWAM210S MODULE I2S INTERFACE By default the CWAM210S Module does not have an I2S interface, however when re-using the right GPIO pins one I2S interface can be allocated. The most important features of the I2S interface are:  Stereo channel support with external DMA based operation  Mixes up to two sound sources  Support for serial data transfer of 8, 16 or 32-bit per channel  Support for slave mode CWAM210S MODULE PROCESSOR SYSTEM The ARTIK 51 Module has one dedicated Cortex®-R4 processor dedicated towards application processing. The main features of the main processor are:  Cortex® R4 ARM® processor  CPU speed 320MHz  32kB Instruction cache  32kB Data cache
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 10 CWAM210S MODULE EDGE CONNECTOR The CWAM210S Module utilizes 76 signals and ground pins providing all the relevant signaling. Figure 3 shows how the Edge Connector is oriented and how signal-coordinates are assigned to the edge of the CWAM210S Module. Table 1 describes the relation between the edge coordinates and the signal names. Figure 3. CWAM210S Module Edge Connector Table 1. CWAM210S Module Edge Connector Table Signal Descriptions Pin Number Pin Name I/O* PU/PD Power Default Function Groups 1 GND - - - GND 1 2 XGPIO26 I PD VDDQ33_EXT0 GPIO 2 3 XGPIO25 I PD VDDQ33_EXT0 GPIO 3 4 XGPIO24 I PD VDDQ33_EXT0 GPIO 4 5 XGPIO21 I PD VDDQ33_EXT0 GPIO 5 6 XGPIO19 I PD VDDQ33_EXT0 GPIO 6 7 XGPIO18 I PD VDDQ33_EXT0 GPIO 7 8 XGPIO17 I PD VDDQ33_EXT0 GPIO 8 9 XGPIO14 I PD VDDQ33_EXT0 GPIO 9 10 XGPIO13 I PD VDDQ33_EXT0 GPIO 10 5872220921196101413181215171611424125327262823032312329GNDXGPIO26XGPIO25XGPIO24XGPIO21XGPIO19XGPIO18XGPIO17XGPIO14XGPIO13XGPIO16XGPIO15XGPIO20XADC0 AIN_1XADC0 AIN_0XADC0 AIN_2XADC0 AIN_3XGPIO23XGPIO22GNDXRESET_NXJTAG_TMSXJTAG_TDIXJTAG_TCKXJTAG_TDOXJTAG_TRST_N3V3_EXT_LDO2XEINT0XEINT2XEINT1PWR_RSTDC_5V_12V7269705557685658716763645965626061667353765274505149754745465448GNDXGPIO27XSPI1_CSNXSPI1_MOSIXSPI1_CLKXSPI1_MISOXGPIO0XGPIO3XGPIO1XGPIO5XGPIO4XGPIO2XGPIO7XGPIO8XGPIO6XGPIO11XGPIO9XGPIO10XGPIO12XUART3_RXDXUART3_TXDXUART2_RXDXUART2_TXDXUART1_RXDXUART1_TXDXSPI0 _CLKXSPI0 _MOSIXSPI0 _CSNXSPI0 _MISORXD0TXD0XPWMTOUT_333 34 35 36 37 38 39 40 41 42 43 44NorthWest EastSouth79 78 77XI2C0 _SCLXI2C0 _SDAXI2C1_SCLXI2C1_SDAXDEBUG_TXDXDEBUG_RXDXPWMTOUT_4XPWMTOUT_5XPWMTOUT_1XPWMTOUT_0XPWMTOUT_6XPWMTOUT_2343336373938404244433541GNDGNDGND7779782 17 6 4 351234567GNDGNDTXDO with Level ShifterRXDO with Level ShifterPWR_RSTGNDDC_5V_12V
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 11 Pin Number Pin Name I/O* PU/PD Power Default Function Groups 11 XGPIO16 I PD VDDQ33_EXT0 GPIO 11 12 XGPIO15 I PD VDDQ33_EXT0 GPIO 12 13 XGPIO20 I PD VDDQ33_EXT0 GPIO 13 14 XADC0AIN_1 – – AVDD18_ADC0 ADC 14 15 XADC0AIN_0 – – AVDD18_ADC0 ADC 15 16 XADC0AIN_2 – – AVDD18_ADC0 ADC 16 17 XADC0AIN_3 – – AVDD18_ADC0 ADC 17 18 XGPIO23 I PD VDDQ1833_SDIO_0 GPIO 18 19 XGPIO22 I PD VDDQ1833_SDIO_0 GPIO 19 20 GND - - - GND 20 21 XRESET_N I – VDDQ33_EXT1 RESET 21 22 XJTAG_TMS I PU VDDQ33_EXT1 DEBUG 22 23 XJTAG_TDI I PU VDDQ33_EXT1 DEBUG 23 24 XJTAG_TCK I PD VDDQ33_EXT1 DEBUG 24 25 XJTAG_TDO I PD VDDQ33_EXT1 DEBUG 25 26 XJTAG_TRST_N I PD VDDQ33_EXT1 DEBUG 26 27 3V3_EXT_LDO2 - - - POWER 27 28 XEINT_0 I PD VDDQ33_EXT1 INT 28 29 XEINT_2 I PD VDDQ33_EXT1 INT 29 30 XEINT_1 I PD VDDQ33_EXT1 INT 30 31 PWR_RST - - - RESET 31 32 DC_5V_12V - - - POWER 32 33 XI2C0_SCL I PD VDDQ33_EXT1 I2C 33 34 XI2C0_SDA I PD VDDQ33_EXT1 I2C 34 35 XI2C1_SCL I PD VDDQ33_EXT1 I2C 35 36 XI2C1_SDA I PD VDDQ33_EXT1 I2C 36 37 XDEBUG_TXD I PD VDDQ33_EXT1 DEBUG 37 38 XDEBUG_RXD I PD VDDQ33_EXT1 DEBUG 38 39 XPWMTOUT_4 I PD VDDQ33_EXT0 PWM 39 40 XPWMTOUT_5 I PD VDDQ33_EXT0 PWM 40 41 XPWMTOUT_1 I PD VDDQ33_EXT0 PWM 41 42 XPWMTOUT_0 I PD VDDQ33_EXT0 PWM 42 43 XPWMTOUT_6 I PD VDDQ33_EXT0 PWM 43 44 XPWMTOUT_2 I PD VDDQ33_EXT0 PWM 44 45 XPWMTOUT_3 I PD VDDQ33_EXT0 PWM 45 46 TXD0 - - - TR 46 47 RXD0 - - - TR 47 48 XSPI0_MISO I PD VDDQ33_EXT0 SPI 48 49 XSPI0_CSN I PD VDDQ33_EXT0 SPI 49 50 XSPI0_MOSI I PD VDDQ33_EXT0 SPI 50 51 XSPI0_CLK I PD VDDQ33_EXT0 SPI 51 52 XUART1_TXD I PD VDDQ33_EXT0 UART 52 53 XUART1_RXD I PD VDDQ33_EXT0 UART 53 54 XUART2_TXD I PD VDDQ33_EXT0 UART 54 55 XUART2_RXD I PD VDDQ33_EXT0 UART 55 56 XUART3_TXD I PD VDDQ33_EXT0 UART 56 57 XUART3_RXD I PD VDDQ33_EXT0 UART 57 58 XGPIO12 I PD VDDQ33_EXT0 GPIO 58 59 XGPIO10 I PD VDDQ33_EXT0 GPIO 59 60 XGPIO9 I PD VDDQ33_EXT0 GPIO 60 61 XGPIO11 I PD VDDQ33_EXT0 GPIO 61 62 XGPIO6 I PD VDDQ33_EXT0 GPIO 62
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 12 Pin Number Pin Name I/O* PU/PD Power Default Function Groups 63 XGPIO8 I PD VDDQ33_EXT0 GPIO 63 64 XGPIO7 I PD VDDQ33_EXT0 GPIO 64 65 XGPIO2 I PD VDDQ33_EXT0 GPIO 65 66 XGPIO4 I PD VDDQ33_EXT0 GPIO 66 67 XGPIO5 I PD VDDQ33_EXT0 GPIO 67 68 XGPIO1 I PD VDDQ33_EXT0 GPIO 68 69 XGPIO3 I PD VDDQ33_EXT0 GPIO 69 70 XGPIO0 I PD VDDQ33_EXT0 GPIO 70 71 XSPI1_MISO I PD VDDQ33_EXT0 SPI 71 72 XSPI1_CLK I PD VDDQ33_EXT0 SPI 72 73 XSPI1_MOSI I PD VDDQ33_EXT0 SPI 73 74 XSPI1_CSN I PD VDDQ33_EXT0 SPI 74 75 XGPIO27 I PD VDDQ33_EXT0 GPIO 75 76 GND - - - GND 76 Note: 1. *Default setting after reset 2. Type definition: [S:Signal ball, P:Power ball, G:GND ball] 3. IO pad type definition: [I:Input, O:Output, I/O: Input/Output 4. Internal Pull Up/Down definition: – PU:Pull Up, PD:Pull Down, N:No Pull
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 13 CWAM210S FUNCTIONAL INTERFACES ADC INTERFACE Table 2. ADC Interface Pin Number Pin Name I/O PU/PD Power Default Function 14 XADC0AIN_1 – – AVDD18_ADC0 XADC0AIN_1 15 XADC0AIN_0 – – AVDD18_ADC0 XADC0AIN_0 16 XADC0AIN_2 – – AVDD18_ADC0 XADC0AIN_2 17 XADC0AIN_3 – – AVDD18_ADC0 XADC0AIN_3 DEBUG INTERFACE Table 3. Debug Interface Pin Number Pin Name I/O PU/PD Power Default Function 22 XJTAG_TMS I PU VDDQ33_EXT1 XJTAG_TMS 23 XJTAG_TDI I PU VDDQ33_EXT1 XJTAG_TDI 24 XJTAG_TCK I PD VDDQ33_EXT1 XJTAG_TCK 25 XJTAG_TDO I PD VDDQ33_EXT1 XJTAG_TDO 26 XJTAG_TRST_N I PD VDDQ33_EXT1 XJTAG_TRST_N 37 XDEBUG_TXD I PD VDDQ33_EXT1 XDEBUG_TXD 38 XDEBUG_RXD I PD VDDQ33_EXT1 XDEBUG_RXD GPIO INTERFACE Table 4. GPIO Interface Pin Number Pin Name I/O PU/PD Power Default Function 2 XGPIO26 I PD VDDQ33_EXT0 XGPIO26 3 XGPIO25 I PD VDDQ33_EXT0 XGPIO25 4 XGPIO24 I PD VDDQ33_EXT0 XGPIO24 5 XGPIO21 I PD VDDQ33_EXT0 XGPIO21 6 XGPIO19 I PD VDDQ33_EXT0 XGPIO19 7 XGPIO18 I PD VDDQ33_EXT0 XGPIO18 8 XGPIO17 I PD VDDQ33_EXT0 XGPIO17 9 XGPIO14 I PD VDDQ33_EXT0 XGPIO14 10 XGPIO13 I PD VDDQ33_EXT0 XGPIO13 11 XGPIO16 I PD VDDQ33_EXT0 XGPIO16 12 XGPIO15 I PD VDDQ33_EXT0 XGPIO15 13 XGPIO20 I PD VDDQ33_EXT0 XGPIO20 18 XGPIO23 I PD VDDQ1833_SDIO_0 XGPIO23 19 XGPIO22 I PD VDDQ1833_SDIO_0 XGPIO22 58 XGPIO12 I PD VDDQ33_EXT0 XGPIO12 59 XGPIO10 I PD VDDQ33_EXT0 XGPIO10 60 XGPIO9 I PD VDDQ33_EXT0 XGPIO9 61 XGPIO11 I PD VDDQ33_EXT0 XGPIO11 62 XGPIO6 I PD VDDQ33_EXT0 XGPIO6 63 XGPIO8 I PD VDDQ33_EXT0 XGPIO8 64 XGPIO7 I PD VDDQ33_EXT0 XGPIO7 65 XGPIO2 I PD VDDQ33_EXT0 XGPIO2 66 XGPIO4 I PD VDDQ33_EXT0 XGPIO4 67 XGPIO5 I PD VDDQ33_EXT0 XGPIO5
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 14 Pin Number Pin Name I/O PU/PD Power Default Function 68 XGPIO1 I PD VDDQ33_EXT0 XGPIO1 69 XGPIO3 I PD VDDQ33_EXT0 XGPIO3 70 XGPIO0 I PD VDDQ33_EXT0 XGPIO0 75 XGPIO27 I PD VDDQ33_EXT0 XGPIO27 I2C INTERFACE Table 5. I2C Interface Pin Number Pin Name I/O PU/PD Power Default Function 33 XI2C0_SCL I PD VDDQ33_EXT1 XI2C0_SCL 34 XI2C0_SDA I PD VDDQ33_EXT1 XI2C0_SDA 35 XI2C1_SCL I PD VDDQ33_EXT1 XI2C1_SCL 36 XI2C1_SDA I PD VDDQ33_EXT1 XI2C1_SDA INT INTERFACE Table 6. Interrupt Interface Pin Number Pin Name I/O PU/PD Power Default Function 28 XEINT_0 I PD VDDQ33_EXT1 XEINT_0 29 XEINT_2 I PD VDDQ33_EXT1 XEINT_2 30 XEINT_1 I PD VDDQ33_EXT1 XEINT_1 POWER INTERFACE Pin Number Pin Name I/O PU/PD Power Default Function 1 GND - - - - 20 GND - - - - 27 3V3_EXT_LDO2 - - - - 32 DC_5V_12V - - - - 76 GND - - - - PWM INTERFACE Table 7. PWM Interface Pin Number Pin Name I/O PU/PD Power Default Function 39 XPWMTOUT_4 I PD VDDQ33_EXT0 XPWMTOUT_4 40 XPWMTOUT_5 I PD VDDQ33_EXT0 XPWMTOUT_5 41 XPWMTOUT_1 I PD VDDQ33_EXT0 XPWMTOUT_1 42 XPWMTOUT_0 I PD VDDQ33_EXT0 XPWMTOUT_0 43 XPWMTOUT_6 I PD VDDQ33_EXT0 XPWMTOUT_6 44 XPWMTOUT_2 I PD VDDQ33_EXT0 XPWMTOUT_2 45 XPWMTOUT_3 I PD VDDQ33_EXT0 XPWMTOUT_3 RESET INTERFACE Table 8. Reset Interface Pin Number Pin Name I/O PU/PD Power Default Function 21 XRESET_N I – VDDQ33_EXT1 XRESET_N 31 PWR_RST - - - -
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 15 SPI INTERFACE Table 9. SPI Interface Pin Number Pin Name I/O PU/PD Power Default Function 48 XSPI0_MISO I PD VDDQ33_EXT0 XSPI0_MISO 49 XSPI0_CSN I PD VDDQ33_EXT0 XSPI0_CSN 50 XSPI0_MOSI I PD VDDQ33_EXT0 XSPI0_MOSI 51 XSPI0_CLK I PD VDDQ33_EXT0 XSPI0_CLK 71 XSPI1_MISO I PD VDDQ33_EXT0 XSPI1_MISO 72 XSPI1_CLK I PD VDDQ33_EXT0 XSPI1_CLK 73 XSPI1_MOSI I PD VDDQ33_EXT0 XSPI1_MOSI 74 XSPI1_CSN I PD VDDQ33_EXT0 XSPI1_CSN LEVEL SHIFTER Table 10. Level Shifter Pin Number Pin Name I/O PU/PD Power Default Function 46 TXD0 - - - - 47 RXD0 - - - - UART INTERFACE Table 11. UART Interface Pin Number Pin Name I/O PU/PD Power Default Function 52 XUART1_TXD I PD VDDQ33_EXT0 XUART1_TXD 53 XUART1_RXD I PD VDDQ33_EXT0 XUART1_RXD 54 XUART2_TXD I PD VDDQ33_EXT0 XUART2_TXD 55 XUART2_RXD I PD VDDQ33_EXT0 XUART2_RXD 56 XUART3_TXD I PD VDDQ33_EXT0 XUART3_TXD 57 XUART3_RXD I PD VDDQ33_EXT0 XUART3_RXD
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 16 CWAM210S MODULE GPIO ALTERNATE FUNCTIONS Table 12 describes the alternate functions that can be accessed using GPIOs that are available on the edge of the CWAM210S Module. Table 12. Alternate functions of the CWAM210S Module PIN # Pin Name Default Function Alternate Function 1 2 3 4 5 6 7 2 XGPIO26 XGPIO26 GPG3[2] I2S_0_SDO MCT1_INTlev - - - - 3 XGPIO25 XGPIO25 GPG3[1] I2S_0_LRCK MCT0_TICK - - - - 4 XGPIO24 XGPIO24 GPG3[0] I2S_0_BCLK MCT0_INTlev WB2AP_ETM_DATA_OUT_15 WLBT_DEBUG_15 - - 5 XGPIO21 XGPIO21 GPG2[5] SerialFLASH_MONITOR_sf1_5 WLBT_UART_TXD WB2AP_ETM_DATA_OUT_12 WLBT_DEBUG_12 WAKE_EXT_INTG2[5] - 6 XGPIO19 XGPIO19 GPG2[3] SerialFLASH_MONITOR_sf1_3 WB2AP_ETM_DATA_OUT_10 WLBT_DEBUG_10 WAKE_EXT_INTG2[3] - - 7 XGPIO18 XGPIO18 GPG2[2] SerialFLASH_MONITOR_sf1_2 WB2AP_ETM_DATA_OUT_09 WLBT_DEBUG_09 WAKE_EXT_INTG2[2] - - 8 XGPIO17 XGPIO17 GPG2[1] SerialFLASH_MONITOR_sf1_1 WB2AP_ETM_DATA_OUT_08 WLBT_DEBUG_08 WAKE_EXT_INTG2[1] - - 9 XGPIO14 XGPIO14 GPG1[6] SerialFLASH_MONITOR_sf0_6 ALV_DBG[14] WB2AP_ETM_DATA_OUT_05 WLBT_DEBUG_05 WAKE_EXT_INTG1[6] - 10 XGPIO13 XGPIO13 GPG1[5] SerialFLASH_MONITOR_sf0_5 ALV_DBG[13] WB2AP_ETM_DATA_OUT_04 WLBT_DEBUG_04 WAKE_EXT_INTG1[5] - 11 XGPIO16 XGPIO16 GPG2[0] SerialFLASH_MONITOR_sf1_0 WB2AP_ETM_DATA_OUT_07 WLBT_DEBUG_07 WAKE_EXT_INTG2[0] - - 12 XGPIO15 XGPIO15 GPG1[7] SerialFLASH_MONITOR_sf0_7 ALV_DBG[15] WB2AP_ETM_DATA_OUT_06 WLBT_DEBUG_06 WAKE_EXT_INTG1[7] - 13 XGPIO20 XGPIO20 GPG2[4] SerialFLASH_MONITOR_sf1_4 WLBT_UART_RXD WB2AP_ETM_DATA_OUT_11 WLBT_DEBUG_11 WAKE_EXT_INTG2[4] - 18 XGPIO23 XGPIO23 GPG2[7] SerialFLASH_MONITOR_sf1_7 WB2AP_ETM_DATA_OUT_14 WLBT_DEBUG_14 WAKE_EXT_INTG2[7] - - 19 XGPIO22 XGPIO22 GPG2[6] SerialFLASH_MONITOR_sf1_6 WB2AP_ETM_DATA_OUT_13 WLBT_DEBUG_13 WAKE_EXT_INTG2[6] - - 22 XJTAG_TMS XJTAG_TMS ETC0[1] - - - - - - 23 XJTAG_TDI XJTAG_TDI ETC0[3] - - - - - - 24 XJTAG_TCK XJTAG_TCK ETC0[2] - - - - - - 25 XJTAG_TDO XJTAG_TDO ETC0[4] - - - - - - 26 XJTAG_TRST_N XJTAG_TRST_N ETC0[0] - - - - - - 28 XEINT_0 XEINT_0 GPA0[0] WAKE_EXT_INTA0[0] - - - - - 29 XEINT_2 XEINT_2 GPA0[2] WAKE_EXT_INTA0[2] - - - - - 30 XEINT_1 XEINT_1 GPA0[1] WAKE_EXT_INTA0[1] - - - - - 33 XI2C0_SCL XI2C0_SCL GPA1[0] HSI2C_0_SCL - - - - - 34 XI2C0_SDA XI2C0_SDA GPA1[1] HSI2C_0_SDA - - - - - 35 XI2C1_SCL XI2C1_SCL GPA1[2] HSI2C_1_SCL - - - - - 36 XI2C1_SDA XI2C1_SDA GPA1[3] HSI2C_1_SDA - - - - - 37 XDEBUG_TXD XDEBUG_TXD GPA3[1] Xdebug_TXD - - - - - 38 XDEBUG_RXD XDEBUG_RXD GPA3[0] Xdebug_RXD - - - - - 39 XPWMTOUT_4 XPWMTOUT_4 GPP2[4] PWM_TOUT_4 - - - - - 40 XPWMTOUT_5 XPWMTOUT_5 GPP2[5] PWM_TOUT_5 - - - - - 41 XPWMTOUT_1 XPWMTOUT_1 GPP2[1] PWM_TOUT_1 COUNTER_0 UART_3_RTSn - - -
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 17 PIN # Pin Name Default Function Alternate Function 1 2 3 4 5 6 7 42 XPWMTOUT_0 XPWMTOUT_0 GPP2[0] PWM_TOUT_0 UART_3_CTSn - - - - 43 XPWMTOUT_6 XPWMTOUT_6 GPP2[6] PWM_TOUT_6 - - - - - 44 XPWMTOUT_2 XPWMTOUT_2 GPP2[2] PWM_TOUT_2 - - - - - 45 XPWMTOUT_3 XPWMTOUT_3 GPP2[3] PWM_TOUT_3 - - - - - 48 XSPI0_MISO XSPI0_MISO GPP0[2] SPI_0_MISO - - - - - 49 XSPI0_CSN XSPI0_CSN GPP0[1] SPI_0_CSn - - - - - 50 XSPI0_MOSI XSPI0_MOSI GPP0[3] SPI_0_MOSI - - - - - 51 XSPI0_CLK XSPI0_CLK GPP0[0] SPI_0_CLK - - - - - 52 XUART1_TXD XUART1_TXD GPP0[5] UART_1_TXD UART_2_RTSn - - - - 53 XUART1_RXD XUART1_RXD GPP0[4] UART_1_RXD UART_2_CTSn - - - - 54 XUART2_TXD XUART2_TXD GPP0[7] UART_2_TXD - - - - - 55 XUART2_RXD XUART2_RXD GPP0[6] UART_2_RXD - - - - - 56 XUART3_TXD XUART3_TXD GPP1[7] UART_3_TXD - - - - - 57 XUART3_RXD XUART3_RXD GPP1[6] UART_3_RXD - - - - - 58 XGPIO12 XGPIO12 GPG1[4] SerialFLASH_MONITOR_sf0_4 ALV_DBG[12] WB2AP_ETM_DATA_OUT_03 WLBT_DEBUG_03 WAKE_EXT_INTG1[4] - 59 XGPIO10 XGPIO10 GPG1[2] SPI_3_MISO SerialFLASH_MONITOR_sf0_2 ALV_DBG[10] WB2AP_ETM_DATA_OUT_01 WLBT_DEBUG_01 WAKE_EXT_INTG1[2] 60 XGPIO9 XGPIO9 GPG1[1] SPI_3_CSn SerialFLASH_MONITOR_sf0_1 ALV_DBG[9] WB2AP_ETM_DATA_OUT_00 WLBT_DEBUG_00 WAKE_EXT_INTG1[1] 61 XGPIO11 XGPIO11 GPG1[3] SPI_3_MOSI SerialFLASH_MONITOR_sf0_3 ALV_DBG[11] WB2AP_ETM_DATA_OUT_02 WLBT_DEBUG_02 WAKE_EXT_INTG1[3] 62 XGPIO6 XGPIO6 GPG0[6] SPI_2_MISO ALV_DBG[6] - - - - 63 XGPIO8 XGPIO8 GPG1[0] SPI_3_CLK SerialFLASH_MONITOR_sf0_0 ALV_DBG[8] WB2AP_TRACE_CLK_OUT WAKE_EXT_INTG1[0] - 64 XGPIO7 XGPIO7 GPG0[7] SPI_2_MOSI ALV_DBG[7] - - - - 65 XGPIO2 XGPIO2 GPG0[2] HSI2C_3_SCL ALV_DBG[2] - - - - 66 XGPIO4 XGPIO4 GPG0[4] SPI_2_CLK ALV_DBG[4] - - - - 67 XGPIO5 XGPIO5 GPG0[5] SPI_2_CSn ALV_DBG[5] - - - - 68 XGPIO1 XGPIO1 GPG0[1] HSI2C_2_SDA ALV_DBG[1] - - - - 69 XGPIO3 XGPIO3 GPG0[3] HSI2C_3_SDA ALV_DBG[3] - - - - 70 XGPIO0 XGPIO0 GPG0[0] HSI2C_2_SCL ALV_DBG[0] - - - - 71 XSPI1_MISO XSPI1_MISO GPP4[2] SPI_1_MISO - - - - - 72 XSPI1_CLK XSPI1_CLK GPP4[0] SPI_1_CLK - - - - - 73 XSPI1_MOSI XSPI1_MOSI GPP4[3] SPI_1_MOSI - - - - - 74 XSPI1_CSN XSPI1_CSN GPP4[1] SPI_1_CSn - - - - - 75 XGPIO27 XGPIO27 GPG3[3] I2S_0_SDI MCT1_TICK - - - -
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 18 CWAM210S MODULE BOOTING SEQUENCE The section describes the timing associated with powering up and resetting the CWAM210S Module. Figure 4 depicts the various relevant external (PWR_RST and DC_5V_12V) and internal signaling relations. Figure 4. Booting and Reset Timing Relations InternalPower RailExternalPower RailPWR_RSTDC_5V_12V
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 19 CWAM210S MODULE WI-FI ANTENNA STRUCTURE The CWAM210S Module has an integrated Metal Structural Antenna that operates autonomously. In addition there is an option to attach an external Wi-Fi antenna using a conventional RF connector interface as depicted in Figure 5. Caution: Do not apply power (enable) the radio chips before connecting the Wi-Fi antenna or damage to the CWAM210S Module may result. Figure 5. RF Connector for Wi-Fi Antenna The U.FL-R-SMT Hirose connector is used to connect a standard Wi-Fi antenna to the CWAM210S Module. The mechanical size of the connector (receptacle) is described in Figure 5. For suggestions on mating plug and more details on the connector, please contact Hirose Electric Co., LTD. All Dimensions are in mm
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 20 CWAM210S MODULE ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATING Table 13. Absolute Maximum Ratings PAD:[Pin#] Symbol Condition Min Typ Max Units PAD:[32] VIN Input voltage VIN on the high efficiency step down converter – – 20 V PAD:[2~19], [21~26], [28~31], [33~45], [48~75] Vundershoot Undershoot voltage for I/O -0.3 – - V PAD:[31] PWR_RST – -0.3 – 6 V PAD:[46,47] VMAX Based on 3V3 I/O signalling – – 63.3 V IMAX Continuous – – 305 mA Pulsed – – 800 mA DC ELECTRICAL CHARACTERISTICS Table 14. I/O DC Electrical Characteristics (PAD:[2-13,18,19],[21-26],[28-31],[33-45],[48-75], I/O) Parameter Condition Min Typ Max Units Tolerant External Voltage VTOL 3.3 Power Off and On – – 3.60 V High-Level Input Voltage CMOS Interface VIH 2.31 – 3.60 V Low-Level Input Voltage CMOS Interface VIL VDD=3.30V -0.30 – 0.70 V Hysteresis Voltage ΔV 0.15 – – V High-Level Input Current Input Buffer IIH VIN=3.30V VDD=3.30V Power On -3.00 – 3.00 µA VDD=3.30V Power Off & SNS=0 -5.00 – 5.00 µA Input Buffer with Pull-Down VIN=3.30V VDD=3.30V 13 40 90 µA Low-Level Input Current Input Buffer IIL VIN=0V VDD=3.30V Power On and Off -3.00 – 3.00 µA Input Buffer with Pull-Down VIN=0V VDD=3.30V -13.00 – -90.00 µA Output High Voltage VOH IOH = 2.0mA, 4.0mA, 8.0mA and 12.0mA 2.64 – 3.30 V Output Low Voltage VOL IOL = -2.0mA, -4.0mA, -8.0mA and -12.0mA 0 – 0.66 V Output Hi-Z Current VOZ -5 – 5 µA Input Capacitance CIN Any input and bi-directional buffers – – 5 pF Table 15. I/O DC Electrical Characteristics (PAD:[14-17], ADC) Parameter Condition Min Typ Max Units High Level Input Voltage VIH Guaranteed Logic High Level 1.26 – 1.80 V Low Level Input Voltage VIL Guaranteed Logic Low Level 0 – 0.54 V Output High Voltage VOH IOH=2mA, 4mA, 8mA and 12mA 1.44 – 1.80 V Output Low Voltage VOL IOL=2mA, 4mA, 8mA and 12mA 0 – 0.36 V Input Pull-Up Resistor Current IRPU VPAD=0 15 – 77 µA Input Pull-Down Resistor Current IRPD VPAD=1.80 17 – 77 µA
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 21 Parameter Condition Min Typ Max Units Input Hysteresis VH – 0.18 – – V Input Leakage Current for Non Tolerant Cells IPAD DVDD=1.80, VPAD=0 or 1.80V -6 – +6 µA Off State Leakage Current IOZ DVDD=1.80, VPAD=0 or 1.80V -6 – +6 µA Table 16. Recommended Operating Conditions Parameter Symbol Min Typ Max Units Main Power Supply: PAD:[32] DC_5V_12V 4.50 – 18.00 V Maximum Operating Temperature TO -20 – 70 °C Storage Temperature TS TBD – TBD °C Table 17. I/O Drive Strength State Currents: worst conditions VDD=3.30V Units DS0 DS1 SR: 0: Fast, 1: Slow 0 0 0/1 2 mA 0 1 0/1 4 mA 1 0 0/1 8 mA 1 1 0/1 12 mA DC MODULE USE CASE CHARACTERISTICS TBD POWER SUPPLY REQUIREMENTS TBD ESD RATINGS Table 18. ESD Ratings Parameter Min Typ Max Units ESD stress voltage Human Body Model (JEDEC) -1.0 – 1.0 kV ESD stress voltage Charged Device Model – 250 – V AC ELECTRICAL CHARACTERISTICS Table 19.Level Shifter AC Electrical Characteristics PAD:[Pin#] Symbol Condition Min Typ Max Units PAD:[46,47] Dynamic Characteristics CISS Input Capacitance VDS=25V, f=1.0MHz, VGS=0V – – 50 pF COSS Output Capacitance – – 25 pF CRSS Reverse Transfer Capacitance – – 5 pF RF ELECTRICAL CHARACTERISTICS TBD
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 22
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 23 CWAM210S MODULE MECHANICAL SPECIFICATIONS In Figure 6 the mechanical dimensions of the CWAM210S Module are provided. All dimensions are in mm. Figure 6. CWAM210S Module Mechanical Dimensions 0.65NorthWest EastSouthNorthSouth764544 33TOP View BOTTOM View1.65 1.651232.54 72.426.231.22.543.77.577 790.41.0Solder plate(bottom side only)0.60.61.00.27.731.74.754.01540All Dimensions in [mm]11.311.728.532.45321East West
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 24 CWAM210S MODULE FCC CERTIFICATION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Caution: Any changes or modifications to the equipment not expressly approved by the party responsible for compliance could void user’s authority to operate the equipment. This appliance and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. A minimum separation distance of 20cm must be maintained between the antenna and the person for this appliance to satisfy the RF exposure requirements. Instruction to OEM This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference and 2. This device must accept any interference, including interference that may cause undesired operation of the device. This application and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. A minimum separation distance of 20cm must be maintained between the antenna and the person for this appliance to satisfy the RF exposure requirements. Host labeling requirement: “Contains transmitter module FCC ID: A3LCWAM210S IC : 649E-CWAM210S ” This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation.
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 25 CWAM210S MODULE ORDERING INFORMATION Type Order Number Description CWAM210S Module ?? One CWAM210S Module CWAM210S Evaluation Kit ?? One CWAM210S Module One EVK Board One Wi-Fi Antenna For volume ordering of evaluation kits, please contact a sales representative in your area or email sales@artik.io.
Samsung Semiconductor, Inc. CWAM210S Module Datasheet Samsung Confidential Specifications in this document are tentative and subject to change. 26 LEGAL INFORMATION INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK™ DEVELOPMENT KIT AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER “SAMSUNG PRODUCTS”). NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. THE LICENSE AND OTHER TERMS AND CONDITIONS RELATED TO YOUR USE OF THE SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT AS PROVIDED IN THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND ITS AFFILIATES (COLLECTIVELY, “SAMSUNG”) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATED TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS WITHOUT NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR NOTICE. THIS DOCUMENTATION IS PROVIDED FOR REFERENCE PURPOSES ONLY, AND ALL INFORMATION DISCUSSED HEREIN IS PROVIDED ON AN “AS IS” BASIS, WITHOUT WARRANTIES OF ANY KIND. SAMSUNG ASSUMES NO RESPONSIBILITY FOR POSSIBLE ERRORS OR OMISSIONS, OR FOR ANY CONSEQUENCES FROM THE USE OF THE DOCUMENTATION CONTAINED HEREIN. Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand names, trademarks and registered trademarks belong to their respective owners. For updates or additional information about Samsung ARTIK™, contact the Samsung ARTIK™ team via the Samsung ARTIK™ website at www.artik.io. Copyright © 2016 Samsung Electronics Co., Ltd. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Samsung Electronics.

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