Samsung Electronics Co CYWDCB7UR Wireless Connection Module User Manual

Samsung Electronics Co Ltd Wireless Connection Module HS6621 installation 6 26

a href="https://usermanual.wiki/Samsung-Electronics-Co" itemprop="url"> Samsung Electronics Co >

Contents

revised installation manual Aug.2, 2012

COMPANY CONFIDENTIAL CY-WDCB7UR installation manual P/N: BN59-01157A 1 of 37 CY-WDCB7UR installation manual Proprietary Information All information contained in this document is confidential and proprietary to Hanshin IT. No license, expressed or implied, under any patent, copyright or trade secret right is granted or implied by the conveyance of this document. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual, or otherwise without the prior written permission of Hanshin IT. Copyright © 2012 Hanshin IT. All rights reserved. Document Title CY-WDCB7UR Installation manual Samsung P/N BN59-01157A Hanshin IT P/N HS6621 Rev 2.6 Latest Revision Number V0.9 Latest Revised Date 04/23/2012 Confidential Revision No.: V0.9 Authors: DC Kim Project Leader: DC Kim Project Code: SS-UWB-201101 Release Date: 04/23/2012
COMPANY CONFIDENTIAL CY-WDCB7UR installation manual P/N: BN59-01157A 2 of 37 CONTENT 1. SCOPE ............................................................................................................................................................................................. 8 1.1 DOCUMENT ...................................................................................................................................................................... 8 2. How to install the CY-WDCB7UR? ..................................................................................................................................... 8 2.1 UWB RF module applications ................................................................................................................................... 8 2.2 Interface signals .............................................................................................................................................................. 8 2.3 Installation ......................................................................................................................................................................... 8 3. HARDWARE SPECIFICATIONS ........................................................................................................................................... 10 3.1 GENERAL ......................................................................................................................................................................... 10 3.2 PRODUCT CHACTERISTICS ..................................................................................................................................... 10 3.3 ENVIRONMENT ............................................................................................................................................................ 11 3.3.1 Temperature ................................................................................................................................................... 11 3.3.2 Humidity ........................................................................................................................................................... 11 3.4 PRODUCT PHOTOGRAPH ....................................................................................................................................... 12 4. HARDWARE REQUIREMENTS ............................................................................................................................................ 13 4.1 FUNCTIONAL BLOCK DIAGRAM .......................................................................................................................... 13 4.2 AL6301/AL5100 CHIPSET ARCHITECTURE ....................................................................................................... 14 4.3 IO CONNECTOR PIN DEFINITION ....................................................................................................................... 15 4.4 Manufacturing Test Block Diagram .................................................................................................................... 16 4.4.1 PT Block Diagram ......................................................................................................................................... 16 4.4.2 FT Block Diagram ......................................................................................................................................... 16
Download:
Mirror Download [FCC.gov]
Document ID1758532
Application IDm+ooH91r6a+SMC5OtXb0Tg==
Document Descriptionrevised installation manual Aug.2, 2012
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize184.85kB (2310597 bits)
Date Submitted2012-08-02 00:00:00
Date Available2012-10-30 00:00:00
Creation Date2012-08-02 09:32:00
Producing SoftwareAcrobat Distiller 9.3.3 (Windows)
Document Lastmod2012-08-02 09:32:00
Document TitleMicrosoft Word - HS6621_installation 6_26.doc
Document CreatorPScript5.dll Version 5.2.2
Document Author: 29418
FCC ID Filing: A3LCYWDCB7UR

Navigation menu