ShenZhen HaiLingKe Electronic HLK-M50 WIFI Module User Manual 15 HLK M50 UserMan r2

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Document Description	15_HLK-M50 UserMan r2
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Document Type	User Manual
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Date Submitted	2018-06-15 00:00:00
Date Available	2018-06-15 00:00:00
Creation Date	2018-06-07 09:18:05
Producing Software	福昕PDF打印机 版本 7.3.4.0308
Document Lastmod	2018-06-07 09:18:05
Document Title	15_HLK-M50 UserMan r2

HLK-M50
niki@hlktech.com
Specification
Shenzhen HaiLingKe Electronic co., Ltd.
HLK-M50 SPEC.
Version：V1.0
Date changed：2017-12-27
All right reserved@ Shenzhen Hi-Lin Electronic company
HLK-M50
niki@hlktech.com
Specification
Catalogue
1.
PRODUCT INTRODUCTION .............................................................................................................................. 1
1.1.
HLK-M50 MODULE TYPE.............................................................................................................................. 1
1.2.
WLAN FEATURES............................................................................................................................................ 2
1.3.
MCU FEATURES .............................................................................................................................................. 2
2. FUNCTIONAL DIAGRAM ......................................................................................................................................... 3
3.SPECIFICATIONS........................................................................................................................................................ 3
3.1 SYSTEM MEMORY .................................................................................................................................................. 3
3.2 INTERFACE ............................................................................................................................................................... 4
3.3 INTERFACE EXTENSION APPLICATION EXAMPLE...................................................................................... 5
3.4 POWER ....................................................................................................................................................................... 5
4. MODULE PIN DEFINITION ..................................................................................................................................... 6
4.1 PIN DIAGRAM DEFINITION ................................................................................................................................. 6
4.2 DEFAULT PIN DEFINITION ................................................................................................................................... 7
4.3 GPIO ALTERNATE FUNCTION AND FUNCTION PIN POSITION ................................................................. 8
5. MODULE SIZE CHART ............................................................................................................................................. 8
6. TYPICAL APPLICATION CIRCUIT ........................................................................................................................ 9
7. RECOMMENDED REFLOW TEMPERATURE ..................................................................................................... 9
FCC WARNING ............................................................................................................................................................. 11
HLK-M50
Specification
niki@hlktech.com
1. Product introduction
The HLK-M50 WiFi module is a low-power chip that integrates MCU, PMU, clock, and IEEE802.11b / g / n
MAC / PHY / radio.
Module supports 2.4GHz IEEE802.11b / g / n, USB Host and Device 2.0 HS, Micro SD card (SDMMC
interface), UART, I2C, I2S, PMW, SPI and other interfaces, analog keys (GPADC0).
Software using mbedOS5.1 operating system, has two versions : WiFi serial transmission function version
and secondary development.
Second development version provides rich development interface, users can develop their own applications
based on mbedOS through C or C ++. Development kit to provide a large number of guidance documents and test
routines to facilitate rapid development of users.
1.1. HLK-M50 Module Type
Pin section and SMD section front
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HLK-M50
Specification
niki@hlktech.com
1.2. WLAN Features
 Single-chip integrated MAC/PHY/Radio
 Supports 2.4GHz IEEE 802.11b/g/n
 Integrated PA, LNA
 20/40MHz bandwidth, maximum 150Mbps
 Support WPA, WPA2, WEP, TKIP,CCMP
 Support STA, softAP, P2P, STA+softAp,STA+P2P
 Support A-MPDU, A-MSDU, HT-BA
 Lightweight TCP / IP protocol stack
1.3. MCU Features
 Integrated ARM-CM4 MCU, the maximum clock frequency of 160MHz
 Integrated MPU and mbed uvisor
 Support external psram interface
 Built-in 8Mbit SPI flash
 Function pin position programmable
 Available external rising / falling edge interrupt or wake-up GPIO
 Integrated UART×2/I2S×2/I2C×1/PWM×8/SPI×4/SDMMC×1/USB2.0×1
 Integrated 2 channel ADC
 Integrated watchdog and low-power timer
 Operating system using mbedOS5.1
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HLK-M50
Specification
niki@hlktech.com
2. Functional diagram
HLK-M50 Module functional diagram
3.Specifications
3.1 System memory
Project
Parameters
96K Bytes User SRAM
Memory
Built-in RAM
32K Bytes icache
System
Built-in Flash
Built-in 8Mbit flash
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HLK-M50
Specification
niki@hlktech.com
3.2 Interface
项目
GPIO
Serial performance
参数
supports up to 17 GPIO ports, of which 16 can trigger interrupts
supports up to 2 serial ports, baud rate can be configured to 1200bps 4Mbps
Supports 2 I2S Interfaces; I2S Host BCLK Supports 96/192/384/512 /
I2S Interface Features
44.1 / 88.2KHz; Supports 16/32 bit per channel, Data Format
Configurable as 16/20 / 24bit or Software Configurable Maximum
24bit per channel)
Supports one I2C standard interface. Support master or slave operation.
I2C Interface
There are 3 standard speed modes:
1. Standard mode (<100Kb/s)
Performance
2. Fast mode (<400Kb/s)
3. High-speed mode (<3.4Mb/s)
Supports up to eight PWM interfaces; PWM cycle and duty cycle
programmable, duty cycle can be configured between 0-100; cycle
programmable, the software can choose a different clock to produce
longcycles
PWM Interface
Performance
As the SPI host, up to 4 SPI slave; SPI clock programmable and
SPI Interface
maximum 20Mhz; data length can be configured by software, the
maximum 64bit;
SDMMC Interface
USB Interface
Support 1 SDMMC interface
Support 1 USB interface
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HLK-M50
Specification
niki@hlktech.com
3.3 Interface Extension Application Example
Note：
1，The figure can be extended function, the common firmware do not support some features, please consult
our FAE if you need.
2，The module factory default is USB HOST。
3.4 Power
Typical
Symbol
Function
Maximum
Min.Voltage（V）
Voltage（V） Voltage（V）
Current
（mA）
VBAT
Supply voltage range
3.3
3.3
3.5
≥500mA
I/O
I/O Input Voltage range
2.7
3.3
3.6
≤10mA
Symbol Function Min. Voltage (V) Typical Voltage (V) Maximum Voltage (V) Current (mA)
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HLK-M50
Specification
niki@hlktech.com
VBAT supply voltage range 3.3 3.3 3.5 ≥500mA
I / O I / O Input Voltage Range 2.7 3.3 3.6 ≤10mA
4. Module pin definition
4.1 Pin Diagram Definition
HLK-RM08S default Pin diagram definition
Note：
1，The figure is the default definition, the multiplexing function is not listed.
2，Please do not arbitrarily pull of each free function pin, so as cause the module does not start properly.
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HLK-M50
Specification
niki@hlktech.com
4.2 Default Pin definition
Number
Name
Type
Description
RST
RESET signal of the chip
ADC
I/O
General purpose ADC
GPIO1
I/O
General purpose input/output
GPIO2
I/O
General purpose input/output
GPIO3
I/O
General purpose input/output
GPIO13
I/O
General purpose input/output
GPIO12
I/O
General purpose input/output
3.3V
PWR
I/O power supply
GPIO23
I/O
General purpose input/output
10
GPIO22
I/O
General purpose input/output
11
GPIO21
I/O
General purpose input/output(no interrupt)
12
GPIO0
I/O
General purpose input/output
13
GPIO4
I/O
General purpose input/output
14
GPIO5
I/O
General purpose input/output
15
GND
GND
buck ground
16
GPIO8
I/O
General purpose input/output
17
GPIO7
I/O
General purpose input/output
18
GPIO9
I/O
General purpose input/output
19
USB-DN
I/O
USB negative signal
20
USB-DP
I/O
USB positive signal
21
RX
I/O
UART_RX
22
TX
I/O
UART_TX
Pin type definition：
 I/O → Digital input/output；
 I → Digital input
 O → Digital output
 A,I → Analog input
 A,O → Analog output
 A,I/O → Analog input/output
 PWR → Power
 GND → Ground
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HLK-M50
Specification
niki@hlktech.com
4.3 GPIO alternate function and function pin position
5. Module size chart
Unit：millimetre（mm）
HLK-M50 Dimension
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HLK-M50
Specification
niki@hlktech.com
6. Typical application circuit
Note：
This is a schematic diagram of the M50 development test suite. Schematic and PCB source files, please ask
sales.
Module over the furnace, please follow this temperature curve in strict implementation. Reflow temperature
deviation is too large will cause damage to the module!
7. Recommended reflow temperature
Module over the furnace, please follow this temperature curve in strict implementation.Reflow temperature
deviation too large will cause damage to the module!
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HLK-M50
Specification
niki@hlktech.com
Temperature setting (centigrade)
Temper.
Up
125
135
155
185
195
225
240
230
Down
125
135
155
185
195
225
240
230
area
Conveyor speed: 70.0 cm/min.
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HLK-M50
Specification
niki@hlktech.com
FCC Warning
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
NOTE 1: This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
-Consult the dealer or an experienced radio/TV technician for help.
NOTE 2: Any changes or modifications to this unit not expressly approved by the
party responsible for compliance could void the user's authority to operate the
equipment.
Please notice that if the FCC identification number is not visible when the module is
installed inside another device, then the outside of the device into which the module is
installed must also display a label referring to the enclosed module. This exterior label
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HLK-M50
Specification
niki@hlktech.com
can use wording such as the following: “Contains FCC ID: 2AD56HLK-M50” any
similar wording that expresses the same meaning may be used.
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This transmitter must not be co-located or operating
in conjunction with any other antenna or transmitter. The module is limited to
OEM installation ONLY.
The OEM integrator is responsible for ensuring that the end-user has no manual
instruction to remove or install module.
There is requirement that the grantee provide guidance to the host manufacturer
for compliance with Part 15B requirements.
This module certified that complies with RF exposure requirement under mobile or fixed
condition, this module is to be installed only in mobile or fixed applications.
A mobile device is defined as a transmitting device designed to be used in other than fixed
locations and to generally be used in such a way that a separation distance of at least 20 centimeters
is normally maintained between the transmitter's radiating structure(s) and the body of the user or
nearby persons. Transmitting devices designed to be used by consumers or workers that can be easily
re-located, such as wireless devices associated with a personal computer, are considered to be
mobile devices if they meet the 20 centimeter separation requirement.
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Create Date                     : 2018:06:07 09:18:05+08:00
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Modify Date                     : 2018:06:07 09:18:05+08:00
Producer                        : 福昕PDF打印机 版本 7.3.4.0308
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